TWI662875B - Manufacturing mehod of circuit board - Google Patents

Abstract

A method for manufacturing a circuit board includes the following steps: performing a first printing process to form a first insulating layer, the first insulating layer having a first circuit trench; and performing a second printing process for the first circuit. A first circuit layer is formed in the trench; it is checked whether the actual position of the first circuit layer deviates from the predetermined position of the first circuit layer, wherein when the actual position of the first circuit layer deviates from the predetermined position, the deviation amount of the actual position from the predetermined position is judged Whether it is greater than a predetermined value; when the deviation is greater than a predetermined value and the thickness of the second insulating layer to be formed on the first insulating layer is not greater than an allowable thickness, a first printing process is performed to form a second on the first insulating layer An insulating layer, the second insulating layer has openings, and the positions of the openings at least partially overlap the actual positions; and a second printing process is performed to form a via hole in the opening.

Description

Method for manufacturing circuit board

The present invention relates to a method for manufacturing a circuit board, and more particularly, to a method for manufacturing a circuit board using a printing process.

In the current circuit board manufacturing process, when forming a multilayer circuit board, mechanical drilling or laser drilling is mostly used to form vertical openings on the substrate. Next, a conductive layer is formed on the substrate and in the openings. Then, a lithography process and an etching process are performed to form a horizontal circuit pattern. After that, another substrate is laminated and the above steps are repeated.

However, in addition to the cumbersome process steps, the above-mentioned circuit board manufacturing process also has the disadvantages of excessive material consumption and environmental pollution. In addition, for multi-layer circuit boards, tolerances will occur in each process step (such as drilling, lithography, etching, etc.), so it is easy to cause the problem of poor yield of the circuit board.

The invention provides a method for manufacturing a circuit board, which uses a printing process to manufacture the circuit board.

The method for manufacturing a circuit board of the present invention includes the following steps: performing a first printing process to form a first insulating layer, wherein the first insulating layer has a first circuit trench; and performing a second printing process for Forming a first circuit layer in the first circuit trench; checking whether the actual position of the first circuit layer deviates from a predetermined position of the first circuit layer, wherein when the actual position of the first circuit layer deviates from the predetermined position When the position is, determine whether the deviation amount of the actual position from the predetermined position is greater than a predetermined value; when the deviation amount is greater than the predetermined value and the thickness of the second insulating layer to be formed on the first insulating layer is not When the thickness is greater than the allowable thickness, the first printing process is performed to form the second insulating layer on the first insulating layer, the second insulating layer has openings, and the positions of the openings are at least Partially overlap with the actual position; performing the second printing process to form a conductive via in the opening.

In an embodiment of the manufacturing method of the manufacturing method of the wiring board of the present invention, when the actual position does not deviate from the predetermined position or the deviation is not greater than the predetermined value, the method for manufacturing the wiring board includes The following steps: perform the first printing process to form the third insulating layer on the first insulating layer, wherein the third insulating layer has a second circuit trench and a first opening, and A ratio of an overlapping area of the first opening and the actual position to an area of the first opening is not less than 0.75; and performing the second printing process to form in the second circuit trench A second circuit layer and the via hole are formed in the first opening, wherein the second circuit layer is electrically connected to the first circuit layer through the via hole.

In an embodiment of the manufacturing method of the manufacturing method of the wiring board of the present invention, when the deviation is greater than the predetermined value and the thickness of the second insulating layer to be formed on the first insulating layer is smaller than When the allowable thickness is described, the second insulating layer has a first opening, and the position of the first opening is deviated from the actual position toward the predetermined position, and the method for manufacturing the circuit board further includes the following steps. : After the second insulating layer is formed and before the via hole is formed, the first printing process is performed to form a third insulating layer on the second insulating layer, wherein the second insulating layer And the third insulating layer has a total thickness equal to the allowable thickness, the third insulating layer has a second opening, and a position of the second opening is away from the first opening toward the predetermined position. Position of the hole to overlap the predetermined position; perform the second printing process to form the via hole in the first opening and the second opening; perform the first printing A process for forming a first layer on the third insulating layer An insulation layer, wherein the fourth insulation layer has a second circuit trench; and performing the second printing process to form a second circuit layer in the second circuit trench, wherein the second circuit The layer is electrically connected to the first circuit layer through the via hole.

In an embodiment of the manufacturing method of the manufacturing method of the wiring board of the present invention, when the deviation is greater than the predetermined value and the thickness of the second insulating layer to be formed on the first insulating layer is equal to an allowable In the thickness, the position of the opening overlaps the actual position and the predetermined position at the same time, and the method for manufacturing the circuit board further includes the following steps: after forming the via hole, performing the first printing A process for forming a third insulation layer on the second insulation layer, wherein the third insulation layer has a second line trench; and performing the second printing process for the second line trench A second circuit layer is formed in the trench, wherein the second circuit layer is electrically connected to the first circuit layer through the via hole.

In an embodiment of the manufacturing method of the manufacturing method of the wiring board of the present invention, when the deviation is larger than the predetermined value and the thickness of the second insulating layer to be formed on the first insulating layer is greater than the allowable At the time of thickness, the manufacturing method of the circuit board includes the following steps: performing the first printing process to form a third insulating layer on the first insulating layer, and the third insulating layer has the openings With the second line trench, the position of the opening overlaps with the actual position and the predetermined position at the same time, and when the second printing process is performed to form the via hole, it is simultaneously with the second A second circuit layer is formed in the circuit trench, wherein the second circuit layer is electrically connected to the first circuit layer through the via hole.

In an embodiment of the manufacturing method of the manufacturing method of the wiring board of the present invention, the first printing process is, for example, three-dimensional digital light processing (DLP).

In an embodiment of the manufacturing method of the method for manufacturing a wiring board according to the present invention, in the first printing process, the first insulating layer is formed in a molding groove, and a bottom surface of the molding groove is, for example, transparent. And the light beam processed by the three-dimensional digitizing light is irradiated through the bottom surface of the molding groove to the first insulating layer.

In an embodiment of the manufacturing method of the manufacturing method of the wiring board according to the present invention, the second printing process is, for example, conductive ink jet printing.

In an embodiment of the manufacturing method of the manufacturing method of the wiring board of the present invention, the allowable thickness is, for example, a predetermined vertical distance between the first wiring layer and a second wiring layer to be formed above the first wiring layer. distance.

Based on the above, in the present invention, after the first circuit layer is formed by the printing process, it is checked whether the actual position of the first circuit layer deviates from the predetermined position, and then the subsequent insulation layer is formed to define a via hole according to the inspection result. Printing process. Therefore, when the actual position of the first circuit layer deviates from the predetermined position, subsequent printing processes can be adjusted immediately, so that the formed vias can accurately connect the first circuit layer and the second circuit layer.

In order to make the above features and advantages of the present invention more comprehensible, embodiments are hereinafter described in detail with reference to the accompanying drawings.

In the present invention, after a layer of the circuit board is formed by a printing process, the position of the layer of the circuit is first checked to determine whether the actual position of the layer of the circuit deviates from the predetermined position. In this way, when the actual position of this layer of circuit deviates from the predetermined position, subsequent printing processes for forming an insulating layer defining a via hole can be adjusted in real time so that the via hole can accurately connect this layer of circuit with Follow up another layer of lines. Hereinafter, the present invention will be described by using various embodiments. In the following embodiments, the same elements will be represented by the same element symbols.

In each of the following embodiments, the “first printing process” refers to a printing process for forming an insulating layer, which is, for example, a three-dimensional digital photo process. In addition, the "second printing process" refers to a printing process for forming a conductive layer, which is, for example, conductive ink jet printing.

FIG. 1 is a flowchart of a method for manufacturing a circuit board according to an embodiment of the present invention. FIG. 2A to FIG. 2D are schematic cross-sectional views of a process of a method for manufacturing a circuit board according to a first embodiment of the present invention. First, referring to FIG. 1 and FIG. 2A at the same time, in step 100, a first printing process is performed to form an insulating layer 200. As shown in FIG. 6, in this embodiment, a printing device 600 is used to perform a first printing process. The printing device 600 includes a light source 602, a reflective element 604, a lens 606, a molding groove 608, and a printing element 610. The insulating layer 200 is formed in the molding groove 608 by the printing element 610. The bottom surface of the molding groove 608 is transparent, so that the light beam 612 generated by the light source 602 changes the path through the reflecting element 604 and passes through the lens 606, and is irradiated from the bottom surface of the molding groove 608 to cure the insulating layer 200. Since the surface of the formed insulating layer 200 may form a curved surface due to surface tension, the above setting can prevent light from exposing the insulating layer 200 through the curved surface to cause curing errors. The insulating layer 200 has a line trench 202 therein. In this embodiment, the circuit trench 202 includes a trench 202 a for defining a first-layer circuit and a trench 202 b for defining a bonding pad.

Then, referring to both FIG. 1 and FIG. 2B, in step 102, a second printing process is performed to form a circuit layer 204 in the circuit trench 202. In detail, the wiring layer 204 located in the trench 202 a can be regarded as a first layer of wiring in a multilayer circuit board, and the wiring layer 204 located in the trench 202 b can be regarded as a bonding pad used to connect with external components.

Next, in step 104, it is checked whether the actual position of the formed circuit layer 204 deviates from the predetermined position, and in step 106, when the actual position deviates from the predetermined position, it is determined whether the deviation amount of the actual position from the predetermined position is greater than a predetermined value. When forming the insulating layer 200 in the first printing process, the position or shape of the circuit trench 202 may be affected by the process environment, human operation, or other factors. Since the positions of the wiring layer and the vias formed in the subsequent steps are predetermined, the above-mentioned deviation may affect the yield of the circuit board. When the actual position of the circuit layer 204 does not deviate from the predetermined position or the above-mentioned deviation is within an allowable range (the deviation is not greater than a predetermined value), the yield rate of the formed circuit board is limited and can be accepted. However, when the above-mentioned deviation exceeds the allowable range, it may cause the transmission efficiency of the telecommunication signal to decrease, or even cause a disconnection. In this way, the yield of the circuit board will be greatly reduced. Therefore, in the present invention, after the circuit layer 204 is formed, the position of the circuit layer 204 is inspected immediately, and subsequent processes are adjusted in real time according to the inspection result. The method for checking the position of the circuit layer 204 is, for example, automatic optical image detection.

Then, please refer to FIG. 1 and FIG. 2C at the same time. In this embodiment, after the position of the circuit layer 204 is checked, it is determined that the position does not deviate from the predetermined position (or the deviation is not greater than the predetermined value). Therefore, in step 108, a first printing process is performed to form an insulating layer 206 on the insulating layer 200. The insulating layer 206 includes a line trench 208 and an opening 210. Since the actual position of the circuit layer 204 does not deviate from the predetermined position (or the amount of deviation is not greater than a predetermined value), the ratio of the area of the overlap between the opening 210 and the actual position of the circuit layer 204 to the area of the opening 210 can be not less than 0.75, That is, the vias formed in the openings 210 can be effectively aligned with the circuit layer 204. The circuit trench 208 is used to define a second-layer circuit, and the opening 210 is used to define a via hole connecting the first-layer circuit and the second-layer circuit. In this embodiment, since the position of the circuit layer 204 is not deviated from the predetermined position (or the deviation is not greater than a predetermined value), the position of the formed opening 210 can be accurately aligned with the predetermined position of the circuit layer 204, such as This is shown by the dashed box in Figure 2C.

Thereafter, referring to both FIG. 1 and FIG. 2D, in step 110, a second printing process is performed to form a circuit layer 212 in the circuit trench 208 and the opening 210. In detail, the circuit layer 212 in the circuit trench 208 can be regarded as the second layer circuit in the multilayer circuit board, and the circuit layer 212 in the opening 210 can be regarded as the connection between the first layer circuit and the second layer circuit. Vias. Since the via is accurately connected to a predetermined position of the wiring layer 204, the problem of poor yield of the formed wiring board can be avoided.

In this embodiment, the circuit board shown in FIG. 2D is a circuit board having a two-layer circuit, but the present invention is not limited thereto. In other embodiments, when the circuit board has more layers of lines, the position of the lines may be checked after forming each layer of lines as described above, and subsequent processes may be performed. In this way, it can be ensured that the formed vias can be accurately connected to the wiring layer.

FIG. 3A to FIG. 3E are schematic cross-sectional flowcharts of a method for manufacturing a circuit board according to a second embodiment of the present invention. Please refer to FIG. 1 and FIG. 3A at the same time. As shown in FIG. 2B, a circuit layer 204 is formed in the insulating layer 200. In step 104, it is checked whether the actual position of the formed wiring layer 204 deviates from a predetermined position. In this embodiment, the position of a part of the circuit layer 204 (the area 204 a) is deviated from the predetermined position 300. Next, in step 106, it is determined whether the deviation amount of the actual position from the predetermined position is greater than a predetermined value. In this embodiment, the above-mentioned deviation amount is larger than a predetermined value. At this time, since the position of the region 204a deviates from the predetermined position 300 and the deviation is greater than a predetermined value, subsequent processes must be adjusted immediately to avoid that the vias formed later cannot be accurately connected to the circuit layer 204.

In addition, based on the final thickness of the formed wiring board, the vertical distance between the two wiring layers has a predetermined value (also referred to herein as an allowable thickness). Therefore, the thickness of the insulating layer formed between the two circuit layers must not be greater than the allowable thickness. In this embodiment, the process for forming the via is adjusted under the condition that the thickness of the insulating layer used to define the via is not greater than the allowable thickness.

Then, referring to FIG. 1 and FIG. 3B simultaneously, in step 112, a first printing process is performed to form an insulating layer 302 on the insulating layer 200. The insulating layer 302 has an opening 302a. The position of the opening 302 is deviated from the position of the region 204a toward the predetermined position 300, and a part thereof overlaps the region 204a. Next, a first printing process is performed to form an insulating layer 304 on the insulating layer 302. At this time, the total thickness of the insulating layer 302 and the insulating layer 304 is smaller than the allowable thickness. The insulating layer 304 has an opening 304a. The position of the opening 304a is deviated from the position of the hole 302a toward the predetermined position 300, and a part thereof overlaps the opening 302a. Then, a first printing process is performed to form an insulating layer 306 on the insulating layer 304. At this time, the total thickness of the insulating layer 302, the insulating layer 304, and the insulating layer 306 is smaller than the allowable thickness. The insulating layer 306 has an opening 306a. The position of the opening 306a is deviated from the position of the hole 304a toward the predetermined position 300, and a part thereof overlaps the opening 304a. After that, a first printing process is performed to form an insulating layer 308 on the insulating layer 306. At this time, the total thickness of the insulating layer 302, the insulating layer 304, the insulating layer 306, and the insulating layer 308 is equal to the allowable thickness. The insulating layer 308 has an opening 308a. The position of the opening 308a is deviated from the position of the hole 306a toward the predetermined position 300, and a part thereof overlaps the opening 306a. At this time, the position of the opening 308a overlaps with the predetermined position 300. Next, referring to FIG. 3C, a second printing process is performed to form a via hole 310 connected to the region 204a in the openings 302a, 304a, 306a, 308a.

Then, referring to FIG. 1 and FIG. 3D at the same time, in step 114, a first printing process is performed to form an insulating layer 312 on the insulating layer 308. The insulating layer 312 has a line trench 312a. After that, referring to FIG. 3E, a second printing process is performed to form a circuit layer 314 in the circuit trench 312a. In this embodiment, because the position of the region 204a is deviated from the predetermined position 300, if a vertical via (such as the via in FIG. 2D) is directly formed, the circuit layer 204 (region 204a) cannot be accurately connected to the circuit layer 314. . Therefore, by forming the via holes 302a, 304a, 306a, and 308a gradually shifting toward the predetermined position 300, a via hole 310 that simultaneously connects the region 204a and overlaps the predetermined position 300 is formed, so that the wiring layer 204 and the wiring layer 314 can be accurately地 连接。 Ground connection.

In this embodiment, four insulating layers are formed between the circuit layer 204 and the circuit layer 314, but the present invention is not limited thereto. In other embodiments, the number of layers of the insulation layer may be adjusted according to the actual situation (such as the degree of deviation between the region 204a and the predetermined position 300, the number of layers of the insulation layer that can be accommodated between the circuit layer 204 and the circuit layer 314, etc.). .

FIG. 4A to FIG. 4C are schematic cross-sectional flowcharts of a method for manufacturing a circuit board according to a third embodiment of the present invention. First, please refer to FIG. 1 and FIG. 4A at the same time. In this embodiment, as in the second embodiment, in step 104, the actual position of a part of the circuit layer 204 (area 204a) formed in the insulating layer 200 is determined after inspection. Deviated from the predetermined position 300. Next, in step 106, it is determined that the deviation amount of the actual position from the predetermined position is larger than a predetermined value. Then, in step 112, a first printing process is performed to form an insulating layer 400 on the insulating layer 200. At this time, the thickness of the insulating layer 400 is equal to the allowable thickness. The insulating layer 400 has an opening 400a therein. In this embodiment, the position of the opening 400a overlaps with the area 204a and the predetermined position 300, that is, the position of the opening 400a covers the area 204a and the predetermined position 300. Next, referring to FIG. 4B, a second printing process is performed to form a via hole 402 connected to the region 204a in the opening 400a.

After that, please refer to FIG. 1 and FIG. 4C at the same time. In step 114, as shown in FIG. 3D to FIG. 3E, a first printing process is performed to form an insulating layer 312 having a line trench 312a on the insulating layer 400. Then, a second printing process is performed to form a circuit layer 314 in the circuit trench 312a.

In this embodiment, since the position of the region 204a is deviated from the predetermined position 300, if a vertical via (such as the via in FIG. 2D) is directly formed, the circuit layer 204 (region 204a) and the circuit layer 314 cannot be accurately connected. . Therefore, by forming the via hole 402 with a relatively large size in the insulating layer 400, the position of the via hole 402 can cover the area 204a and the predetermined position 300 to be accurately connected to the circuit layer 204 and the circuit layer 314.

FIG. 5A to FIG. 5B are schematic cross-sectional views of a process of a method for manufacturing a circuit board according to a fourth embodiment of the present invention. First, please refer to FIG. 1 and FIG. 5A at the same time. In this embodiment, as in the second embodiment, in step 104, the actual position of a part of the circuit layer 204 (area 204a) formed in the insulating layer 200 is determined after inspection. Deviated from the predetermined position 300. Next, in step 106, it is determined that the deviation amount of the actual position from the predetermined position is larger than a predetermined value.

In this embodiment, because the vertical distance between the two circuit layers is too small, that is, the thickness of the insulating layer used to define the via is greater than the allowable thickness, it cannot be used in the same way as in the second and third embodiments. The process is adjusted by forming a via hole between two circuit layers.

Then, in step 116, a first printing process is performed to form an insulating layer 500 on the insulating layer 200. The insulating layer 500 includes a line trench 502 and an opening 504. In this embodiment, the position of the opening 504 overlaps the area 204a and the predetermined position 300 at the same time. 5B, a second printing process is performed to form a circuit layer 506 in the circuit trench 502 and the opening 504. In detail, the circuit layer 506 in the circuit trench 502 can be regarded as the second layer circuit in the multilayer circuit board, and the circuit layer 506 in the opening 504 can be regarded as the connection between the first layer circuit and the second layer circuit. Vias.

In this embodiment, since the position of the region 204a is deviated from the predetermined position 300, if a vertical via (such as the via in FIG. 2D) is directly formed, the circuit layer 204 (region 204a) and the circuit layer 314 cannot be accurately connected. . Therefore, in the case where an additional insulating layer cannot be formed, by forming a larger via hole in the insulating layer 500, the position of the via hole can cover the region 204a and the predetermined position 300, so as to accurately communicate with the first-layer circuit. Layer and the second circuit layer.

Although the present invention has been disclosed as above with the examples, it is not intended to limit the present invention. Any person with ordinary knowledge in the technical field can make some modifications and retouching without departing from the spirit and scope of the present invention. The protection scope of the present invention shall be determined by the scope of the attached patent application.

100, 102, 104, 106, 108, 110, 112, 114, 116‧‧‧ steps

200, 206, 312, 302, 304, 306, 308, 400, 500‧‧‧ insulation

202, 208, 312a, 502‧‧‧line trench

202a, 202b‧‧‧Trench

204, 212, 314, 506‧‧‧ line layer

210, 302a, 304a, 306a, 308a, 400a, 504‧‧‧ via hole opening

204a‧‧‧area

300‧‧‧ scheduled location

310, 402‧‧‧via

600‧‧‧printing device

602‧‧‧light source

604‧‧‧Reflective element

606‧‧‧ lens

608‧‧‧Forming groove

610‧‧‧Printing element

FIG. 1 is a flowchart of a method for manufacturing a circuit board according to an embodiment of the present invention. FIG. 2A to FIG. 2D are schematic cross-sectional views of a process of a method for manufacturing a circuit board according to a first embodiment of the present invention. FIG. 3A to FIG. 3E are schematic cross-sectional flowcharts of a method for manufacturing a circuit board according to a second embodiment of the present invention. FIG. 4A to FIG. 4C are schematic cross-sectional flowcharts of a method for manufacturing a circuit board according to a third embodiment of the present invention. FIG. 5A to FIG. 5B are schematic cross-sectional views of a process of a method for manufacturing a circuit board according to a fourth embodiment of the present invention. FIG. 6 is a schematic diagram of a printing apparatus used in an embodiment of the present invention.

Claims (7)

A method for manufacturing a circuit board includes: performing a first printing process to form a first insulating layer, the first insulating layer having a first circuit trench; and performing a second printing process to the first A first circuit layer is formed in the circuit trench; it is checked whether the actual position of the first circuit layer deviates from a predetermined position of the first circuit layer, wherein when the actual position of the first circuit layer deviates from the predetermined position When the deviation of the actual position from the predetermined position is greater than a predetermined value; when the deviation is greater than the predetermined value and the thickness of the second insulating layer to be formed on the first insulating layer is not greater than When the thickness is allowable, the first printing process is performed to form the second insulating layer on the first insulating layer, the second insulating layer has a first opening, and the first opening is The position of at least partially overlaps the actual position, and the allowable thickness is a predetermined vertical distance between the first circuit layer and a second circuit layer to be formed above the first circuit layer; and Two-print process A via hole is formed in the first opening, wherein when the deviation is greater than the predetermined value and a thickness of the second insulating layer to be formed on the first insulating layer is smaller than the allowable thickness A position of the first opening of the second insulation layer is deviated from the actual position toward the predetermined position, and the method of manufacturing the circuit board further includes: after forming the second insulation layer; and Before forming the vias, the first printing process is performed to form a third insulating layer on the second insulating layer, wherein the total thickness of the second insulating layer and the third insulating layer is equal to In the allowable thickness, the third insulating layer has a second opening, and a position of the second opening is away from a position of the first opening toward the predetermined position so as to overlap the predetermined position; Performing the second printing process to form the via hole in the first opening and the second opening; performing the first printing process to form the third insulating layer A fourth insulating layer, wherein the fourth insulating layer has a first A circuit trench; and performing the second printing process to form the second circuit layer in the second circuit trench, wherein the second circuit layer communicates with the first via the via hole. The line layer is electrically connected. The method for manufacturing a circuit board according to item 1 of the scope of patent application, wherein when the actual position does not deviate from the predetermined position or the deviation is not greater than the predetermined value, the method for manufacturing the circuit board includes: Performing the first printing process to form the second insulating layer on the first insulating layer, wherein the second insulating layer has the second circuit trench and the first opening, And the ratio of the overlapping area of the first opening to the actual position to the area of the first opening is not less than 0.75; and the second printing process is performed in the second circuit trench Forming the second circuit layer and forming the via hole in the first opening, wherein the second circuit layer is electrically connected to the first circuit layer through the via hole. The method for manufacturing a circuit board according to item 1 of the scope of patent application, wherein when the deviation is greater than the predetermined value and the thickness of the second insulating layer to be formed on the first insulating layer is equal to the thickness In the allowable thickness, the position of the first opening overlaps the actual position and the predetermined position at the same time, and the method for manufacturing the circuit board further includes: after forming the via hole, performing the first row A printing process to form the third insulation layer on the second insulation layer, wherein the third insulation layer has the second line trench; and the second printing process is performed to The second circuit layer is formed in the second circuit trench, wherein the second circuit layer is electrically connected to the first circuit layer through the via hole. The method for manufacturing a wiring board according to item 1 of the scope of patent application, wherein when the deviation is larger than the predetermined value and the thickness of the second insulating layer to be formed on the first insulating layer is larger than the thickness At the allowable thickness, the method for manufacturing the circuit board includes: performing the first printing process to form the second insulating layer on the first insulating layer, and the second insulating layer having the first insulating layer An opening and the second circuit trench, the position of the first opening overlaps the actual position and the predetermined position at the same time, and when the second printing process is performed to form the via hole And simultaneously forming the second circuit layer in the second circuit trench, wherein the second circuit layer is electrically connected to the first circuit layer through the via hole. The method for manufacturing a circuit board according to item 1 of the scope of patent application, wherein the first printing process includes three-dimensional digital light processing. The method for manufacturing a circuit board according to item 5 of the scope of patent application, wherein in the first printing process, the first insulating layer is formed in a molding groove, and a bottom surface of the molding groove is transparent. And the three-dimensional digitized light beam is irradiated through the bottom surface of the molding groove to the first insulating layer. The method for manufacturing a circuit board according to item 1 of the scope of patent application, wherein the second printing process includes conductive ink printing.