TWI662335B - Lighting device and backlight module using the same - Google Patents

Abstract

A light emitting device and a backlight module. The light emitting device includes a substrate, a driving circuit, an insulating layer, a metal pattern layer, and a light emitting unit. The driving circuit is disposed on the substrate, the insulating layer is disposed on the substrate and covers the driving circuit, and the metal pattern layer is disposed on the insulating layer. The metal pattern layer includes a plurality of connection pads and a reflection layer. The plurality of connection pads are separated from each other and are electrically coupled to the driving circuit, respectively. The reflection layer is separated from the plurality of connection pads and is located at the periphery of the plurality of connection pads. The light emitting unit is disposed on the plurality of connection pads. The backlight module includes a light emitting device, a scattering layer, and an opposite substrate. The scattering layer is disposed on the insulating layer, the metal pattern layer and the light emitting unit. The opposite substrate is disposed opposite to the substrate, and the scattering layer is disposed between the light emitting device and the opposite substrate.

Description

Light emitting device and backlight module using the same

The present invention relates to a light-emitting device, and more particularly, to a light-emitting device applicable to a display device and a backlight module using the same.

Most of the current thin display devices are liquid crystal displays. A liquid crystal display usually includes a liquid crystal panel and a backlight module. The liquid crystal panel itself does not emit light, and the backlight module can be used as a light source. The backlight module has a light emitting surface aligned with the liquid crystal panel, and a surface light source can be formed on the light emitting surface (light will be evenly distributed from the light emitting surface). The light from this surface light source passes through the liquid crystal panel, and the driving circuit in the liquid crystal panel Elements such as liquid crystal molecules and color filters can determine the amount of light allowed per unit pixel at a specific time point, and eventually an image will be formed on the display surface of the liquid crystal panel. In order for the LCD panel to produce a better image, the backlight module needs to be capable of forming a surface light source with uniform light distribution.

In order to allow light to be emitted uniformly from the light emitting surface, the existing backlight module includes a plurality of optical elements (such as a cymbal, a diffusion film, a light guide plate, and a reflective sheet) in addition to the light-emitting components, and its function is to generate light from the light-emitting components. The light can be evenly distributed through the scattering, refraction and diffusion of these optical elements. The light-emitting components of the existing backlight module can be divided into two types: direct-type and side-type. Since the direct-type type is more uniform than the side-type type, and because the technology of current light-emitting diodes has gradually matured, Diodes are increasingly popular as products for light emitting components. In the application of backlight modules, products in which light-emitting diodes are arranged in an array to be used as direct-type light-emitting components have also become mainstream.

As described in the prior art, a large proportion of existing backlight modules will use light-emitting diode arrays as direct-type light-emitting components. However, even if such a direct-type light-emitting component is used, in order to make the light more uniform, the multilayer optical elements in the existing backlight module are still indispensable, such as a diaphragm, a diffuser film, and a reflective sheet. These multilayer optical components make the backlight module larger, thicker and heavier. In addition, in the production of the backlight module, in addition to separately manufacturing a cymbal, a diffusion film, a reflective sheet, a light-emitting diode array, and a substrate on which these light-emitting diode arrays are installed, these components must be assembled one by one. Because the production process is time-consuming and labor-intensive, production costs are bound to remain high.

In view of this, the present invention proposes a light-emitting device and a backlight module using the same, with the hope that the backlight module can generate a uniform surface light source, can also reduce the volume, thickness and weight of the backlight module, and can also reduce production costs.

In one embodiment of the present invention, a light emitting device includes a substrate, a driving circuit, an insulating layer, a metal pattern layer, and a light emitting unit. The driving circuit is disposed on the substrate, the insulating layer is disposed on the substrate and covers the driving circuit, and the metal pattern layer is disposed on the insulating layer. The metal pattern layer includes a plurality of connection pads and a reflection layer. The plurality of connection pads are separated from each other and are electrically coupled to the driving circuit, respectively. The reflection layer is separated from the plurality of connection pads and is located at the periphery of the plurality of connection pads. The light emitting unit is disposed on the plurality of connection pads.

In an embodiment of the invention, the reflective layer has at least one opening, and a plurality of connection pads are located in the opening.

In an embodiment of the present invention, the reflective layer has a plurality of separated blocks separated from each other, and the plurality of separated blocks are respectively located around the plurality of connection pads.

In an embodiment of the invention, the light emitting device further includes a plurality of conductive patterns, and each conductive pattern is located between the corresponding connection pad and the driving circuit and is coupled to the connection pad and the driving circuit.

In one embodiment of the present invention, the plurality of conductive patterns are made of indium tin oxide.

In an embodiment of the invention, the driving circuit includes a thin film transistor, and the thin film transistor is coupled to one of the corresponding plurality of connection pads.

In one embodiment of the present invention, the reflective layer and the thin film transistor overlap in a vertical direction of the substrate.

In one embodiment of the present invention, the metal pattern layer is made of aluminum, copper, or silver.

In an embodiment of the present invention, a distance between centers of two adjacent connection pads in the connection pad provided with the light-emitting unit is between 10 μm and 900 μm.

In one embodiment of the present invention, a backlight module includes the aforementioned light emitting device, a scattering layer, and an opposite substrate. The scattering layer is disposed on the insulating layer, the metal pattern layer and the light emitting unit. The opposite substrate is disposed opposite to the substrate, and the scattering layer is disposed between the light emitting device and the opposite substrate.

In one embodiment of the present invention, the scattering layer is a polymer dispersed liquid crystal.

To sum up, according to the light-emitting device and the backlight module using the same according to the embodiments of the present invention, not only the backlight module can generate a uniform surface light source, but also reduce the volume, thickness, and weight of the backlight module. Cost of production.

The detailed features and advantages of the present invention are described in detail in the following embodiments. The content is sufficient for any person skilled in the art to understand and implement the technical content of the present invention, and according to the content disclosed in this specification, the scope of patent applications and the drawings Anyone skilled in the relevant art can easily understand the related objects and advantages of the present invention.

Please refer to FIGS. 1 and 2. FIG. 1 is a schematic top view of a light emitting device 30 according to a first embodiment of the present invention, and FIG. 2 is a schematic cross-sectional view at a line segment 2-2 of FIG. 1. In this embodiment, the light-emitting device 30 is used in a backlight module of a liquid crystal display and as a direct-type light-emitting component, so that the backlight module can generate a surface light source, but is not limited thereto. As shown in FIGS. 1 and 2, in this embodiment, the light emitting device 30 includes a substrate 100, a driving circuit 200, an insulating layer 300, a metal pattern layer 400, and a light emitting unit 500. For convenience of explanation, the driving circuit is not shown in FIG. 1.

As shown in FIG. 2, the driving circuit 200 is disposed on the substrate 100, and the insulating layer 300 may include a first insulating layer 301, a second insulating layer 302, and a third insulating layer 303. The insulating layer 300 is disposed on the substrate 100, and The third insulating layer 303 in the insulating layer 300 covers the driving circuit 200. The metal pattern layer 400 is disposed on the third insulating layer 303 in the insulating layer 300. The metal pattern layer 400 includes a plurality of connection pads 410 and a reflective layer 420. As shown in FIG. 1 and FIG. 2, the plurality of connection pads 410 are separated from each other, and the connection pads 410 are electrically coupled to the driving circuit 200 respectively. The reflection layer 420 and the plurality of connection pads 410 are also separated from each other. The reflection layer 420 is located at the periphery of the plurality of connection pads 410, and the light emitting unit 500 is disposed on the plurality of connection pads 410.

In this embodiment, two adjacent and electrically separated connection pads 410 are regarded as a group, and a group of connection pads 410 (also referred to as a connection pair 415) is used to electrically connect a light-emitting unit 500. For example, two connection pads 410, that is, a connection pair 415 respectively connect the positive electrode and the negative electrode of the corresponding light-emitting unit 500. In other words, the number of the connection pairs 415 is the same as the number of the light emitting units 500.

It should be understood that although the light-emitting device 30 shown in FIG. 1 includes four light-emitting units 500, and the four light-emitting units 500 are arranged in an array of two by two, the number of the light-emitting units 500 and the array arrangement here The type is for better understanding in the description and drawings, and is not intended to limit the present invention. In different embodiments, the number of light-emitting units 500 may be less than or more than four according to requirements and designs, and if the array formed by the light-emitting units 500 is defined as x times y, x and y may be Are any positive integers. In different embodiments, the arrangement of the light emitting units 500 may also be an irregular distribution or a pattern arranged in a special pattern, and is not limited to an array of x times y. In some embodiments, the substrate 100 may be a glass substrate, but is not limited thereto.

In this embodiment, the reflective layer 420 has at least one opening 422, and each opening 422 is provided with a set of connection pads 410, also referred to as connection pairs 415 (that is, two connections connecting the positive and negative electrodes of the same light-emitting unit 500) Pad 410). As shown in FIG. 1, in this embodiment, the reflective layer 420 has four openings 422, and the light-emitting device 30 has four sets of connection pads 410. Each set of connection pads 410 is located in each opening 422. As a result, after the light emitting units 500 are aligned and bonded, the reflective layer 420 individually surrounds each light emitting unit 500 under a vertical projection toward the substrate 100 and along the vertical direction Dv (as shown in FIG. 2). When each light-emitting unit 500 emits light, the reflective layer 420 surrounding each light-emitting unit 500 can be used to reflect light emitted by the light-emitting unit 500.

In some embodiments, the metal pattern layer 400 may be made of a metal material such as aluminum, copper, or silver. The driving circuit 200 may be made of a conductive material such as a metal wire, and the light emitting unit 500 is a light emitting diode. As shown in FIG. 1, in this embodiment, each connection pad 410 has a connection pad center 412, and this connection pad center 412 can be defined as the geometric center position of each connection pad 410 in the upper view. For example, when the connection pad is In the case of a rectangle, the center of the couple is the intersection of the diagonals; when the connection pad is circular, the center of the couple is the center of the circle. In addition, the two connection pad centers 412 of the two connection pads 410 in each connection pair 415 are separated by a distance Dis, and the distance Dis can be between 10 microns and 900 microns.

Please refer to FIG. 3, which is a schematic partial top view of the light emitting device 30 of FIG. 1. For the convenience of description, FIG. 3 only illustrates a set of connection pads 410 and a part of the reflective layer 420 in a part of FIG. 1, and the light emitting unit 500 is omitted. It is drawn in a perspective manner to show the driving circuit 200 and other components under the connection pad 410, the reflective layer 420 and the insulating layer 300.

As shown in FIGS. 2 and 3, in this embodiment, the driving circuit 200 includes a thin film transistor TFT. The thin film transistor TFT is coupled to one of the corresponding plurality of connection pads 410. In this embodiment, one connection pair 415 corresponds to one thin-film transistor TFT, that is, the number of thin-film transistor TFTs is the same as the number of connection pairs 415 and the number of light-emitting units 500, but it is not limited to this. In other embodiments, According to requirements, multiple thin-film transistor TFTs can correspond to one light-emitting unit. Each thin film transistor TFT is coupled to one of the connection pads 410 of the corresponding connection pair 415, and provides the driving voltage to the light-emitting unit 500 via the coupled connection pad 410.

In this embodiment, in addition to the thin film transistor TFT, the driving circuit 200 further includes an input line 220, an output line 230, a control line 240, and a connection line 250. The thin film transistor TFT includes a semiconductor layer 210, a gate G, a source S, and a drain D. Here, for convenience of explanation, one of the two connection pads 410 of a group is defined as a first connection pad 4101, and the other of them is defined as a second connection pad 4102. The input line 220 is coupled to the source S, and the source S is coupled to the semiconductor layer 210. The semiconductor layer 210 is coupled to the drain D, the drain D is coupled to the connection line 250, and is coupled to the first connection pad 4101 via the connection line 250. The first connection pad 4101 is coupled to the negative electrode of the light-emitting unit 500, the positive electrode of the light-emitting unit 500 is coupled to the second connection pad 4102, and the second connection pad 4102 is coupled to the output line 230. In other embodiments, the first connection pad 4101 may also be coupled to the positive electrode of the light emitting unit 500, and the second connection pad 4102 may be coupled to the negative electrode of the light emitting unit 500. Further, in this embodiment, the insulating layer 300 includes a first insulating layer 301, a second insulating layer 302, and a third insulating layer 303. As shown in FIG. 2, the first insulating layer 301, the second insulating layer 302 and the third insulating layer 303 are sequentially stacked. The first insulating layer 301 is located on the substrate 100, and the gate G (control line 240) and the semiconductor layer 210 are separated by a first insulating layer 301 (eg, a gate insulating layer, which may be an oxide layer), and a second insulating layer 302 covers the control gate G (control line 240), and the third insulation layer 303 covers the source S (input line 220) and the drain D. In other words, the position where the input line 220 is coupled to the semiconductor layer 210 is the source S of the thin film transistor TFT, and the position where the connection line 250 is coupled to the semiconductor layer 210 is the drain electrode D of the thin film transistor TFT. The gate G of the thin film transistor TFT is coupled to the control circuit 240. The gate G and the semiconductor layer 210 are separated by a first insulating layer 301, the control circuit 240 and the input circuit 220 are separated by a second insulating layer 302, and the control circuit 240 is A second insulating layer 302 is also interposed between the output line 230 and the output line 230. In this embodiment, an auxiliary electrode 270 may be further included under the output circuit 230 corresponding to the second connection pad 410. The auxiliary electrode 270 is disposed between the substrate 100 and the output circuit 230. The auxiliary electrode 270 and the output circuit 230 are electrically connected. To reduce the impedance of the circuit.

In some embodiments, the control circuit 240 and the input circuit 220 may be respectively coupled to an external control module (not shown), and the control module may apply a certain voltage through the control circuit 240 to form the semiconductor layer 210. On state, at this time, power or signal can be input to the light emitting unit 500 through the input line 220, so that the light emitting unit 500 emits light according to the power or signal. In some embodiments, the control module may individually control the plurality of light-emitting units 500 of the light-emitting device 30 by controlling the thin-film transistor corresponding to each light-emitting device 30 to be turned on or off, so that any one or more light-emitting units 500 emit light. , Do not emit light or adjust brightness. In other words, when the light-emitting device 30 is applied to a backlight module of a display device, the display device can adjust the light-emitting device 30 according to different areas on the display surface by means of the control module. For example, when a certain area in the image displayed on the display surface is a dark scene, one or more light-emitting units 500 in the light-emitting device 30 corresponding to the area may be controlled to lower the one or more light-emitting units 500. Brightness or no light.

As shown in FIG. 2 and FIG. 3, in this embodiment, in the vertical direction Dv of the substrate 100, the reflective layer 420 and the thin film transistor TFT overlap. For example, the reflective layer 420 overlaps the semiconductor layer 210, the input line 220, and the control line 240 in the vertical direction Dv of the substrate 100.

In this embodiment, the driving circuit 200, the insulating layer 300, the connection pad 410, and the reflective layer 420 can be directly formed on the substrate 100 through processes such as development, etching, deposition, and / or sputtering, and then the light emitting unit 500 is aligned and aligned Bonding to the corresponding connection pads 410 can complete the production of the light-emitting device 30. In other words, the manufacturing processes of the substrate 100, the driving circuit 200, the insulating layer 300, the connection pad 410, the reflective layer 420, and the light emitting unit 500 may be integrated, instead of manufacturing each component separately and then grouping the components together. In this embodiment, the connection pad 410 and the reflective layer 420 may be formed by patterning the same metal layer. For example, after the insulating layer 300 is formed, a metal layer is formed, and then yellow light, development, After the etching process, a metal pattern layer 400 is formed. A portion of the metal pattern layer 400 is used as the connection pad 410 and a portion is used as the reflective layer 420.

Please refer to FIG. 4 and FIG. 5. FIG. 4 is a schematic cross-sectional view of a light-emitting device 30 according to another embodiment of the present invention. FIG. 5 is a schematic partial top-view schematic view of the light-emitting device 30 of FIG. 4. 4 and 5 only show a part of the light-emitting device 30. As shown in FIG. 4 and FIG. 5, in this embodiment, the driving circuit 200 may include only the input line 220 and the output line 230 without the semiconductor layer 210 and the control line 240. If one of the two connection pads 410 (ie, the connection pair 415) of each group is defined as the first connection pad 4101 and the other is the second connection pad 4102, the input line 220 is coupled to The first connection pad 4101, the first connection pad 4101 is coupled to one end of the light-emitting unit 500, the other end of the light-emitting unit 500 is coupled to the second connection pad 4102, and the second connection pad 4102 is coupled to the output line 230. The input line 220 can be coupled to an external control module (not shown). The control module can input power or signals to the light-emitting unit 500 through the input line 220, so that the light-emitting unit 500 emits light according to the power or signals. In this case, the control module can perform overall control on the plurality of light-emitting units 500 of the light-emitting device 30, so that the overall light-emitting unit 500 emits light, does not emit light, or adjusts brightness, and the structure of such a light-emitting device 30 is simplified, which can reduce production costs . In some embodiments, if the plurality of input lines 220 are respectively coupled to a single or a plurality of groups of light-emitting units 500, the control module may also input power or signals for the individual input lines 220 in order to individually control all The light-emitting units 500 are described individually or in groups.

As shown in FIGS. 4 and 5, in this embodiment, the driving circuit 200 further includes a lower input line 222 and a lower output line 232. The lower input line 222 is located between the input line 220 and the substrate 100, and the input line 220 and the lower input line 222 are stacked and connected to each other. The lower output line 232 is located between the output line 230 and the substrate 100, and the output line 230 and the lower output line 232 are stacked and connected to each other. When the input line 220 and the lower input line 222 are used to input the same source of power or signal, the line impedance can be reduced. Similarly, when the output line 230 and the lower output line 232 are used to output the same source of power or signal, the line impedance Can also be reduced. In other words, the lower input line 222 and the lower output line 232 facilitate the transmission of power or signals. In some embodiments, if the input line 220 and the lower input line 222 are stacked on each other but electrically isolated from each other (for example, the input line 220 and the lower input line 222 may be separated by the insulating layer 300), then the input line 220 and the lower input line 222 are separated from each other. It is also possible to input power or signals from different sources separately; similarly, the output line 230 and the lower input line 232 are stacked on each other but are electrically isolated from each other, then the output line 230 and the lower output line 232 can also output power or signals from different sources, respectively.

In some embodiments, the light emitting device 30 may further include a plurality of conductive patterns 600, as shown in FIG. 2 or FIG. 4. Each conductive pattern 600 is located between the corresponding connection pad 410 and the driving circuit 200, and each conductive pattern 600 is coupled to the corresponding connection pad 410 and the driving circuit 200. In some embodiments, the plurality of conductive patterns 600 are made of indium tin oxide (ITO), and the indium tin oxide is connected between the corresponding connection pad 410 and the driving circuit 200, which may increase The adhesion of the connection pad 410 helps to stabilize the connection relationship between the connection pad 410 and the driving circuit 200.

In some embodiments, the reflective layer 420 is periodic or regular with respect to each light-emitting unit 500.

As shown in FIG. 1, in this embodiment, the reflective layer 420 has a periodic pattern 426 relative to each group of connection pads 410 (or each light-emitting unit 500). For example, taking FIG. 1 as an example, the reflective layer 420 surrounds each group of the connection pads 410 (or each light-emitting unit 500) with a specific periodicity or regularity, and forms a “mouth” -shaped periodic pattern 426. This periodic or regular periodic pattern 426 of the reflective layer 420 enables the light generated by the light-emitting unit 500 to reflect and diffuse more regularly, and makes the light distribution more uniform.

Please refer to FIG. 6, which is a schematic top view of a light emitting device according to a second embodiment of the present invention. The difference from the first embodiment described above is that the reflective layer 420 in this embodiment has a plurality of separated blocks 424a separated from each other, and the reflective layer 420 is arranged on each group of connection pads 410 (or each light emitting unit with a specific periodicity or regularity). Unit 500). Specifically, the reflective layer 420 includes a plurality of periodic patterns 426, each of which includes a plurality of separated blocks 424a, and the plurality of separated blocks 424a of each of the periodic patterns 426 are arranged in a corresponding periodicity or regularity in the corresponding Around the connection pad 410 (or the corresponding light emitting unit 500). In this embodiment, each periodic pattern 426 includes four separated blocks 424a, and the four separated blocks 424a of each periodic pattern 426 are respectively located around each group of connection pads 410 (or each light-emitting unit 500) and form a non- Continuous "mouth" glyphs. In this embodiment, the separated blocks 424 a of two adjacent periodic patterns 426 may be connected to each other.

Please refer to FIG. 7, which is a schematic top view of a light emitting device according to a third embodiment of the present invention. In this embodiment, the reflective layer 420 includes a plurality of periodic patterns 426, each periodic pattern 426 includes two separated blocks 424b, and the two separated blocks 424b of each periodic pattern 426 will have a specific periodicity or regularity. Around the corresponding connection pad 410 (or the corresponding light emitting unit 500). In this embodiment, two separate blocks 424b of each periodic pattern 426 surround each group of connection pads 410 (or each light-emitting unit 500), and form two concentric polygons. However, it is not limited to this. In other embodiments, for example, it may be a concentric circle. In this embodiment, two adjacent periodic patterns 426 may be connected to each other. For example, the outer separation blocks 424b of two adjacent periodic patterns 426 (that is, the outer sides of two concentric circle separation blocks 424b) are connected to each other.

Please refer to FIG. 8, which is a schematic top view of a light emitting device according to a fourth embodiment of the present invention. In this embodiment, the reflective layer 420 includes a plurality of periodic patterns 426, each periodic pattern 426 includes eight separated blocks 424c, and the eight separated blocks 424c of each periodic pattern 426 will have a specific periodicity or regularity. It is arranged around the corresponding connection pad 410 (or the corresponding light emitting unit 500). In this embodiment, the eight separated blocks 424c of each periodic pattern 426 are respectively arranged around each group of connection pads 410 (or each light-emitting unit 500) and formed in a radial shape. In the present embodiment, two adjacent periodic patterns 426 have no overlapping portions but are independent of each other. Moreover, in this embodiment, the size of the eight separate blocks 424c of each periodic pattern 426 is the same; and in other embodiments, the size of the eight separate blocks 424c of each periodic pattern 426 may have a periodicity or a regularity. For example, the separation block 424c located between adjacent periodic patterns 426 is smaller, and the separation block 424c located outside the periodic pattern 426 (the side away from other periodic patterns 426) is larger. This configuration also helps In order to enhance the amount of light reflection on the outside of the light emitting device, the light diffusion effect is more uniform.

Please refer to FIG. 9, which is a schematic side view of a backlight module 20 according to an embodiment of the present invention. A backlight module 20 includes the light-emitting device 30, the scattering layer 700, and the opposite substrate 710 in any one of the foregoing embodiments. The scattering layer 700 is located between the opposite substrate 710 and the light-emitting device 30. The scattering layer 700 is disposed on the insulating layer 300, the metal pattern layer 400, and the light emitting unit 500 of the light emitting device 30, and the opposite substrate 710 is disposed opposite to the substrate 100.

In this embodiment, the scattering layer 700 may be a polymer dispersed liquid crystal (Polymer Dispersed Liquid Crystal, PDLC) 702. In some embodiments, the scattering layer 700 may also be a polymer network liquid crystal (Polymer Network Liquid Crystal, PNLC). In this embodiment, the backlight module 20 further includes a sealing member 720. The sealing member 720 is located on the periphery of the light emitting device 30 and the opposite substrate 710, and is coupled to the light emitting device 30 and the opposite substrate 710. In addition, the sealing member 720 can restrict the polymer dispersed liquid crystal 702 between the light emitting device 30 and the opposite substrate 710. The light emitted by the light emitting unit 500 on the light emitting device 30 can be refracted and scattered by the polymer dispersed liquid crystal 702 in the scattering layer 700, and can be further reflected by the periodic pattern 426 of the reflection layer 420. In this way, the light will be in the scattering layer The 700 and the light-emitting device 30 are diffused through continuous refraction and reflection. When the light is finally emitted from the light-emitting surface of the opposite substrate 710 (that is, the side away from the light-emitting device 30), a surface light source with good uniformity is formed.

As shown in FIG. 9, in this embodiment, the driving circuit 200 may further include a peripheral circuit 260 and a lower peripheral circuit 262, and the light emitting device 30 may further include a peripheral conductive pattern 610. The peripheral circuit 260 and the lower peripheral circuit 262 are located on the substrate 100 and are stacked on each other. The peripheral conductive pattern 610 is connected to the peripheral circuit 260 through the insulating layer 300. In some embodiments, the peripheral circuit 260 and the lower peripheral circuit 262 may be connected to a thin film transistor TFT, an input circuit 220, or an output circuit 230, but are not limited thereto. In addition, since the light emitting unit 500 is not provided on the surrounding conductive pattern 610, the scattering layer 700 need not be covered on the surrounding conductive pattern 610.

In summary, according to the light-emitting device 30 and the backlight module 20 using the light-emitting device 30 according to the embodiment of the present invention, the periodic pattern 426 of the reflective layer 420 allows the light emitted by each light-emitting unit 500 to pass through the periodic pattern. 426 further reflects, and the scattering layer 700 in the backlight module 20 also facilitates the refraction and scattering of light, so that the light can be more uniformly diffused to generate a uniform surface light source. In addition, the driving circuit 200, the reflective layer 420, and the connection pad 410 (and the conductive pattern layer 600) of the light-emitting device 30 can be formed on the substrate 100 through an integrated process to reduce the volume, thickness, and weight of the backlight module 20. , While also reducing production costs.

Although the technical content of the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art and making some changes and retouching without departing from the spirit of the present invention should be covered by the present invention. Therefore, the scope of protection of the present invention shall be determined by the scope of the appended patent application.

20‧‧‧ backlight module

30‧‧‧light-emitting device

100‧‧‧ substrate

200‧‧‧Drive circuit

210‧‧‧Semiconductor layer

220‧‧‧ input line

222‧‧‧ Lower input line

230‧‧‧ output line

232‧‧‧lower output line

240‧‧‧Control line

250‧‧‧ connection line

260‧‧‧Circle

262‧‧‧Routes around the lower level

270‧‧‧Auxiliary electrode

300‧‧‧ Insulation

400‧‧‧ metal pattern layer

410‧‧‧Connecting pad

4101‧‧‧First connection pad

4102‧‧‧Second connection pad

412‧‧‧Connecting pad center

415‧‧‧connected pair

420‧‧‧Reflective layer

422‧‧‧ opening

424a, 424b, 424c

426‧‧‧period pattern

500‧‧‧light-emitting unit

600‧‧‧ conductive pattern

610‧‧‧ Around conductive pattern

700‧‧‧ scattering layer

702‧‧‧ polymer dispersed liquid crystal

710‧‧‧ Opposite substrate

720‧‧‧seal

D‧‧‧ Drain

Dis‧‧‧ Distance

Dv‧‧‧ vertical

G‧‧‧Gate

S‧‧‧Source

TFT‧‧‧ thin film transistor

FIG. 1 is a schematic top view of a light emitting device according to a first embodiment of the present invention; FIG. 2 is a schematic cross-sectional view at a line segment 2-2 of FIG. 1; FIG. 3 is a partial top view of the light emitting device of FIG. 4 is a schematic cross-sectional view of a light emitting device according to another embodiment of the present invention; FIG. 5 is a schematic partial top view of the light emitting device of FIG. 4; FIG. 6 is a light emitting device according to a second embodiment of the present invention 7 is a schematic top view of a light emitting device according to a third embodiment of the present invention; FIG. 8 is a schematic top view of a light emitting device according to a fourth embodiment of the present invention; and FIG. 9 is a schematic view of A schematic side view of a backlight module according to an embodiment of the invention.

Claims (11)

A light emitting device includes: a substrate; a driving circuit disposed on the substrate; an insulating layer disposed on the substrate and covering the driving circuit; a metal pattern layer disposed on the insulating layer and the metal pattern layer The method includes: a plurality of connection pads separated from each other and electrically coupled to the driving circuit respectively; and a reflection layer separated from the plurality of connection pads and located at a periphery of the plurality of connection pads, the reflection layer having at least one opening, and the plurality of connections A pad is located in the opening; and a light emitting unit is disposed on the plurality of connection pads. The light-emitting device according to claim 1, wherein the reflective layer and the plurality of connection pads are formed by patterning the same metal layer. The light-emitting device according to claim 1, wherein the reflective layer has a plurality of separated blocks separated from each other, and the plurality of separated blocks are respectively located around the plurality of connection pads. The light-emitting device according to claim 1, further comprising: a plurality of conductive patterns, each of which is located between the corresponding connection pad and the driving circuit and is coupled to the connection pad and the driving circuit. The light-emitting device according to claim 4, wherein the plurality of conductive patterns are made of indium tin oxide. The light-emitting device according to claim 1, wherein the driving circuit includes a thin film transistor, and the thin film transistor is coupled to one of the plurality of corresponding connection pads. The light-emitting device according to claim 6, wherein the reflective layer and the thin film transistor overlap in a vertical direction of the substrate. The light-emitting device according to claim 1, wherein the metal pattern layer is made of aluminum, copper, or silver. The light-emitting device according to claim 1, wherein a distance between centers of two adjacent connection pads in the plurality of connection pads provided with the light-emitting unit is between 10 μm and 900 μm. A backlight module, comprising: the light-emitting device according to any one of claims 1 to 9; a scattering layer provided on the insulating layer, the metal pattern layer and the light-emitting unit; and a pair of substrates and the The substrates are oppositely disposed, and the scattering layer is disposed between the light emitting device and the opposite substrate. The backlight module according to claim 10, wherein the scattering layer is a polymer dispersed liquid crystal.