TWI657060B - 刻劃輪、保持具單元、刻劃裝置及刻劃方法 - Google Patents
刻劃輪、保持具單元、刻劃裝置及刻劃方法 Download PDFInfo
- Publication number
- TWI657060B TWI657060B TW103121514A TW103121514A TWI657060B TW I657060 B TWI657060 B TW I657060B TW 103121514 A TW103121514 A TW 103121514A TW 103121514 A TW103121514 A TW 103121514A TW I657060 B TWI657060 B TW I657060B
- Authority
- TW
- Taiwan
- Prior art keywords
- wheel
- blade
- leading edge
- scoring
- scribing
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 19
- 239000010432 diamond Substances 0.000 claims abstract description 67
- 239000000758 substrate Substances 0.000 claims abstract description 59
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 55
- 238000005520 cutting process Methods 0.000 claims abstract description 33
- 239000000919 ceramic Substances 0.000 claims abstract description 19
- 239000013078 crystal Substances 0.000 claims description 38
- 239000000463 material Substances 0.000 claims description 25
- 229910052594 sapphire Inorganic materials 0.000 claims description 7
- 239000010980 sapphire Substances 0.000 claims description 7
- 229910052710 silicon Inorganic materials 0.000 claims description 7
- 239000010703 silicon Substances 0.000 claims description 7
- 230000003746 surface roughness Effects 0.000 claims description 7
- 239000011521 glass Substances 0.000 abstract description 10
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 230000015572 biosynthetic process Effects 0.000 abstract description 6
- 238000003754 machining Methods 0.000 description 16
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 230000035515 penetration Effects 0.000 description 4
- 239000010455 vermiculite Substances 0.000 description 4
- 229910052902 vermiculite Inorganic materials 0.000 description 4
- 235000019354 vermiculite Nutrition 0.000 description 4
- 238000005299 abrasion Methods 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000006058 strengthened glass Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- YOBAEOGBNPPUQV-UHFFFAOYSA-N iron;trihydrate Chemical compound O.O.O.[Fe].[Fe] YOBAEOGBNPPUQV-UHFFFAOYSA-N 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000001308 synthesis method Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
- C03B33/105—Details of cutting or scoring means, e.g. tips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
- B28D5/0029—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rotating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B3/00—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools
- B24B3/60—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of tools not covered by the preceding subgroups
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/225—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/027—Scoring tool holders; Driving mechanisms therefor
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mining & Mineral Resources (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP2013-196593 | 2013-09-24 | ||
| JP2013196593A JP6357746B2 (ja) | 2013-09-24 | 2013-09-24 | スクライビングホイール、ホルダユニット、スクライブ装置、スクライビングホイールの製造方法及びスクライブ方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201512119A TW201512119A (zh) | 2015-04-01 |
| TWI657060B true TWI657060B (zh) | 2019-04-21 |
Family
ID=52831347
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103121514A TWI657060B (zh) | 2013-09-24 | 2014-06-23 | 刻劃輪、保持具單元、刻劃裝置及刻劃方法 |
| TW107125721A TWI703102B (zh) | 2013-09-24 | 2014-06-23 | 刻劃輪及刻劃輪之製造方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107125721A TWI703102B (zh) | 2013-09-24 | 2014-06-23 | 刻劃輪及刻劃輪之製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6357746B2 (ja) |
| KR (1) | KR102235408B1 (ja) |
| CN (3) | CN110370472A (ja) |
| TW (2) | TWI657060B (ja) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016210169A (ja) * | 2015-04-30 | 2016-12-15 | 三星ダイヤモンド工業株式会社 | スクライビングホイール |
| KR102509143B1 (ko) * | 2015-06-30 | 2023-03-13 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | 커터 휠 및 그 제조방법 |
| JP6736151B2 (ja) * | 2015-06-30 | 2020-08-05 | 三星ダイヤモンド工業株式会社 | カッターホイール並びにその製造方法 |
| JP6572660B2 (ja) * | 2015-07-31 | 2019-09-11 | 三星ダイヤモンド工業株式会社 | スクライビングホイール |
| JP6682907B2 (ja) * | 2016-02-26 | 2020-04-15 | 三星ダイヤモンド工業株式会社 | 脆性基板の分断方法 |
| JP6746128B2 (ja) * | 2016-05-24 | 2020-08-26 | 三星ダイヤモンド工業株式会社 | カッターホイール |
| CN107662292A (zh) * | 2016-07-29 | 2018-02-06 | 三星钻石工业株式会社 | 刻划轮 |
| JP6460267B2 (ja) * | 2018-01-29 | 2019-01-30 | 三星ダイヤモンド工業株式会社 | ブレーク装置 |
| JP2019147225A (ja) * | 2018-02-27 | 2019-09-05 | 三星ダイヤモンド工業株式会社 | カッターホイールおよび切断方法 |
| CN109605584B (zh) * | 2018-12-28 | 2024-05-24 | 嘉善佳腾自润滑材料厂 | 一种石墨柱切割系统 |
| JP2021006374A (ja) * | 2019-06-28 | 2021-01-21 | 三星ダイヤモンド工業株式会社 | スクライビングホイール |
| CN113500403A (zh) * | 2021-06-21 | 2021-10-15 | 东台耀强机械制造有限公司 | 无死角自动剪切压型装置 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55106635U (ja) * | 1979-01-22 | 1980-07-25 | ||
| TW201024238A (en) * | 2008-12-18 | 2010-07-01 | Univ Nat Taiwan | Method and device for vibration assistant scribing process on a substrate |
| TW201302638A (zh) * | 2011-05-31 | 2013-01-16 | Mitsuboshi Diamond Ind Co Ltd | 劃線方法、鑽石尖、劃線裝置 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55106635A (en) | 1979-02-08 | 1980-08-15 | Nippon Radiator Co Ltd | Method and apparatus for molding flange to circular pipe |
| CN2841285Y (zh) | 2004-12-10 | 2006-11-29 | 厦门市万成光学工业有限公司 | 眼镜片切割工具 |
| JP4836150B2 (ja) * | 2008-11-26 | 2011-12-14 | 株式会社日本製鋼所 | カッターホイール |
| JP5438422B2 (ja) * | 2009-07-31 | 2014-03-12 | 三星ダイヤモンド工業株式会社 | 脆性材料基板の加工方法並びに加工装置 |
| JP5257323B2 (ja) * | 2009-10-29 | 2013-08-07 | 三星ダイヤモンド工業株式会社 | チップホルダユニット |
| CN101712132A (zh) * | 2010-01-04 | 2010-05-26 | 廊坊昊博金刚石有限公司 | 一种镜面抛光的cvd金刚石磨块及制造方法和应用方法 |
| JP2012250352A (ja) * | 2011-05-31 | 2012-12-20 | Mitsuboshi Diamond Industrial Co Ltd | スクライビングホイールおよびスクライブ装置 |
| JP5966564B2 (ja) * | 2011-06-08 | 2016-08-10 | 三星ダイヤモンド工業株式会社 | スクライビングホイール及びスクライブ方法 |
| JP2013010650A (ja) * | 2011-06-28 | 2013-01-17 | Mitsuboshi Diamond Industrial Co Ltd | スクライブ装置 |
| CN202656218U (zh) * | 2012-07-31 | 2013-01-09 | 乐清市南方硬质合金有限公司 | 一种新型刀轮 |
| CN203112689U (zh) * | 2013-02-04 | 2013-08-07 | 深圳市常兴技术股份有限公司 | 一种用于触摸屏玻璃钻孔加工的刀具 |
-
2013
- 2013-09-24 JP JP2013196593A patent/JP6357746B2/ja active Active
-
2014
- 2014-06-23 TW TW103121514A patent/TWI657060B/zh active
- 2014-06-23 TW TW107125721A patent/TWI703102B/zh active
- 2014-07-18 KR KR1020140090734A patent/KR102235408B1/ko active Active
- 2014-08-22 CN CN201910599299.XA patent/CN110370472A/zh active Pending
- 2014-08-22 CN CN201410418893.1A patent/CN104441275A/zh active Pending
- 2014-08-22 CN CN201810456573.3A patent/CN108608588A/zh active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55106635U (ja) * | 1979-01-22 | 1980-07-25 | ||
| TW201024238A (en) * | 2008-12-18 | 2010-07-01 | Univ Nat Taiwan | Method and device for vibration assistant scribing process on a substrate |
| TW201302638A (zh) * | 2011-05-31 | 2013-01-16 | Mitsuboshi Diamond Ind Co Ltd | 劃線方法、鑽石尖、劃線裝置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2015063010A (ja) | 2015-04-09 |
| JP6357746B2 (ja) | 2018-07-18 |
| TW201512119A (zh) | 2015-04-01 |
| KR20150033523A (ko) | 2015-04-01 |
| CN104441275A (zh) | 2015-03-25 |
| TWI703102B (zh) | 2020-09-01 |
| KR102235408B1 (ko) | 2021-04-01 |
| CN110370472A (zh) | 2019-10-25 |
| TW201840492A (zh) | 2018-11-16 |
| CN108608588A (zh) | 2018-10-02 |
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