TWI656033B - Adhering device, adhering method, production device of optical display device, and production method thereof - Google Patents

Abstract

The bonding apparatus of the present invention is a bonding apparatus for bonding the layer F1X to the optical display member P, and includes a winding portion 111 for winding the optical component layer FX from the roll drum RX together with the separation layer F3a; The broken portion 115 cuts the optical component layer FX residual separation layer F3a to form a layer F1X; the bonding portion 150, peels the layer F1X from the separation layer F3a and bonds it to the optical display member P; and the dust collecting device 10 It is disposed between the cutting portion 115 and the bonding portion 150 to remove dust from the layer sheet F1X.

Description

Laminating device, bonding method, production system of optical display device, and production method of optical display device

The present invention relates to a bonding apparatus, a bonding method, a production system of an optical display device, and a production method of the optical display device.

The present invention claims priority based on Japanese Patent Application No. 2014-141317, filed on Jan.

An apparatus described in Patent Document 1 is known as a device for bonding a layered material to an object to be attached.

The apparatus of Patent Document 1 cuts a long layered layer material in a specific size and holds it on the head. Then, the apparatus of Patent Document 1 moves the head to the stage on which the attached object is placed, and after aligning the head and the attached object, presses the head on the attached object to make the layered material. Transfer to the attached object.

[Previous Technical Literature]

[Patent Literature]

[Patent Document 1] Japanese Patent No. 4482757

In the apparatus of Patent Document 1, when the layered material is transferred to the object to be attached, the shape of the head is an arc shape in order not to generate bubbles. However, in the layered material to be cut, dust such as cutting dust generated when the long layered material is cut is easily adhered. Therefore, when the layered material is transferred to the object to be attached, dust is easily mixed between the layered material and the object to be attached. Further, bubbles are easily generated between the layered material and the adherend due to the incorporation of dust.

Therefore, the quality of the product cannot be improved.

An object of the present invention is to provide a bonding apparatus, a bonding method, a production system of an optical display device, and a production method of an optical display device which can suppress the incorporation of dust when transferring a layer sheet and improve the quality of the product.

In order to achieve the above object, the present invention employs the following means.

(1) That is, a bonding apparatus according to an aspect of the present invention is a bonding apparatus for bonding a layer to an optical display member, comprising: a winding-out portion, together with the optical module layer from the winding roller and the separation layer Rolling off; cutting the portion of the optical component layer to leave the separation layer to form the layer; bonding layer, peeling the layer from the separation layer and bonding to the optical display member; and collecting dust The device is disposed between the cutting portion and the bonding portion to remove dust from the layer.

(2) The bonding apparatus according to the above aspect (1), wherein the dust collecting device further includes: a first pair of rollers, which is constituted by a pair of first rollers, and is conveyed to the bonding portion a portion of the conveying direction of the ply is clamped from above and below, and the surface of the first pair of rollers is brought into contact with the surface of the ply to remove dust of the ply; and at least one of the pair of first rollers The surface has a first adhesion that removes dust from the ply.

(3) The bonding apparatus according to (2) above, wherein the first adhesive force is preferably smaller than an adhesive force of the layer and the separation layer.

(4) The bonding apparatus according to the above (2) or (3), wherein the first adhesive layer is preferably detachably wound around the first roller having the first adhesive force.

(5) The bonding apparatus according to any one of (2) to (4), wherein the dust collecting device further comprises: a second pair of rollers, which is constituted by a pair of second rollers, The first roller pair is clamped from above and below, and the surfaces of the second roller pair are respectively in contact with the first roller pair to remove dust of the first roller; and the pair of second rollers are opposite And a second roller of the first roller having the first adhesive force, the surface of the second roller having a second adhesive force greater than the first adhesive force.

(6) The bonding apparatus according to (5) above, wherein the second adhesive layer is preferably detachably wound around the second roller having the second adhesive force.

(7) The bonding apparatus according to any one of the above (1) to (6), further comprising: a layer platform, the layer is supported from the separation layer side; and the bonding platform is placed There is the optical display member; wherein the bonding portion preferably comprises a bonding head, and the layer that is stationary on the layer platform is rotated along the bending surface of the holding surface by pressing the curved holding surface while pressing The layer sheet is peeled off from the separation layer and held on the holding surface, and the layer sheet held on the holding surface is bonded to the optical display member placed on the bonding platform.

(8) The bonding apparatus according to the above (7), further comprising: a winding portion, wherein the layer is peeled off from the separation layer by the bonding head, and then wound into a separate separation layer; The winding portion rotates the separation layer in the winding direction in a first period of the moment when the bonding head presses the holding surface against the layer to start the rotation, and after the first period passes to the winding portion The separation layer is rotated in the winding direction during the second period in which the rotation is stopped.

(9) The bonding apparatus according to (7) or (8) above, preferably further comprising: a cover plate Adhering to the optical display member on the bonding platform; wherein, after the holding surface of the bonding head is pressed against the upper surface of the cover, the bonding head is continuously rotated on the upper surface of the cover plate and the optical On the upper surface of the display member, the layer held on the holding surface is attached to the optical display member.

(10) A production system for an optical display device according to a first aspect of the present invention is a production system in which an optical display member is bonded to an optical component to form an optical display device, comprising: a bonding device on which the optical display member is attached A bonding apparatus according to any one of the above (1) to (9), wherein the bonding apparatus is a laminate of the optical component.

(11) A production system for an optical display device according to a second aspect of the present invention is a production system in which an optical display member is bonded to an optical component to form an optical display device, comprising: a bonding device on which the optical display member is attached a layer larger than the optical component; a detecting device that captures an optical display member to which the layer is attached, detects a cutting line of the layer based on the shooting information; and cuts the device by cutting The wire is cut into a layer of the optical display member to cut the optical component from the layer; wherein the bonding device is the one described in any one of the above (1) to (9) Combined device.

(12) A method for attaching an aspect of the present invention to a method of bonding a layer to an optical display member, comprising: a winding-out step of unwinding the optical component layer from the roll drum and the separation layer a cutting step of cutting the separation layer of the optical component layer to form the layer; a bonding step of peeling the layer from the separation layer and bonding to the optical display member; and a dust collecting step, The dust of the layer is removed between the cutting step and the bonding step.

(13) The bonding method according to the above (12), wherein the dust collecting step preferably uses a first pair of rollers formed by a pair of first rollers to transport the layer to the bonding step. a portion of the conveying direction is sandwiched from above and below, and the surface of the first pair of rollers is brought into contact with the surface of the layer to remove dust of the layer; and at least one of the pair of first rollers has a surface The first adhesion of the dust of the ply can be removed.

(14) The bonding method according to (13) above, wherein the first adhesive force is preferably smaller than an adhesive force of the layer and the separation layer.

(15) The bonding method according to the above (13) or (14), wherein the first adhesive layer is preferably detachably wound around the first roller having the first adhesive force.

(16) The bonding method according to any one of (13) to (15), wherein the dust collecting step preferably further uses a second pair of rollers formed by a pair of second rollers, The first pair of rollers are clamped from above and below, and the surfaces of the pair of second rollers are respectively in contact with the pair of first rollers to remove dust of the first roller; and among the pair of second rollers, opposite a second roller of the first roller having the first adhesive force, the surface of the second roller having a second adhesive force greater than the first adhesive force.

(17) The bonding method according to (16) above, wherein the second adhesive layer is preferably detachably wound around the second roller having the second adhesive force.

(18) The bonding method according to any one of the above (12) to (17), further comprising: a supporting step of supporting the layer from the side of the separation layer by a layer platform; Step, the optical display component is placed on the bonding platform; wherein the bonding step is performed on the layer resting on the layer platform by pressing the curved holding surface of the bonding head The surface of the surface is rotated to rotate the bonding head, and the layer is peeled off from the separation layer and held on the holding surface, and the layer held on the holding surface is attached to the optical display member placed on the bonding platform. .

(19) The bonding method according to (18) above, further comprising: a winding step of peeling the layer from the separation layer by the bonding head, and winding the winding portion into a separate a separating layer; wherein, in the winding step, the winding portion rotates the separating layer in a winding direction during a first period of the moment when the bonding head presses the holding surface against the layer to start rotating After the first period has elapsed until the winding portion is in the second period in which the rotation is stopped, the winding portion rotates the separation layer in the winding direction.

(20) The bonding method according to (18) or (19), further comprising: a cover plate adjacent to the optical display member on the bonding platform; wherein, in the bonding step, After the holding surface of the bonding head is pressed against the upper surface of the cover, the bonding head is adhered to the layer of the holding surface by continuously rotating on the upper surface of the cover and the upper surface of the optical display member. The optical display member.

(21) A method of producing an optical display device according to a first aspect of the present invention is a method for producing an optical display device by bonding an optical component to an optical display member, comprising: a bonding step of attaching the optical display member In cooperation, the bonding step is carried out using the bonding method according to any one of the above (12) to (20).

(22) A method of producing an optical display device according to a second aspect of the present invention is a method for producing an optical display device by bonding an optical component to an optical display member, comprising: a bonding step of attaching the optical display member a layer larger than the optical component; a detecting step of photographing an optical display member to which the layer is attached, detecting a cutting line of the layer based on the photographing information; and a cutting step by cutting along the cutting The optical component is cut out from the layer of the optical display member, and the optical component is cut out from the layer; wherein the bonding step is used in the sticker according to any one of the above (12) to (20) The method is combined.

According to the present invention, it is possible to provide a bonding apparatus, a bonding method, a production system of an optical display device, and a production method of an optical display device capable of suppressing the incorporation of dust during transfer of a layer sheet and improving the quality of the product.

10‧‧‧dust collection device

11‧‧‧First roller pair

11a‧‧‧First upper roller

11b‧‧‧First lower roller

12‧‧‧Second roller pair

12a‧‧‧Second upper roller

12b‧‧‧Second lower roller

13‧‧‧First adhesive layer

13a‧‧‧First upper adhesive layer

13b‧‧‧First lower adhesive layer

14‧‧‧Second Adhesive Layer

14a‧‧‧Second upper adhesive layer

14b‧‧‧Second lower adhesive layer

15‧‧‧Photographing device

20‧‧‧dust collection device

30‧‧‧Attraction device

31‧‧‧Dust box

33‧‧‧ front wall

34‧‧‧The lower wall

35‧‧‧Extension

36‧‧‧Attraction nozzle

36a‧‧‧Flow

37‧‧‧ attracting mouth

38‧‧‧Upper wall

39‧‧‧ Back wall

41‧‧‧Flow

42‧‧‧Import

43‧‧‧Export

44‧‧‧Guide board

51‧‧‧ blowing out the nozzle

52‧‧‧Blowing out

100‧‧‧Fitting device

110‧‧‧layer conveyor

111‧‧‧Devolution

112‧‧‧Winding Department

113‧‧‧ pinch roller

113a‧‧‧First pinch roller

113b‧‧‧Second pinch roller

114‧‧‧ platform

115‧‧‧cutting department

120‧‧‧Fitting head

121‧‧‧ head body

122‧‧‧Adhesive layer

122a‧‧‧ Keep face

130‧‧‧ head drive

135‧‧‧floor

136‧‧‧Rotary Drive Department

136a‧‧‧Rotary retention shaft

137‧‧‧ pole

140‧‧‧Head lifting device

141‧‧‧Cylinder body

142‧‧‧Cylinder rod

150‧‧‧ head unit

160‧‧‧ head moving device

161‧‧‧ guided orbit

162‧‧‧Sliding parts

170‧‧‧ platform unit

171‧‧‧Melt platform

171a‧‧‧Loading surface

172‧‧‧ platform drive

173‧‧‧ cover

181‧‧‧ first camera

182‧‧‧Second camera

183‧‧‧Photographing device

184‧‧‧cutting device

185‧‧‧ cut off the platform

189‧‧‧Detection device

190‧‧‧Control device

215‧‧ ‧ laser cutting device

1000‧‧‧Production System

1001‧‧‧cleaning device

1002‧‧‧First bonding device

1003‧‧‧Second fitting device

1004‧‧‧ peeling device

1005‧‧‧ Third bonding device

1006‧‧‧Checking device

2000‧‧‧Production System

2001‧‧‧cleaning device

2002‧‧‧First bonding device

2003‧‧‧First cutting device

2004‧‧‧Second fitting device

2005‧‧‧Second cutting device

2006‧‧‧ peeling device

2007‧‧‧ Third bonding device

2008‧‧‧ Third cutting device

2009‧‧‧Inspection device

AFD‧‧‧ direction of rotation

CL‧‧‧ cutting line

CN‧‧‧Air duct connecting pipe

CP‧‧‧ checkpoint

D‧‧‧distance

DP‧‧‧Optical display device

EL‧‧‧ edge line

F1a‧‧‧Optical component body

F1X‧‧‧ layer

F2a‧‧‧Adhesive layer

F3a‧‧‧Separation layer

F4a‧‧‧Surface protection film

F5‧‧‧Fitting layer

F6‧‧‧ polarizer

F7‧‧‧ first film

F8‧‧‧second film

FB‧‧‧ first area

FO‧‧‧Optical components

FS‧‧‧Second area

FX‧‧‧ optical component layer

FXm‧‧‧ layer

L‧‧‧Laser light

P‧‧‧Optical display parts

P4‧‧‧ display area

RX‧‧‧ Roller

SX‧‧‧ cut line

WCL‧‧‧ cut line

Θ1‧‧‧ tilt angle

Θ2‧‧‧opening angle

Maxmax‧‧‧maximum offset angle

Midmid‧‧‧minimum offset angle

Θmin‧‧‧average offset angle

Fig. 1 is a schematic view showing a bonding apparatus according to a first embodiment of the present invention.

[Fig. 2] is a perspective view of the periphery of the dust collecting device.

[Fig. 3] is a plan view around the dust collecting device.

[Fig. 4] is a side view of the dust collecting device.

Fig. 5A is a view showing a process of attaching a layer to a bonding head.

Fig. 5B is a view showing a process of attaching a layer to a head.

Fig. 5C is a view showing a process of attaching a layer to a head.

Fig. 6A is a view showing a process of transferring a layer attached to a bonding head to an optical display member.

Fig. 6B is a view showing a process of transferring a layer attached to a bonding head to an optical display member.

Fig. 6C is a view showing a process of transferring a layer attached to a bonding head to an optical display member.

Fig. 7 is a cross-sectional view showing an optical component layer.

Fig. 8 is a schematic view showing a production system of an optical display device according to a first embodiment of the present invention.

Fig. 9 is a side cross-sectional view showing a dust collecting device according to a first modification of the first embodiment of the present invention.

Fig. 10 is an enlarged view of a main part of Fig. 9.

Fig. 11 is a view showing a cutting process of a ply in the bonding apparatus according to the second embodiment of the present invention.

Fig. 12A is a view for explaining a method of determining a bonding position of an optical display member and a layer.

Fig. 12B is a view for explaining a method of determining a bonding position of an optical display member and a layer.

Fig. 13 is a schematic view showing a production system of an optical display device according to a second embodiment of the present invention.

[First Embodiment]

Hereinafter, a production system of a bonding apparatus and an optical display apparatus according to a first embodiment of the present invention will be described with reference to Figs. 1 to 8 .

Fig. 1 is a schematic view of a bonding apparatus 100 of the present embodiment.

In the bonding apparatus 100 of the present embodiment, the layer F1X obtained by half-cutting the long optical component layer FX is bonded to one surface of the optical display member P.

For example, as the optical display member P, a panel-shaped optical display member such as a liquid crystal panel or an organic electroluminescence (OEL) panel can be used. For example, as the optical component layer FX, a polarizing film, a retardation film, a luminance increasing film, or the like can be used. For example, in the present embodiment, as the optical component layer FX, a polarizing film as shown in FIG. 7 is used.

The optical component layer FX of FIG. 7 includes a film-shaped optical module body F1a, an adhesive layer F2a provided on one surface of the optical component body F1a (upper side in FIG. 7), and a separable layer interposed therebetween via the adhesive layer F2a. The separation layer F3a accumulated on one surface of the optical module body F1a and the surface protection film F4a laminated on the other surface (the lower side of FIG. 7) of the optical module body F1a.

For example, the optical module body F1a has a function as a polarizing plate, and is attached to the display region of the optical display member P or across the display region and its peripheral region. The optical module main body F1a is bonded to the optical display member P via the adhesive layer F2a in a state in which the adhesive layer F2a remains on the one surface and is separated from the separation layer F3a. Hereinafter, a portion after removing the separation layer F3a from the optical module layer FX is referred to as a bonding layer F5. The layer F1X is a specific size of the strip-shaped bonding layer F5 A layer of the bonded layer F5 obtained by cutting.

The separation layer F3a protects the adhesive layer F2a and the optical module body F1a from the time before the separation from the adhesive layer F2a. The surface protective film F4a is bonded to the optical display member P together with the optical module body F1a. The surface protective film F4a is disposed on the opposite side of the optical display member P with respect to the optical module body F1a to protect the optical module body F1a. Further, the optical component layer FX may be configured not to include the surface protective film F4a, and the surface protective film F4a may not be separated from the optical module body F1a.

The optical module main body F1a includes a layered polarizer F6, a first film F7 joined to one surface of the polarizer F6 by an adhesive or the like, and a surface of the other side of the polarizer F6 joined by an adhesive or the like. The second film F8. For example, the first film F7 and the second film F8 are protective films for protecting the polarizer F6.

Further, the optical module body F1a may have a single layer structure composed of one layer of optical layers, or may have a laminated structure in which a plurality of optical layers are laminated to each other. The optical layer may be a retardation film or a luminance increasing film, in addition to the polarizing mirror F6. At least one of the first film F7 and the second film F8 may be subjected to a surface treatment to obtain an anti-glare effect including an outermost hard coat treatment or an anti-glare treatment for protecting the liquid crystal display unit. The optical module body F1a may not include at least one of the first film F7 and the second film F8. For example, in the optical module body F1a, the first film F7 may be omitted, and the separation layer F3a may be bonded to the surface of one side of the polarizer F6 via the adhesive layer F2a.

For example, as shown in FIG. 1 , the bonding apparatus 100 of the present embodiment includes a layer conveying device 110 , a dust collecting device 10 , a head unit 150 (a bonding unit), a head moving device 160 , and a platform unit 170 . And control device 190.

For example, the layer conveying device 110 includes a winding portion 111, a winding portion 112, a nip roller portion 113, a layer platform 114, and a cutting portion 115.

The winding portion 111 is configured to wind the optical module layer FX in the longitudinal direction while holding the roll drum RX of the optical component layer FX which is wound in a long shape. For example, the optical component layer FX has the same width as the first side (for example, the short side) of the display region of the optical display member P in the horizontal direction (layer width direction) perpendicular to the transport direction.

In the following, the direction in which the optical component layer FX (separation layer F3a) is unwound from the winding portion 111 and conveyed is referred to as a layer transport direction, the upstream side in the layer transport direction is referred to as a layer transport upstream side, and the downstream side in the layer transport direction is referred to as a layer. Transport to the downstream side.

The cutting unit 115 cuts off (semi-cut) the optical component layer FX wound from the roll drum RX and the residual separation layer F3a in the thickness direction. For example, the cutting portion 115 is in the longitudinal direction perpendicular to the layer width direction of the optical component layer FX as long as the length of the second side (for example, the long side) of the display region of the optical display member P is rolled up. The same length spans the entire width in the width direction of the layer, and cuts off the portion of the optical component layer FX in the thickness direction.

The cutting portion 115 adjusts the advancement and retreat position of the cutting blade and imparts a half cut when the separation layer F3a is not broken or broken (so that the separation layer F3a has a predetermined thickness) by the tension in the conveyance of the optical module layer FX. Broken to the vicinity of the interface between the adhesive layer F2a and the separation layer F3a. Further, instead of the cutting blade, a laser cutting device can be used as the cutting portion 115.

The optical component layer FX after the half cut is formed in the thickness direction by cutting the optical module body F1a, the adhesive layer F2a, and the surface protective film F4a to form a cutting line that spans the entire width of the optical component layer FX in the layer width direction. . The optical component layer F is divided into a section having a length corresponding to the length of the second side of the display region by the cutting line in the longitudinal direction. This partition each becomes a layer F1X in the bonding layer F5.

The cutting angle of the layer conveying direction with respect to the optical component layer FX is controlled by the control device 190. For example, the imaging device 15 (see FIGS. 2 and 3) is disposed at a plurality of positions in the layer transport direction, and the edge image of the optical component layer FX is captured, based on the complex images taken by the imaging devices 15. The edge device of the number of positions, the control device 190 detects the edge position of the complex position. Then, based on the relative positional relationship of the edges of the detected complex positions, the control device 190 calculates the tilt angle of the layer transport direction with respect to the edge of the cut position of the optical component layer FX. Then, the cutting unit 115 cuts off the optical component layer FX by the cutting angle controlled by the control device 190. Thereby, even if the optical component layer FX is meandered in the layer width direction, the optical component layer FX can be cut accurately in the intended direction.

The layer platform 114 supports the underside of the optical component layer FX rolled out from the take-up reel RX (the side on the side of the separation layer F3a as shown in Fig. 7). For example, the layer stage 114 is disposed between the downstream side of the layer where the dust collection position at which the dust of the layer F1X is removed, and the peeling position where the layer piece F1X is peeled off from the separation layer F3a.

The nip roller portion 113 includes a first nip roller 113a and a second nip roller 113b which are disposed in parallel with each other in the rotation axis direction. The first nip roller 113a and the second nip roller 113b are rotated in synchronization with each other, and the separation layer F3a can be transported from the layer transport upstream side toward the layer transport downstream side (the direction taken up to the winding unit 112) and separated. The layer F3a is conveyed from the layer conveyance downstream side toward the layer conveyance upstream side (the direction in which the winding portion 112 is wound up).

The winding unit 112 peels off the layer sheet F1X from the separation layer F3a by the bonding head 120, and then winds up into a separate separation layer F3a. The winding unit 112 rotates synchronously by the first nip roller 113a and the second nip roller 113b to perform winding and unwinding of the separation layer F3a.

The dust collecting device 10 is disposed at a cutting position at which the optical module layer FX is half-cut by the cutting portion 115, and the layer F1X obtained by the half-cutting is peeled off from the separation layer F3a and held between the peeling positions of the bonding head 120. . The dust collecting device 10 removes the dust of the layer sheet F1X. The details of the dust collecting device 10 will be described later.

For example, the head unit 150 includes a fitting head 120, a head driving device 130, and a head lifting device 140.

For example, the bonding head 120 includes a head body portion 121 and an adhesive layer 122.

The upper surface of the head main body portion 121 is a flat surface, and the lower surface is a curved surface that is convex toward the lower side and curved in the direction in which the optical component layer FX is oriented. The adhesive layer 122 is fixedly attached to the lower surface of the head main body portion 121. For example, in the case of the adhesive layer 122, an adhesive rubber or the like is used. The surface of the adhesive layer 122 is a curved holding surface 122a to which the layer F1X is attached and held. For example, the holding surface 122a has a weak adhesion force to the bonding surface (adhesive layer F2a) of the layer F1X, and the surface protective film F4a of the layer F1X can be attached and peeled off.

The bonding head 120 peels and holds the layer F1X from the separation layer F3a by bending the curved holding surface 122a while pressing the curved holding surface 122a on the layer sheet F1X supported on the layer stage 114. The surface 122a is held. The bonding head 120 presses the layer F1X along the bending of the holding surface 122a while pressing the layer F1X held on the holding surface 122a against the optical display member P placed on the bonding stage 171. In the optical display part P.

For example, the head driving device 130 includes a bottom plate 135, a rotation driving portion 136, and a rod portion 137.

The bonding head 120 is connected to the rotation support shaft 136a of the rotation driving unit 136 through a rod portion 137 connected to the center portion of the upper surface of the head main body portion 121. The rotation support shaft 136a is fixed to the bottom plate 135. The bonding head 120 is rotatably suspended from the lower surface of the bottom plate 135 via the rod portion 137 and the rotation support shaft 136a. For example, the retaining surface 122a is an arcuate curved surface centered on the rotating support shaft 136a.

The bonding head 120 is rotated by the rotation driving portion 136 at a specific angular range to the rotation of the rotation support shaft 136a. Thereby, the layer sheet F1X is attached from the separation layer F3a to the holding surface 122a, and the layer sheet F1X is bonded (transferred) from the holding surface 122a to the optical display member P.

The head lifting device 140 includes a cylinder body portion 141 and a cylinder rod 142. The first end of the cylinder rod 142 is fixed to the upper surface of the bottom plate 135, and the second end of the cylinder rod 142 is coupled to the cylinder body portion 141. The cylinder body portion 141 is introduced by the air pressure introduced into the cylinder body portion 141. The inner piston and the cylinder rod 142 move in the up and down direction. Thereby, the bonding head 120 is moved in the vertical direction.

The head moving device 160 includes a guide rail 161 and a slider 162. The upper end portion of the cylinder body portion 141 is fixed to the slider 162. Thereby, the head unit 150 is vertically suspended from the slider 162. The guide rail 161 is spanned between the layer transport device 110 and the bonding platform 171. The slider 162 reciprocates along the guide rail 161. Thereby, the bonding head 120 is moved between the peeling position which peeled the layer piece F1X from the separation layer F3a, and the bonding position which bonded the layer piece F1X to the optical display member P.

The head driving device 130, the head lifting device 140, and the head moving device 160 constitute a head driving mechanism that rotationally drives, moves up, and moves the bonding head 120. The bonding head 120 is rotated and horizontally moved by the head driving device 130 and the head moving device 160, and is rotated on the layer F1X supported on the layer platform 114 and placed on the optical display member P of the bonding platform 171. Thereby, the layer sheet F1X is attached from the separation layer F3a to the holding surface 122a, and the layer sheet F1X is bonded (transferred) from the holding surface 122a to the optical display member P.

The fitting head 120 is rotated by the head driving device 130 in the first rotation direction (for example, clockwise direction) by the head moving device 160 in the first moving direction (for example, the right direction) The horizontal movement is rotatable in a first direction from a first end (for example, a left end) of the retaining surface 122a to a second end (for example, a right end). Moreover, the fitting head 120 is rotated by the head driving device 130 in the second rotation direction (for example, the counterclockwise rotation direction) by the head moving device 160 in the second moving direction (for example, The horizontal movement in the left direction is rotatable in a second direction from the second end (for example, the right end) of the holding surface 122a to the first end (for example, the left end).

The platform unit 170 includes a bonding platform 171, a platform driving device 172, and a cover plate 173.

The bonding stage 171 has a mounting surface 171a on which the optical display member P is placed. Lift For example, the bonding platform 171 holds the optical display member P on the mounting surface 171a by adsorbing the lower surface of the optical display member P (the surface opposite to the surface on which the layer F1X is bonded).

The cover plate 173 is a plate-like or rod-shaped assembly disposed along one side of the optical display member P. The cover plate 173 is fixed to the mounting surface 171a. The height of the cover plate 173 is approximately the same as the height of the optical display member P. The cover plate 173 is disposed on the upstream side in the rotational direction AFD of the position where the optical display member P is placed.

The optical display member P is disposed adjacent to the cover plate 173. The optical display member P is fixed to the mounting surface 171a with the end portion in contact with the side surface of the cover plate 173. Thereby, the upper surface of the optical display member P and the upper surface of the cover plate 173 form a continuous plane.

The cover plate 173 can be fixed to at least two positions (the first position and the second position) disposed on the bonding platform 171. The first position is a position on the bonding platform 171 corresponding to the rotation direction AFD as the first direction (for example, a position near the left side of the optical display member P), and the second position is the corresponding rotation direction AFD as the first position. The position on the bonding platform 171 in the case of the two directions (for example, the position near the right side of the optical display member P).

After the bonding head 120 presses the holding surface 122a located on the upstream side of the bonding direction of the layer F1X to the upper surface of the cover plate 173, the bonding head 120 is continuously rotated on the upper surface of the cover plate 173 and the optical display part P. In the upper surface, the layer F1X held on the holding surface 122a is bonded to one surface of the optical display member P. Before the contact layer F1X and the optical display member P are moved, the bonding head 120 is started to move outside the optical display member P, and the bonding conditions such as load or speed can be uniformized in the entire layer F1X.

The stage driving device 172 moves the bonding platform 171 in a direction perpendicular to the rotational direction AFD of the bonding head 120 and the rotational direction AFD of the bonding head 120. Also, the platform drive 172 rotates the bonding platform 171 in a horizontal plane. The platform driving device 172 adjusts the optical display member P held by the bonding platform 171 and the layer held by the bonding head 120 by driving the bonding platform 171. The relative fit position of F1X. Thereby, the alignment of the optical display member P and the layer F1X is performed.

The control device 190 is constructed by including a computer system. The computer system includes a calculation unit of a CPU or the like, a memory unit such as a memory or a hard disk. The control device 190 includes an interface that can communicate with an external device of the computer system to collectively control the operations of the various devices constituting the bonding device 100 and various external devices of the bonding device 100.

Hereinafter, the dust collecting device 10 of the present embodiment will be described with reference to Figs. 2 to 4 .

2 is a perspective view of the periphery of the dust collecting device 10. 3 is a plan view of the periphery of the dust collecting device 10. FIG. 4 is a side view of the dust collecting device 10.

As shown in FIGS. 2 and 3, the dust collecting device 10 includes a first roller pair 11 and a second roller pair 12.

The first pair of rollers 11 is a pair of rollers formed by a pair of first rollers (the first upper roller 11a and the first lower roller 11b) arranged in parallel with each other in the rotation axis direction.

In the following, among the pair of first rollers (the first upper roller 11a and the first lower roller 11b), the first roller that sandwiches the layer sheet F1X and is disposed on the upper side is referred to as a first upper roller 11a. Among the pair of first rollers (the first upper roller 11a and the first lower roller 11b), the first roller that sandwiches the layer F1X and is disposed on the lower side is referred to as a first lower roller 11b. Further, the first upper side drum 11a and the first lower side drum 11b are separate first rolls.

The first upper drum 11a and the first lower drum 11b are rotated in synchronization with each other, and the half-cut optical component layer FX is conveyed from the layer transport upstream side toward the layer transport downstream side.

The first upper side drum 11a and the first lower side drum 11b are respectively cylindrical shape members having a length larger than the layer width of the optical component layer FX. The surfaces of the first upper roller 11a and the first lower roller 11b respectively have a first adhesion force As1 of the dust capable of removing the layer F1X. The first adhesive force As1 is smaller than the adhesion of the layer F1X and the separation layer F3a. Thereby, before the bonding of the optical display member P, the separation of the layer F1X from the separation layer F3a is suppressed, and the dust of the surface of the layer F1X can be removed. Ai.

Further, from the viewpoint of suppressing the peeling between the plurality of layers constituting the layer sheet F1X, the first adhesive force As1 is smaller than the adhesive force of the optical module main body F1a and the surface protective film F4a constituting the layer sheet F1X. From the same viewpoint, the first adhesive force As1 is smaller than the surface of one side of the polarizer F6 and the adhesion of the first film F7, the other side of the polarizer F6, and the adhesion of the second film F8.

The first roller pair 11 holds a part of the conveyance direction of the layer F1X conveyed by the head unit 150 from the upper and lower sides. In the present embodiment, the cutting unit 115 is formed in the four cutting lines of the optical module layer FX, and the first roller pair 11 is the third cutting line and the fourth cutting line which are calculated by the layer transport upstream side. One of the partitioned layers F1X is clamped from above and below.

In addition, the arrangement position of the first roller pair 11 is not limited to this. The arrangement position of the first roller pair 11 can be set at an appropriate specific position as long as it is between the cutting unit 115 and the head unit 150.

The surface of the first roller pair 11 is brought into contact with the surface of the layer F1X to remove dust present on the surface of the layer F1X. Specifically, the surface of the first upper side roller 11a is brought into contact with the surface of the surface protective film F4a constituting the layer sheet F1X to remove dust on the surface of the surface protective film F4a. The surface of the first lower side drum 11b is brought into contact with the surface (bottom surface) of the separation layer F3a to remove dust on the surface of the separation layer F3a.

The second roller pair 12 is a pair of rollers constituted by a pair of second rollers (the second upper roller 12a and the second lower roller 12b) which are disposed in parallel with each other in the rotation axis direction.

Hereinafter, among the pair of second rollers (the second upper roller 12a and the second lower roller 12b), the second roller that faces the first upper roller 11a is referred to as a second upper roller 12a. Among the pair of second rollers (the second upper roller 12a and the second lower roller 12b), the second roller opposed to the first lower roller 11b is referred to as a second lower roller 12b. Further, the second upper drum 12a and the second lower drum 12b are separate second rollers.

The second upper side drum 12a is rotatable in synchronization with the first upper side drum 11a, and the second lower side drum 12b is rotatable in synchronization with the first lower side drum 11b. In FIG. 4, the second upper drum 12a is rotated, and its rotation direction (clockwise rotation direction) is opposite to the rotation direction of the first upper drum 11a (counterclockwise rotation direction), and the second lower drum 12b is rotated. The direction of rotation (the direction of counterclockwise rotation) is opposite to the direction of rotation of the first lower side drum 11b (the direction of clockwise rotation).

The second upper roller 12a and the second lower roller 12b are each a cylindrical member having a length that is approximately the same as the length of the first roller in the layer width direction. The second upper roller 12a and the second lower roller 12b sandwich the first roller pair 11 (the first upper roller 11a and the first lower roller 11b) from above and below. The surfaces of the second upper roller 12a and the second lower roller 12b respectively have a second adhesive force Fs2 (Fs2>Fs1) larger than the first adhesive force Fs1. Thereby, the dust adhering to the first roller can be removed by the second roller. Thereby, the first adhesive force Fs1 can be effectively maintained.

As shown in FIG. 4, the first adhesive layer 13 is detachably wound around the first pair of rollers 11. Specifically, the first upper side adhesive layer 13a is detachably wound around the first upper side drum 11a. The first lower adhesive layer 13b is detachably wound around the first lower roller 11b.

Therefore, even if the first adhesive force Fs1 is lowered due to the adhesion of dust, it is not necessary to exchange all of the first roller pairs 11, as long as the first adhesive layer 13 is exchanged, and as long as necessary, as long as necessary Any one of the upper adhesive layer 13a or the first lower adhesive layer 13b can be exchanged. Thereby, maintenance for maintaining the first adhesive force Fs1 can be performed efficiently.

The second adhesive layer 14 is detachably wound around the second roller pair 12. Specifically, the second upper side adhesive layer 14a is detachably wound around the second upper side roller 12a. The second lower side adhesive layer 14b is detachably wound around the second lower side roller 12b.

Therefore, even if the second adhesive force Fs2 is lowered due to the adhesion of dust, it is not necessary to exchange all of the second roller pairs 12, and the second adhesive layer 14 can be exchanged. And, if necessary, exchange any one of the second upper adhesive layer 14a or the second lower adhesive layer 14b Can be solved. Thereby, maintenance for maintaining the second adhesive force Fs2 can be performed efficiently. Further, since the first adhesive force Fs1 is maintained while maintaining the second adhesive force Fs2, the surface for maintaining the first adhesive force Fs1 is also effective.

For example, in the first adhesive layer 13, an adhesive lanthanide, urethane-based adhesive layer or the like is used. For example, in the second adhesive layer 14, a urethane-based adhesive layer having a larger adhesive force than the first adhesive layer 13 (first adhesive force Fs1) is used. For example, in the case where the adhesive layer of the lanthanoid system is used as the first adhesive layer 13, a urethane-based adhesive layer is used as the second adhesive layer 14.

The exchange of the first adhesive layer 13 is for maintaining the degree of the first adhesive force Fs1. For example, it is preferable to determine whether the adhesion of the first adhesive layer 13 has the first adhesive force Fs1 by visually confirming the presence or absence of cracks or the like on the surface of the first adhesive layer 13 by visual observation or the like. When the adhesion of the first adhesive layer 13 is lower than the first adhesive force Fs1, it is exchanged. Similarly, the exchange with respect to the second adhesive layer 14 is also for maintaining the second adhesive force Fs2.

Further, the exchange of the first adhesive layer 13 is preferably performed periodically in consideration of the use period of the dust collecting device 10. The same is true regarding the exchange of the second adhesive layer 14.

Hereinafter, the bonding method of this embodiment will be described using FIG.

The bonding method of the present embodiment is a bonding method of bonding the layer P1X to the optical display member, and includes a winding step, a cutting step, a bonding step, and a dust collecting step.

As shown in FIG. 1, the unwinding step is performed by winding the long optical component layer FX from the roll drum RX together with the separation layer separation layer F3a.

The cutting step cuts the optical component layer FX residual separation layer F3a to form a layer F1X.

In the bonding step, the layer F1X is peeled off from the separation layer F3a and bonded to the optical display member.

The dust collecting step is performed between the cutting step and the bonding step, and it is preferable to remove the dust of the layer sheet F1X while the layer sheet F1X is attached to the holding surface 122a of the bonding head 120.

Hereinafter, the dust collecting step will be described using FIGS. 2 to 4.

As shown in FIGS. 2 to 4, the dust collecting step uses the first roller pair 11 composed of a pair of first rollers (the first upper liquid cylinder 11a and the first lower roller 11b), and is conveyed to the bonding step. A part of the conveying direction of the layer F1X is sandwiched from above and below, and the surface of the first roller pair 11 is brought into contact with the surface of the layer F1X to remove the dust of the layer F1X. The surfaces of the first rollers (the first upper roller 11a and the first lower roller 11b) respectively have a first adhesion force As1 of the dust capable of removing the layer F1X.

Further, the dust collecting step uses the second roller pair 12 constituted by the pair of second rollers (the second upper roller 12a and the second lower roller 12b) to sandwich the first roller pair 11 from the upper and lower sides, and The surfaces of the two roller pairs 12 are each in contact with the first roller pair 11 to remove the dust of the first roller. The surfaces of the second roller (the second upper roller 12a and the second lower roller 12b) respectively have a second adhesive force As2 (As2>As1) larger than the first adhesive force As1.

Hereinafter, the bonding step will be described using FIGS. 5A to 5C and FIGS. 6A to 6C. First, the process of attaching the layer F1X to the bonding head 120 will be described using FIGS. 5A to 5C.

As shown in FIG. 5A, the bonding head 120 is disposed above the layer platform 114 in a state where the bonding head 120 is inclined with respect to the layer platform 114. After the conveyance of the layer F1X is stopped, the layer F1X is rested on the layer platform 114. The layer platform 114 supports the layer F1X from the side of the separation layer F3a. Then, the bonding head 120 and the layer F1X on the layer platform 114 are aligned. The fitting head 120 assumes an inclined state such that the upstream side in the rotational direction is located below the downstream side in the rotational direction. In the case of the present embodiment, the inclined state is such that the end portion on the layer transport downstream side is located below the end portion on the layer transport upstream side.

Once the position of the bonding head 120 and the layer F1X is aligned, the head 120 is lowered by the head lifting device 140 to the height in contact with the layer F1X. Thereby, the end portion of the layer head downstream side of the bonding head 120 is pressed against the end portion on the layer transport downstream side of the layer sheet F1X.

Next, as shown in FIG. 5B, by rotating the rotation driving unit 136 and the head moving device 160 synchronously, the bonding head 120 is rotated from the layer transport downstream side toward the layer transport upstream side (rotation and level). mobile). Thereby, the layer sheet F1X is gradually attached to the holding surface 122a from the layer conveyance downstream side to the layer conveyance upstream side.

In the first period in which the bonding head 120 presses the holding surface 122a against the layer F1X and starts to rotate, the winding unit 112 and the nip roller unit 113 synchronously rotate the driving unit 136 and the head moving device 160 to separate The layer F3a is rotated in the winding direction (counterclockwise direction). Thereby, on the upstream side of the nip roller portion 113, the separation layer F3a is loosened, and the portion F1X and the separation layer F3a on the downstream side of the portion which is provided with the load by the bonding head 120 are curved along the holding surface 122a toward the layer platform. The top of 114 floats up.

Since the separation layer F3a is in a relaxed state, it is difficult to generate a force for peeling the layer sheet F1X from the holding surface 122a at the end portion of the layer F1X on the downstream side of the layer conveyance. Thereby, the adhesion force of the layer piece F1X and the holding surface 122a is high, and the layer piece F1X is adhered to the holding surface 122a reliably. Further, when the layer F1X is peeled off from the separation layer F3a by the separation layer F3a, the peeling force which is applied to the separation layer F3a instantaneously increases is suppressed. Thereby, the separation layer F3a is prevented from being broken and broken.

As shown in FIG. 5C, in the second period from the first period to the stop of the rotation of the bonding head 120, the winding portion 112 and the nip roller portion 113 rotate the separation layer F3a in the winding direction (clockwise direction). Thereby, the relaxation of the separation layer F3a is released, and the separation of the layer sheet F1X from the separation layer F3a is promoted. For example, when the rotation direction of the winding portion 112 and the nip roller portion 113 is switched from the counterclockwise direction to the clockwise direction, it is preferable that the layer sheet F1X is 5%-70% attached to the holding surface 122a. The time to complete 10% -50%.

When the winding unit 112 and the pinch roller unit 113 perform the winding and winding of the separation layer F3a, the bonding head 120 continuously rotates in the same direction by the rotation driving unit 136 and the head moving device 160. The bonding head 120 rotates along the bending of the holding surface 122a while pressing the holding surface 122a on the layer F1X, and peels the layer sheet F1X from the separation layer F3a, and holds it on the holding surface 122a.

By the above, the surface protective film F4a of the layer F1X is sequentially attached to the bonding head. The holding surface 122a of 120. The layer sheet F1X attached to the holding surface 122a is peeled off from the separation layer F3a, and the adhesive layer F2a (see FIG. 7 and the bonding surface with the optical display member P) is exposed. The bonding head 120 holding the layer F1X is moved by the head moving device 160 to the bonding stage 171 on which the optical display member P is placed.

In FIGS. 5A to 5C, although the process of holding the layer F1X of the good product having no defects in the layer on the bonding head 120 is shown, the layer F1X of the defective product having defects in the layer is held by the bonding head 120. , the same processing is also performed. For example, the bonding head 120 of the layer F1X holding the defective product is moved to the stud position (discarded position) by the head driving device 160, and the studing position is disposed at a position different from the bonding platform 171 (not shown) ). Then, the layer F1X of the defective product is repeatedly bonded to the waste material layer or the like provided at the dressing position.

For example, the disadvantage of the layer F1X as described above means that a portion of the foreign matter composed of at least one of a solid, a liquid, and a gas exists inside the layer F1X, and the surface of the layer F1X has irregularities or flaws. In part, a portion of the bright spot is generated due to the skew of the layer F1X or the deviation of the material.

Next, a process of bonding (transferring) the layer sheet F1X attached to the bonding head 120 to the optical display member P will be described with reference to FIGS. 6A to 6C.

As shown in FIG. 6A, the bonding head 120 of the holding layer F1X is raised by the head lifting device 140 to a height that does not affect the layer conveying device 110 with the adhesive layer F2a (see FIG. 7) facing downward. until. Then, the bonding head 120 is moved by the head moving device 160 to the upper position of the bonding stage 171 on which the optical display member P is placed.

For example, when the bonding head 120 is moved from the upper position of the layer platform 114 to the upper position of the bonding platform 171, the four corners of the layer F1X held by the holding surface 122a are photographed by the first imaging device 181. . The image of the layer F1X captured by the first imaging device 181 is image-resolved by a first image processing device (not shown) to detect the four corner positions of the layer F1X. The information on the position of the corner portion of the layer F1X detected by the first image processing device is sent to the control device 190. The control device 190 confirms the arrangement position of the layer F1X with respect to the bonding head 120 based on the information detected by the first image processing device.

For example, the optical display component P held on the bonding platform 171 is photographed by the second photographing device 182. For example, the second photographing device 182 captures a calibration mark, a black matrix, or the like as a calibration reference set on the optical display part P. The image of the optical display unit P captured by the second imaging device 182 is image-resolved by a second image processing device (not shown) to detect the position of the calibration reference. The information on the calibration reference position of the optical display unit P detected by the second image processing device is sent to the control device 190. The control device 190 confirms the arrangement position of the optical display member P with respect to the bonding platform 171 based on the information detected by the second image processing device.

The control device 190 controls the platform driving device 172 based on the arrangement position of the layer F1X with respect to the bonding head 120 and the arrangement position of the optical display member P with respect to the bonding platform 171. The control device 190 uses the platform driving device 172 to horizontally move the bonding platform 171 in a horizontal plane, and rotationally drives the bonding platform 171 in a horizontal plane.

Thereby, the optical display member P held by the bonding stage 171 and the relative bonding position of the layer F1X held by the bonding head 120 are adjusted.

As shown in FIG. 6B, once the relative bonding position of the optical display member P and the layer F1X is adjusted, the bonding head 120 is lowered to contact the height of the optical display member P by the head lifting device 140. The fitting head 120 is inclined such that the end portion on the upstream side in the rotational direction is located further below the end on the downstream side in the rotational direction. By the lowering of the bonding head 120, the end portion of the bonding head 120 located on the upstream side of the layer F1X is pressed to the upper surface of the cover plate 173 located on the upstream side in the rotational direction of the optical display member P.

Next, as shown in FIG. 6C, the bonding head 120 is rotated from the upper surface of the cover plate 173 toward the upper surface of the optical display member P by synchronously driving the rotation driving portion 136 and the head moving device 160. Accompany With the rotation of the bonding head 120, the layer F1X held on the holding surface 122a is slowly attached to the upper surface of the optical display member P.

For example, the bonding head 120 has a weak adhesion force to the bonding surface of the layer F1X (refer to FIG. 7: the adhesive layer F2a), and can repeatedly adhere and peel the surface protective film F4a of the layer F1X. Therefore, the adhesive layer F2a side is pressed against the layer sheet F1X of the optical display member P, is peeled off from the holding surface 122a, and is bonded to the upper surface of the optical display member P. By the above, the process of bonding the layer sheet F1X to the optical display part P is completed.

In FIGS. 6A to 6C, although the process of transferring the layer F1X of the good product having no defects in the layer from the bonding head 120 to the optical display member P is shown, the layer F1X of the defective product having defects in the layer is bonded to The same processing is also performed in the case where the waste material layer or the like is set at the pasting position.

As described above, in the bonding apparatus 100 of the present embodiment, since the dust F of the layer sheet F1X can be removed by the dust collecting device 10, the layer sheet F1X and the optical display member P can be bonded to the head unit 150, so that the dust can be removed. The bonding is carried out in the state of mixing or generation of bubbles. Thereby, the quality of the product can be improved.

Further, since the contact type is the first roller pair 11, the dust on the surface of the layer F1X can be effectively removed as compared with the non-contact type.

Further, by pressing the curved holding surface 122a of the bonding head 120 on the layer F1X resting on the layer stage 114, the bonding head 120 is rotated along the bending of the holding surface 122a, and the layer F1X is separated from the separation layer. F3a is peeled off and held on the holding surface 122a. Therefore, it is suppressed that the wrinkles which are caused by the meandering of the optical component layer FX and the wrinkles are held by the bonding sheet 120 of the bonding head 120. Thereby, when the layer sheet F1X is bonded to the optical display member P, generation of bubbles is suppressed between the layer sheet F1X and the optical display member P.

Further, in the present embodiment, the first roller (the first upper roller is exemplified) The surfaces of the cylinder 11a and the first lower drum 11b) respectively have the first adhesion force As1 of the dust capable of removing the layer F1X, but are not limited thereto.

For example, among the pair of first rollers (the first upper roller 11a and the first lower roller 11b), only the surface of the first upper roller 11a may have the first adhesive force As1, or only the first lower side. The surface of the drum 11b has the first adhesive force As1. In other words, it is sufficient that at least one of the pair of first rollers (the first upper roller 11a and the first lower roller 11b) has the first adhesive force As1. However, from the viewpoint of removing the surface of the surface protective film F4a and the surface (underside) of the separation layer F3a, respectively, the surfaces of the first roller (the first upper roller 11a and the first lower roller 11b) are preferably respectively The first adhesive force As1 is provided.

Further, in the present embodiment, the second roller (the second upper roller 12a and the second lower roller 12b) has a second adhesive force Fs2 larger than the first adhesive force Fs1, but is not limited thereto.

In a case where only one of the pair of first rollers (the first upper roller 11a and the first lower roller 11b) has the first adhesive force Fs1, the pair of second rollers (the second upper roller 12a, the second roller) Among the lower rollers 12b), the second adhesive force Fs2 may be provided on the surface of the second roller opposed to the first roller having the first adhesive force Fs1.

Further, in the present embodiment, the configuration in which the dust collecting device 10 includes the first roller pair 11 and the second roller pair 13 is not limited thereto. For example, the dust collecting device may not include the second roller pair 12 and only include the first roller pair 11. According to this configuration, it is possible to suppress the dust on the surface of the layer sheet F1X while purifying the configuration of the device. Further, the first adhesive layer 13 wound around the first roller pair 11 is easily separated.

Fig. 8 is a schematic view showing a production system 1000 of an optical display device according to a first embodiment of the present invention. The optical display device is constructed by attaching an optical component to the optical display member P. For the bonding device in which the optical display member P is bonded to the layer of the optical component, the production is performed. System 1000 is provided with the above-described bonding apparatus 100.

The production system 1000 of the present embodiment includes a cleaning device 1001, a first bonding device 1002, a second bonding device 1003, a peeling device 1004, a third bonding device 1005, and an inspection device 1006. The first bonding apparatus 1002, the second bonding apparatus 1003, and the third bonding apparatus 1005 have the above-described configuration of the bonding apparatus 100. The cleaning device 1001, the first bonding device 1002, the second bonding device 1003, the peeling device 1004, the third bonding device 1005, and the inspection device 1006 are arranged in a series of transport lines that transport the optical display member P.

The cleaning device 1001 cleans the optical display member P carried in from the loading device (not shown), and removes foreign matter or the like adhering to the optical display member P. For example, the cleaning device 1001 can be water-washed, with a first side of the optical display member P (for example, a side that is visually displayed on the side of the image of the display area) and a second side (for example, with visual inspection) The surface on the side opposite to the image displayed on the display area is brushed and washed with water, and thereafter, the first surface and the second surface of the optical display member P are drained. The cleaning device 1001 can also be a dry type, and performs electrostatic removal and dust collection on the front and back surfaces of the optical display member P. For example, the optical display part P is a liquid crystal panel.

The first bonding apparatus 1002 adheres to the first layer on the first surface of the optical display member P. Similarly to the above-described bonding apparatus 100, the first bonding apparatus 1002 includes a dust collecting device that removes dust of the first layer sheet after the first layer sheet is formed and before bonding to the optical display member P. Therefore, since the first layer sheet and the optical display member P can be bonded after the dust of the first layer sheet is removed by the dust collecting device, the bonding can be performed in a state in which dust is mixed or bubbles are generated. Thereby, the quality of the product can be improved.

Further, the first bonding apparatus 1002 rotates the bonding head along the bending of the holding surface by pressing the curved holding surface of the bonding head to the stationary first layer sheet, and the first layer is separated from the separation layer. Peel and hold on the holding surface. Therefore, when the first layer sheet is bonded to the optical display member P, generation of bubbles is suppressed between the first layer sheet and the optical display member P.

For example, the first layer is a sheet-shaped polarizing plate that is cut corresponding to the size of the outer shape of the optical display member P. The above-mentioned "corresponding to the size of the outer dimensions of the optical display member P" means that the size of the remaining portion which is problematic in actual use does not occur when bonded to the optical display member P. The first layer has the same configuration as the layer F1X shown in FIG.

For example, a display area for displaying an image is provided at a central portion of the optical display member P, and a circuit component mounting portion is provided at an end of the optical display member P. The circuit component mounting portion is provided with a connection semiconductor wafer or a flexible printed wiring. Wait for the multiple terminals. For example, in this case, in the case of the first layer, a region having a larger display area than the optical display member P and smaller than the outer shape (contour shape in the plan view) of the optical display member P is used, and is avoided. A layer of a size of a region of a functional portion such as a circuit component mounting portion in the optical display member P is opened. The "layer larger than the optical component" of the present invention means an optical display layer having an arbitrary size from the display region of the optical display member P to the end of the optical display member P.

The second bonding device 1003 is attached to the second layer on the second surface of the optical display member P. Similarly to the above-described bonding apparatus 100, the second bonding apparatus 1003 includes a dust collecting device that removes dust of the second layer before bonding the second layer sheet to the optical display member P. Therefore, since the second layer sheet and the optical display member P can be bonded after the dust of the second layer sheet is removed by the dust collecting device, the bonding can be performed in a state in which dust is mixed or bubbles are generated. Thereby, the quality of the product can be improved.

Further, the second bonding apparatus 1003 rotates the bonding head along the bending of the holding surface by pressing the curved holding surface of the bonding head against the stationary second layer sheet, and the second layer is separated from the separation layer. Peel and hold on the holding surface. Therefore, when the second layer sheet is bonded to the optical display member P, generation of bubbles is suppressed between the second layer sheet and the optical display member P.

For example, the second layer is a sheet-shaped polarizing plate that is cut to correspond to the size of the outer shape of the optical display member P. The second layer has the same structure as the layer F1X as shown in FIG. to make. The transmission axis of the second layer bonded to the second surface of the optical display member P and the transmission axis of the first layer bonded to the first surface of the optical display member P are perpendicular to each other.

For example, a reverse-opposing device (not shown) that reverses the optical display member P is provided on the transport line of the optical display member P between the first bonding device 1002 and the second bonding device 1003. The optical display member P to which the first layer is bonded to the first surface is supplied to the second bonding apparatus 1002 in a state of being reversed and reversed.

The peeling device 1004 peels off the surface protective film from the second layer bonded to the second surface of the optical display member P.

The third bonding apparatus 1005 bonds the third layer sheet to the surface of the second layer sheet from which the surface protective film is peeled off by the peeling device 1004. Similarly to the above-described bonding apparatus 100, the third bonding apparatus 1005 includes a dust collecting device that removes dust of the third layer before bonding the third layer sheet to the optical display member P. Therefore, since the third layer sheet and the optical display member P can be bonded after the dust of the third layer sheet is removed by the dust collecting device, the bonding can be performed in a state in which dust is mixed or bubbles are generated. Thereby, the quality of the product can be improved.

Further, the third bonding apparatus 1005 rotates the bonding head along the curved surface of the holding surface by pressing the curved holding surface of the bonding head against the stationary third layer sheet, and the third layer is separated from the separation layer. Peel and hold on the holding surface. Therefore, when the third layer sheet is bonded to the optical display member P, generation of bubbles is suppressed between the third layer sheet and the optical display member P.

For example, the third layer is a sheet-like luminance increasing film that is cut corresponding to the size of the outer shape of the optical display member P. The luminance increasing film is a reflective polarizing plate that reflects linear polarization, and the linear polarizing system is perpendicular to the transmission axis. The third layer has the same configuration as the layer F1X shown in FIG. The transmission axis of the second layer bonded to the second surface of the optical display member P and the transmission axis of the third layer bonded to the second layer are parallel to each other.

The inspection device 1006 performs the first layer and the second layer on the optical display part P Check whether the position of the piece and the third layer are correct (whether the positional deviation is within the allowable range). The optical display member whose position is determined to be incorrect with respect to the position of the first layer sheet, the second layer sheet or the third layer sheet of the optical display member P is discharged outside the system by means of a discharge means not shown.

An optical display member in which a first layer sheet, a second layer sheet, and a third layer sheet are bonded, and if necessary, is attached as an optical display after being subjected to a defect inspection (such as a foreign matter inspection) or a mounting of a circuit component. The device DP is shipped.

In the production system 1000 described above, the first bonding apparatus 1002, the second bonding apparatus 1003, and the third bonding apparatus 1005 use a bonding apparatus having the same configuration as the above-described bonding apparatus 100. Therefore, it is possible to provide an optical display device DP that performs bonding in a state in which dust is mixed or bubbles are generated, thereby improving the quality of the product.

[First Modification of First Embodiment]

Hereinafter, the dust collecting device 20 according to the first modification of the first embodiment will be described with reference to Figs. 9 and 10 .

Fig. 9 is a side sectional view showing a dust collecting device according to a first modification of the first embodiment. Fig. 10 is an enlarged view of a main part of Fig. 9.

In the present modification, the point different from the first embodiment is that the dust collecting device is a non-contact type point; the cutting portion is a point of the laser cutting device. In the following description, the non-contact dust collecting device 20 will be mainly described. The components that are the same as those in the first embodiment are denoted by the same reference numerals, and the detailed description thereof will be omitted.

As shown in FIGS. 9 and 10, the laser cutting device 215 irradiates the laser beam L from the upper side in the vertical direction of the optical module layer FX, and cuts the optical component layer FX.

The dust collecting device 20 includes a suction device 30. The suction device 30 includes a dust box 31 disposed on the layer transport downstream side of the cutting line SX (corresponding to the above-described cutting line CL) of the optical module layer FX. A duct connecting pipe CN is provided on the downstream side of the layer transport of the dust box 31.

The dust box 31 has a hollow rectangular parallelepiped shape, and is disposed on the side of the cut line SX (hereinafter referred to as the front side of the dust box 31) in a plan view along the cutting line SX. The lower portion of the front wall 33 of the dust box 31 is inclined obliquely forward and downward, and an extension portion 35 having a triangular cross section is formed at the front edge portion of the lower wall 34. A suction nozzle 36 having a flow path 36a having a rear high inclination is formed in the front lower edge portion of the dust box 31 by the lower portion of the front wall 33 and the extending portion 35 of the lower wall 34.

The suction nozzle 36 has a suction port 37 opened throughout the width of the dust box 31 in the longitudinal direction of the cutting line SX (the scanning direction of the laser light L). The suction port 37 is disposed from the layer conveyance downstream side to the cutting line SX. The front wall 33 is fixed to the upper wall 38 by adjusting the vertical position, whereby the vertical width of the suction opening 37 can be adjusted by the vertical movement of the front wall 33. The inclination angle θ1 viewed in the cross section of the flow path 36a (the inclination angle of the inclined surface of the extending portion 35 as the lower surface of the flow path 36a in Fig. 10) is about 45° with respect to the upper surface of the optical module layer FX. The opening angle θ2 on the downstream side (the opening angle of the upper and lower surfaces of the flow path 36a) viewed from the cross section of the flow path 36a is set to be about 15°.

The dust box 31 is disposed on the downstream side of the cutting line SX in plan view, and is spaced apart by a distance d that does not affect the laser light L. In the present modification, the suction device 30 is not moved at the time of laser cutting, and the suction device 30 is miniaturized because the distance d is small as compared with the case where the suction device 30 is moved during the laser cutting.

A flow path 41 for the assist gas is formed in the lower wall 34 of the dust box 31. For example, the flow path 41 is a flow path through which the assist gas introduced through the introduction port 42 opened at the lower end portion of the rear wall 39 or the like is guided to the lower guide port 43 opened in the extending portion 35. A thin plate-shaped guide plate 44 is fixed to the lower surface of the front portion of the lower wall 34, and a blowing nozzle 51 that opens to the front of the lower wall 34 is formed between the guide plate 44 and the lower wall 34. The blowing nozzle 51 forms an air outlet 52 directly below the suction port 37 of the dust box 31, and extends over the entire width of the dust box 31 like the suction port 37.

For example, the suction device 30 is in the cut position according to the laser cutting device 215 Before the suction operation, the dust box 31 is raised and retracted from the cutting position; when the suction operation is performed at the cutting position, the dust box 31 is lowered. When the dust box 31 is lowered, the dust box 31 is in contact with the uppermost surface of the optical component layer FX on the lower surface of the cutting guide plate 44, and is disposed on the layer transport downstream side of the cutting line SX and close to the suction port 37 and the air outlet 52. . Thereby, at the time of laser cutting of the optical component layer FX, the smoke-like decomposition product (smoke) generated by the melting or decomposition reaction can be collected in the dust box 31.

In the dust box 31, the wind pressure at the tip end of the suction nozzle 36 is set to a static pressure of 0.1 kPa or more, and the wind speed is set to 7 m/s or more. On the other hand, the wind pressure and the wind speed of the tip end of the blowing nozzle 51 are set to be smaller than the suction nozzle 36. As a result, the auxiliary gas blown out from the blowing nozzle 51 is folded back toward the suction port 37 directly above the air outlet 52, and is attracted to the suction nozzle 36. By this air flow, the distance of the distance d between the suction port 37 and the cutting line SX effectively suppresses the adhesion of the smoke on the optical component layer FX. Since the assist gas blown out by the blowing nozzle 51 is a warm air, and the heat energy of the mist is imparted as a sublimate, the adhesion of the smoke to the optical component layer FX is suppressed.

As described above, even in the present modification, since the dust F of the layer F1X can be removed by the dust collecting device 20, the layer sheet F1X and the optical display member P can be bonded to the head unit 150, so that the dust can be prevented from being mixed or bubbles. The bonding is performed in the state of generation. Thereby, the quality of the product can be improved.

Further, according to the present modification, it is possible to attract the smoke generated by the laser processing of the dust collecting device 20 over the entire length of the cutting line SX without leaking. Thereby, the adhesion of the smoke on the surface of the product can be suppressed, and the contamination of the production line due to the smoke attached to the product can be prevented.

[Second embodiment]

Hereinafter, a production system of a bonding apparatus and an optical display apparatus according to a second embodiment of the present invention will be described with reference to Figs. 11 to 13 .

Fig. 11 is a view showing a cutting process of the layer sheet FXm in the production system of the embodiment.

In the present embodiment, the difference from the first embodiment is that the layer FXm attached to the optical display member P by the bonding head is a point larger than the layer of the optical component FO having a predetermined size; And after the layer FXm is bonded to the optical display member P, the remaining portion of the layer FXm is cut by the cutting device 184. Therefore, in the following description, the cutting process of the layer sheet FXm will be mainly described. The components that are the same as those in the first embodiment are denoted by the same reference numerals, and the detailed description thereof will be omitted.

The cross-sectional structure of the layer FXm is the same as that of the layer F1X shown in FIG. The layer FXm is obtained by cutting a long optical component layer FX as shown in FIG. 1 at a specific size. For example, the layer FXm is larger than the size of the outer size of the optical display part P (the size of the first area FB). The above-mentioned "corresponding to the size of the outer dimensions of the optical display member P" means that the size of the remaining portion which is problematic in actual use does not occur when bonded to the optical display member P. Since the layer FXm is larger in size corresponding to the outer shape of the optical display member P, the remaining portion (second region FS) which is problematic in practical use is cut by the cutting device 184.

The bonding apparatus for bonding the layer FXm to the optical display member P is the same as the bonding apparatus 100 described in the first embodiment. In the present embodiment, the detecting device 189 and the cutting device 184 are provided on the conveying line on the downstream side of the bonding apparatus.

The detecting device 189 includes an imaging device 183 that captures an optical display member P to which the layer sheet FXm is attached. The detecting device 189 detects the cutting line WCL of the layer sheet FXm (the position at which the layer sheet FXm should be cut) based on the photographing information of the photographing device 183.

For example, the imaging device 183 photographs the optical display member P from above the optical display member P placed on the cutting platform 185 over the layer FXm. For example, the imaging device 183 captures images of the four corners of the substrate (for example, the color filter substrate) to which the optical display member P of the layer FXm is attached. For example, the detecting device 189 image-processes the photographing information to detect the position of the outer peripheral edge of the substrate, and detects the position of the outer peripheral edge of the cutting line WCL as the layer FXm.

The information of the cutting line WCL detected by the detecting device 189 is sent to the control device 190. The control device 190 controls the cutting device 184 based on the information of the cutting line WCL conveyed from the detecting device 189 to cut the layer FXm along the cutting line WCL. Thereby, the first region FB opposed to the display region of the layer FXm and the second region FS outside the first region FB are cut out to cut out the optical component FO which is a predetermined size from the layer FXm.

The cutting line WCL of the layer FXm is a cutting line WCL detected by each of the optical display members P conveyed on the conveying line. Thereby, even if the optical display member P has a dimensional deviation, the optical component FO corresponding to the outer size of the optical display member P can be surely cut out from the layer FXm.

In the present specification, a method in which the remaining portion of the layer FXm is cut based on the photographing information of the optical display unit P is referred to as a "window type" after the layer FXm having a larger size as the optical unit FO of a predetermined size is attached to the optical display unit P. Cutting method". In the present embodiment, the optical component FO of the target size is bonded to the target position of the optical display member P by the window type cutting method. By adopting the window type cutting method, the following effects are obtained.

(i) In the case where the optical component is bonded to the optical display component P, the dimensional deviation of the optical display component P and the optical component FO and the alignment deviation (positional offset) with respect to the optical component FO of the optical display component P are considered. ), etc., it is necessary to attach a larger optical component FO to the optical display component P. However, in this method, an additional area (frame area) which does not function is formed in the peripheral portion of the display region displayed on the optical display member P, which hinders the miniaturization of the machine. In the case of the window type cutting method, the optical display unit P after the bonding layer FXm is photographed, and the layer FXm is cut based on the photographing information, so that the optical unit FO having a predetermined size can be reliably disposed as the designated position.

(ii) The direction of the optical axis of the layer FXm may be shifted from the original design direction due to manufacturing errors. In this case, the prepared layer FXm (optical component layer FX) is measured in advance. In the optical axis direction, it is preferable to adjust the relative bonding position of the layer FXm and the optical display member P based on the measurement result. However, if the size of the layer FXm coincides with the size of the designated optical component FO, such a failure cannot be performed. Adjustment. In the window type cutting method, the layer FXm larger than the optical unit FO is bonded to the optical display unit P, and since the remaining portion of the layer sheet FXm is cut after this, such adjustment can be performed.

For example, the bonding position (relative bonding position) with respect to the layer FXm of the optical display member P can be determined as described below.

First, as shown in FIG. 12A, a plurality of checkpoints CP are set in the width direction of the optical component layer FX, and the direction of the optical axis of the optical component layer FX is detected at each of the inspection points CP. The timing of detecting the optical axis may be a period in which the roll drum RX (see FIG. 1) is manufactured, or may be rolled out from the roll drum RX until the half is cut. The information on the optical axis direction of the optical component layer FX is combined with the position in the longitudinal direction of the optical component layer FX and the position in the width direction, and then stored in a memory device not shown.

The control device 190 acquires the information of the optical axis of each checkpoint CP (inspection information of the in-plane distribution of the optical axis) from the memory device, and detects the optical component layer FX of the portion where the slice FXm is cut out (by the cutting line CL) The direction of the average optical axis of the area).

For example, as shown in FIG. 12B, the angle (offset angle) of the optical axis direction and the edge line EL of the layer FXm is detected at each check point CP, with the maximum angle (maximum offset angle) among the offset angles. When θmax and the minimum angle (minimum offset angle) are θmin, the average value θmid (=(θmax+θmin)/2) of the maximum offset angle θmax and the minimum offset angle θmin is detected as the average offset angle. Then, the average offset angle θmid direction with respect to the edge line EL of the layer sheet FXm is detected as the average optical axis direction of the layer sheet FXm. Further, for example, the offset angle is calculated by a positive angle in the counterclockwise direction with respect to the edge line EL of the layer FXm and a negative angle in the clockwise direction.

Then, the average optical axis of the optical component layer FX detected by the above method In the direction, the bonding position (relative bonding position) with respect to the layer FXm of the optical display member P is determined so as to be at a target angle with respect to one side of the display region P4 of the optical display member P. For example, in the case where the optical axis direction of the optical component is set to a direction of 90° with respect to one side of the display region P4 by design specifications, the average optical axis direction of the optical component layer FX is relative to one side of the display region P4. The layer sheet FXm was bonded to the optical display member P at 90°.

After that, the cutting line WCL of the layer sheet FXm is detected by the detecting device 189 shown in (a) of FIG. 11, by the cutting device 184 shown in (b) of FIG. 11, The layer FXm is cut along the cutting line WCL. Thereby, the optical component FO precisely controlling the optical axis direction is disposed at the target size and the target position. Thereby, it is possible to provide an optical display device DP having a narrow frame edge excellent in display quality.

Fig. 13 is a schematic view showing a production system 2000 of an optical display device according to a second embodiment of the present invention. The production system 2000 is a production system using a window type cutting method. In the bonding apparatus in which the optical display member P is bonded to a layer larger than the optical unit, the production system 2000 includes the bonding apparatus 100 described in the first embodiment.

The production system 2000 of the present embodiment includes a cleaning device 2001, a first bonding device 2002, a first cutting device 2003, a second bonding device 2004, a second cutting device 2005, a peeling device 2006, and a third sticker. The device 2007, the third cutting device 2008, and the inspection device 2009. Washing device 2001, first bonding device 2002, first cutting device 2003, second bonding device 2004, second cutting device 2005, peeling device 2006, third bonding device 2007, third cutting device 2008 The inspection device 2009 is disposed in a series of transport lines that transport the optical display unit P.

The cleaning device 2001, the first bonding device 2002, the second bonding device 2004, the peeling device 2006, the third bonding device 2007, and the inspection device 2009 each have the first bonding device with the cleaning device 1001 of the first embodiment. The device 1002, the second bonding device 1003, the peeling device 1004, the third bonding device 1005, and the inspection device 1006 have the same configuration. However, the first bonding device 2002, In the second bonding apparatus 2004 and the third bonding apparatus 2007, a layer sheet which is larger than an optical component of a predetermined size is bonded to the optical display part P.

The first cutting device 2003, the second cutting device 2005, and the third cutting device 2008 have the same configuration as the above-described cutting device 184 and detecting device 189. In other words, in the first cutting device 2003, the second cutting device 2005, and the third cutting device 2008, an optical display member P to which a layer FXm larger than a predetermined size is attached is used. After the shooting, the window cut mode of the remaining portion of the layer is cut based on the shooting information. Thereby, it is possible to provide an optical display device DP having a narrow frame edge excellent in display quality.

Although the preferred embodiments of the present invention have been described above with reference to the attached drawings, the present invention is not limited to the examples of the present invention. The various shapes, combinations, and the like of the respective constituent elements shown in the above-described examples are merely examples, and various changes based on design requirements and the like are possible without departing from the gist of the invention.

[Industrial availability]

According to the bonding apparatus, the bonding method, the production system of the optical display device, and the production method of the optical display device of the present invention, it is possible to provide a bonding apparatus capable of suppressing the incorporation of dust when transferring a layer sheet and improving the quality of the product. , a bonding method, a production system of an optical display device, and a production method of an optical display device.

Claims (18)

A bonding device is a bonding device for bonding a layer to an optical display member, comprising: a winding portion for winding an optical component layer together from a roll roller and a separation layer; and a cutting portion, the optical component layer The separation layer is cut to form the layer; the bonding portion is peeled off from the separation layer and bonded to the optical display member; and the dust collecting device is disposed in the cutting portion and the bonding portion. And removing the dust of the layer; wherein the dust collecting device further comprises: a first pair of rollers formed by a pair of first rollers, and a part of the conveying direction of the layer conveyed to the bonding portion is up and down Clamping, and contacting the surface of the first roller pair with the surface of the layer to remove dust of the layer; at least one of the pair of first rollers has a surface that can remove the dust of the layer a first roller force; the second roller pair is formed by a pair of second rollers, the first roller pair is clamped from above and below, and the surfaces of the second roller pair are respectively contacted with the first roller pair to Removing the dust of the first roller; and among the pair of second rollers, Of the first roller to the second roller having the first adhesive force, the surface of the second cylinder having a second adhesive force greater than the first adhesive force. The bonding device of claim 1, wherein the first adhesive force is less than the adhesion of the ply and the separation layer. The bonding apparatus according to claim 1 or 2, wherein the first adhesive layer is detachably wound around the first roller having the first adhesive force. The bonding apparatus according to claim 1 or 2, wherein the second adhesive layer is detachably wound around the second roller having the second adhesive force. The bonding device according to claim 1 or 2, further comprising: a layer platform supporting the layer from the side of the separation layer; and a bonding platform on which the optical display member is placed; wherein the bonding portion comprises The bonding head, for the layer resting on the platform, is pressed and held along the bending surface of the holding surface while being bent along the holding surface, and the layer is peeled off from the separation layer and held on the holding surface. At the same time, the layer held on the holding surface is attached to the optical display member placed on the bonding platform. The bonding device of claim 5, further comprising: a winding portion, after the bonding head peels the layer from the separating layer, the winding is turned into a separate separating layer; wherein the winding portion is a first period in which the bonding head presses the holding surface against the layer to start the rotation, and rotates the separation layer in the winding direction. After the first period, the winding portion stops at the rotation. During the second period, the separation layer is rotated in the winding direction. The bonding device of claim 5, further comprising: a cover plate adjacent to the optical display member on the bonding platform; wherein the holding surface of the bonding head is pressed against the upper surface of the cover plate The bonding head bonds the layer held on the holding surface to the optical display member by continuously rotating on the upper surface of the cover plate and the upper surface of the optical display member. A production system for an optical display device is a production system for forming an optical display device by attaching an optical component to an optical display component, comprising: a bonding device, wherein the optical display component is bonded to a layer of the optical component; The bonding device is the bonding device according to any one of claims 1 to 7. A production system for an optical display device is a production system in which an optical display member is attached to an optical component to form an optical display device, comprising: a bonding device for bonding a layer larger than the optical component to the optical display member; and detecting means for capturing an optical display member to which the layer is attached, and detecting a cutting line of the layer based on the shooting information; a cutting device for cutting the optical component from the layer by cutting the layer attached to the optical display member along the cutting line; wherein the bonding device is as claimed in claims 1 to 7 A laminating device according to any one of the preceding claims. A bonding method is a bonding method for bonding an optical display member to a layer, comprising: a winding-out step of winding the optical component layer together with the separation layer from the separation roller; and cutting the optical component layer The separation layer is left to be cut to form the layer; the bonding step, the layer is peeled off from the separation layer and attached to the optical display member; and the dust collecting step is performed between the cutting step and the bonding step Removing the dust of the layer; wherein the dust collecting step comprises: using a first pair of rollers formed by a pair of first rollers, and moving a part of the conveying direction of the layer conveyed in the bonding step from upper to lower Clamping and contacting the surface of the first roller pair with the surface of the ply to remove dust of the ply; and at least one of the pair of first rollers has a dust capable of removing the ply a first adhesive force; and a second pair of rollers formed by a pair of second rollers, the first roller pair being clamped from above and below, and the surfaces of the second roller pair being respectively in contact with the first a pair of rollers to remove dust from the first roller; Among the pair of second roller, the second roller pair having a first roller of the first adhesive force, the surface of the second cylinder having a second adhesive force greater than the first adhesive force. The bonding method of claim 10, wherein the first adhesive force is less than the adhesion of the ply and the separation layer. The bonding method according to claim 10 or 11, wherein the first adhesive layer is detachably wound around the first roller having the first adhesive force. The bonding method of claim 10 or 11, wherein the second adhesive layer is detachably wound around the second roller having the second adhesive force. The bonding method according to claim 10 or 11, further comprising: a supporting step of supporting the layer from the separating layer side by a layer platform; and placing the step of loading the optical display member on the bonding platform Wherein the bonding step rotates the bonding head along the bending of the holding surface by pressing the curved holding surface of the bonding head against the layer resting on the layer platform, and the layer is pressed The separator held on the holding surface is bonded to the optical display member placed on the bonding platform while being peeled off from the separation layer and held on the holding surface. The bonding method of claim 14, further comprising: a winding step, after the layer is peeled off from the separation layer by the bonding head, and the coiling portion is wound into a separate separation layer; wherein In the winding step, in the first period of the moment when the bonding head presses the holding surface against the layer to start the rotation, the winding portion rotates the separation layer in the winding direction, after the first period to The winding portion rotates the separation layer in the winding direction during the second period in which the rotation is stopped. The bonding method of claim 14, further comprising: a cover plate adjacent to the optical display member on the bonding platform; wherein, in the bonding step, the holding surface of the bonding head is pressed against the bonding surface After the upper surface of the cover, the bonding head is attached to the optical display member by continuously rotating on the upper surface of the cover and the upper surface of the optical display member. A method for producing an optical display device is characterized in that an optical display member is attached to an optical component The method for producing an optical display device, comprising: a bonding step of bonding the optical display member to a layer of the optical component; wherein the bonding step is performed according to any one of claims 10 to 16. The bonding method is carried out. A method for producing an optical display device is a method for producing an optical display device by bonding an optical component to an optical display component, comprising: a bonding step of bonding a layer larger than the optical component to the optical display component; detecting a step of photographing an optical display member to which the layer is attached, detecting a cutting line of the layer based on the photographing information; and cutting a step of cutting the optical display member along the cutting line A layer is formed to cut the optical component from the ply; wherein the laminating step is performed using the laminating method according to any one of claims 10 to 16.