TW201600908A - Adhering device, adhering method, production device of optical display device, and production method thereof - Google Patents

Abstract

An adhering device 100 of the present invention separates a sheet piece F1X from a separator sheet F3a and holds the sheet piece F1X on a holding surface 122a by rolling an adhering head 120 along a curvature of the holding surface 122a while pressing the curved holding surface 122a of the adhering head 120 with respect to the sheet piece F1X which is supported on a sheet stage 114. In addition, the adhering device 100 adheres the sheet piece F1X held on the holding surface 122a to an optical display component P by rolling the adhering head 120 along the curvature of the holding surface 122a while pressing the sheet piece F1X held on the holding surface 122a on the optical display component P which is mounted on the adhering stage 171.

Description

Laminating device, bonding method, production system of optical display device, and production method of optical display device

The present invention relates to a bonding apparatus, a bonding method, a production system of an optical display device, and a production method of the optical display device. The present invention claims priority based on Japanese Patent Application No. 2014-132811, filed on Jun.

An apparatus described in Patent Document 1 is known as a device for bonding a layered material to an object to be attached. The apparatus of Patent Document 1 cuts a long layered layer material in a specific size and holds it on the head. Then, the head is moved to the platform on which the attached object is placed, the head is aligned with the attached object, and after being attached, the head is pressed onto the attached object to transfer the layered material to the attached object. Things. [Prior Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent No. 4482757

[Problems to be solved by the invention]

In the apparatus of Patent Document 1, when the layered material is transferred to the object to be attached, the shape of the head is an arc shape in order not to generate bubbles. However, since the layered material is held by the head portion while the layered material is being conveyed, the layered material is held by the head. Therefore, when the layered material is held on the head due to the influence of the meandering or the like when the layered material is conveyed, wrinkles are likely to occur in the layer. Shaped material. Thereby, when the layered material is transferred to the object to be attached, air bubbles are likely to be generated between the layered material and the object to be attached.

An object of the present invention is to provide a bonding apparatus, a bonding method, a production system of an optical display device, and a production method of an optical display device which can suppress generation of bubbles when transferring a layer sheet. [Means for solving problems]

A bonding apparatus according to an aspect of the present invention is a bonding apparatus for bonding a layer to an optical display member, comprising: a winding portion for winding the optical component layer together from the roll drum and the separation layer; And removing the separation layer from the optical component layer to form the layer; the layer platform, the layer is supported from the separation layer side; the bonding platform, the optical display component is placed; and the bonding head, The layer piece resting on the platform of the layer is rotated along the curved surface of the holding surface while pressing the curved holding surface, and the layer is peeled off from the separation layer and held on the holding surface, The plies held on the holding surface are attached to the optical display member placed on the bonding platform.

A bonding apparatus according to an aspect of the present invention may further include: a winding portion that is peeled off from the separation layer by the bonding head, and then wound into a separate separation layer; wherein the winding portion During the first period of the moment when the bonding head presses the holding surface against the layer and starts to rotate, the separation layer is rotated in the winding direction. After the first period, the winding portion ends at the rotation. During the second period of the stop, the separation layer is rotated in the winding direction.

A bonding apparatus according to an aspect of the present invention may further include: a cover plate adjacent to the optical display member on the bonding platform; wherein a retaining surface of the bonding head is pressed against the cover plate Thereafter, the layer held on the holding surface is bonded to the optical display member by continuously rotating on the upper surface of the cover and the upper surface of the optical display member.

A production system for an optical display device according to a first aspect of the present invention is a production system in which an optical display member is bonded to an optical component to form an optical display device, comprising: a bonding device, wherein the optical display member is bonded to the optical A ply of the assembly; wherein the laminating device is a laminating device in accordance with one aspect of the invention described above.

A production system for an optical display device according to a second aspect of the present invention is a production system in which an optical display member is bonded to an optical component to form an optical display device, comprising: a bonding device, wherein the optical display member is attached to the optical device a layer having a large component; a detecting device that photographs an optical display member to which the layer is attached, detects a cutting line of the layer based on the photographing material; and a cutting device that cuts the patch along the cutting line A ply of the optical display member is incorporated to cut the optical component from the ply; wherein the laminating device is an aspect of the above-described aspect of the present invention.

The bonding method of the aspect of the present invention is a method for bonding the optical display member to the bonding layer, comprising: a winding-out step of winding the optical component layer together from the winding roller and the separation layer; Removing the separation layer from the optical component layer to form the layer; supporting step of supporting the layer from the side of the separation layer by a layer platform; and placing the optical display component on the sticker And a laminating step of rotating the bonding head along the bending of the holding surface by pressing the curved holding surface on the layer resting on the platform, and separating the layer from the separation layer While peeling and holding the holding surface, the layer sheet held on the holding surface is bonded to the optical display member placed on the bonding platform.

In an aspect of the present invention, the method further includes: a winding step of separating the layer from the separation layer by the bonding head, and then winding the winding portion into a separate separation layer; In the winding step, in the first period of the moment when the bonding head presses the holding surface against the layer and starts to rotate, the winding portion rotates the separation layer in the winding direction, and passes through the first After the period, the winding portion rotates the separation layer in the winding direction during the second period from the end of the rotation to the stop.

In a bonding method according to an aspect of the present invention, a cover plate may be further disposed on the bonding platform adjacent to the optical display member; wherein, in the bonding step, the holding surface of the bonding head is applied After being pressed against the upper surface of the cover, the bonding head is adhered to the optical display member by continuously rotating on the upper surface of the cover and the upper surface of the optical display member.

A method of producing an optical display device according to a first aspect of the present invention is a method for producing an optical display device by bonding an optical component to an optical display member, comprising: a bonding step, wherein the optical display member is bonded to the optical A ply of the component; wherein the laminating step is carried out using the above-described aspect of the bonding method of the present invention.

A method for producing an optical display device according to a second aspect of the present invention is a method for producing an optical display device by bonding an optical component to an optical display member, comprising: a bonding step, wherein the optical display member is attached to the optical device a layer having a large component; a detecting step of photographing an optical display member to which the layer is attached, detecting a cutting line of the layer based on the photographing data; and a cutting step of cutting the stitching along the cutting line The ply of the optical display member is used to cut the optical component from the ply; wherein the laminating step is performed using the above-described aspect of the bonding method of the present invention.

In the production system and production method of the optical display device of the first aspect, and the production system and production method of the optical display device according to the second aspect, the term "optical component" means setting based on the specifications of the optical display device. The size of the optical components. For example, the "size set based on the specifications of the optical display device" means that it can correspond to the size of the external dimensions of the optical display member, and specifically, when it is bonded to the optical display member, it does not cause actual use. There will be the size of the rest of the problem.

For example, a display area for displaying an image is provided at a central portion of the optical display member, a circuit component mounting portion is provided at an end of the optical display member, and the circuit component mounting portion is provided with a semiconductor wafer or a flexible printed wiring. Multiple terminals. For example, in this case, in the case of the "optical component", a region having a larger display area than the optical display member and a smaller outer shape (the contour shape in the plan view) of the optical display member is used, and the optical display is avoided. An optical component of a size of a region of a functional portion such as a circuit component mounting portion in the component.

In the production system and the production method of the optical display device of the second aspect, the "layer having a larger optical component" means an optical component that is larger than a predetermined size (a size set based on the specifications of the optical display device). Larger layers. In the layer sheet, a portion larger than the optical component is used as the remaining portion, and becomes a cutting object. An optical component of a specified size is obtained by cutting the remaining portion from the ply. [Effects of the Invention]

According to the present invention, it is possible to provide a bonding apparatus, a bonding method, a production system of an optical display device, and a production method of an optical display device capable of suppressing generation of bubbles when transferring a layer sheet.

[First Embodiment] Hereinafter, a production system of a bonding apparatus and an optical display apparatus according to a first embodiment of the present invention will be described with reference to Figs. 1 to 5 .

Fig. 1 is a schematic view of a bonding apparatus 100 of the present embodiment. In the bonding apparatus 100 of the present embodiment, the layer F1X obtained by half-cutting the long optical component layer FX is bonded to one surface of the optical display member P.

For example, as the optical display member P, a panel-shaped optical display member such as a liquid crystal panel or an organic electro-luminescence (OEL) panel can be used. For example, as the optical component layer FX, a polarizing film, a retardation film, a luminance increasing film, or the like can be used. For example, in the present embodiment, as the optical component layer FX, a polarizing film as shown in FIG. 4 is used.

The optical component layer FX of FIG. 4 includes a film-shaped optical component body F1a, an adhesive layer F2a provided on one side of the optical component body F1a (upper side in FIG. 4), and a separable layer interposed via the adhesive layer F2a. The separation layer F3a accumulated on one surface of the optical module body F1a and the surface protective film F4a laminated on the other surface (lower side surface of FIG. 4) of the optical module body F1a.

For example, the optical module body F1a has a function as a polarizing plate, and is attached to the display region of the optical display member P or across the display region and its peripheral region. The optical module main body F1a is bonded to the optical display member P via the adhesive layer F2a in a state in which the adhesive layer F2a remains on the one surface and is separated from the separation layer F3a. Hereinafter, a portion after removing the separation layer F3a from the optical module layer FX is referred to as a bonding layer F5. The layer F1X is a layer of the bonding layer F5 obtained by cutting the long-shaped bonding layer F5 into a specific size.

The separation layer F3a protects the adhesive layer F2a and the optical module body F1a from the time before the separation from the adhesive layer F2a. The surface protective film F4a is bonded to the optical display member P together with the optical module body F1a. The surface protective film F4a is disposed on the opposite side of the optical display member P with respect to the optical module body F1a to protect the optical module body F1a. Further, the optical component layer FX may be configured not to include the surface protective film F4a, and the surface protective film F4a may not be separated from the optical module body F1a.

The optical module main body F1a includes a layered polarizer F6, a first film F7 joined to one surface of the polarizer F6 by an adhesive or the like, and a surface of the other side of the polarizer F6 joined by an adhesive or the like. The second film F8. For example, the first film F7 and the second film F8 are protective films for protecting the polarizer F6.

Further, the optical module body F1a may have a single layer structure composed of one layer of optical layers, or may have a laminated structure in which a plurality of optical layers are laminated to each other. The optical layer may be a retardation film or a luminance increasing film, in addition to the polarizing mirror F6. At least one of the first film F7 and the second film F8 may be subjected to a surface treatment to obtain an anti-glare effect including an outermost hard coat treatment or an anti-glare treatment for protecting the liquid crystal display unit. The optical module body F1a may not include at least one of the first film F7 and the second film F8. For example, in the optical module body F1a, the first film F7 may be omitted, and the separation layer F3a may be bonded to the surface of one side of the polarizer F6 via the adhesive layer F2a.

For example, as shown in FIG. 1 , the bonding apparatus 100 of the present embodiment includes a layer conveying device 110 , a head unit 150 , a head moving device 160 , a platform unit 170 , and a control device 190 .

For example, the layer conveying device 110 includes a winding portion 111, a winding portion 112, a nip roller portion 113, a layer platform 114, and a cutting portion 115.

The winding portion 111 is configured to wind the optical module layer FX in the longitudinal direction while holding the roll drum RX of the optical component layer FX which is wound in a long shape. For example, the optical component layer FX has the same width as the first side (for example, the short side) of the display region of the optical display member P in the horizontal direction (layer width direction) perpendicular to the transport direction.

In the following, the direction in which the optical component layer FX (separation layer F3a) is unwound from the winding portion 111 and conveyed is referred to as a layer transport direction, the upstream side in the layer transport direction is referred to as a layer transport upstream side, and the downstream side in the layer transport direction is referred to as a layer. Transport to the downstream side.

The cutting unit 115 cuts off (semi-cut) the optical component layer FX wound from the roll drum RX and the residual separation layer F3a in the thickness direction. For example, the cutting portion 115 is in the longitudinal direction perpendicular to the layer width direction of the optical component layer FX as long as the length of the second side (for example, the long side) of the display region of the optical display member P is rolled up. The same length spans the entire width in the width direction of the layer, and cuts off the portion of the optical component layer FX in the thickness direction.

The cutting portion 115 adjusts the advancement and retreat position of the cutting blade and imparts a half cut when the separation layer F3a is not broken or broken (so that the separation layer F3a has a predetermined thickness) by the tension in the conveyance of the optical module layer FX. Broken to the vicinity of the interface between the adhesive layer F2a and the separation layer F3a. Further, instead of the cutting blade, a laser cutting device can be used as the cutting portion 115.

The optical component layer FX after the half cut is formed in the thickness direction by cutting the optical module body F1a, the adhesive layer F2a, and the surface protective film F4a to form a cutting line that spans the entire width of the optical component layer FX in the layer width direction. . The optical component layer F is divided into a section having a length corresponding to the length of the second side of the display region by the cutting line in the longitudinal direction. This partition each becomes a layer F1X in the bonding layer F5.

The cutting angle of the layer conveying direction with respect to the optical component layer FX is controlled by the control device 190. For example, the imaging device is disposed at a plurality of positions in the layer transport direction, and the edge image of the optical component layer FX is captured. Based on the edge images of the plurality of positions captured by the imaging devices, the control device 190 detects the edge position of the plurality of positions. Then, based on the relative positional relationship of the edges of the detected complex positions, the control device 190 calculates the tilt angle of the layer transport direction with respect to the edge of the cut position of the optical component layer FX. Then, the cutting unit 115 cuts off the optical component layer FX by the cutting angle controlled by the control device 190. Thereby, even if the optical component layer FX is meandered in the layer width direction, the optical component layer FX can be cut accurately in the intended direction.

The layer platform 114 supports the lower surface of the optical component layer FX that is unwound from the roll drum RX (the surface on the side of the separation layer F3a as shown in FIG. 4). For example, the layer stage 114 is provided across both the cutting position at which the cutting unit 115 half-cuts the optical module layer FX and the peeling position at which the layer F1X is peeled off from the separation layer F3a.

The nip roller portion 113 includes a first nip roller 113a and a second nip roller 113b which are disposed in parallel with each other in the rotation axis direction. The first nip roller 113a and the second nip roller 113b are rotated in synchronization with each other, and the separation layer F3a is conveyed from the layer conveyance upstream side toward the layer conveyance downstream side (the direction taken up to the winding portion 112), or the separation layer is separated. F3a is conveyed from the layer conveyance downstream side toward the layer conveyance upstream side (the direction which is wound up from the winding part 112).

The winding unit 112 peels off the layer sheet F1X from the separation layer F3a by the bonding head 120, and then winds up into a separate separation layer F3a. The winding unit 112 rotates synchronously by the first nip roller 113a and the second nip roller 113b to perform winding and unwinding of the separation layer F3a.

For example, the head unit 150 includes a fitting head 120, a head driving device 130, and a head lifting device 140.

For example, the bonding head 120 includes a head body portion 121 and an adhesive layer 122. The upper surface of the head main body portion 121 is a flat surface, and the lower surface is a curved surface that is convex toward the lower side and curved in the direction in which the optical component layer FX is oriented. The adhesive layer 122 is fixedly attached to the lower surface of the head main body portion 121. For example, in the case of the adhesive layer 122, an adhesive rubber or the like is used. The surface of the adhesive layer 122 is a curved holding surface 122a to which the layer F1X is attached and held. For example, the holding surface 122a has a weak adhesion force to the bonding surface (adhesive layer F2a) of the layer F1X, and the surface protective film F4a of the layer F1X can be attached and peeled off.

The bonding head 120 peels and holds the layer F1X from the separation layer F3a by bending the curved holding surface 122a while pressing the curved holding surface 122a on the layer sheet F1X supported on the layer stage 114. The surface 122a is held. The bonding head 120 presses the layer F1X along the bending of the holding surface 122a while pressing the layer F1X held on the holding surface 122a to the optical display member P placed on the bonding stage 171. In the optical display part P.

For example, the head driving device 130 includes a bottom plate 135, a rotation driving portion 136, and a rod portion 137.

The bonding head 120 is connected to the rotation support shaft 136a of the rotation driving unit 136 through a rod portion 137 connected to the center portion of the upper surface of the head main body portion 121. The rotation support shaft 136a is fixed to the bottom plate 135. The bonding head 120 is rotatably suspended from the lower surface of the bottom plate 135 via the rod portion 137 and the rotation support shaft 136a. For example, the retaining surface 122a is an arcuate curved surface centered on the rotating support shaft 136a.

The bonding head 120 is rotated by the rotation driving portion 136 at a specific angular range to the rotation of the rotation support shaft 136a. Thereby, the layer sheet F1X is attached from the separation layer F3a to the holding surface 122a, and the layer sheet F1X is bonded (transferred) from the holding surface 122a to the optical display member P.

The head lifting device 140 includes an elevation driving unit 141 and a rod portion 142. The first end of the rod portion 142 is fixed to the upper surface of the bottom plate 135, and the second end portion of the rod portion 142 is connected to the elevation driving portion 141. For example, the elevation drive unit 141 has a servo motor built therein and is moved in the vertical direction by the driving force lever portion 142 of the servo motor. Thereby, the bonding head 120 moves in the vertical direction.

The head moving device 160 includes a guide rail 161 and a slider 162. The upper end portion of the elevation drive unit 141 is fixed to the slider 162. Thereby, the head unit 150 is vertically suspended from the slider 162. The guide rail 161 is spanned between the layer transport device 110 and the bonding platform 171. The slider 162 reciprocates along the guide rail 161. Thereby, the bonding head 120 is moved between the peeling position which peeled the layer piece F1X from the separation layer F3a, and the bonding position which bonded the layer piece F1X to the optical display member P.

The head driving device 130, the head lifting device 140, and the head moving device 160 constitute a head driving mechanism that rotationally drives, moves up, and moves the bonding head 120. The bonding head 120 is rotated and horizontally moved by the head driving device 130 and the head moving device 160, and is rotated on the layer F1X supported on the layer platform 114 and placed on the optical display member P of the bonding platform 171. Thereby, the layer sheet F1X is attached from the separation layer F3a to the holding surface 122a, and the layer sheet F1X is bonded (transferred) from the holding surface 122a to the optical display member P.

The fitting head 120 is rotated by the head driving device 130 in the first rotation direction (for example, clockwise direction) by the head moving device 160 in the first moving direction (for example, the right direction) The horizontal movement is rotatable from a first end (for example, a left end) of the retaining surface 122a toward a second end (for example, a right end) in a first direction. Moreover, the fitting head 120 is rotated by the head driving device 130 in the second rotation direction (for example, the counterclockwise rotation direction) by the head moving device 160 in the second moving direction (for example, The horizontal movement in the left direction is rotatable from a second end of the retaining surface 122a (for example, the right end) toward the second end of the first end (for example, the left end).

The platform unit 170 includes a bonding platform 171, a platform driving device 172, and a cover plate 173.

The bonding stage 171 has a mounting surface 171a on which the optical display member P is placed. For example, the bonding platform 171 holds the optical display member P on the mounting surface 171a by adsorbing the lower surface of the optical display member P (the surface opposite to the surface on which the layer F1X is bonded).

The cover plate 173 is a plate-like or rod-shaped assembly disposed along one side of the optical display member P. The cover plate 173 is fixed to the mounting surface 171a. The height of the cover plate 173 is approximately the same as the height of the optical display member P. The cover plate 173 is disposed on the upstream side in the rotational direction AFD of the position where the optical display member P is placed.

The optical display member P is disposed adjacent to the cover plate 173. The optical display member P is fixed to the mounting surface 171a with the end portion in contact with the side surface of the cover plate 173. Thereby, the upper surface of the optical display member P and the upper surface of the cover plate 173 form a continuous plane.

The cover plate 173 can be fixed to at least two positions (the first position and the second position) disposed on the bonding platform 171. The first position is a position on the bonding platform 171 corresponding to the rotation direction AFD as the first direction (for example, a position near the left side of the optical display member P), and the second position is the corresponding rotation direction AFD as the first position. The position on the bonding platform 171 in the case of the two directions (for example, the position near the right side of the optical display member P).

After the bonding head 120 presses the holding surface 122a located on the upstream side of the bonding direction of the layer F1X to the upper surface of the cover plate 173, the bonding head 120 is continuously rotated on the upper surface of the cover plate 173 and the optical display part P. In the upper surface, the layer F1X held on the holding surface 122a is bonded to one surface of the optical display member P. Before the contact layer F1X and the optical display member P are moved, the bonding head 120 is started to move outside the optical display member P, and the bonding conditions such as load or speed can be uniformized in the entire layer F1X.

The stage driving device 172 moves the bonding platform 171 in a direction perpendicular to the rotational direction AFD of the bonding head 120 and the rotational direction AFD of the bonding head 120. Also, the platform drive 172 rotates the bonding platform 171 in a horizontal plane. The platform driving device 172 drives the bonding platform 171 to adjust the relative position of the optical display member P held by the bonding platform 171 and the layer F1X held by the bonding head 120. Thereby, the alignment of the optical display member P and the layer F1X is performed.

The control device 190 is constructed by including a computer system. The computer system includes a calculation unit of a CPU or the like, a memory unit such as a memory or a hard disk. The control device 190 includes an interface that can communicate with an external device of the computer system to collectively control the operations of the various devices constituting the bonding device 100 and various external devices of the bonding device 100.

Hereinafter, a process of attaching the layer sheet F1X to the bonding head 120 will be described with reference to FIGS. 2A to 2C.

As shown in FIG. 2A, the bonding head 120 is disposed above the layer platform 114 in a state where the bonding head 120 is inclined with respect to the layer platform 114. After the conveyance of the layer F1X is stopped, the layer F1X is rested on the layer platform 114. The layer platform 114 supports the layer F1X from the side of the separation layer F3a. Then, the bonding head 120 and the layer F1X on the layer platform 114 are aligned. The fitting head 120 assumes an inclined state such that the upstream side in the rotational direction is located below the downstream side in the rotational direction. In the case of the present embodiment, the inclined state is such that the end portion on the layer transport downstream side is located below the end portion on the layer transport upstream side.

Once the position of the bonding head 120 and the layer F1X is aligned, the head 120 is lowered by the head lifting device 140 to the height in contact with the layer F1X. Thereby, the end portion of the layer head downstream side of the bonding head 120 is pressed against the end portion on the layer transport downstream side of the layer sheet F1X.

Then, as shown in FIG. 2B, the rotational driving unit 136 and the head moving device 160 are synchronously driven to rotate the bonding head 120 from the layer transport downstream side toward the layer transport upstream side (rotation and horizontal movement). Thereby, the layer sheet F1X is gradually attached to the holding surface 122a from the layer conveyance downstream side to the layer conveyance upstream side.

In the first period in which the bonding head 120 presses the holding surface 122a against the layer F1X and starts to rotate, the winding portion 112 and the nip roller portion 113 synchronously drive the rotation driving portion 136 and the head moving device 160 to separate The layer F3a is rotated in the winding direction (counterclockwise direction). Thereby, on the upstream side of the nip roller portion 113, the separation layer F3a is loosened, and the portion F1X and the separation layer F3a on the downstream side of the portion which is provided with the load by the bonding head 120 are curved along the holding surface 122a toward the layer platform. The top of 114 floats up.

Since the separation layer F3a is in a relaxed state, it is difficult to generate a force for peeling the layer sheet F1X from the holding surface 122a at the end portion of the layer F1X on the downstream side of the layer conveyance. Thereby, the adhesion force of the layer piece F1X and the holding surface 122a is high, and the layer piece F1X is adhered to the holding surface 122a reliably. Further, when the layer F1X is peeled off from the separation layer F3a by the separation layer F3a, the peeling force which is applied to the separation layer F3a instantaneously increases is suppressed. Thereby, the separation layer F3a is prevented from being broken and broken.

As shown in FIG. 2C, after the first period of time has elapsed, the winding portion 112 and the nip roller portion 113 rotate the separation layer F3a in the winding direction (clockwise direction) in the second period from the end of the rotation of the bonding head 120 to the stop. Thereby, the relaxation of the separation layer F3a is released, and the separation of the layer sheet F1X from the separation layer F3a is promoted. For example, when the rotation direction of the winding portion 112 and the nip roller portion 113 is switched from the counterclockwise direction to the clockwise direction, it is preferable that the layer sheet F1X is 5%-70% attached to the holding surface 122a. The time to complete 10% -50%.

When the winding unit 112 and the pinch roller unit 113 perform the winding and winding of the separation layer F3a, the bonding head 120 continuously rotates in the same direction by the rotation driving unit 136 and the head moving device 160. The bonding head 120 rotates along the bending of the holding surface 122a while pressing the holding surface 122a on the layer F1X, and peels the layer sheet F1X from the separation layer F3a, and holds it on the holding surface 122a.

By the above, the surface protective film F4a of the layer F1X is sequentially attached to the holding surface 122a of the bonding head 120. The layer sheet F1X attached to the holding surface 122a is peeled off from the separation layer F3a, and the adhesive layer F2a (the bonding surface with the optical display member P) is exposed. The bonding head 120 holding the layer F1X is moved by the head moving device 160 to the bonding stage 171 on which the optical display member P is placed.

In FIGS. 2A to 2C, the process of holding the layer F1X of the good product having no defects in the layer on the bonding head 120 is shown, but the layer F1X of the defective product having defects in the layer is held by the bonding head 120. , the same processing is also performed. The bonding head 120 of the layer F1X for holding the defective product is moved to the stud position (discarded position) by the head driving device 160, and the studing position is disposed at a position different from the bonding platform 171 (not shown). Then, the layer F1X of the defective product is repeatedly bonded to the waste material layer or the like provided at the dressing position.

For example, the disadvantage of the layer F1X means that there is a portion of the foreign matter composed of at least one of a solid or a liquid or a gas inside the layer F1X, and a portion having irregularities or flaws on the surface of the layer F1X, The skew of the layer F1X or the deviation of the material or the like causes a portion of a bright spot or the like.

Next, a process of bonding (transferring) the layer sheet F1X attached (held) to the bonding head 120 to the optical display member P will be described with reference to FIGS. 3A to 3C.

As shown in FIG. 3A, the bonding head 120 of the holding layer sheet F1X is raised by the head lifting and lowering device 140 to a height that does not affect the layer conveying device 110 with the adhesive layer F2a facing downward. Then, the bonding head 120 is moved by the head moving device 160 to the upper position of the bonding stage 171 on which the optical display member P is placed.

For example, when the bonding head 120 is moved from the upper position of the layer platform 114 to the upper position of the bonding platform 171, the two corners of the layer F1X held by the holding surface 122a are photographed by the first imaging device 181. . The image of the layer F1X captured by the first imaging device 181 is image-resolved by a first image processing device (not shown) to detect the two corner positions of the layer F1X. The information on the position of the corner portion of the layer F1X detected by the first image processing device is sent to the control device 190. The control device 190 confirms the arrangement position of the layer F1X with respect to the bonding head 120 based on the information detected by the first image processing device.

For example, although the first imaging device 181 captures two corners on the rear end side of the layer F1X, the number or position of the layer F1X captured by the first imaging device 181 is not limited thereto. For example, as long as the arrangement position of the layer F1X with respect to the bonding head 120 can be confirmed, the number of the layers F1X captured by the first imaging device 181 can be freely selected within a range of one to four. The corner position of the shot can also be set freely.

For example, the optical display component P held on the bonding platform 171 is photographed by the second photographing device 182. For example, the second photographing device 182 captures a calibration mark, a black matrix, or the like as a calibration reference set on the optical display part P. The image of the optical display unit P captured by the second imaging device 182 is image-resolved by a second image processing device (not shown) to detect the position of the calibration reference. The information on the calibration reference position of the optical display unit P detected by the second image processing device is sent to the control device 190. The control device 190 confirms the arrangement position of the optical display member P with respect to the bonding platform 171 based on the information detected by the second image processing device.

The control device 190 controls the platform driving device 172 based on the arrangement position of the layer F1X with respect to the bonding head 120 and the arrangement position of the optical display member P with respect to the bonding platform 171. The control device 190 uses the platform driving device 172 to horizontally move the bonding platform 171 in a horizontal plane, and rotationally drives the bonding platform 171 in a horizontal plane. Thereby, the optical display member P held by the bonding stage 171 and the relative bonding position of the layer F1X held by the bonding head 120 are adjusted.

As shown in FIG. 3B, once the relative bonding position of the optical display member P and the layer F1X is adjusted, the bonding head 120 is lowered to contact the height of the optical display member P by the head lifting device 140. The fitting head 120 is inclined such that the end portion on the upstream side in the rotational direction is located further below the end on the downstream side in the rotational direction. By the lowering of the bonding head 120, the end portion of the bonding head 120 located on the upstream side of the layer F1X is pressed to the upper surface of the cover plate 173 located on the upstream side in the rotational direction of the optical display member P.

Next, as shown in FIG. 3C, the bonding head 120 is rotated from the upper surface of the cover plate 173 toward the upper surface of the optical display member P by synchronously driving the rotation driving portion 136 and the head moving device 160. With the rotation of the bonding head 120, the layer F1X held on the holding surface 122a is slowly attached to the upper surface of the optical display member P.

For example, the bonding head 120 has a weak adhesion force to the bonding surface of the layer F1X (the adhesive layer F2a as shown in FIG. 4), and can repeatedly adhere and peel the surface protective film F4a of the layer F1X. Therefore, the adhesive layer F2a side is pressed against the layer sheet F1X of the optical display member P, is peeled off from the holding surface 122a, and is bonded to the upper surface of the optical display member P. By the above, the process of bonding the layer sheet F1X to the optical display part P is completed.

In FIG. 3, the process of transferring the layer F1X of the good product having no defects in the layer from the bonding head 120 to the optical display member P is shown, but the layer F1X of the defective product having defects in the layer is attached to the surface. The same treatment is also performed in the case of the waste material layer at the pasting position.

As described above, in the bonding apparatus 100 of the present embodiment, the layer F1X resting on the layer stage 114 is pressed along the holding surface 122a while pressing the curved holding surface 122a of the bonding head 120. The bending of the bonding head 120 causes the layer F1X to be peeled off from the separation layer F3a and held on the holding surface 122a. Therefore, it is suppressed that the wrinkles which are caused by the meandering of the optical component layer FX and the wrinkles are held by the bonding sheet 120 of the bonding head 120. Thereby, when the layer sheet F1X is bonded to the optical display member P, generation of bubbles is suppressed between the layer sheet F1X and the optical display member P.

Fig. 5 is a schematic view showing a production system 1000 of an optical display device according to a first embodiment of the present invention. The optical display device is constructed by attaching an optical component to the optical display member P. The size of the optical component is set based on the specifications of the optical display device. In the bonding apparatus in which the optical display member P is bonded to the layer of the optical unit, the production system 1000 includes the above-described bonding apparatus 100.

The production system 1000 of the present embodiment includes a cleaning device 1001, a first bonding device 1002, a second bonding device 1003, a peeling device 1004, a third bonding device 1005, and an inspection device 1006. The first bonding apparatus 1002, the second bonding apparatus 1003, and the third bonding apparatus 1005 have the above-described configuration of the bonding apparatus 100. The cleaning device 1001, the first bonding device 1002, the second bonding device 1003, the peeling device 1004, the third bonding device 1005, and the inspection device 1006 are arranged in a series of transport lines that transport the optical display member P.

The cleaning device 1001 cleans the optical display member P carried in from the loading device (not shown), and removes foreign matter or the like adhering to the optical display member P. For example, the cleaning device 1001 can be water-washed, with a first side of the optical display member P (for example, a side that is visually displayed on the side of the image of the display area) and a second side (for example, with visual inspection) The surface on the side opposite to the image displayed on the display area is brushed and washed with water, and thereafter, the first surface and the second surface of the optical display member P are drained. The cleaning device 1001 can also be a dry type, and performs electrostatic removal and dust collection on the front and back surfaces of the optical display member P. For example, the optical display part P is a liquid crystal panel.

The first bonding apparatus 1002 adheres to the first layer on the first surface of the optical display member P. Similarly to the above-described bonding apparatus 100, the first bonding apparatus 1002 rotates the bonding head along the curved surface of the holding surface by pressing the curved holding surface of the bonding head on the stationary first layer sheet. The first ply is peeled off from the separation layer and held on the holding surface. Therefore, when the first layer sheet is bonded to the optical display member P, generation of bubbles is suppressed between the first layer sheet and the optical display member P.

For example, the first layer is a sheet-shaped polarizing plate that is cut corresponding to the size of the outer shape of the optical display member P. The above-mentioned "corresponding to the size of the outer dimensions of the optical display member P" means that the size of the remaining portion which is problematic in actual use does not occur when bonded to the optical display member P. The first layer has the same configuration as the layer F1X shown in FIG.

For example, a display area for displaying an image is provided at a central portion of the optical display member P, and a circuit component mounting portion is provided at an end of the optical display member P. The circuit component mounting portion is provided with a connection semiconductor wafer or a flexible printed wiring. Wait for the multiple terminals. For example, in this case, in the case of the first layer, a region having a larger display area than the optical display member P and smaller than the outer shape (contour shape in the plan view) of the optical display member P is used, and is avoided. A layer of a size of a region of a functional portion such as a circuit component mounting portion in the optical display member P is opened.

The second bonding device 1003 is attached to the second layer on the second surface of the optical display member P. Similarly to the above-described bonding apparatus 100, the second bonding apparatus 1003 rotates the bonding head along the curved surface of the holding surface by pressing the curved holding surface of the bonding head to the stationary second layer sheet. The second ply is peeled off from the separation layer and held on the holding surface. Therefore, when the second layer sheet is bonded to the optical display member P, generation of bubbles is suppressed between the second layer sheet and the optical display member P.

For example, the second layer is a sheet-shaped polarizing plate that is cut to correspond to the size of the outer shape of the optical display member P. The second ply has the same configuration as the ply F1X as shown in FIG. The transmission axis of the second layer bonded to the second surface of the optical display member P and the transmission axis of the first layer bonded to the first surface of the optical display member P are perpendicular to each other.

For example, a reverse-opposing device (not shown) that reverses the optical display member P is provided on the transport line of the optical display member P between the first bonding device 1002 and the second bonding device 1003. The optical display member P to which the first layer is bonded to the first surface is supplied to the second bonding apparatus 1002 in a state of being reversed and reversed.

The peeling device 1004 peels off the surface protective film from the second layer bonded to the second surface of the optical display member P.

The third bonding apparatus 1005 adheres the third layer to the surface of the second layer of the surface protective film which is peeled off by the peeling device 1004. Similarly to the above-described bonding apparatus 100, the third bonding apparatus 1005 rotates the bonding head along the curved surface of the holding surface by pressing the curved holding surface of the bonding head to the stationary third layer sheet. The third ply is peeled off from the separation layer and held on the holding surface. Therefore, when the third layer sheet is bonded to the optical display member P, generation of bubbles is suppressed between the third layer sheet and the optical display member P.

For example, the third layer is a sheet-like luminance increasing film that is cut corresponding to the size of the outer shape of the optical display member P. The luminance increasing film is a reflective polarizing plate that reflects linear polarization, and the linear polarizing system is perpendicular to the transmission axis. The third layer has the same configuration as the layer F1X shown in FIG. The transmission axis of the second layer bonded to the second surface of the optical display member P and the transmission axis of the third layer bonded to the second layer are parallel to each other.

The inspection device 1006 checks whether the positions of the first layer, the second layer, and the third layer are correct (whether the positional shift is within an allowable range) for the optical display member P. The optical display member whose position is determined to be incorrect with respect to the position of the first layer sheet, the second layer sheet or the third layer sheet of the optical display member P is discharged outside the system by means of a discharge means not shown.

An optical display member in which a first layer sheet, a second layer sheet, and a third layer sheet are bonded, and if necessary, is attached as an optical display after being subjected to a defect inspection (such as a foreign matter inspection) or a mounting of a circuit component. The device DP is shipped.

In the production system 1000 described above, the first bonding apparatus 1002, the second bonding apparatus 1003, and the third bonding apparatus 1005 use a bonding apparatus having the same configuration as the above-described bonding apparatus 100. Therefore, it is possible to provide an optical display device DP that suppresses generation of bubbles.

[Second Embodiment] Hereinafter, a production system of a bonding apparatus and an optical display device according to a second embodiment of the present invention will be described with reference to Figs. 6 to 8 .

Fig. 6 is a view showing a cutting process of the layer sheet FXm in the production system of the embodiment.

In the present embodiment, the difference from the first embodiment is that the layer FXm attached to the optical display member P by the bonding head has a predetermined size (a size set based on the specifications of the optical display device). The point at which the optical component FO is larger than the layer; and the point at which the remaining portion of the layer FXm is cut by the cutting device 184 after the layer FXm is attached to the optical display member P. Therefore, in the following description, the cutting process of the layer sheet FXm will be mainly described. The components that are the same as those in the first embodiment are denoted by the same reference numerals, and the detailed description thereof will be omitted.

The cross-sectional structure of the layer FXm is the same as that of the layer F1X shown in FIG. The layer FXm is obtained by cutting a long optical component layer FX as shown in FIG. 1 at a specific size. For example, the layer FXm is larger than the size of the outer size of the optical display part P (the size of the first area FB). The above-mentioned "corresponding to the size of the outer dimensions of the optical display member P" means that the size of the remaining portion which is problematic in actual use does not occur when bonded to the optical display member P. Since the layer FXm is larger in size corresponding to the outer shape of the optical display member P, the remaining portion (second region FS) which is problematic in practical use is cut by the cutting device 184.

The bonding apparatus for bonding the layer FXm to the optical display member P is the same as the bonding apparatus 100 described in the first embodiment. In the present embodiment, the detecting device 189 and the cutting device 184 are provided on the conveying line on the downstream side of the bonding apparatus.

The detecting device 189 includes an imaging device 183 that captures an optical display member P to which the layer sheet FXm is attached. The detecting device 189 detects the cutting line WCL of the layer sheet FXm (the position at which the layer sheet FXm should be cut) based on the image data of the image capturing device 183.

For example, the imaging device 183 photographs the optical display member P from above the optical display member P placed on the cutting platform 185 over the layer FXm. For example, the imaging device 183 captures images of the four corners of the substrate (for example, the color filter substrate) to which the optical display member P of the layer FXm is attached. For example, the detecting device 189 image-processes the photographed material to detect the position of the outer peripheral edge of the substrate, and detects the position of the peripheral edge of the cut line WCL as the layer FXm.

The information of the cutting line WCL detected by the detecting device 189 is sent to the control device 190. The control device 190 controls the cutting device 184 based on the information of the cutting line WCL conveyed from the detecting device 189, and cuts the layer FXm along the cutting line WCL. Thereby, the first region FB opposed to the display region of the layer FXm and the second region FS outside the first region FB are cut out to cut out the optical component FO which is a predetermined size from the layer FXm.

The cutting line WCL of the layer FXm is a cutting line WCL detected by each of the optical display members P transported on the transport line. Thereby, even if the optical display member P has a dimensional deviation, the optical component FO corresponding to the outer size of the optical display member P can be surely cut out from the layer FXm.

In the present specification, a method in which the remaining portion of the layer FXm is cut based on the photographing material of the optical display member P is referred to as a "window type" after the layer FXm having a larger optical component FO of a predetermined size is attached to the optical display member P. Cutting method". In the present embodiment, the optical component FO of the target size is bonded to the target position of the optical display member P by the window type cutting method. By adopting the window type cutting method, the following effects are obtained.

(i) In the case where the optical component is bonded to the optical display component P, the dimensional deviation of the optical display component P and the optical component FO and the alignment deviation (positional offset) with respect to the optical component FO of the optical display component P are considered. ), etc., it is necessary to attach a larger optical component FO to the optical display component P. However, in this method, an additional area (frame area) which does not function is formed in the peripheral portion of the display region displayed on the optical display member P, which hinders the miniaturization of the machine. In the case of the window type cutting method, the optical display unit P after the bonding layer FXm is imaged, and the layer FXm is cut based on the image data, so that the optical element FO having a predetermined size can be reliably disposed as the designated position.

(ii) The direction of the optical axis of the layer FXm may be shifted from the original design direction due to manufacturing errors. In this case, the optical axis direction of the prepared layer sheet FXm (optical element layer FX) is measured in advance, and based on the measurement result, it is preferable to adjust the relative bonding position of the layer sheet FXm and the optical display member P, but if the layer is FXm The size is the same as the size of the specified optical component FO, and such adjustment cannot be made. In the window type cutting method, the layer FXm larger than the optical unit FO is bonded to the optical display unit P, and since the remaining portion of the layer sheet FXm is cut after this, such adjustment can be performed.

For example, the bonding position (relative bonding position) with respect to the layer FXm of the optical display member P can be determined as described below.

First, as shown in FIG. 7A, a plurality of checkpoints CP are set in the width direction of the optical component layer FX, and the direction of the optical axis of the optical component layer FX is detected at each of the inspection points CP. The timing of detecting the optical axis may be a period in which the roll drum RX (see FIG. 1) is manufactured, or may be rolled out from the roll drum RX until the half is cut. The optical axis direction of the optical component layer FX is combined with the position of the optical component layer FX in the longitudinal direction and the position in the width direction, and then stored in a memory device not shown.

The control device 190 acquires the optical axis data (inspection data of the in-plane distribution of the optical axis) of each of the inspection points CP from the memory device, and detects the optical component layer FX of the portion where the layer FXm is cut out (by the cutting line CL) The direction of the average optical axis of the area).

For example, as shown in FIG. 7B, the angle (offset angle) of the optical axis direction and the edge line EL of the layer FXm is detected at each check point CP, and the maximum angle (maximum offset angle) among the offset angles When θmax and the minimum angle (minimum offset angle) are θmin, the average 値θmid (=(θmax+θmin)/2) of the maximum offset angle θmax and the minimum offset angle θmin is detected as the average offset angle. Then, the average offset angle θmid direction with respect to the edge line EL of the layer sheet FXm is detected as the average optical axis direction of the layer sheet FXm. Further, for example, the offset angle is calculated by a positive angle in the counterclockwise direction with respect to the edge line EL of the layer FXm and a negative angle in the clockwise direction.

Then, the bonding position (relative bonding position) with respect to the layer FXm of the optical display member P is determined by the average optical axis direction of the optical component layer FX detected by the above method, so that the display with respect to the optical display member P is made. One side of the area P4 is at a target angle. For example, in the case where the optical axis direction of the optical component is set to a direction of 90° with respect to one side of the display region P4 by design specifications, the average optical axis direction of the optical component layer FX is relative to one side of the display region P4. The layer sheet FXm was bonded to the optical display member P at 90°.

After that, the cutting line WCL of the layer sheet FXm is detected by the detecting means 189 as shown in (a) of FIG. 6, by the cutting means 184 as shown in (b) of FIG. 6, The layer FXm is cut along the cutting line WCL. Thereby, the optical component FO precisely controlling the optical axis direction is disposed at the target size and the target position. Thereby, it is possible to provide an optical display device DP having a narrow frame edge excellent in display quality.

Fig. 8 is a schematic view showing a production system 2000 of an optical display device according to a second embodiment of the present invention. The production system 2000 is a production system using a window type cutting method. In the bonding apparatus in which the optical display member P is bonded to a layer larger than the optical unit, the production system 2000 includes the bonding apparatus 100 described in the first embodiment.

The production system 2000 of the present embodiment includes a cleaning device 2001, a first bonding device 2002, a first cutting device 2003, a second bonding device 2004, a second cutting device 2005, a peeling device 2006, and a third sticker. The device 2007, the third cutting device 2008, and the inspection device 2009. Washing device 2001, first bonding device 2002, first cutting device 2003, second bonding device 2004, second cutting device 2005, peeling device 2006, third bonding device 2007, third cutting device 2008 The inspection device 2009 is disposed in a series of transport lines that transport the optical display unit P.

The cleaning device 2001, the first bonding device 2002, the second bonding device 2004, the peeling device 2006, the third bonding device 2007, and the inspection device 2009 each have the first bonding device with the cleaning device 1001 of the first embodiment. The device 1002, the second bonding device 1003, the peeling device 1004, the third bonding device 1005, and the inspection device 1006 have the same configuration. However, in the first bonding apparatus 2002, the second bonding apparatus 2004, and the third bonding apparatus 2007, a layer larger than an optical component of a predetermined size is attached to the optical display part P.

The first cutting device 2003, the second cutting device 2005, and the third cutting device 2008 have the same configuration as the above-described cutting device 184 and detecting device 189. In other words, in the first cutting device 2003, the second cutting device 2005, and the third cutting device 2008, an optical display member P to which a layer FXm larger than a predetermined size is attached is used. After the shooting, the window cut mode of the remaining portion of the layer is cut based on the photographing data. Thereby, it is possible to provide an optical display device DP having a narrow frame edge excellent in display quality.

Although the preferred embodiments of the present invention have been described above with reference to the attached drawings, the present invention is not limited to the examples of the present invention. The various shapes, combinations, and the like of the respective constituent elements shown in the above-described examples are merely examples, and various changes based on design requirements and the like are possible without departing from the gist of the invention. For example, in the above-described embodiment, the bonding head 120 has an arcuate holding surface 122a, but the configuration of the bonding head 120 is not limited thereto. The bonding head 120 may have a curved shape holding surface other than the circular arc, or may have a cylindrical holding surface. [Industrial use possibilities]

According to the bonding apparatus, the bonding method, the production system of the optical display device, and the production method of the optical display device of the present invention, it is possible to provide a bonding apparatus, a bonding method, and an optical method capable of suppressing generation of bubbles when transferring a layer sheet. A production system of a display device and a production method of the optical display device.

100‧‧‧Fitting device
110‧‧‧layer conveyor
111‧‧‧Devolution
112‧‧‧Winding Department
113‧‧‧ pinch roller
113a‧‧‧First pinch roller
113b‧‧‧Second pinch roller
114‧‧‧ platform
115‧‧‧cutting department
120‧‧‧Fitting head
121‧‧‧ head body
122‧‧‧Adhesive layer
122a‧‧‧ Keep face
130‧‧‧ head drive
135‧‧‧floor
136‧‧‧Rotary Drive Department
136a‧‧‧Rotary retention shaft
137‧‧‧ pole
140‧‧‧Head lifting device
141‧‧‧ Lifting and Driving Department
142‧‧‧ Rod
150‧‧‧ head unit
160‧‧‧ head moving device
161‧‧‧ guided orbit
162‧‧‧Sliding parts
170‧‧‧ platform unit
171‧‧‧Melt platform
171a‧‧‧Loading surface
172‧‧‧ platform drive
173‧‧‧ cover
181‧‧‧ first camera
182‧‧‧Second camera
183‧‧‧Photographing device
184‧‧‧cutting device
185‧‧‧ cut off the platform
189‧‧‧Detection device
190‧‧‧Control device
1000‧‧‧Production System
1001‧‧‧cleaning device
1002‧‧‧First bonding device
1003‧‧‧Second fitting device
1004‧‧‧ peeling device
1005‧‧‧ Third bonding device
1006‧‧‧Checking device
2000‧‧‧Production System
2001‧‧‧cleaning device
2002‧‧‧First bonding device
2003‧‧‧First cutting device
2004‧‧‧Second fitting device
2005‧‧‧Second cutting device
2006‧‧‧ peeling device
2007‧‧‧ Third bonding device
2008‧‧‧ Third cutting device
2009‧‧‧Inspection device
AFD‧‧‧ direction of rotation
CL‧‧‧ cutting line
CP‧‧‧ checkpoint
DP‧‧‧Optical display device
EL‧‧‧ edge line
F1a‧‧‧Optical component body
F1X‧‧‧ layer
F2a‧‧‧Adhesive layer
F3a‧‧‧Separation layer
F4a‧‧‧Surface protection film
F5‧‧‧Fitting layer
F6‧‧‧ polarizer
F7‧‧‧ first film
F8‧‧‧second film
FB‧‧‧ first area
FO‧‧‧Optical components
FS‧‧‧Second area
FX‧‧‧ optical component layer
FXm‧‧‧ layer
P‧‧‧Optical display parts
P4‧‧‧ display area
RX‧‧‧ Roller
WCL‧‧‧ cut line θmax‧‧‧maximum offset angle θmid‧‧‧minimum offset angle θmin‧‧‧average offset angle

Fig. 1 is a schematic view showing a bonding apparatus according to a first embodiment of the present invention. Fig. 2A is a view showing a process of attaching a layer to a bonding head. [Fig. 2B] Fig. 2B is a view showing a process of attaching a sheet to a head. [Fig. 2C] A view showing a process of attaching a sheet to a head. Fig. 3A is a view showing a process of transferring a layer attached to a bonding head to an optical display member. Fig. 3B is a view showing a process of transferring a layer attached to a bonding head to an optical display member. Fig. 3C is a view showing a process of transferring a layer attached to a bonding head to an optical display member. [Fig. 4] A cross-sectional view showing a layer of an optical component. Fig. 5 is a schematic view showing a production system of an optical display device according to a first embodiment of the present invention. Fig. 6 is a view showing a cutting process of a ply in the bonding apparatus according to the second embodiment of the present invention. Fig. 7A is a view for explaining a method of determining a bonding position of an optical display member and a layer. Fig. 7B is a view for explaining a method of determining a bonding position of an optical display member and a layer. Fig. 8 is a schematic view showing a production system of an optical display device according to a second embodiment of the present invention.

100‧‧‧Fitting device

110‧‧‧layer conveyor

111‧‧‧Devolution

112‧‧‧Winding Department

113‧‧‧ pinch roller

113a‧‧‧First pinch roller

113b‧‧‧Second pinch roller

114‧‧‧ platform

115‧‧‧cutting department

120‧‧‧Fitting head

121‧‧‧ head body

122‧‧‧Adhesive layer

122a‧‧‧ Keep face

130‧‧‧ head drive

135‧‧‧floor

136‧‧‧Rotary Drive Department

136a‧‧‧Rotary retention shaft

137‧‧‧ pole

140‧‧‧Head lifting device

141‧‧‧ Lifting and Driving Department

142‧‧‧ Rod

150‧‧‧ head unit

160‧‧‧ head moving device

161‧‧‧ guided orbit

162‧‧‧Sliding parts

1711‧‧‧ platform unit

171‧‧‧Melt platform

171a‧‧‧Loading surface

172‧‧‧ platform drive

173‧‧‧ cover

190‧‧‧Control device

AFD‧‧‧ direction of rotation

F1X‧‧‧ layer

F3a‧‧‧Separation layer

FX‧‧‧ optical component layer

P‧‧‧Optical display parts

RX‧‧‧ Roller

Claims (10)

A bonding device is a bonding device for bonding a layer to an optical display member, comprising: a winding portion for winding an optical component layer together from a roll roller and a separation layer; a cutting portion, the optical component layer Residually separating the separation layer to form the layer; a layer platform supporting the layer from the side of the separation layer; a bonding platform on which the optical display member is placed; and a bonding head for resting on the platform The upper layer is pressed along the curved surface while pressing the curved holding surface, and the layer is peeled off from the separation layer and held on the holding surface, and is held on the holding surface. The plies are attached to an optical display component that is placed on the lamination platform. The bonding device of claim 1, further comprising: a winding portion, after the bonding head peels the layer from the separating layer, the winding is turned into a separate separating layer; wherein the winding portion is The bonding head rotates the separation layer in the winding direction during the first period of the moment when the holding surface is pressed against the layer and starts to rotate. After the first period, the winding portion ends to the rotation. In the second period, the separation layer is rotated in the winding direction. The bonding device according to claim 1 or 2, further comprising: a cover plate adjacent to the optical display member on the bonding platform; wherein the holding surface of the bonding head is pressed against the upper surface of the cover plate Thereafter, the layer held on the holding surface is bonded to the optical display member by continuously rotating on the upper surface of the cover and the upper surface of the optical display member. A production system for an optical display device is a production system for forming an optical display device by attaching an optical component to an optical display component, comprising: a bonding device, wherein the optical display component is bonded to a layer of the optical component; The bonding device is the bonding device according to any one of claims 1 to 3. A production system for an optical display device is a production system for forming an optical display device by bonding an optical component to an optical display component, comprising: a bonding device, wherein the optical display component is attached to a layer larger than the optical component; a device that photographs an optical display member to which the layer is attached, detects a cutting line of the layer based on the photographing material, and a cutting device that cuts and attaches to the optical display member along the cutting line And a laminating device for cutting the optical component from the ply; wherein the bonding device is the laminating device according to any one of claims 1 to 3. A bonding method is a bonding method for bonding an optical display member to a layer, comprising: a winding step of winding the optical component layer together from the roll roller and the separation layer; and cutting the optical component layer Residually separating the separation layer to form the layer; a supporting step of supporting the layer from the side of the separation layer by a layer platform; placing the optical display member on the bonding platform; and laminating a step of rotating the bonding head along the bending of the holding surface by pressing the curved holding surface on the layer resting on the layer platform, peeling the layer from the separation layer and holding the holding layer At the same time as the surface, the layer held on the holding surface is bonded to the optical display member placed on the bonding platform. The bonding method according to claim 6, further comprising: a winding step, after the layer is peeled off from the separation layer by the bonding head, and the winding portion is wound into a separate separation layer; wherein In the winding step, the winding portion rotates the separation layer in the winding direction during the first period of the moment when the bonding head presses the holding surface against the layer and starts to rotate. After the first period, The winding portion rotates the separation layer in the winding direction during the second period from the end of the rotation to the stop. The bonding method according to claim 6 or 7, further comprising: a cover plate adjacent to the optical display member on the bonding platform; wherein, in the bonding step, the holding surface of the bonding head is pressed After the upper surface of the cover, the bonding head is adhered to the optical display member by continuously rotating on the upper surface of the cover and the upper surface of the optical display member. A method for producing an optical display device is a method for producing an optical display device by attaching an optical component to an optical display component, comprising: a bonding step of bonding the optical display component to a layer of the optical component; This bonding step is carried out using the bonding method as described in any one of claims 6 to 8. A method for producing an optical display device, which is a method for producing an optical display device by bonding an optical component to an optical display component, comprising: a bonding step of bonding a layer larger than the optical component to the optical display component; a step of photographing an optical display member to which the layer is attached, detecting a cutting line of the layer based on the photographing material; and cutting a step of cutting the optical display member by cutting along the cutting line And laminating the optical component from the ply; wherein the laminating step is performed using the laminating method according to any one of claims 6 to 8.