TWI655765B - Microled display panel - Google Patents

Abstract

A micro-light-emitting diode display panel includes a substrate for carrying a plurality of micro-light-emitting diodes, the surface of the substrate is divided into a plurality of sub-regions, and a plurality of drivers are respectively disposed on surfaces of the sub-regions. In an embodiment, the top surface of the substrate has a recess for receiving the driver.

Description

Micro LED display panel

The present invention relates to a display panel, and more particularly to a micro LED display panel.

The micro-light emitting diode (microLED, mLED or μLED) display panel is a type of flat panel display composed of individual microscopic light-emitting diodes of a size scale of 1 to 10 micrometers. Compared with the conventional liquid crystal display panel, the micro-light-emitting diode display panel has a large contrast ratio and a fast response time, and consumes less power. Although the micro-light-emitting diode and the organic light-emitting diode (OLED) also have low power consumption characteristics, the micro-light-emitting diode uses three-five-group diode technology (for example, gallium nitride), so The organic light-emitting diode has higher brightness, higher luminous efficacy and longer lifetime.

The active driving method using a thin film transistor (TFT) is a commonly used driving mechanism that can be combined with a micro light emitting diode to manufacture a display panel. However, the thin film transistor uses a complementary metal oxide semiconductor (CMOS) process, and the micro light emitting diode uses a flip chip technique, which causes thermal mismatch problems and a thin film. The process of the transistor is complicated. In the low gray scale display, since the driving current is small, the leakage current of the micro light emitting diode is affected to affect the gray scale display.

Passive drive is another drive mechanism. A conventional passive drive display panel has a column drive circuit and a row drive circuit disposed at an edge of the display panel. However, when the size of the display panel becomes large or the resolution becomes high, the output load of the driver is excessively large, and an excessively long delay time causes the display panel to be unable to drive normally. Therefore, the passive driving mechanism cannot be applied to a large-sized micro-light emitting diode display panel.

Therefore, there is a need to propose a novel micro-light-emitting diode display panel, particularly a large-sized or high-resolution display panel, which retains the advantages of the micro-light-emitting diode and can improve the disadvantages of the conventional driving mechanism.

In view of the above, one of the objects of the embodiments of the present invention is to provide a micro-light emitting diode display panel, which effectively reduces the load of the driver to realize a single large-size high-resolution micro-light-emitting diode display panel. In one embodiment, the passive driving method is adopted, which can simplify the manufacturing process of the display panel, shorten the opening time of the micro light emitting diode, improve the driving current, and effectively reduce the influence of the leakage current on the gray scale display of the micro light emitting diode.

According to an embodiment of the invention, the micro-light-emitting diode display panel comprises a plurality of micro-light emitting diodes, a substrate and a plurality of drivers. The substrate is used to carry the micro-light emitting diodes, and the surface of the substrate is divided into a plurality of sub-regions. The drivers are respectively disposed on the surfaces of the sub-regions. In an embodiment, the micro-light emitting diodes use a passive driving method. The driver comprises a row driving circuit, and the row driving wire is connected to and transmits the row driving signal to the first electrode of the same row of the micro light emitting diode; and the column driving circuit is connected by the column wires and transmits the column driving signal to the same column of the micro light emitting diode The second electrode of the polar body.

According to another embodiment of the present invention, a micro light emitting diode display panel includes a plurality of micro light emitting diodes, at least one integrated circuit, and a substrate. The substrate carries the micro-light emitting diodes and the integrated circuit, and the top surface of the substrate has a recessed portion for accommodating the integrated circuit.

1A shows a top view of a micro LED display panel 100 according to an embodiment of the present invention, and FIG. 1B shows a side view of the micro LED display panel 100 of FIG. The architecture of the micro-light-emitting diode display panel 100 of the present embodiment is preferably applied to a large-sized high-resolution display panel, such as a display panel having a resolution of 3840 RGB x 2160. In the present specification, the micro-light emitting diode has a size rating of 1 to 10 μm. However, it will be smaller due to the application field of the product or the development of future technologies. In the present specification, the "large size" display panel is defined as a display panel of 10 inches or more according to the current industry practice. However, the definition of a "large size" display panel may vary depending on the application area of the product or the future development of the technology. In the present specification, the "high-resolution" display panel is defined as a display panel of 1080 or more scanning lines according to the current industry practice. However, the definition of a "high-resolution" display panel will also change depending on the application area of the product or the future development of the technology.

In the embodiment, the micro-light-emitting diode display panel 100 includes a substrate 11 for carrying a plurality of micro-light-emitting diodes (not shown). The material of the substrate 11 is preferably an insulator (for example, glass or acryl), and may be other materials suitable for carrying the micro-light emitting diode.

According to one of the features of the embodiment, the surface of the substrate 11 is divided into a plurality of sub-regions 101. The divided sub-regions 101 are not physically cut, and the substrate 11 is not formed by integrating a plurality of cell blocks, so the substrate 11 is a complete uncut entity. In other words, the micro-light-emitting diode display panel 100 of the present embodiment is a single (single or whole) or uncut display panel. The first A diagram shows only a simplified example of the sub-region 101 division. Taking the micro-light-emitting diode display panel 100 with a resolution of 3840 RGB x 2160 as an example, the substrate 11 can be divided into 80×54 sub-regions 101, and the resolution of each region 101 is 48 RGB×40, but can also be divided into more or less sub-regions. 101.

According to another feature of the present embodiment, the micro-light-emitting diode display panel 100 includes a plurality of drivers 12 respectively disposed on surfaces (eg, top surfaces) of the sub-regions 101. The driver 12 shown in FIG. 1A is disposed at the center of the surface of the corresponding sub-region 101, but is not limited thereto. The first A diagram illustrates that each of the sub-regions 101 is provided with a driver 12. However, in other embodiments, each of the sub-regions 101 may be provided with a plurality of drivers 12. The driver 12 of the present embodiment can be fabricated as an integrated circuit in the form of a wafer, and the driver 12 is bonded by surface mount technology (SMT), such as chip-on-glass (COG) or flip chip technology. Bonded to the surface of the sub-region 101. In one example, the driver 12 and the micro-light emitting diode system are disposed on the same surface of the sub-region 101 of the substrate 11.

The micro-light-emitting diode display panel 100 of the present embodiment further includes a complex timing controller (TCON) 13 that can be electrically connected to the substrate 11 by wires (for example, a flexible circuit board, not shown in the drawings), and then A trace (not shown) on the surface of the substrate 11 is electrically connected to the corresponding driver 12. In this embodiment, a timing controller 13 can be electrically connected to at least two drivers 12. In other words, the number of timing controllers 13 is less than the number of drivers 12. The timing controller 13 can be directly connected to the corresponding driver 12 by a trace; or can be connected to a driver 12 by a trace, buffered by a signal, and then connected to another driver 12 by a trace.

According to still another feature of the embodiment, the micro-light-emitting diode display panel 100 adopts a passive driving manner to drive the micro-light emitting diode. The second figure shows a schematic diagram of the passively driven micro-light emitting diode display panel 100. The timing controller 13 transmits a timing control signal and a display data signal to the driver 12. The driver 12 includes a column driving circuit 121 and a row or scan driving circuit 122. The row driving circuit 121 is connected by the row wiring 1211 and transmits the row driving signal to the first electrode of the same row of the micro-light emitting diodes 14. (e.g., the anode), the column driver circuit 122 connects and transmits the column drive signals to the second electrode (e.g., the cathode) of the same column of micro-light-emitting diodes 14 by the column conductors 1221. In the present embodiment, the row driving circuit 121 and the column driving circuit 122 are fabricated as a single integrated circuit.

According to the above embodiment, since the substrate 11 of the micro-light-emitting diode display panel 100 is divided into the plurality of sub-regions 101, each of the regions 101 is provided with a corresponding driver 12, so that the load of the row driving circuit 121 and the column driving circuit 122 can be effectively reduced. To achieve a single large-size high-resolution micro-light-emitting diode display panel. In addition, the micro-light-emitting diode display panel 100 of the present embodiment can drive the micro-light-emitting diode 14 by using a passive driving method, so that the process of the display panel can be simplified, as compared with the active driving method using a thin film transistor (TFT). The turn-on time of the micro-light-emitting diode 14 is shortened, the driving current is increased, and the influence of the leakage current on the gray-scale display of the micro-light-emitting diode 14 is effectively reduced.

The third figure shows a cross-sectional view of a frontside illuminating micro-light emitting diode display panel 300 in accordance with a first particular embodiment of the present invention. In the present embodiment, the micro-light emitting diode 14 and the driver 12 are disposed on the top surface of the substrate 11. The light generated by the micro-light-emitting diode 14 mainly emits light from the top surface of the substrate 11 (i.e., the front side emits light) as indicated by an arrow.

As illustrated in the third figure, each pixel includes a red micro-light emitting diode 14R, a green micro-light emitting diode 14G, and a blue micro-light emitting diode 14B. A wiring layer 15 is disposed between the surface (for example, the top surface) of the substrate 11 and the micro-light-emitting diode 14 and the driver 12 for electrically connecting the driver 12, the micro-light-emitting diode 14 and the timing controller 13. Between the micro-light-emitting diodes 14 of adjacent pixels, a light blocking layer 16 is formed above the wiring layer 15. The material of the light blocking layer 16 of this embodiment may be a black matrix (BM) or other suitable material that can shield light. In an embodiment, the light blocking layer 16 may be formed between the red micro-light emitting diode 14R, the green micro light emitting diode 14G, and the blue micro light emitting diode 14B of the same pixel, but it is not necessarily formed.

A light guiding layer 17 may be further disposed on the red micro-light emitting diode 14R, the green micro light emitting diode 14G, and the blue micro light emitting diode 14B. The front-illuminated micro-light-emitting diode display panel 300 of the present embodiment further includes a cover plate 18 disposed on the bottom surface of the substrate 11. The material of the cover plate 18 of this embodiment may be an opaque material.

The fourth figure shows a cross-sectional view of a backside illuminating micro-light emitting diode display panel 400 of a second specific embodiment of the present invention. In the present embodiment, the micro-light emitting diode 14 and the driver 12 are disposed on the top surface of the substrate 11. The light generated by the micro-light-emitting diode 14 mainly emits light downward from the back surface of the substrate 11 (i.e., the back surface emits light) as indicated by an arrow.

As illustrated in the fourth figure, each pixel includes a red micro-light emitting diode 14R, a green micro-light emitting diode 14G, and a blue micro-light emitting diode 14B. Between the micro-light-emitting diodes 14 of adjacent pixels, a light blocking layer 16 is formed on the surface (for example, the top surface) of the substrate 11. The material of the light blocking layer 16 of this embodiment may be a black matrix (BM) or other suitable material that can shield light. A wiring layer 15 is disposed above the light blocking layer 16 for electrically connecting the driver 12, the micro LED 14 and the timing controller 13. In an embodiment, the light blocking layer 16 may be formed between the red micro-light emitting diode 14R, the green micro light emitting diode 14G, and the blue micro light emitting diode 14B of the same pixel, but it is not necessarily formed.

A light guiding layer 17 may be further disposed on the red micro-light emitting diode 14R, the green micro light emitting diode 14G, and the blue micro light emitting diode 14B. The back-illuminated micro-light-emitting diode display panel 400 of the present embodiment further includes a cover plate 18 disposed above the driver 12, the wiring layer 15, the light blocking layer 16, and the light guiding layer 17. The material of the cover plate 18 of this embodiment may be an opaque material.

The fifth figure shows a partially enlarged side view of the substrate 11, the driver 12 and the micro-light-emitting diode 14, wherein the driver 12 and the micro-light-emitting diode 14 are disposed on the top surface of the substrate 11. In general, the height of the integrated circuit (e.g., driver 12) is much higher than the height of the micro-light emitting diode 14. For example, the height of the driver 12 is 150 micrometers, the height of the micro-light-emitting diode 14 is 10 micrometers, and the height of the substrate 11 is 500-1100 micrometers. Since the heights of the driver 12 and the micro-light-emitting diodes 14 are greatly different (for example, ten times or more), the light emitted from the top surface of the substrate 11 by the micro-light-emitting diodes 14 (as indicated by an arrow) is adjacent. The driver 12 blocks, thereby reducing the light intensity at certain viewing angles. In order to solve this problem, the present invention therefore proposes the following embodiments.

Fig. 6A is a partially enlarged side elevational view showing the micro-light emitting diode display panel of the first embodiment of the present invention. In the present embodiment, the top surface of the substrate 11 has a recess 110 for accommodating an integrated circuit (for example, the driver 12). In the present embodiment, the sum of the depth d1 of the depressed portion 110 and the height of the micro-light emitting diode 14 is equal to the height of the driver 12. Therefore, the top surface of the driver 12 is at the same level as the top surface of the micro-light-emitting diode 14. Compared with the micro-light-emitting diode display panel of the fifth embodiment, the light emitted by the micro-light-emitting diode 14 of the present embodiment is not blocked by the adjacent driver 12.

Fig. 6B is a partially enlarged side elevational view showing the micro-light emitting diode display panel of the second embodiment of the present invention. In the present embodiment, the top surface of the substrate 11 has a recess 110 for accommodating an integrated circuit (for example, the driver 12). In the present embodiment, the depth d2 of the recessed portion 110 is greater than the height of the driver 12. Therefore, the level of the top surface of the driver 12 is lower than the top surface of the micro-light-emitting diode 14. Compared with the micro-light-emitting diode display panel of the fifth embodiment, the light emitted by the micro-light-emitting diode 14 of the present embodiment is not blocked by the adjacent driver 12.

Fig. 6C is a partially enlarged side elevational view showing the micro-light emitting diode display panel of the third embodiment of the present invention. In the present embodiment, the top surface of the substrate 11 has a recess 110 for accommodating an integrated circuit (for example, the driver 12). In the present embodiment, the sum of the depth d3 of the depressed portion 110 and the height of the micro-light emitting diode 14 is smaller than the height of the driver 12. Therefore, the level of the top surface of the driver 12 is higher than the top surface of the micro-light-emitting diode 14. Compared with the micro-light-emitting diode display panel of the fifth embodiment, the light emitted by the micro-light-emitting diode 14 of the present embodiment is greatly improved by the degree of blocking by the adjacent driver 12.

According to the above embodiment, the designer can respectively form the recesses 110 of different depths according to the heights of the integrated circuits for respectively accommodating the integrated circuits of different heights. The designer can also form a groove having a recess according to the maximum height of the complex integrated circuit to accommodate the integrated circuits at the same time.

The above description is only the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention; all other equivalent changes or modifications which are not departing from the spirit of the invention should be included in the following Within the scope of the patent application.

100‧‧‧Micro LED display panel

101‧‧‧ subregion

300‧‧‧Front-emitting micro-light emitting diode display panel

400‧‧‧Backlight-emitting micro-light emitting diode display panel

11‧‧‧Substrate

12‧‧‧ Drive

121‧‧‧ row drive circuit

1211‧‧‧ wire

122‧‧‧ column drive circuit

1221‧‧‧ column conductor

13‧‧‧Timing controller

14‧‧‧microluminescent diode

14R‧‧‧Red micro-light emitting diode

14G‧‧‧Green micro-light emitting diode

14B‧‧‧Blue micro-light emitting diode

15‧‧‧Line layer

16‧‧‧Light blocking layer

17‧‧‧Light guide layer

18‧‧‧ cover

110‧‧‧Depression

D1‧‧ depth

D2‧‧ depth

D3‧‧ depth

FIG. 1A is a plan view showing a micro-light emitting diode display panel according to an embodiment of the present invention. The first B-picture shows a side view of the micro-light-emitting diode display panel of the first A-picture. The second figure shows a schematic diagram of a passively driven micro-light emitting diode display panel. The third figure shows a cross-sectional view of a front-illuminated micro-light-emitting diode display panel in accordance with a first specific embodiment of the present invention. The fourth figure shows a cross-sectional view of a back-illuminated micro-light emitting diode display panel in accordance with a second specific embodiment of the present invention. The fifth figure shows a partial enlarged side view of the substrate 11, the driver 12, and the micro-light emitting diode 14. Fig. 6A is a partially enlarged side elevational view showing the micro-light emitting diode display panel of the first embodiment of the present invention. Fig. 6B is a partially enlarged side elevational view showing the micro-light emitting diode display panel of the second embodiment of the present invention. Fig. 6C is a partially enlarged side elevational view showing the micro-light emitting diode display panel of the third embodiment of the present invention.

Claims (28)

A micro-light-emitting diode display panel comprising: a plurality of micro-light-emitting diodes; a substrate for carrying the micro-light-emitting diodes, the surface of the substrate is divided into a plurality of sub-regions; and a plurality of drivers respectively disposed at the a surface of the sub-region; wherein a top surface of the substrate has a recess portion for receiving the driver; wherein the micro-light emitting diodes are disposed on a surface of the substrate outside the recess portion, and a configuration surface of the drivers is lower than The arrangement surface of the micro-light emitting diodes. The micro-light-emitting diode display panel according to claim 1, wherein the material of the substrate comprises an insulator. The micro-light-emitting diode display panel according to claim 2, wherein the material of the substrate comprises glass. The micro-light-emitting diode display panel of claim 1, wherein each of the drivers is disposed at a central position of a surface of the corresponding sub-region. The micro-light emitting diode display panel of claim 1, wherein the drivers are bonded to surfaces of the sub-regions by wafer glass bonding techniques. The micro-light emitting diode display panel of claim 1, wherein the drivers and the micro-light emitting diodes are disposed on the same surface of the substrate. The micro-light-emitting diode display panel according to claim 1 further includes a plurality of timing controllers electrically connected to the substrate and electrically connected to the corresponding drivers. The micro-light-emitting diode display panel of claim 7, wherein each of the timing controllers is electrically connected to at least two of the drivers. The micro-light-emitting diode display panel according to claim 1, wherein the micro-light-emitting diodes use a passive driving method. The micro-light-emitting diode display panel of claim 9, wherein the driver comprises: a row driving circuit, wherein the row driving wires are connected and the row driving signals are transmitted to the first electrode of the same row of micro-light emitting diodes; And the column driving circuit connects and transmits the column driving signals to the second electrodes of the same column of the micro-light emitting diodes by the column wires. The micro-light-emitting diode display panel of claim 1, wherein the micro-light-emitting diodes and the drivers are disposed on a top surface of the substrate. The micro-light-emitting diode display panel of claim 11, further comprising a light guiding layer disposed above the micro-light emitting diodes. The micro-light-emitting diode display panel of claim 11, further comprising a cover plate disposed on a bottom surface of the substrate, such that the light generated by the micro-light-emitting diodes is mainly from the top surface of the substrate Glowing. The micro-light-emitting diode display panel of claim 13 further comprising: a trace layer disposed on a top surface of the substrate; and a light blocking layer disposed above the trace layer. The micro-light-emitting diode display panel according to claim 14, wherein the light-blocking layer is disposed between the micro-light-emitting diodes of adjacent pixels and located above the wiring layer. The micro-light-emitting diode display panel of claim 14, wherein the light-blocking layer is disposed in a pixel of a red micro-light emitting diode, a green micro-light emitting diode, and a blue micro-light emitting diode. between. The micro-light-emitting diode display panel of claim 11, further comprising a cover plate disposed above the micro-light-emitting diodes and the drivers, so that the light generated by the micro-light-emitting diodes It mainly emits light downward from the bottom surface of the substrate. The micro-light-emitting diode display panel of claim 17, further comprising: a light blocking layer disposed on a top surface of the substrate; and a trace layer disposed above the light blocking layer . The micro-light-emitting diode display panel according to claim 18, wherein the light-blocking layer is disposed between the micro-light-emitting diodes of adjacent pixels and located below the trace layer. The micro-light-emitting diode display panel according to claim 18, wherein the light blocking layer is disposed in the pixel, the red micro-light emitting diode, the green micro-light emitting diode and the blue micro-light emitting diode. between. The micro-light emitting diode display panel according to claim 1, wherein a sum of a depth of the recess and a height of the micro-light emitting diode is equal to a height of the driver. The micro-light-emitting diode display panel according to claim 1, wherein a sum of a depth of the recess and a height of the micro-light emitting diode is greater than a height of the driver. The micro-light-emitting diode display panel according to claim 1, wherein a sum of a depth of the recess and a height of the micro-light emitting diode is smaller than a height of the driver. A micro-light-emitting diode display panel comprising: a plurality of micro-light-emitting diodes; at least one integrated circuit; a substrate for carrying the micro-light-emitting diodes and the integrated circuit, the top surface of the substrate has a recess The micro-light-emitting diodes are disposed on the surface of the substrate outside the recess, and the arrangement surface of the integrated circuit is lower than the arrangement surface of the micro-light-emitting diodes. The micro-light-emitting diode display panel of claim 24, wherein the integrated circuit includes a driver. The micro-light-emitting diode display panel according to claim 24, wherein a sum of a depth of the depressed portion and a height of the micro-light emitting diode is equal to a height of the integrated circuit. The micro-light-emitting diode display panel according to claim 24, wherein a sum of a depth of the depressed portion and a height of the micro-light emitting diode is greater than a height of the integrated circuit. The micro-light-emitting diode display panel according to claim 24, wherein a sum of a depth of the depressed portion and a height of the micro-light emitting diode is smaller than a height of the integrated circuit.