TWI654481B - Exposure device - Google Patents
Exposure deviceInfo
- Publication number
- TWI654481B TWI654481B TW107125221A TW107125221A TWI654481B TW I654481 B TWI654481 B TW I654481B TW 107125221 A TW107125221 A TW 107125221A TW 107125221 A TW107125221 A TW 107125221A TW I654481 B TWI654481 B TW I654481B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- projection optical
- pattern
- optical systems
- rotating
- Prior art date
Links
- 230000002093 peripheral effect Effects 0.000 claims abstract description 20
- 230000003287 optical effect Effects 0.000 claims description 196
- 239000000758 substrate Substances 0.000 claims description 178
- 238000005286 illumination Methods 0.000 claims description 32
- 239000000463 material Substances 0.000 claims description 8
- 238000012545 processing Methods 0.000 description 53
- 238000012546 transfer Methods 0.000 description 21
- 238000000034 method Methods 0.000 description 14
- 238000010586 diagram Methods 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 10
- 238000011084 recovery Methods 0.000 description 10
- 239000010408 film Substances 0.000 description 8
- 238000004804 winding Methods 0.000 description 8
- 239000010410 layer Substances 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 210000001747 pupil Anatomy 0.000 description 6
- 239000000470 constituent Substances 0.000 description 5
- 238000013461 design Methods 0.000 description 4
- 239000003504 photosensitizing agent Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 238000005096 rolling process Methods 0.000 description 3
- 239000013545 self-assembled monolayer Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000005401 electroluminescence Methods 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- -1 polypropylene Polymers 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000001505 atmospheric-pressure chemical vapour deposition Methods 0.000 description 1
- 239000012461 cellulose resin Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 239000002094 self assembled monolayer Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/24—Curved surfaces
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Lenses (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP2012-050664 | 2012-03-07 | ||
| JP2012050664 | 2012-03-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201841048A TW201841048A (zh) | 2018-11-16 |
| TWI654481B true TWI654481B (zh) | 2019-03-21 |
Family
ID=49116794
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107125221A TWI654481B (zh) | 2012-03-07 | 2013-03-06 | Exposure device |
| TW102107797A TWI587077B (zh) | 2012-03-07 | 2013-03-06 | 光罩、光罩單元、曝光裝置、基板處理裝置、及元件製造方法 |
| TW106114290A TWI634382B (zh) | 2012-03-07 | 2013-03-06 | 圓筒型光罩製作方法、曝光方法、以及圖案形成方法 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102107797A TWI587077B (zh) | 2012-03-07 | 2013-03-06 | 光罩、光罩單元、曝光裝置、基板處理裝置、及元件製造方法 |
| TW106114290A TWI634382B (zh) | 2012-03-07 | 2013-03-06 | 圓筒型光罩製作方法、曝光方法、以及圖案形成方法 |
Country Status (3)
| Country | Link |
|---|---|
| JP (4) | JP6135664B2 (ja) |
| TW (3) | TWI654481B (ja) |
| WO (1) | WO2013133321A1 (ja) |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2546312B2 (ja) * | 1987-12-29 | 1996-10-23 | キヤノン株式会社 | 反射型マスクおよび該反射型マスクを用いた露光装置と露光方法 |
| JPH02160237A (ja) * | 1988-12-14 | 1990-06-20 | Nikon Corp | マスク基板及びマスク製造方法、並びに該マスク基板を用いた露光方法 |
| JPH08213305A (ja) * | 1995-02-08 | 1996-08-20 | Nippon Telegr & Teleph Corp <Ntt> | 荷電ビーム転写装置および転写方法 |
| JP3261960B2 (ja) * | 1995-12-15 | 2002-03-04 | キヤノン株式会社 | 走査型露光装置及びそれを用いたデバイス製造方法 |
| US5955776A (en) * | 1996-12-04 | 1999-09-21 | Ball Semiconductor, Inc. | Spherical shaped semiconductor integrated circuit |
| DE10005189A1 (de) * | 2000-02-05 | 2001-08-09 | Zeiss Carl | Projektionsbelichtungsanlage mit reflektivem Retikel |
| JP2001343589A (ja) * | 2000-03-31 | 2001-12-14 | Canon Inc | 投影光学系、および該投影光学系による投影露光装置、デバイス製造方法 |
| WO2003085457A1 (en) * | 2002-04-10 | 2003-10-16 | Fuji Photo Film Co., Ltd. | Exposure head, exposure apparatus, and its application |
| CN1307456C (zh) * | 2003-05-23 | 2007-03-28 | 佳能株式会社 | 投影光学系统、曝光装置及器件的制造方法 |
| JP4521539B2 (ja) * | 2004-05-18 | 2010-08-11 | 学校法人東京電機大学 | 露光方法 |
| JP2006093318A (ja) * | 2004-09-22 | 2006-04-06 | Tohoku Univ | Ｅｕｖ露光装置、ｅｕｖ露光方法及び反射型マスク |
| US20080204682A1 (en) * | 2005-06-28 | 2008-08-28 | Nikon Corporation | Exposure method and exposure apparatus, and device manufacturing method |
| JP2007227438A (ja) * | 2006-02-21 | 2007-09-06 | Nikon Corp | 露光装置及び方法並びに光露光用マスク |
| JP4984631B2 (ja) * | 2006-04-28 | 2012-07-25 | 株式会社ニコン | 露光装置及び方法、露光用マスク、並びにデバイス製造方法 |
| WO2008029917A1 (en) * | 2006-09-08 | 2008-03-13 | Nikon Corporation | Mask, exposure apparatus and device manufacturing method |
| JP5327046B2 (ja) * | 2007-04-17 | 2013-10-30 | 旭硝子株式会社 | Ｅｕｖマスクブランク |
| EP2219077A1 (en) * | 2009-02-12 | 2010-08-18 | Carl Zeiss SMT AG | Projection exposure method, projection exposure system and projection objective |
| CN102483580B (zh) * | 2009-08-20 | 2015-04-01 | 株式会社尼康 | 物体处理装置、曝光装置及曝光方法、以及元件制造方法 |
| US20110123913A1 (en) * | 2009-11-19 | 2011-05-26 | Nikon Corporation | Exposure apparatus, exposing method, and device fabricating method |
| JP2011203311A (ja) * | 2010-03-24 | 2011-10-13 | Nikon Corp | マスクホルダ、円筒型マスク、露光装置、基板処理装置及びデバイス製造方法 |
| JP2011221536A (ja) * | 2010-04-13 | 2011-11-04 | Nikon Corp | マスク移動装置、露光装置、基板処理装置及びデバイス製造方法 |
| JP5724564B2 (ja) * | 2010-04-13 | 2015-05-27 | 株式会社ニコン | マスクケース、マスクユニット、露光装置、基板処理装置及びデバイス製造方法 |
| JP5711810B2 (ja) * | 2010-05-18 | 2015-05-07 | エーエスエムエル ネザーランズ ビー．ブイ． | リソグラフィ装置及びデバイス製造方法 |
-
2013
- 2013-03-06 TW TW107125221A patent/TWI654481B/zh active
- 2013-03-06 WO PCT/JP2013/056145 patent/WO2013133321A1/ja not_active Ceased
- 2013-03-06 JP JP2014503882A patent/JP6135664B2/ja active Active
- 2013-03-06 TW TW102107797A patent/TWI587077B/zh active
- 2013-03-06 TW TW106114290A patent/TWI634382B/zh active
-
2016
- 2016-02-02 JP JP2016017951A patent/JP6048600B2/ja active Active
-
2017
- 2017-04-18 JP JP2017082093A patent/JP6369591B2/ja active Active
-
2018
- 2018-07-10 JP JP2018130360A patent/JP6562129B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2013133321A1 (ja) | 2013-09-12 |
| TWI634382B (zh) | 2018-09-01 |
| JP2017134422A (ja) | 2017-08-03 |
| TW201730666A (zh) | 2017-09-01 |
| TW201841048A (zh) | 2018-11-16 |
| JP6048600B2 (ja) | 2016-12-21 |
| JP6369591B2 (ja) | 2018-08-08 |
| JP6562129B2 (ja) | 2019-08-21 |
| JP2018159958A (ja) | 2018-10-11 |
| TWI587077B (zh) | 2017-06-11 |
| JP6135664B2 (ja) | 2017-05-31 |
| JP2016066105A (ja) | 2016-04-28 |
| TW201348855A (zh) | 2013-12-01 |
| JPWO2013133321A1 (ja) | 2015-07-30 |
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