TWI652731B - Stripping device and peeling method of laminated body, and manufacturing method of electronic component - Google Patents

Abstract

The present invention relates to a laminate peeling apparatus which is formed by laminating a first substrate and a second substrate, and the interface between the first substrate and the second substrate is oriented from one end side The peeling traveling direction of the other end side is sequentially peeled off, and includes: a support portion that supports the first substrate of the laminated body; and a peeling unit that includes a plate-shaped first flexible member and is detachable An adsorption unit that is disposed on the first flexible member and that adsorbs the second substrate of the laminate; and a driving unit that sequentially deflects the second substrate of the laminate from one end side toward the other end side The deformation means deforms the above-mentioned peeling unit.

Description

Stripping device and peeling method of laminated body, and manufacturing method of electronic component

The present invention relates to a peeling device and a peeling method of a laminate, and a method of manufacturing the electronic component.

In order to reduce the thickness and weight of electronic components such as a display panel, a solar cell, and a thin film secondary battery, it is desirable to use a thin plate for a substrate (first substrate) such as a glass plate, a resin plate, or a metal plate for the electronic components.

However, when the thickness of the substrate is reduced, the handleability of the substrate is deteriorated, so that it is difficult to form a functional layer for an electronic component on the front surface of the substrate (Thin Film Transistor (TFT), color filter (CF: Color Filter) )).

Therefore, it is proposed to attach a glass reinforcing plate (second substrate) to the back surface of the substrate, and to form a laminated body in which the reinforcing layer is used to reinforce the substrate, and to form a functional layer on the front surface of the substrate in the state of the laminated body. Production method. This manufacturing method improves the handleability of the substrate, so that the functional layer can be favorably formed on the front surface of the substrate. Moreover, the reinforcing plate is peeled off from the substrate after forming the functional layer.

The peeling method of the reinforcing plate disclosed in Patent Document 1 is such that the reinforcing plate or the substrate or both are oriented toward each other by one of the two corner portions on the diagonal line of the rectangular laminated body. The direction of separation is flexed and deformed. At this time, in order to smoothly perform the peeling, a peeling start portion is formed at one corner portion of the laminated body. The peeling start portion is produced by piercing the peeling blade into a specific amount from the end of the laminated body facing the interface between the substrate and the reinforcing plate.

The peeling device of Patent Document 1 includes a stage, a flexible member, a gasket, and the like by The substrate is adsorbed and held by the stage, and the reinforcing plate is sucked and held by the flexible member, and the flexible member is flexibly deformed from the other direction by the spacer, whereby the reinforcing plate is peeled off from the substrate.

The flexible member includes a rubber mounting portion (adsorption portion) and a predetermined portion defining a bending rigidity of the flexible member, and the groove portion of the mounting portion communicates with the through hole of the predetermined portion, and is pumped by a vacuum pump connected to the through hole. The suction plate is sucked and held at the mounting portion by suction.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] International Publication No. 2011/024689

In the peeling device of Patent Document 1, when the rubber-made mounting portion is deteriorated or the mounting portion is damaged due to use, it is not economical to replace it with the predetermined portion. When the predetermined portion is not to be replaced, the mounting portion must be cut from the predetermined portion, and the new mounting portion must be placed in the predetermined portion. This also causes a problem in that the replacement work takes time.

The present invention has been made in view of such a problem, and an object of the invention is to provide a peeling device, a peeling method, and a method for producing an electronic component of a laminate which is easy to replace an adsorption portion of a substrate on which a laminate is held.

In order to achieve the above object, the laminate device of the laminated body of the present invention is a laminate in which the first substrate and the second substrate are peelably attached, and the interface between the first substrate and the second substrate is along one end side. The first peeling unit supports the first substrate of the laminated body, and the peeling unit includes a plate-shaped first flexible member and a loading and unloading member, which is sequentially peeled toward the peeling traveling direction of the other end side. An adsorption unit that is provided on the first flexible member and that adsorbs the second substrate of the laminate; and a driving unit that sequentially slantes the second substrate of the laminate from one end side toward the other end side Curved deformation The above-described peeling unit is deformed.

In order to achieve the above object, the laminate method of the laminate of the present invention is a laminate in which the first substrate and the second substrate are peelably attached, and the interface between the first substrate and the second substrate is along one end side. The step of peeling off in the peeling traveling direction toward the other end side includes a support step of supporting the first substrate of the laminated body by a support portion, and an adsorption step of using a plate-like shape a flexible member, and a peeling unit that is detachably provided to the first flexible member and that adsorbs the adsorption portion of the second substrate of the laminate; and the second portion of the laminate is adsorbed by the adsorption portion In the substrate, and the peeling step, the peeling unit is deformed and peeled off at the interface so that the second substrate of the laminated body is sequentially flexed and deformed from one end side toward the other end side by the driving portion.

In order to achieve the above object, a method for producing an electronic component according to the present invention includes a functional layer forming step of laminating a first substrate and a second substrate, and an exposed surface of the first substrate Forming a functional layer; and separating the first substrate from the first substrate on which the functional layer is formed; and the method of manufacturing the electronic component is characterized in that the separating step includes a support step by supporting The first substrate supporting the laminated body, and the adsorption step of using the first flexible member including a plate shape and the first flexible member detachably attached to the first flexible member and adsorbing the laminated body a second peeling unit of the adsorption portion of the substrate, wherein the second substrate is adsorbed by the adsorption portion; and a peeling step of causing the second substrate of the laminate to face from one end side by a driving portion The other end side is deformed in a manner to deform the peeling unit to peel the second substrate from the first substrate.

According to the invention, since the adsorption portion is detachably provided to the first flexible member, when the adsorption portion is replaced, the adsorption portion is detached from the first flexible member, and the new adsorption portion is attached to the first flexible portion. Sexual components. Therefore, the replacement of the adsorption portion becomes easy. Moreover, the non-operating time for replacing the adsorption portion can be shortened.

Preferably, the support portion of the present invention has the same configuration as the peeling unit. In other words, in the above-described supporting step, the first substrate is supported by the support portion having the same configuration as the peeling unit in the adsorption step.

According to the configuration described above, the first substrate is adsorbed and held by the support portion having the same configuration as the peeling unit, and the first substrate and the second substrate are sequentially flexed and deformed from one end side toward the other end side, thereby causing the peeling unit and the peeling unit. The support portion is deformed to peel the first substrate from the second substrate. In this case, since the first substrate and the second substrate are simultaneously bent, the peeling force can be made smaller than in a form in which only one substrate is bent.

Preferably, the adsorption unit according to the present invention includes a plate-shaped second flexible member that is detachably provided to the first flexible member, and a gas permeable sheet that is provided in the second The other surface of the flexible member is vacuum-adsorbed to the inner surface of the second substrate; and the sealing frame member is provided on the other surface of the second flexible member so as to surround the gas permeable sheet, and The second substrate is in contact with the outer surface other than the inner surface.

According to the above configuration, when the inner surface of the second substrate is vacuum-adsorbed by the gas permeable sheet, the outer peripheral surface of the second substrate is in close contact with the sealing frame member, so that the second substrate can be vacuum-adsorbed to the gas permeability. Sheet. Further, since the gas permeable sheet and the seal frame member are configured to be supported by the other surface of the second flexible member, the gas permeable sheet can be accurately assembled to the second flexible member outside the peeling device. Seal the frame member. Further, since the flexible gas permeable sheet and the seal frame member are supported by the second flexible member having higher rigidity, the function of each can be stably exhibited. Further, it is also possible to use electrostatic adsorption or adhesion instead of vacuum adsorption, but in order to obtain a strong adsorption force, vacuum adsorption is preferred.

Preferably, the adsorption unit of the present invention is detachably provided to the first flexible member via a double-sided adhesive tape, and the adhesive force of the double-sided adhesive tape to the adsorption portion is higher than that for the first flexible member. Adhesion of flexible members.

According to the configuration as described above, when the adsorption portion is replaced, the double-sided adhesive tape and the adsorption portion They are taken out together, so that when the adhesion of the double-sided adhesive tape is lowered, the new adhesive tape can be easily replaced. As the double-sided adhesive tape, it is preferable to use a one-side re-peeling type including a strong adhesive surface on one side and a re-peelable surface on the other side, and to adhere the re-peelable surface to the first flexible member to make it strong. The adhesive surface is adhered to the adsorption portion and used.

Preferably, the adsorption unit of the present invention is provided with a plurality of sizes corresponding to the size of the laminate, and one of the adsorption units selected based on the size of the laminate is detachably attached to the first flexible portion. Sexual components.

According to the above-described feature, the plurality of adsorption portions corresponding to the size of the laminate are prepared in advance, and when the size of the laminate is changed, one adsorption portion corresponding to the size of the laminate is selected and replaced. When such an adsorption portion is changed in accordance with the size change, the replacement of the adsorption portion is also facilitated, and the non-operation time for replacing the adsorption portion can be shortened.

According to the peeling apparatus, the peeling method, and the manufacturing method of the electronic component of the laminated body of the present invention, it is possible to easily replace the adsorption portion of the substrate on which the laminated body is held.

1‧‧ ‧ laminated body

1A‧‧‧1st laminate

1B‧‧‧2nd layer body

2‧‧‧Substrate

2A‧‧‧Substrate

2Aa‧‧‧front of the substrate

2a‧‧‧front of the substrate

2B‧‧‧Substrate

2Ba‧‧‧front of the substrate

2b‧‧‧Back of the substrate

3‧‧‧ reinforcing plate

3A‧‧‧ reinforcing plate

3a‧‧‧ Strengthening the front of the board

3B‧‧‧ reinforcing plate

3Bb‧‧‧ Back of the reinforcing board

4‧‧‧ resin layer

4A‧‧‧ resin layer

4B‧‧‧ resin layer

6‧‧‧Layer

6A‧‧‧ corner

6B‧‧‧ corner

7‧‧‧ functional layer

8‧‧‧ reinforcing plate

10‧‧‧ peeling start production unit

12‧‧‧ platform

14‧‧‧ Keeper

16‧‧‧ Height adjustment device

18‧‧‧ Feeding device

20‧‧‧Liquid

22‧‧‧Liquid supply device

24‧‧‧ interface

26‧‧‧ peeling start

28‧‧‧ interface

30‧‧‧ peeling start

40‧‧‧ peeling device

42‧‧‧ peeling unit

44‧‧‧ movable body

46‧‧‧ movable device

48‧‧‧ drive

50‧‧‧ Controller

52‧‧‧Flexible board

54‧‧‧Adsorption Department

56‧‧‧Double adhesive tape

58‧‧‧Flexible board

60‧‧‧ breathable sheet

62‧‧‧ Sealing frame members

64‧‧‧Double adhesive tape

66‧‧‧ slots

68‧‧‧through holes

70‧‧‧ pole

72‧‧‧ ball joint

74‧‧‧Frame

76‧‧‧ cushioning members

78‧‧‧Adsorption pad

80‧‧‧Transporting device

82‧‧‧Adsorption Department

84‧‧‧ breathable sheet

86‧‧‧ Sealing frame components

88‧‧‧ slots

A‧‧‧ arrow

B‧‧‧ arrow

E, F‧‧‧ arrows

G, H‧‧‧ arrows

N‧‧‧ knife

P‧‧‧ panel

Fig. 1 is an enlarged side elevational view of an essential part showing an example of a laminate for a manufacturing step of an electronic component.

2 is an enlarged side elevational view of an essential part showing an example of a laminate produced in the middle of a manufacturing process of an LCD (Liquid Crystal Display).

3(A) to 3(E) are explanatory views showing a method of producing a peeling start portion by the peeling start portion producing device.

Fig. 4 is a plan view showing a laminated body in which a peeling start portion is produced by a peeling start portion producing method.

Fig. 5 is a longitudinal sectional view showing the configuration of a peeling device of the embodiment.

Figure 6 is a view schematically showing the arrangement position of a plurality of movable bodies with respect to the peeling unit Top view of the flexible board.

7(A) to 7(C) are explanatory views showing the configuration of the peeling unit.

Fig. 8 is a longitudinal sectional view showing a peeling device for peeling the reinforcing plate at the interface of the laminated body.

(A) to (C) are explanatory diagrams showing a peeling method of peeling the reinforcing sheet of the laminated body in which the peeling start portion is produced by the peeling start portion forming method in time series.

Fig. 10 (A) to (C) are explanatory views showing, in time series, a peeling method of the reinforcing plate which peels the laminated body after Fig. 9 .

11(A) and 11(B) are explanatory views showing another embodiment of the adsorption unit of the peeling unit.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

Hereinafter, a case where the peeling device and the peeling method of the laminated body of the present invention are used in the manufacturing steps of the electronic component will be described.

The electronic component refers to an electronic component such as a display panel, a solar cell, or a thin film secondary battery. As the display panel, a liquid crystal display (LCD) panel, a plasma display panel (PDP: Plasma Display Panel), and an organic EL display (OELD: Organic Electro Luminescence Display) panel can be exemplified.

[Manufacturing steps of electronic components]

The electronic component is manufactured by forming a functional layer for an electronic component (in the case of an LCD, a thin film transistor (TFT) or a color filter (CF)) on the front surface of a substrate made of glass, resin, or metal.

The substrate is attached to the reinforcing plate before being formed into a functional layer, and is formed as a laminated body. Thereafter, a functional layer is formed on the front surface of the substrate in a state of a laminate. Then, after the functional layer is formed, the reinforcing plate is peeled off from the substrate.

That is, in the manufacturing step of the electronic component, the functional layer forming step of forming the functional layer on the front surface of the substrate in the state of the laminated body and the separating step of separating the reinforcing plate from the substrate on which the functional layer is formed are included. In the separating step, the stripping device of the laminated body of the present invention is applied And stripping methods.

[Layer 1]

Fig. 1 is an enlarged side elevational view showing an essential part of an example of the laminated body 1.

The laminated body 1 includes a substrate (first substrate) 2 on which a functional layer is to be formed, and a reinforcing plate (second substrate) 3 that reinforces the substrate 2. Moreover, the reinforcing plate 3 includes the resin layer 4 as an adsorption layer on the front surface 3a, and the back surface 2b of the substrate 2 is attached to the resin layer 4. In other words, the substrate 2 is detachably attached to the reinforcing plate 3 via the resin layer 4 by the van der Waals force acting between the resin layer 4 and the adhesive force of the resin layer 4.

[Substrate 2]

The substrate 2 is formed with a functional layer on its front surface 2a. The substrate 2 can be exemplified by a glass substrate, a ceramic substrate, a resin substrate, a metal substrate, and a semiconductor substrate. Among these substrates, the glass substrate is excellent in chemical resistance and moisture permeability resistance, and has a small coefficient of linear expansion. Therefore, it is preferable as the substrate 2 for electronic components. Further, there is an advantage that the pattern of the functional layer formed at a high temperature is less likely to shift during cooling as the coefficient of linear expansion becomes smaller.

Examples of the glass of the glass substrate include alkali-free glass, borosilicate glass, soda lime glass, high cerium oxide glass, and other oxide-based glass containing cerium oxide as a main component. The oxide-based glass is preferably a glass having a cerium oxide content of 40 to 90% by mass in terms of oxide.

The glass of the glass substrate is preferably a glass which is suitable for the type of electronic component to be manufactured and which is suitable for the manufacturing process. For example, a glass substrate for a liquid crystal panel preferably uses a glass (alkali-free glass) which does not substantially contain an alkali metal component.

The thickness of the substrate 2 is set according to the type of the substrate 2. For example, when the substrate 2 is made of a glass substrate, the thickness of the electronic component is preferably 0.7 mm or less, more preferably 0.3 mm or less, and still more preferably 0.1 mm or less in order to reduce the weight and thickness of the electronic component. When the thickness is 0.3 mm or less, good flexibility can be imparted to the glass substrate. Further, when the thickness is 0.1 mm or less, the glass substrate can be wound into a roll shape, but The thickness of the glass substrate is preferably 0.03 mm or more from the viewpoint of the production of the glass substrate and the treatment of the glass substrate.

Further, in FIG. 1, the substrate 2 is composed of one substrate, but the substrate 2 may be composed of a plurality of substrates. In other words, the substrate 2 may be formed of a laminate in which a plurality of substrates are laminated. In this case, the total thickness of all the substrates constituting the substrate 2 is the thickness of the substrate 2.

[Reinforcing board 3]

Examples of the reinforcing plate 3 include a glass substrate, a ceramic substrate, a resin substrate, a metal substrate, and a semiconductor substrate.

The thickness of the reinforcing plate 3 is set to 0.7 mm or less, and is set according to the type, thickness, and the like of the substrate 2 to be reinforced. Further, the reinforcing plate 3 may have a thickness thicker than the substrate 2 or may be thinner than the substrate 2. However, in order to reinforce the substrate 2, it is preferably 0.4 mm or more.

Further, in the present embodiment, the reinforcing plate 3 is composed of one substrate, but the reinforcing plate 3 may be composed of a laminated body in which a plurality of substrates are laminated. In this case, the total thickness of all the substrates constituting the reinforcing plate 3 becomes the thickness of the reinforcing plate 3.

[Resin layer 4]

As for the resin layer 4, in order to prevent peeling between the resin layer 4 and the reinforcing plate 3, the bonding force with the reinforcing plate 3 is set to be higher than the bonding force with the substrate 2. Thereby, in the peeling step, the substrate 2 is peeled off at the interface between the resin layer 4 and the substrate 2.

The resin constituting the resin layer 4 is not particularly limited, and examples thereof include an acrylic resin, a polyolefin resin, a polyurethane resin, a polyimide resin, a polyoxymethylene resin, and a polyimide resin. Several kinds of resins can also be used in combination. Among them, from the viewpoint of heat resistance or peelability, a polyphthalocyanine resin or a polyamidene polyoxymethylene resin is preferable.

The thickness of the resin layer 4 is not particularly limited, but is preferably 1 to 50 μm, more preferably 4 to 20 μm. When the thickness of the resin layer 4 is 1 μm or more and bubbles or foreign matter are mixed between the resin layer 4 and the substrate 2, the thickness of the bubble or the foreign matter can be absorbed by the deformation of the resin layer 4. On the other hand, by setting the thickness of the resin layer 4 to 50 μm or less, The formation time of the resin layer 4 can be shortened, and further, the resin of the resin layer 4 is not required to be used, which is economical.

Further, the outer shape of the resin layer 4 is preferably the same as the outer shape of the reinforcing plate 3 or smaller than the outer shape of the reinforcing plate 3, so that the reinforcing plate 3 can support the entirety of the resin layer 4. Further, the outer shape of the resin layer 4 is preferably the same as the outer shape of the substrate 2 or larger than the outer shape of the substrate 2, so that the resin layer 4 can be closely adhered to the entirety of the substrate 2.

Further, in FIG. 1, the resin layer 4 is composed of one layer, but the resin layer 4 may be composed of two or more layers. In this case, the total thickness of all the layers constituting the resin layer 4 becomes the thickness of the resin layer 4. Moreover, in this case, the kind of the resin which comprises each layer may differ.

Further, in the embodiment, the resin layer 4 as an organic film is used as the adsorption layer, and an inorganic layer may be used instead of the resin layer 4. The inorganic film constituting the inorganic layer contains, for example, at least one selected from the group consisting of metal halides, nitrides, carbides, and carbonitrides.

Further, the laminated body 1 of FIG. 1 includes the resin layer 4 as an adsorption layer, and may be configured to include the substrate 2 and the reinforcing plate 3 without the resin layer 4. In this case, the substrate 2 and the reinforcing plate 3 are detachably attached by a van der Waals force or the like acting between the substrate 2 and the reinforcing plate 3. Further, when the substrate 2 and the reinforcing plate 3 are glass substrates, it is preferable to form an inorganic thin film on the front surface 3a of the reinforcing plate 3 so that the substrate 2 and the reinforcing plate 3 are not adhered to each other due to high temperature.

[Laminate 6 in which an embodiment having a functional layer is formed]

The functional layer is formed on the front surface 2a of the substrate 2 of the laminated body 1 by the functional layer forming step. As a method of forming the functional layer, a vapor deposition method such as a CVD (Chemical Vapor Deposition) method or a PVD (Physical Vapor Deposition) method or a sputtering method is used. The functional layer forms a specific pattern by photolithography and etching.

Fig. 2 is an enlarged side elevational view of an essential part showing an example of a rectangular laminated body 6 which is produced in the middle of the manufacturing process of the LCD.

The laminated body 6 is configured by sequentially laminating the reinforcing plate 3A, the resin layer 4A, the substrate 2A, the functional layer 7, the substrate 2B, the resin layer 4B, and the reinforcing plate 3B. That is, the laminated body 6 of FIG. 2 corresponds to the laminated body in which the laminated body 1 shown in FIG. 1 is symmetrically arranged via the functional layer 7. Hereinafter, the laminated body including the substrate 2A, the resin layer 4A, and the reinforcing plate 3A is referred to as a first laminated body 1A, and the laminated body including the substrate 2B, the resin layer 4B, and the reinforcing plate 3B is referred to as a second laminated body 1B.

A thin film transistor (TFT) as the functional layer 7 is formed on the front surface 2Aa of the substrate 2A of the first laminated body 1A, and a color filter as the functional layer 7 is formed on the front surface 2Ba of the substrate 2B of the second laminated body 1B. Sheet (CF).

The first layered body 1A and the second layered body 1B are integrated with each other by superposing the front faces 2Aa and 2Ba of the substrates 2A and 2B. Thereby, the laminated body 6 of the structure in which the first laminated body 1A and the second laminated body 1B are symmetrically arranged via the functional layer 7 is manufactured.

After the peeling start portion is formed by a knife in the peeling start portion forming step in the separation step, the reinforcing layer 3A and 3B are sequentially peeled off in the peeling step of the separating step, and then the polarizing plate, the backlight device, and the like are attached. , thereby manufacturing an LCD as a product.

[Peeling start unit making device 10]

3(A) to 3(E) are explanatory views showing a method of producing a peeling start portion by the peeling start portion forming apparatus 10, and Fig. 3(A) is an explanatory view showing a positional relationship between the laminated body 6 and the blade N, and Fig. 3 (B) is an explanatory view showing the peeling start portion 26 at the interface 24 by the knife N, and FIG. 3(C) is an explanatory view showing a state immediately before the peeling start portion 30 is formed at the interface 28, and FIG. 3(D) The illustration of the peeling start portion 30 at the interface 28 by the knife N is shown, and FIG. 3(E) is an explanatory view of the laminated body 6 in which the peeling start portions 26 and 30 have been produced. Moreover, FIG. 4 is a top view of the laminated body 6 in which the peeling start parts 26 and 30 have been produced.

When the peeling start portions 26 and 30 are produced, the laminated body 6 is as shown in FIG. 3(A), and the back surface 3Bb of the reinforcing plate 3B is held by the stage 12 and supported horizontally (in the X-axis direction in the drawing).

The knife N is held in such a manner that the blade edge faces the end face of the corner portion 6A of the laminated body 6 by holding The device 14 is horizontally supported. Further, the knife N is adjusted by the height adjusting device 16 to adjust the position in the height direction (the Z-axis direction in the drawing). Further, the blade N and the laminated body 6 are relatively moved in the horizontal direction by the feeding device 18 such as a ball screw device. The feeding device 18 may move at least one of the blade N and the stage 12 in the horizontal direction. In the embodiment, the knife N is moved. Further, the liquid supply device 22 that supplies the liquid 20 to the upper surface of the blade N before or during the piercing is disposed above the blade N.

[How to make peeling start unit]

In the method of producing the peeling start portion by the peeling start portion forming apparatus 10, the piercing position of the blade N is set to the corner portion 6A of the laminated body 6 and overlapped in the thickness direction of the laminated body 6, and the interface 24 is provided. 28, different ways to set the amount of penetration of the knife N. Explain the production process.

In the initial state, the blade edge of the blade N is present at a position shifted in the height direction (Z-axis direction) with respect to the interface 24 between the substrate 2B and the resin layer 4B as the first piercing position. Therefore, first, as shown in FIG. 3(A), the blade N is moved in the height direction, and the height of the blade edge of the blade N is set to the height of the interface 24.

Thereafter, as shown in FIG. 3(B), the blade N is horizontally moved toward the corner portion 6A of the laminated body 6, and the blade N is pierced by a specific amount at the interface 24. Further, the liquid 20 is supplied from the liquid supply device 22 to the upper surface of the blade N when the knife N is pierced or before the piercing. Thereby, the substrate 2B of the corner portion 6A is peeled off from the resin layer 4B. Therefore, as shown in FIG. 4, a triangular peeling start portion 26 is formed at the interface 24 in a plan view. Further, the supply of the liquid 20 is not essential. When the liquid 20 is used, the liquid 20 remains in the peeling start portion 26 after the blade N is pulled out, so that the peeling start portion 26 which is not reattachable can be produced.

Next, the blade N is pulled out from the corner portion 6A in the horizontal direction, and as shown in Fig. 3(C), the blade edge of the blade N is set to the height of the interface 28 between the substrate 2A and the resin layer 4A as the second piercing position.

Thereafter, as shown in FIG. 3(D), the blade N is horizontally moved toward the laminated body 6, and the blade N is pierced by a specific amount at the interface 28. Similarly, the surface of the upper surface of the knife N is supplied from the liquid supply device 22. Liquid 20. Thereby, as shown in FIG. 3(E), the peeling start portion 30 is formed at the interface 28. Here, the amount of penetration of the knife N to the interface 28 is set to be smaller than the amount of penetration of the interface 24. The above is the production method of the peeling start unit. Furthermore, the amount of penetration of the knife N to the interface 24 can be set to be smaller than the amount of penetration of the interface 28.

The laminated body 6 in which the peeling start portions 26 and 30 have been produced is taken out from the peeling start portion forming apparatus 10, transported to the peeling device described below, and the reinforcing plates 3B and 3A are sequentially peeled off at the interfaces 24 and 28 by the peeling device.

The details of the peeling method are described below, but as shown by the arrow A in Fig. 4, the area of the peeling start portion 26 is made by bending the laminated body 6 from the corner portion 6A toward the corner portion 6B opposed to the corner portion 6A. The peeling start portion 26 of the larger interface 24 is initially peeled off from the starting point. Thereby, the reinforcing plate 3B is peeled off. Then, the laminated body 6 is deflected again from the corner portion 6A toward the corner portion 6B, and peeling is performed starting from the peeling start portion 30 of the interface 28 having a small area of the peeling start portion 30. Thereby, the reinforcing plate 3A is peeled off.

Further, the amount of penetration of the knife N is preferably set to 7 mm or more, and more preferably set to about 15 to 20 mm, depending on the size of the laminated body 6.

[Peeling device 40]

5 is a longitudinal cross-sectional view showing a configuration of the peeling device 40 of the embodiment, and FIG. 6 is a plan view schematically showing the peeling unit 42 of the plurality of movable bodies 44 of the peeling device 40 with respect to the arrangement position of the peeling unit 42. 5 corresponds to a cross-sectional view taken along line B-B of FIG. 6, and in FIG. 6, the laminated body 6 is indicated by a solid line.

As shown in FIG. 5, the peeling device 40 includes a pair of movable devices 46 and 46 arranged vertically above the laminated body 6. Since the movable devices 46 and 46 have the same configuration, the movable device 46 disposed on the lower side of FIG. 5 will be described here, and the movable devices 46 disposed on the upper side will be denoted by the same reference numerals and will not be described.

The movable device 46 includes a plurality of movable bodies 44, a plurality of driving devices (driving portions) 48 that move the movable body 44 up and down for each movable body 44, and for each of the driving devices 48. The controller 50 (drive unit) of the drive unit 48 is controlled.

The peeling unit 42 flexures and deforms the reinforcing plate 3B, so that the reinforcing plate 3B is held by vacuum suction. Further, instead of vacuum adsorption, electrostatic adsorption or magnetic adsorption may be performed.

[Peel unit 42]

Fig. 7(A) is a plan view of the peeling unit 42, and Fig. 7(B) is an enlarged longitudinal sectional view of the peeling unit 42 taken along line C-C of Fig. 7(A). In addition, FIG. 7(C) shows that the rectangular plate-shaped flexible plate (first flexible member) 52 constituting the peeling unit 42 is detachably provided with the peeling unit 42 via the double-sided adhesive tape 56. An enlarged longitudinal cross-sectional view of the peeling unit 42 in the case of the portion 54.

As described above, the peeling unit 42 is configured such that the flexible plate 52 is detachably attached to the suction portion 54 via the double-sided adhesive tape 56.

The adsorption unit 54 includes a flexible plate (second flexible member) 58 that is thinner than the flexible plate 52. The lower surface (one surface) of the flexible plate 58 is detachably attached to the upper surface of the flexible plate 52 via the double-sided adhesive tape 56.

Further, the adsorption portion 54 includes a rectangular gas permeable sheet 60 that adsorbs and holds the inner surface of the reinforcing plate 3B of the laminated body 6. For the purpose of reducing the tensile stress generated by the reinforcing plate 3B at the time of peeling, the thickness of the gas permeable sheet 60 is 2 mm or less, preferably 1 mm or less, and 0.5 mm is used in the embodiment.

Further, the adsorption unit 54 includes a seal frame member 62 that surrounds the gas permeable sheet 60 and that abuts the outer peripheral surface of the reinforcing plate 3B. The seal frame member 62 and the gas permeable sheet 60 are adhered to the upper surface (the other surface) of the flexible plate 58 via the double-sided adhesive tape 64. Further, the sealing frame member 62 is a sponge of independent bubbles having a Shore E hardness of 20 degrees or more and 50 degrees or less, and the thickness thereof is configured to be 0.3 mm to 0.5 mm thick with respect to the thickness of the gas permeable sheet 60.

A frame-shaped groove 66 is provided between the gas permeable sheet 60 and the sealing frame member 62. Further, a plurality of through holes 68 are opened in the flexible plate 52, and one end of the through holes 68 communicates with the groove 66, and the other end is connected to the suction source via a suction line (not shown) (for example, Vacuum pump).

Therefore, when the suction source is driven, the air of the suction line, the through hole 68, and the groove 66 is sucked, whereby the inner surface of the reinforcing plate 3B of the laminated body 6 is vacuum-sucked and held on the gas permeable sheet. Further, since the outer peripheral surface of the reinforcing plate 3B is pressed against the seal frame member 62, the airtightness of the suction space surrounded by the seal frame member 62 is improved.

The flexible plate 52 has a higher bending rigidity than the flexible plate 58, the gas permeable sheet 60, and the sealing frame member 62, and the bending rigidity of the flexible plate 52 governs the bending rigidity of the peeling unit 42. The bending rigidity per unit width (1 mm) of the peeling unit 42 is preferably 1000 to 40,000 N. Mm ² /mm. For example, in the portion where the stripping unit 42 has a width of 100 mm, the bending rigidity becomes 100000 to 4000000 N. Mm ² /mm. By setting the bending rigidity of the peeling unit 42 to 1000N. The mm ² /mm or more can prevent the bending of the reinforcing plate 3B held by the peeling unit 42 by the suction. Moreover, by setting the bending rigidity of the peeling unit 42 to 40,000 N. Below mm ² /mm, the reinforcing plate 3B held by the peeling unit 42 can be appropriately flexed and deformed.

The flexible sheets 52 and 58 are resin members having a Young's modulus of 10 GPa or less, such as polycarbonate resin, polyvinyl chloride (PVC) resin, acrylic resin, and polyacetal (POM) resin. A resin member.

[movable device 46]

On the lower surface of the flexible plate 52, a plurality of disk-shaped movable bodies 44 shown in Fig. 5 are fixed in a lattice shape as shown in Fig. 6. The movable body 44 is fixed to the flexible plate 52 by a fastening member such as a bolt, but may be fixed and fixed instead of the bolt. The movable bodies 44 are independently moved up and down by the drive unit 48 that is driven and controlled by the controller 50.

That is, the controller 50 controls the driving device 48 so that the movable body 44 on the side of the corner portion 6A of the laminated body 6 in Fig. 6 is sequentially lowered to the movable body 44 on the side of the corner portion 6B of the peeling traveling direction indicated by the arrow A. mobile. By this operation, as shown in the longitudinal cross-sectional view of FIG. 8, the reinforcing plate 3B of the laminated body 6 is peeled off at the interface 24 starting from the peeling start portion 26 (see FIG. 4). Further, the laminated body 6 shown in FIGS. 5 and 8 is produced by the peeling start portion described in FIG. On the other hand, the laminated body 6 of the peeling start portions 26 and 30 is produced.

The drive unit 48 includes, for example, a rotary servo motor, a ball screw mechanism, and the like. The rotary motion of the servo motor is converted into a linear motion in the ball screw mechanism and transmitted to the rod 70 of the ball screw mechanism. At the front end of the rod 70, a movable body 44 is provided via the ball joint 72. Thereby, as shown in FIG. 8, the movable body 44 can be tilted following the flexural deformation of the peeling unit 42. Therefore, the peeling unit 42 can be flexibly deformed from the corner portion 6A toward the corner portion 6B without applying excessive force to the peeling unit 42. Further, the drive device 48 is not limited to the rotary servo motor and the ball screw mechanism, and may be a linear servo motor or a fluid pressure cylinder (for example, an air pressure cylinder).

Preferably, a plurality of driving devices 48 are attached to the frame 74 that can be lifted and lowered via the cushioning member 76. The cushioning member 76 is elastically deformed in such a manner as to follow the flexural deformation of the peeling unit 42. Thereby, the rod 70 is tilted relative to the frame 74.

When the frame 74 is detached from the peeling reinforcing plate 3B from the peeling unit 42, the frame 74 is lowered and moved by a driving unit (not shown).

The controller 50 is configured as a computer including a CPU (Central Processing Unit), a ROM (Read Only Memory), and a RAM (Random Access Memory). . The controller 50 controls a plurality of driving devices 48 for each of the driving devices 48 by causing the CPU to execute a program recorded in the recording medium, thereby controlling the lifting movement of the plurality of movable bodies 44.

[Separation method of reinforcing plates 3A, 3B by peeling device 40]

Figs. 9(A) to 9(C) and Figs. 10(A) to 10(C) show the laminated body 6 in which the peeling start portions 26 and 30 are formed in the corner portion 6A by the peeling start portion producing method described with reference to Fig. 3 . Stripping method. That is, in the figure, the peeling method of the reinforcing sheets 3A and 3B which peeled the laminated body 6 is shown in time series.

Moreover, the loading operation of the laminated body 6 of the peeling apparatus 40, the peeling reinforcement board 3A, 3B of the self-peeling apparatus 40, and the carrying-out operation of the panel P are contained by the suction shown in FIG. The transfer device 80 of the pad 78 is carried out. In addition, in FIGS. 9 and 10, in order to avoid the complication of the drawings, the illustration of the movable device 46 is omitted. Further, the panel P is attached with a product panel that removes the substrate 2A of the reinforcing plates 3A and 3B and the substrate 2B via the functional layer 7.

Fig. 9(A) is a side view of the peeling device 40 of the peeling unit 42 placed on the lower side by the operation indicated by the arrows E and F of the conveying device 80. In this case, the lower peeling unit 42 and the upper peeling unit 42 are moved to a position that is relatively sufficiently retracted so that the lower peeling unit 42 and the upper peeling unit 42 are inserted between the lower peeling unit and the upper peeling unit 42. Then, when the laminated body 6 is placed on the lower peeling unit 42, the reinforcing plate 3B of the laminated body 6 is vacuum-sucked by the lower peeling unit 42. That is, in FIG. 9(A), the adsorption step of adsorbing and holding the reinforcing plate 3B as the second substrate by the lower peeling unit 42 is shown.

9(B) is a peeling device 40 in which the peeling unit 42 on the lower side and the peeling unit 42 on the upper side are moved in the relatively close direction, and the reinforcing plate 3A of the laminated body 6 is vacuum-adsorbed by the peeling unit 42 on the upper side. Side view. That is, in FIG. 9(B), the adsorption step of adsorbing and holding the reinforcing plate 3A as the second substrate by the upper peeling unit 42 is shown.

When the substrate 2 of the laminated body 1 shown in FIG. 1 is peeled off from the reinforcing plate 3 by the peeling device 40, the substrate 2 as the first substrate is supported by the upper peeling unit 42 (support step) The reinforcing plate 3 as the second substrate is adsorbed and held by the lower peeling unit 42 (adsorption step). In this case, the support portion of the support substrate 2 is not limited to the peeling unit 42 as long as it is a supporter that can detachably attach the substrate 2. However, by using the peeling unit 42 as the support portion, the substrate 2 and the reinforcing plate 3 can be simultaneously bent and peeled off, so that there is an advantage that the peeling force can be made smaller than the form in which only the substrate 2 or the reinforcing plate 3 is bent. .

Returning to Fig. 9, Fig. 9(C) is a side view showing a state in which the peeling unit 42 on the lower side is deflected downward from the corner portion 6A of the laminated body 6 toward the corner portion 6B, and the interface 24 is formed. The peeling start portion 26 (see FIG. 4) is a starting point, and the reinforcing plate 3B of the laminated body 6 is continuously peeled off. That is, in the plurality of movable bodies 44 of the peeling unit 42 on the lower side shown in FIG. 8, The movable body 44 located on the side of the corner portion 6A of the laminated body 6 is moved downward by the movable body 44 located on the side of the corner portion 6B, and the reinforcing plate 3B is peeled off at the interface 24 (peeling step). Further, in the plurality of movable bodies 44 of the upper peeling unit 42, the movable body 44 located on the corner portion 6A side of the laminated body 6 to the movable body 44 located on the side of the corner portion 6B may be moved in accordance with the operation. The order is moved upward to peel off the reinforcing plate 3B. Thereby, the peeling force can be made smaller than the form in which only the reinforcing plate 3B is bent.

Fig. 10(A) is a side view of the peeling device 40 in a state in which the reinforcing plate 3B is completely peeled off. According to the figure, the peeled reinforcing plate 3B is vacuum-sucked by the lower peeling unit 42, and the laminated body 6 (including the laminated body including the reinforcing plate 3A and the panel P) of the reinforcing plate 3B is removed by the upper peeling unit 42 vacuum. Adsorption is maintained.

Further, the lower peeling unit 42 and the upper peeling unit 42 are moved to a position that is relatively sufficiently retracted so that the transfer device 80 shown in FIG. 9(A) is inserted between the upper and lower peeling units 42.

Thereafter, the vacuum adsorption of the peeling unit 42 on the lower side is first released. Next, the reinforcing plate 3B is adsorbed and held by the resin layer 4B by the adsorption pad 78 of the transfer device 80. Then, the reinforcing plate 3B is carried out from the peeling device 40 by the operation of the conveying device 80 indicated by arrows G and H in Fig. 10(A).

Fig. 10(B) is a side view showing the laminated body 6 in which the reinforcing plate 3B is vacuum-sucked and held by the peeling unit 42 on the lower side and the peeling unit 42 on the upper side. That is, the lower peeling unit 42 and the upper peeling unit 42 are moved in the relatively close direction, and the lower peeling unit 42 vacuum-sucks and holds the substrate 2B (support step).

10(C) is a side view showing a state in which the peeling unit 42 is bent outward from the corner portion 6A of the laminated body 6 toward the corner portion 6B, and the peeling start portion 30 is formed at the interface 28 ( The reinforcing plate 3A of the laminated body 6 is continuously peeled off as a starting point with reference to FIG. 4). In other words, in the plurality of movable bodies 44 of the peeling unit 42 on the upper side shown in Fig. 8, the movable body 44 on the side of the corner portion 6A of the laminated body 6 is moved up to the movable body 44 on the side of the corner portion 6B. The reinforcing plate 3A is peeled off at the interface 28 (peeling step). Further, in the plurality of movable bodies 44 of the lower peeling unit 42, the movable body 44 located on the corner portion 6A side of the laminated body 6 to the movable body 44 located on the corner portion 6B side may be interlocked with the operation. The reinforcing plate 3A is peeled off at the interface 28 by sequentially moving downward. Thereby, the peeling force can be made smaller than the form in which only the reinforcing plate 3A is bent.

Thereafter, the reinforcing plate 3A from which the panel P is completely peeled off is taken out from the upper peeling unit 42 and the panel P is taken out from the lower peeling unit 42. The above is a method of peeling off the laminated body 6 of the peeling start portions 26 and 30 at the corner portion 6A.

[Features of the peeling device 40]

First, as shown in FIG. 7(C), the adsorption portion 54 is detachably provided via the double-sided adhesive tape 56 with respect to the flexible plate 52.

Therefore, when the adsorption portion 54 is replaced with the flexible plate 52, the adsorption portion 54 can be detached only from the flexible plate 52, and the new adsorption portion 54 can be attached to the flexible plate 52. Therefore, the replacement of the adsorption portion 54 becomes easy. Moreover, the non-operation time for replacing the adsorption portion 54 can be shortened. The adsorption portion 54 is affixed or fixed to the flexible plate 52 in a detachable state. By preparing various adsorption portions that change the shape of the seal frame member 62, it is possible to cope with laminates of various sizes and shapes. In particular, it is preferable to replace the adsorption portion 54 on the upper side to improve the assembly accuracy of the adsorption portion 54, and to peel the laminate of various sizes and shapes in a short time.

It is preferable that the adhesion of the double-sided adhesive tape 56 to the adsorption portion 54 is higher than the adhesion to the flexible plate 52.

Thereby, when the adsorption portion 54 is replaced, the double-sided adhesive tape 56 is taken out together with the adsorption portion 54, so that when the adhesive force of the double-sided adhesive tape 56 is lowered, the new double-sided adhesive tape 56 can be easily replaced. Preferably, as the double-sided adhesive tape 56, a one-side re-peeling type including a strong adhesive side on one side and a re-peelable side on the other side is used, and the re-peelable surface is adhered to the flexible sheet 52 to make a strong adhesive surface. It is adhered to the adsorption unit 54 and used. As a double-sided adhesive tape 56, For example, a double-sided tape (trade name #7686UR) manufactured by Ebisu Chemical Co., Ltd. is listed. Further, the means for attaching and detaching the adsorption portion 54 to the flexible plate 52 is not limited to the double-sided adhesive tape 56, and can be detachably attached by a vacuum suction means.

Next, as shown in FIGS. 7(A) and (B), the adsorption portion 54 is constituted by the flexible plate 58, the gas permeable sheet 60, and the sealing frame member 62.

In other words, when the inner surface of the reinforcing plate 3B is vacuum-adsorbed by the gas permeable sheet 60, the outer peripheral surface of the reinforcing plate 3B is in close contact with the sealing frame member 62, so that air leakage can be prevented, whereby the reinforcing plate 3B can be surely The vacuum is adsorbed to the gas permeable sheet 60.

Moreover, since the gas permeable sheet 60 and the seal frame member 62 are supported by the flexible plate 58, the gas permeable sheet 60 and the seal can be assembled to the flexible plate 58 with high precision outside the peeling device 40. Frame member 62.

Further, since the flexible gas permeable sheet 60 and the sealing frame member 62 are supported by the flexible sheet 58 having a higher rigidity, the functions of the respective members can be stably exhibited.

Next, it is characterized in that the adsorption portion 54 is replaceable and can be replaced with the adsorption portion 54 having a size corresponding to the size of the laminated body 6.

In other words, the adsorption unit 54 is provided in advance in a plurality of sizes corresponding to the size of the laminated body 6, and one of the suction units selected based on the size of the laminated body 6 is detachably attached to the flexible plate 52.

Fig. 11(A) is a plan view of the peeling unit 42, and Fig. 11(B) is an enlarged longitudinal sectional view of the peeling unit 42 taken along line D-D of Fig. 11(A).

In the adsorption portion 82 of the peeling unit 42 of Fig. 11, a rectangular reinforcing plate 8 having a smaller size than the reinforcing plate 3B shown in Fig. 7 is adsorbed and held. Therefore, the adsorption portion 82 is smaller in size than the gas permeable sheet 60 shown in Fig. 7, and a gas permeable sheet 84 having a size corresponding to the size of the reinforcing plate 8 is used. Further, the adsorption portion 82 is a sealing frame member 86 having a larger size than the sealing frame member 62 shown in FIG.

The gas permeable sheet 84 and the sealing frame member 86 are attached to each other via the double-sided adhesive tape 64. The upper surface of the flexible plate 58. When the adsorption portion is replaced, the double-sided adhesive tape 56 is peeled off from the flexible sheet 52. Further, a frame-shaped groove 88 is provided between the gas permeable sheet 84 and the sealing frame member 86, and the groove 88 communicates with the through hole 68. Therefore, the inner surface of the reinforcing plate 8 is vacuum-sucked and held by the gas permeable sheet 84, and the outer peripheral surface of the reinforcing plate 8 is pressed against the sealing frame member 86.

In this way, when the adsorption portion is replaced with the change in the size of the reinforcing plate, the replacement of the adsorption portion can be facilitated, and the non-operating time of the replacement adsorption portion can be shortened.

The present invention has been described in detail with reference to the specific embodiments thereof, and it is understood that various changes or modifications may be added without departing from the spirit and scope of the invention.

The present application is based on Japanese Patent Application No. 2014-116464, filed on Jun.

Claims (13)

A laminated body peeling device for laminating a first substrate and a second substrate, wherein an interface between the first substrate and the second substrate is from one end side toward the other end side The peeling direction is sequentially peeled off, and includes: a support portion that supports the first substrate of the laminate; and a peeling unit that includes a plate-shaped first flexible member and is detachably provided in the above a first flexible member that adsorbs the adsorption portion of the second substrate of the laminate; and a driving portion that causes the second substrate of the laminate to be flexibly deformed from one end side toward the other end side in order The above peeling unit is deformed. The peeling device of the laminated body according to claim 1, wherein the support portion has the same configuration as the peeling unit. The peeling device for a laminated body according to claim 1, wherein the adsorption portion has a plate-shaped second flexible member, wherein one of the first flexible members is detachably provided, and the gas permeable sheet is The second flexible member is disposed on the other surface of the second flexible member and vacuum-adsorbs the inner surface of the second substrate; and the sealing frame member is disposed on the second flexible member so as to surround the gas permeable sheet The other surface is in contact with the outer peripheral surface of the second substrate except the inner surface. The peeling device for a laminate according to claim 2, wherein the adsorption portion has a plate-shaped second flexible member, and one of the detachable portions is detachably provided in the first a flexible member; a gas permeable sheet provided on the other surface of the second flexible member and vacuum-absorbing the inner surface of the second substrate; and a sealing frame member surrounding the gas permeable sheet The material is provided on the other surface of the second flexible member, and is in contact with the outer surface of the second substrate except the inner surface. The peeling device for a laminated body according to any one of claims 1 to 4, wherein the adsorption portion is detachably provided to the first flexible member via a double-sided adhesive tape, and the double-sided adhesive tape is The adhesion of the adsorption portion is higher than the adhesion to the first flexible member. The stripping device for a laminate according to any one of claims 1 to 4, wherein the adsorption unit is provided with a plurality of sizes corresponding to the size of the laminate, and one adsorption unit is selected based on the size of the laminate. The first flexible member is detachably attached to the first flexible member. The peeling device of the laminated body according to claim 5, wherein the adsorption unit is provided with a plurality of sizes corresponding to the size of the laminated body, and one of the adsorption portions selected based on the size of the laminated body is detachably attached to The first flexible member. A method for peeling a laminated body, wherein a laminate in which a first substrate and a second substrate are detachably attached is formed on an interface between the first substrate and the second substrate from one end side toward the other end side The peeling traveling direction and the sequential peeling are characterized by comprising: a supporting step of supporting the first substrate of the laminated body by a support portion; and an adsorption step of using a first flexible member including a plate shape And the second substrate that is detachably attached to the first flexible member and adsorbs the laminated body a peeling unit of the adsorption unit, the second substrate that adsorbs the laminated body by the adsorption unit; and a peeling step of the second substrate from the one end side toward the other end of the laminated body by the driving unit The peeling unit is deformed and the peeling is performed at the interface in such a manner that the side is sequentially flexed and deformed. The method of peeling a laminate according to claim 8, wherein in the supporting step, the first substrate is supported by the support portion having the same configuration as the peeling unit in the adsorption step. The method for peeling a laminate according to claim 8 or 9, wherein the adsorption unit is provided with a plurality of sizes corresponding to the size of the laminate, and one of the adsorption portions selected based on the size of the laminate is detachably It is attached to the above first flexible member. A method for producing an electronic component, comprising: a functional layer forming step of forming a functional layer on an exposed surface of the first substrate on a laminate in which a first substrate and a second substrate are detachably attached; and a separation step of separating the second substrate from the first substrate on which the functional layer is formed; and the method of manufacturing the electronic component, characterized in that the separating step includes a support step of supporting the laminate by a support portion The first substrate; the adsorption step of the first flexible substrate including the plate shape, and the adsorption portion of the second substrate that is detachably provided on the first flexible member and adsorbs the laminated body a stripping unit that adsorbs the second substrate of the laminate by the adsorption unit; and a peeling step of sequentially biasing the second substrate of the laminate from one end side toward the other end side by a driving unit The manner in which the curvature is deformed causes the above-mentioned peeling unit to be changed The second substrate is peeled off from the first substrate. The method of manufacturing an electronic component according to claim 11, wherein in the supporting step, the first substrate is supported by the support portion having the same configuration as the peeling unit in the adsorption step. The method of manufacturing an electronic component according to claim 11 or 12, wherein the adsorption unit is provided with a plurality of sizes corresponding to the size of the laminate, and the adsorption unit selected based on the size of the laminate is detachably It is attached to the above first flexible member.