TWI673225B - Stripping device and peeling method of laminated body, and manufacturing method of electronic device - Google Patents

Abstract

The present invention relates to a laminated body peeling device for a laminated body including a first substrate, a second substrate, and an adhesive layer for bonding the first substrate and the second substrate, and the first layer is obtained from the adhesive layer. The substrate is peeled from the second substrate, and includes a driving portion that flexes and deforms the first substrate or one of the second substrates, and a sliding portion that causes the first substrate and the second substrate to follow. The direction parallel to the first substrate or the second substrate is relatively slid.

Description

Peeling device and method of laminated body, and manufacturing method of electronic device

The present invention relates to a peeling device and a peeling method of a laminated body, and a manufacturing method of an electronic device.

With the reduction in thickness and weight of electronic devices such as display panels, solar cells, and thin-film secondary batteries, thinner substrates such as glass plates, resin plates, and metal plates used in such electronic devices are required.

However, if the thickness of the substrate is reduced, the operability of the substrate is deteriorated, so it is difficult to form a functional layer for electronic devices (TFT: Thin Film Transistor), color filter (CF : Color Filter).

Therefore, a manufacturing method of an electronic device is proposed in which a reinforcing plate is attached to the second surface of the substrate to form a laminated body, and a functional layer is formed on the first surface of the substrate. In this manufacturing method, since the operability of the substrate is improved, a functional layer can be favorably formed on the first surface of the substrate. After the functional layer is formed, the reinforcing plate is peeled from the substrate (for example, Patent Document 1, Patent Document 2, and Patent Document 3).

The stripping method of the reinforcing plate disclosed in Patent Documents 1, 2, and 3 is to make the reinforcing plate or the substrate, or both of them, from one end side to the other end side of the two corners located on the diagonal of the rectangular laminated body. They are flexibly deformed in mutually separated directions. This flexural deformation is implemented in a state in which at least one of the flexible plates is adsorbed and the other is fixed by the support portion, and a plurality of movable bodies fixed to the flexible plate are independently moved.

[Prior technical literature] [Patent Literature]

[Patent Document 1] Japanese Patent No. 5155454

[Patent Document 2] Japanese Patent Laid-Open No. 2013-52998

[Patent Document 3] Japanese Patent Laid-Open No. 2014-159337

In the case where the reinforcing plate is peeled from the substrate, the positions of the ends of the flexible plates and the support portion are aligned because the flexible plate and the supporting portion are aligned before the peeling starts. However, due to the bending action (state) of the flexible plate when the peeling operation is performed, the ends of the flexible plate and the support portion do not match.

The inconsistency of the end portions (a phenomenon in which the end portions are staggered) is converted into a load which is intended to stagger the substrates in parallel with respect to the interface between the reinforcing plate and the substrate. As a result, the substrate may be broken due to a load.

The present invention has been made in view of the above-mentioned problems, and an object thereof is to provide a peeling device, a peeling method, and an electronic device manufacturing method capable of suppressing damage to a laminated body due to a bending state during peeling.

One aspect of the peeling device of the laminated body of the present invention is as follows: For a laminated body including a first substrate, a second substrate, and an adhesive layer for bonding the first substrate and the second substrate, The first substrate is separated from the second substrate, and includes a driving portion that flexes and deforms the first substrate or one of the second substrates; and a sliding portion that causes the first substrate and the first substrate to be deformed. The two substrates slide relative to each other in a direction parallel to the first substrate or the second substrate.

The peeling device of the multilayer body of the present invention preferably includes: a support portion that supports the first substrate of the multilayer body; and an adsorption portion that adsorbs the second substrate of the multilayer body through an adsorption surface; The part is mounted in the suction part and the suction The surface on the opposite side of the attached surface moves independently of the supporting portion to deflect and deform the second substrate, and sequentially peels it off at the interface between the first substrate and the second substrate.

Preferably, the adsorption section includes a flexible plate.

It is preferable that a connecting mechanism that connects the flexible plate and the driving unit includes the sliding portion.

Preferably, the sliding portion is provided in a connection portion that connects the support portion and a holding portion that holds the support portion.

One aspect of the peeling method of the laminated body of the present invention is as follows: It is directed to a laminated body provided with a first substrate, a second substrate, and an adhesive layer for bonding the first substrate and the second substrate. The first substrate and the second substrate are peeled off, and the peeling step includes a step of flexing and deforming the first substrate or one of the second substrates by a driving portion, and using a sliding portion to make the first substrate and The second substrate is peeled while sliding relative to each other in a direction parallel to the first substrate or the second substrate.

The method for manufacturing an electronic device according to the present invention includes a functional layer forming step for a multilayer body including a first substrate, a second substrate, and an adhesive layer for bonding the first substrate and the second substrate. 1 forming a functional layer on the exposed surface of the substrate; and a separating step of separating the second substrate from the first substrate on which the functional layer is formed; and the separating step has a stripping step of: The substrate or one of the second substrates is flexibly deformed, and the first substrate and the second substrate are peeled off while sliding relative to each other in a direction parallel to the first substrate or the second substrate by a sliding portion.

According to the peeling device, the peeling method, and the manufacturing method of the electronic device of the laminated body of the present invention, it is possible to suppress damage due to the bending state at the time of peeling.

1‧‧‧ laminated body

1A‧‧‧The first laminated body

1B‧‧‧Second layered body

1C‧‧‧Corner

1D‧‧‧Corner

2‧‧‧ substrate

2A‧‧‧ substrate

2B‧‧‧ substrate

3‧‧‧ Reinforcing board

3A‧‧‧ Reinforcing board

3B‧‧‧ Reinforcing board

4‧‧‧ resin layer

4A‧‧‧Resin layer

4B‧‧‧Resin layer

6‧‧‧ laminated body

6A, 6B‧‧‧ Corner

7‧‧‧ functional layer

8‧‧‧main seal

10‧‧‧ peeling start part making device

12‧‧‧ platform

14‧‧‧ holder

16‧‧‧ height adjustment device

18‧‧‧feeding device

20‧‧‧ Liquid

22‧‧‧Liquid supply device

24‧‧‧ interface

26‧‧‧ Stripping start

28‧‧‧ interface

30‧‧‧ stripping start

40‧‧‧ peeling device

42‧‧‧ stripping unit

44‧‧‧ movable body

46‧‧‧ Mobile device

48‧‧‧Drive

52‧‧‧ flexible board

54‧‧‧ Adsorption Department

56‧‧‧ double-sided adhesive tape

58‧‧‧ flexible board

60‧‧‧breathable sheet

62‧‧‧sealing frame member

64‧‧‧ double-sided adhesive tape

66‧‧‧slot

68‧‧‧through hole

70‧‧‧ par

80‧‧‧ Connected Institutions

82‧‧‧ Concave face

84‧‧‧shell

86‧‧‧holding member

88‧‧‧ convex face

90‧‧‧ sliding path

92‧‧‧ Restricted Department

94‧‧‧ positioning device

100‧‧‧ peeling device

112‧‧‧Elastic sheet

114‧‧‧platform

116‧‧‧Elastic sheet

118‧‧‧ flexible board

118A‧‧‧Body

118B, 118C‧‧‧ protrusion

120‧‧‧ pedestal

122‧‧‧axis

124‧‧‧bearing

126‧‧‧Servo cylinder

126A‧‧‧Cylinder body

126B‧‧‧Piston

128‧‧‧axis

130‧‧‧bearing

132‧‧‧axis

134‧‧‧bearing

140‧‧‧stop

142‧‧‧Spring

N‧‧‧knife

FIG. 1 is an enlarged side view of a main part showing an example of a laminated body supplied to a manufacturing process of an electronic device.

FIG. 2 is an enlarged side view showing a main part of an example of a multilayer body produced in the middle of a step of manufacturing an LCD.

3 (A) to (E) are explanatory diagrams showing a method for producing a peeling start portion using a peeling start portion production device.

FIG. 4 is a plan view of a laminate having a peeling start portion produced by a peeling start portion production method.

5 (A) and 5 (B) are explanatory diagrams showing the configuration and operation of a peeling device according to the first embodiment.

6 (A) and 6 (B) are explanatory diagrams showing the configuration and operation of a peeling device according to the first embodiment.

7 (A) and 7 (B) are explanatory diagrams showing the configuration and operation of the peeling device according to the first embodiment.

FIG. 8 is a plan view schematically showing a flexible plate in which a plurality of movable bodies are arranged with respect to the disposing unit.

9 (A) to (C) are explanatory diagrams showing the configuration of the peeling unit.

FIG. 10 is an enlarged cross-sectional view of a main part showing a state of the coupling mechanism before the peeling starts.

FIG. 11 is an enlarged cross-sectional view of a main part showing a state of the coupling mechanism after the peeling is started.

FIG. 12 is an enlarged sectional view of a main part showing another state of the coupling mechanism after the peeling is started.

Fig. 13 is a plan view showing a peeling device according to a second embodiment.

Fig. 14 is a side view of a peeling device according to a second embodiment.

15 (A) and 15 (B) are explanatory diagrams showing the operation of the peeling device of the second embodiment.

Hereinafter, preferred embodiments of the present invention will be described based on the accompanying drawings. The present invention is explained by the following preferred embodiments. Without departing from the scope of the present invention, many changes can be made, and other embodiments than this embodiment can be used. Therefore, all changes within the scope of the present invention are included in the scope of patent application.

Here, in the drawings, parts indicated by the same symbols are the same elements having the same functions. In addition, in this specification, when "~" is used to indicate a numerical range, numerical values of the upper limit and lower limit indicated by "~" are also included in the numerical range.

Hereinafter, embodiments of the present invention will be described based on the accompanying drawings.

Hereinafter, the case where the peeling device and the peeling method of the laminated body of this invention are used in the manufacturing process of an electronic device is demonstrated.

The electronic device refers to electronic components such as a display panel, a solar cell, and a thin film secondary battery. Examples of the display panel include a liquid crystal display (LCD: Liquid Crystal Display) panel, a plasma display panel (PDP: Plasma Display Panel), and an organic EL display (OELD: Organic Electro Luminescence Display) panel.

[Manufacturing method of electronic device]

The electronic device is formed by forming a functional layer for an electronic device on the first surface of a substrate made of glass, resin, or metal (if it is an LCD, a thin film transistor (TFT) or a color filter (CF) is formed). Manufacturing.

Before the substrate is formed into a functional layer, a second surface of the substrate is attached to a reinforcing plate to form a laminated body. Thereafter, a functional layer is formed on the first surface of the substrate in the state of the laminated body. After the functional layer is formed, the reinforcing plate is peeled from the substrate.

That is, the manufacturing method of the electronic device includes a functional layer forming step of forming a functional layer on the first surface of the substrate in a state of a laminate, and a separating step of separating the reinforcing plate from the substrate on which the functional layer is formed. In this separation step, the layer of the present invention is applied Body peeling device and method.

[Laminated body]

FIG. 1 is an enlarged side view showing a main part of an example of the laminated body 1.

The laminated body 1 includes a substrate 2 on which a functional layer is formed as a first substrate, and a reinforcing plate 3 as a second substrate that reinforces the substrate 2. The reinforcing plate 3 includes a resin layer 4 as a bonding layer on the first surface (the surface facing the substrate 2), and the second surface of the substrate 2 (the first surface on which the functional layer is formed) is attached to the resin layer 4. The opposite). The substrate 2 is releasably attached to the reinforcing plate 3 via the Van der Waals force acting on the resin layer 4 or the adhesive force of the resin layer 4. Regarding the reinforcing plate 3, the second surface (the surface opposite to the first surface facing the substrate 2) is supported by a platform (not shown) or the like.

[Substrate]

A functional layer is formed on the first surface (exposed surface) of the substrate 2 as the first substrate. Examples of the substrate 2 include a glass substrate, a ceramic substrate, a resin substrate, a metal substrate, and a semiconductor substrate. Among the exemplified substrates, a glass substrate is suitable as a substrate 2 for an electronic device because it has excellent chemical resistance, moisture resistance, and a small linear expansion coefficient. In addition, the glass substrate also has the advantage that as the linear expansion coefficient becomes smaller, the pattern of the functional layer formed at high temperatures becomes difficult to stagger when cooled.

Examples of the glass of the glass substrate include alkali-free glass, borosilicate glass, soda lime glass, high silica glass, and other oxide-based glasses containing silicon oxide as a main component. The oxide-based glass is preferably a glass having a silicon oxide content of 40 to 90% by mass, which is obtained by conversion of an oxide.

The glass of the glass substrate is preferably a glass suitable for the type of electronic device to be manufactured and a glass suitable for its manufacturing steps. For example, the glass substrate for a liquid crystal panel is preferably glass (alkali-free glass) that does not substantially contain an alkali metal component.

The thickness of the substrate 2 is set according to the type of the substrate 2. For example, when a glass substrate is used for the substrate 2, the thickness of the electronic device is preferably reduced due to the weight and thickness of the electronic device. It is set to 0.7 mm or less, more preferably 0.3 mm or less, and even more preferably 0.1 mm or less. When the thickness is 0.3 mm or less, good flexibility can be imparted to the glass substrate. Furthermore, when the thickness is 0.1 mm or less, the glass substrate can be wound into a roll shape. The thickness of the glass substrate is preferably 0.03 mm or more from the viewpoint of manufacturing the glass substrate and the viewpoint of handling the glass substrate.

In FIG. 1, the substrate 2 is composed of a single substrate, but the substrate 2 may be composed of a plurality of substrates. That is, the substrate 2 may be formed of a laminated body in which a plurality of substrates are laminated. In this case, the total thickness of all the substrates constituting the substrate 2 becomes the thickness of the substrate 2.

[Boosting board]

Examples of the reinforcing plate 3 of the second substrate include a glass substrate, a ceramic substrate, a resin substrate, a metal substrate, and a semiconductor substrate.

The type of the reinforcing plate 3 is selected according to the type of the electronic device to be manufactured, the type of the substrate 2 used in the electronic device, and the like. If the reinforcing plate 3 and the substrate 2 are made of the same material, it is possible to reduce warping and peeling caused by a temperature change in the step of forming the functional layer.

The difference (absolute value) of the average linear expansion coefficient of the reinforcing plate 3 and the substrate 2 is appropriately set in accordance with the size and shape of the substrate 2 and the like. The difference between the average linear expansion coefficients is preferably 35 × 10 ^-7 / ° C or lower. Here, the "average linear expansion coefficient" means an average linear expansion coefficient in a temperature range of 50 to 300 ° C (JIS R3102: 1995).

The thickness of the reinforcing plate 3 is set to 0.7 mm or less, and is set according to the type of the reinforcing plate 3 and the type and thickness of the substrate 2 to be reinforced. In addition, the thickness of the reinforcing plate 3 may be thicker than the substrate 2 or thinner than the substrate 2, but for reinforcing the substrate 2, it is preferably 0.4 mm or more.

Furthermore, in this example, the reinforcing plate 3 is composed of a single substrate, but the reinforcing plate 3 may be composed of a laminated body in which a plurality of substrates are laminated. In this case, the total thickness of all the substrates constituting the reinforcing plate 3 becomes the thickness of the reinforcing plate 3.

[Resin layer]

In order to prevent the resin layer 4 from peeling between the resin layer 4 and the reinforcing plate 3, the resin layer 4 The bonding force between the layer 4 and the reinforcing plate 3 is set higher than the bonding force between the resin layer 4 and the substrate 2. Thereby, in the peeling step, the interface between the resin layer 4 and the substrate 2 is peeled.

The resin constituting the resin layer 4 is not particularly limited, and examples thereof include an acrylic resin, a polyolefin resin, a polyurethane resin, a polyimide resin, a polysiloxane resin, and a polyimide polysiloxane resin. Several types of resins may be mixed and used. Among these, from the viewpoints of heat resistance and peelability, polysiloxane resins and polyimide polysiloxane resins are preferred.

The thickness of the resin layer 4 is not particularly limited, but is preferably set to 1 to 50 μm, and more preferably set to 4 to 20 μm. By setting the thickness of the resin layer 4 to 1 μm or more, when bubbles or foreign matter are mixed between the resin layer 4 and the substrate 2, the thickness of the bubbles or foreign matter can be absorbed by the deformation of the resin layer 4. On the other hand, by setting the thickness of the resin layer 4 to 50 μm or less, the formation time of the resin layer 4 can be shortened, and since the resin of the resin layer 4 is not used more than necessary, it is more economical.

In addition, the outer shape of the resin layer 4 is preferably the same as or smaller than the outer shape of the reinforcing plate 3 in order that the reinforcing plate 3 can support the entirety of the resin layer 4. The outer shape of the resin layer 4 is preferably the same as the outer shape of the substrate 2 or larger than the outer shape of the substrate 2 so that the resin layer 4 can be in close contact with the entire substrate 2.

In FIG. 1, the resin layer 4 is composed of one layer, and the resin layer 4 may be composed of two or more layers. In this case, the total thickness of all the layers constituting the resin layer 4 becomes the thickness of the resin layer 4. In this case, the types of resin constituting each layer may be different.

Furthermore, in the embodiment, the resin layer 4 of an organic film is used as an adhesive layer, and an inorganic layer may be used instead of the resin layer 4. The inorganic film constituting the inorganic layer includes, for example, at least one selected from the group consisting of a metal silicide, a nitride, a carbide, and a carbonitride.

The metal silicide includes, for example, at least one selected from the group consisting of W, Fe, Mn, Mg, Mo, Cr, Ru, Re, Co, Ni, Ta, Ti, Zr, and Ba, and is preferably Tungsten silicide.

The nitride is, for example, selected from the group consisting of Si, Hf, Zr, Ta, Ti, Nb, Na, Co, At least one of the group consisting of Al, Zn, Pb, Mg, Sn, In, B, Cr, Mo, and Ba is preferably aluminum nitride, titanium nitride, or silicon nitride.

The carbide includes, for example, at least one selected from the group consisting of Ti, W, Si, Zr, and Nb, and is preferably silicon carbide.

The carbonitrides include, for example, at least one selected from the group consisting of Ti, W, Si, Zr, and Nb, and are preferably silicon carbonitrides.

Regarding metal silicides, nitrides, carbides, and carbonitrides, the difference in anodal electrical properties between Si, N, or C contained in the material and other elements contained in the material is smaller, and the polarization is smaller. small. Therefore, the reactivity of the inorganic film with water is low, and it is difficult to generate hydroxyl groups on the surface of the inorganic film. Therefore, when the substrate 2 is a glass substrate, the releasability between the inorganic film and the substrate 2 can be favorably maintained.

Furthermore, although the laminated body 1 of FIG. 1 includes the resin layer 4 as an adhesion layer, it may be configured to include the substrate 2 and the reinforcing plate 3 without the resin layer 4. In this case, the substrate 2 and the reinforcing plate 3 are releasably attached due to the Van der Waals force acting between the substrate 2 and the reinforcing plate 3. In this case, in a state where the substrate 2 and the reinforcing plate 3 are glass substrates, it is preferable that an inorganic material is formed on the first surface of the reinforcing plate 3 in a form in which the substrate 2 and the reinforcing plate 3 do not adhere at high temperatures. film.

[Laminated body with functional layers formed]

A functional layer is formed on the first surface of the substrate 2 of the laminated body 1 by the functional layer forming step. As a method for forming the functional layer, a vapor deposition method such as a CVD (Chemical Vapor Deposition) method, a PVD (Physical Vapor Deposition) method, or a sputtering method is used. The functional layer is formed into a specific pattern by a photolithography method or an etching method.

FIG. 2 is an enlarged side view showing a main part of an example of the multilayer body 6 manufactured in the middle of the manufacturing steps of the LCD.

The laminated body 6 is a layered reinforcing plate 3A, a resin layer 4A, a substrate 2A, a functional layer 7, The substrate 2B, the resin layer 4B, and the reinforcing plate 3B are configured. The reinforcing plate 3A is releasably bonded to the substrate 2A through the resin layer 4A, and the reinforcing plate 3B is releasably bonded to the substrate 2B through the resin layer 4B. That is, the laminated body 6 shown in FIG. 2 corresponds to the laminated body 1 shown in FIG. 1 which is arranged symmetrically with the functional layer 7 interposed therebetween. Hereinafter, a laminated body composed of a substrate 2A, a resin layer 4A, and a reinforcing plate 3A is referred to as a first laminated body 1A, and a laminated body composed of a substrate 2B, a resin layer 4B, and a reinforcing plate 3B is referred to as a second laminated body 1B.

A thin film transistor (TFT) as a functional layer 7 is formed on the first surface of the substrate 2A of the first multilayer body 1A. A color filter (CF) as a functional layer 7 is formed on the first surface of the substrate 2B of the second multilayer body 1B.

The first laminated body 1A and the second laminated body 1B are integrated with each other such that the substrate 2A and the first surface of the substrate 2B overlap each other. Thereby, a laminated body 6 having a structure in which the first laminated body 1A and the second laminated body 1B are arranged symmetrically with the functional layer 7 interposed therebetween is manufactured.

Regarding the laminated body 6, the reinforcing plates 3A and 3B are peeled off in a peeling step, and thereafter, a polarizing plate, a backlight device, and the like are mounted to manufacture an LCD as a product.

In addition, the laminated body 6 in FIG. 2 has a structure in which reinforcing plates 3A and 3B are arranged on both the front and back sides. As a laminated body, a structure in which a reinforcing plate is arranged only on one side.

[Peeling start part making device]

FIGS. 3 (A) to (E) are explanatory diagrams showing the configuration of the peeling start portion producing device 10 used in the peeling start portion preparing step, and FIG. 3 (A) is a view showing the positional relationship between the laminated body 6 and the knife N. 3 (B) is an explanatory diagram of the peeling start portion 26 produced at the interface 24 by the knife N, and FIG. 3 (C) is an explanatory diagram showing a state immediately before the peeling start portion 30 is produced at the interface 28. FIG. 3 (D) is an explanatory diagram of the peeling start portion 30 produced at the interface 28 by the knife N, and FIG. 3 (E) is an explanatory diagram of the laminated body 6 having the peeling start portions 26 and 30. In addition, FIG. 4 is a plan view of the laminated body 6 in which the peeling start portions 26 and 30 are produced.

When the peeling start portions 26 and 30 are produced, as shown in FIG. 3A, the second layer 6 of the reinforcing plate 3B is adsorbed and held on the platform 12 and is supported horizontally (in the X-axis direction in the figure).

The blade N is horizontally supported by the holder 14 so that the blade edge of the end face 6A of the corner portion 6A on one end side of the laminated body 6 faces. In addition, the knife N adjusts the position in the height direction (the Z-axis direction in the figure) by the height adjusting device 16. Further, the knife N and the laminated body 6 are relatively moved in the horizontal direction by a feeding device 18 such as a ball screw device. Regarding the feeding device 18, at least one of the knife N and the platform 12 may be moved in the horizontal direction. In the embodiment, the knife N is moved. Further, the liquid supply device 22 for supplying the liquid 20 is disposed above the knife N before or above the knife N.

[Making method of peeling start part]

In the peeling start part manufacturing method using the peeling start part production device 10, the penetration position of the knife N is set to the corner portion 6A of the laminated body 6, that is, the position overlapping in the thickness direction of the laminated body 6, and the knife N The penetration amount is set in a manner different from the interfaces 24 and 28, respectively.

The manufacturing procedure will be described.

In the initial state, the tip of the knife N is located at a position offset from the interface 24 between the substrate 2B and the resin layer 4B as the first penetration position in the height direction (Z-axis direction). Therefore, first, as shown in FIG. 3 (A), the knife N is moved in the height direction, and the height of the tip of the knife N is set to the height of the interface 24.

Thereafter, as shown in FIG. 3 (B), the knife N is horizontally moved toward the corner portion 6A of the laminated body 6, and the knife N is pierced by a specific amount at the interface 24. The liquid 20 is supplied from the liquid supply device 22 to the upper surface of the knife N at the time of the penetration of the knife N or before the penetration. Thereby, the board | substrate 2B of the corner part 6A is peeled from the resin layer 4B, and as shown in FIG. In addition, the supply of the liquid 20 is not necessary. If the liquid 20 is used, the liquid 20 remains in the peeling start portion 26 even after the blade N is removed, so that the peeling start portion 26 cannot be attached again.

Further, instead of the liquid 20, a protruding portion or the like is provided on the knife N, and the resin layer 4B is cut, whereby a peeling start portion 26 that cannot be attached again can be produced.

Then, the blade N is pulled out from the corner 6A in the horizontal direction, as shown in FIG. 3 (C), and the blade edge of the blade N is set to the height of the interface 28 between the substrate 2A and the resin layer 4A as the second penetration position.

Thereafter, as shown in FIG. 3 (D), the knife N is moved horizontally toward the laminated body 6, and the knife N is pierced by a specific amount at the interface 28. Similarly, the liquid 20 is supplied from the liquid supply device 22 to the upper surface of the knife N. Thereby, as shown in FIG. 3 (D), a peeling start portion 30 is produced on the interface 28. Here, the penetration amount of the knife N with respect to the interface 24 is made smaller than the penetration amount with respect to the interface 28. The above is the method for producing the peeling start portion. In addition, the penetration amount of the knife N with respect to the interface 28 may be set to be smaller than the penetration amount with respect to the interface 24.

The laminated body 6 prepared with the peeling start portions 26 and 30 is taken out from the peeling start portion preparing device 10 and transported to the peeling device described below, and the peeling is performed at the interfaces 24 and 28 in order by the peeling device.

The details of the peeling method will be described later. As shown by arrow A in FIG. 4, the laminated body 6 is bent from the corner portion 6A on one side to the corner portion 6B opposite to the corner portion 6A. At the interface 28 with a larger area of the peeling start portion 30, peeling is initially performed using the peeling start portion 30 as a starting point. Thereby, the reinforcing plate 3A is peeled. Thereafter, the laminated body 6 is bent again from the corner portion 6A to the corner portion 6B, and the peeling start portion 26 is used as the starting point to peel at the interface 24 with a smaller area of the peeling start portion 26. Thereby, the reinforcing plate 3B is peeled.

In addition, the penetration amount of the knife N is preferably set to 7 mm or more and more preferably set to about 15 to 20 mm according to the size of the laminated body 6.

Hereinafter, the peeling apparatus of this embodiment is demonstrated.

[Peeling device of the first embodiment]

5 to 7 are explanatory diagrams (longitudinal sectional views) showing the structure and operation of the peeling device 40 according to the first embodiment, and FIG. 8 is a diagram schematically showing a plurality of movable bodies 44 of the peeling device 40 with respect to the peeling unit 42. A plan view of the peeling unit 42 at the arrangement position. 5 to 7 correspond to cross-sectional views taken along the line C-C in FIG. 8, and the laminated body 6 is indicated by a solid line in FIG. 8.

As shown in FIG. 5 (A), the peeling device 40 includes a pair of movable devices 46 and 46 which are arranged one above the other with the laminated body 6 interposed therebetween. The movable devices 46 and 46 have the same structure. Therefore, the movable device 46 disposed on the upper side in FIG. 5 (A) will be described here, and the movable device 46 disposed on the lower side will be denoted by the same reference numeral and description thereof will be omitted.

The movable device 46 includes a plurality of movable bodies 44, a plurality of driving devices 48 as drive units for moving the movable body 44 up and down for each of the plurality of movable bodies 44, and a control drive device 48 for each of the driving devices 48. Controller (not shown). The movable device 46 will be described later.

Since the peeling unit 42 as the suction portion sequentially deforms the reinforcing plate 3A, the suction plate holds the reinforcing plate 3A in a vacuum. Furthermore, instead of vacuum adsorption, electrostatic adsorption, magnetic adsorption, or adhesive adsorption may be performed.

[Stripping unit]

FIG. 9 (A) is a top view of the peeling unit 42, and FIG. 9 (B) is an enlarged longitudinal cross-sectional view of the peeling unit 42 along line D-D of FIG. 9 (A). In addition, FIG. 9 (C) shows the peeling unit 42 which is provided with the adsorption part 54 which comprises the peeling unit 42 freely with respect to the rectangular plate-shaped flexible plate 52 which comprises the peeling unit 42 via the double-sided adhesive tape 56. Zoomed in longitudinal sectional view.

As described above, the peeling unit 42 is configured by attaching and detaching the suction portion 54 to and from the flexible plate 52 via the double-sided adhesive tape 56.

The suction portion 54 includes a flexible plate 58 which is thinner than the flexible plate 52. The upper surface of the flexible plate 58 is detachably attached to the lower surface of the flexible plate 52 with a double-sided adhesive tape 56 interposed therebetween. The upper surface means the surface on the side opposite to the surface facing the side of the reinforcing plate 3A, and the lower surface means the surface on the side facing the reinforcing plate 3A.

Moreover, the adsorption | suction part 54 is provided with the rectangular air-permeable sheet | seat 60 which comprises the adsorption | suction surface which adsorbs and holds the inner surface of the reinforcement board 3A of the laminated body 6. As shown in FIG. The thickness of the air-permeable sheet 60 is 2 mm or less, preferably 1 mm or less in order to reduce the tensile stress generated in the reinforcing plate 3A at the time of peeling. In the embodiment, a thickness of 0.5 mm is used.

Furthermore, the adsorption part 54 is provided with the sealing frame member 62 which surrounds the air-permeable sheet 60 and abuts the outer peripheral surface of the reinforcing plate 3A. The sealing frame member 62 and the air-permeable sheet 60 are adhered to the lower surface of the flexible plate 58 with a double-sided adhesive tape 64 interposed therebetween. In addition, the sealing frame member 62 is a sponge with independent bubbles having a Shore E hardness of 20 degrees or more and 50 degrees or less, and has a thickness of 0.3 mm to 0.5 mm with respect to the thickness of the air-permeable sheet 60.

A frame-shaped groove 66 is provided between the air-permeable sheet 60 and the seal frame member 62. The flexible plate 52 is provided with a plurality of through-holes 68. One end of the through-holes 68 communicates with the groove 66, and the other end is connected to an air suction source (for example, a vacuum pump) through a suction pipe (not shown).

Therefore, if the suction source is driven, the inner surface of the reinforcing plate 3A of the laminated body 6 is vacuum-adsorbed and held on the air-permeable sheet 60 by sucking the air in the suction pipe, the through hole 68, and the groove 66, and The outer peripheral surface of the reinforcing plate 3A is pressed against the seal frame member 62. Thereby, the airtightness of the adsorption space surrounded by the sealing frame member 62 is improved.

Since the flexible plate 52 has higher bending rigidity than the flexible plate 58, the air-permeable sheet 60, and the sealing frame member 62, the bending rigidity of the flexible plate 52 controls the bending rigidity of the peeling unit 42. The bending rigidity per unit width (1 mm) of the peeling unit 42 is preferably 1000 to 40,000 N. mm ² / mm. For example, in a part where the width of the peeling unit 42 is 100 mm, the bending rigidity becomes 100,000 to 4000000 N. mm ² . By setting the bending rigidity of the peeling unit 42 to 1000N. mm ² / mm or more, it is possible to prevent the bending of the reinforcing plate 3A held by the peeling unit 42. The bending rigidity of the peeling unit 42 is set to 40,000 N. mm ² / mm or less, the reinforcing plate 3A adsorbed and held on the peeling unit 42 can be flexibly deformed.

The flexible plates 52 and 58 are resin members having a Young's modulus of 10 GPa or less, such as polycarbonate resin, polyvinyl chloride (PVC) resin, acrylic resin, and polyacetal (POM: polyoxymethylene) resin. And other resin parts.

[Movable device]

On the upper surface of the peeling unit 42, a plurality of disk-shaped movable bodies 44 shown in FIG. 5 (A) are fixed in a checkerboard shape as shown in FIG. The movable bodies 44 are fixed by fastening members such as bolts. Scheduled for peeling unit 42. In addition, you may fix it instead of a bolt. The movable bodies 44 are independently moved up and down by a driving device 48 driven and controlled by a controller (not shown).

That is, the controller controls the driving device 48 to sequentially move the movable body 44 located on the corner 6A side of the laminated body 6 in FIG. 4 to the movable body 44 located on the corner 6B side in the peeling direction shown by the arrow A. Move up. With this operation, as shown in FIG. 5 to FIG. 7, peeling is gradually performed at the interface 28 of the laminated body 6 with the peeling start portion 30 (see FIG. 4) as a starting point. The laminated body 6 shown in FIGS. 5 to 7 is a laminated body 6 in which peeling start portions 26 and 30 are manufactured by the peeling start portion manufacturing method described in FIG. 3. The laminated body 6 includes a main seal 8 formed around the functional layer 7 and sealing the functional layer 7.

The drive device 48 includes, for example, a rotary servo motor and a ball screw mechanism. The rotary motion of the servo motor is converted into linear motion in the ball screw mechanism and transmitted to the rod 70 of the ball screw mechanism.

As shown in FIG. 5, the plurality of movable bodies 44 are respectively connected to corresponding rods 70 through corresponding connecting mechanisms 80. The plurality of movable bodies 44 can be moved along the axial direction of the lever 70 together with the levers 70 connected to each of them, and can be separated from and separated from the peeling unit 42. By moving the plurality of movable bodies 44 with respect to the peeling unit 42, the reinforcing plates 3A and 3B are flexed and deformed. By driving a plurality of driving devices 48 as driving portions constituting the movable device 46, the peeling unit 42 can be raised and lowered, and one of the reinforcing plates 3A and 3B can be flexed and deformed.

The drive device 48 is not limited to a rotary servo motor and a ball screw mechanism, and may be a linear servo motor or a hydraulic cylinder (for example, a pneumatic cylinder).

The controller is configured as a computer including a recording medium such as a CPU (Central Processing Unit), a ROM (Read Only Memory), and a RAM (Random Access Memory). The controller controls the plurality of driving devices 48 for each of the driving devices 48 by causing the CPU to execute a program recorded on a recording medium, thereby controlling the lifting and lowering movements of the plurality of movable bodies 44.

[Linked agency]

As shown in FIG. 10, the coupling mechanism 80 in the embodiment includes a concave spherical surface portion 82 connected to the lever 70, a housing 84 connected to the movable body 44, and a concave spherical surface portion movably received inside the housing 84 and held. 82 的 保护 机构 86。 82 of holding members 86. The holding member 86 includes a convex spherical surface portion 88 slidably contacting the concave spherical surface portion 82, and a restricting portion 92 for forming a sliding path 90 of the concave spherical surface portion 82 between the convex spherical surface portion 88 and the convex spherical surface portion 88.

As shown in FIG. 10, the size of the internal space of the case 84 is larger than the size of the holding member 86 in the left-right direction of the holding member 86. The holding member 86 can slide the inside of the case 84 in the left-right direction (so-called lateral sliding). Therefore, it is possible to release the load on the substrate 2A caused by the stagger phenomenon parallel to the interface that occurs when the peeling unit 42 is flexed and deformed. In this embodiment, the connection mechanism 80 functions as a sliding portion.

In addition, the concave spherical surface portion 82 and the convex spherical surface portion 88 are positioned so as not to be separated by the restricting portion 92. Since the concave spherical surface portion 82 and the convex spherical surface portion 88 are slidably positioned, the movable body 44 can be tilted following the flexural deformation of the peeling unit 42.

Next, a peeling method of the reinforcing plates 3A and 3B using the peeling device 40 will be described with reference to FIGS. 5 to 7.

As shown in FIG. 5 (A), the lower peeling unit 42 and the upper peeling unit 42 are relatively moved in advance to a fully retracted position. The laminated body 6 is placed on the lower peeling unit 42 by a conveying device (not shown). The reinforcing plate 3B of the laminated body 6 is vacuum-adsorbed by the lower peeling unit 42. The lower peeling unit 42 functions as a support portion for supporting the substrate 2A as the first substrate. In the embodiment, the substrate 2A is indirectly supported by the peeling unit 42 on the lower side.

As shown in FIG. 5 (A), positioning devices 94 disposed oppositely are arranged on both sides of the lower peeling unit 42. The position of the lower peeling unit 42 is set to a specific position by the positioning device 94. Similarly, positioning devices 94 are disposed on opposite sides of the upper peeling unit 42. The position of the upper peeling unit 42 is set to a specific position by the positioning device 94 Home. By the positioning of the positioning device 94, the relative positional relationship between the upper peeling unit 42 and the lower peeling unit 42 is determined. As the positioning device 94, for example, an air cylinder, a servo motor, and the like that can control the positioning lever forward and backward can be used.

As shown in FIG. 5 (B), the lower peeling unit 42 and the upper peeling unit 42 move in a relatively close direction, and the reinforcing plate 3A of the laminated body 6 is vacuum-held and held by the upper peeling unit 42. The reinforcing plate 3A as the second substrate is adsorbed by a gas-permeable sheet (see FIG. 9) constituting the adsorption surface of the peeling unit 42 as the upper side of the adsorption section.

Furthermore, when the substrate 2 of the laminated body 1 shown in FIG. 1 is peeled from the reinforcing plate 3 by the peeling device 40, the peeling unit 42 on the upper side is used to support the substrate 2 as the first substrate (supporting step). The reinforcing plate 3 as the second substrate is sucked and held by the lower peeling unit 42 (adsorption step). In this case, the supporting portion of the supporting substrate 2 is not limited to the peeling unit 42, and may be any one that can detachably support the substrate 2. However, by using the peeling unit 42 as a support portion, the substrate 2 and the reinforcing plate 3 can be bent and peeled at the same time. Therefore, the peeling force can be reduced compared to a configuration in which only the substrate 2 or the reinforcing plate 3 is bent. The substrate 2 as the first substrate may be supported by the lower peeling unit 42 (supporting step), and the reinforcing plate 3 as the second substrate may be adsorbed and held by the upper peeling unit 42 (adsorption step).

As shown in FIG. 5 (B), the positioning device 94 may follow the rising and falling of the peeling unit 42 to move it, and the positioning device 94 may be fixed in advance at a position where the peeling unit 42 is in contact with the laminated body 6.

Next, as shown in FIG. 6 (A), the upper positioning device 94 is moved in a direction away from the upper peeling unit 42, and the lower positioning device 94 is moved in a direction away from the lower positioning device 94. As shown in FIG. 6 (A), for example, the positioning lever is moved backward in a direction away from the peeling unit 42. Thereby, preparations for peeling the reinforcing plate 3A are completed. As shown by the two-dot chain line in the figure, the ends of each of the peeling unit 42 on the upper side and the peeling unit 42 on the lower side are consistent when viewed from the side direction.

Then, as shown in FIG. 6 (B), the upper side peeling unit 42 is flexed and deformed on one side from the corner portion 6A on one end side to the corner portion 6B on the other side of the laminated body 6, while one side is at the interface of the laminated body 6. The reinforcing plate 3A (including the resin layer 4A) is peeled from the peeling start portion 30 (see FIG. 4) as a starting point. That is, among the plurality of movable bodies 44 of the upper peeling unit 42, the movable body 44 located on the corner 6A side of the laminated body 6 and the movable body 44 located on the corner 6B side are sequentially moved upward to peel off at the interface. (Peeling step). In addition, in conjunction with this action, among the plurality of movable bodies 44 of the lower peeling unit 42, the movable body 44 located on the corner 6A side of the laminated body 6 to the movable body 44 located on the corner 6B side They were sequentially moved downward to peel off at the interface. With this, the peeling force can be reduced compared to a configuration in which only the reinforcing plate 3A is bent.

As shown in FIG. 6 (B), when the movable body 44 located at the corner 6A side is moved upward, the end portion of the peeling unit 42 on the upper side and the end portion of the peeling unit 42 on the lower side are inconsistent (staggered) ) S. The reason for this inconsistency is that when the movable body 44 located on the corner 6A side (right side in the figure) of the laminated body 6 is moved up, the remaining movable body 44 is not moved up and stays at the position before peeling. There is no inconsistency between the ends of the peeling unit 42 on the corner 6B side (the left side in the figure) on the upper side and the lower side. When an inconsistency occurs at the end of the corner 6A, the connection mechanism 80 of this embodiment causes the reinforcing plate 3A and the substrate 2A to slide relative to each other in a direction parallel to the interface or in a direction parallel to the reinforcing plate 3A or the substrate 2A. This operation will be described with reference to FIGS. 11 and 12.

FIG. 11 is an enlarged view of a main part of the coupling mechanism 80 located on the upper right side in FIG. 6 (B). As shown in FIG. 11, the connecting mechanism 80 allows the reinforcing plate 3A to slide in a direction opposite to the direction in which the ends are aligned, as shown by an arrow E (left direction), that is, the directions in which the ends are inconsistent are allowed to slide. In this embodiment, the driving device 48, the lever 70, the concave spherical surface portion 82, and the holding member 86 maintain the positions before peeling in the left-right direction in the figure. On the other hand, the entire reinforcing plate 3A, the peeling unit 42, the movable body 44, and the casing 84 connected to the movable body 44 are moved in the direction of the arrow E. That is, compared with FIG. 10, in FIG. 11, the housing 84 moves to the left until it comes into contact with the holding member 86.

FIG. 12 is an enlarged view of a main part of the coupling mechanism 80 located at the upper center in FIG. 6 (B). As shown in FIG. 12, since the concave spherical surface portion 82 and the convex spherical surface portion 88 of the coupling mechanism 80 are slidably positioned, the movable body 44 can be tilted following the flexure and deformation of the peeling unit 42. Further, as in FIG. 11, the reinforcing plate 3A, the peeling unit 42, the movable body 44, and the case 84 connected to the movable body 44 can be moved in the direction of the arrow F as a whole. That is, the reinforcing plate 3A is slid in the direction of the arrow F.

As explained in FIG. 11 and FIG. 12, the sliding function of the connecting mechanism 80 is used to slide the reinforcing plate 3A in a direction parallel to the interface in at least a part of the displacement between the substrate 2A and the reinforcing plate 3A. The load on the substrate 2A caused by the shift can be released. Here, the so-called at least a part means: as shown in FIG. 6 (B), the three connecting mechanisms 80 shown here do not all perform the sliding function, that is, in FIG. 6 (B), the left connecting mechanism 80 is the same as before the peeling. In this state, the sliding function is not performed. On the other hand, the right and center link mechanisms 80 are in a state of performing the sliding function.

Then, as shown in FIG. 7 (A), the peeling unit 42 is flexed and deformed in such a way that the interface between the substrate 2A and the reinforcing plate 3A is peeled in sequence from one end side to the other end side, and the substrate 2A and the reinforcement are deformed. The plate 3A is completely peeled. As shown in FIG. 7 (A), the peeling reinforcing plate 3A is vacuum-adsorbed and held by the peeling unit 42 on the upper side, and the laminated body 6 except the reinforcing plate 3A is vacuum-adsorbed and held by the peeling unit 42 on the lower side.

In addition, a conveying device (not shown) is inserted between the upper and lower peeling units 42 to relatively move the lower peeling unit 42 and the upper peeling unit 42 to a sufficiently retracted position.

As shown in this figure, in a state where the substrate 2A and the reinforcing plate 3A are completely peeled off, the upper peeling unit 42 and the lower peeling unit 42 become inconsistent on the right and left sides. Therefore, in all the connecting mechanisms 80, the reinforcing plate 3A, the peeling unit 42, the movable body 44, and the housing 84 are moved in such a manner that the reinforcing plate 3A slides in the left direction following the displacement between the substrate 2A and the reinforcing plate 3A. To the left. That is, all the connecting mechanisms 80 of FIG. 7 (A) become as shown in FIG. 11 Of the state.

Next, as shown in FIG. 7 (B), the upper positioning device 94 and the lower positioning device 94 are operated, and the positions of the upper peeling unit 42 and the lower peeling unit 42 are adjusted so that the positions of the ends are adjusted. Consistent.

Thereafter, first, the vacuum suction of the upper peeling unit 42 is released. Then, the reinforcing plate 3A is carried out from the peeling device 40 by a carrying device (not shown).

The laminated body 6 other than the reinforcing plate 3A is vacuum-held and held by the upper peeling unit 42 and the lower peeling unit 42. That is, the upper peeling unit 42 and the lower peeling unit 42 move in a relatively close direction, and the upper peeling unit 42 vacuum-holds and holds the substrate 2A (supporting step).

Then, the lower peeling unit 42 is deformed downward from one end side to the other end side of the laminated body 6, and at the interface of the laminated body 6, the reinforcing plate is reinforced with the peeling start portion 26 (see FIG. 4) as a starting point. 3B (including the resin layer 4B) is peeled. That is, among the plurality of movable bodies 44 of the lower peeling unit 42, the movable body 44 located on one end side of the laminated body 6 and the movable body 44 located on the other end side are sequentially moved downward to peel off the interface (peeling step) ). In addition, in conjunction with this action, among the plurality of movable bodies 44 of the upper peeling unit 42, the movable body 44 located on one end side of the laminated body 6 and the movable body 44 located on the other end side are sequentially moved upward. The interface is peeled off. With this, the peeling force can be reduced compared to a configuration in which only the reinforcing plate 3B is bent.

When the reinforcing plate 3B is peeled from the laminated body 6, the reinforcing plate 3A is peeled from the laminated body 6, and the sliding function of the connecting mechanism 80 is used to offset the substrate 2B and the reinforcing plate 3B in at least a part to make reinforcement. The plate 3B slides in a direction parallel to the interface, whereby the load on the substrate 2B caused by the stagger can be released. The above is the peeling method of the laminated body 6 which produced the peeling start part 26 and 30 in the corner part 6A.

In the embodiment, the reinforcing plate 3A is peeled off, and then the method of peeling the reinforcing plate 3B is described. However, the reinforcing plate 3B may be peeled off, and then the reinforcing plate 3A may be peeled off.

A method of sequentially bending the reinforcing plates 3A and 3B by sequentially bending the peeling unit 42 will be described. However, the peeling method of the laminated body 6 is not limited to this, and instead of using the peeling unit 42, an adsorption pad may be used instead of the movable body 44. In the case of using an adsorption pad, the adsorption pads can be used to directly adsorb the reinforcing plates 3A and 3B, so that the adsorption pads are sequentially raised or lowered from one end side to the other end side, thereby sequentially bending the reinforcing plates 3A and 3B.

[Peeling device of the second embodiment]

FIG. 13 is a plan view showing an example of a peeling device 100 according to the second embodiment. 14 is a side view of the peeling device 100 shown in FIG. 13.

In addition, here, the case where the laminated body 1 shown in FIG. 1 and especially the laminated body 1 with a square external shape is peeled off is demonstrated. In addition, the laminated body 1 shown in FIG. 14 is formed, for example, by using a peeling start portion preparation device 10 shown in FIG. 3 to prepare a peeling start portion at a corner 1C.

The peeling device 100 is a device that flexes and deforms the reinforcing plate 3 with respect to the substrate 2 and peels the reinforcing plate 3 (including the resin layer 4) from the substrate 2. At this time, the corner portion 1C on one end side of the laminated body 1 is slowly flexed and deformed toward the corner portion 1D on the other end side of the diagonal line, and the reinforcement plate 3 is lifted from the substrate 2 from the peeling start portion Peel off. Therefore, the peeling is performed from the corner portion 1C on one end side to the corner portion 1D on the other end side of the laminated body 1. In this case, the boundary between the peeled area and the unpeeled area is represented by a straight line, and this straight line is taken as the pre-peel line G. The peeling front line G travels in a direction indicated by an arrow H in FIG. 13. With the peeling device 100, after the reinforcing plate 3 and the substrate 2 are separated at the peeling start portion, the liquid (medium) obtained by preparing the peeling start portion can be sucked and removed. Removal by suction can reduce the contamination caused by the liquid adhering to the device. Suction removal can be performed by arranging a suction nozzle on the side of the peeling start portion.

The peeling device 100 includes a platform 114 that sandwiches the elastic sheet 112 made of rubber so that the substrate 2 cannot be deformed and is adsorbed and held, and a flexibility that sandwiches the reinforcing sheet 3 that is flexibly deformed and held by the elastic sheet 116.板 118。 Plate 118. Elastic sheet 112 and platform 114 as support To function, the elastic sheet 116 and the flexible plate 118 function as an adsorption portion having an adsorption surface.

The stage 114 vacuum-sucks the first surface of the substrate 2 through the elastic sheet 112 and holds it. The platform 114 is horizontally disposed on the upper surface of the pedestal 120. The stage 114 has a larger area than the substrate 2 and has a shape that follows the outer shape of the substrate 2. The pedestal 120 functions as a holding portion that holds a supporting portion including the elastic sheet 112 and the platform 114.

The flexible plate 118 vacuum-sucks and holds the second surface of the reinforcing plate 3 through the elastic sheet 116. The flexible plate 118 includes a main body portion 118A which can be flexibly deformed. The main body portion 118A has a sufficiently larger area than the reinforcing plate 3 and has a shape similar to that of the reinforcing plate 3.

At one end of the main body portion 118A, a rectangular-shaped protruding portion 118B protruding from the corner portion 1C of the laminated body 1 in a horizontal direction outward is provided. Further, at the other end of the main body portion 118A, a rectangular protruding portion 118C protruding from the corner portion 1D of the laminated body 1 to the outside in a horizontal direction is provided. The protruding portions 118B and 118C are arranged along the traveling direction (direction of arrow H) of the peeling front line G.

The bending rigidity per unit width (1mm) of the flexible plate 118 is preferably 1000 to 40,000N. mm ² / mm. For example, in a portion where the width of the flexible plate 118 is 100 mm, the bending rigidity becomes 100,000 to 4000000 N. mm ² . By setting the bending rigidity per unit width (1mm) of the flexible plate 118 to 1000N. mm ² / mm or more, the bending of the reinforcing plate 3 held by the flexible plate 118 can be prevented. In addition, the bending rigidity per unit width (1 mm) of the flexible plate 118 is set to 40,000 N. Below mm ² / mm, the reinforcing plate 3 held by the flexible plate 118 can be flexibly deformed.

As the flexible plate 118, a metal plate may be used in addition to resin plates such as polyvinyl chloride (PVC: Polyvinyl Chloride) resin, polycarbonate resin, acrylic resin, and polyacetal (POM: polyoxymethylene) resin.

A shaft 122 is provided at an end portion of the protruding portion 118C of the flexible plate 118 in the horizontal direction. The shaft 122 is rotatably supported by bearings 124 and 124 fixed on the upper surface of the pedestal 120. Therefore, the flexible plate 118 is centered on the shaft 122 and can tilt freely with respect to the pedestal 120. Ground setting. A servo cylinder 126 is mounted on the flexible plate 118.

The servo cylinder 126 includes a cylinder body 126A and a piston 126B. The servo cylinder 126 is arranged such that the axis of the piston 126B is positioned on a straight line connecting the corner portion 1C and the corner portion 1D of the laminated body 1 in the plan view of FIG. 13. That is, the servo cylinder 126 is arrange | positioned so that the piston 126B may expand and contract in the advancing direction (arrow H direction) of the front line G of peeling.

A shaft 128 is provided at a base end portion of the cylinder body 126A in a horizontal direction. The shaft 128 is rotatably supported by bearings 130 and 130 fixed on the upper surface of the protruding portion 118C of the flexible plate 118.

A shaft 132 is provided at the front end of the piston 126B in the horizontal direction. The shaft 132 is rotatably supported by bearings 134 and 134 fixed to the upper surface of the protruding portion 118B of the flexible plate 118.

A stopper 140 is provided on the upper surface of the pedestal 120 on the side of the corner 1D. The block 140 is fixed to the base 120. A spring 142 is provided on the upper surface of the pedestal 120 as a pressing member on the corner 1C side. The platform 114 is pressed by the spring 142 in the direction of the arrow I. Since the platform 114 is not fixed on the upper surface of the pedestal 120 and is horizontally arranged, the platform 114 can move left and right on the upper surface of the pedestal 120. Therefore, in the state before peeling, the platform 114 is pressed against the stopper 140 by the urging force of the spring 142.

In the present embodiment, the servo cylinder 126 is used as the driving means. However, as the driving means, a linear motion device including a rotary servo motor, a feed screw mechanism, and the like, and a hydraulic cylinder can be used. The overall operation of the peeling device 100 is comprehensively controlled by a control unit (not shown).

Next, a peeling method of the reinforcing plate 3 using the peeling device 100 will be described with reference to FIGS. 15 (A) and 15 (B). 15 (A) and 15 (B) are operation explanatory diagrams of the peeling device 100. 15 (A) shows the state of the peeling device 100 after a specific time has elapsed from the start of peeling, and FIG. 15 (B) shows the state of the peeling device 100 after the specific time has elapsed from the start of peeling.

Regarding the laminated body 1 provided in the peeling device 100, the first surface of the substrate 2 is provided with an elastic sheet interposed therebetween. The material 112 is adsorbed and held on the platform 114. In addition, the second surface of the reinforcing plate 3 is sandwiched between the elastic sheet 116 and held by the flexible plate 118 by suction.

In the initial state, the piston 126B of the servo cylinder 126 is in an extended state (see FIG. 14).

When the piston 126B of the servo cylinder 126 is contracted from the extended state, a force pulling to the protruding portion 118C through the protruding portion 118B acts on the protruding portion 118B. With this force, the flexible plate 118 starts to bend as shown in FIG. 15 (A). As a result, the reinforcing plate 3 adsorbed and held on the flexible plate 118 also starts to bend. Therefore, in the laminated body 1, peeling is started from the peeling start portion having the corner portion 1C.

When the piston 126B of the servo cylinder 126 is further contracted, the flexible plate 118 is further flexed and deformed in conjunction with this operation. In addition, since the servo cylinder 126 is rotatably supported around the shaft 128 and the shaft 132 as the center, the servo cylinder 126 tilts around the shaft 128 in accordance with the bending deformation of the flexible plate 118. In this way, the servo cylinder 126 is slowly tilted, and the flexible plate 118 is slowly flexed and deformed from the protruding portion 118B side to the protruding portion 118C side. As a result, from the corner portion 1C on one side to the corner portion 1D on the other side, The reinforcing plate 3 is slowly peeled off.

At this time, as shown in FIG. 15 (A), before the peeling, the peeling start side (corner 1C side) of the reinforcing plate 3 is pulled in on the elastic sheet 116 serving as the suction surface as shown by arrow J The way of the central part is staggered. As a result, the load caused by the displacement between the reinforcing plate 3 and the substrate 2 is released. In particular, the contact area between the substrate 2 and the reinforcing plate 3 sandwiched by the platform 114 and the flexible plate 118 on the peeling end side (corner 1D side) before the peeling is larger than the substrate 2 and the reinforcing on the peeling start side. The area where the plate 3 is separated. As a result, the reinforcing plate 3 can be easily shifted on the peeled side of the elastic sheet 116, and the load on the substrate 2 can be released.

Further, after the peeling of the reinforcing plate 3 is performed, as shown in FIG. 15 (B), the peeling end side (corner portion 1D side) of the reinforcing plate 3 is placed on the elastic sheet 116 serving as an adsorption surface as shown by an arrow K. The way of pulling into the central part is staggered. Especially in the half after the peeling, the area where the substrate 2 and the reinforcing plate 3 are sandwiched by the platform 114 and the flexible plate 118 on the corner 1D side is smaller than the area separating the substrate 2 and the reinforcing plate 3 on the peeling start side, and The reinforcing plate 3 is adsorbed by the elastic sheet 116 The area becomes larger. As a result, the peeling end side of the reinforcing plate 3 is easily shifted from the elastic sheet 116. Due to the staggering of the reinforcing plate 3, a load is applied to stagger the substrate 2 parallel to the interface. In this embodiment, since the pedestal 120 and the platform 114 are not fixed, the platform 114 is slid on the pedestal 120 following the displacement of the reinforcing plate 3, and the load on the substrate 2 is released by the sliding. As shown in FIG. 15 (B), the platform 114 slides in the direction of arrow K against the pressure of the spring 142.

That is, in this embodiment, the platform 114 is made to slide on the pedestal 120 so that it functions as a sliding portion. The interface between the platform 114 and the pedestal 120 constitutes a connection portion, and the platform 114 can be easily slid on the pedestal 120 by reducing the friction of the interface (connection portion). Therefore, in order to reduce friction, it is preferable to arrange a resin sheet or the like between the platform 114 and the pedestal 120. As the resin sheet, a fluororesin sheet, a polyethylene resin sheet, or the like can be used.

Furthermore, if the reinforcing plate 3 is completely peeled from the substrate 2, the pressure plate 114 is pressed against the stopper 140 by the pressing force of the spring 142. In this embodiment, the stopper 140 and the spring 142 function as a positioning device. In order to limit the sliding movement direction of the platform 114, a guide mechanism such as an LM guide (Linear Motion Guide) may be provided on the base 120.

The case where the peeling device 40 of the first embodiment and the peeling device 100 of the second embodiment follow the states of the reinforcing plates 3, 3A, and 3B and passively perform the sliding function will be described. However, it is not limited to this, and a slide function may be actively performed. For example, a sensor or the like may be provided to detect a positional change in a bent state, and based on the result, an actuator or the like may be used to actively perform a sliding function.

In addition, as long as the load can be released by the slide function, the mechanism, the place where the mechanism is installed, and the like are not limited.

This case is based on Japanese Patent Application 2015-023854 filed on February 10, 2015 and Japanese Patent Application 2015-099739 filed on May 15, 2015, the contents of which are incorporated herein by reference.

Claims (6)

A laminated body peeling device is for a laminated body including a first substrate, a second substrate, and an adhesive layer for bonding the first substrate and the second substrate, and peeling the first substrate from the adhesive layer. And further comprising: a driving portion that flexes and deforms one of the first substrate or one of the second substrates; and a sliding portion that makes the first substrate and the second substrate parallel to the first substrate, Or the second substrate slides relatively in the direction; and includes: a support portion that supports the first substrate of the laminated body; and an adsorption portion that adsorbs the second substrate of the laminated body through an adsorption surface; and The driving portion is mounted on a surface of the suction portion opposite to the suction surface, and the second substrate is flexibly deformed by being independently moved relative to the support portion, and the driving portion is placed on the first substrate and the second substrate. The interface is sequentially peeled off; wherein the suction portion includes a flexible plate; the connecting mechanism that connects the flexible plate and the driving portion is provided with the sliding portion; the sliding portion is provided with: a rod having a connection to the above A concave spherical portion of the driving portion; a housing; and a holding member movably received in the housing and having a convex spherical portion slidably contacting the concave spherical portion. A method for peeling a laminated body is directed to a laminated body including a first substrate, a second substrate, and an adhesive layer for bonding the first substrate and the second substrate, and the first substrate and the above substrate are bonded from the adhesive layer. The second substrate is peeled, and the peeling step includes a step of flexing and deforming the first substrate or one of the second substrates by a driving portion, and the first substrate is deformed by a sliding portion. And the second substrate is peeled while sliding relative to the first substrate or the second substrate in a direction parallel to the first substrate; in the peeling step, the first substrate of the laminated body is supported by a support portion; The adsorption surface adsorbs the second substrate of the laminated body, and the second substrate is moved independently of the support portion by the driving portion mounted on a surface of the adsorption portion opposite to the adsorption surface. The first substrate and the second substrate are peeled in order by being flexibly deformed; the suction portion includes a flexible plate; and the sliding mechanism is provided in the connecting mechanism that connects the flexible plate and the driving portion. The sliding portion includes: a rod having a concave spherical surface portion connected to the driving portion; a housing; and a holding member movably received in the housing and having a convex portion slidably contacting the concave spherical surface portion. Ball face. An electronic device manufacturing method includes a functional layer forming step for a laminated body including a first substrate, a second substrate, and an adhesive layer for bonding the first substrate and the second substrate. A functional layer is formed on the exposed surface of the substrate; and a separating step is to separate the second substrate from the first substrate on which the functional layer is formed; and the separating step has the following peeling step: the driving section is used to make the first layer One of the first substrate or one of the second substrates is flexed and deformed, and the first substrate and the second substrate are peeled relative to each other in a direction parallel to the first substrate or the second substrate by a sliding portion; In the peeling step, the first substrate of the laminated body is supported by a support portion; the second substrate of the laminated body is adsorbed by an adsorption surface of the adsorption portion; The driving portion mounted on a surface of the suction portion opposite to the suction surface moves independently of the support portion to deflect and deform the second substrate, and causes the first substrate and the second substrate to flex and deform. The interface of the substrate is sequentially peeled off; the suction portion includes a flexible plate; the sliding mechanism is provided in a connecting mechanism connecting the flexible plate and the driving portion; the sliding portion includes: a rod having a connection to the above A concave spherical portion of the driving portion; a housing; and a holding member movably received in the housing and having a convex spherical portion slidably contacting the concave spherical portion. A laminated body peeling device is for a laminated body including a first substrate, a second substrate, and an adhesive layer for bonding the first substrate and the second substrate, and peeling the first substrate from the adhesive layer. And further comprising: a driving portion that flexes and deforms one of the first substrate or one of the second substrates; and a sliding portion that makes the first substrate and the second substrate parallel to the first substrate, Or the direction of the second substrate is relatively slid; a support portion that supports the first substrate of the multilayer body; and an adsorption portion that adsorbs the second substrate of the multilayer body through an adsorption surface; wherein the driving portion is mounted on the A surface of the adsorption portion opposite to the adsorption surface, the second substrate is flexibly deformed by being independently moved relative to the support portion, and is located at an interface between the first substrate and the second substrate. The sliding portion is provided at a connection portion connecting the support portion and a holding portion holding the support portion. A method for peeling a laminated body is provided with a first substrate, a second substrate, and A laminated body of an adhesive layer in which the first substrate and the second substrate are bonded together, and the first substrate and the second substrate are peeled from the adhesive layer, and the peeling step includes: The first substrate or one of the second substrates is flexibly deformed, and the first substrate and the second substrate are peeled off relative to each other in a direction parallel to the first substrate or the second substrate by a sliding portion. Wherein, in the peeling step, the first substrate of the laminated body is supported by the support portion; the second substrate of the laminated body is adsorbed by the adsorption surface of the adsorption portion; and the adsorption is performed by being installed in the adsorption portion and the adsorption The driving part on the opposite side of the surface moves independently from the supporting part to deflect and deform the second substrate, and sequentially peels off at the interface between the first substrate and the second substrate; A connection portion that connects the support portion and a holding portion that holds the support portion includes the sliding portion. An electronic device manufacturing method includes a functional layer forming step for a laminated body including a first substrate, a second substrate, and an adhesive layer for bonding the first substrate and the second substrate. A functional layer is formed on the exposed surface of the substrate; and a separating step is to separate the second substrate from the first substrate on which the functional layer is formed; and the separating step has the following peeling step: the driving section is used to make the first layer One of the first substrate or one of the second substrates is flexed and deformed, and the first substrate and the second substrate are peeled relative to each other in a direction parallel to the first substrate or the second substrate by a sliding portion; In the peeling step, the first substrate of the laminated body is supported by a support portion; the second substrate of the laminated body is adsorbed by an adsorption surface of the adsorption portion; The driving portion mounted on a surface of the suction portion opposite to the suction surface moves independently of the support portion to deflect and deform the second substrate, and causes the first substrate and the second substrate to flex and deform. The interface of the substrate is sequentially peeled off. The sliding portion is provided at a connection portion connecting the support portion and a holding portion holding the support portion.