[go: up one dir, main page]

TWI652238B - 貼合基板之分斷方法 - Google Patents

貼合基板之分斷方法 Download PDF

Info

Publication number
TWI652238B
TWI652238B TW104108450A TW104108450A TWI652238B TW I652238 B TWI652238 B TW I652238B TW 104108450 A TW104108450 A TW 104108450A TW 104108450 A TW104108450 A TW 104108450A TW I652238 B TWI652238 B TW I652238B
Authority
TW
Taiwan
Prior art keywords
scribe
groove
guide
liquid crystal
sealing
Prior art date
Application number
TW104108450A
Other languages
English (en)
Chinese (zh)
Other versions
TW201600483A (zh
Inventor
徐鏞植
金判謙
Original Assignee
日商三星鑽石工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商三星鑽石工業股份有限公司 filed Critical 日商三星鑽石工業股份有限公司
Publication of TW201600483A publication Critical patent/TW201600483A/zh
Application granted granted Critical
Publication of TWI652238B publication Critical patent/TWI652238B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/57—Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/027—Scoring tool holders; Driving mechanisms therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • C03B33/076—Laminated glass comprising interlayers
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Nonlinear Science (AREA)
  • Thermal Sciences (AREA)
  • Plasma & Fusion (AREA)
  • General Physics & Mathematics (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Manufacturing & Machinery (AREA)
  • Mathematical Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Liquid Crystal (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Laser Beam Processing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
TW104108450A 2014-06-25 2015-03-17 貼合基板之分斷方法 TWI652238B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
??10-2014-0078282 2014-06-25
KR20140078282 2014-06-25
KR1020140106714A KR101596296B1 (ko) 2014-06-25 2014-08-18 접합 기판의 커팅 방법
??10-2014-0106714 2014-08-18

Publications (2)

Publication Number Publication Date
TW201600483A TW201600483A (zh) 2016-01-01
TWI652238B true TWI652238B (zh) 2019-03-01

Family

ID=55164738

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104108450A TWI652238B (zh) 2014-06-25 2015-03-17 貼合基板之分斷方法

Country Status (3)

Country Link
JP (1) JP6536099B2 (ja)
KR (1) KR101596296B1 (ja)
TW (1) TWI652238B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2019131525A1 (ja) * 2017-12-27 2021-01-14 三星ダイヤモンド工業株式会社 スクライブ加工方法及びスクライブ加工装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002172479A (ja) * 2000-09-20 2002-06-18 Seiko Epson Corp レーザ割断方法、レーザ割断装置、液晶装置の製造方法並びに液晶装置の製造装置
JP2002287107A (ja) * 2001-03-28 2002-10-03 Hitachi Ltd 液晶表示装置およびその製造方法
JP2003002676A (ja) * 2001-06-19 2003-01-08 Seiko Epson Corp 基板の分割方法及び液晶装置の製造方法
KR100689314B1 (ko) * 2003-11-29 2007-03-08 엘지.필립스 엘시디 주식회사 액정표시패널의 절단방법
JP4890462B2 (ja) * 2005-10-28 2012-03-07 三星ダイヤモンド工業株式会社 脆性材料基板のスクライブライン形成方法およびスクライブライン形成装置
WO2010029660A1 (ja) * 2008-09-12 2010-03-18 シャープ株式会社 表示パネルの製造方法
JP2010095414A (ja) * 2008-10-17 2010-04-30 Linkstar Japan Co Ltd ディスプレイ用マザーガラス基板および脆性材料基板の切断方法、ディスプレイの製造方法
JP5481167B2 (ja) * 2009-11-12 2014-04-23 浜松ホトニクス株式会社 ガラス溶着方法

Also Published As

Publication number Publication date
JP6536099B2 (ja) 2019-07-03
KR20160000812A (ko) 2016-01-05
TW201600483A (zh) 2016-01-01
JP2016008172A (ja) 2016-01-18
KR101596296B1 (ko) 2016-02-22

Similar Documents

Publication Publication Date Title
KR101971202B1 (ko) 유기 발광 표시 장치 및 그 제조방법
TWI633594B (zh) Optical device wafer processing method
TW201632359A (zh) 玻璃載體組件及用於處理撓性玻璃片的方法
TWI472855B (zh) 顯示面板及其製作方法
WO2016000418A1 (zh) 柔性显示面板母板及柔性显示面板的制作方法
JP5949334B2 (ja) 貼り合わせ基板、及び製造方法
CN105892133B (zh) Tft-lcd的显示面板制造方法、显示面板及显示器
TWI656571B (zh) Substrate cutting method
KR20140141906A (ko) 액정표시장치 및 그 제조방법
TWI652238B (zh) 貼合基板之分斷方法
TWI669278B (zh) 貼合基板之分斷方法
JP6565544B2 (ja) 接合基板の切断方法
JP2016112714A (ja) 基板の分断方法及び分断装置
CN105278136B (zh) 贴合基板的分断方法
JP6512221B2 (ja) パネルの製造方法
KR20150045759A (ko) 기판 절단 방법
JP2008003388A (ja) フラットパネルディスプレイおよびその製造方法
TW201938309A (zh) 劃線加工方法及劃線加工裝置
TW201513367A (zh) 薄膜電晶體基板的製造方法及液晶面板的製造方法
JP2007304297A (ja) 液晶表示装置の製造方法
JP2018036291A5 (ja)
TW201811692A (zh) 基板分斷裝置及基板分斷方法
JP2016088810A (ja) スクライブ方法及びスクライブ装置
JP2009256151A (ja) ガラス基板の分断方法及び表示パネルの製造方法
WO2016007695A1 (en) Methods for separating a glass sheet