TWI650293B - Scribe tool - Google Patents
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- TWI650293B TWI650293B TW104107539A TW104107539A TWI650293B TW I650293 B TWI650293 B TW I650293B TW 104107539 A TW104107539 A TW 104107539A TW 104107539 A TW104107539 A TW 104107539A TW I650293 B TWI650293 B TW I650293B
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- 239000000758 substrate Substances 0.000 claims abstract description 121
- 239000003566 sealing material Substances 0.000 claims abstract description 20
- 239000000696 magnetic material Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 25
- 239000011521 glass Substances 0.000 description 44
- 230000035515 penetration Effects 0.000 description 22
- 238000002474 experimental method Methods 0.000 description 19
- 230000007246 mechanism Effects 0.000 description 17
- 239000004973 liquid crystal related substance Substances 0.000 description 11
- 238000005336 cracking Methods 0.000 description 8
- 238000002347 injection Methods 0.000 description 6
- 239000007924 injection Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000003028 elevating effect Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000013077 scoring method Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 230000005294 ferromagnetic effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 238000012512 characterization method Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
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- Physics & Mathematics (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Liquid Crystal (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
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Abstract
於密封材之正上及正下之位置形成刻劃線之情況下,提供一種能夠於基板形成足夠之深度之裂紋之刻劃工具。 In the case where the scribe line is formed at the position directly above and below the sealing material, a scribe tool capable of forming a crack of a sufficient depth on the substrate is provided.
刻劃工具30、40具備:保持具303、403;槽303a、403a,形成於保持具303、403與保持具303a、403a之下面;一對槽303b、403b,以夾持槽303a、403a之方式形成於保持具304、404之下面;刻劃輪301、401,於槽303a、403a可旋轉地裝設;一對輥302、402,於一對槽303b、403b分別可旋轉地裝設;刻劃輪301、401之軸301a、401a與輥302、402之軸302a、402a於刻劃方向僅互相分離既定距離。 The scribing tools 30 and 40 are provided with holders 303 and 403, grooves 303a and 403a formed under the holders 303 and 403 and the holders 303a and 403a, and a pair of grooves 303b and 403b for holding the grooves 303a and 403a. The method is formed on the lower surface of the holders 304 and 404; the scoring wheels 301 and 401 are rotatably mounted on the grooves 303a and 403a; and the pair of rollers 302 and 402 are rotatably mounted on the pair of grooves 303b and 403b, respectively; The shafts 301a, 401a of the scoring wheels 301, 401 and the shafts 302a, 402a of the rollers 302, 402 are separated from each other by a predetermined distance in the scoring direction.
Description
本發明係關於一種刻劃工具,用於在將刻劃線形成於基板時。 The present invention relates to a scoring tool for forming a score line on a substrate.
以往,玻璃基板等脆性材料基板之分斷係藉由於基板表面形成刻劃線之刻劃步驟,以及沿著被形成之刻劃線而於基板表面施加既定之力之裂斷步驟而進行。於刻劃步驟中,刻劃輪之刀尖,係一面壓抵於基板表面,一面沿著既定之線而被移動。於刻劃線之形成中,使用具備刻劃頭之刻劃裝置。 Conventionally, the breaking of a brittle material substrate such as a glass substrate is performed by a step of forming a scribe line on the surface of the substrate, and a step of applying a predetermined force to the surface of the substrate along the formed scribe line. In the scribing step, the tip of the scoring wheel is pressed against the surface of the substrate while being moved along a predetermined line. In the formation of the score line, a scoring device having a scribing head is used.
下述之專利文獻1中,記載有用於自母基板將液晶面板切除之方法。此方法中,藉由將形成有薄膜電晶體(TFT)之基板及形成有濾色片(CF)之基板透過密封材貼合而形成母基板。藉由此母基板之分斷而獲得各個液晶面板。 Patent Document 1 listed below describes a method for cutting a liquid crystal panel from a mother substrate. In this method, a mother substrate is formed by bonding a substrate on which a thin film transistor (TFT) is formed and a substrate on which a color filter (CF) is formed through a sealing material. Each liquid crystal panel is obtained by the division of the mother substrate.
密封材,係以兩個基板貼合之狀態保留形成液晶注入區域之空間之方式配置。 The sealing material is disposed such that the space in which the liquid crystal injection regions are formed remains in a state in which the two substrates are bonded together.
將上述之構成之母基板進行分斷之情形,能夠使用下述方法:使用兩個刻劃頭,於母基板之兩面,同時形成刻劃線之方法(例如,參照專利文獻2)。此情形,兩個刻劃頭以夾持母基板之方式配置。兩個刻劃輪被定位於俯視基板時之相同位置。此狀態中,兩個刻劃輪於相同方向同 時地被移動而於基板之各表面形成刻劃線。 In the case where the mother substrate having the above configuration is divided, a method of forming a scribe line on both surfaces of the mother substrate by using two scribe heads can be used (for example, refer to Patent Document 2). In this case, the two scribing heads are configured to sandwich the mother substrate. The two scoring wheels are positioned at the same position as when the substrate is viewed from above. In this state, the two scoring wheels are in the same direction The time is moved to form a score line on each surface of the substrate.
[專利文獻1]日本特開2006-137641號公報 [Patent Document 1] Japanese Laid-Open Patent Publication No. 2006-137641
[專利文獻2]日本特開2012-241902號公報 [Patent Document 2] Japanese Patent Laid-Open Publication No. 2012-241902
如上述專利文獻1所示,於習知之母基板中,在相鄰之液晶注入區域間,存在有無介入密封材之區域。故,於藉由如上述之兩個刻劃頭而於母基板之兩面同時形成刻劃線之情形,在無介入密封材之區域,能夠形成刻劃線。若如此方式形成刻劃線而將母基板分斷,則於液晶面板於液晶注入區域之周圍殘留有既定寬度之邊緣區域。 As shown in the above Patent Document 1, in the conventional mother substrate, there is a region where there is no intervening sealing material between adjacent liquid crystal injection regions. Therefore, in the case where the scribe lines are simultaneously formed on both surfaces of the mother substrate by the two scribe heads as described above, the scribe line can be formed in the region where the intervening sealing material is not provided. When the mother substrate is formed by forming the scribe line in this manner, the liquid crystal panel has an edge region of a predetermined width remaining around the liquid crystal injection region.
但是,近年來,尤其是在手機用液晶面板,使上述邊緣區域極致地狹窄逐漸成為主流。為了因應此需求,於母基板省略無介入密封材之區域,且相鄰之液晶注入區域,需要以僅藉由密封材分隔之方式構成。此情形,刻劃線成為,形成於密封材之正下以及正下。 However, in recent years, especially in liquid crystal panels for mobile phones, the narrow edge region has become the mainstream. In order to meet this demand, the region where the intervening sealing material is not disposed on the mother substrate is omitted, and the adjacent liquid crystal injection regions need to be separated by only the sealing material. In this case, the score line is formed to be formed directly under the seal member and directly below.
然而,經本案發明者們確認有如下問題:若如此方式於密封材之正上以及正下之位置形成刻劃線,則無法於兩個玻璃基板充分地產生裂紋。若於如此裂紋不充分之狀態實行裂斷步驟,則裂斷後之基板之端緣產生細微龜裂或破損而有玻璃基板強度低下之虞。 However, the inventors of the present invention have confirmed that if the scribe line is formed at the position immediately above and below the sealing material in this manner, cracks cannot be sufficiently generated on the two glass substrates. When the cracking step is performed in such a state that the crack is insufficient, the edge of the substrate after the cracking is slightly cracked or broken, and the strength of the glass substrate is lowered.
鑑於此課題,本發明係以提供一種刻劃工具做為目的,於密封材之正上以及正下之位置形成刻劃線之情形,能夠於基板形成充分深度之裂紋。 In view of the above problems, the present invention provides a scribing tool for forming a scribe line at a position directly above and below a sealing material, and is capable of forming a crack having a sufficient depth on the substrate.
本案發明者們反覆的嘗試錯誤,發現於密封材之正上以及正 下之位置形成刻劃線之情形,藉由將於母基板之上面及下面之各刻劃位置於刻劃方向僅移動既定距離,產生較各基板深之裂紋。本發明係關於一種刻劃工具,能夠於母基板之上面及下面之各刻劃位置僅於刻劃方向移動既定距離,並且與刻劃輪之相反側之面由輥按壓。 The inventors of this case repeatedly tried the mistake and found it on the front and the positive side of the sealing material. In the case where the lower position forms a scribe line, only a predetermined distance is generated in the scribe direction by the scribe positions on the upper and lower sides of the mother substrate, and cracks deeper than the respective substrates are generated. The present invention relates to a scribing tool capable of moving a predetermined distance only in the scoring direction at each of the scribing positions on the upper and lower sides of the mother substrate, and pressing the surface opposite to the scoring wheel by a roller.
本發明之主樣態係關於一種刻劃工具,於在將第1基板與第2基板藉由密封材貼合而成之母基板形成刻劃線時使用。本樣態之刻劃工具具備:保持具;第1槽,形成於前述保持具之下面;一對第2槽,以夾持前述第1槽之方式形成於前述保持具之下面;刻劃輪,於前述第1槽可旋轉地裝設;一對輥,於前述一對第2槽分別可旋轉地裝設。前述刻劃輪之旋轉軸與前述輥之旋轉軸於刻劃方向僅互相分離既定距離。 The main aspect of the present invention relates to a scribing tool which is used when forming a scribe line on a mother substrate in which a first substrate and a second substrate are bonded together by a sealing material. The scribing tool of the present aspect includes: a holder; a first groove formed on the lower surface of the holder; and a pair of second grooves formed on the lower surface of the holder so as to sandwich the first groove; the scoring wheel The first groove is rotatably mounted; and the pair of rollers are rotatably mounted in the pair of second grooves. The rotation axis of the scoring wheel and the rotation axis of the roller are separated from each other by a predetermined distance in the scribing direction.
藉由使用本樣態之刻劃工具,能夠於母基板之上面及下面之各刻劃位置僅於刻劃方向移動既定距離,並且與刻劃輪之相反側之面由輥按壓。藉此,裂紋之深度變深,並且能夠使裂紋之形成狀況安定化。 By using the scribing tool of the present state, it is possible to move a predetermined distance only in the scribing direction on each of the scribing positions on the upper and lower sides of the mother substrate, and the surface opposite to the scoring wheel is pressed by the roller. Thereby, the depth of the crack becomes deep, and the formation state of the crack can be stabilized.
本樣態之刻劃工具,係能夠以前述一對輥之一部分夾持前述刻劃輪之一部分之方式配置前述刻劃輪與前述一對輥。藉由此構成,能夠使刻劃輪與輥之間之距離於刻劃方向上縮小。 In the sculpt tool of the present aspect, the scoring wheel and the pair of rollers can be disposed such that one of the pair of rollers partially clamps a portion of the scoring wheel. With this configuration, the distance between the scoring wheel and the roller can be reduced in the scribing direction.
於本樣態之刻劃工具,前述保持具係由磁性材料構成,且能夠得到將圓柱之側面斜切除而形成傾斜面之形狀。若以此方式,則藉由於裝設有刻劃頭之保持具之孔設置磁石,能夠圓滑地將刻劃工具裝設於刻劃頭。又,藉由於該孔配置抵接於前述傾斜面之銷,能夠將刻劃工具定位於常規位置。 In the sculpt tool of the present aspect, the holder is made of a magnetic material, and a shape in which the side surface of the cylinder is obliquely cut to form an inclined surface can be obtained. In this way, the scoring tool can be smoothly mounted on the scribing head by providing the magnet by the hole in which the holder of the scribing head is provided. Further, since the hole is disposed to abut against the pin of the inclined surface, the scribing tool can be positioned at a normal position.
此情形,前述第1槽與前述第2槽於前述保持具之兩個側面 連通而形成,且前述傾斜面設於前述第1槽與前述第2槽連通之兩個前述側面中之一方之側面,且前述刻劃輪與前述一對輥,係以前述刻劃輪較前述一對輥靠近形成有前述傾斜面之前述側面之方式形成。 In this case, the first groove and the second groove are on both sides of the holder The inclined surface is formed on one side of one of the two side faces that communicate with the first groove and the second groove, and the scribing wheel and the pair of rollers are the aforementioned scribing wheel The pair of rolls are formed close to the side surface on which the inclined surface is formed.
或者,前述第1槽與前述第2槽於前述保持具之兩個側面連通而形成,且前述傾斜面設於前述第1槽與前述第2槽連通之兩個前述側面中之一方之側面,且前述刻劃輪與前述一對輥,係以前述一對輥較前述刻劃輪靠近形成有前述傾斜面之前述側面之方式形成。 Alternatively, the first groove and the second groove are formed to communicate with the two side faces of the holder, and the inclined surface is provided on one side of one of the two side faces that communicate with the first groove and the second groove. Further, the scribing wheel and the pair of rollers are formed such that the pair of rollers are closer to the side surface of the inclined surface than the scribing wheel.
這樣一來,刻劃輪與一對輥之排列順序以傾斜面做為基準,預先準備互相相異之2種類之刻劃工具,藉此,僅由分別裝設與將母基板上下夾持之一對刻劃頭相異之種類之刻劃工具,可使上側之刻劃輪與下側之輥互相對向,又,可使下側之刻劃輪與上側之輥互相對向。 In this way, the arrangement order of the scoring wheel and the pair of rollers is based on the inclined surface, and two kinds of scribing tools different from each other are prepared in advance, whereby the parent substrate is separately mounted and held separately. A pair of scoring tools of different types can be used to make the upper scoring wheel and the lower roller oppose each other, and the lower scoring wheel and the upper roller can be opposed to each other.
於本樣態之刻劃工具,理想為將前述既定距離設定為0.5mm以上。若如此,能夠有效的加深裂紋之深度。 In the characterization of the tool, it is desirable to set the aforementioned predetermined distance to 0.5 mm or more. If so, the depth of the crack can be effectively deepened.
又,於本樣態之刻劃工具,前述刻劃輪,係能夠於圓板之外周形成V字形之刀尖並且於前述刀尖之稜線以既定間隔具有槽而形成。於以下所示之實施形態,藉由此種刻劃輪進行實驗,確認深入形成裂紋。 Further, in the present state, the scribing wheel is formed by forming a V-shaped blade edge on the outer circumference of the disk and having grooves at a predetermined interval on the ridge line of the blade edge. In the embodiment shown below, an experiment was conducted by using such a scribing wheel to confirm that cracks were formed in depth.
如上所述,根據本發明,能夠提供一種刻劃工具,於密封材之正上以及正下之位置形成刻劃線之情形,能夠於基板形成充分的深度之裂紋。 As described above, according to the present invention, it is possible to provide a scribing tool in which a scribe line is formed at a position directly above and below the sealing material, and a crack of a sufficient depth can be formed on the substrate.
本發明之效果至意義,藉由以下所示之實施形態之說明進一步明確。 The effects and significance of the present invention will be further clarified by the description of the embodiments shown below.
但是,以下所示之實施形態,當然只是本發明進行實施化時之一個例 示,本發明並非限制於以下之實施形態所記載。 However, the embodiment shown below is of course only an example when the present invention is implemented. It is to be noted that the present invention is not limited to the embodiments described below.
30、40‧‧‧刻劃工具 30, 40‧‧‧ scribing tools
301、401‧‧‧刻劃輪 301, 401‧‧‧ marking wheel
302、402‧‧‧輥 302, 402‧‧‧ Roll
303、403‧‧‧保持具 303, 403‧‧‧ Keeping
303a、403a‧‧‧槽(第1槽) 303a, 403a‧‧‧ slots (1st slot)
303b、403b‧‧‧槽(第2槽) 303b, 403b‧‧‧ slots (2nd slot)
303c、403c‧‧‧傾斜面 303c, 403c‧‧‧ sloped surface
圖1係以示意表示實施形態之刻劃裝置之構成之圖。 Fig. 1 is a view schematically showing the configuration of a scoring apparatus of an embodiment.
圖2係表示實施形態之刻劃頭之構成之分解立體圖。 Fig. 2 is an exploded perspective view showing the configuration of the scribe head of the embodiment.
圖3係表示實施形態之刻劃頭之構成之立體圖。 Fig. 3 is a perspective view showing the configuration of the scribe head of the embodiment.
圖4係說明刻劃方法1之圖。 Fig. 4 is a view for explaining the scribing method 1.
圖5係表示刻劃方法1進行之實驗結果之圖。 Fig. 5 is a view showing the results of experiments conducted by the scribing method 1.
圖6係說明實施形態之刻劃方法2之圖。 Fig. 6 is a view for explaining the scribing method 2 of the embodiment.
圖7係表示實施形態之另一刻劃方法2進行之實驗結果之圖。 Fig. 7 is a view showing the results of an experiment conducted by another scribing method 2 of the embodiment.
圖8係表示實施形態之刻劃工具之構成之立體圖。 Fig. 8 is a perspective view showing the configuration of a scribing tool of the embodiment.
圖9係表示實施形態之刻劃工具之構成之立體圖。 Fig. 9 is a perspective view showing the configuration of a scribing tool of the embodiment.
圖10係表示實施形態之刻劃工具之構成之立體圖。 Fig. 10 is a perspective view showing the configuration of a scribing tool of the embodiment.
圖11係以示意表示實施形態之刻劃工具之安裝方法之圖。 Fig. 11 is a view schematically showing a method of mounting the scoring tool of the embodiment.
圖12係以示意表示變更例之刻劃工具之構成之圖。 Fig. 12 is a view schematically showing the configuration of a scribing tool of a modified example.
以下,關於本發明之實施形態,參照圖面進行說明。再者,於各圖,方便起見,注記有互相正交之X軸、Y軸及Z軸。X-Y平面於水平面平行,Z軸方向為鉛直方向。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. Furthermore, in the drawings, for convenience, the X-axis, the Y-axis, and the Z-axis orthogonal to each other are noted. The X-Y plane is parallel to the horizontal plane and the Z-axis direction is the vertical direction.
<刻劃裝置> <scratching device>
圖1(a)、(b)係以示意表示刻劃裝置1之構成之圖。圖1(a)係自Y軸之正側觀察刻劃裝置1之圖。圖1(b)係自X軸之正側觀察刻劃裝置1之圖。 1(a) and 1(b) are diagrams schematically showing the configuration of the scoring apparatus 1. Fig. 1(a) is a view of the scribing device 1 as seen from the positive side of the Y-axis. Fig. 1(b) is a view of the scribing device 1 as seen from the positive side of the X-axis.
參照圖1(a),刻劃裝置1具備:輸送帶11、支柱12a、12b、導件13a、13b、導件14a、14b、滑動單元15、16、兩個刻劃頭2。 Referring to Fig. 1(a), the scoring apparatus 1 includes a conveyor belt 11, pillars 12a and 12b, guides 13a and 13b, guides 14a and 14b, sliding units 15, and 16, and two scribing heads 2.
如圖1(b)所示,輸送帶11,係於Y軸方向延伸設於除了配置有刻劃頭2之處。在輸送帶11上載置有母基板G。母基板G具有一對玻璃基板互相貼合之基板構造。母基板G藉由輸送帶11於Y軸方向被運送。 As shown in Fig. 1(b), the conveyor belt 11 is extended in the Y-axis direction except where the scribing head 2 is disposed. The mother substrate G is placed on the conveyor belt 11. The mother substrate G has a substrate structure in which a pair of glass substrates are bonded to each other. The mother substrate G is carried by the conveyor belt 11 in the Y-axis direction.
支柱12a、12b,係於刻劃裝置1之基座將輸送帶11夾持而垂直地設置。導件13a、13b及導件14a、14b,係分別以成為於X軸方向平行之方式架設於支柱12a、12b之間。滑動單元15、16,係分別滑動自在地設於導件13a、13b、導件14a、14b。於導件13a、13b及導件14a、14b分別設有既定的驅動機構,且藉由此驅動機構,滑動單元15、16於X軸方向移動。 The pillars 12a and 12b are attached to the base of the scoring apparatus 1 to sandwich the conveyor belt 11 and are vertically disposed. The guides 13a and 13b and the guides 14a and 14b are respectively disposed between the pillars 12a and 12b so as to be parallel to each other in the X-axis direction. The slide units 15 and 16 are slidably provided on the guides 13a and 13b and the guides 14a and 14b, respectively. Each of the guides 13a and 13b and the guides 14a and 14b is provided with a predetermined drive mechanism, and by this drive mechanism, the slide units 15 and 16 are moved in the X-axis direction.
於滑動單元15、16,分別裝設有刻劃頭2。於Z軸正側之刻劃頭2與Z軸負側之刻劃頭2分別以與母基板G對向之方式安裝有刻劃工具30、40。以被保持於刻劃工具30、40之刻劃輪按壓於母基板G之表面之狀態,刻劃頭2於X軸方向移動。藉此,於母基板G之表面形成刻劃線。 The scribing heads 2 are respectively mounted on the sliding units 15, 16. The scribing heads 2 on the positive side of the Z-axis and the scribing heads 2 on the negative side of the Z-axis are respectively attached with the scribing tools 30, 40 so as to face the mother substrate G. The scribing head 2 is moved in the X-axis direction while being pressed by the scribing wheel held by the scribing tools 30 and 40 on the surface of the mother substrate G. Thereby, a scribe line is formed on the surface of the mother substrate G.
<刻劃頭> <scribe head>
圖2係表示刻劃頭2之一部分之分解立體圖。圖3係表示之刻劃頭2之構成之立體圖。 Fig. 2 is an exploded perspective view showing a portion of the scribing head 2. Fig. 3 is a perspective view showing the configuration of the scribe head 2.
參照圖2,刻劃頭2具備:升降機構21、刻劃線形成機構22、基座板23、頂板24、底板25、橡膠框26、外蓋27、伺服馬達28。 Referring to Fig. 2, the scribing head 2 includes an elevating mechanism 21, a scribing line forming mechanism 22, a base plate 23, a top plate 24, a bottom plate 25, a rubber frame 26, an outer cover 27, and a servo motor 28.
升降機構21具備:連結於伺服馬達28之驅動軸之圓筒凸輪21a,及形成於升降部21b之上面之從動件21c。升降部21b,係透過滑動件 (未圖示)於基座板23可於上下方向移動地被支持,且藉由彈簧21d於Z軸正方向施力。藉由彈簧21d之施力,從動件21c被按壓於圓筒凸輪21a之下面。升降部21b連結於刻劃線形成機構22。若藉由伺服馬達28轉動圓筒凸輪21a,則藉由圓筒凸輪21a之凸輪作用升降部21b進行升降,伴隨此,刻劃線形成機構22進行升降。於刻劃線形成機構22之下端裝設有刻劃線工具30、40。 The elevating mechanism 21 includes a cylindrical cam 21a connected to a drive shaft of the servo motor 28, and a follower 21c formed on the upper surface of the elevating portion 21b. Lifting portion 21b, through the sliding member (not shown) is supported by the base plate 23 so as to be movable in the vertical direction, and is biased in the positive Z direction by the spring 21d. The follower 21c is pressed against the lower surface of the cylindrical cam 21a by the biasing force of the spring 21d. The lifting portion 21b is coupled to the score line forming mechanism 22. When the cylindrical cam 21a is rotated by the servo motor 28, the cam action lifting portion 21b of the cylindrical cam 21a is moved up and down, and the scribe line forming mechanism 22 ascends and descends. The scribing tools 30, 40 are attached to the lower end of the score line forming mechanism 22.
橡膠框26係不透氣之彈性構件。橡膠框26具有嵌入於基座板23之槽23a、頂板24之槽24a及底板25之槽25a之形狀。在橡膠框26係裝設於槽23a、24a、25a之狀態,橡膠框26之表面較基座板23、頂板24及底板25之側面燒為向外側突出。 The rubber frame 26 is an airtight elastic member. The rubber frame 26 has a shape that is fitted into the groove 23a of the base plate 23, the groove 24a of the top plate 24, and the groove 25a of the bottom plate 25. In a state in which the rubber frame 26 is attached to the grooves 23a, 24a, and 25a, the surface of the rubber frame 26 is burned outward from the side surfaces of the base plate 23, the top plate 24, and the bottom plate 25.
外蓋27具有前面部27a、右側面部27b及左側面部27c之三個板部折彎之形狀。於前面部27a之上下端緣形成有兩個孔27f。 The outer cover 27 has a shape in which three plate portions of the front surface portion 27a, the right side surface portion 27b, and the left side surface portion 27c are bent. Two holes 27f are formed in the lower end edge of the front portion 27a.
在橡膠框26嵌入於槽23a、24a、25a之狀態,外蓋27之右側面部27b與左側面部27c以於外側撓曲之方式變形,且外蓋27安裝於基座板23、頂板24及底板25。在此狀態,透過於前面部27a之上下端緣形成之兩個孔27f,螺絲被擰入頂板24及底板25。進而,羅斯被擰入於形成在基座板23、頂板24及底板25之槽23a、24a、25a之略外側之螺絲孔。藉此外蓋27藉由基座板23、頂板24及底板25與螺絲之頭部被夾住,且右側面部27b及左側面部27c之周緣部被按壓於橡膠框26。從而如圖3所示刻劃頭2被組裝。 In a state in which the rubber frame 26 is fitted in the grooves 23a, 24a, and 25a, the right side surface portion 27b and the left side surface portion 27c of the outer cover 27 are deformed so as to be bent outward, and the outer cover 27 is attached to the base plate 23, the top plate 24, and the bottom plate. 25. In this state, the screw is screwed into the top plate 24 and the bottom plate 25 through the two holes 27f formed in the upper end edge of the front portion 27a. Further, Ross is screwed into the screw holes formed on the outer sides of the grooves 23a, 24a, and 25a of the base plate 23, the top plate 24, and the bottom plate 25. Thereby, the outer cover 27 is sandwiched by the base plate 23, the top plate 24, and the bottom plate 25 and the head of the screw, and the peripheral edge portions of the right side surface portion 27b and the left side surface portion 27c are pressed against the rubber frame 26. Thus, the scribing head 2 is assembled as shown in FIG.
如圖1(a)所示,兩個刻劃頭2分別被配置於母基板G之上下。兩個刻劃頭2成為相同構成。裝設於兩個刻劃頭2之刻劃工具30、40, 係因應刻劃方法而變更。以下所示之兩個刻劃方法中,在刻劃方法1,使用僅保持刻劃輪301、401之刻劃工具30、40。又,在刻劃方法2,使用保持刻劃輪301、401與輥302、402之刻劃工具30、40。 As shown in FIG. 1(a), the two scribing heads 2 are disposed above the mother substrate G, respectively. The two scribing heads 2 have the same composition. The scoring tools 30, 40 are mounted on the two scribing heads 2, It is changed according to the method of scribing. Among the two scribing methods shown below, in the scribing method 1, the scribing tools 30, 40 that only hold the scoring wheels 301, 401 are used. Further, in the scoring method 2, the scribing tools 30, 40 that hold the scoring wheels 301, 401 and the rollers 302, 402 are used.
以下,對此等兩個刻劃方法進行說明。 Hereinafter, the two scribing methods will be described.
<刻劃方法1> <Scoring method 1>
圖4(a)~(c)係說明本實施形態之刻劃方法之圖。圖4(a)係自Y軸負側觀察刻劃位置附近時之示意圖,圖4(b)係自X軸正側觀察刻劃位置附近時之示意圖,圖4(c)係自Y軸正側觀察刻劃位置附近時之示意圖。 4(a) to 4(c) are views for explaining the scribing method of the embodiment. Fig. 4(a) is a schematic view when the vicinity of the scribing position is observed from the negative side of the Y-axis, and Fig. 4(b) is a schematic view when the scribing position is observed from the positive side of the X-axis, and Fig. 4(c) is a positive view from the Y-axis. A side view of the vicinity of the scoring position.
如圖4(a)所示,在本刻劃方法,以上側(Z軸正側)之刻劃頭2之刻劃輪301,較下側(Z軸負側)之刻劃頭2之刻劃輪401,於刻劃方向(X軸正方向)僅距離W1為前之方式移動而兩個刻劃輪301、401。兩個刻劃輪301、401分別以軸301a、401a作為旋轉軸可旋轉地安裝有刻劃工具30、40。 As shown in Fig. 4(a), in the present scribing method, the scribing wheel 301 of the head 2 is engraved on the upper side (the positive side of the Z-axis), and the engraved head 2 is engraved on the lower side (the negative side of the Z-axis). The circular wheel 401 moves in the scoring direction (the positive X-axis direction) only in a manner that the distance W1 is the front and the two scoring wheels 301 and 401. The two scoring wheels 301, 401 are rotatably mounted with scoring tools 30, 40 with the shafts 301a, 401a as rotating shafts, respectively.
參照圖4(b),母基板G,係透過密封材SL而將兩個玻璃基板G1、G2黏合所構成。於玻璃基板G1形成有濾色片(CF),且於玻璃基板G2形成有薄膜電晶體(TFT)。藉由密封材SL及兩個玻璃基板G1、G2,形成液晶注入區域R,且於此液晶注入區域注入液晶。兩個刻劃輪301、401,係於Y軸方向不互相偏移而定位。刻劃輪301,係於密封材SL之正上位置按壓於玻璃基板G1之表面,刻劃輪401,係於密封材SL之正下位置按壓於玻璃基板G2之表面。 Referring to Fig. 4(b), the mother substrate G is formed by bonding the two glass substrates G1 and G2 through the sealing material SL. A color filter (CF) is formed on the glass substrate G1, and a thin film transistor (TFT) is formed on the glass substrate G2. The liquid crystal injection region R is formed by the sealing material SL and the two glass substrates G1 and G2, and liquid crystal is injected into the liquid crystal injection region. The two scoring wheels 301, 401 are positioned so as not to be offset from each other in the Y-axis direction. The scribing wheel 301 is pressed against the surface of the glass substrate G1 at a position directly above the sealing material SL, and the scoring wheel 401 is pressed against the surface of the glass substrate G2 at a position immediately below the sealing material SL.
如圖4(c)所示,密封材SL係格子狀地配置。兩個刻劃輪301、401,係沿著密封材SL而於X軸正方向移動。藉此,如圖4(b)、(c)所示,於玻璃基板G1、G2之表面分別形成有L1、L2。 As shown in FIG. 4(c), the seal members SL are arranged in a lattice shape. The two scoring wheels 301 and 401 are moved in the positive X-axis direction along the sealing material SL. Thereby, as shown in FIGS. 4(b) and 4(c), L1 and L2 are formed on the surfaces of the glass substrates G1 and G2, respectively.
於圖4(a)~(c)所示之刻劃方法,未設有對與刻劃輪301相反側(Z軸負側)之母基板G之表面進行按壓之輥,又,亦未設有對與刻劃輪401相反側(Z軸正側)之母基板G之表面進行按壓之輥。 In the scribing method shown in Figs. 4(a) to 4(c), the roller for pressing the surface of the mother substrate G on the opposite side (the negative side of the Z-axis) from the scribing wheel 301 is not provided, and it is not provided. There is a roller that presses the surface of the mother substrate G on the opposite side (the positive side of the Z axis) from the scoring wheel 401.
<實驗1> <Experiment 1>
本案發明者等,係遵從圖4(a)~(c)所示之刻劃方法而進行於母基板G形成刻劃線之實驗。以下,對該實驗及實驗結果進行說明。 The inventors of the present invention conducted an experiment of forming a score line on the mother substrate G in accordance with the scribing method shown in Figs. 4(a) to 4(c). Hereinafter, the experiment and experimental results will be described.
實驗中,使用將厚度分別為0.2mm之玻璃基板G1、G2透過密封材SL黏合之基板(母基板)。黏合基板(母基板)之尺寸為118mm×500mm。刻劃輪301、401係使用三星鑽石工業股份有限公司製,MicroPenett(三星鑽石工業股份有限公司之註冊商標)。刻劃輪301、401,係分別成為於圓板之外周形成V字形之刀尖並且於刀尖之稜線以既定間隔具有槽之構造。刻劃輪301、401,係直徑3mm,刀尖角度110°,槽的個數550,槽深度3μm,將該構成之刻劃輪301、401分別如圖4(a)~(c)所示之方式一面按壓於玻璃基板G1、G2一面使移動而進行刻劃動作。 In the experiment, a substrate (mother substrate) to which the glass substrates G1 and G2 having a thickness of 0.2 mm were bonded through the sealing material SL was used. The size of the bonded substrate (mother substrate) was 118 mm × 500 mm. The scoring wheels 301 and 401 are manufactured by Samsung Diamond Industrial Co., Ltd., MicroPenett (registered trademark of Samsung Diamond Industry Co., Ltd.). The scribing wheels 301 and 401 are configured to form a V-shaped blade edge on the outer circumference of the disk and have grooves at a predetermined interval on the ridge line of the blade edge. The scoring wheels 301 and 401 have a diameter of 3 mm, a cutting edge angle of 110°, a number of grooves 550, and a groove depth of 3 μm. The scribing wheels 301 and 401 of the configuration are as shown in Figs. 4(a) to 4(c), respectively. In this manner, the glass substrates G1 and G2 are pressed while being pressed to perform the scribing operation.
於刻劃動作時控制施加於刻劃輪301、401之荷重為6.5N。又,刻劃輪301、401之移動速度係使其為一定(200mm/sec)。 The load applied to the scoring wheels 301, 401 is controlled to be 6.5 N during the scribing action. Further, the moving speed of the scoring wheels 301 and 401 is made constant (200 mm/sec).
基於以上條件,一面使兩個刻劃輪301、401間之距離W1變化,一面測量於玻璃基板G1、G2之裂紋之滲透量。作為比較例,亦測量刻劃輪301、401間之距離W1為0之情形之裂紋之滲透量。於各測量中,裂紋之滲透量以外,亦一併測量肋狀標記。 Based on the above conditions, the amount of penetration of cracks in the glass substrates G1 and G2 was measured while changing the distance W1 between the two scoring wheels 301 and 401. As a comparative example, the amount of penetration of the crack in the case where the distance W1 between the scoring wheels 301 and 401 is 0 is also measured. In each measurement, in addition to the amount of penetration of the crack, the ribbed mark was also measured.
於圖5(a)~(e)表示有實驗結果。圖5(a)係以數值表示裂紋滲 透量與肋狀標記量之圖,圖5(b)~(e)係於刻劃線上之母基板G之剖面照片,分別係距離W1為0.4mm、0.6mm、0.8mm、1.0mm之情況。圖5(b)~(e)中,示有D1、D3為肋狀標記量,D2、D4為裂紋滲透量。 The experimental results are shown in Figures 5(a) to (e). Figure 5 (a) shows the crack seepage by numerical values. Figure 5(b)~(e) is a cross-sectional photograph of the mother substrate G on the score line, which is 0.4mm, 0.6mm, 0.8mm, and 1.0mm, respectively. . In Figs. 5(b) to 5(e), D1 and D3 are rib-shaped marks, and D2 and D4 are crack penetration amounts.
參照圖5(a),若距離W1超過0.6mm,則相較距離W1為0mm之情況,玻璃基板G之裂紋滲透量變得較大。若於玻璃基板G1、G2中任一方以較大之滲透量產生裂紋,則於裂斷步驟,可對母基板G進行適切地分斷。 Referring to Fig. 5(a), when the distance W1 exceeds 0.6 mm, the amount of crack penetration of the glass substrate G becomes larger as compared with the case where the distance W1 is 0 mm. When a crack is generated in one of the glass substrates G1 and G2 with a large amount of penetration, the mother substrate G can be appropriately cut in the cracking step.
例如,如比較例(W1=0mm)所示,若於玻璃基板G1、G2之裂紋量為小,同時為玻璃基板G1、G2之厚度(0.2mm)之一半之程度,則於裂斷步驟,需要從母基板G之兩側將玻璃基板G1、G2分別裂斷。若進行如上述從母基板G之兩側將玻璃基板G1、G2分別裂斷之動作,則玻璃基板G1、G2之邊緣產生細微的龜裂或破損,而有玻璃基板G1、G2之強度低下之虞。 For example, as shown in the comparative example (W1 = 0 mm), if the amount of cracks in the glass substrates G1 and G2 is small and is half the thickness (0.2 mm) of the glass substrates G1 and G2, the cracking step is performed. It is necessary to break the glass substrates G1 and G2 from both sides of the mother substrate G, respectively. When the glass substrates G1 and G2 are respectively broken from the both sides of the mother substrate G as described above, the edges of the glass substrates G1 and G2 are slightly cracked or broken, and the strength of the glass substrates G1 and G2 is low. Hey.
相對於此,距離W1為0.6mm~1.4mm之情形,於玻璃基板G2之裂紋滲透量為小,同時於玻璃基板G1之裂紋滲透量為大。如此之於玻璃基版G1之裂紋滲透量為大之情形,於裂斷步驟,裂紋滲透量為小之玻璃基板G2僅從母基板G之一方側進行裂斷之動作為佳,此裂斷動作時,產生較深的裂紋之玻璃基板G1亦同時沿著裂紋被分斷。若如上述僅從母基板G之一方側使玻璃基板G1、G2裂斷,則玻璃基板G1、G2之邊緣不會產生細微的龜裂或破損,而高度保持玻璃基板G1、G2之強度。 On the other hand, when the distance W1 is 0.6 mm to 1.4 mm, the amount of crack penetration into the glass substrate G2 is small, and the amount of crack penetration into the glass substrate G1 is large. In the case where the amount of crack penetration of the glass substrate G1 is large, in the cracking step, it is preferable that the glass substrate G2 having a small amount of crack penetration is broken only from one side of the mother substrate G, and the cracking action is preferable. At the same time, the glass substrate G1 which generates a deep crack is also broken along the crack at the same time. When the glass substrates G1 and G2 are only broken from one side of the mother substrate G as described above, the edges of the glass substrates G1 and G2 are not cracked or broken, and the strength of the glass substrates G1 and G2 is maintained at a high level.
從以上之理由,於母基板G之分斷,期望於玻璃基板G1、G2任一方以較大滲透量產生裂紋。於本實驗,如圖5(a)所示,兩個刻劃輪 301、401間之距離W1若超過0.6mm,則相較比較例(W1=0mm),玻璃基板G1之裂紋滲透量變得較大。由此,期望兩個刻劃輪301、401間之距離W1為0.6mm以上。藉由如上所述將兩個刻劃輪301、401間之距離W1設定,可適切地進行母基板G之裂斷。 For the above reasons, it is desirable that the mother substrate G is broken, and it is desirable that cracks are generated in a large amount of penetration of either of the glass substrates G1 and G2. In this experiment, as shown in Figure 5 (a), two scoring wheels When the distance W1 between 301 and 401 exceeds 0.6 mm, the amount of crack penetration of the glass substrate G1 becomes larger than that of the comparative example (W1 = 0 mm). Therefore, it is desirable that the distance W1 between the two scoring wheels 301 and 401 is 0.6 mm or more. By setting the distance W1 between the two scoring wheels 301 and 401 as described above, the cracking of the mother substrate G can be appropriately performed.
<刻劃方法2> <Scoring method 2>
於如圖4(a)~(c)所示之刻劃方法(刻劃方法1),與刻劃輪301相反側(Z軸負側)之母基板G之表面未以輥壓抵,又,與刻劃輪401相反側(Z軸正側)之母基板G之表面亦未以輥壓抵。相對於此,於本刻劃方法,與刻劃輪301相反側(Z軸負側)之母基板G之表面,及與刻劃輪401相反側(Z軸正側)之母基板G之表面,分別藉由輥壓抵。 4(a) to (c), the surface of the mother substrate G opposite to the scoring wheel 301 (the negative side of the Z axis) is not pressed by the roller, and The surface of the mother substrate G on the side opposite to the scoring wheel 401 (positive side of the Z axis) is also not pressed by the roller. On the other hand, in the present scribing method, the surface of the mother substrate G on the side opposite to the scoring wheel 301 (the negative side of the Z axis) and the surface of the mother substrate G on the side opposite to the scoring wheel 401 (the positive side of the Z axis) , respectively, pressed by a roller.
圖6(a)、(b)係說明刻劃方法2之圖。圖6(a)係自Y軸負側觀察刻劃位置附近時之示意圖。圖6(b)係自X軸正側觀察刻劃位置附近時之示意圖。 6(a) and 6(b) are diagrams illustrating the scribing method 2. Fig. 6(a) is a schematic view showing the vicinity of the scribing position from the negative side of the Y-axis. Fig. 6(b) is a schematic view showing the vicinity of the scribing position from the positive side of the X-axis.
如圖6(a)所示,於本刻劃方法,與刻劃輪301相反側(Z軸負側)之母基板G之表面被兩個輥402壓抵,又,與刻劃輪401相反側(Z軸正側)之母基板G之表面被兩個輥302壓抵。兩個輥302,係以夾持刻劃輪301之方式配置,且以軸302a作為旋轉軸成為可旋轉。又,兩個輥402,係以夾持刻劃輪401之方式配置,且以軸402a作為旋轉軸成為可旋轉。 As shown in Fig. 6(a), in the present scribing method, the surface of the mother substrate G on the opposite side (the negative side of the Z-axis) from the scoring wheel 301 is pressed against the two rollers 402, and, in contrast, the scoring wheel 401 The surface of the mother substrate G on the side (positive side of the Z axis) is pressed by the two rolls 302. The two rollers 302 are disposed to sandwich the scoring wheel 301, and are rotatable with the shaft 302a as a rotating shaft. Further, the two rollers 402 are disposed so as to sandwich the scribing wheel 401, and are rotatable with the shaft 402a as a rotating shaft.
與刻劃方法1同樣,兩個刻劃輪301、401,於刻劃方向(X軸方向)僅偏移W1。兩個刻劃輪301、401,分別一面壓抵於玻璃基板G1、G2,一面沿著密封材SL移動。刻劃輪301與兩個輥302之間,有Y軸方向之間隙,且刻劃輪401與兩個輥402之間,亦有Y軸方向之間隙。因此, 輥302、402,係以跨越藉由刻劃輪301、401而形成之刻劃線L1、L2之方式而於X軸正方向移動。 Similarly to the scribing method 1, the two scoring wheels 301 and 401 are shifted by W1 only in the scoring direction (X-axis direction). The two scoring wheels 301 and 401 are respectively pressed along the sealing material SL while being pressed against the glass substrates G1 and G2. There is a gap between the scoring wheel 301 and the two rollers 302 in the Y-axis direction, and there is also a gap between the scoring wheel 401 and the two rollers 402 in the Y-axis direction. therefore, The rollers 302 and 402 are moved in the positive X-axis direction so as to straddle the score lines L1 and L2 formed by the scoring wheels 301 and 401.
<實驗2> <Experiment 2>
本案發明者等,係遵從圖6(a)、(b)所示之刻劃方法而進行於母基板G形成刻劃線之實驗。以下,對該實驗及實驗結果進行說明。 The inventors of the present invention conducted an experiment of forming a score line on the mother substrate G in accordance with the scribing method shown in Figs. 6(a) and 6(b). Hereinafter, the experiment and experimental results will be described.
於本實驗使用之母基板G與刻劃輪301、401係與上述實驗1相同。於本實驗,將刻劃輪301、401間之距離W1設定為2.2mm。又,刻劃輪301、401之移動速度係使其為一定(200mm/sec)。相對於上側之刻劃頭2之荷重中心之刻劃輪301之偏心量為1.0mm,相對於下側之刻劃頭2之荷重中心之刻劃輪401之偏心量為3.2mm。 The mother substrate G and the scoring wheels 301 and 401 used in this experiment were the same as those in the above experiment 1. In this experiment, the distance W1 between the scoring wheels 301 and 401 was set to 2.2 mm. Further, the moving speed of the scoring wheels 301 and 401 is made constant (200 mm/sec). The eccentric amount of the scribing wheel 301 with respect to the center of the load of the scribing head 2 of the upper side is 1.0 mm, and the eccentric amount of the scribing wheel 401 with respect to the center of the load of the scribing head 2 of the lower side is 3.2 mm.
刻劃輪301、401之軸301a、401a之中心位置,分別與輥302、402之軸302a、402a之中心位置於Z軸方向一致,且輥302、402之直徑,分別與劃輪301、401之直徑相同設定為3mm。 The center positions of the axes 301a, 401a of the scoring wheels 301, 401 are respectively coincident with the center positions of the shafts 302a, 402a of the rollers 302, 402 in the Z-axis direction, and the diameters of the rollers 302, 402 are respectively associated with the row wheels 301, 401. The diameter is the same as 3 mm.
基於以上條件,一面使施加於刻劃工具30、40之荷重變化,一面測量於玻璃基板G1、G2之裂紋滲透量。 Based on the above conditions, the amount of crack penetration of the glass substrates G1 and G2 was measured while changing the load applied to the scribing tools 30 and 40.
於圖7(a)~(e)表示有實驗結果。圖7(a)係以數值表示裂紋滲透量與肋狀標記量之圖,圖7(b)~(e)係於刻劃線上之母基板G之剖面照片,分別係荷重為6N、7N、8N、9N之情況。圖7(b)~(e)中,示有D1、D3為肋狀標記量,D2、D4為裂紋滲透量。 The experimental results are shown in Figures 7(a) to (e). Fig. 7(a) is a numerical diagram showing the amount of crack penetration and the amount of rib-shaped marks, and Figs. 7(b) to (e) are cross-sectional photographs of the mother substrate G on the score line, respectively, having a load of 6N, 7N, 8N, 9N situation. In Figs. 7(b) to 7(e), D1 and D3 are rib-shaped marks, and D2 and D4 are crack penetration amounts.
參照圖7(a),若荷重從5N變化為6N,則可得知於玻璃基板G1之裂紋滲透量急遽地增加。又,若荷重超過6N,則玻璃基板G1之裂紋滲透量超過玻璃基板G1之厚度(0.2mm)的80%,且於玻璃基板G1由滲透量 產生大量裂紋。如上所述,若於玻璃基板G1、G2中任一方以較大之滲透量產生裂紋,則於裂斷步驟,可對母基板G進行適切地分斷。故,於刻劃方法2,期望施加於刻劃工具30、40之荷重設定為6N以上。 Referring to Fig. 7(a), when the load is changed from 5N to 6N, it is understood that the amount of crack penetration of the glass substrate G1 is rapidly increased. Further, when the load exceeds 6 N, the amount of crack penetration of the glass substrate G1 exceeds 80% of the thickness (0.2 mm) of the glass substrate G1, and the amount of penetration on the glass substrate G1 A large number of cracks are generated. As described above, when one of the glass substrates G1 and G2 is cracked with a large amount of penetration, the mother substrate G can be appropriately cut in the cracking step. Therefore, in the scribing method 2, it is desirable that the load applied to the scribing tools 30, 40 is set to 6 N or more.
再者,於本實驗,相較於上述實驗1,對於玻璃基板G1之裂紋滲透量進一步變大。故,對於使裂紋滲透量變大之同時安定地形成裂紋,如刻劃方法2,期望於與母基板G之刻劃輪301、401相反側之面以輥402、302進行按壓。 Further, in this experiment, the amount of crack penetration of the glass substrate G1 was further increased as compared with the above experiment 1. Therefore, the crack is stably formed while the amount of crack penetration is increased. For the scribing method 2, it is desirable to press the rolls 402 and 302 on the side opposite to the scribing wheels 301 and 401 of the mother substrate G.
<刻劃工具> <scoping tool>
圖8(a)、(b),係分別表示刻劃工具30、40之構成之立體圖。圖9(a)~(c)係表示刻劃工具30之構成之左側視圖、前視圖、右側視圖。圖10(a)~(c)係表示刻劃工具40之構成之左側視圖、前視圖、右側視圖。 8(a) and 8(b) are perspective views showing the configuration of the scribing tools 30 and 40, respectively. 9(a) to 9(c) are a left side view, a front view, and a right side view showing the configuration of the scoring tool 30. 10(a) to (c) are a left side view, a front view, and a right side view showing the configuration of the scoring tool 40.
刻劃工具30、40,係除了刻劃輪301、401與輥302、402之排列順序以外,具有相同之構成。刻劃工具30、40,分別具備保持刻劃輪301、401與輥302、402之保持具303、403。保持具303係由強磁性體所形成。 The scribing tools 30 and 40 have the same configuration except for the order in which the scoring wheels 301 and 401 and the rollers 302 and 402 are arranged. The scribing tools 30 and 40 are provided with holders 303 and 403 for holding the scoring wheels 301 and 401 and the rollers 302 and 402, respectively. The holder 303 is formed of a ferromagnetic body.
保持具303、403具備:安裝有刻劃輪301、401之槽303a、403a、安裝有輥302、402之槽303b、403b、傾斜面303c、403c。槽303a、403a、與槽303b、403b,係於保持具303、403之前後之側面連通。傾斜面303c、403c,係,將保持具303、403之圓柱狀之側面自前側斜切除而形成。刻劃輪301、401,係藉由將軸301a、401a崁入保持具303、403之孔而安裝。輥302、402,係藉由將軸302a、402a崁入保持具303、403之孔而安裝。 The holders 303 and 403 include grooves 303a and 403a to which the scoring wheels 301 and 401 are attached, grooves 303b and 403b to which the rollers 302 and 402 are attached, and inclined surfaces 303c and 403c. The grooves 303a and 403a and the grooves 303b and 403b communicate with each other on the side surface before and after the holders 303 and 403. The inclined faces 303c and 403c are formed by cutting the cylindrical side faces of the holders 303 and 403 obliquely from the front side. The scoring wheels 301, 401 are mounted by inserting the shafts 301a, 401a into the holes of the holders 303, 403. The rollers 302, 402 are mounted by plunging the shafts 302a, 402a into the holes of the holders 303, 403.
圖11(a)、(b)係以示意表示對於刻劃線形成機構22之刻劃工 具30之安裝方法之圖。於圖11(a)、(b)示有刻劃線形成機構22之內部透視之狀態。 11(a) and (b) are schematic illustrations showing the engraving of the scribing forming mechanism 22. Figure with 30 installation method. Fig. 11 (a) and (b) show the state of the internal perspective of the score line forming mechanism 22.
於刻劃線形成機構22之下端,設有保持刻劃工具30之保持部221,且於該保持部221形成有可將刻劃工具30插入之孔222。孔222之底設置有磁石224,且孔222之中間位置設有銷223。刻劃工具30之保持具303係由強磁性體所形成。 At the lower end of the score line forming mechanism 22, a holding portion 221 for holding the scribing tool 30 is provided, and a hole 222 into which the scribing tool 30 can be inserted is formed in the holding portion 221. A magnet 224 is disposed at the bottom of the hole 222, and a pin 223 is disposed at an intermediate position of the hole 222. The holder 303 of the scoring tool 30 is formed of a ferromagnetic body.
於刻劃線形成機構22安裝有刻劃工具30之情形,刻劃工具30之保持具303被插入至保持部221之孔222。保持具303之上端若接近磁石224,則保持具303被磁石224吸附。此時,保持具303之傾斜面303c抵接於銷223,且保持具303被定位於常規位置。由此,如圖11(b)所示,刻劃工具30安裝於刻劃線形成機構22之下端。 In the case where the scribing forming mechanism 22 is mounted with the scoring tool 30, the holder 303 of the scoring tool 30 is inserted into the hole 222 of the holding portion 221. When the upper end of the holder 303 is close to the magnet 224, the holder 303 is attracted by the magnet 224. At this time, the inclined surface 303c of the holder 303 abuts against the pin 223, and the holder 303 is positioned at the normal position. Thereby, as shown in FIG. 11(b), the scribing tool 30 is attached to the lower end of the score line forming mechanism 22.
刻劃工具40亦同樣,安裝於刻劃線形成機構22之下端。由此,若刻劃工具30、40分別安裝於對應之刻劃頭2之刻劃線形成機構22,則如圖6(a)、(b)所示,於刻劃輪301對應之位置定位輥402,且於刻劃輪401對應之位置定位輥302。若使用圖8(a)、(b)所示之構成之刻劃工具30、40,則刻劃工具30、40僅由分別安裝於對應之刻劃頭2之刻劃線形成機構22,而使刻劃輪301與刻劃輪401之距離W1保持既定距離,同時可使刻劃輪301、401與輥402、302互相定位校準。 Similarly, the scribing tool 40 is attached to the lower end of the score line forming mechanism 22. Thus, if the scribing tools 30, 40 are respectively attached to the scribing line forming mechanism 22 of the corresponding scribing head 2, as shown in Figs. 6(a) and (b), the position of the scoring wheel 301 is positioned. The roller 402, and the roller 302 is positioned at a position corresponding to the scoring wheel 401. When the scribing tools 30 and 40 having the configuration shown in Figs. 8(a) and 8(b) are used, the scribing tools 30 and 40 are only attached to the scribing line forming mechanism 22 of the corresponding scribing head 2, respectively. The distance W1 between the scoring wheel 301 and the scoring wheel 401 is maintained at a predetermined distance, and the scoring wheels 301, 401 and the rollers 402, 302 are positioned and aligned with each other.
再者,上述實驗2,係使用圖8(a)、(b)所示之構成之刻劃工具30、40而進行。又,上述實驗1,係從保持具303、403省略槽303b、403b,且於僅具有槽303b、403b之保持具303、403,分別使用安裝有刻劃輪301、401之刻劃工具30、40而進行。 Further, the above experiment 2 was carried out using the scribing tools 30 and 40 having the configurations shown in Figs. 8(a) and 8(b). Further, in the above experiment 1, the grooves 303b and 403b are omitted from the holders 303 and 403, and the holders 303 and 403 having only the grooves 303b and 403b are respectively used, and the scribing tool 30 to which the scoring wheels 301 and 401 are attached is used. 40.
<實施形態之效果> <Effects of Embodiments>
根據本實施形態,可發揮以下效果。 According to this embodiment, the following effects can be exhibited.
藉由使用如圖8~圖10所示之刻劃工具30、40,能夠將母基板之上面及下面之各刻劃位置於刻劃方向僅位移既定距離,對刻劃輪與相反側之面以輥按壓。正如實驗2所示,於密封材SL之正上位置,可由較深之裂紋形成刻劃線L1。藉由於刻劃工具30、40設有輥302、402,使裂紋滲透量進一步變大,同時安定地形成裂紋。 By using the scribing tools 30 and 40 as shown in FIGS. 8 to 10, the scribing positions on the upper and lower sides of the mother substrate can be displaced only by a predetermined distance in the scribing direction, and the scribing wheel and the opposite side can be faced. Press with a roller. As shown in Experiment 2, at the position directly above the seal member SL, the score line L1 can be formed by a deep crack. By providing the scribing tools 30, 40 with the rollers 302, 402, the amount of crack penetration is further increased, and cracks are formed stably.
如圖8~圖10所示之刻劃工具30、40中,以一對輥302、402之一部分夾持刻劃輪301、401之一部分之方式配置刻劃輪301、401與一對輥302、402。若根據此構成,可使刻劃輪301、401與輥302、402之間之距離於刻劃方向縮減。 In the scribing tools 30 and 40 shown in FIGS. 8 to 10, the scoring wheels 301 and 401 and the pair of rollers 302 are disposed such that one of the pair of rollers 302 and 402 partially sandwiches one of the scribing wheels 301 and 401. 402. According to this configuration, the distance between the scoring wheels 301, 401 and the rollers 302, 402 can be reduced in the scoring direction.
如圖8~圖10所示之刻劃工具30、40中,保持具303、403係由磁性材料構成,且將圓柱之側面斜切除而成為傾斜面303c、403c所形成之形狀。因此,藉由於安裝有刻劃頭2之保持具303、403之孔222設置磁石224,能夠將刻劃工具30、40圓滑地安裝於刻劃頭2。又,藉由於此孔222配置傾斜面303c、304c抵接之銷223,利用磁石224進行之吸附力而能夠將刻劃工具30、40定位於常規位置。 In the scribing tools 30 and 40 shown in FIGS. 8 to 10, the holders 303 and 403 are made of a magnetic material, and the side faces of the cylinder are obliquely cut to have a shape formed by the inclined faces 303c and 403c. Therefore, by providing the magnet 224 by the hole 222 in which the holders 303, 403 of the scribing head 2 are attached, the scribing tools 30, 40 can be smoothly attached to the scribing head 2. Further, since the hole 222 is provided with the pin 223 against which the inclined surfaces 303c and 304c abut, the scoring force by the magnet 224 can be used to position the scribing tools 30 and 40 at the normal position.
又,藉由使用圖8(a)、(b)所示之兩種類之刻劃工具30、40,刻劃工具30、40僅由分別安裝於對應之刻劃頭2之刻劃線形成機構22,而使刻劃輪301與刻劃輪401之距離W1保持既定距離,同時可使刻劃輪301、401與輥402、302互相定位校準。 Further, by using the scribing tools 30, 40 of the two types shown in Figs. 8(a) and (b), the scribing tools 30, 40 are only provided by the scribing forming mechanisms respectively attached to the corresponding scribing heads 2 22, while keeping the distance W1 between the scoring wheel 301 and the scoring wheel 401 at a predetermined distance, and simultaneously aligning the scoring wheels 301, 401 and the rollers 402, 302 with each other.
<變更例> <Modification>
以上,雖對於本發明之實施形態進行說明,但本發明不被限制於上述實施形態,又,本發明之實施形態亦可為上述形態以外之各種變更。 Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and the embodiments of the present invention may be various modifications other than the above.
例如,於上述實施形態,使用於刀尖之稜線以一定間隔形成槽之刻劃輪,但可想而知,使用未於稜線形成槽之刻劃輪亦可發揮同樣的效果。刻劃輪(刀尖)之大小或形狀不僅限制於上述實施形態所記載,可適當地使用其他的大小或形狀、種類之刀尖。 For example, in the above-described embodiment, the scriber wheel in which the groove is formed at a predetermined interval is formed on the ridge line of the blade edge. However, it is conceivable that the same effect can be obtained by using the scribe wheel which is not formed by the ridge line. The size or shape of the scoring wheel (tool tip) is not limited to the above-described embodiment, and other sizes, shapes, and types of blade tips can be used as appropriate.
又,於上述實施形態,使母基板G之上側之刻劃輪301相對於母基板下側之刻劃輪401於刻劃方向為前,但使母基板G之下側之刻劃輪301相對於母基板上側之刻劃輪401於刻劃方向為前亦為佳。此情形亦能發揮與上述同樣的效果。 Further, in the above embodiment, the scribing wheel 301 on the upper side of the mother substrate G is oriented forward with respect to the scribing wheel 401 on the lower side of the mother substrate, but the scribing wheel 301 on the lower side of the mother substrate G is opposed to each other. It is also preferable that the scribing wheel 401 on the upper side of the mother substrate is in the front of the scribing direction. This situation can also exert the same effect as described above.
又,於圖6(a)、(b)及圖8(a)、(b)之構成,刻劃輪301、401之軸301a、401a之中心位置,分別與輥302、402之軸302a、402a之中心位置於Z軸方向一致,且使刻劃輪301、401之直徑分別與輥302、402之直徑相同。然而,刻劃輪301、401與輥302、402之關係,不僅限定於此,亦能夠進行其他各種變更。 Further, in the configuration of Figs. 6(a) and 6(b) and Figs. 8(a) and 8(b), the center positions of the axes 301a and 401a of the scoring wheels 301 and 401 are respectively coupled to the axes 302a of the rollers 302 and 402, The center positions of the 402a are aligned in the Z-axis direction, and the diameters of the scribing wheels 301, 401 are the same as the diameters of the rolls 302, 402, respectively. However, the relationship between the scoring wheels 301 and 401 and the rollers 302 and 402 is not limited thereto, and various other modifications are possible.
例如,如圖12(a)所示,刻劃輪301之直徑較輥302之直徑僅較大△d1亦為佳,或者,如圖12(b)所示,刻劃輪301之直徑較輥302之直徑僅較小△d2亦為佳。又,如圖12(c)所示,刻劃輪301之軸301a之中心位置較輥302之軸302a之中心位置於Z軸負方向僅△d3偏移亦為佳,或者,如圖12(d)所示,刻劃輪301之軸301a之中心位置較輥302之軸302a之中心位置於Z軸正方向僅△d4偏移亦為佳。關於刻劃輪401與輥402亦能夠同樣地變更。 For example, as shown in Fig. 12(a), the diameter of the scoring wheel 301 is preferably larger than the diameter of the roller 302 by Δd1, or, as shown in Fig. 12(b), the diameter of the scoring wheel 301 is larger than that of the roller. The diameter of 302 is also smaller than Δd2. Further, as shown in Fig. 12(c), it is preferable that the center position of the shaft 301a of the scribing wheel 301 is offset from the center position of the shaft 302a of the roller 302 by only Δd3 in the negative direction of the Z-axis, or, as shown in Fig. 12 ( d), it is preferable that the center position of the shaft 301a of the scribing wheel 301 is offset from the center position of the shaft 302a of the roller 302 by only Δd4 in the positive direction of the Z-axis. The scoring wheel 401 and the roller 402 can also be changed in the same manner.
再者,於圖12(b)、(d)之構成例,輥302之下端由於較刻劃輪301之下端為下側,於刻劃動作時,輥302更強力的抵壓於玻璃基板G1。若輥如此強力的抵壓,則玻璃基板G1向Z軸方向撓曲,藉此,於玻璃基板G1之背面承受打開裂紋之方向之拉伸力。因此,於輥302所抵壓之玻璃基板G1之部分之背面,若抵壓另一方之刻劃輪401之刀尖,則藉由此拉伸力使裂紋變得容易深入。因此,於圖12(b)、(d)之構成例,可想而知藉由對應輥302之背側之刻劃輪401,能形成更深的裂紋。 Further, in the configuration examples of FIGS. 12(b) and (d), the lower end of the roller 302 is lower than the lower end of the scribing wheel 301, and the roller 302 is more strongly pressed against the glass substrate G1 during the scribing operation. . When the roller is pressed so strongly, the glass substrate G1 is deflected in the Z-axis direction, whereby the back surface of the glass substrate G1 is subjected to the tensile force in the direction in which the crack is opened. Therefore, when the blade edge of the other scribing wheel 401 is pressed against the back surface of the portion of the glass substrate G1 which is pressed by the roller 302, the crack can be easily penetrated by the tensile force. Therefore, in the configuration examples of FIGS. 12(b) and (d), it is conceivable that a deeper crack can be formed by the scribing wheel 401 on the back side of the corresponding roller 302.
此外,母基板G之構成、厚度、材質等,並不限定於上述實施形態所示,於其他構成之母基板G之切斷,亦能夠使用刻劃裝置30、40。 Further, the configuration, thickness, material, and the like of the mother substrate G are not limited to those described in the above embodiment, and the scribing devices 30 and 40 can be used for cutting the mother substrate G of another configuration.
本發明之實施形態,可於申請專利範圍所示之技術思想範圍內適當的進行各種變更。 The embodiments of the present invention can be variously modified as appropriate within the scope of the technical idea shown in the claims.
Claims (11)
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| JPJP2014-161252 | 2014-08-07 | ||
| JP2014161252A JP6435698B2 (en) | 2014-08-07 | 2014-08-07 | Scribing equipment |
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| TWI650293B true TWI650293B (en) | 2019-02-11 |
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| TW104107539A TWI650293B (en) | 2014-08-07 | 2015-03-10 | Scribe tool |
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| KR (1) | KR20160018330A (en) |
| CN (1) | CN105366932B (en) |
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| KR101727543B1 (en) * | 2016-02-22 | 2017-04-17 | 한국미쯔보시다이아몬드공업(주) | Rotating apparatus of scribe head for cutting substrate |
| CN108623141A (en) * | 2018-07-18 | 2018-10-09 | 安徽锐利玻璃机械有限公司 | A kind of glass cutting machine |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2012240902A (en) * | 2011-05-24 | 2012-12-10 | Mitsuboshi Diamond Industrial Co Ltd | Scribing apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4226153A (en) * | 1979-05-17 | 1980-10-07 | The Fletcher-Terry Company | Compensating glass scoring head |
| JPH07138039A (en) * | 1993-11-12 | 1995-05-30 | Fuji Xerox Co Ltd | Scribing apparatus |
| JP3810127B2 (en) * | 1996-04-25 | 2006-08-16 | 京セラ株式会社 | Glass substrate cutting method |
| JP2003313036A (en) * | 2002-04-17 | 2003-11-06 | Sharp Corp | Glass cutting method and apparatus |
| JP2006137641A (en) | 2004-11-12 | 2006-06-01 | Sanyo Electric Co Ltd | Cutting method of glass substrate |
| JP2008156151A (en) * | 2006-12-22 | 2008-07-10 | Sharp Corp | Cutting blade unit, liquid crystal display panel manufacturing apparatus including the same, and liquid crystal display panel manufacturing method |
| JPWO2015137161A1 (en) * | 2014-03-12 | 2017-04-06 | 旭硝子株式会社 | Cutter device, cutting line forming method, and brittle plate cutting method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2012240902A (en) * | 2011-05-24 | 2012-12-10 | Mitsuboshi Diamond Industrial Co Ltd | Scribing apparatus |
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| TW201605751A (en) | 2016-02-16 |
| CN105366932A (en) | 2016-03-02 |
| KR20160018330A (en) | 2016-02-17 |
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| CN105366932B (en) | 2019-12-17 |
| JP2016037414A (en) | 2016-03-22 |
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