TWI644387B - Substrate transfer system and method - Google Patents
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- TWI644387B TWI644387B TW106136327A TW106136327A TWI644387B TW I644387 B TWI644387 B TW I644387B TW 106136327 A TW106136327 A TW 106136327A TW 106136327 A TW106136327 A TW 106136327A TW I644387 B TWI644387 B TW I644387B
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- 239000000758 substrate Substances 0.000 title claims abstract description 145
- 238000012546 transfer Methods 0.000 title claims abstract description 94
- 238000000034 method Methods 0.000 title claims description 45
- 230000007246 mechanism Effects 0.000 claims abstract description 32
- 238000004519 manufacturing process Methods 0.000 description 28
- 239000004065 semiconductor Substances 0.000 description 27
- 230000008569 process Effects 0.000 description 15
- 238000012545 processing Methods 0.000 description 11
- 239000000463 material Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
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- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
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- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
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- 238000005516 engineering process Methods 0.000 description 1
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- 239000000835 fiber Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000004643 material aging Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
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- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
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- 238000004151 rapid thermal annealing Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
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Abstract
本揭露提供一種基板傳送系統,包括皮帶、滾輪、基板傳送組件、位置感測器、及驅動機構。滾輪配置用以帶動皮帶滾動。基板傳送組件連接皮帶並用以傳送基板。位置感測器配置用以偵測皮帶在滾輪的輪軸方向上的位置。驅動機構配置用以驅動滾輪沿著輪軸方向移動,使得皮帶保持在輪軸方向上的一既定位置範圍內。 The present disclosure provides a substrate transfer system including a belt, a roller, a substrate transfer assembly, a position sensor, and a drive mechanism. The roller is configured to drive the belt to roll. The substrate transfer assembly connects the belts and is used to transport the substrates. The position sensor is configured to detect the position of the belt in the direction of the axle of the roller. The drive mechanism is configured to drive the roller to move in the direction of the axle such that the belt remains within a predetermined range of directions in the direction of the axle.
Description
本發明實施例關於一種半導體技術,特別係有關於一種基板傳送系統及方法。 Embodiments of the present invention relate to a semiconductor technology, and more particularly to a substrate transfer system and method.
現代的工業社會中,自動化控制系統已逐漸取代人力,成為提高生產效率的關鍵,尤其是半導體先進製程中更是大量地引進自動化控制系統以進行各種精密的製造步驟,以降低成本及避免人為疏失。 In the modern industrial society, the automation control system has gradually replaced manpower and become the key to improving production efficiency. Especially in the advanced semiconductor process, a large number of automated control systems are introduced to carry out various precise manufacturing steps to reduce costs and avoid human error. .
舉例來說,半導體裝置係藉由一系列的半導體製造機台處理半導體基板而產出。其中,配置於各製造機台中的一或多個基板傳送系統可將基板從載入口送入處理腔室以進行一特定的製程處理,並於製程結束後,再將基板從載出口送出製造機台。此外,一些半導體製造機台中可以設有多個獨立的處理腔室,並透過基板傳送系統在不同的處理腔室之間傳送基板。 For example, a semiconductor device is produced by processing a semiconductor substrate by a series of semiconductor manufacturing machines. Wherein, one or more substrate transfer systems disposed in each manufacturing machine can feed the substrate from the loading port into the processing chamber for a specific process, and after the process ends, the substrate is sent out from the load port. Machine. In addition, some semiconductor manufacturing machines may be provided with a plurality of separate processing chambers and transfer substrates between different processing chambers through a substrate transfer system.
雖然現有的基板傳送系統及方法已經足以達成其目標,但這些系統及方法仍不能在各方面令人滿意。 While existing substrate delivery systems and methods are sufficient to achieve their goals, these systems and methods are still not satisfactory in all respects.
本揭露一些實施例提供一種基板傳送系統,包括一皮帶、一滾輪、一基板傳送組件、一位置感測器、及一驅動機構。滾輪配置用以帶動皮帶滾動。基板傳送組件連接皮帶, 用以傳送一基板。位置感測器配置用以偵測皮帶在滾輪的一輪軸方向上的位置。驅動機構配置用以驅動滾輪沿著輪軸方向移動,使得皮帶保持在輪軸方向上的一既定位置範圍內。 The present disclosure provides a substrate transfer system including a belt, a roller, a substrate transfer assembly, a position sensor, and a drive mechanism. The roller is configured to drive the belt to roll. The substrate transfer assembly is connected to the belt, Used to transfer a substrate. The position sensor is configured to detect the position of the belt in the direction of one of the axles of the roller. The drive mechanism is configured to drive the roller to move in the direction of the axle such that the belt remains within a predetermined range of directions in the direction of the axle.
本揭露一些實施例提供一種基板傳送系統,包括一皮帶、一主動輪、一從動輪、一基板傳送組件、一第一位置感測器、一第一驅動機構、一第二位置感測器、及一第二驅動機構。主動輪配置用以透過一馬達之驅動而發生轉動。從動輪配置用以配合主動輪來帶動皮帶滾動。基板傳送組件配置用以透過皮帶之帶動而傳送一基板。第一位置感測器配置用以偵測皮帶在主動輪的一輪軸方向上的位置。第一驅動機構配置用以驅動主動輪沿著其輪軸方向移動,使得皮帶保持在主動輪之輪軸方向上的一第一位置範圍內。第二位置感測器配置用以偵測皮帶在該動輪的一輪軸方向上的位置。第二驅動機構配置用以驅動從動輪沿著其輪軸方向移動,使得皮帶保持在從動輪之輪軸方向上的一第二位置範圍內,其中第一、第二位置範圍的上邊界係在一相同水平高度上,且第一、第二位置範圍的下邊界係在另一相同水平高度上。 Some embodiments provide a substrate transfer system including a belt, a driving wheel, a driven wheel, a substrate transfer assembly, a first position sensor, a first drive mechanism, a second position sensor, And a second drive mechanism. The driving wheel is configured to rotate by driving of a motor. The driven wheel is configured to cooperate with the driving wheel to drive the belt to roll. The substrate transfer assembly is configured to transport a substrate through the belt. The first position sensor is configured to detect the position of the belt in the direction of one of the axles of the drive wheel. The first drive mechanism is configured to drive the drive wheel to move along its axle direction such that the belt remains within a first range of positions in the direction of the axle of the drive wheel. The second position sensor is configured to detect a position of the belt in an axle direction of the moving wheel. The second driving mechanism is configured to drive the driven wheel to move along the direction of the axle thereof such that the belt is maintained within a second position in the direction of the axle of the driven wheel, wherein the upper boundaries of the first and second ranges are the same At the horizontal level, and the lower boundary of the first and second position ranges is at another same level.
本揭露一些實施例提供一種基板傳送方法,包括藉由一基板傳送系統傳送至少一基板,其中基板傳送系統包括一皮帶、一滾輪及一基板傳送組件,滾輪用以帶動皮帶滾動,而基板傳送組件用以透過皮帶之帶動而傳送至少一基板。基板傳送方法更包括在傳送至少一基板的過程中,偵測皮帶在滾輪的一輪軸方向上的位置。此外,基板傳送方法還包括當偵測到皮帶在滾輪的輪軸方向上發生偏移並超出一既定位置範圍時, 將滾輪沿著輪軸方向移動,使得皮帶復位到既定位置範圍內。 Some embodiments provide a substrate transfer method including transferring at least one substrate by a substrate transfer system, wherein the substrate transfer system includes a belt, a roller and a substrate transfer assembly, the roller is used to drive the belt to roll, and the substrate transfer assembly The at least one substrate is conveyed by the belt. The substrate transfer method further includes detecting a position of the belt in a direction of an axle of the roller during the transfer of the at least one substrate. In addition, the substrate transfer method further includes: when detecting that the belt is offset in the direction of the wheel axis of the roller and exceeds a predetermined position range, Move the roller in the direction of the axle to reset the belt to a predetermined position.
1‧‧‧半導體製造機台 1‧‧‧Semiconductor manufacturing machine
10‧‧‧處理腔室 10‧‧‧Processing chamber
11‧‧‧承載埠 11‧‧‧ Carrying equipment
12‧‧‧載入口 12‧‧‧ loading
13‧‧‧感測器 13‧‧‧ sensor
20‧‧‧基板傳送系統 20‧‧‧Substrate transfer system
21‧‧‧基板傳送組件 21‧‧‧Substrate transfer assembly
21A‧‧‧線性滑軌 21A‧‧‧Linear slides
21B‧‧‧滑塊 21B‧‧‧ Slider
21C‧‧‧機械手臂 21C‧‧‧ Robotic arm
21D‧‧‧支撐桿 21D‧‧‧Support rod
22‧‧‧外殼 22‧‧‧ Shell
22A‧‧‧開口部 22A‧‧‧ Openings
70‧‧‧基板傳送方法 70‧‧‧Substrate transfer method
71~73‧‧‧操作 71~73‧‧‧ operation
A‧‧‧輪軸方向 A‧‧‧Axle direction
B‧‧‧皮帶 B‧‧‧Belt
C‧‧‧承載單元 C‧‧‧bearing unit
D‧‧‧間隔 D‧‧‧ interval
F‧‧‧凸緣結構 F‧‧‧Flange structure
L‧‧‧伸縮桿 L‧‧‧ Telescopic rod
M‧‧‧馬達 M‧‧ motor
M1、M2‧‧‧驅動機構 M1, M2‧‧‧ drive mechanism
W‧‧‧基板 W‧‧‧Substrate
R‧‧‧滾輪 R‧‧‧Roller
R1‧‧‧主動輪 R1‧‧‧ drive wheel
R2‧‧‧從動輪 R2‧‧‧ driven wheel
S‧‧‧位置感測器 S‧‧‧ position sensor
U‧‧‧控制單元 U‧‧‧Control unit
X‧‧‧偏移量 X‧‧‧ offset
AS‧‧‧警示信號 AS‧‧‧ warning signal
NP‧‧‧既定位置範圍 NP‧‧‧established location range
第1圖顯示根據一些實施例之一具有基板傳送系統的半導體製造機台的示意圖。 1 shows a schematic diagram of a semiconductor fabrication machine having a substrate transfer system in accordance with some embodiments.
第2圖顯示根據一些實施例之一基板傳送系統的部分元件的側視示意圖。 Figure 2 shows a side view of some of the elements of a substrate transport system in accordance with some embodiments.
第3圖顯示根據一些實施例之一基板傳送系統的部分元件的上視示意圖。 Figure 3 shows a top view of some of the components of a substrate transport system in accordance with some embodiments.
第4圖顯示根據一些實施例之一基板傳送系統的部分元件的側視示意圖,其中,基板傳送系統之滾輪可以基於皮帶的偏移進行移動,並使得皮帶復位。 Figure 4 shows a side view of some of the elements of a substrate transport system in accordance with some embodiments, wherein the rollers of the substrate transport system can be moved based on the offset of the belt and the belt is reset.
第5A、5B圖顯示根據一些實施例之用於偵測皮帶偏移量之不同形式的位置感測器的示意圖。 5A, 5B are schematic diagrams showing different forms of position sensors for detecting belt offsets in accordance with some embodiments.
第6圖顯示根據一些實施例之一基板傳送系統的部分元件的方塊圖。 Figure 6 shows a block diagram of some of the components of a substrate transfer system in accordance with some embodiments.
第7圖顯示根據一些實施例之一基板傳送方法的流程圖。 Figure 7 shows a flow chart of a substrate transfer method in accordance with some embodiments.
以下揭露內容提供許多不同的實施例或較佳範例以實施本案的不同特徵。當然,本揭露也可以許多不同形式實施,而不局限於以下所述之實施例。以下揭露內容配合圖式詳細敘述各個構件及其排列方式的特定範例,係為了簡化說明,使揭露得以更透徹且完整,以將本揭露之範圍完整地傳達予同領域熟悉此技術者。 The following disclosure provides many different embodiments or preferred examples to implement various features of the present disclosure. Of course, the disclosure may be embodied in many different forms and is not limited to the embodiments described below. The disclosure of the various components and their arrangement in detail is set forth in the accompanying drawings, and the description of the disclosure will be more fully understood.
在下文中所使用的空間相關用詞,例如“在...下方”、“下方”、“較低的”、“上方”、“較高的”及類似的用詞,係為了便於描述圖示中一個元件或特徵與另一個(些)元件或特徵之間的關係。除了在圖式中繪示的方位之外,這些空間相關用詞也意欲包含使用中或操作中的裝置之不同方位。裝置可能被轉向不同方位(旋轉90度或其他方位),而在此所使用的空間相關用詞也可依此相同解釋。 Spatially related terms used in the following, such as "below," "below," "lower," "above," "higher," and the like, are used to facilitate the description. The relationship between one element or feature and another element or feature(s). In addition to the orientation depicted in the drawings, these spatially related terms are also intended to encompass different orientations of the device in use or operation. The device may be turned to a different orientation (rotated 90 degrees or other orientation), and the spatially related terms used herein may also be interpreted the same.
必須了解的是,未特別圖示或描述之元件可以本領域技術人士所熟知之各種形式存在。此外,若實施例中敘述了一第一特徵形成於一第二特徵之上或上方,即表示其可能包含上述第一特徵與上述第二特徵是直接接觸的情況,亦可能包含了有附加特徵形成於上述第一特徵與上述第二特徵之間,而使得上述第一特徵與第二特徵未直接接觸的情況。 It is to be understood that elements not specifically shown or described may be in various forms well known to those skilled in the art. In addition, if a first feature is formed on or above a second feature in the embodiment, it may indicate that the first feature may be in direct contact with the second feature, and may also include additional features. Formed between the first feature and the second feature described above such that the first feature and the second feature are not in direct contact with each other.
以下不同實施例中可能重複使用相同的元件標號及/或文字,這些重複係為了簡化與清晰的目的,並非用以限定所討論的不同實施例及/或結構之間有特定的關係。在圖式中,結構的形狀或厚度可能擴大,以簡化或便於標示。 The same component numbers and/or characters may be repeated in the following various embodiments, which are for the purpose of simplicity and clarity, and are not intended to limit the specific relationship between the various embodiments and/or structures discussed. In the drawings, the shape or thickness of the structure may be enlarged to simplify or facilitate the marking.
請先參照第1圖,其顯示根據本發明一些實施例之一具有基板傳送系統20的半導體製造機台1的示意圖。半導體製造機台1包括一處理腔室10(例如一真空絕緣腔室),用以對一或多個基板(例如半導體晶圓、光罩或其他任何基底物質)進行一或多種特定的製程處理。在一些實施例中,半導體製造機台1可以為一化學氣相沉積(chemical vapor deposition,CVD)機台、一物理氣相沉積(physical vapor deposition,PVD)機台、一蝕 刻(etching)機台、一熱氧化(thermal oxidation)機台、一離子佈植(ion implantation)機台、一化學機械研磨(chemical mechanical polishing,CMP)機台、一快速升溫退火(rapid thermal annealing,RTA)機台、一光微影(photolithography)機台、一擴散(diffusion)機台、或者其他半導體製造機台。 Referring first to Figure 1, there is shown a schematic diagram of a semiconductor fabrication machine 1 having a substrate transfer system 20 in accordance with some embodiments of the present invention. The semiconductor manufacturing machine 1 includes a processing chamber 10 (eg, a vacuum insulating chamber) for performing one or more specific processing processes on one or more substrates (eg, semiconductor wafers, reticle, or any other substrate material). . In some embodiments, the semiconductor manufacturing machine 1 can be a chemical vapor deposition (CVD) machine, a physical vapor deposition (PVD) machine, and an etch. Etching machine, a thermal oxidation machine, an ion implantation machine, a chemical mechanical polishing (CMP) machine, and a rapid thermal annealing , RTA) machine, a photolithography machine, a diffusion machine, or other semiconductor manufacturing machine.
半導體製造機台1中配置有一基板傳送系統20,包括一活動式機械手臂21C(或夾具),用以將停靠在半導體製造機台1之承載埠11上的承載單元C內的一或多個基板W從半導體製造機台1之載入口12送入處理腔室10,以進行上述製程處理。於製程結束後,機械手臂21C再將基板W從半導體製造機台1之載出口(圖未示)送出。關於基板傳送系統20中驅動機械手臂21C的機構在稍後段落中會做進一步介紹。 A substrate transfer system 20 is disposed in the semiconductor manufacturing machine 1 and includes a movable robot arm 21C (or jig) for stopping one or more of the load bearing units C on the load cassette 11 of the semiconductor manufacturing machine 1. The substrate W is fed from the loading port 12 of the semiconductor manufacturing machine 1 into the processing chamber 10 to perform the above-described process. After the end of the process, the robot arm 21C sends the substrate W from the load port (not shown) of the semiconductor manufacturing machine 1. The mechanism for driving the robot arm 21C in the substrate transfer system 20 will be further described in a later paragraph.
在一些實施例中,在半導體製造機台1中靠近載入口12之位置可配置有一感測器13,其透過例如光學方式來偵測基板傳送系統20的機械手臂21C是否來到載入口12附近,並由此決定載入口12的開閉時機,以減少半導體製造機台1受到外界環境的影響或汙染的機會。 In some embodiments, a sensor 13 can be disposed in the semiconductor manufacturing machine 1 near the loading port 12, for example, by optically detecting whether the robot arm 21C of the substrate transport system 20 is at the loading port. In the vicinity of 12, the opening and closing timing of the loading port 12 is determined to reduce the chance that the semiconductor manufacturing machine 1 is affected or contaminated by the external environment.
在一些其他實施例中,半導體製造機台1中可以設置有複數個獨立的處理腔室10,且基板傳送系統20更用以在不同的處理腔室10之間傳送基板W。另外,半導體製造機台1中也可以配置有多組基板傳送系統20。 In some other embodiments, a plurality of separate processing chambers 10 may be disposed in the semiconductor manufacturing machine 1 and the substrate transfer system 20 is further configured to transfer the substrates W between different processing chambers 10. Further, a plurality of sets of substrate transfer systems 20 may be disposed in the semiconductor manufacturing machine 1.
第2圖顯示根據一些實施例之基板傳送系統20的部分元件的側視示意圖,及第3圖顯示根據一些實施例之基板傳送系統20的部分元件的上視示意圖。如第2、3圖所示,基板 傳送系統20包括複數個滾輪R、一皮帶B、一基板傳送組件21(包括一線性滑軌21A、一滑塊21B及一機械手臂21C)、及用以收容上述元件或部件之一外殼22(為了清楚起見,第2圖中省略了線性滑軌21A並僅顯示部分的滾輪R,而第3圖中省略了機械手臂21C及外殼22)。 2 shows a side view of some of the components of substrate transfer system 20 in accordance with some embodiments, and FIG. 3 shows a top view of some of the components of substrate transfer system 20 in accordance with some embodiments. As shown in Figures 2 and 3, the substrate The transport system 20 includes a plurality of rollers R, a belt B, a substrate transport assembly 21 (including a linear slide 21A, a slider 21B and a robot arm 21C), and a housing 22 for housing the above components or components ( For the sake of clarity, the linear slide 21A is omitted in Fig. 2 and only a part of the roller R is shown, and the robot arm 21C and the outer casing 22) are omitted in Fig. 3.
在第2、3圖之實施例中,複數個滾輪R係以直立方式配置於外殼22中(亦即,滾輪R的輪軸方向A大致平行於Z軸方向)。皮帶B套設於該些滾輪R之間,並可透過滾輪R之帶動而沿著水平方向發生滾動。在一些實施例中,皮帶B係以塑膠材質製成的一齒型皮帶。配合滾輪R的位置,皮帶B可構成一環形(第3圖),且皮帶B的兩端部連接於基板傳送組件21之滑塊21B。由此,當皮帶B進行滾動時,滑塊21B受到皮帶B之帶動下可以沿著線性滑軌21A移動,並使得與滑塊21B連接之機械手臂21C一起發生線性移動。另外,外殼22上可形成有一狹長型開口部22A,大致平行於線性滑軌21A,能夠允許機械手臂21C之一支撐桿21D通過且連接至滑塊21B。支撐桿21D亦可以相對於滑塊21B進行旋轉,而使得機械手臂21C發生轉動。如此一來,能夠達到基板傳送系統20傳送基板W的目的。 In the embodiments of Figs. 2 and 3, a plurality of rollers R are disposed in the housing 22 in an upright manner (i.e., the wheel axis direction A of the roller R is substantially parallel to the Z-axis direction). The belt B is sleeved between the rollers R and can be rolled in the horizontal direction by the roller R. In some embodiments, the belt B is a toothed belt made of plastic material. In conjunction with the position of the roller R, the belt B can constitute an annular shape (Fig. 3), and both ends of the belt B are coupled to the slider 21B of the substrate transfer unit 21. Thus, when the belt B is rolled, the slider 21B is moved by the belt B to be movable along the linear slide 21A, and linearly moves together with the robot arm 21C to which the slider 21B is attached. Further, the outer casing 22 may be formed with an elongated opening portion 22A substantially parallel to the linear sliding rail 21A, allowing one of the mechanical arms 21C to pass through and support the slider 21B. The support rod 21D can also be rotated relative to the slider 21B to cause the robot arm 21C to rotate. As a result, the substrate transfer system 20 can be transported for the purpose of transporting the substrate W.
應瞭解的是,滾輪R又包括一主動輪R1及複數個從動輪R2。其中,主動輪R1可以透過一馬達M(請參照第4圖)之驅動而繞著其輪軸方向A發生轉動,而該些從動輪R2在主動輪R1轉動時通過皮帶B之帶動下則可繞著各自的輪軸方向A發生轉動(亦即,從動輪R2用以配合主動輪R1來帶動滾輪R滾動)。 It should be understood that the roller R further includes a driving wheel R1 and a plurality of driven wheels R2. The driving wheel R1 can be rotated around its axle direction A by driving a motor M (please refer to FIG. 4), and the driven wheels R2 can be wound by the belt B when the driving wheel R1 rotates. The respective axle directions A are rotated (that is, the driven wheels R2 are used to cooperate with the driving wheels R1 to drive the rollers R to roll).
另外,皮帶B係以交叉方式(或一前一後方式)套設 於主動輪R1與相鄰的從動輪R2之間(第3圖),故主動輪R1與該些從動輪R2的轉動方向為相反。然而,主動輪R1、從動輪R2及皮帶B的數量或配置方式也可以有其他的變化或修改,而並不以第3圖所示之實施例為限。另外,在基板傳送系統20中也可以加入其他的特徵(例如,在線性滑軌21A之端部配置擋塊,以界定滑塊21B之移動行程),或者,在基板傳送系統20之某些實施例中,上述的某些特徵也可以被更換或移除。 In addition, the belt B is sleeved in a crossover manner (or one after the other) Between the driving wheel R1 and the adjacent driven wheel R2 (Fig. 3), the driving direction of the driving wheel R1 and the driven wheels R2 is opposite. However, there may be other variations or modifications to the number or arrangement of the driving wheels R1, the driven wheels R2 and the belt B, and are not limited to the embodiment shown in FIG. In addition, other features may be added to the substrate transport system 20 (e.g., a stop is disposed at the end of the linear slide 21A to define the travel of the slider 21B), or some implementation of the substrate transfer system 20 In some cases, some of the above features may also be replaced or removed.
接著請參照第4圖,在傳送基板W(第1圖)的過程中,由於受力不均或者材料老化導致張力發生變化等因素,基板傳送系統20之皮帶B可能在滾輪R(包括主動輪R1及/或從動輪R2)之輪軸方向A上發生偏移,並與位在滾輪R上、下端部之凸緣結構F發生摩擦,長時間下來,可能導致皮帶B發生斷裂。一旦皮帶B突然發生斷裂,會導致機械手臂21C的動作瞬間停止並發生劇烈晃動,使得基板W可能脫離機械手臂21C並與半導體製造機台1中之其他部件碰撞,造成基板W發生受損或碎裂。 Next, referring to FIG. 4, in the process of transporting the substrate W (Fig. 1), the belt B of the substrate transport system 20 may be on the roller R (including the driving wheel) due to factors such as uneven force or material aging due to changes in tension. The wheel axis direction A of the R1 and/or the driven wheel R2) is offset, and friction occurs with the flange structure F located at the upper and lower ends of the roller R, and the belt B may be broken for a long time. Once the belt B suddenly breaks, the action of the robot arm 21C is instantaneously stopped and violently shaken, so that the substrate W may be detached from the robot arm 21C and collide with other components in the semiconductor manufacturing machine 1, causing the substrate W to be damaged or broken. crack.
本發明實施例提出如下述技術特徵,能夠在基板傳送過程中即時、動態地補償皮帶B在滾輪R之輪軸方向A上的偏移,以避免皮帶B與滾輪R之凸緣結構F發生摩擦,從而延長皮帶B的使用壽命及降低皮帶B斷裂之機會。進一步地,也可以降低基板W的報廢率(scrap ratio),並提高各製程的良率。 The embodiment of the present invention provides the following technical features, which can instantly and dynamically compensate the offset of the belt B in the wheel axis direction A of the roller R during the substrate transfer process, so as to avoid friction between the belt B and the flange structure F of the roller R. Thereby extending the service life of the belt B and reducing the chance of the belt B breaking. Further, the scrap ratio of the substrate W can also be lowered, and the yield of each process can be improved.
如第4圖所示,在基板傳送系統20的運作中,皮帶B理想上應該保持在主動輪R1及從動輪R2之輪軸方向A上的中心位置附近,亦即,皮帶B處在主動輪R1及從動輪R2之輪軸方向A上的既定位置範圍NP(如圖中之虛線帶所示)。舉例來說, 皮帶B在主動輪R1及從動輪R2之輪軸方向A上的既定位置範圍NP包括皮帶B在主動輪R1及從動輪R2之輪軸方向A上的中心位置及從中心位置向上及/或向下偏移一可允許的範圍,例如數毫米至數公分,其端視實際需求決定(重點是,皮帶B在既定位置範圍NP內即不會與滾輪R之凸緣結構F輕易發生摩擦)。再者,皮帶B在主動輪R1之輪軸方向A上的既定位置範圍NP可稱作一第一位置範圍,而皮帶B在從動輪R2之輪軸方向A上的既定位置範圍NP可稱作一第二位置範圍,其中第一、第二位置範圍的上邊界在一相同水平高度上,且第一、第二位置範圍的下邊界在另一相同水平高度上。 As shown in Fig. 4, in the operation of the substrate transfer system 20, the belt B should ideally be held near the center position in the axle direction A of the driving wheel R1 and the driven wheel R2, that is, the belt B is at the driving wheel R1. And a predetermined position range NP in the axle direction A of the driven wheel R2 (shown by a dotted line in the figure). for example, The predetermined position range NP of the belt B in the axle direction A of the driving wheel R1 and the driven wheel R2 includes the center position of the belt B in the axle direction A of the driving wheel R1 and the driven wheel R2 and the upward and/or downward bias from the center position. The allowable range is shifted, for example, a few millimeters to a few centimeters, depending on the actual demand (the point is that the belt B does not easily rub against the flange structure F of the roller R within the predetermined position range NP). Furthermore, the predetermined position range NP of the belt B in the axle direction A of the driving wheel R1 may be referred to as a first position range, and the predetermined position range NP of the belt B in the axle direction A of the driven wheel R2 may be referred to as a first The two position range, wherein the upper boundaries of the first and second position ranges are at the same level, and the lower boundaries of the first and second position ranges are at another same level.
在一些實施例中,為了偵測皮帶B在主動輪R1及從動輪R2之輪軸方向A上是否超出既定位置範圍NP,係在主動輪R1上、下端部分別設置一(第一)位置感測器S,及在從動輪R2上、下端部分別設置一(第二)位置感測器S(為了清楚起見,第4圖中僅省略了位置感測器S)。舉例來說,位置感測器S可以設置於主動輪R1及從動輪R2在輪軸方向A上之上、下端部,並恰好齊平皮帶B的既定位置範圍NP的上、下邊界(例如第5A圖中所示)。 In some embodiments, in order to detect whether the belt B exceeds the predetermined position range NP in the axle direction A of the driving wheel R1 and the driven wheel R2, a (first) position sensing is respectively disposed on the upper and lower ends of the driving wheel R1. The device S is provided with a (second) position sensor S on the upper and lower ends of the driven wheel R2 (only the position sensor S is omitted in Fig. 4 for the sake of clarity). For example, the position sensor S may be disposed on the upper and lower ends of the driving wheel R1 and the driven wheel R2 in the axle direction A, and just flush the upper and lower boundaries of the predetermined position range NP of the belt B (for example, the 5A Shown in the picture).
根據一些實施例,位置感測器S偵測皮帶B之位置的方式可以為接觸式或非接觸式。 According to some embodiments, the position sensor S detects the position of the belt B in a contact or non-contact manner.
舉例來說,第5A圖所示實施例中之位置感測器S為一光感測器(或稱作光電感測器),其可以圍繞方式固定於滾輪R(包括主動輪R1及/或從動輪R2)之上、下端部之凸緣結構F上,並與滾輪R之輪軸部分之間具有一間隔D。間隔D的大小要 足夠允許皮帶B通過而不會與位置感測器S發生干涉。當皮帶B在滾輪R之輪軸方向A上發生偏移並超出既定位置範圍NP時,位置感測器S(光感測器)可透過光學方式偵測到皮帶B超出既定位置範圍NP的一偏移量X。根據一些實施例,上述光感測器係由一組投光器及受光器組成,透過投光器及受光器之間的光線改變所獲得的光信號,能夠即時來偵測皮帶B超出既定位置範圍NP之偏移量X。 For example, the position sensor S in the embodiment shown in FIG. 5A is a light sensor (or photo-sensing device), which can be fixed to the roller R in a surrounding manner (including the driving wheel R1 and/or There is a gap D between the upper and lower flange portions F of the driven wheel R2) and the axle portion of the roller R. The size of the interval D is It is sufficient to allow the belt B to pass without interfering with the position sensor S. When the belt B is offset in the axle direction A of the roller R and exceeds the predetermined position range NP, the position sensor S (photosensor) can optically detect a deviation of the belt B beyond the predetermined position range NP. Shift X. According to some embodiments, the light sensor is composed of a group of light projectors and light receivers, and the light signal obtained by the light change between the light projector and the light receiver can instantly detect the deviation of the belt B beyond the predetermined position range NP. Shift X.
又舉例來說,第5B圖所示實施例中之位置感測器S為一壓力感測器,其可以圍繞方式固定於滾輪R之上、下端部之凸緣結構F上,並與滾輪R之輪軸部分相鄰接。當皮帶B在滾輪R之輪軸方向A上發生偏移並超出既定位置範圍NP時,會導致位置感測器S(壓力感測器)受力變形,且位置感測器S所感測到的壓力值正比於皮帶B之偏移量。如此一來,位置感測器S亦能夠偵測皮帶B超出既定位置範圍NP之偏移量X。根據一些實施例,上述壓力感測器中包括一彈簧套件,用以在受力變形後產生一反作用力來達到復位。 For example, the position sensor S in the embodiment shown in FIG. 5B is a pressure sensor which can be fixed around the roller R, the flange structure F at the lower end, and the roller R. The axle portions are adjacent. When the belt B is offset in the axle direction A of the roller R and exceeds the predetermined position range NP, the position sensor S (pressure sensor) is deformed by force, and the pressure sensed by the position sensor S is caused. The value is proportional to the offset of the belt B. In this way, the position sensor S can also detect the offset X of the belt B beyond the predetermined position range NP. According to some embodiments, the pressure sensor includes a spring kit for generating a reaction force after the force is deformed to achieve the reset.
應瞭解的是,上述光感測器或壓力感測器僅作為位置感測器S之示例,而並非用以限制位置感測器S之類型。位置感測器S可以採用任何已知形式適於感測物件之位置或距離的感測器。 It should be understood that the above-mentioned photo sensor or pressure sensor is only used as an example of the position sensor S, and is not used to limit the type of the position sensor S. The position sensor S can take any known form of sensor suitable for sensing the position or distance of the item.
接著請一併參照第4圖及第6圖,基板傳送系統20亦包括一控制單元U,用以接收來自位置感測器S的位置感測信號(亦即,位置感測器S可將所感測到之光信號或壓力值轉變為一電信號,並傳送至控制單元U),及基於位置感測信號控制如 下述用以驅動主動輪R1及從動輪R2沿著各自的輪軸方向A移動之驅動機構M1、M2的運作。控制單元U亦可用以控制驅動主動輪R1之馬達M的運作。 Referring to FIG. 4 and FIG. 6 together, the substrate transfer system 20 also includes a control unit U for receiving a position sensing signal from the position sensor S (ie, the position sensor S can sense the position) The measured optical signal or pressure value is converted into an electrical signal and transmitted to the control unit U), and based on the position sensing signal control The operation of driving mechanisms M1, M2 for driving the driving wheel R1 and the driven wheel R2 to move along the respective axle directions A is described below. The control unit U can also be used to control the operation of the motor M that drives the driving wheel R1.
根據一些實施例,控制單元U包括一處理器、微控制器、數位訊號處理器(DSP)、其他處理元件、或上述之組合,並可透過有線(例如電線、電纜或光纖)或無線(例如藍芽、wifi或近場通訊(NFC)傳輸)之方式電性連接馬達M、位置感測器S及驅動機構M1、M2。根據一些替代實施例,亦可利用半導體製造機台1之電腦控制系統來取代控制單元U的功能(亦即,基板傳送系統20之控制單元U也可以被省略)。 According to some embodiments, the control unit U comprises a processor, a microcontroller, a digital signal processor (DSP), other processing elements, or a combination thereof, and may be wired (eg, wire, cable, or fiber optic) or wireless (eg, In the manner of Bluetooth, wifi or Near Field Communication (NFC) transmission, the motor M, the position sensor S and the drive mechanisms M1, M2 are electrically connected. According to some alternative embodiments, the computer control system of the semiconductor manufacturing machine 1 can also be used in place of the function of the control unit U (i.e., the control unit U of the substrate transfer system 20 can also be omitted).
根據一些實施例,驅動機構M1、M2例如為(Z軸)馬達或其類似物,分別設置於基板傳送系統20之外殼22中,用以驅動主動輪R1及從動輪R2沿著各自的輪軸方向A移動,並可使得皮帶B保持在各滾輪R之輪軸方向A上的既定位置範圍NP內。 According to some embodiments, the driving mechanisms M1, M2 are, for example, (Z-axis) motors or the like, respectively disposed in the outer casing 22 of the substrate transport system 20 for driving the driving wheel R1 and the driven wheel R2 along respective axle directions. A moves and allows the belt B to be held within a predetermined position range NP in the axle direction A of each roller R.
舉例來說,如第4圖所示,當皮帶B沿著主動輪R1之輪軸方向A發生向上偏移並超出既定位置範圍NP時,(第一)驅動機構M1受到控制單元U(第6圖)之控制可以驅動主動輪R1沿著其輪軸方向A向下移動(其中,驅動機構M1可透過一伸縮桿L連接馬達M,再透過馬達M連接主動輪R1),並透過主動輪R1與皮帶B之間的摩擦力來帶動皮帶B,使其復位到既定位置範圍NP(亦即第一位置範圍)內;同理,當皮帶B沿著從動輪R2之輪軸方向A發生向下偏移並超出既定位置範圍NP時,(第二)驅動機構M2受到控制單元U(第6圖)之控制可以驅動從動輪R2 沿著其輪軸方向A向上移動(其中,驅動機構M2可透過一伸縮桿L連接從動輪R2),並透過從動輪R2與皮帶B之間的摩擦力來帶動皮帶B,使其復位到既定位置範圍NP(亦即第二位置範圍)內。應可以理解的是,當皮帶B超出既定位置範圍NP的偏移量X越大時,驅動機構M1、M2驅動主動輪R1及從動輪R2沿著輪軸方向A的移動量亦會越大。藉此,能夠即時、有效地補償及矯治皮帶B在滾輪R之輪軸方向A上的偏移。 For example, as shown in FIG. 4, when the belt B is displaced upward along the axle direction A of the driving wheel R1 and exceeds the predetermined position range NP, the (first) driving mechanism M1 is subjected to the control unit U (Fig. 6 The control can drive the driving wheel R1 to move downward along its axle direction A (wherein the driving mechanism M1 can be connected to the motor M through a telescopic rod L, and then connected to the driving wheel R1 through the motor M), and through the driving wheel R1 and the belt The friction between B drives the belt B to return it to the predetermined position range NP (ie, the first position range); similarly, when the belt B is displaced downward along the axle direction A of the driven wheel R2 and When the predetermined position range NP is exceeded, the (second) drive mechanism M2 is controlled by the control unit U (Fig. 6) to drive the driven wheel R2. Moving upward along its axle direction A (wherein the drive mechanism M2 can be connected to the driven wheel R2 through a telescopic rod L), and driving the belt B through the friction between the driven wheel R2 and the belt B to reset it to a predetermined position The range is NP (ie, the second position range). It should be understood that when the shift amount X of the belt B beyond the predetermined position range NP is larger, the amount of movement of the driving mechanism M1, M2 driving the driving wheel R1 and the driven wheel R2 along the axle direction A is also larger. Thereby, the offset of the belt B in the axle direction A of the roller R can be compensated and corrected in an immediate and effective manner.
本發明實施例亦提供一種基板傳送方法70,如第7圖中之流程圖所示。為了說明,將配合參照第1至6圖一起描述流程圖。首先,基板傳送方法70包括操作71:(在一半導體製造機台1中)藉由一基板傳送系統20傳送至少一基板W,其中基板傳送系統20包括一皮帶B、一滾輪R及一基板傳送組件21,滾輪R用以帶動皮帶B滾動,而基板傳送組件21用以透過皮帶B之帶動而傳送至少一基板W。接著,基板傳送方法70更包括操作72:在傳送至少一基板W的過程中,(利用位置感測器S)偵測皮帶B在滾輪的一輪軸方向A上的位置。此外,基板傳送方法70還包括操作73:當偵測到皮帶B在滾輪R的輪軸方向A上發生偏移並超出一既定位置範圍NP時,(基於位置感測器S所獲得皮帶B的位置感測信號,控制單元U控制驅動機構M1、M2)將滾輪R沿著輪軸方向A移動(更具體而言,滾輪R沿著輪軸方向A的移動方向與皮帶B沿著輪軸方向A的偏移方向呈相反),使得皮帶B復位到既定位置範圍NP內。 The embodiment of the present invention also provides a substrate transfer method 70, as shown in the flow chart in FIG. For the sake of explanation, the flowchart will be described together with reference to Figs. 1 to 6. First, the substrate transfer method 70 includes an operation 71: (in a semiconductor manufacturing machine 1) transmitting at least one substrate W by a substrate transfer system 20, wherein the substrate transfer system 20 includes a belt B, a roller R, and a substrate transfer The component 21, the roller R is used to drive the belt B to roll, and the substrate transporting component 21 is configured to transmit at least one substrate W through the belt B. Next, the substrate transfer method 70 further includes an operation 72 of detecting the position of the belt B in the direction A of the wheel axis (in the position sensor S) during the transfer of the at least one substrate W. Further, the substrate transfer method 70 further includes an operation 73: when it is detected that the belt B is displaced in the wheel axis direction A of the roller R and exceeds a predetermined position range NP (based on the position of the belt B obtained by the position sensor S) Sensing the signal, the control unit U controls the drive mechanism M1, M2) to move the roller R along the axle direction A (more specifically, the direction of movement of the roller R along the axle direction A and the offset of the belt B along the axle direction A) The direction is reversed, so that the belt B is reset to the predetermined position range NP.
需要瞭解的是,在上述實施例中的方法之前、期間和之後可以提供額外的操作,並且對於不同實施例中的方法, 可以替換或消除一些描述的操作。例如,基板傳送方法70還可以包括:在傳送至少一基板W的過程中,當偵測到皮帶B在滾輪R之輪軸方向A上偏移超出既定位置範圍NP一定次數時,發出一警示。舉例來說,在傳送多片基板W的過程中,當偵測到皮帶B在滾輪R之輪軸方向A上相對於既定位置範圍NP已發生多次(例如5次、10次或更多次)偏移時(亦即,經過多次補償皮帶B之偏移後,而仍然繼續發生偏移時),控制單元U可以傳送一警示信號AS給半導體製造機台1,使其發出一警示,以通知操作者皮帶B可能發生異常(例如材料老化而導致其張力不足),而需要暫停基板傳送系統20之運作及進行皮帶B之更換。如此一來,能夠有效且即時監測皮帶B的使用情況,並降低皮帶B突然斷裂的可能性。 It will be appreciated that additional operations may be provided before, during and after the methods in the above embodiments, and for methods in different embodiments, Some of the described operations can be replaced or eliminated. For example, the substrate transfer method 70 may further include: in the process of transmitting the at least one substrate W, an alarm is issued when it is detected that the belt B is offset in the wheel axis direction A of the roller R by a predetermined number of times beyond the predetermined position range NP. For example, in the process of transporting the plurality of substrates W, when it is detected that the belt B has occurred multiple times (for example, 5 times, 10 times or more) with respect to the predetermined position range NP in the axle direction A of the roller R. When offset (that is, after a plurality of offsets of the offset of the belt B, and the offset continues to occur), the control unit U can transmit a warning signal AS to the semiconductor manufacturing machine 1 to issue a warning to The operator is notified that the belt B may be abnormal (for example, the material is aged to cause insufficient tension), and the operation of the substrate transfer system 20 and the replacement of the belt B need to be suspended. In this way, the use of the belt B can be effectively and instantly monitored, and the possibility of sudden breakage of the belt B can be reduced.
另外,在一些替代實施例中,基於上述控制單元U或半導體製造機台1所發出之警示,基板傳送方法70也可以直接停止基板傳送系統20之運作,包括使得機械手臂21C不再到半導體製造機台1之載入口12接收基板W,同時降低機械手臂21C的移動速度(亦即,皮帶B的滾動速度),並且令機械手臂21C回到其初始位置(home position),以待操作者來進行皮帶B之檢查或更換作業。此種自動防護方式亦能夠提高基板傳送系統20之信賴度。 In addition, in some alternative embodiments, based on the warnings issued by the control unit U or the semiconductor manufacturing machine 1, the substrate transfer method 70 can also directly stop the operation of the substrate transfer system 20, including causing the robot arm 21C to no longer be in semiconductor manufacturing. The loading port 12 of the machine 1 receives the substrate W while reducing the moving speed of the robot arm 21C (that is, the rolling speed of the belt B), and returns the robot arm 21C to its home position for the operator to wait for the operator. To carry out the inspection or replacement of the belt B. This automatic protection method can also increase the reliability of the substrate transfer system 20.
綜上所述,本揭露實施例具有以下優點:藉由即時監測及動態調整基板傳送系統之皮帶位置的技術手段,能夠避免皮帶與滾輪端部之凸緣結構發生摩擦,從而延長皮帶的使用壽命及降低皮帶突然斷裂之機會(亦即,提高基板傳送系統 的信賴度及可利用性)。進一步地,也可以降低基板的報廢率,並提高各製程的良率。 In summary, the disclosed embodiment has the following advantages: by instantaneously monitoring and dynamically adjusting the belt position of the substrate transport system, friction between the belt and the flange end of the roller can be avoided, thereby prolonging the service life of the belt. And reduce the chance of a sudden break in the belt (ie, improve the substrate transfer system) Reliability and availability). Further, the rejection rate of the substrate can also be reduced, and the yield of each process can be improved.
根據一些實施例,提供一種基板傳送系統,包括一皮帶、一滾輪、一基板傳送組件、一位置感測器、及一驅動機構。滾輪配置用以帶動皮帶滾動。基板傳送組件連接皮帶,用以傳送一基板。位置感測器配置用以偵測皮帶在滾輪的一輪軸方向上的位置。驅動機構配置用以驅動滾輪沿著輪軸方向移動,並使得皮帶保持在輪軸方向上的一既定位置範圍內。 In accordance with some embodiments, a substrate transfer system is provided that includes a belt, a roller, a substrate transfer assembly, a position sensor, and a drive mechanism. The roller is configured to drive the belt to roll. The substrate transfer assembly is coupled to the belt for transporting a substrate. The position sensor is configured to detect the position of the belt in the direction of one of the axles of the roller. The drive mechanism is configured to drive the roller to move in the direction of the axle and to maintain the belt within a predetermined range of positions in the direction of the axle.
根據一些實施例,基板傳送系統更包括一控制單元,配置用以接收來自位置感測器的一位置感測信號,及基於位置感測信號控制驅動機構的運作。 According to some embodiments, the substrate transfer system further includes a control unit configured to receive a position sensing signal from the position sensor and to control operation of the driving mechanism based on the position sensing signal.
根據一些實施例,位置感測器設置於滾輪在輪軸方向上的一端部,用以偵測皮帶在輪軸方向上是否超出既定位置範圍。 According to some embodiments, the position sensor is disposed at one end of the roller in the direction of the axle to detect whether the belt exceeds a predetermined position range in the direction of the axle.
根據一些實施例,位置感測器更用以偵測皮帶在輪軸方向上超出既定位置範圍的一偏移量。 According to some embodiments, the position sensor is further configured to detect an offset of the belt beyond the predetermined position range in the direction of the axle.
根據一些實施例,基板傳送組件包括一線性滑軌、一滑塊、及一機械手臂。機械手臂連接滑塊,用以傳送基板。滑塊配置用以透過皮帶之帶動而沿著線性滑軌移動。 According to some embodiments, the substrate transfer assembly includes a linear slide, a slider, and a robotic arm. The robot arm is connected to the slider for transferring the substrate. The slider is configured to move along the linear slide by the belt.
根據一些實施例,提供一種基板傳送系統,包括一皮帶、一主動輪、一從動輪、一基板傳送組件、一第一位置感測器、一第一驅動機構、一第二位置感測器、及一第二驅動機構。主動輪配置用以透過一馬達之驅動而發生轉動。從動輪配置用以配合主動輪來帶動皮帶滾動。基板傳送組件配置用以 透過皮帶之帶動而傳送一基板。第一位置感測器配置用以偵測皮帶在主動輪的一輪軸方向上的位置。第一驅動機構配置用以驅動主動輪沿著其輪軸方向移動,使得皮帶保持在主動輪之輪軸方向上的一第一位置範圍內。第二位置感測器配置用以偵測皮帶在該動輪的一輪軸方向上的位置。第二驅動機構配置用以驅動從動輪沿著其輪軸方向移動,使得皮帶保持在從動輪之輪軸方向上的一第二位置範圍內,其中第一、第二位置範圍的上邊界係在一相同水平高度上,且第一、第二位置範圍的下邊界係在另一相同水平高度上。 According to some embodiments, a substrate transfer system includes a belt, a driving wheel, a driven wheel, a substrate transfer assembly, a first position sensor, a first drive mechanism, a second position sensor, And a second drive mechanism. The driving wheel is configured to rotate by driving of a motor. The driven wheel is configured to cooperate with the driving wheel to drive the belt to roll. The substrate transfer component is configured to be used A substrate is conveyed by the belt. The first position sensor is configured to detect the position of the belt in the direction of one of the axles of the drive wheel. The first drive mechanism is configured to drive the drive wheel to move along its axle direction such that the belt remains within a first range of positions in the direction of the axle of the drive wheel. The second position sensor is configured to detect a position of the belt in an axle direction of the moving wheel. The second driving mechanism is configured to drive the driven wheel to move along the direction of the axle thereof such that the belt is maintained within a second position in the direction of the axle of the driven wheel, wherein the upper boundaries of the first and second ranges are the same At the horizontal level, and the lower boundary of the first and second position ranges is at another same level.
根據一些實施例,馬達連接主動輪,而第一驅動機構連接馬達。 According to some embodiments, the motor is coupled to the drive wheel and the first drive mechanism is coupled to the motor.
根據一些實施例,提供一種基板傳送方法,包括藉由一基板傳送系統傳送至少一基板,其中基板傳送系統包括一皮帶、一滾輪及一基板傳送組件,滾輪用以帶動皮帶滾動,而基板傳送組件用以透過皮帶之帶動而傳送至少一基板。基板傳送方法更包括在傳送至少一基板的過程中,偵測皮帶在滾輪的一輪軸方向上的位置。此外,基板傳送方法還包括當偵測到皮帶在滾輪的輪軸方向上發生偏移並超出一既定位置範圍時,將滾輪沿著輪軸方向移動,使得皮帶復位到既定位置範圍內。 According to some embodiments, a substrate transfer method is provided, including transmitting at least one substrate by a substrate transfer system, wherein the substrate transfer system includes a belt, a roller and a substrate transfer assembly, the roller is used to drive the belt to roll, and the substrate transfer assembly The at least one substrate is conveyed by the belt. The substrate transfer method further includes detecting a position of the belt in a direction of an axle of the roller during the transfer of the at least one substrate. In addition, the substrate transfer method further includes moving the roller along the axle direction when the belt is detected to be offset in the direction of the wheel axis of the roller and beyond a predetermined position range, so that the belt is reset to a predetermined position range.
根據一些實施例,基板傳送方法更包括在傳送至少一基板的傳送過程中,當偵測到皮帶在輪軸方向上偏移超出既定位置範圍一定次數時,發出一警示。 According to some embodiments, the substrate transfer method further includes issuing a warning when the transfer of the at least one substrate is detected, and when the belt is detected to be offset in the direction of the axle by a predetermined number of times.
根據一些實施例,基板傳送方法更包括基於警示,停止基板傳送系統的運作。 According to some embodiments, the substrate transfer method further includes stopping the operation of the substrate transfer system based on the alert.
以上雖然詳細描述了實施例及它們的優勢,但應該理解,在不背離所附申請專利範圍限定的本揭露的精神和範圍的情況下,對本揭露可作出各種變化、替代和修改。此外,本申請的範圍不旨在限制於說明書中所述的製程、機器、製造、物質組成、工具、方法和步驟的特定實施例。作為本領域的普通技術人員將容易地從本揭露中理解,根據本揭露,可以利用現有的或今後將被開發的、執行與在本揭露所述的對應實施例基本相同的功能或實現基本相同的結果的製程、機器、製造、物質組成、工具、方法或步驟。因此,所附申請專利範圍旨在將這些製程、機器、製造、物質組成、工具、方法或步驟包括它們的範圍內。此外,每一個申請專利範圍構成一個單獨的實施例,且不同申請專利範圍和實施例的組合都在本揭露的範圍內。 The embodiments and their advantages are described in detail above, and it is understood that various changes, substitutions and modifications may be made in the present disclosure without departing from the spirit and scope of the disclosure. Further, the scope of the present application is not intended to be limited to the specific embodiments of the process, the machine, the manufacture, the material composition, the tool, the method and the steps described in the specification. It will be readily apparent to those skilled in the art from this disclosure that, in accordance with the present disclosure, substantially the same functions or implementations as those of the corresponding embodiments described herein may be utilized. The resulting process, machine, manufacturing, material composition, tool, method or procedure. Therefore, the scope of the appended claims is intended to cover such processes, machines, manufacture, compositions of matter, tools, methods or steps. In addition, each patent application scope constitutes a separate embodiment, and combinations of different application patent scopes and embodiments are within the scope of the disclosure.
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| TW201521956A (en) * | 2013-10-16 | 2015-06-16 | 應用材料股份有限公司 | Chemical mechanical polishing machine with pivot arm |
| CN205442003U (en) * | 2015-12-29 | 2016-08-10 | 郑州旭飞光电科技有限公司 | Belt transfer system of glass substrate line printer |
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| TW201715637A (en) * | 2015-10-27 | 2017-05-01 | 平田機工股份有限公司 | Transfer unit, transfer device and transfer method |
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| TW201521956A (en) * | 2013-10-16 | 2015-06-16 | 應用材料股份有限公司 | Chemical mechanical polishing machine with pivot arm |
| TW201715637A (en) * | 2015-10-27 | 2017-05-01 | 平田機工股份有限公司 | Transfer unit, transfer device and transfer method |
| CN205442003U (en) * | 2015-12-29 | 2016-08-10 | 郑州旭飞光电科技有限公司 | Belt transfer system of glass substrate line printer |
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