TWI644344B - Processing liquid supply device, substrate processing system, and processing liquid supply method - Google Patents

Abstract

The processing liquid supply device includes: a processing liquid tank that stores a processing liquid; a first processing liquid pipe that connects the processing unit and the processing liquid tank; an opening and closing unit that opens and closes the first processing liquid pipe; pressurized A unit for pressurizing the processing liquid with a gas in order to send the processing liquid inside the processing liquid tank to the first processing liquid pipe; a pressure adjusting unit for adjusting the inside of the processing liquid tank Pressure; and a control device that controls the pressure adjusting unit before the opening and closing unit is closed, gradually opens the atmosphere inside the pressurized treatment liquid tank, and closes the opening and closing unit after the opening of the atmosphere is started.

Description

Processing liquid supply device, substrate processing system, and processing liquid supply method

The present invention relates to a processing liquid supply device that supplies a processing liquid, a substrate processing system provided with the supply device, and a processing liquid supply method that supplies a processing liquid. The substrates to be processed using the processing liquid include, for example, semiconductor wafers, substrates for liquid crystal display devices, substrates for plasma displays, substrates for field emission displays (FED; Field Emission Display), substrates for optical discs, and disks Substrates, substrates for optomagnetic discs, substrates for photomasks, ceramic substrates, substrates for solar cells, etc.

Patent Document 1 below discloses a processing liquid supply device that supplies a processing liquid to a substrate processing section. The processing liquid supply device includes: a processing liquid tank that stores the processing liquid; a processing liquid pipe that connects the processing liquid tank and the substrate processing section; and a valve that opens and closes the processing liquid pipe. The processing liquid supply device further includes a pressurizing unit that uses a so-called pressurized pressure feeding method to pressurize the processing liquid inside the processing liquid tank with a gas, thereby moving the processing liquid to the processing liquid piping.

[Prior Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2000-21703

In such a processing liquid supply device, if it is notified from the substrate processing section side that supply is not required, the valve on the substrate processing section side is closed while maintaining the pressurized state inside the processing liquid tank and the processing liquid piping. Therefore, after the valve is closed, the pressure inside the processing liquid tank and the processing liquid piping is kept in a pressurized state.

Since the high-pressure pressurized gas is used for continuous pressurization, a large amount of gas (inert gas such as nitrogen) dissolves into the processing liquid inside the processing liquid tank and the processing liquid piping. Because the solubility of gas to liquid is proportional to its pressure, there is a possibility that a large amount of gas will be dissolved in the treatment liquid inside the treatment liquid piping under high pressure.

If the processing liquid (for example, organic solvent, etc.) supplied to the substrate contains bubbles, the gas-liquid interface formed by the liquid of the processing liquid and the bubbles attracts and accumulates tiny foreign substances contained in the processing liquid, And grow into particles. As a result, particles may be generated on the surface of the substrate after drying. Moreover, if the amount of bubbles contained in the treatment liquid is large, the gas-liquid interface will be enlarged in size, and there is a possibility that the problem of generation of particles becomes significant.

Such a problem occurs not only when the organic solvent is supplied to the substrate, but also when the other type of processing liquid is supplied to the substrate.

Therefore, an object of the present invention is to provide a processing liquid supply device and a processing liquid supply method that can reduce the amount of bubbles included in the supplied processing liquid.

In addition, another object of the present invention is to provide a substrate processing system that can suppress or prevent generation of particles.

The present invention provides a processing liquid supply device that supplies a processing liquid to a processing unit that performs processing using a processing liquid on a substrate, and includes: a processing liquid tank that stores a processing liquid; and a first processing liquid pipe that connects to the above The processing unit and the processing liquid tank; the opening and closing unit for opening and closing the first processing liquid piping; the pressurizing unit, which uses gas Pressurizing the processing liquid inside the processing liquid tank, thereby moving the processing liquid to the first processing liquid piping; a pressure adjustment unit for adjusting the pressure inside the processing liquid tank; and a control device, In order to stop the supply of the processing liquid from the processing liquid supply device to the processing unit, the pressure adjusting unit is controlled before the opening and closing unit is closed, so that the inside of the processing liquid tank in the pressurized state is gradually opened to the atmosphere, and After the opening of the atmosphere, the opening and closing unit is closed.

According to this configuration, when the supply of the processing liquid from the processing liquid supply device to the processing unit is stopped, the control device gradually opens the atmosphere of the processing liquid tank pressurized by the pressurization unit before the opening and closing unit is closed, and Close the opening and closing unit after the opening of the atmosphere. Since the opening and closing unit is closed after the decompression inside the processing liquid tank is started, after closing the opening and closing unit, the inside of the processing liquid tank and the inside of the first processing liquid piping are maintained at a more reduced pressure than the above-mentioned pressurized state 'S state. Since the solubility of the gas in the liquid is proportional to its pressure, no large amount of gas will dissolve inside the processing liquid piping in this reduced pressure state. Since the amount of dissolved gas in the treatment liquid is small, the amount of bubbles generated in the treatment liquid can be reduced.

In addition, since the atmosphere inside the processing liquid tank is gradually opened, it is also possible to suppress or prevent the gas dissolved in the processing liquid from appearing as bubbles during the depressurization process.

Thereby, it is possible to provide a processing liquid supply device capable of reducing the amount of bubbles contained in the supplied processing liquid.

In one embodiment of the present invention, the control device closes the opening and closing unit after the pressure inside the processing liquid tank drops to atmospheric pressure.

According to this configuration, the opening and closing unit is closed after the pressure inside the processing liquid tank drops to atmospheric pressure. Therefore, after closing the opening and closing unit, the inside of the processing liquid tank and The inside of the first processing liquid piping is maintained at atmospheric pressure. Therefore, it is possible to further reduce the amount of dissolved gas in the processing liquid dissolved in the processing liquid tank and the first processing liquid piping. Therefore, the amount of bubbles in the treatment liquid can be further reduced.

The included processing liquid supply device may further include a pressure gauge for detecting the pressure inside the processing liquid tank, and the control device is not capable of detecting the value of the pressure gauge when a predetermined time has passed since the opening of the atmosphere It is judged as an error state when it reaches the established threshold.

According to this configuration, when the pressure value does not reach the predetermined threshold value when a predetermined time has passed since the opening of the atmosphere, it is determined as an error state. By this, the decompression speed inside the processing liquid tank can be prevented from being too fast, so that the amount of bubbles contained in the processing liquid can be more effectively reduced.

The treatment liquid device may further include an atmosphere communication pipe that connects the inside of the treatment liquid tank to the atmosphere, and the pressure adjustment unit includes an atmosphere on-off valve for opening and closing the atmosphere communication pipe.

According to this configuration, the atmosphere inside the processing liquid tank can be opened by opening the atmosphere on-off valve to open the atmosphere communication piping. Therefore, it is possible to realize a structure capable of opening the atmosphere inside the processing liquid tank with a simple structure.

An orifice may also be provided in the above atmospheric communication piping. In this case, since the orifice is provided in the atmospheric communication pipe, it is difficult for the gas to pass through the interior of the atmospheric communication pipe. Therefore, even if the atmosphere communication piping is opened, the inside of the treatment liquid tank will not be decompressed at one go, but the pressure inside will gradually decrease to some extent. Therefore, it is possible to realize a structure capable of gradually opening the inside of the processing liquid tank with a simple structure.

The treatment liquid device may further include an atmosphere communication pipe that connects the inside of the treatment liquid tank to the atmosphere, and the pressure adjustment unit includes an opening degree adjustment unit that adjusts the opening degree of the atmosphere communication pipe.

According to this configuration, by adjusting the opening degree of the atmospheric communication pipe, the ease of passage of the gas inside the atmospheric communication pipe can be adjusted. Therefore, when the atmosphere inside the processing liquid tank is opened, by setting the opening degree of the atmosphere communication piping to be low, the time from when the atmosphere inside the processing liquid tank is opened to when the pressure in the interior is reduced to atmospheric pressure lengthen. Therefore, it is possible to realize a structure capable of gradually opening the inside of the processing liquid tank with a simple structure.

The processing liquid tank may be provided with a plurality of the first processing liquid piping including an individual pipe connected to each processing liquid tank, and a common pipe connecting each of the plurality of individual pipes with the processing unit, and the opening and closing The unit includes an individual on-off valve that opens and closes each individual piping, and a common on-off valve that opens and closes the above-mentioned common piping.

According to this configuration, when the supply of the processing liquid from the processing liquid supply device toward the processing unit is stopped, the control device gradually opens the inside of the processing liquid tank in the pressurized state before the common on-off valve and the individual on-off valve are closed. The opening and closing unit is closed after the opening of the atmosphere. In this way, even when a plurality of processing liquid tanks are provided, the amount of bubbles generated by the processing liquid can be reduced.

The processing liquid stored in the processing liquid tank may contain an organic solvent.

In the case of using organic solvents as the processing liquid, most of the organic solvents are flammable liquids, and the organic solvent cannot be conveyed by pumping and pumping. Instead, use the aforementioned pressurized unit to carry out the organic solvent to the processing unit. Conveying (pressure and pressure feeding method). In this case, the amount of bubbles contained in the organic solvent supplied by the processing liquid supply device can be reduced.

In addition, the present invention provides a substrate processing system including a substrate A processing unit for processing using a processing liquid, and the processing liquid supply device, the processing unit includes: a discharge section for discharging a processing liquid to be supplied to the substrate; a second processing liquid pipe connected to the first processing A liquid piping and the discharge part; and a processing liquid valve for opening and closing the second processing liquid pipe; the control device closes the processing liquid valve in order to stop the supply of processing liquid from the processing liquid pipe to the discharge part, and The pressure adjusting unit is controlled to decompress the inside of the processing liquid tank.

According to this configuration, when the discharge of the processing liquid from the discharge portion is stopped, the control device first closes the processing liquid valve to stop the supply of the processing liquid from the processing liquid piping to the discharge portion, and then gradually opens the inside of the processing liquid tank to the atmosphere, and After the opening of the atmosphere, the opening and closing unit is closed.

Since the opening and closing unit is closed after the decompression inside the processing liquid tank is started, after closing the opening and closing unit, the inside of the processing liquid tank and the inside of the first processing liquid pipe are maintained in a more decompressed state than the pressurized state. Since the solubility of the gas in the liquid is proportional to its pressure, no large amount of gas will dissolve inside the processing liquid piping in this reduced pressure state. Therefore, it is possible to reduce the amount of dissolved gas in the processing liquid dissolved into the processing liquid tank and the first processing liquid piping. Since the amount of dissolved gas in the treatment liquid is small, the amount of bubbles generated in the treatment liquid can be reduced.

In addition, since the atmosphere inside the processing liquid tank is gradually opened, it is possible to suppress or prevent the gas dissolved in the processing liquid from appearing as bubbles during the depressurization process.

By this, the amount of bubbles contained in the processing liquid supplied to the processing unit can be reduced. Thereby, a substrate processing system capable of suppressing or preventing the generation of particles on the substrate can be provided.

In one embodiment of the present invention, the processing liquid valve may be disposed above the opening and closing unit. In this case, when the opening / closing unit is arranged at the lower processing liquid valve In the lower case, in order for the processing liquid stored in the processing liquid tank to reach the processing unit, it is necessary to use a higher pressure to pressurize the processing liquid inside the processing liquid tank. In this case, the pressure inside the processing liquid tank and the first processing liquid piping becomes higher at the time of supply, and as a result, there is a possibility that the above-mentioned problem of generating bubbles is further conspicuous.

However, since the inside of the processing liquid tank is gradually opened to the atmosphere, and the opening and closing unit is closed after the opening of the atmosphere, the amount of bubbles included in the processing liquid supplied to the processing unit can be further reduced, thereby further suppressing Or prevent the generation of particles on the substrate.

The processing liquid supply device may be disposed below the processing unit.

According to this configuration, since the processing liquid supply device is provided in the lower layer, the length of the first processing liquid piping becomes longer. Therefore, there is a high-pressure part locally inside the first processing liquid piping, and there is a possibility that the aforementioned problem of generating bubbles may be further conspicuous.

However, since the inside of the processing liquid tank is gradually opened to the atmosphere, and the opening and closing unit is closed after the opening of the atmosphere, the amount of bubbles included in the processing liquid supplied to the processing unit can be further reduced, thereby further suppressing Or prevent the generation of particles on the substrate.

In addition, the present invention provides a processing liquid supply method implemented by a processing liquid supply device, the processing liquid supply device including: a processing liquid tank that stores a processing liquid; and a first processing liquid pipe connected to a substrate A processing unit for processing using a processing liquid and the processing liquid tank; an opening and closing unit for opening and closing the first processing liquid piping; and a pressurizing unit for pressurizing the processing liquid inside the processing liquid tank with a gas, By this, the processing liquid is moved to the above-mentioned first processing liquid piping; wherein, in order to stop the processing liquid From the supply of the processing liquid supply device to the processing unit, the inside of the processing liquid tank in a pressurized state is gradually opened to the atmosphere, and the opening and closing unit is closed after the opening of the atmosphere is started.

According to this method, when the supply of the processing liquid from the processing liquid supply device to the processing unit is stopped, the control device gradually opens the atmosphere of the processing liquid tank pressurized by the pressurization unit before the opening and closing unit is closed, and Close the opening and closing unit after the opening of the atmosphere. Since the opening / closing unit is closed after the decompression inside the processing liquid tank is started, after closing the opening / closing unit, the inside of the processing liquid tank and the inside of the first processing liquid piping are maintained at a more decompressed state than the aforementioned pressurized state . Since the solubility of the gas in the liquid is proportional to its pressure, no large amount of gas will dissolve inside the processing liquid piping in this reduced pressure state. Therefore, it is possible to reduce the amount of dissolved gas in the processing liquid dissolved into the processing liquid tank and the first processing liquid piping. Since the amount of dissolved gas in the treatment liquid is small, the amount of bubbles generated in the treatment liquid can be reduced.

In addition, since the atmosphere inside the processing liquid tank is gradually opened, it is possible to suppress or prevent the gas dissolved in the processing liquid from appearing as bubbles during the depressurization process.

Thereby, a processing liquid supply method capable of reducing the amount of bubbles contained in the supplied processing liquid can be provided.

The aforementioned object or other objects, features, and effects of the present invention will be made clear by referring to the accompanying drawings and describing the following embodiments.

1‧‧‧Substrate processing system

2‧‧‧Processing unit

3‧‧‧Organic solvent supply device

4‧‧‧Substrate processing device

5‧‧‧The first control device

6‧‧‧The second control device

7‧‧‧Process chamber

8‧‧‧Organic solvent nozzle

9‧‧‧Organic solvent tank

10‧‧‧Individual piping of organic solvent

11‧‧‧Common piping for organic solvents

12‧‧‧Flowmeter

13‧‧‧Common on-off valve

14‧‧‧Individual opening and closing valve

15‧‧‧Pressure unit

16‧‧‧pressure gauge

17‧‧‧Atmospheric connection piping

18‧‧‧Atmospheric opening and closing valve

19‧‧‧Fixed orifice

20‧‧‧Pressure gas piping

21‧‧‧Pressure valve

22‧‧‧Process side piping

23‧‧‧ Common piping on the processing side

24‧‧‧Process side branch piping

25‧‧‧Organic solvent valve

26‧‧‧Rotating chuck

27‧‧‧Medicinal liquid nozzle

28‧‧‧Flushing fluid nozzle

29‧‧‧rotating base

30‧‧‧Rotary drive unit

31‧‧‧Medicine valve

32‧‧‧Pharmaceutical piping

33‧‧‧Flush valve

34‧‧‧Flushing fluid piping

41‧‧‧Liquid film

42‧‧‧foreign

43‧‧‧Bubble

103‧‧‧ Organic solvent supply device

106‧‧‧The third control device

218‧‧‧ opening adjustment unit

D‧‧‧delay

W‧‧‧Substrate

FIG. 1 is a schematic diagram showing the structure of a substrate processing system according to an embodiment of the present invention.

Fig. 2 is a horizontal view of the processing unit of the substrate processing system Schematic diagram of the Ministry.

FIG. 3 is a flowchart showing the discharge stop control executed in the above substrate processing apparatus.

4 is a flowchart showing the discharge stop control executed in the organic solvent supply device.

Fig. 5 is a diagram showing the opening and closing states of the organic solvent valve, common on-off valve, individual on-off valve, and atmospheric on-off valve in the substrate processing system, and the timing of the measured value of the pressure gauge.

FIG. 6 is a graph showing the decompression status from the opening of the atmosphere inside the organic solvent tank to the opening of the atmosphere.

FIG. 7 is a diagram showing the state of minute foreign substances contained in a liquid film of an organic solvent on a substrate surface.

FIG. 8 is a schematic diagram showing the configuration of another form of substrate processing system.

9 is a diagram showing a modification of the present invention.

FIG. 1 is a schematic diagram of a substrate processing system 1 according to an embodiment of the present invention viewed from a horizontal direction. The substrate processing system 1 is a monolithic system that processes a semiconductor wafer as an example of the substrate W one piece at a time. The substrate processing system 1 includes: a processing unit 2 that processes the substrate W; and an organic solvent supply device 3 that is a processing liquid supply device that supplies an organic solvent as an example of a processing liquid to the processing unit 2. The processing unit 2 and the organic solvent supply device 3 are independent units (units that can be moved independently of each other). That is, as shown in FIG. 1, the substrate processing system 1 is exemplified as including: a substrate processing device 4 including a processing unit 2; and an organic solvent supply device 3 arranged at a position away from the substrate processing device 4. The substrate processing device 4 is installed in a clean room, and another On the one hand, the organic solvent supply device 3 is provided in a space below the clean room (for example, underground) called a sub-fab. The substrate processing system 1 further includes: a first control device 5 that controls the opening and closing of devices or valves provided in the substrate processing device 4; and a second control device 6 that controls the devices or devices provided in the organic solvent supply device 3 or Control the opening and closing of the valve.

Furthermore, the processing unit 2 may be a single-chip unit that processes the substrate W one at a time, or a batch-type unit that processes a plurality of substrates W at a time. FIG. 1 shows an example in which the processing unit 2 is a monolithic unit. In addition, in FIG. 1, although only one organic solvent supply device 3 is shown, when a plurality of organic solvents are provided, an organic solvent supply device 3 corresponding to the number of liquid types may be provided.

The processing unit 2 includes a box-shaped processing chamber 7 having an internal space, and an organic solvent nozzle (discharge section) 8 for supplying organic solvent to the substrate W held in a horizontal posture in the processing chamber 7 (See Figure 2). In this embodiment, a plurality of processing units 2 are provided. The plurality of processing units are arranged in a three-layer structure as shown in FIG. 1, for example. Although not shown in FIG. 1, for example, four processing units are arranged in each layer portion. In this embodiment, the processing unit 2 is an example in which the organic solvent supply device 3 supplies a total of twelve processing units 2 and supplies the chemical solution to all of the processing units 2, but it may also be an organic solvent supply. The device 3 corresponds to each of a part of the processing units 2 (for example, each of the three processing units 2 stacked in the longitudinal direction) and supplies the chemical solution to the part of the processing units 2.

The organic solvent supply device 3 includes: a plurality of (for example, two in FIG. 1) organic solvent tanks (processing liquid tanks) 9 that store organic solvents; organic solvent individual piping (individual piping) 10, which is connected to each Organic solvent tank 9; and organic solvent common piping (common piping) 11, which connects a plurality of (for example, 2 in FIG. 1) each of the individual pipes of the organic solvent 10 And the processing unit 2 side. The organic solvent stored in the organic solvent tank 9 is, for example, IPA (isopropyl alcohol; Isopropyl Alcohol). An individual on-off valve (opening and closing unit) 14 for opening and closing the organic solvent individual piping 10 is interposed in each organic solvent individual piping 10. In the organic solvent common piping 11, a flow meter 12 for measuring the flow rate of the organic solvent flowing through the organic solvent common piping 11 is sequentially provided from the organic solvent tank 9 side, and common opening and closing for opening and closing the organic solvent common piping 11 Valve (opening and closing unit) 13. Organic solvent individual piping 10 and organic solvent common piping 11 use resin-resistant resins such as PFA (tetrafluoroethylene-perfluoroalkoxy vinyl ether copolymer; perfluoro-alkylvinyl-ether-tetrafluoro-ethlene-copolymer) form. The first processing liquid piping is constituted by the organic solvent individual piping 10 and the organic solvent common piping 11.

The organic solvent supply device 3 is a liquid supply device of a pressure and pressure feeding method. Therefore, the organic solvent supply device 3 further includes: a pressurizing unit 15 that moves the organic solvent in the organic solvent tank 9 to the organic solvent common piping 11 via the individual organic solvent piping 10; and a pressure gauge 16, which measures the organic solvent The pressure inside the tank 9; a new liquid supply unit (not shown), which supplies the new liquid of the organic solvent from the organic solvent supply source to the organic solvent tank 9; and a liquid volume sensor (not shown), which is used to The amount of liquid (for example, liquid level) stored in the organic solvent tank 9 is detected. One pressurizing unit 15, a pressure gauge 16, a new liquid supply unit, and a liquid volume sensor are provided for each organic solvent tank 9. Since IPA is a flammable liquid, it is necessary to implement anti-explosion countermeasures when using the pumping method. In order to simplify the device, the organic solvent supply device 3 adopts a pressurized pressure feeding method.

In addition, the organic solvent supply device 3 further includes: an atmospheric communication pipe 17 that communicates the inside of the organic solvent tank 9 with the atmosphere; and an atmospheric opening and closing valve (pressure adjustment unit) 18 that opens and closes each atmospheric communication pipe 17. The atmospheric communication piping 17 and the atmospheric opening and closing valve 18 are provided in each organic solvent tank 9. Connect the piping 17 to the atmosphere, open and close in the atmosphere A fixed orifice (orifice) 19 is provided on the downstream side (atmosphere side) of the valve 18.

Each pressurizing unit 15 includes a pressurized gas piping 20 through which high-pressure gas for pressurization (for example, an inert gas such as nitrogen) flows, and a pressurizing valve 21 that opens and closes the pressurized gas piping 20. By opening the pressurizing valve 21, the high-pressure gas from the pressurized gas piping 20 is supplied to the organic solvent tank 9. In this supply state, the pressure inside the organic solvent tank 9 and the pressure inside the pipes 10 and 11 corresponding to the organic solvent tank 9 are maintained at a high pressure (in this embodiment, for example, about 2 atm).

Each organic solvent tank 9 is partitioned into a container shape by a partition wall. The partition wall of the organic solvent tank 9 is formed of, for example, stainless steel, and its entire inner surface is coated with PTFE (polytetra-fluoroethylene). The capacity of each organic solvent tank 9 is several liters to several tens of liters.

The organic solvent is supplied from one organic solvent tank 9 selected from the plurality of organic solvent tanks 9 to the processing unit 2 side. Moreover, if the organic solvent stored in one of the organic solvent tanks 9 in use is used up, the supply source of the organic solvent is switched to another organic solvent tank 9, and the organic solvent stored in the other organic solvent tank 9 is It is supplied to the processing unit 2 side.

At this time, the new liquid of the organic solvent can be supplied from the new liquid supply unit (not shown) to the emptied organic solvent tank 9 (one organic solvent tank 9). Furthermore, since the inside of the pressurized organic solvent tank 9 is in a high-pressure state, before the supply of the organic solvent, the atmospheric on-off valve 18 corresponding to an organic solvent tank 9 is opened, and the organic solvent tank 9 The inside of the inside is depressurized from the high-pressure state to the atmospheric pressure, whereby new liquid of the organic solvent can be supplied toward the organic solvent tank 9.

The supply source of the organic solvent is switched by opening and closing the individual on-off valve 14 interposed in the individual piping 10 of each organic solvent. That is, individual opening and closing The valve 14 functions as a switching valve for switching the organic solvent tank 9 of the supply source.

The second control device 6 is configured using a microcomputer, for example. The second control device 6 includes an arithmetic unit such as a CPU (Central Processing Unit), a storage unit such as a fixed memory device, a hard disk drive, and an input / output unit. The storage unit memorizes a program for the operation unit to execute.

The second control device 6 opens and closes the common on-off valve 13, the individual on-off valve 14, the atmospheric on-off valve 18, the pressurizing valve 21, etc. according to a program previously set in the storage unit. In addition, the detection outputs of the flowmeter 12 and the pressure gauge 16 are input to the second control device 6.

When the organic solvent stored in an organic solvent tank 9 is supplied to the processing unit 2 side, the second control device 6 opens the organic solvent tank while closing the individual on-off valve 14 corresponding to the other organic solvent tank 9 9 corresponds to the individual on-off valve 14, and the common on-off valve 13 is opened. Furthermore, the second control device 6 opens the pressurizing valve 21 corresponding to an organic solvent tank 9. By this, the high-pressure gas is supplied to an organic solvent tank 9, and by this supply pressure (nitrogen pressure), the organic solvent stored in an organic solvent tank 9 is sent out to the corresponding organic solvent individual piping 10, The organic solvent individual piping 10 moves to the organic solvent common piping 11. With this, the organic solvent is supplied from the organic solvent supply device 3 toward the processing unit 2. In the supply state of the organic solvent, the pressure inside the organic solvent tank 9 and the pressure inside the pipes 10 and 11 corresponding to the organic solvent tank 9 are maintained at a high pressure (for example, about 2 atmospheres).

In addition, when the organic solvent stored in the other organic solvent tank 9 is supplied to the processing unit 2 side, the second control device 6 opens and closes the other with the individual on-off valve 14 corresponding to the one organic solvent tank 9 closed. The individual on-off valve 14 corresponding to the organic solvent tank 9 opens the common on-off valve 13. Also, the second control device 6 opens the tank 9 with another organic solvent Corresponding to the pressure valve 21. By this, the high-pressure gas is supplied to the other organic solvent tank 9, and by this supply pressure (nitrogen pressure), the organic solvent stored in the other organic solvent tank 9 is pressed out of the corresponding organic solvent individual piping 10, moved to the organic solvent common piping 11 via the organic solvent individual piping 10. With this, the organic solvent is supplied from the organic solvent supply device 3 toward the processing unit 2 side. In the supply state of the organic solvent, the pressure inside the other organic solvent tank 9 and the pressure inside the pipes 10 and 11 corresponding to the other organic solvent tank 9 are maintained at a high pressure (for example, about 2 atm).

In addition, in the following description, the organic solvent tank 9 which supplies the organic solvent to the processing unit 2 side is called "the current organic solvent tank 9".

The organic solvent from the organic solvent supply device 3 is supplied to the organic solvent nozzle 8 included in each processing unit 2 through the processing-side piping (second processing liquid piping) 22 passing through the inside of the substrate processing device 4. The processing-side piping 22 includes a processing-side common piping 23 that is connected to the organic solvent common piping 11 and a processing-side branch piping 24 that connects each organic solvent nozzle 8 to the processing-side common piping 23. An organic solvent valve 25 for opening and closing the processing-side branch piping 24 is interposed in the processing-side branch piping 24. In a state where the organic solvent is supplied from the organic solvent supply device 3 toward the processing unit 2 side, the organic solvent valve 25 is opened by the second control device 6 so that the organic solvent is supplied to the organic solvent nozzle 8 included in each processing unit 2 . In addition, the common piping 23 on the processing side and the branch piping 24 on the processing side use PFA (tetrafluoroethylene-perfluoroalkoxy vinyl ether copolymer; perfluoro-alkylvinyl-ether-tetrafluoro-ethlene-copolymer), etc. Resin.

FIG. 2 is a schematic view of the inside of the processing unit 2 viewed horizontally.

The processing unit 2 further includes a rotating chuck 26 that holds a piece of substrate W in a horizontal posture in the processing chamber 7 and causes the substrate W to pass through the lead passing through the center of the substrate W The vertical rotation axis rotates; the chemical liquid nozzle 27, which supplies the chemical liquid to the substrate W held by the rotary chuck 26; and the rinse liquid nozzle 28, which supplies the substrate W held by the rotary chuck 26 Flushing fluid.

The rotary chuck 26 includes: a disk-shaped rotating base 29 that holds the substrate W substantially horizontally and can rotate about a vertical axis; and a rotary drive unit 30 such as a motor that makes the rotating base 29 rotate vertically Axis rotation. The chemical liquid nozzle 27 and the rinsing liquid nozzle 28 may be fixed nozzles where the positions of the chemical liquid and the rinsing liquid on the substrate W are fixed, or may be the positions of the chemical liquid and the rinsing liquid on the rotation center of the substrate W The scanning nozzle moves within the range of the periphery of the substrate W.

The chemical liquid nozzle 27 is connected to the chemical liquid pipe 32 in which the chemical liquid valve 31 is interposed. The chemical liquid is supplied to the chemical liquid nozzle 27. The chemical liquid supplied to the chemical liquid nozzle 27 includes, for example, sulfuric acid, acetic acid, nitric acid, hydrochloric acid, hydrofluoric acid, ammonia water, hydrogen peroxide water, organic acids (such as citric acid, oxalic acid, etc.), organic bases (such as TMAH: 4 Methyl ammonium hydroxide, etc.), and at least one of an interface activator and an anti-corrosion agent.

The rinsing liquid nozzle 28 is connected to a rinsing liquid pipe 34 in which a rinsing liquid valve 33 is interposed. Pure water (deionized water) as an example of the rinse liquid is supplied to the rinse liquid nozzle 28. The rinsing liquid supplied to the rinsing liquid nozzle 28 is not limited to pure water, but may be any of carbonated water, electrolytic ionized water, hydrogen water, ozone water, and hydrochloric acid water with a diluted concentration (for example, about 10 to 100 ppm) .

The first control device 5 is configured using a computer, for example. The first control device 5 includes an arithmetic unit such as a CPU, a storage unit such as a fixed memory device, a hard disk drive, and an input / output unit. The storage unit memorizes a program for the operation unit to execute. The first control device 5 controls the operation of the rotary drive unit 30 and the like according to a program previously set in the storage unit. In addition, the first control device 5 controls the organic solvent valve 25 and the chemical liquid valve. 31. The opening and closing operations of the flushing fluid valve 33, etc. are controlled. In addition, the first control device 5 (substrate processing device 4) is provided so as to be able to communicate with the second control device 6 (organic solvent supply device 3).

As shown in FIGS. 1 and 2, before the processing of the processing unit 2 included in the substrate processing device 4 starts, the first control device 5 transmits a supply request signal to the organic solvent supply device 3. If the organic solvent supply device 3 receives the supply request signal, the second control device 6 opens the individual on-off valve 14 corresponding to the current organic solvent tank 9 and the common on-off valve 13 and opens the corresponding organic solvent tank 9之 Pressure valve 21. As a result, the organic solvent can be supplied from the organic solvent supply device 3 to the processing unit 2 through the organic solvent common piping 11. In a state where the organic solvent is supplied by the organic solvent supply device 3, the current pressure inside the organic solvent tank 9 and the pressure inside the pipes 10 and 11 corresponding to the organic solvent tank 9 are maintained at a high pressure (for example, about 2 atmosphere ).

As shown in FIG. 2, when the processing unit 2 performs processing using the processing liquid (chemical liquid, rinse liquid, and organic solvent) on the substrate W, the first control device 5 horizontally holds the substrate W by rotating the chuck 26, While rotating the substrate W around the vertical axis. In this state, the first control device 5 opens the chemical liquid valve 31 and causes the chemical liquid to be discharged from the chemical liquid nozzle 27 toward the upper surface of the substrate W. The chemical liquid supplied to the substrate W diffuses outward on the substrate W by the centrifugal force generated by the rotation of the substrate W, and is discharged from the periphery of the upper surface of the substrate W toward the periphery of the substrate W. After stopping the discharge of the chemical solution from the chemical solution nozzle 27, the first control device 5 opens the rinse solution valve 33 to discharge the rinse solution from the rinse solution nozzle 28 toward the upper surface of the rotating substrate W. Thereby, the chemical liquid on the substrate W is washed away by the rinse liquid. After stopping the discharge of the rinse liquid from the rinse liquid nozzle 28, the first control device 5 opens the organic solvent valve 25 to discharge the organic solvent from the organic solvent nozzle 8 toward the upper surface of the rotating substrate W. By this, the substrate W The rinsing liquid is replaced with an organic solvent. Then, the first control device 5 rotates the substrate W at a high speed by using the rotary chuck 26 to dry the substrate W. In this way, a series of processing is performed on one of the substrates W.

FIG. 3 is a flowchart showing the discharge stop control executed by the substrate processing apparatus 4. FIG. 4 is a flowchart showing the discharge stop control executed by the organic solvent supply device 3. FIG. 5 is a timing chart showing the opening and closing states of the organic solvent valve 25, the common opening and closing valve 13, the individual opening and closing valve 14, and the atmospheric opening and closing valve 18 in the substrate processing system 1, and the measured values of the pressure gauge 16. FIG. 6 is a diagram showing the decompression status from the opening of the atmosphere in the organic solvent tank 9 to the opening of the atmosphere.

In the processing unit 2, when it is time to discharge the organic solvent from the organic solvent nozzle 8, the first control device 5 opens the organic solvent valve 25. With this, the organic solvent is discharged from the organic solvent nozzle 8.

Then, when it is time to stop the discharge (YES in step S1 in FIG. 3), the first control device 5 closes the organic solvent valve 25 (step S2 in FIG. 3). Then, when the first control device 5 determines that the substrate processing device 4 is in a state in which the organic solvent does not need to be supplied (YES in step S3 of FIG. 3), the first control device 5 transmits the organic solvent supply device 3 without The signal is supplied (step S4 in FIG. 3). In addition, when it is not the case where the stop timing is not ejected (No in step S1 of FIG. 3), when it is judged that it is not in a state in which the organic solvent does not need to be supplied (in step S3 of FIG. 3), and after the supply unnecessary signal is transmitted , The process shown in Figure 3 returns.

The so-called state where no organic solvent needs to be supplied refers to a state where the substrate processing apparatus 4 no longer needs to supply more organic solvent. As an example of the state in which the organic solvent does not need to be supplied, the state where the discharge of the organic solvent in one processing unit 2 ends and the discharge of the organic solvent in the other processing unit 2 has been completed. Also, in addition to another processing unit 2 In addition to the end of the discharge of the organic solvent, the processing unit 2 included in the substrate processing apparatus 4 may not be scheduled to discharge the organic solvent for a short period of time thereafter, and the conditions for the establishment of the state where the organic solvent does not need to be supplied may be increased in.

When receiving the no-supply signal from the substrate processing apparatus 4 (YES in step T1 of FIG. 4), the second control device 6 opens the atmospheric on-off valve 18 corresponding to the current organic solvent tank 9 (step T2 of FIG. 4) ).

By opening the atmospheric opening and closing valve 18, the inside of the organic solvent tank 9 is depressurized. However, since the fixed orifice 19 is provided in the atmospheric communication pipe 17, it is difficult for gas to pass through the interior of the atmospheric communication pipe 17. Therefore, even if the atmosphere communication pipe 17 is opened, the inside of the organic solvent tank 9 will not be decompressed at once, and the pressure inside will gradually decrease to some extent. That is, it takes some time from the opening of the atmosphere inside the organic solvent tank 9 until the internal pressure drops to atmospheric pressure. By combining the atmospheric opening / closing valve 18 and the fixed orifice 19, it is possible to realize a structure capable of gradually opening the inside of the organic solvent tank 9 in a pressurized state to the atmosphere.

Furthermore, as shown in FIG. 5, there is a predetermined delay D between the closing of the organic solvent valve 25 and the opening of the atmospheric on-off valve 18.

Next, the second control device 6 refers to the detection output of the pressure gauge 16 corresponding to the current organic solvent tank 9 to investigate whether the inside of the current organic solvent tank 9 is depressurized to atmospheric pressure (step T3 in FIG. 4). Then, if the pressure inside the current organic solvent tank 9 drops to atmospheric pressure (YES at step T3 in FIG. 4), the second control device 6 closes the common on-off valve 13 and the individual on-off valve 14 (step T4 in FIG. 4). Therefore, after the valves 13 and 14 are closed, the inside of the organic solvent tank 9, the inside of the organic solvent individual piping 10, and the inside of the organic solvent common piping 11 are maintained at atmospheric pressure. Because the solubility of gas to liquid is proportional to its pressure, the liquid at atmospheric pressure will not dissolve a large amount of gas. therefore, The dissolved gas amount of the organic solvent dissolved in the inside of the organic solvent tank 9, the inside of the organic solvent individual piping 10, and the inside of the organic solvent common piping 11 can be reduced.

When the pressure inside the organic solvent tank 9 is higher than atmospheric pressure (No in step T3 in FIG. 4), then, the second control device 6 starts from the opening of the atmospheric opening and closing valve 18 (that is, the atmospheric opening) Whether a predetermined time (X seconds (for example, about 5 seconds)) has passed (step T5 in FIG. 4). Then, if X seconds have elapsed since the opening of the atmospheric on-off valve 18 (YES at step T5 in FIG. 4), the second control device 6 refers to the detection output of the pressure gauge 16 corresponding to the current organic solvent tank 9 (FIG. 4 Step T6). At this time, when the measured value (measured pressure) after X seconds has elapsed since the opening of the atmosphere does not reach the threshold (set to a predetermined threshold at a higher atmospheric pressure and a higher pressure), the second control device 6 determines that Error status.

The second control device 6 includes a memory (not shown). The threshold value of the pressure value is stored in the memory system. As shown in Fig. 6, the threshold value is the lower limit pressure value X seconds after the opening of the atmosphere. When the measured value does not reach the threshold value, if the decompression speed inside the organic solvent tank 9 is too fast, it is taken as Rapid decompression to determine an error state. The dotted line shown in Figure 6 is an error state. The two-dot chain line shown in Fig. 6 is not in an error state (OK state). If the decompression speed inside the organic solvent tank 9 is too fast, the gas dissolved in the organic solvent may appear as bubbles (microbubbles) during the decompression process. Therefore, the second control device 6 detects that the decompression speed inside the organic solvent tank 9 is faster than the predetermined speed as an error state.

If the second control device 6 determines that it is in an error state, it performs a predetermined error process (step T7 in FIG. 4). Examples of error processing include a case where the occurrence of an error state is stored in a log file, or an alarm is issued from the substrate processing apparatus 4 or the organic solvent supply apparatus 3.

In addition, in the case where no supply signal is not received (step T1 in FIG. 4 is No), when X seconds have not passed since the opening of the atmospheric on-off valve 18 (No in step T5 of FIG. 4), when the measured value is above the threshold (Yes in step T5 of FIG. 4), valves 13, 14 After the closing and the end of the error processing, the processing shown in FIG. 4 returns.

FIG. 7 is a diagram showing a state where minute foreign substances 42 contained in the liquid film 41 of the organic solvent are on the surface of the substrate W. FIG. By supplying the organic solvent to the surface of the substrate W, a liquid film 41 of the organic solvent is formed on the surface of the substrate W.

The organic solvent discharged from the organic solvent nozzle 8 may contain bubbles 43. If the liquid film 41 of the organic solvent contains bubbles 43, a gas-liquid interface is formed by the liquid of the organic solvent and the bubbles 43. The tiny foreign substances 42 contained in the organic solvent are attracted and gathered to the gas-liquid interface, and grow into tiny particles of a predetermined size. As a result, there is a possibility that fine particles may be generated on the surface of the substrate W after drying. In addition, if the amount of bubbles contained in the liquid film 41 of the organic solvent is large, there is a possibility that the gas-liquid interface becomes larger in size and the problem of the generation of fine particles becomes significant.

As described above with reference to FIG. 1, the installation location of the organic solvent supply device 3 is the lower layer (lower layer installation) of the substrate processing device 4. In other words, the valves 13 and 14 are arranged below the organic solvent valve 25. In this case, in order for the organic solvent stored in the organic solvent tank 9 to reach the processing unit 2, the organic solvent in the organic solvent tank 9 needs to be pumped at a higher pressure. In this case, the pressure inside the tanks 9, 10, and 11 becomes higher, and as a result, there is a possibility that the problem of the generation of air bubbles becomes more significant.

In addition, since the organic solvent supply device 3 is provided in the lower layer, the piping length of the organic solvent common piping 11 is long (for example, 5 to 10 m). Therefore, there is a high-pressure part locally inside the organic solvent common piping 11, and by this, there is a possibility that the aforementioned problem of the generation of bubbles may be further conspicuous.

Here, in order to facilitate the understanding of the features and functions of this embodiment, For reference examples, other forms of substrate processing systems are discussed.

FIG. 8 is a schematic diagram showing the structure of a substrate processing system of another form.

In other forms, the parts corresponding to the parts shown in one embodiment of the present invention are shown with the same reference signs as in the case of FIGS. 1 to 6 and their description is omitted.

A substrate processing system of another form includes: an organic solvent supply device 103; and a third control device 106, which controls the organic solvent supply device 103. The third control device 106 is constituted by a computer. The difference between the organic solvent supply device 103 and the aforementioned organic solvent supply device 3 is that the atmospheric communication piping 17 (see FIG. 1), the atmospheric on-off valve 18 (see FIG. 1) and the pressure gauge 16 (see FIG. 1) are abolished . The other configuration is the same as the aforementioned organic solvent supply device 3.

In such an organic solvent supply device 103, if a signal of unnecessary supply from the substrate processing device 4 is received (if the organic solvent valve 25 is closed), the third control device 106 then closes the common on-off valve 13 and the individual on-off valve 14 . In the organic solvent supply device 3 in the state where the organic solvent is supplied as described above, the current organic solvent tank 9 and the pipes 10 and 11 corresponding to the organic solvent tank 9 (hereinafter, sometimes referred to as "tank etc. 9, 10 , 11 ") The internal pressure is maintained at high pressure (for example, about 2 atmospheres). Since the pressure inside the tanks 9, 10, and 11 is not released, the common on-off valve 13 and the individual on-off valves 14 are closed. Therefore, after the valves 13 and 14 are closed, the pressure inside the tanks 9, 10, and 11 will be maintained The state of high pressure.

Since the high-pressure pressurized gas is continuously used for pressure delivery, a large amount of gas (inert gas such as nitrogen) will be dissolved into the organic solvent inside 9, 10, and 11 of the tank. In addition, there are also ambient gases (such as oxygen) outside the pipes 10 and 11 that can penetrate the walls of the pipes 10 and 11 made of PFA and dissolve into the pipes 10 and 11 in a liquid-tight state. Possibility in organic solvents. By "the solubility of gas in liquid is proportional to its pressure" Henry's law (Henry's law), inside the pipes 10 and 11 in a high-pressure state, there is also a possibility that a large amount of ambient gas (such as oxygen) dissolves into the organic solvent. As a result, there is a possibility that the amount of bubbles included in the organic solvent discharged to the substrate W increases.

Also, after the valves 13 and 14 are closed, the pressure inside the tanks 9, 10, and 11 is still maintained at a high pressure. Therefore, when the organic solvent is discharged again in the processing unit 2, if the organic solvent valve 25 is When the organic solvent is discharged from the organic solvent nozzle 8 and opened, the organic solvent that has been maintained at a high pressure (especially the organic solvent in the organic solvent common piping 11) will be rapidly depressurized, and the gas dissolved in it becomes bubbles, And lead to the possibility of a lot of foaming.

In contrast, according to this embodiment, when the supply of the processing liquid from the organic solvent supply device 3 to the processing unit 2 is stopped, the third control device 106 facilitates the opening of the atmosphere communication piping before the common on-off valve 13 and the individual on-off valve 14 are closed. 17. The inside of the organic solvent tank 9 in a pressurized state is gradually opened to the atmosphere, and after the pressure inside the organic solvent tank 9 drops to atmospheric pressure, the common on-off valve 13 and the individual on-off valve 14 are closed. Therefore, after the valves 13 and 14 are closed, the inside of the organic solvent tank 9, the inside of the organic solvent individual piping 10, and the inside of the organic solvent common piping 11 are maintained at atmospheric pressure.

The amount of gas dissolved in the liquid at atmospheric pressure is small. Therefore, it is possible to reduce the dissolved gas amount of the organic solvent dissolved in the inside of the organic solvent tank 9, the inside of the organic solvent individual piping 10, and the inside of the organic solvent common piping 11. Because the amount of dissolved gas dissolved in the organic solvent is small, the amount of bubbles generated in the organic solvent can be reduced.

In addition, when the processing unit 2 re-discharges the organic solvent, the inside of the organic solvent individual piping 10 and the inside of the organic solvent common piping 11 are maintained in a pressurized state, and the organic solvent valve 25 is opened in this state. At the time of this re-ejection, with the opening of the organic solvent valve 25, although pressure reduction occurs inside the pipes 10 and 11, the dissolution into the pipe 10. The amount of dissolved gas in the organic solvent inside 10 and 11 is small, so the amount of bubbles generated in the organic solvent accompanying decompression can be reduced.

In addition, since the atmosphere inside the organic solvent tank 9 is gradually opened, it is possible to suppress or prevent the gas dissolved in the organic solvent from becoming bubbles during the decompression process.

With this, the amount of bubbles contained in the organic solvent supplied from the organic solvent supply device 3 to the processing unit 2 can be reduced.

Although one embodiment of the present invention has been described above, the present invention can be implemented in other forms.

For example, in the aforementioned embodiment, although the pressure inside the organic solvent tank 9 is judged to fall to atmospheric pressure based on the measured value of the pressure gauge 16, the pressure drop inside the organic solvent tank 9 can also be detected by the measured value of the pressure gauge 16 To a predetermined pressure, and it is determined that the pressure inside the organic solvent tank 9 has fallen to atmospheric pressure by a predetermined time after the detection.

In addition, although it has been described that the pressure inside the organic solvent tank 9 is reduced to atmospheric pressure, the common on-off valve 13 and the individual on-off valve 14 are closed, but as long as the atmospheric opening is started, it may be set to a time before falling to atmospheric pressure. The common on-off valve 13 and the individual on-off valve 14 are closed.

In addition, although it has been described that the fixed orifice 19 and the atmospheric opening and closing valve 18 are respectively interposed in the atmospheric communication pipe 17, the orifice may be provided in the atmospheric opening and closing valve 18 itself. That is, a valve with an orifice may be provided as the atmospheric on-off valve 18.

In addition, as shown in FIG. 9, instead of the fixed orifice 19, an opening adjustment unit 218 for adjusting the opening of the atmospheric communication piping 17 may be provided. The opening adjustment unit 218 may be either a flow adjustment valve as shown in FIG. 9 or a variable orifice (flow adjustment orifice).

Although not shown, the flow regulating valve includes: a valve body with a valve seat inside; a valve body that opens and closes the valve seat; and an actuator that places the valve body between an open position and a closed position mobile. As the actuator, an electric motor, a cylinder, or the like can be used. In addition, as the flow rate adjustment valve, various forms such as a needle valve, a diaphragm valve, and a butterfly valve can be used.

In addition, the opening degree adjustment unit 218 can also be used in combination with the atmospheric opening and closing valve 18. When the opening degree adjustment unit 218 has an opening and closing function, the atmospheric opening and closing valve 18 can also be eliminated.

Furthermore, the fixed orifice 19 or the opening adjustment unit 218 may not be provided. In this case, the second control device 6 may also gradually open the inside of the organic solvent tank 9 by setting the opening speed of the atmospheric opening and closing valve 18 to a low speed.

In addition, the pressure adjustment unit for adjusting the pressure inside the organic solvent tank 9 does not need to be provided in the atmospheric communication pipe 17. For example, the pressure adjustment unit may be directly provided in the organic solvent tank 9.

In the foregoing embodiment, the organic solvent supply device 3 includes a plurality of organic solvent tanks 9 as an example. However, the organic solvent supply device 3 may include only one organic solvent tank 9. In this case, since there is no need to switch the organic solvent tank of the supply source, the individual piping 10 of the organic solvent and the individual on-off valve 14 can be eliminated.

In addition, the organic solvent supply device 3 may include not only a mechanism for supplying an organic solvent, but also a mechanism for supplying other chemical solutions. That is, it may be configured to be common to other chemical liquid supply devices.

Furthermore, in the foregoing embodiment, IPA has been described as an example of the organic solvent supplied from the organic solvent supply device 3, but in addition to IPA, Organic solvents such as methanol, ethanol, acetone, hydrofluoroether (HEF, Hydro Fluoro Ether) and ethylene glycol (EG, Ethylene Glycol) can be used.

In the foregoing description, although the processing unit 2 and the organic solvent supply device 3 have been described as separate units, the processing unit 2 and the organic solvent supply device 3 may be part of a common device. That is, the substrate processing system may also include a substrate processing device including the processing unit 2 and the organic solvent supply device 3. In this case, a control device in which the first and second control devices 5 and 6 are integrated may also be used.

In addition, although the organic solvent supply device 3 for supplying an organic solvent has been taken as an example to describe the processing liquid supply device, the processing liquid supply device is not limited to a person supplying an organic solvent, and may also be a person supplying a chemical solution, a rinse solution, or the like.

Furthermore, in the foregoing embodiment, although a semiconductor wafer has been proposed as the substrate W to be processed, it is not limited to the semiconductor wafer, and for example, a glass substrate for a liquid crystal display device, a substrate for a plasma display, and a FED may be used. Other types of substrates, such as substrates, optical disc substrates, magnetic disc substrates, optomagnetic disc substrates, photomask substrates, ceramic substrates, solar cell substrates, and other types of substrates are processed.

Although the embodiments of the present invention have been described in detail, these are only specific examples for clarifying the technical content of the present invention, and the present invention should not be limited to these specific examples for interpretation, and the scope of the present invention Only limited by the scope of the attached patent application.

This application corresponds to Japanese Patent Application No. 2015-189918 filed with the Japan Patent Office on September 28, 2015, and the entire disclosure of this application is incorporated herein by reference.

Claims (13)

A processing liquid supply device that supplies a processing liquid to a processing unit that performs processing using a processing liquid on a substrate, and includes: a processing liquid tank that stores a processing liquid; and a first processing liquid pipe that connects the processing unit and The processing liquid tank; the opening and closing unit for opening and closing the first processing liquid pipe; the pressurizing unit for sending the processing liquid inside the processing liquid tank to the first processing liquid pipe, using gas The processing liquid is pressurized; a pressure adjusting unit for adjusting the pressure inside the processing liquid tank; and a control device for opening and closing the processing liquid supply device from the processing liquid supply device toward the processing unit Before the unit is closed, the pressure adjusting unit is controlled so that the inside of the processing liquid tank in a pressurized state is gradually opened to the atmosphere at a decompression speed below a predetermined speed, and is closed after the opening of the atmosphere is started. Opening and closing unit, wherein the predetermined speed is such that the gas dissolved in the treatment liquid does not appear as bubbles set up. The processing liquid supply device according to claim 1, wherein the control device waits for the pressure inside the processing liquid tank to drop to atmospheric pressure, and then closes the opening and closing unit after the pressure drops to atmospheric pressure. A processing liquid supply device that supplies a processing liquid to a processing unit that performs processing using a processing liquid on a substrate, and includes: a processing liquid tank that stores a processing liquid; and a first processing liquid pipe that connects the processing unit and The processing liquid tank; the opening and closing unit for opening and closing the first processing liquid pipe; the pressurizing unit for sending the processing liquid inside the processing liquid tank to the first processing liquid pipe, using gas The processing liquid is pressurized; a pressure adjustment unit is used to adjust the pressure inside the processing liquid tank; a pressure gauge is used to measure the pressure inside the processing liquid tank; and a control device is used to stop the processing liquid from The processing liquid supply device is supplied toward the processing unit, and the pressure adjusting unit is controlled before the opening and closing unit is closed, so that the inside of the processing liquid tank in a pressurized state is gradually opened to the atmosphere, and closed after the opening of the atmosphere is started The above-mentioned opening and closing unit; the above-mentioned control device is the above-mentioned pressure at a point in time when a predetermined time has passed since the opening of the atmosphere When the detected value is above the predetermined threshold value of the case, after the drop in pressure inside the tank of the above-described process to atmospheric pressure, closing the opening and closing unit. The processing liquid supply device according to any one of claims 1 to 3, further comprising an atmospheric communication pipe that connects the inside of the processing liquid tank to the atmosphere, and the pressure adjustment unit includes an atmospheric opening and closing mechanism for opening and closing the atmospheric communication pipe valve. The processing liquid supply device according to claim 4, wherein the atmosphere communication piping is provided with an orifice. The processing liquid supply device according to any one of claims 1 to 3, further comprising an atmospheric communication pipe that connects the inside of the processing liquid tank to the atmosphere, and the pressure adjustment unit includes means for adjusting the opening of the atmospheric communication pipe Opening adjustment unit. The processing liquid supply device according to any one of claims 1 to 3, wherein the processing liquid tank is provided in plural, the first processing liquid piping includes an individual pipe connected to each processing liquid tank, and the plural Each of the individual pipes is a common pipe to the processing unit. The opening and closing unit includes an individual on-off valve that opens and closes each individual pipe, and a common on-off valve that opens and closes the common pipe. The processing liquid supply device according to any one of claims 1 to 3, wherein the processing liquid stored in the processing liquid tank contains an organic solvent. A substrate processing system includes a processing unit that performs processing using a processing liquid on a substrate, and a processing liquid supply device that supplies a processing liquid to the processing unit. The processing liquid supply device includes a processing liquid tank that stores a processing liquid; The first processing liquid piping connects the processing unit and the processing liquid tank; the opening and closing unit opens and closes the first processing liquid piping; the pressurizing unit sends the processing liquid inside the processing liquid tank to the above Inside the first processing liquid piping, the processing liquid is pressurized with gas; a pressure adjustment unit for adjusting the pressure inside the processing liquid tank; and a control device for stopping the supply of the processing liquid from the processing liquid The device is directed toward the supply of the processing unit, and the pressure adjusting unit is controlled before the opening and closing unit is closed, so that the inside of the processing liquid tank in a pressurized state is gradually opened to the atmosphere, and the opening and closing unit is closed after the opening of the atmosphere is started; The processing unit includes: a discharge part for discharging the processing liquid to be supplied to the substrate A second processing liquid pipe connecting the first processing liquid pipe and the discharge part; and a processing liquid valve for opening and closing the second processing liquid pipe; the control device stopping the discharge of the processing liquid from the processing liquid pipe to the discharge Supply of the unit, the processing liquid valve is closed, and then the pressure adjustment unit is controlled to depressurize the inside of the processing liquid tank. The substrate processing system according to claim 9, wherein the processing liquid valve is disposed above the opening and closing unit. The substrate processing system according to claim 10, wherein the processing liquid supply device is disposed below the processing unit. A processing liquid supply method is implemented by a processing liquid supply device. The processing liquid supply device includes: a processing liquid tank that stores a processing liquid; a first processing liquid pipe connected to perform processing using a processing liquid on a substrate Processing unit and the processing liquid tank; an opening and closing unit for opening and closing the first processing liquid pipe; and a pressurizing unit for sending the processing liquid inside the processing liquid tank to the inside of the first processing liquid pipe And pressurize the processing liquid with gas; in order to stop the supply of the processing liquid from the processing liquid supply device to the processing unit, the inside of the processing liquid tank in the pressurized state is lowered by a predetermined speed The decompression speed is gradually reduced to atmospheric pressure, and the opening and closing unit is closed after the atmospheric opening is started. The predetermined speed is set so that the gas dissolved in the treatment liquid does not appear as bubbles. A processing liquid supply method is implemented by a processing liquid supply device. The processing liquid supply device includes: a processing liquid tank that stores a processing liquid; a first processing liquid pipe connected to perform processing using a processing liquid on a substrate Processing unit and the processing liquid tank; an opening and closing unit for opening and closing the first processing liquid pipe; and a pressurizing unit for sending the processing liquid inside the processing liquid tank to the inside of the first processing liquid pipe In order to stop the supply of the processing liquid from the processing liquid supply device toward the processing unit, the inside of the processing liquid tank under pressure is gradually opened to the atmosphere in When the pressure inside the processing liquid tank is a predetermined threshold or more after a predetermined time has elapsed since the opening of the atmosphere, the opening and closing unit is closed after the pressure inside the processing liquid tank drops to atmospheric pressure.