TWI641845B - Conveying device with temperature control mechanism and operation classification device thereof - Google Patents

Abstract

A conveying device with a temperature control mechanism is provided with a first carrier for displacement in at least one direction, the first carrier is provided with at least one first bearing portion for receiving electronic components, and the temperature control mechanism is At least one temperature controller having a temperature source is disposed on the mounting member on the circumferential side of the first carrier, and the temperature control member is provided with at least one temperature guiding member capable of transmitting the temperature of the temperature source to contact the first carrier or When the temperature guiding component is adjacent to the temperature guiding component, the first temperature is transmitted to the first carrier by using the temperature guiding component, so that the first carrier maintains the preset temperature to preheat the electronic component; thereby, the first carrier does not need to be configured with the high pressure pipe body In order to avoid the bending and fracture of the pipe body and the leakage of the cold source due to the displacement of the first carrier, the utility model has the practical benefit of effectively saving cost and improving work convenience.

Description

Conveying device with temperature control mechanism and operation classification device thereof

The invention provides a conveying device with a temperature control mechanism which is required to dispose a high-pressure pipe body on the first carrier, not only reduces the cost of replacing the pipe body, but also improves the convenience of temperature control operation.

Nowadays, electronic components are applied to different electronic devices. Since the environment in which the electronic devices are located may be a high temperature environment or a low temperature environment, in order to ensure the quality of use of the electronic components, after the completion of the production, the manufacturer uses the test equipment to cool the electronic components. The test operation or the thermal test operation is performed to eliminate the defective product; please refer to the figures 1 and 2, the test device is provided with a test device 12 with a circuit board 121 and a test socket 122 on the machine table 11, and the test seat 122 is used. Carrying and testing electronic components, a transport device 13 is mounted on the machine table 11, and is provided with a loading stage 131 and a discharge loading platform 132. The feeding stage 131 and the discharging stage 132 are respectively provided with materials. The susceptor 1311 and the discharge pedestal 1321 are respectively provided with a feeding fixture 1312 and a discharging fixture 1322 above the feeding base 1311 and the discharging base 1321 to respectively receive the electronic components to be tested and The electronic measuring device, the loading stage 131 and the discharging stage 132 are further driven by the first driving source 133 to be displaced in a first direction (such as an X direction), and the conveying device 13 is further provided with a pressure shifter 134, the pressure shifting The device 134 is driven by the second driving source 135 for the second and third directions (eg In the Y and Z directions, the refrigerant is cooled in the test device 12 by the refrigerant. The conveying pipe 136 is connected to a refrigerant supply device (not shown), and conveys the refrigerant to the feeding base 1311 of the feeding stage 131, and uses the refrigerant to keep the feeding stage 131 at a preset low temperature, so that the feeding load The stage 131 preheats the electronic component to be tested on the feeding fixture 1312, and when the first driving source 133 drives the loading stage 131 and the discharging stage 132 to synchronize When the X-direction displacement is performed, the loading stage 131 drives the electronic component to be tested and the refrigerant conveying pipe 136 to be synchronously displaced to the front of the test socket 122, and the second driving source 135 drives the pressure shifter 134 to shift in the YZ direction. The feeding fixture 1312 of the stage 131 takes out the electronic component to be tested, and moves the electronic component to be tested into the test socket 122 to perform a cold-test operation. After the material is taken by the pressure shifter 134, the first driving source 133 is driven into the material load. The stage 131 and the discharge stage 132 are synchronously reset in the X direction reverse displacement; however, the preheating design of the conveying device 13 has the following improvements in use:

1. Since the inside of the tubular body of the refrigerant conveying pipe 136 is in a high pressure state, when the refrigerant conveying pipe 136 is reciprocally displaced in the X direction along with the feeding base 1311 of the feeding stage 131, the refrigerant conveying pipe 136 is easily deformed by repeated bending. Moreover, the pressure is uneven, and the pipe bend is broken, so that the refrigerant delivery pipe 136 must be shut down, resulting in an increase in equipment cost and a decrease in production efficiency.

2. Since the refrigerant conveying pipe 136 is easily deformed by repeated bending and uneven pressure, the problem of cracking of the pipe body bend occurs, and the refrigerant conveyed by the refrigerant conveying pipe 136 leaks on the machine table 11, and the worker must stop and time-consuming cleaning. This has led to an increase in the inconvenience of staff inconvenience.

A first object of the present invention is to provide a transport device with a temperature control mechanism, which is provided with a first carrier that is displaced in at least one direction, and the first carrier is provided with at least one first bearing for mounting electronic components. The temperature control mechanism is provided with at least one temperature controller having a temperature source on the mounting member on the circumferential side of the first carrier, and the temperature controller is provided with at least one temperature guiding component capable of transmitting the temperature of the temperature source. When the first carrier contacts or approaches the temperature guiding component, the first temperature is transmitted to the first carrier by the temperature guiding component, so that the first carrier maintains the preset temperature and preheats the electronic component; thereby, the first The high-pressure pipe body is not required to be arranged on the carrier, so as to avoid the bending and breaking of the pipe body and the leakage of the cold source due to the displacement of the first carrier, thereby achieving the practical benefit of effectively saving cost and improving work convenience.

The second object of the present invention is to provide a conveying device with a temperature control mechanism, wherein the temperature controller of the temperature control mechanism is disposed on a bearing member on a circumferential side of the first carrier, and is firstly connected by a temperature guiding component. The carrier transmits a preset temperature, so that the first carrier maintains the preset temperature and preheats the electronic component, and the high pressure pipe body of the refrigerant is not required to be assembled on the first carrier to avoid the pipe body being bent and broken to leak the refrigerant. Ensure that the machine is clean and achieve practical benefits of improving work convenience and production efficiency.

A third object of the present invention is to provide an operation classification device using a conveying device with a temperature control mechanism, which comprises a machine table, a feeding device, a receiving device, a working device, a conveying device and a central control device, and the feeding device is Disposed on the machine table, and provided with at least one feeding device for accommodating electronic components to be operated, the receiving device is disposed on the machine table, and is provided with at least one receiving device for accommodating the working electronic components The working device is disposed on the machine table, and is provided with at least one pair of electronic components to perform a preset operation, the conveying device is disposed on the machine table, and is provided with at least one shifting device for transferring electronic components. And a first carrier provided with at least one electronic component, the conveying device is further provided with at least one temperature control mechanism of the invention to temperature control the electronic components on the first carrier, the central control device is used for Control and integrate the operation of each device to perform automated operations to achieve practical benefits of improving operational efficiency.

[study]

11‧‧‧ machine

12‧‧‧Testing device

121‧‧‧Circuit board

122‧‧‧ test seat

13‧‧‧Conveyor

131‧‧‧Incoming loading platform

1311‧‧‧Feeding base

1312‧‧‧Feeding fixture

132‧‧‧Output loading platform

1321‧‧‧Draining base

1322‧‧‧Feeding fixture

133‧‧‧First drive source

134‧‧‧pressure shifter

135‧‧‧second drive source

136‧‧‧ refrigerant pipe

〔this invention〕

20‧‧‧Conveyor

21, 21A‧‧‧ first carrier

211, 211A‧‧‧ first base

212, 212A‧‧‧First fixture

213, 213A‧‧‧First Undertaking

214‧‧‧First set of holes

22, 22A‧‧‧ thermostat

221, 221A‧‧‧ ontology

2211A‧‧‧ first panel

222‧‧‧ delivery tube

223, 223A‧‧ ‧ temperature components

224‧‧‧Cold wafer

23‧‧‧First power source

24‧‧‧Second carrier

241‧‧‧Second base

242‧‧‧Second fixture

243‧‧‧Second Undertaking

25‧‧‧Pumper

26‧‧‧second power source

27‧‧‧ Cover

271‧‧‧ first port

272‧‧‧second port

28‧‧‧Transfer

281‧‧‧First mover

282‧‧‧Second shifter

29‧‧‧Insulation

30‧‧‧ machine

40‧‧‧Testing device

41‧‧‧ boards

42‧‧‧ test seat

50‧‧‧Feeding device

51‧‧‧Feeder

60‧‧‧ receiving device

61‧‧‧Receipt receiver

70‧‧‧Working device

71‧‧‧Circuit board

72‧‧‧ test seat

Figure 1: Schematic diagram of the use of conventional test devices and transport devices (1).

Figure 2: Schematic diagram of the use of conventional test devices and transport devices (2).

Figure 3 is a schematic view showing a first embodiment of the temperature control mechanism of the present invention.

Fig. 4 is a schematic view showing the use of the first embodiment of the temperature control mechanism of the present invention (1).

Fig. 5 is a schematic view showing the use of the first embodiment of the temperature control mechanism of the present invention (2).

Figure 6 is a schematic view showing the use of the first embodiment of the temperature control mechanism of the present invention (3).

Figure 7 is a schematic view showing a second embodiment of the temperature control mechanism of the present invention.

Figure 8 is a schematic view showing a third embodiment of the temperature control mechanism of the present invention.

Figure 9 is a schematic view showing a fourth embodiment of the temperature control mechanism of the present invention.

Fig. 10 is a schematic view showing the application of the conveying device of the present invention to an operation sorting device.

In order to make the reviewer further understand the present invention, a preferred embodiment will be described in conjunction with the drawings, as follows:

Referring to FIG. 3, the conveying device 20 of the present invention is provided with at least one first carrier 21 and a temperature control mechanism with a temperature controller 22, the first carrier 21 being displaced in at least one direction and provided with at least In the embodiment, the first carrier 21 has a first pedestal 211 with good temperature conductivity, and the first pedestal 211 can directly open the first susceptor. And a first jig having at least one first receiving portion, and in the embodiment, a first bearing portion 213 is mounted on the first base 211 and the temperature guiding property is good. a fixture 212, and the electronic component is mounted by the first receiving portion 213, and the conveying device 20 is mounted on the machine 30 to assemble at least a first power source 23 to drive the first base of the first carrier 21. 211 is at least one direction displacement. In this embodiment, the first power source 23 is disposed in the X direction to drive the first base 211 to be displaced in the X direction; the first embodiment of the temperature control mechanism is At least one temperature source thermostat 22 is disposed on the mounting member on the circumferential side of the carrier 21, and further, the mounting member can be the machine 30 The thermostat 22 may be mounted in front of or behind the first carrier 21 or in a moving path, which may be a cryogenic wafer or a heating element or a cold source fluid or a heat source fluid. If the first carrier 21 carries the electronic component to be operated, the thermostat 22 can perform pre-cooling operation or pre-heating operation on the first carrier 21, and if the first carrier 21 is installed, the cold measurement is completed. The electronic component, the thermostat 22 can perform a warming operation on the electronic component of the first carrier 21 that has been cold-tested. In this embodiment, the thermostat 22 is attached to the moving path of the first carrier 21. And a body 221 is fixed on the mounting member of the machine 30. The body 221 is provided with at least one conveying pipe 222 for conveying the temperature source. In the embodiment, the conveying pipe 222 is connected to the refrigerant supply device. (not shown) for conveying a temperature source which can be a refrigerant, and the temperature controller 22 is provided with at least one temperature guiding member capable of transmitting the temperature of the temperature source to transmit a preset temperature to the first carrier 21, so that The first carrier 21 maintains a preset temperature, and further, the temperature control The temperature guiding component of the device 22 transmits a preset temperature when the first carrier 21 is in contact with or close to the first carrier 21, and the temperature guiding component can be a rod or a surface. In this embodiment, the temperature control mechanism is attached to the first carrier 21 A first sleeve hole 214 is formed in a side of the first base 211, and a first hollow hole is disposed at a position corresponding to the first sleeve hole 214 of the first carrier 21 on the first surface of the body 221 Further, the temperature-conducting member 223 having a good temperature conductivity has a refrigerant flowing inside the temperature-conducting member 223 to maintain a low temperature state.

Referring to FIG. 4 , the test apparatus is equipped with a test device 40 and a transport device 20 on the machine 30 . The test device 40 is provided with an electrically connected circuit board 41 and a test socket 42 , and is supported by the test socket 42 . The test device 20 of the present invention is provided with a first carrier 21 and a second carrier 24, the second carrier 24 having a second base 241, which is assembled above the second base 241 a second fixture 242 of the second mounting portion 243, and the measured electronic components are mounted by the second mounting portion 243, the first carrier 21 and the second carrier 24 being the first power source 23 The driving device synchronously transmits the X-direction displacement to respectively carry the electronic component to be tested and the tested electronic component, and the conveying device 20 further sets a pressure shifter 25 above the testing device 40, and the pressure shifter 25 is controlled by the second power source 26 The driving is performed in the YZ direction to transfer and crimp the electronic component to be tested and the tested electronic component between the test socket 42 and the first and second carriers 21 and 24; since the temperature controller 22 of the temperature control mechanism is configured At the beginning of the moving path of the first carrier 21 (ie, the feeding area), the first base 2 of the first carrier 21 The first set of holes 214 are fitted to the temperature guiding member 223 of the body 221 of the thermostat 22, and the temperature is transmitted to the body 221 by the conveying pipe 222 of the thermostat 22, so that the temperature of the body 221 can be guided. The inside of the member 223 has a low temperature state, and the temperature controller 22 can conduct the low temperature to the first base 211 through the temperature guiding member 223 and the first sleeve hole 214, and then use the first base 211 to lower the temperature. The first jig 212 is kept at a predetermined low temperature, and the first mounting portion 213 of the first jig 212 of the first carrier 21 is placed on the electronic component to be tested. The first jig 212 is pre-cooled to the electronic component to be tested.

Referring to FIG. 5, the first power source 23 of the conveying device 20 drives the first carrier 21 and the second carrier 24 to be displaced in the X direction. The refrigerant delivery tube 222 is mounted on the body 221 of the thermostat 22. And the body 221 is assembled on the machine table 30, so that the refrigerant conveying pipe 222 does not shift with the first carrier 21 in the X direction, thereby effectively preventing the bending and rupture, thereby ensuring the service life of the conveying pipe 222 and preventing the refrigerant from being external. Leaking to the machine table 30, thereby saving cost and improving work convenience; therefore, when the first carrier 21 is displaced in the X direction, the first sleeve hole 214 is directly separated from the temperature guiding member 223 and is carried during the loading process. The electronic component to be tested is pre-cooled via the first fixture 212 that has been in a low temperature state. When the first carrier 21 is displaced to the front of the test socket 42, the pressure shifter 25 is driven by the second power source 26 as YZ. The direction is displaced, and the electronic component to be tested is taken out by the first carrier 21, and the electronic component to be tested is moved into the test stand 42 to perform a test operation.

Referring to FIG. 6, after the electronic component to be tested of the first carrier 21 is taken out by the pressure shifter 25, the first power source 23 drives the first carrier 21 and the second carrier 24 to be reversely displaced in the X direction. The first sleeve hole 214 of the first carrier 21 is again fitted to the temperature guiding member 223 of the thermostat 22, so that the temperature controller 22 uses the temperature guiding member 223 with the refrigerant to the first base of the first carrier 21. The seat 211 performs a low temperature operation, so that the first jig 212 of the first carrier 21 maintains a preset low temperature to carry and pre-cool the next electronic component to be tested; therefore, the first carrier 21 does not need to be configured with a high pressure pipe. In addition, there is no need to worry about the problem of bending and fracture of the pipe body and leakage of refrigerant during the reciprocating displacement in the X direction, so as to achieve the practical benefit of improving the efficiency of temperature control and saving cost.

Referring to FIG. 7, a second embodiment of the temperature control mechanism of the present invention is different from the first embodiment in that the body 221A of the thermostat 22A is attached to the first panel 2211A to be a temperature of the refrigerant wafer 224. The first surface of the cooled wafer 224 is a cold surface, and the second surface is a hot surface, and the first surface 2211A of the contact body 221A is adhered to the cold surface so that the first panel 2211A is in a low temperature state. , the thermostat 22A and the first panel 2211A The first surface of the first carrier 21A is used as the temperature guiding member 223A. The first carrier 21A is mounted on the first base 211A to assemble a first fixture 212A having a first bearing portion 213A and having good temperature conductivity. The first carrier 21A is driven by the first power source 23 to be displaced in at least one direction, and is coupled to the first base 211A and the first fixture of the first carrier 21A. When the second surface of the 212A is in contact with the temperature guiding member 223A of the first surface of the main body 221A, the cooling wafer 224 of the thermostat 22A can conduct the low temperature to the first base 211A via the temperature guiding member 223A of the main body 221A. A fixture 212A maintains the first carrier 21A at a predetermined low temperature to pre-cool the electronic component to be tested.

Please refer to FIG. 8 , which is a third embodiment of the temperature control mechanism of the present invention. The outer cover of the first carrier 21 and the temperature controller 22 is provided with at least one outer cover 27 , and the outer cover 27 is opened for the first In the embodiment, the outer cover 27 is made of a heat insulating material, and is disposed outside the main body 221 of the first carrier 21 and the thermostat 22, and the outer cover 27 is a first opening 271 for the first carrier 21 to enter and exit is opened on the first side, and a second opening 272 for the inlet and outlet 28 of the feeder 28 is opened on the top surface, and the temperature guiding member 223 of the temperature controller 22 is opposite. When the first carrier 21 performs the low temperature operation, the outer cover 27 can be used to assist in maintaining the low temperature of the first carrier 21, so that the first carrier 21 maintains the preset temperature, thereby achieving the practical benefit of improving the use efficiency.

Please refer to FIG. 9 , which is a fourth embodiment of the temperature control mechanism of the present invention. The first carrier 21 is provided with at least one heat insulating member. In this embodiment, the first base of the first carrier 21 is The outer peripheral surface of the seat 211 and the first jig 212 is provided with a heat insulating member 29 made of a heat insulating material. When the temperature guiding member 223 of the temperature controller 22 conducts low temperature operation on the first carrier 21, the heat insulating member 29 can be used to assist Maintaining the low temperature of the first carrier 21 maintains the first carrier 21 at a preset temperature, thereby achieving the practical benefit of improving the performance.

Please refer to FIG. 3 and FIG. 10 , which are schematic diagrams of the conveying device 20 with the temperature control mechanism applied to the electronic component operation sorting device. The feeding machine 30 is provided with a feeding device 50, a receiving device 60, a working device 70, a conveying device 20 with a temperature control mechanism of the present invention, and a central control device (not shown); the feeding device 50 is Mounted on the machine table 30, and provided with at least one feeding device 51 for feeding trays for accommodating at least one electronic component to be operated; the receiving device 60 is mounted on the machine table 30 and provided with at least a receiving receptacle 61 for receiving trays for accommodating at least one electronic component that has been operated; the working device 70 is mounted on the machine 30 and is provided with at least one pair of electronic components for performing preset operations In this embodiment, the operator is provided with an electrically connected circuit board 71 and a test stand 72 for performing a test operation on the electronic component; the transport device 20 is mounted on the machine 30 and is provided with at least a shifter for transferring the electronic component, and a first carrier 21 for carrying at least one electronic component, the transport device 20 is further provided with at least one temperature control mechanism of the invention for temperature-controlling the first carrier 21 In the embodiment, the conveying device 20 is provided with two electronic components capable of being tested. The first carrier 21 and the temperature transfer mechanism are respectively disposed on the transfer paths of the two first carriers 21, and the temperature controller 22 of each temperature control mechanism conducts the low temperature to the first carrier 21 by the temperature guiding member 223, so that The first carrier 21 maintains a preset temperature, and the conveying device 20 is provided with a first feeder 281 for taking out the electronic component to be tested at the feeding device 51 of the feeding device 50 and transferring it to the second The first carrier 21, the two first carriers 21 pre-cools the electronic components to be tested, and carries the electronic components to be tested to the side of the working device 70, and the conveying device 20 is respectively connected by the two pressure shifters 25 Transferring the electronic components to be tested on the two first carriers 21 to the test socket 72 of the working device 70 to perform a test operation, and transferring the tested electronic components of the test socket 72 to the second second carrier 24, The second carrier 24 carries the measured electronic components, and the conveying device 20 is provided with a second shifter 282 to take out the measured electronic components on the second carrier 24, and according to the test result, the measured electronic components The components are transported to the receiving device 61 of the receiving device 60 for sorting and accommodating; the central control device is And integration of each device to control actuator to perform automatic operation, to achieve practical benefits of the job performance of the lift.

Claims (9)

A conveying device with a temperature control mechanism, comprising: a first carrier: being at least one direction displaced, and provided with at least one first bearing portion for receiving electronic components; and a temperature control mechanism: being attached to the first carrier Having at least one temperature source thermostat on the front or rear or moving path mounting member, the thermostat is provided with at least one temperature guiding component capable of transmitting the temperature of the temperature source, the temperature guiding component is a member or face to deliver a predetermined temperature to the first carrier. The conveying device with a temperature control mechanism according to claim 1, wherein the first carrier has a first base, the first base defines the first receiving portion, or at least one The first fixture having the first mounting portion. The conveying device with a temperature control mechanism according to claim 1, wherein the temperature controller of the temperature control mechanism is disposed on a moving path of the first carrier. The conveying device with a temperature control mechanism according to claim 1, wherein the temperature controller of the temperature control mechanism is a refrigerant chip or a heating element or a cold source fluid or a heat source fluid. The conveying device with a temperature control mechanism according to claim 1, wherein the temperature controller of the temperature control mechanism is provided with a body, and the temperature guiding member is disposed on the body. The conveying device with a temperature control mechanism according to claim 5, wherein the temperature controller is provided with at least one conveying pipe for conveying the temperature source. The conveying device with a temperature control mechanism according to the first aspect of the invention, wherein the temperature control mechanism is provided with at least one outer cover on the outer side of the first carrier and the temperature controller, and the outer cover is opened for the The first port of the first carrier enters and exits. The conveying device with a temperature control mechanism according to claim 1, wherein the temperature control mechanism is provided with at least one heat insulating member on the first carrier. An operation classification device for applying a conveying device with a temperature control mechanism, comprising: a machine table; a feeding device: disposed on the machine table, and provided with at least one feeding device for accommodating at least one to be operated The electronic component; the receiving device is disposed on the machine, and is provided with at least one receiving device for accommodating at least one electronic component that has been operated; the working device is disposed on the machine and is provided Having at least one operator for performing a preset operation on the electronic component; at least one conveying device having a temperature control mechanism according to claim 1 is disposed on the machine and provided with at least one transfer a shifter for the electronic component, and a first carrier provided with at least one carrying electronic component, and at least one temperature control mechanism for temperature controlling the first carrier; the central control device: for controlling and integrating Each device is actuated to perform an automated job.