TWI641299B - Method of manufacturing electronic component mounting body - Google Patents

Abstract

A method of manufacturing an electronic component mounting body, comprising: providing a recess 11 on one side of a transfer mold 10 subjected to a release process, and filling the solder paste 20 by coating in the recess; aligning the recess 11 and the connection of the electronic component 30 The position of the electrode 31 carries the connection electrode 31 on the solder paste 20 filled in the recess 11; the reflow is performed in a state where the connection electrode 31 is pressed against the solder paste 20; and the transfer mold 10 and the electronic component 30 are separated from the transfer mold. 10, the solder paste 20 is peeled off, and the solder paste 20 is transferred to the connection electrode 31 of the electronic component 30; and the wiring pattern of the connection electrode 31 and the electronic circuit substrate 50 is electrically connected by the solder paste 20, and the electronic component 30 is assembled to the electronic component. Circuit board 50.

Description

Method of manufacturing electronic component mounting body

The present invention relates to a method of manufacturing an electronic component mounted body in which high-density assembly is performed on an electronic circuit board.

In recent years, with the development of miniaturization, weight reduction, high performance, and high frequency of electronic devices, electronic circuit boards having such a configuration must have high-density assembly.

In order to achieve high-density assembly of electronic circuit boards, the miniaturization of electronic components such as resistors, capacitors, LSIs, and ICs mounted on electronic circuit boards has also progressed. For example, the previous mainstream is the so-called "1005" electronic component with a length of 1 mm and a width of 0.5 mm. However, it is necessary to assemble the so-called "0603" (length 0.6 mm, width 0.3 mm) or "0402" (length 0.4). Smaller electronic components such as mm and width 0.2 mm).

Further, in order to achieve high-density assembly of an electronic circuit board, the wiring pattern of the electronic circuit board becomes fine and complicated. Since the wiring pattern of the electronic circuit board becomes more and more fine and complicated, when the electronic component is assembled, a short circuit of the wiring, a defective product, a position gap, and the like occur due to the outflow of the conductive material such as the liquid solder. Therefore, the present invention proposes a method of manufacturing an electronic component mounted body in which the connection strength between the electronic component and the electronic circuit board is sufficiently ensured and the occurrence of a bridge is prevented (for example, refer to Patent Documents 1 and 2).

In terms of a method of manufacturing an electronic component mounted body for preventing occurrence of a bridge, the present invention also proposes a method of manufacturing an electronic component mounted body which provides a necessary and minimum conductive material to a connector and prevents occurrence of a bridge (for example, Please refer to Patent Documents 3 and 4).

Patent literature:

Patent Document 1 Japanese Patent Publication No. 2004-273853

Patent Document 2 Japanese Patent Publication No. 2005-51204

Patent Document 3 Japanese Patent Publication No. 2006-319253

Patent Document 4 Japanese Patent Laid-Open Publication No. 2008-34756

However, in Patent Documents 1 to 4, problems such as bridges, defective products, and position gaps in the assembly of small electronic components such as "0402" remain. Further, in the reflow process, since the lead-free solder or the like has a high specific heat and a high melting point, a long melting time is required, and thus the solder is oxidized by the influence of the atmosphere, and a poor assembly condition or the like is caused. When solder is heated, the solder is often exposed to the atmosphere, causing the solder to oxidize significantly.

The object of the method for manufacturing an electronic component mounting body provided by the present invention is to sufficiently ensure the connection strength between the electronic component and the electronic circuit substrate, and to provide a minimum amount of solder paste to the connection terminal of the electronic component to stabilize the connection of the electronic component. And prevent the occurrence of defects such as bridges, defective products, position gaps, etc., and can reduce the oxidation of solder.

The present inventors have proposed a method for solving the above problem, in a transfer mold The reflowed solder paste is provided in the recess to the connection end of the electronic component. In other words, the present invention provides the following 1 to 11 methods.

The first method is a method of manufacturing an electronic component mounting body, comprising: providing a recess on one side of a transfer mold by a release process, and filling a solder paste by coating in the recess; aligning the recess and an electronic component One of the positions of the connection electrode, the connection electrode is carried on the solder paste filled in the concave portion; the connection electrode is reflowed while the connection electrode is pressed with the solder paste; the transfer mold and the electronic component are separated, and the solder paste is peeled off from the transfer mold, and Transferting the solder paste to the connection electrode of the electronic component; and electrically connecting the connection electrode and one of the wiring patterns of the electronic circuit substrate by the solder paste, and assembling the electronic component on the electronic circuit substrate.

The second method is a method of manufacturing an electronic component mounting body, comprising: providing a recess on one side of a transfer mold by a release process, and filling a solder paste in the recess by a dispenser; aligning the recess and an electronic component a position where the electrode is connected, the connection electrode is carried on the solder paste filled in the concave portion; the connection electrode is reflowed in the state of pressing the solder paste; the transfer mold and the electronic component are separated, the solder paste is peeled off from the transfer mold, and the transfer is performed. Printing the solder paste to the connection electrode of the electronic component; and electrically connecting the connection electrode and one of the wiring patterns of the electronic circuit substrate by the solder paste, and assembling the electronic component on the electronic circuit substrate.

A third method is a method of manufacturing an electronic component mounting body, comprising: providing a recess on one side of a transfer mold by a release process, and filling a solder paste by screen printing in the recess; aligning the recess and an electronic component One of the positions of the connection electrode, the connection electrode is carried on the solder paste filled in the concave portion; the connection electrode is reflowed while the connection electrode is pressed with the solder paste; the transfer mold and the electronic component are separated, and the solder paste is peeled off from the transfer mold, and Transfer solder paste to electronic component connection And an electrode; and a wiring pattern electrically connecting the connection electrode and one of the electronic circuit substrates, and assembling the electronic component on the electronic circuit substrate.

The fourth method is a method for manufacturing an electronic component mounting body, comprising: providing a recess on one side of a transfer mold by a release process, and filling a solder paste in the recess by filling a hole in one of the transfer molds; a quasi-recessed portion and a position of one of the electronic components connecting the electrodes, carrying a connection electrode on the solder paste filled in the concave portion; performing reflow under the state in which the connection electrode is pressed against the solder paste; separating the transfer mold and the electronic component from the transfer The mold strips the solder paste, and transfers the solder paste to the connection electrode of the electronic component; and electrically connects the connection electrode and one of the wiring patterns of the electronic circuit substrate by the solder paste, and assembles the electronic component on the electronic circuit substrate.

The fifth method is the method for producing an electronic component mounted body according to any one of the first to fourth aspects, wherein the filler solder paste is filled with the solder paste so as to protrude from the concave portion.

According to a sixth aspect of the invention, in the method of manufacturing an electronic component mounted body according to any one of the first to fourth aspects, the recessed portion is plural and disposed at intervals of the connection electrodes of the corresponding electronic components.

A method of manufacturing an electronic component mounted body according to any one of the first to fourth aspects, wherein the solder paste comprises lead-free solder.

The eighth method is the method for producing an electronic component mounted body according to any one of the first to fourth aspects, wherein the reflow is performed on the other opposite surface of the surface on which the concave portion is disposed.

A method of manufacturing an electronic component mounted body according to any one of the above first to fourth aspects, wherein the transfer molding system comprises a resin-made sheet and gold It is a thin piece made.

The tenth method is the method for manufacturing an electronic component mounted body according to any one of the above first to fourth methods, wherein the solder paste 20 has a viscosity of 5 Pa. s above and 1000Pa. s below.

The eleventh method is the method for producing an electronic component mounted body according to any one of the above first to fourth aspects, wherein the surface energy of the transfer mold is smaller than the surface energy of the solder paste.

According to the manufacturing method of the electronic component mounted body provided by the present invention, it is possible to sufficiently ensure the connection strength between the electronic component and the electronic circuit substrate, and to provide a minimum amount of solder paste to the connection terminal of the electronic component to stabilize the connection of the electronic component. Then, the occurrence of defects such as bridges, defective products, and positional gaps is prevented, and the oxidation of the solder can be reduced.

10‧‧‧Transfer mode

11‧‧‧ recess

12‧‧‧ Filling holes

20‧‧‧ solder glue

30‧‧‧Electronic components

31‧‧‧Connecting electrode

40‧‧‧heating structure

50‧‧‧Electronic circuit substrate

51‧‧‧Wiring pattern

1 is an engineering sectional view showing a method of manufacturing an electronic component mounted body according to first to third embodiments of the present invention; and FIG. 2 is a cross-sectional view showing a size of a transfer die according to an embodiment of the present invention; An engineering sectional view of a method of manufacturing an electronic component mounted body according to a fourth embodiment of the present invention.

First embodiment

The method of manufacturing the electronic component mounted body according to the first embodiment of the present invention will be described with reference to Fig. 1 .

First, as shown in Fig. 1(a), the transfer mold 10 in which the release treatment is disposed, and the concave portion 11 provided on one surface thereof are disposed. The recesses 11 provided in the transfer die 10 may be single, but usually plural. The shape of the recessed portion 11 can be various shapes such as a U-shaped cross section or a V-shaped cross section.

As shown in Fig. 2, the size of the recess 11 can be determined by the pitch A, the width B of the recess, and the height C of the recess. The size of the concave portion 11 can be arbitrarily determined depending on the size of the electronic component and the amount of transfer of the solder paste. When the size of the electronic component is a relatively small size such as "0603" or "0402", in a preferred embodiment, the recess A is 100 um or more and 200 um or less, and the recess width B is 50 um or more and 100 um or less. The height C of the recess is 30 um or more and 100 um or less. When a plurality of recesses 11 are arranged, it is easy to align the positions of the recesses 11 and the connection electrodes of the electronic components, and to easily supply the solder paste to the connection electrodes, and it is preferable that the electrons correspond to the electronic components of the electronic circuit board. The recess 11 is provided at intervals of the connection electrodes of the elements.

The material of the transfer mold 10 can be a resin or a metal. The resin as the transfer mold 10 may be a resin having solder heat resistance, and for example, a polyimide, a thermosetting epoxy resin, a liquid crystal polymer or the like can be used. Further, the metal as the transfer mold 10 may be iron, copper, aluminum, magnesium, an alloy thereof or the like. From the viewpoint of high versatility of the transfer mold 10 and easy formation of the concave portion 11, a preferable method is a sheet made of a resin and a sheet made of metal.

Since the transfer mold 10 must have a release property, a release treatment of coating of a fluorine-based resin, a bismuth resin, an olefin resin, or the like is performed. The fluorine-based resin includes a fluorine element bismuth resin, a fluorine element boron resin, and the like. The resin of the terpenoid includes a resin having a dimethylsiloxane as a backbone. The olefin resin includes a polyethylene resin, a polypropylene resin, a polyethylene propylene (copolymer) resin, and the like. Preferably, the surface energy of the transfer mold 10 is less than the surface energy of the solder paste 20. In this way, it is possible to prevent the solder paste 20 from adhering to the transfer mold 10. In the process described later, the solder paste 20 can be easily transferred to the connection electrode 31 of the electronic component 30.

Next, as shown in FIG. 1(b), the solder paste 20 is filled in the concave portion 11 of the transfer mold 10. When the solder paste 20 is filled in the recess 11, in order to easily align the positions of the recess 11 and the connection electrode 31 of the electronic component, it is preferable to fill the solder paste 20 like the protrusion of the recess 11. The method of filling the solder paste 20 in the recess 11 is to apply a solder paste 20 over the transfer mold 10 to fill the recess 11. The solder paste 20 is applied over the transfer mold 10 by a conventional method such as a gravure coat, a bar coat, a spray coat, or a spin coat method. (spin coat), roll coating, die coat, knife coat, air knife coat, curtain mold (curtain) Coat) and so on. Due to the release treatment of the transfer mold 10 and the influence of the surface tension, the solder paste 20 applied on the transfer mold 10 is self-filled in the recess 11. The solder paste 20 may contain solder for electronic solder such as lead solder and lead-free solder, and particularly lead-free solder is suitable. Lead-free solders include SnAgCu-based solders, SnZnBi-based solders, SnCu-based solders, SnAgInBi-based solders, and SnZnAl-based solders. Solder paste 20 has a viscosity of 5 Pa. s above and 1000Pa. Below s, it is better to 50Pa. s above and 1000Pa. Below s, better is 250Pa. s above and 500Pa. s below. If the viscosity of the solder paste 20 is within the above range, The solder paste 20 can be well filled in the recess 11 with respect to the surface tension of the solder paste 20.

Then, as shown in FIG. 1(c), the positions of the concave portion 11 and the connection electrode 31 of the electronic component 30 are aligned such that the connection electrode 31 is carried on the solder paste 20 filling the recess 11. The electronic component 30 includes a wafer-shaped circuit component such as a wafer resistor, a wafer capacitor, a wafer LSI, or a wafer IC that are mounted on the electronic circuit board 50. On the side surfaces of both ends of the electronic component 30, the connection electrode 31 is disposed to receive electric power from the electronic circuit board 50. In order to obtain a remarkable effect of preventing a problem such as a bridge, a defective product, or a positional gap, the size of the electronic component 30 is preferably a small size having a length of less than 1.0 mm and a width of less than 0.5 mm (for example, "0603" And "0402", etc.).

Next, as shown in FIG. 1(d), the connection electrode 31 is pressed against the solder paste 20, and the solder paste 20 is reflowed. In order to reflow the solder paste 20, the solder paste 20 is heated to a temperature equal to or higher than the melting point. In order to heat the solder paste 20 to a temperature equal to or higher than the melting point, in order to uniformly heat the solder paste 20, for example, it is preferable to heat the structure 40 such as a heating stage on the other opposite side of the surface on which the concave portion 11 is disposed. To heat it. The heating temperature is above the melting point of the solder paste 20. For example, when the solder paste 20 is a SnAgCu-based solder, it is heated to between 217 ° C and 220 ° C for reflow.

Then, as shown in Fig. 1(e), the transfer mold 10 and the electronic component 30 are separated, the solder paste 20 is peeled off from the transfer mold 10, and the solder paste 20 is transferred to the connection electrode 31 of the electronic component 30. As shown in FIG. 1(e), the solder paste 20 transferred to the connection electrode 31 may be a part of the solder paste 20 filled in the recess 11, or may be all of the solder paste 20 filled in the recess 11. Solder paste transferred to the connection electrode 31 The amount of transfer of 20 is controlled in accordance with the filling amount of the solder paste 20 and the degree of reflow heating (temperature, time) of the solder paste 20. In this way, the amount of the desired solder paste 20 is transferred to the connection electrode 31 of the electronic component 30.

Next, as shown in FIG. 1(f), the connection electrode 31 is electrically connected to the wiring pattern 51 of the electronic circuit substrate 50 by the solder paste 20, and the electronic component 30 is assembled to the electronic circuit substrate 50. When the connection electrode 31 is electrically connected to the wiring pattern 51, it is heated again, so that the solder paste 20 can be reflowed. The electronic component mounting body in which the electronic component 30 is electrically connected to the electronic circuit board 50 is manufactured by the above-described process.

According to the method of manufacturing the electronic component mounting body of the first embodiment of the present invention, the solder paste 20 is reflowed while the connection electrode 31 is pressed to fill the solder paste 20 in the recess 11 of the transfer mold 10, and the solder paste 20 is used. The area exposed to the atmosphere is small, and the oxidation of solder caused by reflow under the atmosphere can be reduced. Further, according to the method of manufacturing the electronic component mounting body of the first embodiment of the present invention, the transfer solder paste 20 is subjected to reflow engineering before the connection electrode 31, and since the solder is once melted, the solder particles are not subjected to the particles. The influence of the size of the diameter can sufficiently ensure the connection strength between the electronic component 30 and the electronic circuit board 50 when the electronic component 30 is assembled on the electronic circuit board 50. Further, according to the method of manufacturing the electronic component mounted body of the first embodiment of the present invention, since it is possible to provide the necessary and minimum solder paste 20 to the connection end point 31, it is possible to prevent the bridge from occurring when the solder paste 20 is melted. .

Type of the second embodiment

Compared with the method of manufacturing the electronic component mounted body of the first embodiment of the present invention, the method of manufacturing the electronic component mounted body of the second embodiment of the present invention differs in the method of filling the solder paste 20 in the recess 11 By means of A solder paste 20 is filled in the recess 11 by a dispenser. Since the other parts are substantially the same, the description is omitted.

According to the method of manufacturing an electronic component mounted body of the second embodiment of the present invention, the same effects as those of the method of manufacturing the electronic component mounted body of the first embodiment of the present invention can be obtained. Further, according to the manufacturing method of the electronic component mounting body of the second embodiment of the present invention, the solder paste 20 is directly filled in the recess 11 by the dispenser, and the necessary and minimum solder paste 20 can be provided according to the desired amount. Up to the concave portion 11, it is possible to prevent the bridge from occurring when the solder paste 20 is melted.

Type of the third embodiment

The manufacturing method of the electronic component mounted body of the third embodiment of the present invention differs from the method of manufacturing the electronic component mounted body of the third embodiment of the present invention in the method of filling the solder paste 20 in the recess 11 The solder paste 20 is filled in the recess 11 by screen printing. Since the other parts are substantially the same, the description is omitted.

According to the method of manufacturing an electronic component mounted body of the third embodiment of the present invention, the same effects as those of the method of manufacturing the electronic component mounted body of the first embodiment of the present invention can be obtained. Further, according to the method of manufacturing the electronic component mounting body of the third embodiment of the present invention, screen printing is employed, and the solder paste 20 can be provided in the recess 11 regardless of whether the transfer die 10 is rigid or soft. Further, with screen printing, since the desired amount of the solder paste 20 can be supplied to the concave portion 11, it is possible to prevent the bridge from occurring when the solder paste 20 is melted.

Type of the fourth embodiment

As shown in FIGS. 3(a) and 3(b), the fourth embodiment of the present invention is compared with the method of manufacturing the electronic component mounted body of the first embodiment of the present invention. The method of manufacturing the electronic component mounting body differs in the method of filling the solder paste 20 in the recess 11 by filling the solder paste 20 in the recess 11 by the filling hole 12 provided in the transfer mold 10. Since the other parts are substantially the same, the description is omitted.

As shown in FIG. 3(a), the transfer mold 10 communicates with the recess 11 and the filling hole 12 is disposed to provide the solder paste 20 to the recess 11. As shown in FIG. 3(b), in the process of filling the solder paste 20 to the recess 11 of the transfer mold 10, the method of filling the solder paste 20 to the recess 11 is filled by the filling holes 12 provided in the transfer mold 10. Solder paste 20.

According to the method of manufacturing an electronic component mounted body of the fourth embodiment of the present invention, the same effects as the method of manufacturing the electronic component mounted body of the first embodiment of the present invention can be obtained. Further, according to the method of manufacturing the electronic component mounted body of the fourth embodiment of the present invention, the method of filling the solder paste 20 in the filling hole 12 of the transfer mold 10 is used, since the desired amount can be easily provided. By soldering the solder 20 to the recess 11, it is possible to prevent the bridge from occurring when the solder paste 20 is melted.

Claims (8)

A manufacturing method of an electronic component mounting body, comprising: providing a recess on one side of a transfer mold by a release process, and filling a solder paste in a recess filled in one of the transfer molds; a recess and a position of one of the electronic components connecting the electrodes, carrying the connection electrode on the solder paste filled in the recess; performing reflow in a state of pressing the connection electrode in the solder paste; separating the transfer mold and the An electronic component, the solder paste is peeled off from the transfer mold, and the solder paste is transferred to the connection electrode of the electronic component; and the connection electrode and a wiring pattern of an electronic circuit substrate are electrically connected by the solder paste, And assembling the electronic component to the electronic circuit substrate. The method of manufacturing an electronic component mounted body according to claim 1, wherein the solder paste is filled to fill the solder paste so as to protrude from the concave portion. The method of manufacturing an electronic component mounted body according to claim 1, wherein the recessed portion is plural and disposed at intervals of the connection electrode corresponding to the electronic component. The method of manufacturing an electronic component mounted body according to claim 1, wherein the solder paste comprises lead-free solder. The method of manufacturing an electronic component mounted body according to claim 1, wherein the reflow is performed on the other opposite surface of the surface on which the recess is disposed. The method of manufacturing an electronic component mounted body according to claim 1, wherein the transfer molding comprises a resin-made sheet and a metal-made sheet. The method for manufacturing an electronic component mounted body according to claim 1, wherein the solder paste has a viscosity of 5 Pa. s above and 1000Pa. s below. The method of manufacturing an electronic component mounted body according to claim 1, wherein a surface energy of the transfer mold is less than a surface energy of the solder paste.