TWI640413B - Resin molding device, method for producing resin molded article, and method for producing product - Google Patents

Abstract

The present invention has an object of providing a resin molding apparatus which can reduce a resin thickness deviation of a molded article. In order to achieve the object, the resin molding apparatus of the present invention includes: a discharge mechanism (520) for discharging a fluid resin for resin molding in a coating region of a coating object (11); and measuring in the coating region a volume measuring mechanism for volume of the fluid resin to be applied; and a compression molding mechanism (530) for performing compression molding using the coating object coated with the fluid resin.

Description

Resin molding device, method for producing resin molded article, and method for producing product

The present invention relates to a resin molding apparatus, a method of producing a resin molded article, and a method of producing a product.

Many electronic components such as ICs and semiconductor electronic components are molded and used as resin-encapsulated electronic components (resin molded products) encapsulated by a resin.

In order to reduce the variation in the thickness of the resin encapsulating resin, for example, Patent Document 1 describes the measurement of the weight of the liquid resin (liquid resin) discharged onto the workpiece.

[Previous Technical Literature]

[Patent Literature]

Patent Document 1: JP-A-2003-165133.

However, in the weight measurement, it is difficult to measure the amount of the fluid resin with high precision. For example, although electronic scales are commonly used in weight measurement, electronic scales are susceptible to the environment in which they are used. For example, in the case of measuring a liquid resin which is discharged over a large range on a large discharge object by an electronic scale, the measured value is unstable, and it is difficult to measure with high precision. Therefore, there is a risk that the resin thickness of the resin molded article is deviated.

Then, an object of the present invention is to provide a resin molding apparatus, a method for producing a resin molded article, and a method for producing a product, which are capable of reducing a resin thickness variation of a resin molded article.

In order to achieve the object, the resin molding apparatus of the present invention includes: a discharge mechanism that discharges a fluid resin for resin molding in a coating region of a coating object, and a measurement of the flow discharged in the coating region. A volume measuring mechanism for the volume of the resin and a compression molding mechanism for performing compression molding using the object to be coated coated with the fluid resin.

The method for producing a resin molded article of the present invention includes a step of discharging a fluid resin for resin molding in a coating region of a coating object, and measuring a fluid resin discharged in the coating region. The volumetric volume measuring step and the compression molding step of performing compression molding using the coating object coated with the fluid resin.

The method for producing a product of the present invention is characterized in that a product is produced by using a resin molded article produced by the method for producing a resin molded article of the present invention.

According to the invention, it is possible to reduce variations in resin thickness of the resin molded article.

1‧‧‧ wafer

11‧‧‧ release film (application object)

11a‧‧‧ Coating area

12‧‧‧Workbench (fixed table)

13‧‧‧Distributor (discharge mechanism)

14‧‧‧Nozzles

15‧‧‧ Displacement meter (dimension measuring mechanism)

16‧‧‧ camera

17‧‧‧heater

18‧‧‧ Camera (Sensor)

19‧‧‧Ventilation nozzle/air nozzle (gas injection mechanism)

21‧‧‧Liquid resin

21b‧‧‧Encapsulation resin

101‧‧‧上模

102‧‧‧Down

103‧‧‧Down base parts

104‧‧‧ Lower cavity part

105‧‧‧Flexible parts

106‧‧‧ Lower cavity of the model cavity

111‧‧‧Fixed platen

112‧‧‧ movable platen

113‧‧‧Base

114‧‧‧ tie rods (holding parts)

115‧‧‧Molding mechanism

116‧‧‧ drive source

117‧‧‧Transfer parts

510‧‧‧Release film cutting module (release film cutting mechanism)

511‧‧‧Film fixed table mounting mechanism

512‧‧‧Roll release film

513‧‧‧Film fixture

520‧‧‧ Coating module (discharge mechanism and resin expansion mechanism)

521‧‧‧Resin Mounting Machine (Resin Handling Mechanism)

522‧‧‧Reprocessing agency

523‧‧‧Film fixed table moving mechanism

530‧‧‧Compression molding mechanism (compression molding module)

531‧‧‧Molding mould

532‧‧‧Model cavity

540‧‧‧Transportation mechanism (handling module)

541‧‧‧Substrate Mounter

542‧‧‧ Track

543‧‧ mechanical arm

544‧‧‧Substrate

544a‧‧‧Resin-packaged front substrate (pre-molded substrate)

544b‧‧‧Resin-packaged substrate (molded substrate)

550‧‧‧Control Department

551‧‧ ‧ Calculation Department

552‧‧‧ Storage Department

701‧‧‧ frame parts

L1, L2‧‧‧ laser

Direction of movement of the M1‧‧‧ laser displacement meter

Fig. 1 is a side view schematically showing an example of a discharge mechanism of a resin molding apparatus of the present invention.

2 is a view schematically showing a displacement gauge of a resin molding apparatus of the present invention A side view of an example of (a part of the volume measuring mechanism).

3 is a side view schematically showing an example of a camera (a part of a volume measuring mechanism) of the resin molding apparatus of the present invention.

Fig. 4 is a side view schematically showing an example of a compression molding mechanism of the resin molding apparatus of the present invention.

Fig. 5 is a plan view schematically showing an example of a resin molding apparatus of the present invention.

Fig. 6 is a plan view schematically showing another example of the resin molding apparatus of the present invention.

FIG. 7 is a plan view schematically showing an example of a fluid resin discharge mode in a discharge step of the method for producing a resin molded article of the present invention.

Fig. 8 is a plan view schematically showing another example of the fluid resin discharge mode of the discharge step.

Fig. 9 is a plan view schematically showing another example of the fluid resin discharge mode of the discharge step.

Fig. 10 is a plan view schematically showing another example of the fluid resin discharge mode of the discharge step.

Fig. 11 is a plan view schematically showing another example of the fluid resin discharge mode of the discharge step.

Fig. 12 is a plan view schematically showing another example of the fluid resin discharge mode of the discharge step.

Fig. 13 is a plan view schematically showing another example of the fluid resin discharge mode of the discharging step.

Figure 14 is a flow-through resin discharge mold schematically showing a discharge step A plan view of another example of the formula.

Fig. 15 is a plan view schematically showing another example of the fluid resin discharge mode of the discharging step.

Fig. 16 is a plan view schematically showing another example of the fluid resin discharge mode of the discharge step.

Fig. 17 is a plan view schematically showing another example of the fluid resin discharge mode of the discharge step.

Fig. 18 is a plan view schematically showing another example of the fluid resin discharge mode of the discharge step.

Fig. 19 is a side view schematically showing an example of volume measurement of a fluid resin according to the present invention and using a displacement meter (a part of a volume measuring mechanism).

Fig. 20 is a schematic block diagram showing the main part of the calculation of the discharge volume of the fluid resin of Fig. 19 or Fig. 36.

FIG. 21 is a side view schematically showing an example of a case where the release film (application target) is moved in the resin expansion step.

FIG. 22 is a side view schematically showing an example of a case where a gas is injected into the fluid resin in the resin expanding step.

FIG. 23 is a plan view schematically showing an example of an expanded mode in a case where a fluid resin is injected into a fluid resin to expand a fluid resin in a resin expanding step.

FIG. 24 is a plan view schematically showing another example of an expanded mode in a case where a fluid resin is ejected to a fluid resin in a resin expanding step.

25 is a plan view schematically showing another example of an expanded mode in a case where a fluid resin is injected to a fluid resin in a resin expanding step.

FIG. 26 is a plan view schematically showing an example of a procedure of a case where a gas is sprayed on a fluid resin to expand a fluid resin in a resin expanding step.

Figure 27 is a plan view schematically showing another step of the same resin expansion step as Figure 26.

Figure 28 is a plan view schematically showing another step of the same resin expansion step as Figure 26.

Figure 29 is a plan view schematically showing another step of the same resin expansion step as Figure 26.

FIG. 30 is a plan view schematically showing an example of a procedure of a compression molding step of the method for producing a resin molded article of the present invention.

Figure 31 is a cross-sectional view schematically showing another step of the same compression molding step as Figure 30.

Figure 32 is a cross-sectional view schematically showing another step of the same compression molding step as Figure 30.

Figure 33 is a cross-sectional view schematically showing another step of the same compression molding step as Figure 30.

Figure 34 is a side view schematically showing an example of fluidity resin volume measurement using a displacement meter and a camera (part of a volume measuring mechanism) according to the present invention.

Figure 35 is a calculation of the discharge volume of the fluid resin of Figure 34. The block diagram of the main part.

36 is a side view schematically showing another example of fluidity resin volume measurement according to the present invention and using a displacement meter (a part of a volume measuring mechanism).

Next, the present invention will be described in further detail by way of examples. However, the invention is not limited to the following description.

In the present invention, the "flowable resin" is not particularly limited as long as it is a fluid resin, and examples thereof include a liquid resin, a molten resin and the like. In the present invention, the term "liquid" means fluidity at normal temperature (room temperature) and has fluidity to a degree by which a force acts, and does not involve the level of fluidity, in other words, Does not involve the degree of viscosity. In the present invention, the "liquid resin" refers to a resin which has fluidity at normal temperature (room temperature) and has fluidity to such a degree that it flows by a force. In the present invention, the "molten resin" means a resin which is in a liquid state or has a fluidity state by melting, for example. The form of the molten resin is not particularly limited, and is, for example, a form that can be supplied to a cavity, a groove, or the like of a molding die.

In the present invention, "compression molding" means that a resin is supplied to a cavity of a molding die, and a resin is applied to a resin in a cavity while the molding die is clamped.

In the present invention, "coating" includes at least discharging the fluid resin. Further, in the present invention, "coating" may further include expanding the discharged fluid resin.

In the resin molding apparatus of the present invention, for example, the volume measuring mechanism includes a size measuring mechanism that measures a size of the fluid resin discharged in the coating area; and a measurement result calculation station from the size measuring mechanism A calculation unit for the volume of the fluid resin. Further, the size measuring means may be one or plural, and one type may be used alone or plural types may be used.

In the resin molding apparatus of the present invention, for example, the size measuring mechanism is a size measuring mechanism for measuring thickness, the calculation section is based on the length of the fluid resin discharged in the coating area and according to the size The thickness of the fluid resin measured by the measuring mechanism calculates the volume of the fluid resin.

In the resin molding apparatus of the present invention, for example, the size measuring mechanism is a size measuring mechanism for thickness measurement, and the volume measuring mechanism further includes a camera that captures an image of the fluid resin discharged in the coating area. The calculation unit may calculate the volume of the fluid resin based on an area of the fluid resin obtained from data captured by the camera and a thickness of the fluid resin measured by the size measuring mechanism.

In the resin molding apparatus of the present invention, for example, the dimension measuring mechanism is a dimension measuring mechanism for three-dimensional data measurement, and the calculation section may be based on three-dimensional data of the fluid resin obtained by measurement according to the dimension measuring mechanism. The volume of the fluid resin is calculated.

In the resin molding apparatus of the present invention, for example, the size measuring mechanism may be a displacement meter.

In the resin molding apparatus of the present invention, for example, the displacement gauge may be Displacement gauge for thickness measurement.

In the resin molding apparatus of the present invention, the displacement gauge may be, for example, a non-contact displacement gauge. In addition, the displacement gauge may be, for example, at least one of an electromagnetic wave displacement gauge, an ultrasonic displacement gauge, a capacitance displacement gauge, and an overcurrent displacement gauge. The electromagnetic wave displacement meter may be, for example, an optical displacement meter, or may be, for example, a laser displacement meter.

The resin molding apparatus of the present invention may further include, for example, a storage portion that stores data, and the storage portion may store at least one of a measurement result obtained by the size measuring mechanism and a calculation result obtained by the calculation unit.

In the resin molding apparatus of the present invention, for example, the discharge mechanism may further include a moving mechanism that moves the fluid resin to a discharge position of the application target. The moving mechanism may be, for example, an application target moving mechanism that moves the application target and relatively moves the discharge position of the fluid resin relative to the application target. The object to be coated moving means, for example, to move the object to be coated in a substantially horizontal direction.

The resin molding apparatus of the present invention may further include, for example, a resin expansion mechanism that expands the fluid resin discharged in the coating region. The resin expansion mechanism can expand the fluid resin by, for example, applying a force to the fluid resin discharged by the discharge mechanism.

The resin molding apparatus of the present invention may further include, for example, a conveying mechanism that conveys the object to be coated to the compression molding mechanism.

In the resin molding apparatus of the present invention, for example, the object to be coated is a release film, and may further include a cutting mechanism for cutting the release film. Further, the discharge mechanism may discharge the fluid resin on the release film cut by the cutting mechanism.

The resin molding apparatus of the present invention may be, for example, a module different from the discharge mechanism and the compression molding mechanism, and is detachably attachable to each other.

In the resin molding apparatus of the present invention, for example, the plurality of compression molding mechanisms are plural, the plurality of compression molding mechanisms are different modules, and the discharge mechanism and the plurality of compression molding mechanisms are different molds. The set, the discharge mechanism and at least one of the plurality of compression molding mechanisms are detachably mountable relative to each other at least one of the mechanisms.

The resin molding apparatus of the present invention may include, for example, a volume measuring mechanism control mechanism that is controlled by a computer program for volume measurement by the volume measuring mechanism of the fluid resin to be discharged.

The resin molding apparatus of the present invention may include, for example, a movement mechanism control mechanism that controls movement of the moving mechanism by a computer program.

In the resin molding apparatus of the present invention, for example, the resin expansion mechanism continuously expands from the landing position toward the peripheral portion of the coating region with respect to at least a portion of the fluid resin discharged by the discharge mechanism Flowable resin.

In the resin molding apparatus of the present invention, for example, the resin expansion mechanism can rotate the coating object, and centrifugal force acts on the fluid resin to expand the fluid resin.

The resin molding apparatus of the present invention may further include, for example, a resin expansion mechanism control mechanism that controls the operation of the resin expansion mechanism by a computer program.

In the resin molding apparatus of the present invention, for example, the resin expansion mechanism ejects a gas to the fluid resin, and the fluid is applied to the fluid resin by the gas to expand the fluid resin. Further, the shape of the gas discharge port of the resin expansion mechanism may be, for example, a shape in which the short axis and the long axis are substantially equal or a slit shape.

In the resin molding apparatus of the present invention, for example, the resin expansion mechanism can eject a heated gas as the gas.

The resin molding apparatus of the present invention may include, for example, a gas injection control mechanism that controls the injection of the gas by a computer program.

The resin molding apparatus of the present invention may further include, for example, a resin heating mechanism that heats the fluid resin discharged in the coating region.

The resin molding apparatus of the present invention may further include, for example, a fluid resin metering mechanism that measures the fluid resin.

The resin molding apparatus of the present invention may further include, for example, a sensor that detects the fluid resin on the coating region in order to control the resin expansion mechanism.

The resin molding apparatus of the present invention may further comprise, for example, the film fixing station that fixes the release film.

The resin molding apparatus of the present invention may include, for example, the resin expansion mechanism, the compression molding mechanism is plural, and the plurality of compression molding mechanisms are separately disposed in different modules, and at the same time, the discharge mechanism and the resin At least one of the expansion mechanisms is configured as a different module than the compression molding mechanism, and at least one of the modules is detachably mountable relative to the other at least one of the modules.

In the resin molding apparatus of the present invention, for example, at least one of the discharge mechanism, the resin expansion mechanism, and the compression molding mechanism is disposed at least in a different module from at least one of the other modules, at least one of the modules It is detachable from each other with respect to at least one of the other modules.

The resin molding apparatus of the present invention may further include, for example, a moving mechanism that moves the fluid resin relative to a discharge position of the coating object, at least one of the moving mechanism, the discharge mechanism, and the compression molding mechanism being relatively The other at least one of the modules is separately disposed in different modules, and at least one of the modules is detachable from each other with respect to the other at least one of the modules. As described above, the moving mechanism may be an application target moving mechanism that relatively moves the discharge position of the fluid resin relative to the application target, by moving the object to be coated. Further, in this case, the resin molding apparatus of the present invention further includes the resin expansion mechanism, and the resin expansion mechanism is disposed separately from the other modules and can be attached and detached from each other with respect to the other at least one mechanism.

The resin molding apparatus of the present invention may further include, for example, a movement mechanism control mechanism that controls movement of the movement mechanism by a computer program, the movement mechanism control mechanism, the movement mechanism, the discharge mechanism, and the compression molding mechanism At least one of the modules is disposed separately from the other modules, and at least one of the modules is detachably mountable relative to the other at least one of the modules. Further, in this case, the resin molding apparatus of the present invention may further include the resin expansion mechanism, which is disposed separately from the other modules and detachably attached to each other with respect to the other at least one mechanism.

In the resin molding apparatus of the present invention, for example, the resin expansion mechanism ejects a gas to the fluid resin, and expands the fluid resin by applying a force to the fluid resin by the gas, and at the same time A gas injection control mechanism for controlling the gas injection by a computer program, at least one of the gas injection control mechanism, the discharge mechanism, the resin expansion mechanism, and the compression molding mechanism being separately disposed with respect to at least one of the other At least one of the modules is detachable from each other with respect to the other at least one of the modules.

The resin molding apparatus of the present invention may further comprise, for example, a resin heating mechanism that heats the fluid resin discharged in the coating region, at least one of the resin heating mechanism, the discharge mechanism, and the compression molding mechanism being relatively The other at least one of the modules is separately disposed in different modules, and at least one of the modules is detachable from each other with respect to the other at least one of the modules. Further, in this case, the resin molding apparatus of the present invention further includes the resin expansion mechanism which is disposed separately from the other modules with respect to the other at least one mechanism, and is detachably attachable to each other.

The resin molding apparatus of the present invention may further include, for example, a fluid resin metering mechanism that measures the fluid resin, at least one of the fluid resin metering mechanism, the discharge mechanism, and the compression molding mechanism with respect to at least one other Separately disposed in different modules, at least one of the modules is detachable from each other with respect to the other at least one of the modules. Further, in this case, the resin molding apparatus of the present invention further includes the resin expansion mechanism, which is disposed separately from the other modules with respect to the other at least one mechanism, and is detachably attachable to each other.

The resin molding apparatus of the present invention may further include, for example, a conveyance mechanism that conveys the object to be coated to the compression molding mechanism, and at least one of the conveyance mechanism, the discharge mechanism, and the compression molding mechanism is at least one other than the other One module is separately disposed in different modules, and at least one of the modules is detachable from each other with respect to the other at least one of the modules. Further, in this case, the resin molding apparatus of the present invention further includes the resin expansion mechanism which is disposed separately from the other modules and can be attached and detached from each other with respect to the other at least one mechanism.

In the resin molding apparatus of the present invention, for example, the object to be coated is a release film, and may further include a cutting mechanism that cuts the release film, the cutting mechanism, the discharge mechanism, and the At least one of the compression molding mechanisms is disposed in different modules relative to the other at least one of the modules, and at least one of the modules is detachably mountable with respect to the other at least one of the modules. Further, in this case, the resin molding apparatus of the present invention further includes the resin expansion mechanism, and the resin expansion mechanism is disposed separately from the other modules and can be attached and detached from each other with respect to the other at least one mechanism.

With regard to the method of producing a resin molded article of the present invention, for example, the volume measuring step may include a size measuring step of measuring a size of the fluid resin discharged in the coating region; and a measurement result from the size The calculation step of calculating the volume of the fluid resin.

In the method of producing a resin molded article of the present invention, for example, in the dimension measuring step, the size of the fluid resin is measured by a displacement meter.

In the method of producing a resin molded article of the present invention, for example, in the dimension measuring step, at least the discharged fluid resin can be measured. thickness.

In the method for producing a resin molded article of the present invention, for example, in the volume measuring step, the volume of the fluid resin is calculated based on the thickness and area of the discharged fluid resin.

In the method of manufacturing a resin molded article of the present invention, for example, in the dimension measuring step, three-dimensional data of the fluid resin discharged is measured, and in the volume measuring step, based on the flow discharged The three-dimensional data of the resin is used to calculate the volume of the fluid resin.

The method for producing a resin molded article of the present invention may, for example, further comprise a storage step of storing data in which at least one of the measurement result of the size and the calculation result of the volume of the fluid resin is stored.

In the method for producing a resin molded article of the present invention, for example, the discharging step may further include a moving step of relatively moving the discharge position of the fluid resin with respect to the object to be coated.

The method for producing a resin molded article of the present invention may further include, for example, a resin expanding step of expanding the fluid resin discharged by the discharge mechanism. In the resin expanding step, for example, a force may be applied to the fluid resin to expand.

The method for producing a resin molded article of the present invention may further include, for example, a step of transporting the object to be coated to a place where the compression molding step is performed.

In the method for producing a resin molded article of the present invention, for example, the object to be coated is a release film, and further includes cutting to cut the release film. In the discharging step, the fluid resin may be discharged on the release film cut by the cutting step.

In the method for producing a resin molded article of the present invention, for example, the discharge position of the fluid resin in the resin discharge step can be relatively moved with respect to the object to be coated. In this case, for example, the object to be coated can be moved to relatively move the discharge position of the fluid resin with respect to the object to be coated.

In the method for producing a resin molded article of the present invention, for example, in the volume measuring step, the measurement of the volume of the fluid resin discharged can be controlled by a computer program.

In the method for producing a resin molded article of the present invention, for example, in the resin expanding step, the expansion of the resin is controlled by a computer program.

In the method of producing a resin molded article of the present invention, for example, in the resin expanding step, the fluid resin continuous extending portion may be present from a falling position of the fluid resin toward a peripheral portion of the coating region. In the manner, the expansion of the fluid resin is performed.

In the method of producing a resin molded article of the present invention, for example, in the resin expanding step, the object to be coated is rotated, and centrifugal force is applied to the fluid resin to expand the fluid resin.

In the method for producing a resin molded article of the present invention, for example, in the resin expanding step, a gas can be sprayed to the fluid resin, and the gas is applied to the fluid resin by the gas to expand the solution. A fluid resin. For example, a heated gas as the gas can be injected. In addition, the ejection of the gas can be controlled, for example, by a computer program. In addition, for example In the resin expanding step, the distance between the gas discharge port and the surface of the fluid resin is fixed. Further, the gas is not particularly limited, but is preferably air, for example, from the viewpoints of cost and convenience.

In the method for producing a resin molded article of the present invention and the resin molding device of the present invention, for example, the coating region may be substantially circular or substantially rectangular or substantially square.

In the method of producing a resin molded article of the present invention, for example, in the resin expanding step, for at least a part of the fluid resin discharged in the discharging step, from a landing position toward the coating region The peripheral portion continuously expands the fluid resin.

In the method of producing a resin molded article of the present invention, for example, in the resin discharging step, the fluid resin is discharged at a central portion and a peripheral portion of the coating region, respectively.

In the method for producing a resin molded article of the present invention, for example, in the discharging step, the discharge position of the fluid resin may be at the same time as the fluid resin is dropped on the coating region. The fluid resin is discharged by moving in substantially the same direction as the outer circumferential direction of the coating region.

In the method for producing a resin molded article of the present invention, for example, in the discharging step, the fluid resin may be discharged while moving the discharge position of the fluid resin in a spiral shape.

The method for producing a resin molded article of the present invention may be divided into a plurality of virtual regions on the coating region, for example, in the discharging step. And discharging the fluid resin in each of the virtual regions, the virtual region being an area surrounded by the outer circumference, the center, and the radius of the coating region, and discharging the fluid resin in the virtual region The discharge position of the fluid resin proceeds in the virtual region from the center portion of the coating region toward the peripheral portion or from the peripheral portion of the coating region toward the center portion.

In the resin discharging method of the present invention, for example, in the resin discharging step, the discharge position of the fluid resin may be moved in a direction substantially matching the outer circumferential direction of the coating region, The central portion of the coating region is moved toward the peripheral portion or from the peripheral portion of the coating region toward the central portion.

In the method for producing a resin molded article of the present invention, for example, in the discharging step, the moving speed of the discharge position of the fluid resin can be kept substantially constant.

In the method of producing a resin molded article of the present invention, for example, in the discharging step, the moving angular velocity of the discharge position of the fluid resin may be made slower from the center portion of the coating region toward the peripheral portion.

In the method for producing a resin molded article of the present invention, for example, in the discharging step, the movement of the discharge position of the fluid resin can be controlled by a computer program.

In the method for producing a resin molded article of the present invention, for example, in the discharging step, the discharge position of the fluid resin can be relatively moved with respect to the object to be coated. For example, the object to be coated can be moved to make the discharge position of the fluid resin relative to the object to be coated. Move on the ground. For example, the object to be coated can be moved in a substantially horizontal direction. Further, for example, the movement of the discharge position of the fluid resin can be controlled by a computer program.

The method for producing a resin molded article of the present invention may, for example, further comprise a resin heating step of heating the fluid resin discharged in the coating region. The resin heating step can be performed, for example, by spraying the heated gas.

The method for producing a resin molded article of the present invention may, for example, further comprise a resin metering step of measuring the fluid resin.

In the method for producing a resin molded article of the present invention, for example, the object to be coated may be a release film. Further, for example, the discharging step can be performed in a state where the release film is fixed to the film fixing table.

In the method for producing a resin molded article of the present invention, for example, a frame may be placed on the object to be coated, and the inside of the frame may be used as the coating region to discharge the resin.

In the method for producing a resin molded article of the present invention, for example, the state of the fluid resin may be liquid or paste. Further, for example, the fluid resin may be a liquid resin having fluidity at normal temperature.

The method for producing a resin molded article of the present invention may, for example, perform the discharging step and the compression molding step at different places, and further include carrying the coating object to perform the compression molding before the compression molding step The carrying step of the place of the step. Further, the carrying step may be performed simultaneously with expanding the fluid resin, that is, simultaneously with the resin expanding step, or in a state where the fluid resin is expanded. Next, that is, after the resin expansion step.

In the manufacturing method of the first electronic component of the present invention, the resin molded article is an electronic component, and in the compression molding step, the invention in which the wafer is subjected to resin encapsulation by compression molding to manufacture the electronic component A method of producing a resin molded article.

The manufacturing method of the second electronic component of the present invention is an intermediate product manufacturing step including manufacturing the electronic component as an intermediate product by the manufacturing method of the first electronic component of the present invention, and manufacturing from the intermediate product The finished product manufacturing step of the other electronic components of the finished product is characterized by the method of manufacturing the electronic component of the finished product. Further, the method for producing the second electronic component of the present invention is to use the intermediate manufacturing method of the first electronic component of the present invention (the one embodiment of the method for producing a resin molded article of the present invention) as the middle. The electronic component (resin molded product) of the product is a method of manufacturing another product (other electronic component as a finished product). Therefore, the method of manufacturing the second electronic component of the present invention may be one embodiment of the method of manufacturing the product of the present invention.

The manufacturing method of the second electronic component of the present invention is as described above, and includes an intermediate product manufacturing step of manufacturing the electronic component as an intermediate product by the manufacturing method of the first electronic component of the present invention and from the intermediate product A method of manufacturing the electronic component as a finished product characterized by a finished product manufacturing step of other electronic components as a finished product. In the method of manufacturing the second electronic component of the present invention, for example, the intermediate product may include the wafer, the coating object, an encapsulating resin encapsulating the wafer, and in the product manufacturing step, The wafer and the encapsulating resin are removed The object to be coated. Further, for example, in the finished product manufacturing step, after the object to be coated is removed from the wafer and the encapsulating resin, a wiring member may be connected to the wafer.

Further, in general, "electronic component" refers to a case where a wafer before resin encapsulation is performed and a state in which a wafer is subjected to resin encapsulation, but in the present invention, in the case where only "electronic component" is mentioned, Unless otherwise indicated, it refers to an electronic component (as a finished electronic component) in which the wafer is resin-wrapped. In the present invention, the "wafer" means a wafer in a state in which at least a part of the wafer is not exposed by the resin, and the wafer including the resin package, a part of the resin-packaged wafer, and at least one of the plurality of wafers are exposed without being encapsulated by the resin. State of the wafer. Specific examples of the "wafer" of the present invention include wafers such as an IC, a semiconductor wafer, and a semiconductor element for power control. In the present invention, a wafer in a state in which at least a portion is not exposed by a resin is distinguished from an electronic component after resin encapsulation, and is referred to as a "wafer" for convenience. However, the "wafer" of the present invention is not particularly limited as long as it is a state in which at least a part of the wafer is exposed without being encapsulated by a resin, and may not be in the form of a wafer.

Hereinafter, specific embodiments of the present invention will be described based on the drawings. For convenience of explanation, the respective drawings are schematically described by appropriately omitting, exaggerating, and the like.

Example 1

In the present embodiment, an example of the resin molding apparatus, the method of producing the resin molded article, and the method of producing the product of the present invention will be described.

[1. Resin molding device]

First, an example of the resin molding apparatus of the present invention will be described.

(1) Discharge mechanism

Fig. 1 is a side view schematically showing an example of a discharge mechanism of the resin molding apparatus of the present invention. As shown, the discharge mechanism has a table (fixing table) 12 and a dispenser 13. A release film 11 is placed and fixed on the upper surface of the table (fixing table) 12. The release film 11 can be, for example, a resin film. The release film 11 corresponds to an "application target" in which a fluid resin for resin encapsulation is applied to a coating region on the upper surface thereof. The release film 11 prevents the cured resin (encapsulation resin) obtained by curing the fluid resin after the resin package molding from adhering to the molding die, and facilitates the removal of the resin molded article. The table 12 can be moved or rotated, for example, in the biaxial direction (substantially horizontal direction) of X-Y, and can also be moved in the three-axis direction of X-Y-Z (that is, in any direction including at least one of the horizontal direction and the vertical direction). The release film 11 can be sucked and fixed to the table 12 by suction from a suction hole (not shown) on the upper surface of the table 12 by suction of a suction mechanism (not shown, for example, a pressure reducing pump or the like). Upper surface. The distributor 13 is a mechanism for discharging the fluid resin on the release film 11, and corresponds to a "discharge mechanism". A nozzle 14 is attached to the dispenser 13, and the fluid resin can be discharged from the front end discharge port of the nozzle 14 on the release film 11. The dispenser 13 is movable together with the nozzle 14 in the biaxial direction (substantially horizontal direction) of X-Y, whereby the discharge position of the fluid resin can be moved. In addition to or instead of this, the discharge position of the fluid resin can be moved by moving the table 12 in the biaxial direction (substantially horizontal direction) of X-Y. Further, the discharge mechanism of FIG. 1 may further have a resin expansion mechanism that expands the fluid resin discharged on the release film 11. The resin expansion mechanism can, for example, force And expanding the fluid resin. The resin expansion mechanism may be a mechanism that applies a force to and expands the fluid resin by moving the table 12 and the release film 11 (object to be coated) together as will be described later. The fluid resin injects a gas, and the mechanism by which the gas acts to force and expand the fluid resin. Further, when a force is applied to the fluid resin by the operation of the table 12 and the fluid resin is expanded, the table 12 functions as a part of the resin expansion mechanism.

(2) Volume measuring mechanism

Fig. 2 is a side view schematically showing an example of a volume measuring mechanism of the resin molding apparatus of the present invention. This volume measuring mechanism has a laser displacement gauge 15, a calculation unit, and a storage unit (not shown) shown in Fig. 2 . 2 shows a state in which the laser displacement gauge 15 is placed above the table 12 and the release film 11 instead of the distributor 13 and the nozzle 14 of FIG. The laser displacement meter 15 can measure at least the thickness of the fluid resin (not shown) discharged from the release film 11 by the dispenser 13 and the nozzle 14, as will be described later. The calculation unit can calculate the volume of the fluid resin using the measurement results of the laser displacement meter 15. The storage unit may store at least one of the measurement result obtained by the laser displacement meter 15 and the calculation result obtained by the calculation unit. Further, the laser displacement meter 15 may be, for example, a laser displacement meter capable of measuring three-dimensional data of a fluid resin as in the third embodiment to be described later. Further, at least a part of the calculation unit and at least a part of the storage unit may be built in the laser displacement meter 15 .

In addition, the volume measuring mechanism can be advanced as shown in the side view of FIG. The camera 16 is provided in one step. FIG. 3 shows a state in which the camera 16 is placed above the stage 12 and the release film 11 instead of the laser displacement meter 15 of FIG. The camera 16 can image an image (planar shape) of a fluid resin (not shown) discharged on the release film 11, for example, as will be described later. Then, based on the image captured by the camera 16, the arithmetic unit can calculate the area of the fluid resin to be discharged. Then, the volume of the fluid resin can be calculated from the area of the fluid resin and the thickness of the fluid resin measured by the laser displacement meter 15. Further, a part of the calculation unit may be incorporated in the camera 16 and the area of the fluid resin may be calculated, and another part of the calculation unit may be incorporated in the laser displacement meter 15 to calculate the volume of the fluid resin.

(3) Compression molding mechanism

Fig. 4 is a cross-sectional view schematically showing an example of a compression molding mechanism of the resin molding apparatus of the present invention. As shown, the compression molding mechanism has a molding die 531 and a mold clamping mechanism 115. The molding die 531 is composed of an upper die 101 and a lower die 102. In the upper mold 101, the upper end thereof is fixed to the fixed platen 111 and hangs from the lower surface of the fixed platen 111. The lower mold 102 is placed on the movable platen 112. The movable platen 112 can be raised and lowered in the vertical direction as will be described later.

The lower mold 102 has a lower mold base member 103, a lower mold cavity side member 104, an elastic member 105, and a lower mold cavity bottom surface member 106 as shown. The lower mold base member 103 is placed on the upper surface of the movable platen 112. The lower mold cavity bottom surface member 106 is mounted on the upper surface of the lower mold base member 103 and constitutes the bottom surface of the lower mold cavity 532. The lower mold cavity side surface member 104 is a frame-shaped member that is disposed to surround the periphery of the lower mold cavity bottom surface member 106, and is attached to the upper surface of the lower mold base member 103 by the elastic member 105, and is configured. The side of the lower mold cavity 532. The lower mold 102 constitutes a lower mold cavity 532 by a lower mold cavity bottom surface member 106 and a lower mold cavity side surface member 104. Further, in the lower mold 102, for example, a heating mechanism (not shown) for heating the lower mold 102 is provided. By heating the lower mold 102 with the heating mechanism, for example, the resin in the lower mold cavity 532 is heated to be solidified.

The mold clamping mechanism 115 is a mechanism for performing mold clamping and mold opening of the mold, and as shown in the drawing, has a transfer member 117 that drives the source 116 and transmits the driving force of the drive source 116. Further, the lower surface (lower end) of the movable platen 112 is coupled to the drive source 116 by a transfer member 117. In addition, the drive source 116 is disposed on the base 113. By moving the movable platen 112 up and down by the drive source 116, the lower mold 102 provided thereon can be moved up and down. That is, the mold clamping mechanism 115 can mold the molding die by driving the movable platen 112 upward, and can mold the molding die by driving the movable platen 112 downward. The drive source 116 is not particularly limited, but for example, an electric motor such as a servo motor can be used. The conveying member 117 is not particularly limited, but may be constituted by, for example, a ball screw. Further, for example, a hydraulic cylinder may be used as the drive source 116, and a mold clamping mechanism 115 may be configured using the tie rod as the transfer member 117. Further, the clamping mechanism 115 can be configured using a toggle mechanism.

Further, a tie bar (columnar member) 114 is disposed as a holding member at each of the four corners of the base 113, the movable platen 112, and the fixed platen 111. Specifically, the upper ends of the four tie bars 114 are fixed to the four corners of the fixed platen 111, and the lower ends are fixed to the four corners of the base 113. Further, holes are formed in the four corners of the movable platen 112, and the tie bars 114 are respectively penetrated. Also, the movable platen 112 is movable up and down along the tie bar 114. In addition, In the tie rod (holding member) 114, a wall member such as a Hold frame (registered trademark) can be used instead of the tie rod (columnar member). The wall member may be disposed, for example, between the movable platen 112 and the surface of the fixed platen 111 facing each other.

Further, a mechanism for lifting and lowering the cavity bottom member 106 using the mold clamping mechanism 115 is shown in FIG. 4, but the present invention is not limited thereto. For example, in addition to the mold clamping mechanism 115, a structure in which another driving mechanism for moving the lower mold cavity bottom surface member 106 is provided may be provided. If this configuration is used, the elastic member 105 may not be used.

(4) The overall structure of the resin molding apparatus

Next, a plan view of Fig. 5 schematically shows an example of the structure of the resin molding apparatus of the present invention. The resin molding apparatus of the figure is an apparatus for manufacturing an electronic component (resin molded product). As shown in the figure, the apparatus is arranged in parallel with a release film cutting module (release film cutting mechanism) 510, a discharge mechanism (coating module) 520, and a compression molding mechanism (compression molding module). 530, a transport mechanism (transport module) 540, and a control unit 550. The modules are separately separated, but the adjacent modules can be mounted and removed from each other. As described later, the coating module 520 includes a discharge mechanism for discharging the flowable resin for resin molding in the coating region on the release film (application target). In addition, as described later, the coating module 520 includes a discharge mechanism (discharge module) that discharges the fluid resin, and a resin expansion mechanism (resin expansion module) that expands the fluid resin. In addition, the apparatus of FIG. 5 further includes a volume measuring mechanism that measures the volume of the fluid resin discharged. The volume measuring means further includes a laser displacement meter (not shown) and an arithmetic unit and a storage unit (not shown) included in the control unit 550, as will be described later. The calculation The volume of the discharged fluid resin is calculated, for example, based on the measurement data of the laser displacement meter 15. Further, in the case of using the camera 16, for example, as in the second embodiment described later, the photographed data of the camera 16 can be subjected to image processing and the area of the discharged fluid resin can be calculated. The storage portion stores, for example, data on the measurement results of the laser displacement meter. Specifically, for example, as described later, the measurement data of the measurement result of the laser displacement meter may be stored, and the data calculated by the calculation unit based on the measurement result of the laser displacement meter may be stored. Further, in the configuration in which the camera 16 is provided, for example, the storage unit may store the photographed data of the camera 16, or may store an area calculated based on the photographed data and the calculation unit. Further, as described above, at least a part of each of the calculation unit and the storage unit may be built in the laser displacement meter 15. Further, as described above, a part of the calculation unit may be built in the camera 16, and another part of the calculation unit may be built in the laser displacement meter 15.

Further, in order to shorten the measurement time, the laser displacement meter 15 and the camera 16 can each be provided in plural.

The release film cutting module (release film cutting mechanism) 510 can cut and separate the circular release film from the long release film. As shown in the figure, the release film cutting module 510 includes a film fixing stage mounting mechanism 511, a roll release film 512, and a film holder 513. The table 12 of FIG. 1 (not shown in FIG. 5) is placed on the upper surface of the film fixing stage mounting mechanism 511. As described above, the table 12 is a fixing table for fixing the release film 11, and may be referred to as a "film fixing table." As shown in the figure, the front end of the release film 11 can be pulled out from the roll release film 512 and covered on the table 12 placed on the film fixing table mounting mechanism 511. The surface and the release film can be fixed on the table 12. The film holder 513 can fix the front end of the release film pulled out from the roll release film 512 to the side opposite to the roll release film 512 as seen from the film fixing stage mounting mechanism 511, and can The release film is pulled out from the roll release film 512. On the film fixing stage mounting mechanism 511, the release film can be cut by a cutter (not shown) to form a circular release film 11. Further, the release film cutting module 510 includes a waste processing mechanism (not shown) that processes the release film (waste) remaining after the circular release film 11 is cut and separated.

The coating module 520 includes a discharge mechanism, a resin mounter (resin transport mechanism) 521, and a post-processing mechanism 522. As described in FIG. 1, the discharge mechanism includes a release film 11, a table (fixing table) 12, and a dispenser 13 (discharge mechanism) to which the nozzle 14 is attached. In addition, since FIG. 5 is a plan view (top view), the table 12 is hidden from the release film 11, and is not shown. In addition, in FIG. 5, the nozzle 14 is hidden in the dispenser 13, and is not shown. In addition, in FIG. 5, the discharge mechanism further includes a film fixing stage moving mechanism 523. A table 12 and a release film 11 are placed on the film holding table moving mechanism 523. The table 12 and the release film 11 placed thereon can be moved or rotated together by moving or rotating the film fixing table moving mechanism 523 in the horizontal direction. In the figure, the film fixing table moving mechanism 523 is the same as the above-described film fixing table mounting mechanism 511, and is movable between the release film cutting module 510 and the coating module 520. Further, the film fixing table moving mechanism 523 can apply a force to and expand the fluid resin by moving or rotating the table 12 together with the release film 11. Therefore, the film fixing table moving mechanism 523 corresponds to the "resin expansion" of the resin molding device of Fig. 5 In addition, as a resin expansion mechanism that applies a force to and expands the fluid resin, a vent nozzle (not shown in FIG. 5) or the like may be further included as will be described later. Further, coating The module 520 may further include a camera (sensor), a heater, etc. as will be described later. Further, the resin mounter 521 and the post-processing mechanism 522 may be integrally formed. Using the resin mounter 521, The frame member (circular) is attached to the release film 11 (on the resin accommodating portion) fixed to the lower end surface of the frame member (circular frame) and supplied with the fluid resin 21 (not shown in FIG. 5). In this state, the release resin can be supplied in the lower mold cavity for compression molding, which will be described later, in the state in which the release film 11 is applied.

The compression molding module 530 includes a molding die 531 as shown. The molding die 531 is not particularly limited, but may be, for example, a metal mold. The upper mold and the lower mold (not shown) of the molding die 531 are main members, and the lower mold cavity 532 is circular as shown. The molding die 531 is further provided with an upper die substrate mounting portion (not shown) and a lower mold cavity bottom surface member (not shown) for resin pressurization. In the compression molding module 530, a wafer (for example, a semiconductor wafer) mounted on a resin package front substrate (pre-molding substrate) to be described later is resin-sealed in a sealing resin (resin package) to form a resin in a lower mold cavity. The packaged substrate (molded substrate). The compression molding module 530 may include, for example, a compression molding mechanism as shown in FIG. 4, and the molding die 531 may be, for example, a molding die 531 as shown in FIG.

The transport mechanism (transport module) 540 can transport the wafer (resin package object) before resin encapsulation together with the substrate, and can carry the resin package After the electronic components (resin molded products). As shown in the figure, the transport mechanism (transport module) 540 includes a substrate mounter 541, a rail 542, and a robot arm 543. The rail 542 protrudes from the transport mechanism (transport module) 540 and reaches the area of the compression molding module 530 and the coating module 520. The substrate mounter 541 can mount the substrate 544 thereon. The substrate 544 may be a resin-packaged front substrate (pre-molded substrate) 544a, or may be a resin-encapsulated substrate (molded substrate) 544b. The substrate mounter 541 and the resin mounter 521 (post-processing mechanism 522) are movable on the rail 542 between the coating module 520, the compression molding module 530, and the transport module 540. Further, as shown in the figure, the transport module 540 includes a substrate housing portion that accommodates a resin package front substrate (preformed substrate) 544a and a resin packaged substrate (molded substrate) 544b. A wafer (not shown, for example, a semiconductor wafer) is mounted on the substrate 544a before molding. The molded substrate 544b is encapsulated by a resin (encapsulated resin) obtained by curing the wafer with a fluid resin to form an electronic component (resin molded article). The robot arm 543 can be used, for example, as follows. In other words, first, the pre-molded substrate 544a taken out from the accommodating portion of the pre-molding substrate 544a can be reversely mounted on the substrate mounting surface 541 by the front and back surfaces being reversed. Secondly, the molded substrate 544b can be taken out from the substrate mounter 541 and the front and back surfaces can be reversed, and the molded substrate 544b can be accommodated in the accommodating portion of the molded substrate with the package resin side facing upward.

The control unit 550 controls the cutting of the release film, the discharge of the fluid resin, the expansion of the fluid resin, the conveyance of the package substrate and the packaged substrate, the conveyance of the resin material, the conveyance of the release film, the heating of the molding die, and the molding. Mold clamping and mold opening. In other words, the control unit 550 performs the release film cutting Control of each operation of the module 510, the coating module 520, the compression molding module 530, and the handling module 540. As described above, the resin molding apparatus of the present invention can control the respective members by the control unit and function as a fully automatic machine. Alternatively, the resin molding apparatus of the present invention may function as a manual machine without depending on the control unit, but it is effective to control the respective members by the control unit. Further, the control unit 550 includes an arithmetic unit and a storage unit (not shown). Further, the apparatus of FIG. 5 includes a laser displacement meter (not shown), and the laser displacement meter, the calculation unit, and the storage unit constitute a volume measurement for measuring the volume of the fluid resin discharged. mechanism. In addition, the volume measuring mechanism may further include a camera, for example, as described later. Further, the laser displacement meter is not limited thereto, and may be, for example, the other displacement gauge described above.

The arrangement position of the control unit 550 is not limited to the position shown in FIG. 5, and may be arbitrarily arranged, for example, on at least one of the modules 510, 520, 530, and 540, and may be disposed outside each module. Further, the control unit 550 can be configured as a plurality of control units that separate at least a part based on the operation of the controlled object.

In addition, the plan view of Fig. 6 schematically shows another example of the structure of the resin molding apparatus of the present invention. The resin molding apparatus of this figure is the same as the resin molding apparatus of FIG. 5 except that it has two compression molding modules 530 and two compression molding modules 530 are arranged adjacent to each other between the coating module 520 and the conveyance module 540. In addition, in the resin molding apparatus of FIG. 6, the transport module 540 and the compression molding module 530 adjacent thereto are detachable from each other, or the coating module 520 and the compression molding module 530 adjacent thereto are detachable from each other, and Or both sides can be installed and removed. Further, two pressures The shrink molding modules 530 are detachable from each other.

In the resin molding apparatus of FIGS. 5 and 6, as described above, the transport module 540 that supplies the substrate and the coating module 520 that discharges the fluid resin on the release film sandwich the compression molding module 530 and are disposed to face each other. Further, a release film cutting module 510 that forms a circular release film is disposed outside the coating module 520. This resin molding apparatus is a separate resin molding apparatus in which the respective modules are separately arranged. Further, the arrangement of the respective modules of the resin molding apparatus of the present invention is not particularly limited, and may be arranged other than the arrangement of FIGS. 5 and 6. For example, a structure in which a compression molding module is disposed in a required number and can be attached and detached can be employed. Further, the release film cutting module (circular release film forming module), the coating module, and the transfer module (substrate module) can be disposed close to the side of the compression molding module. In this case, the release film module, the coating module, and the substrate module become the mother module, and the compression molding module becomes the sub-module (mother-child type). In this case, the required number of compression molding modules can be arranged in order. In addition, the release film cutting module, the coating module, and the transfer module (substrate module) can be integrated. In addition, the release film cutting module, the coating module, and the transfer module (substrate module) can be integrated with one molding module, and the integrated components are integrally formed as a resin molding device (for example, a compression molding device). Play alone.

Further, in the case where a plurality of compression molding modules are disposed between the transportation module (substrate module) and the coating module, and in the case where a plurality of compression molding modules are sequentially disposed with respect to the mother module, it is preferably The following configuration. That is, the molding modules are arranged side by side along the direction in which the members including the substrate mounting machine, the resin mounting machine, and the post-processing mechanism extend in the direction of movement. Set. Further, each of the modules of the resin molding apparatus of the present invention can be attached and detached to each other by, for example, a connection mechanism such as a bolt or a nut or a suitable positioning mechanism. In addition, other compression molding modules can be configured to be detachable from the compression molding module. This can increase or decrease the compression molding module afterwards.

[2. Method for Producing Resin Molded Article and Method for Producing Product]

Next, an example of a method for producing a resin molded article of the present invention and a method for producing the product will be described. More specifically, an example of a method of producing a resin molded article of the resin molding apparatus described with reference to FIGS. 1 to 6 will be described, and an example of a method for producing a product using the same will be described.

(1) Step of applying a fluid resin

First, an example of a step of applying a fluid resin for resin molding to a coating region of a coating object will be described with reference to FIGS. 1 to 3 . As described below, in the present embodiment, the step of applying the fluid resin includes a step of discharging a fluid resin for resin molding on a coating region of a coating object; and measuring discharge on the coating region a volume measuring step of the volume of the fluid resin; and a resin expanding step of expanding the fluid resin discharged on the coating region. However, in the present invention, the step of applying the fluid resin is not limited thereto.

(1-1) Coating step

First, a discharge step of discharging the fluid resin for resin molding is performed on the application region of the object to be coated. That is, the fluid resin is discharged from at least a part of the coating region on the release film 11 from the front end outlet of the nozzle 14 of Fig. 1 . In addition, the coating area on the release film 11 will be described later. Said. In this discharging step, for example, the discharge position of the fluid resin can be moved by moving the dispenser 13 and the nozzle 14 together in the biaxial direction (substantially horizontal direction) of X-Y. In addition to or instead of this, the discharge position of the fluid resin can be moved by moving the table 12 in the biaxial direction (substantially horizontal direction) of X-Y. Further, for example, the release film 11 (application target) can be vibrated together with the table 12 while discharging the fluid resin from the nozzle 14, and the nozzle 14 can be vibrated in addition to or in place of this.

Further, the fluid resin is not particularly limited, and may be a liquid resin or a molten resin. The definitions of "liquid resin" and "molten resin" are as described above. The fluid resin is preferably a liquid resin from the viewpoint of simple handling and the like. The liquid resin is not limited as long as it has fluidity at normal temperature (room temperature) as defined above, and may be in the form of a paste or a paste. Further, the fluid resin may be, for example, a thermoplastic resin or a thermosetting resin. The thermosetting resin is, for example, a liquid resin at normal temperature, and the viscosity is lowered by heating, and further heated to form a cured resin. In the present invention, the fluid resin is preferably a relatively high-temperature thermosetting resin which does not rapidly flow at a normal temperature after discharge, and is further preferably flowed by a force.

Further, for example, before the discharging step, a fluid resin measuring step of measuring the fluid resin using the fluid resin measuring mechanism may be performed. Thereby, not less than a predetermined amount of the fluid resin can be discharged on the release film 11. The fluidity resin measuring mechanism is not particularly limited, and for example, a measuring mechanism for a particulate resin (for example, a load cell for measurement) described in Patent Document 1 can be used. The measuring means can be arranged adjacent to each other, for example, in the vicinity of the dispenser 13.

7 to 13 schematically show an example of a resin discharge mode of the discharging step. Each of FIGS. 7 to 13 is a plan view showing a state in which the fluid resin 21 is discharged onto the release film 11 as an object to be coated. Each of FIGS. 7 to 13 is an example in which the release film 11 as an object to be coated is circular, and the application region 11a is circular. In FIGS. 7 to 13, the inner side of the region indicated by the dotted line (concentric circle slightly smaller than the outer circumference of the release film 11) is the coating region 11a. In the peripheral portion of the release film 11 (outside of the application region 11a), the fluid resin 21 is not applied, and the release film is used for the compression molding step to be described later.

FIG. 7 shows an example in which the release film 11 and the coating region 11a are circular, and the fluid resin 21 is discharged only at the center portion of the coating region 11a. Fig. 7(a) is a plan view, and Fig. 7(b) is a cross-sectional view taken along line I-I' of Fig. 7(a).

FIG. 8 shows an example in which the release film 11 and the coating region 11a are circular, and the fluid resin 21 is discharged in a spiral shape. Fig. 8(a) is a plan view, and Fig. 8(b) is a cross-sectional view taken along line II-II' of Fig. 8(a). In the discharge step of discharging the fluid resin 21 in a spiral shape, for example, it can be discharged from the center portion of the application region 11a toward the peripheral portion, and conversely, it can be discharged from the peripheral portion of the application region 11a toward the center portion.

The plan view of FIG. 9 shows that the release film 11 and the coating region 11a are circular, and the fluid resin 21 is discharged in a circular (annular) manner so as to surround the periphery of the coating region 11a while surrounding the coating region 11a. example. In Fig. 9, the number of the fluid resin 21 is one, but the present invention is not limited thereto, and a plurality of rings may be discharged concentrically. The plan view of Fig. 10 shows one such example. Figure 10 is the same as that of FIG. 9 except that the fluid resin 21 surrounding the center portion is used to discharge the two fluid resins 21 in a concentric manner. In addition, although there are two rings of the fluid resin 21 in FIG. 10, it is not limited to this, and may be three or more.

In the plan view of Fig. 11, the release film 11 and the application region 11a are circular, and the fluid resin 21 is discharged in a dot shape so as to be spread over almost all of the application regions 11a.

The plan view of FIG. 12 is an example in which the release film 11 and the application region 11a are circular, and the fluid resin 21 is radially discharged around the center portion of the application region 11a. In the discharge step of discharging the fluid resin 21 in a radial manner, for example, it can be discharged from the center portion of the application region 11a toward the peripheral portion, and conversely, it can be discharged from the peripheral portion toward the center portion.

The plan view of FIG. 13 is an example in which the release film 11 and the coating region 11a are circular, and the fluid resin 21 is discharged in a planar shape at the center portion of the coating region 11a. This figure is the same as that of FIG. 7 in that the fluid resin 21 is discharged on the center portion of the coating region 11a. However, the fluid resin 21 is discharged in a narrow range of the center portion of the coating region 11a with respect to FIG. 7, and FIG. 13 differs in that the discharge range of the fluid resin 21 is wide and the fluid resin 21 has a planar shape.

Although FIGS. 7 to 13 show an example in which the release film 11 and the coating region 11a are circular, FIGS. 14 to 18 show an example in which the release film 11 and the coating region 11a are square. In FIGS. 14 to 18, the inner side of the region indicated by the dotted line (a concentric square slightly smaller than the square of the outer circumference of the release film 11) is the coating region 11a. At the peripheral portion of the release film 11 (coating region 11a) On the outer side), the fluid resin 21 is not applied, and the release film for the compression molding step to be described later is held. Further, in the present invention, the shape of the application region is not limited thereto, and may be, for example, a substantially circular shape, a substantially rectangular shape, a substantially square shape, a substantially elliptical shape, a substantially triangular shape, a substantially hexagonal shape, substantially any other polygonal shape, or the like, and may be any shape. Further, in the present invention, the shape of the object to be coated is not particularly limited, and may be, for example, a substantially circular shape, a substantially rectangular shape, a substantially square shape, a substantially elliptical shape, a substantially triangular shape, a substantially hexagonal shape, or substantially any other polygonal shape. Any shape, but a substantially circular shape, a substantially rectangular shape, or a substantially square shape is preferable from the viewpoint of simple handling and the like. Further, in the present invention, the shape of the coating object and the shape of the coating region may be as shown in Figs. 7 to 13, but may be different.

FIG. 14 shows an example in which the release film 11 and the coating region 11a are square, and the fluid resin 21 is discharged only at the center portion of the coating region 11a. Fig. 14 (a) is a plan view, and Fig. 14 (b) is a cross-sectional view taken along line III-III' of Fig. 14 (a).

FIG. 15 shows an example in which the release film 11 and the coating region 11a are square and the fluid resin 21 is discharged in a spiral shape. Fig. 15 (a) is a plan view, and Fig. 15 (b) is a cross-sectional view taken along line IV-IV' of Fig. 15 (a). The spiral shape of the fluid resin 21 is substantially circular in FIG. 8, but in FIG. 15, as shown in the drawing, it is a substantially square spiral substantially along the outer peripheral shape of the release film 11. In the resin discharging step of discharging the fluid resin 21 in a spiral shape, as in Fig. 8, for example, it can be discharged from the center portion of the coating region 11a toward the peripheral portion, and conversely, it can be discharged from the peripheral portion toward the center portion. .

The plan view of Fig. 16 is an example in which the release film 11 and the application region 11a are square, and the fluid resin 21 is discharged in a dot shape so as to be spread over almost all of the application regions 11a.

In the plan view of Fig. 17, the release film 11 and the application region 11a are square, and the fluid resin 21 is radially discharged around the center portion of the coating region 11a. In the resin discharging step of discharging the fluid resin 21 in a radial manner, for example, it can be discharged from the center portion of the release film 11 toward the peripheral portion, and conversely, it can be discharged from the peripheral portion toward the center portion.

The plan view of Fig. 18 is an example in which the release film 11 and the application region 11a are square, and the fluid resin 21 is discharged in a planar shape at the center portion of the application region 11a. This drawing is the same as that of FIG. 14 in that the fluid resin 21 is discharged on the center portion of the coating region 11a. However, the fluid resin 21 is discharged in a narrow range of the center portion of the application region 11a with respect to FIG. 14 , and FIG. 18 differs in that the discharge range of the fluid resin 21 is wide and the fluid resin 21 is planar.

(1-2) Volume measurement step

Next, a volume measuring step of measuring the volume of the fluid resin discharged is performed. First, as shown in FIG. 2, the laser displacement meter 15 is placed above the stage 12 and the release film 11, and the thickness of the fluid resin (not shown) discharged on the release film 11 is measured. Specifically, for example, as shown in FIG. 19, the laser L1 is irradiated by the laser displacement meter 15 on the discharged fluid resin 21. Then, the laser light L2 reflected by the fluid resin 21 is measured by the laser displacement meter 15. Thereby, the thickness of the portion of the fluid resin 21 that is irradiated with the laser light L1 is measured. Further, as shown by the arrow M1 in the figure, along The thickness of each portion of the fluid resin 21 was measured in the same manner as the spiral displacement of the fluid resin 21 while moving the laser displacement meter 15 from the inside to the outside. At this time, the length of the fluid resin 21 may be measured at the same time or may not be measured. In the measurement of the length of the fluid resin 21, for example, the moving distance when the fluid resin 21 is measured using the laser displacement meter 15 can be used. The width of the fluid resin 21 is substantially constant depending on the shape of the discharge port of the nozzle 14 when the fluid resin 21 is discharged, and the length of the fluid resin 21 is basically determined, for example, by a discharge program determined in advance. Therefore, by measuring only the thickness of the fluid resin 21, the volume of the fluid resin 21 can be calculated substantially accurately. However, this is an example, and the present invention is not limited thereto. For example, as described above, the length can be measured while measuring the width of the fluid resin 21. Further, for example, as shown in FIG. 34 or FIG. 36 (Example 2 or Example 3) to be described later, one or both of the width and the length of the fluid resin 21 can be further measured in addition to the thickness of the fluid resin 21. In addition, if the volume of the fluid resin 21 can be calculated substantially accurately, it is not necessary to measure the thickness of the fluid resin 21.

In addition, although FIG. 19 shows an example in which the shape of the fluid resin 21 to be discharged is a spiral shape, the shape of the fluid resin 21 is not limited thereto, and may be any shape. The same applies to FIG. 34 and FIG. 36 which will be described later. In addition, in FIG. 19, illustration of the mold release film 11 and the coating area|region 11a is abbreviate|omitted for illustration. The same applies to FIG. 34 and FIG. 36 which will be described later.

Further, after measuring the thickness of the fluid resin 21, as shown in the schematic block diagram of FIG. 20, the volume of the fluid resin 21 is calculated and stored by the calculation unit 551 and the storage unit 552 included in the control unit 550. That is, first, the thickness data of the fluid resin 21 measured by the laser displacement meter 15 (measurement) As a result, it is transmitted to the calculation unit 551 (step S1). Then, the volume of the fluid resin 21 is used and the volume of the fluid resin 21 is calculated by the calculation unit 551 (calculation step). Then, the volume of the calculated fluid resin 21 is sent to the storage unit 552 (step S2), and further stored by the storage unit 552 (storing step). Alternatively, the measurement result of the laser displacement gauge 15 may be directly transmitted to the storage unit 552 (step S1A), and stored in the storage unit 552 (storing step). Then, the measurement result of the laser displacement meter 15 stored in the storage unit 552 can be transmitted to the calculation unit 551 (step S3), and using the result, the calculation unit 551 calculates the volume of the fluid resin 21 (calculation step). Further, the volume of the fluid resin 21 obtained by the calculation can be transmitted to the storage portion 552 (step S2), and stored by the storage portion 552 (storing step). The volume measuring step of measuring the volume of the discharged fluid resin 21 can be performed by the above. Further, at least a part of the calculation unit 551 or at least a part of the storage unit 552 may be built in the laser displacement meter 15 .

Further, in the storage portion 552, the information on the volume of the fluid resin 21 can be stored as a traceable tracking ability-related material in association with the resin molded article or a product using the same, and can be used to control the discharged fluid resin 21. The quantity can also be used to set the conditions of the manufacturing. The same applies to the second embodiment and the third embodiment to be described later.

Further, for example, in order to shorten the measurement time, the fluid resin can be measured by simultaneously using a plurality of laser displacement meters (sensors) 15 and measuring a part of the fluid resin 21 by the plurality of laser displacement meters, respectively. 21 overall. The same applies to the second embodiment and the third embodiment to be described later.

In addition, for example, the volume measurement of the fluid resin 21 can be performed by multiple times. And calculate the average value to improve the measurement accuracy. The same applies to the second embodiment and the third embodiment to be described later.

(1-3) Resin expansion step

Next, Fig. 21 and Fig. 22 show examples of the resin expanding step, respectively. In addition, although the case where the resin expansion step is performed is assumed here, in the present invention, the resin expansion step is arbitrary, and therefore it is a step which can be omitted if it is unnecessary.

Further, according to the example of FIG. 21 and FIG. 22, for example, the fluid resin can be continuously expanded from the falling position of the fluid resin (not shown) toward the peripheral portion of the coating region, but the method of expanding the fluid resin is not limited thereto. Further, specific examples of the resin discharge mode are, for example, the above-described FIGS. 7 to 18, and specific examples of the expansion mode of the fluid resin are, for example, FIGS. 23 to 29 which will be described later.

Here, the continuous expansion of the fluid resin from the falling position of the fluid resin toward the peripheral portion of the coating region means that, for example, when the falling position of the fluid resin is near the one end side of the coating region, the other end facing the coating region is included. The peripheral portion near the side expands. Therefore, in this case, the fluid resin is continuously expanded from the vicinity of one end side of the coating region toward the center portion, and further, the fluid resin is continuously expanded from the center portion of the coating region toward the peripheral portion near the other end side.

First, Fig. 21 shows an example of a resin spreading step. In this step, a force is applied to and spreads the fluid resin (not shown) discharged on the upper surface of the release film 11. For example, the worktable 12 is moved in the biaxial direction (substantially horizontal direction) of X-Y by a drive mechanism (not shown), and the release film 11 and the table 12 are moved together. Thus, the force acts on and expands the discharged mobility tree. fat. In other words, the drive mechanism of the table 12 corresponds to a "application object drive mechanism" that applies a force to the release film 11 by moving the release film 11 (application target) and spreads the fluid resin. The operation of the table 12 can be, for example, a horizontal movement or a rotation. For example, the table 12 can be rotated by the drive mechanism, and a force can be applied to and expand the fluid resin by centrifugal force. The drive mechanism for the rotary table 12 is not particularly limited, and for example, a spin coater or the like can be used. At this time, a resin heating step of heating the fluid resin discharged on the release film 11 by a heater (resin heating mechanism) 17 can be performed. Thereby, the viscosity of the fluid resin can be lowered to promote the expansion (expansion) of the fluid resin. Further, the resin heating step may be performed, for example, simultaneously with the resin expansion step, and may also be performed before the resin expansion step. The heater 17 is not particularly limited, and for example, an infrared lamp (for example, a far-infrared lamp), a halogen lamp (halogen heater), a warm air (heated gas) blowing mechanism, a table built-in electric heater, or the like can be used. At this time, for example, the expansion of the fluid resin can be detected by the camera (sensor) 18, and the movement (for example, the number of rotations, etc.) of the table 12, the amount of gas blow, and the like can be controlled based on the detection result. Thereby, for example, it is possible to prevent the fluid resin from excessively expanding and overflowing from the coating region. The operation of the workbench 12 can be controlled, for example, by a computer program. In addition, the control by the camera (sensor) 18 can be performed in advance in the condition setting stage, and the discharge step of discharging the fluid resin can be performed according to the conditions at the time of actual resin molding.

In addition, FIG. 22 shows another example of the resin expanding step. In the figure, in place of the moving table 12, a gas (not shown) discharged from the upper surface of the release film 11 is ejected by a vent nozzle (gas injection mechanism) 19, and The fluid is applied to and expands the fluid resin by the gas. In the vent nozzle 19, the shape of the gas discharge port is not particularly limited, but may be, for example, a hole shape having substantially the same short axis and a long axis or an elongated slit shape. The gas injected by the vent nozzle 19 is not particularly limited, but may be, for example, a high pressure gas such as compressed air or compressed nitrogen. At this time, if the heated gas is ejected, it is possible to reduce the viscosity of the liquid resin and to facilitate the expansion. At this time, as in the method of FIG. 21, the expanded state of the fluid resin can be detected by the camera (sensor) 18, and the gas injection by the vent nozzle 19 can be controlled based on the detection result. The gas injection by the venting nozzle 19 can be controlled, for example, by a computer program. Further, for example, in the resin expanding step, the distance between the gas discharge port of the vent nozzle 19 and the surface of the fluid resin can be controlled to be fixed. Thereby, for example, the gas pressure applied to the surface of the fluid resin is fixed, and the dispersion variation of the fluid resin can be reduced. Further, for example, in the resin expanding step, the fluid resin can be expanded by injecting a gas to the fluid resin while moving one or both of the vent nozzle 19 and the fixing table 12 in the X-Y direction.

Further, for example, in the resin expanding step, a method of moving the release film (application target) 11 and a method of ejecting a gas to the fluid resin as shown in Fig. 22 may be used together. Thereby, the fluid resin becomes easier to flow and easily expands.

As described above, the fluid resin for resin molding can be applied to the coating region on the release film (application target) 11.

Further, FIGS. 23 to 29 show an example of a fluid resin expansion mode using a resin expansion step by gas injection. Figure 23 shows and The same release film 11 and coating region 11a of FIG. 7 are circular, and the fluid resin 21 is discharged only at the center of the coating region 11a. Fig. 23(a) is a longitudinal sectional view of the air nozzle (venting nozzle) 19, Fig. 23(b) is a transverse sectional view of the air nozzle 19, and Fig. 23(c) is a view schematically showing the mode of the resin expanding step. Floor plan. As shown in the figure, in this example, the shape of the gas discharge port of the air nozzle 19 is a substantially circular hole shape. In this example, by moving one or both sides of the air nozzle 19 and the fixed stage 12 in the XY direction, a gas is sprayed on the fluid resin, and the fluid resin 21 is applied from the coating region 11a as shown in the drawing. The center portion expands toward the peripheral portion.

Fig. 24 shows an example in which the release film 11 and the coating region 11a are square, and the fluid resin 21 is discharged only at one end (near one side of the square) of the coating region 11a. Fig. 24 (a) is a longitudinal sectional view of the air nozzle 19, Fig. 24 (b) is a transverse sectional view of the air nozzle 19, and Fig. 24 (c) is a plan view schematically showing a mode of the resin expanding step. As shown in the figure, in this example, the shape of the gas discharge port of the air nozzle 19 is an elongated slit shape. In this example, by moving one or both of the air nozzle 19 and the fixing table 12 (not shown) in the XY direction, the gas is injected into the fluid resin as shown in FIG. 24(c). The fluid resin 21 is expanded from one end of the coating region 11a toward the other end.

Fig. 25 shows an example in which the release film 11 and the coating region 11a are square, and the fluid resin 21 is discharged at the center portion and the four corners of the coating region 11a. Fig. 25(a) is a longitudinal sectional view of the air nozzle 19, Fig. 25(b) is a transverse sectional view of the air nozzle 19, and Fig. 25(c) is a plan view schematically showing a mode of the resin expanding step. As shown in the figure, in this example, The shape of the gas discharge port of the air nozzle 19 is a substantially circular hole shape. Further, in the present example, the air nozzles 19 are provided at respective positions corresponding to the central portion of the coating region 11a and the resin discharge positions of the four corners. In Fig. 25, the amount of the fluid resin discharged at the center portion is more than the four corners, and correspondingly, the desired discharge port of the air nozzle 19 is also larger in the center portion than the four corners. Then, as shown in (c) of FIG. 24, the fluid resin 21 is expanded by injecting gas from the respective air nozzles 19 to the fluid resin 21.

26 to 29 are stepped plan views showing an example in which the release film 11 and the coating region 11a are square, and the fluid resin 21 is discharged only at the center portion of the coating region 11a. In this example, the shape of the gas discharge port of the air nozzle 19 is an elongated slit shape. First, as shown in FIG. 26, the fluid resin 21 is discharged only at the center portion of the coating region 11a. Then, as shown in the figure, one or both of the air nozzles 19 and the fixing table 12 (not shown) are moved in the height direction of the square of the application region 11a (the direction in which the paper is turned upside down). Thereby, as shown in FIG. 27, the fluid resin 21 is expanded in the height direction of the square of the coating region 11a. Next, the release film 11 and the fixing table 12 (not shown) are rotated together by 90 degrees to switch the height direction and the width direction of the square of the coating region 11a. Then, as shown in FIG. 28, one or both of the air nozzle 19 and the fixing table 12 (not shown) are moved again along the height direction of the square of the application region 11a (the direction of the paper surface is downward). Thereby, as shown in FIG. 29, the fluid resin 21 is expanded in the entire application region 11a on the release film 11.

Above, the injection of the fluid resin 21 is shown using FIGS. 23 to 29 . Various examples of the gas expansion step of continuously expanding the fluid resin 21 by the gas acting on the fluid resin 21 by the gas. However, in the present invention, the resin expanding step is not limited thereto, and any change may be made.

Further, in the present invention, the object to be coated is not limited to the release film. For example, a plate-shaped member (a heat sink for heat insulation, a barrier metal for electromagnetic wave barrier, or the like) can be used as an object to be coated, and a fluid resin can be discharged and expanded thereon. For example, a plate member may be placed on the release film, and the fluid resin may be discharged and expanded on the plate member. Then, a conveyance step of transporting the plate member and the release film together to a place where the resin encapsulation step is performed may be performed, and the compression molding step may be further performed. Further, the resin discharging step, the resin expanding step, the conveying step, and the compression molding step using the plate member may be performed without using a release film.

As described above, in the present invention, the object to be coated is not particularly limited, and may be, for example, a substrate (workpiece) on which a wafer is mounted. However, in particular, in the case of expanding the discharged fluid resin, it is more preferably not a substrate (workpiece). For example, as described above, by applying a release resin such as a release film, a plate member, or the like of a member on the substrate (workpiece) side of the resin molded article, a force is applied to the resin expansion step. The fluid resin does not exert excessive force on the substrate (workpiece). Thereby, for example, damage of components (for example, wafers, leads, and the like) disposed on the substrate (workpiece) can be prevented. Further, in the case where the object to be coated is used as the substrate (workpiece) on which the wafer is mounted, for example, the data of the wafer can be first acquired by scanning of the laser displacement meter 15 or the photographing of the camera 16, for calculating the fluid resin. volume.

Further, the size of the object to be coated (release film, etc.) is not particularly limited. set. However, since the present invention can reduce the thickness variation of the fluid resin, it is particularly suitable for a large-sized object to be coated. For example, the coated region of the object to be coated (release film or the like) may have a long axis of 300 mm or more.

(2) Compression molding step

Next, an example of a compression molding step of the method for producing a resin molded article of the present invention will be described with reference to FIGS. 30 to 33. In the compression molding step shown in Figs. 30 to 33, the compression molding mechanism shown in Fig. 4 will be used. However, in FIGS. 30 to 33, portions other than the molding die 531 are omitted for simplification.

First, as shown in FIG. 30, a resin-packaged front substrate (pre-molded substrate) 544a is supplied to the lower surface of the upper mold 101 and fixed. The pre-molding substrate 544a can be fixed to the lower surface of the upper mold 101 by, for example, a jig (not shown). Further, on the lower surface of the substrate 544a before molding (opposite to the fixed surface of the upper mold 101), as shown in the drawing, the wafer 1 is fixed.

Next, as shown in FIG. 30, the release film 11 to which the fluid resin 21 is applied is conveyed to the molding die 531 by a resin mounting machine (resin conveying mechanism) 521 (transporting step). At this time, for example, as shown in the figure, the frame member 701 is placed on the release film 11, and the fluid resin 21 is placed on the release film 11 in the opening of the frame member 701.

Then, as shown in FIG. 31, the resin mounter 521 carries the release film 11 on which the fluid resin 21 is placed on the lower mold cavity 532 of the lower mold 102. At this time, the release film 11 can be adsorbed on the lower mold cavity 532 by a suction mechanism (not shown). Thereby, the fluid resin 21 and the release film 11 are supplied together to the lower mold cavity 532 of the lower mold 102.

Next, as shown in FIGS. 32 to 33, one surface of the pre-molding substrate 544a is resin-sealed by the encapsulating resin 21b using the lower mold 102 of the molding die 531. Specifically, for example, first, as shown in FIG. 32, the lower mold 102 is raised in the direction of the arrow Y1 by the mold clamping mechanism 115 (not shown in FIG. 32) of FIG. 4, and is filled in the lower mold cavity 532. The wafer 1 mounted on the lower surface of the pre-molding substrate 544a is immersed in the fluid resin. Thereafter, the fluid resin 21 is heated and solidified to form a sealing resin. At this time, the fluid resin 21 can be heated by the lower mold 102 which is previously heated by a heating means (not shown). Thereby, as shown in FIG. 33, the resin-molded substrate (molded substrate, electronic component) 544b in which the wafer 1 fixed on the pre-molding substrate 544a is encapsulated by the encapsulating resin 21b can be manufactured. Thereafter, as shown in FIG. 33, the lower mold 102 is opened by the mold clamping mechanism 115 (not shown in FIG. 33) in the direction of the arrow Y2.

Although the examples of the compression molding step and the conveyance step are shown above, the compression molding step and the conveyance step are not particularly limited, and may be carried out, for example, according to a general resin encapsulation method.

(3) Method for producing a resin molded article

Next, an example of the entire procedure of the method of manufacturing a resin molded article using the compression molding apparatus of FIG. 5 or FIG. 6 will be described.

First, in the release film cutting module (release film cutting mechanism) 510, as described above, the leading end of the release film is pulled out from the roll-shaped release film 512 by the film holder 513 and placed on the cover. The film fixing stage mounts the upper surface of the table 12 on the mechanism 511, and fixes the release film on the table 12. In this state, as described above, the release film is cut by a cutting mechanism (not shown). And as a circular release film 11. The release film (waste) remaining and cutting off the circular release film 11 is processed by a waste processing mechanism (not shown).

Next, the film fixing stage mounting mechanism 511 (film fixing stage moving mechanism 523) and the table 12 (not shown) placed thereon and the release film 11 are moved together to the nozzle 14 in the coating module 520. Below the resin supply port. In this state, in the coating region on the release film 11, for example, discharge (discharge step) and expansion (resin expansion step) of the fluid resin 21 are performed. The discharging step and the resin expanding step can be carried out, for example, as described above. At this time, the movement of the discharge position of the resin can be performed, for example, by moving (or rotating) the film fixing table moving mechanism 523 together with the table 12 (not shown) placed thereon and the release film 11. . Further, as described above, the resin expanding step can be omitted in the present invention.

Next, the release resin 11 and the fluid resin of the application region applied thereto are moved from the film fixing table moving mechanism 523, and held by a resin mounter (resin transport mechanism) 521. The movement of the release film 11 from the film fixing table moving mechanism 523 to the resin mounter 521 can be performed by holding the release film 11 by a holding mechanism (not shown) of the resin mounter 521.

Next, by the mechanical arm 543, as described above, the front and back surfaces of the molded front substrate 544a taken out from the accommodating portion of the pre-molding substrate 544a are reversed. Thereby, the pre-molding substrate 544a is placed on the substrate mounter 541 with the wafer mounting surface side facing downward, and is transported into the compression molding module 530. At this time, the pre-molding substrate 544a is supplied and disposed on the die surface of the upper mold (molding mold 531). Next, as described in FIG. 30, the resin mounting machine 521 holding the release film 11 and the fluid resin is integrated with the resin mounting machine 521. The post-processing mechanism 522 moves together on the rail 542 and is carried into the compression molding module 530 (transport mechanism). At this time, as described in FIG. 31, the release film 11 and the fluid resin can be supplied into the lower mold cavity 532 having the circular opening by placing the release film 11 on the mold surface of the lower mold.

Next, as illustrated in FIG. 32, in the compression molding module 530, the molding die 531 (upper die and lower die) is clamped. Thereby, the wafer mounted on the pre-molding substrate 544a provided on the upper mold can be in a state of being immersed in the fluid resin in the lower mold cavity 532, and the fluid resin type in the lower mold cavity 532 can be used. The cavity bottom part is pressurized. Then, as explained in FIG. 33, the fluid resin (for example, cured by heating) is cured in a molding die 531 (lower mold cavity 532), and the electrons are cured with a resin (encapsulation resin) 21b. Component packaging. Thereby, the resin-packaged substrate 544b (molded substrate, electronic component) is formed. Next, as explained in Fig. 33, the molding die 531 (upper die and lower die) is opened. Then, the resin-packaged substrate 544b is taken out by the substrate mounter 541, and further transported to the transport module 540 side to be accommodated. In addition, after the resin-molded substrate (molded substrate, electronic component) 544b is taken out from the molding die 531 by the substrate mounting machine 541, the upper die surface cleaning machine (not shown) of the post-processing mechanism 522 is used to clean the substrate of the upper mold. unit. In parallel with this or a time shift, the unused release film can be taken out from the lower mold surface using a release film removing mechanism (not shown) of the post-processing mechanism.

Alternatively, the substrate mounter 541 on which the resin-packaged substrate 544b (electronic component) is placed can be moved from the inside of the compression molding module 530 to the transport module 540. In this case, by the robot arm 543, as described above, the tree The grease-sealed substrate (molded substrate, electronic component) 544b is taken out from the substrate mounter 541 and the front and back surfaces are reversed. As a result, the resin-encapsulated substrate (molded substrate, electronic component) 544b is accommodated in the accommodating portion of the resin-packaged substrate (molded substrate, electronic component). In this way, an electronic component (resin molded product) can be manufactured.

In addition, in FIG. 5 and FIG. 6, the manufacturing apparatus of an electronic component, and the manufacturing method of the electronic component using the same were demonstrated. However, the present invention is not limited to electronic components, and can be applied to the production of any resin molded article other than the above. For example, the present invention can be applied to an optical member such as a lens, an optical module, or a light guide plate or other resin product by compression molding.

(4) Method of manufacturing the product

The present invention is applicable, for example, to Wafer Level Package (WLP). The WLP to which the present invention is applied may be, for example, a Fan-Out Wafer Level Package (FO-WLP). In the case where the present invention is applied to a WLP, it is not particularly limited except for the discharge step and the compression molding step, and can be carried out in accordance with a general WLP. Specifically, for example, as described above, first, the electronic component is manufactured as an intermediate product (intermediate product manufacturing step) by the manufacturing method of the first electronic component of the present invention. Then, other electronic components as a finished product are manufactured from the intermediate product (product manufacturing step, manufacturing method of the second electronic component of the present invention). In the method of manufacturing the second electronic component of the present invention, as described above, for example, in the finished product manufacturing step, the object to be coated can be removed from the wafer of the intermediate product and the encapsulating resin. In the case where the manufacturing method of the second electronic component of the present invention is applied to a WLP, for example, in the case of a finished product In the sub-assembly, the wafer can be attached only to the substrate (carrier) as the package object without being electrically connected (wire bonding, flip chip bonding, or the like). Further, for example, as described above, after the object to be coated is removed from the wafer of the intermediate product and the encapsulating resin, the wiring member can be connected to the wafer. The wiring member is not particularly limited, and examples thereof include a lead wire, a bump, a flip chip, and the like.

The manufacturing process in the case where the manufacturing method of the second electronic component of the present invention is applied to the WLP is more specifically, for example, as follows. In other words, first, an intermediate product is manufactured by applying a method of manufacturing a resin molded article of the above-described embodiment to a wafer attached to a carrier such as a semiconductor substrate such as a ruthenium wafer, a glass substrate, or a metal substrate. step). The intermediate product can be separated into individual electronic components by taking out a carrier, applying wiring (rewiring step), and a cutting step to the wafer, thereby manufacturing a finished product (finished product manufacturing step). In addition, the following examples are also possible. In other words, a member in which a wiring layer is formed on a semiconductor substrate such as a germanium wafer as a carrier is used, and a wafer is electrically connected to the wiring layer of the semiconductor substrate, and a resin molded article of the embodiment is applied to the wafer. The method is to manufacture an intermediate product (intermediate product manufacturing step). In the intermediate product, the carrier can be taken out by leaving the wiring layer in a state in which the wiring layer is connected to the wafer, and separated into individual electronic components by performing the cutting step, thereby manufacturing a finished product (finished product manufacturing step).

The manufacturing process in the case where the manufacturing method of the second electronic component of the present invention is applied to a case other than the WLP is not particularly limited, but may be, for example, as follows. That is, first, for the wafer to be electrically connected to the germanium crystal An intermediate product (intermediate product manufacturing step) is produced by applying a method of manufacturing a resin molded article of the above-described embodiment to a wafer which is electrically connected to a substrate such as a semiconductor substrate or a printed substrate. For the intermediate product, the finished product can be separated into individual electronic components by a cutting step (finished product manufacturing step).

Further, as described above, the method of manufacturing the second electronic component of the present invention is one embodiment of the above-described method of producing the product of the present invention. Further, the method of manufacturing the product of the present invention is not limited to the method of manufacturing the second electronic component of the present invention, and can be applied, for example, to the manufacture of products other than electronic components.

Example 2

Next, another embodiment of the present invention will be described. This embodiment is the same as Embodiment 1 except for the volume measuring step.

The volume measuring step of this embodiment will be described using Figs. 2, 3, 19, 34 and 35. In the present embodiment, the camera 16 is used in addition to the laser displacement meter 15. That is, first, as in the first embodiment, the thickness of the fluid resin 21 is measured as shown in Figs. 2 and 19 . Next, the fluid resin 21 is photographed from directly above by the camera 16 shown in FIG. Fig. 34 schematically shows the image taken as described above. As shown in the figure, an image (planar shape) of the fluid resin 21 is reflected inside the image P.

Further, as shown in the schematic block diagram of FIG. 35, the volume of the fluid resin 21 is calculated and stored by the calculation unit 551 and the storage unit 552 included in the control unit 550. That is, first, as in FIG. 20, the thickness data (measurement result) of the fluid resin 21 measured by the laser displacement meter 15 is sent to the performance. The calculation unit 551 (step S1). Further, the image of the fluid resin 21 reflected in the image P of FIG. 34 is sent to the calculation unit 551 (step S1B). Then, the image of the fluid resin 21 is calculated by the calculation unit 551, and the area of the fluid resin 21 is calculated. The area and thickness data of the fluid resin 21 are used, and the fluidity resin 21 is calculated by the calculation unit 551. Volume (calculation step). Further, at this time, image processing of the image of the fluid resin 21 or the like can be performed in the calculation unit 551. Then, the calculated volume of the fluid resin 21 is sent to the storage unit 552 (step S2), and further stored by the storage unit 552 (storing step). Alternatively, the measurement result of the laser displacement meter 15 can be directly transmitted to the storage unit 552 (step S1A), and the image of the fluid resin 21 reflected in the image P of FIG. 34 is directly sent to the storage unit 552 (step S1C). ) and store it in the storage unit 552 (storing step). Then, the measurement result of the laser displacement gauge 15 stored in the storage unit 552 and the map of the fluid resin 21 reflected in the image P of FIG. 34 are transmitted to the calculation unit 551 (step S3), and can be used by calculation. The portion 551 calculates the volume of the fluid resin 21 (calculation step). The volume measuring step can thus be carried out. Further, as described above, the other steps can be carried out in the same manner as in the first embodiment. Further, the calculation unit may be independent of the laser displacement meter 15 and the camera 16. For example, at least a part of the calculation unit may be built in the camera 16 and calculate the area of the fluid resin, and at least a part of the calculation unit may be built in the laser displacement meter 15 to calculate the volume of the fluid resin. In addition, at least a portion of the storage portion may be built into the laser displacement meter 15 and the camera 16.

According to the present embodiment, since the area is measured in addition to the thickness of the fluid resin 21, the fluidity tree can be calculated with higher precision than in the first embodiment. The volume of the lipid 21.

Further, for example, the laser displacement meter (sensor) 15 and the camera (sensor) 16 may each use only one, but in order to shorten the measurement time, a plurality of them may be used at the same time. Specifically, the entirety of the fluid resin 21 can be measured by measuring a part of each fluid resin 21 using the plurality of sensors.

Example 3

Next, another embodiment of the present invention will be described. This embodiment is the same as Embodiment 1 and Embodiment 2 except for the volume measuring step.

The volume measuring step of this embodiment will be described using Figs. 2, 20 and 36. In the present embodiment, although the camera 16 is not used, the laser displacement gauge 15 is used, and as shown in Figs. 2 and 36, the area is measured in addition to the thickness of the fluid resin 21. Moreover, FIG. 36 is a plan view of the fluid resin 21 and a diagram showing the movement locus of the laser displacement meter 15. In other words, the laser displacement gauge 15 is moved in a lightning shape (zigzag) as indicated by an arrow M1 in FIG. 36, and the entire surface of the fluid resin 21 is scanned. Then, as shown in the regions R1, R2, and R3 of the figure, the scanned regions are divided, and the three-dimensional data (thickness, width, and length) of the fluid resin 21 are obtained for each. Further, the shape of the divided region is a short strip shape in FIG. 36, but is not limited thereto, and may be any shape.

Further, after the three-dimensional data of each of the divided regions is obtained, as shown in the schematic block diagram of FIG. 20, the volume of the fluid resin 21 is calculated and stored by the calculation unit 551 and the storage unit 552 included in the control unit 550. That is, first, the three-dimensional data (measurement results) of the divided regions are concentrated and played. The calculation unit 551 transmits (step S1). Then, using the data, the calculation unit 551 calculates the volume of the entire fluid resin 21 (calculation step). Then, the calculated volume of the fluid resin 21 is sent to the storage unit 552 (step S2), and further stored by the storage unit 552 (storing step). Alternatively, the measurement result of the laser displacement gauge 15 may be directly transmitted to the storage unit 552 (step S1A), and stored in the storage unit 552 (storing step). Then, the storage unit 552 transmits the measurement result of the stored laser displacement gauge 15 to the calculation unit 551 (step S3), and uses the measurement result to calculate the volume of the fluid resin 21 by the calculation unit 551 (calculation step). Further, the volume of the fluid resin 21 by the calculation can be transmitted to the storage unit 552 (step S2), and stored by the storage unit 552 (storing step). The volume measuring step of measuring the volume of the discharged fluid resin 21 can be performed by the above. Further, as described above, the other steps can be carried out in the same manner as in the first embodiment and the second embodiment. Further, at least a part of the calculation unit or at least a part of the storage unit may be built in the laser displacement meter 15.

According to the present embodiment, since the area is measured in addition to the thickness of the fluid resin 21, the volume of the fluid resin 21 can be calculated with higher precision than in the first embodiment. Further, by obtaining the data and calculating the calculation by dividing the measurement region, the volume of the fluid resin 21 can be calculated with higher accuracy than in the second embodiment in which the thickness and the area of the fluid resin 21 are measured in the same manner as in the present embodiment.

[Effects of the Invention, etc.]

According to the present invention, for example, in the volume measuring mechanism, by using a non-contact type displacement meter, it is possible to grasp the position with high precision in a non-contact manner. The amount (volume) of the resin of the discharged fluid resin. The non-contact type displacement meter is not particularly limited, but may be, for example, at least one of the electromagnetic wave type displacement meter, the ultrasonic type displacement meter, the electrostatic capacitance type displacement meter, and the overcurrent type displacement meter. The electromagnetic wave type displacement meter may be, for example, an optical displacement meter, or may be, for example, a laser displacement meter described in the above embodiments.

According to the present invention, since the resin amount of the fluid resin can be managed by the volume, the relationship between the resin amount and the resin thickness of the resin molded article can be accurately grasped, and the resin thickness of the resin molded article can be more accurately managed. Therefore, according to the present invention, as described above, the resin thickness deviation of the resin molded article can be reduced. Further, in the technical field of the present invention, the amount of the resin of the fluid resin is managed by the weight measurement, for example, as in the above-described Patent Document 1 for the purpose of managing the amount of the resin of the fluid resin by volume. However, even if the weight is measured from the measured value of the weight of the fluid resin and the density (specific gravity), the volume is calculated from the measured value of the weight of the fluid resin, and the density (specific gravity) of the fluid resin varies, and it is difficult to accurately calculate the volume. Therefore, as described above, there is a risk that the resin thickness of the resin molded article varies. On the other hand, according to the present invention, since the volume of the fluid resin can be accurately measured, the resin thickness deviation of the resin molded article can be reduced.

According to the present invention, since the dispersion variation of the fluid resin can be reduced, for example, the following problems (1) to (5) of the resin molded article can be suppressed or prevented. However, these effects are exemplified, and the present invention is not limited at all.

(1) Flow marks

(2) Filler segregation in the resin

(3) voids in the resin (bubbles)

(4) Thickness deviation of package (resin molded product)

(5) Tilting of the package (resin molded product)

The present invention is not limited to the above-described embodiments, and may be arbitrarily and appropriately combined, changed, or selected as needed, without departing from the spirit and scope of the invention.

The present application claims priority based on Japanese Patent Application No. 2016-126068, filed on Jun.

Claims (19)

A resin molding apparatus comprising: a discharge mechanism that discharges a fluid resin for resin molding in a coating region of a coating object; a volume measuring mechanism that measures a volume of the fluid resin discharged in the coating region; and a coating method The compression molding mechanism in which the object to be coated of the fluid resin is compression-molded. The resin molding apparatus according to claim 1, wherein the volume measuring mechanism includes a size measuring mechanism that measures a size of the fluid resin discharged in the coating area; and the fluidity is calculated from measurement results of the dimensional measuring mechanism The calculation unit of the volume of the resin. The resin molding apparatus according to claim 2, wherein the dimension measuring means is a dimension measuring means for thickness measurement; and the calculating section is based on a length of the fluid resin discharged in the coating region and a size measuring mechanism by the size The thickness of the aforementioned fluid resin was measured, and the volume of the aforementioned fluid resin was calculated. The resin molding apparatus according to claim 2, wherein the size measuring means is a size measuring means for thickness measurement, and the volume measuring means further includes a camera that captures an image of the fluid resin discharged in the application area; The calculation unit calculates the volume of the fluid resin based on the area of the fluid resin described above based on the photographed data obtained by the camera and the thickness of the fluid resin measured by the above-described size measuring mechanism. The resin molding apparatus according to claim 2, wherein the dimension measuring means is a dimensional measuring means for measuring three-dimensional data; and the calculating section calculates the three-dimensional data of the fluid resin based on the measurement by the dimensional measuring means. The volume of the aforementioned fluid resin. The resin molding apparatus according to any one of claims 2 to 5, further comprising: a storage portion storing the data; wherein the data is at least one of a measurement result obtained by the dimensional measurement mechanism and a calculation result obtained by the calculation unit; One. The resin molding apparatus according to any one of claims 1 to 5, wherein the discharge mechanism further includes a moving mechanism that moves the discharge position of the fluid resin with respect to the object to be coated. The resin molding apparatus according to any one of claims 1 to 5, further comprising a resin expansion mechanism that expands the fluid resin discharged in the coating region. The resin molding apparatus according to any one of claims 1 to 5, further comprising a conveying mechanism that conveys the object to be coated to the compression molding mechanism. The resin molding apparatus according to any one of claims 1 to 5, wherein the object to be coated is a release film, and the resin molding device further includes a cutting mechanism for cutting the release film. The resin molding apparatus according to any one of claims 1 to 5, wherein the discharge mechanism and the compression molding mechanism are different modules and are detachable from each other. The resin molding apparatus according to any one of claims 1 to 5, wherein the plurality of compression molding mechanisms are plural; the plurality of compression molding mechanisms are different modules; the discharge mechanism and the plurality of compression molding mechanisms A different module; at least one of the foregoing discharge mechanism and the plurality of the aforementioned compression molding mechanisms are detachably attachable to each other with respect to the other at least one of the aforementioned mechanisms. A method for producing a resin molded article, comprising the steps of: discharging a step of discharging a fluid resin for resin molding in a coating region of a coating target; and measuring a volume of the fluid resin discharged in the coating region; And a compression molding step of performing compression molding using the aforementioned coating object coated with the aforementioned fluid resin and measuring the volume of the fluid resin described above by the volume measuring step. The method for producing a resin molded article according to claim 13, wherein the volume measuring step includes a dimension measuring step of measuring a size of the fluid resin discharged in the coating region; and calculating the flow from the measurement result of the foregoing dimension The calculation step of the volume of the resin. The method for producing a resin molded article according to claim 14, wherein in the dimension measuring step, at least the thickness of the discharged fluid resin is measured. The method for producing a resin molded article according to claim 15, wherein in the volume measuring step, the volume of the fluid resin is calculated based on the thickness and the area of the discharged fluid resin. The method for producing a resin molded article according to claim 13, wherein in the dimension measuring step, the three-dimensional data of the discharged fluid resin is measured; and in the volume measuring step, the fluid resin is discharged based on the fluid The three-dimensional data calculates the volume of the aforementioned fluid resin. The method for producing a resin molded article according to any one of claims 13 to 17, further comprising a storage step of storing the data; and storing the measurement result of the aforementioned size and the volume of the fluid resin in the storing step At least one of the results. A method of producing a product, which is produced by using the resin molded article produced by the production method according to any one of claims 13 to 18.