TWI520895B - Substrate removing device and method for manufacturing flat panel display device using the same - Google Patents

Description

Substrate removing device and method for manufacturing flat panel display device using the same

The present invention relates to a substrate removing apparatus, and more particularly to a substrate removing apparatus including an initial gap forming unit and a front adsorption type removing unit, and a flat panel display apparatus in which the auxiliary substrate is separated by using the substrate removing apparatus method.

In line with the development of various portable device mobile phones, notebook computers and information electronic devices such as high definition televisions that realize high resolution and high quality images, etc., the demand for flat panel display devices applied thereto has increased. Flat panel display devices include liquid crystal displays (LCDs), plasma display (PDPs), field emission displays (FEDs), organic light emitting display devices, and the like.

Flat panel display devices are commonly used in portable devices, and in the case of large televisions, an increase in area results in an increase in weight, so the demand for lighter and thinner display devices is growing to enhance portability.

The thickness and weight of the flat panel display device can be reduced in a variety of ways, but the reduction in the major components of the flat panel display device is limited in structure and current technology. In addition, the main components are light in weight, so it is very difficult to reduce the weight of the main components to reduce the thickness and weight of the entire flat panel display device.

Therefore, a method of reducing the thickness and weight of a flat panel display device by reducing the thickness of a planar substrate constituting a display panel has been actively studied. In this case, however, since the thin substrate is applied, the thin substrate may be bent or broken when it is transferred in the multi-unit process or the unit process is performed thereon. Therefore, in order to overcome this problem, the auxiliary substrate is attached to the thin glass base. A method of performing a manufacturing process, and removing an auxiliary substrate when the process is completed to minimize damage to a planar substrate has been proposed.

Fig. 1A is a schematic view showing a substrate removing device for manufacturing a thin substrate by using a vacuum pad of the related art method, and Fig. 1B is a schematic view showing a substrate removing device using an arched cylindrical pad.

Referring to Fig. 1, a vacuum pad substrate removing device 10 of the related art has a structure in which a plurality of vacuum adsorption pads 14 are disposed on an auxiliary substrate 12 attached to a glass or plastic panel substrate 11. And the panel substrate 11 and the auxiliary substrate 12 are separated by driving the vacuum suction unit 15. In particular, it is assumed that a plastic substrate and a release layer are formed between the panel substrate 11 and the auxiliary substrate 12 by using SiN _x and a-Si, and are removed by using a laser, thereby weakening the bonding force between the substrates. Perform the removal process.

However, in the vacuum pad substrate removing device 10, the auxiliary substrate 12 may be damaged at the initial adsorption portion and the end adsorption portion due to the difference between the height of the vacuum adsorption pad 14(a) and the adsorption power. And because the release layer needs to be removed by the laser, the cost increases. Also, once used, the auxiliary substrate 12 cannot be reused.

Fig. 1B shows a substrate removing device 20 using a cylindrical pad in the related art. In the substrate removing device 20, when the auxiliary substrate attaching process is completed, the first auxiliary substrate 22 and the second auxiliary substrate 23 attached to the panel substrate 21 need to be removed, and for this purpose, the arched cylindrical pad 25 is used to adsorb the front surface of the first auxiliary substrate 22 and gradually lift the front surface, while simultaneously lowering the rear end of the first auxiliary substrate 22 to remove the first auxiliary substrate 22, and the second auxiliary substrate 23 is The same way was removed.

However, the inconvenience of the substrate removing method using the cylindrical pad is that the separation (or removal) of the front surface of the auxiliary substrate takes a long time compared to the front surface adsorption method, and since a large number of driving is provided The unit and the adsorption chamber, it is difficult to manage the drive unit and the adsorption chamber in terms of maintenance of the equipment. In addition, it is difficult to manufacture and manage O-rings formed on the lower surface of the cylindrical pad for separation.

Accordingly, an aspect of the present invention provides a method of manufacturing a flat display device and a substrate removing device, the method of manufacturing the flat display device by attaching an auxiliary base The board is to a thin panel substrate and the program is executed to prevent damage to a thin glass substrate, and the substrate removing device can easily separate an auxiliary substrate from a panel substrate manufactured by the method.

To achieve these and other advantages, and in accordance with the purpose of the present specification, a substrate removal apparatus includes: an initial gap forming unit configured to be attached by a mother substrate when loaded Forming an initial gap in the mother substrate formed by attaching an auxiliary substrate and a panel substrate; and the removing unit is configured to be mounted on a stage on which the mother substrate on which the initial gap is formed has been loaded The formed rectangular airfoil O-ring vacuum adsorbs the auxiliary substrate to separate the auxiliary substrate from the panel substrate.

To achieve these and other advantages, and in accordance with the purpose of the present specification, a substrate removal method includes: providing a first auxiliary substrate and a second auxiliary substrate and a thin panel substrate; Forming a mother substrate by attaching the first auxiliary substrate and the second auxiliary substrate to the panel substrate; performing a display panel manufacturing process on the mother substrate; and transporting the mother substrate to an initial gap forming unit at the first Forming an initial gap between the auxiliary substrate and the panel substrate; transporting the mother substrate to a front adsorption type removing unit to separate the first auxiliary substrate; and transporting the mother substrate to the initial gap forming unit to be on the second auxiliary substrate Forming an initial gap with the panel substrate; and transporting the mother substrate to the front adsorption type removing unit to separate the second auxiliary substrate.

Further scope of applicability of the present application will become more apparent in the detailed description given below. However, it is to be understood that the detailed description of the preferred embodiments of the invention The personnel are obvious.

10‧‧‧Vacuum pad substrate removal device

11‧‧‧ Panel substrate

12‧‧‧Auxiliary substrate

14‧‧‧Vacuum suction pad

15‧‧‧vacuum suction unit

20‧‧‧Substrate removal device

21‧‧‧ Panel substrate

22‧‧‧First auxiliary substrate

23‧‧‧Second auxiliary substrate

25‧‧‧Armed tubular cushion

50‧‧‧ mother substrate

51‧‧‧First panel substrate

52‧‧‧Second panel substrate

61‧‧‧First auxiliary substrate

62‧‧‧Second auxiliary substrate

100‧‧‧Initial gap forming unit

101‧‧‧ Space

102‧‧‧Support

110‧‧‧Vision Alignment Module

111‧‧‧Sensor unit

112‧‧‧First conveyor unit

113‧‧‧Second transport unit

114‧‧‧ Third transport unit

120‧‧‧Substrate registration module

140‧‧‧ Push pin module

141‧‧‧ push pin

142‧‧‧ load weight

143‧‧‧First conveyor unit

144‧‧‧Second transport unit

145‧‧‧ third transport unit

150‧‧‧ clearance knife module

151‧‧‧ clearance knife

152‧‧‧ knife controller

153‧‧‧First conveyor unit

154‧‧‧Second transport unit

155‧‧‧3rd transport unit

160‧‧‧Adsorption platform

161‧‧‧ Lifting pinhole

165‧‧‧Push pin hole

167‧‧‧Main vacuum adsorption line

169‧‧ ‧ sub vacuum adsorption line

170‧‧‧ Lifting needle module

200‧‧‧Pre-adsorption type removal unit

201‧‧‧ Space

202‧‧‧Support

210‧‧‧Low load stage

211‧‧‧vacuum adsorption line

213‧‧‧ slot line

213a‧‧‧Steps

214‧‧‧The substrate stops protruding

220‧‧‧High load platform

221‧‧‧vacuum adsorption line

223‧‧‧ slot line

230‧‧‧Separation gap forming module

231‧‧‧Fixed frame

232‧‧‧ moving in/out components

233‧‧‧ Height adjustment unit

234‧‧‧ bottom frame

236‧‧‧ drive unit

240‧‧‧Bend prevention module

241‧‧‧Rotating components

242‧‧‧Rotating components

S101~S110‧‧‧Steps

S200~S252‧‧‧Steps

Additional illustrations are included to provide a further understanding of the invention and are incorporated in and constitute a part of the invention.

In the drawing: FIG. 1A is a view schematically illustrating a substrate removing device for manufacturing a thin substrate by using a vacuum pad in the related art method, and FIG. 1B is a view schematically illustrating substrate shifting using an arched cylindrical pad except 2 is a view illustrating a method of manufacturing a flat panel display device according to an embodiment of the present invention; and FIG. 3 is a view schematically illustrating a substrate removing device according to an embodiment of the present invention; FIG. 4A to 4C is a view for explaining an initial gap program performed by the panel substrate having the corner cut portion by the initial gap forming unit; FIG. 5 is a view illustrating the initial gap forming unit of the substrate removing device according to an embodiment of the present invention; FIG. 6D is a view illustrating elements included in the initial gap forming unit of FIG. 5; and FIG. 7 is a view illustrating a front adsorption type removing unit of the substrate removing apparatus according to an embodiment of the present invention; Figure 8 to Figure 8C are views for explaining two stages of the front adsorption type removing unit in Fig. 7; Figs. 9A and 9B are views for explaining the removal of the gap forming module according to an embodiment of the present invention; 10A and 10B are views for explaining a bending prevention module according to an embodiment of the present invention; and FIG. 11 is a view illustrating a method of removing a substrate in a method of manufacturing a flat panel display device according to an embodiment of the present invention; .

The description will be given in the form of detailed embodiments with reference to the accompanying drawings. For the sake of brief description, the same or equivalent elements have the same reference code, and the description thereof will not be repeated.

Hereinafter, a method of manufacturing a flat panel display device and a substrate removing device using the same according to the present invention will be described with reference to the accompanying drawings. Hereinafter, a method of manufacturing a flat panel display device and a substrate removing device according to an embodiment of the present invention will be described with reference to the accompanying drawings. In the following description, a method of manufacturing a panel substrate of a liquid crystal display in which a liquid crystal layer is interposed between two substrates is explained as an example, but the manufacturing method according to an embodiment of the present invention is not limited to the LCD and can be applied to any flat panel at the same time. Among the panel substrates of the display device, for example, an organic light emitting display device, a plasma display panel, and the like.

2 is a view illustrating a method of manufacturing a flat panel display device according to an embodiment of the present invention.

In the second drawing, a method of forming a liquid crystal layer to form a panel substrate of an LCD by dropping is described, but the present invention can be applied to a method of manufacturing a liquid crystal by forming a liquid crystal layer by liquid crystal injection.

The procedure for fabricating an LCD can include a drive element array program that forms a drive element on a lower array substrate and a color filter program that forms a color filter on a lower color filter substrate.

The thickness and weight of the LCD depend on many factors, and the color filter substrate and array substrate formed of glass may be the heaviest of the LCD elements. Therefore, in order to reduce the thickness and weight of the LCD device, a thin glass substrate is preferably used.

A method of manufacturing a flat panel display device according to an embodiment of the present invention is performed using an array substrate and a color filter substrate having a thin panel substrate having a thickness of 0.5 t or less. In this case, the program is performed by attaching the auxiliary substrate to the outer surfaces of the two thinner panel substrates, thereby reducing the bending of the thin panel substrate and preventing damage of the thin panel substrate. Here, t represents mm, and therefore, 0.5t represents a thickness of 0.5 mm. Hereinafter, for the sake of explanation, mm is expressed as t in the following description.

In particular, a thin glass panel substrate having a thickness of 0.5 t or less when entering a conventional flat panel display device manufacturing process is severely drooped, causing a problem that it is difficult to transport using a panel substrate such as a cassette or the like, and when loaded to When the unit processing apparatus is unloaded from the unit processing apparatus, it is rapidly and severely bent even with a small impact, frequently causing a positional error.

Therefore, in an embodiment of the present invention, the auxiliary substrate is attached to a thin panel substrate having a thickness of 0.5 mm or less before the thin panel substrate is placed on a production line, whereby the panel substrate having enhanced bending characteristics is provided The same or better than the glass substrate having a thickness of about 0.7 t in a conventional flat panel display device.

First, an auxiliary substrate having a thickness of about 0.5 t to 0.7 t is attached to a panel substrate (S101) before a thin glass substrate having a thickness of 0.5 t or less is placed on a production line of an array program and a color filter program. a surface. Here, however, the invention is not limited to the thickness of the thin panel substrate and the auxiliary substrate.

The procedure of attaching the panel substrate and the auxiliary substrate can be performed by bringing the two substrates into contact in a vacuum state. In this case, the adhesion between the two substrates is considered to be based on vacuum force, van der Waals force, electrostatic force, molecular bonding, and the like.

Thereby, in an embodiment of the invention, the auxiliary substrate is treated with plasma by fluorine, or the like, or treated with a surfactant, or a concave-convex pattern is formed on the auxiliary substrate to reduce the adhesion force for easy separation from the thin panel substrate, Or the thin panel substrate and the auxiliary substrate are attached without performing any processing.

Next, when the auxiliary substrate is attached to the thin panel substrate, the thin panel substrate and the auxiliary substrate (hereinafter, referred to as "array substrate") of the array substrate attached thereto are subjected to an array procedure. In the array program, a plurality of gate lines and a plurality of data lines are disposed on the array substrate to define pixel regions, and thin film transistor TFTs and driving elements connecting the gate lines and the data lines are respectively formed in the pixel regions (S102). Also, a pixel electrode is formed to be connected to each TFT. When a signal is applied to the TFT, the pixel electrode drives the liquid crystal layer.

Meanwhile, during the color filter process, a color filter layer including colors of red, green, and blue sub-color filters is formed on the thin panel substrate for the color filter substrate, and the auxiliary substrate is attached. Attached to the thin panel substrate (S103). In this case, when an in-plane steering (IPS) LCD is fabricated, a common electrode is formed on the array substrate, wherein the pixel electrode is formed in the step S102.

Subsequently, an alignment process for forming the alignment film is performed on the color filter substrate and the array substrate (S104, S105). In this case, in order to provide anchoring force or surface fixing force to the liquid crystal molecules formed on the liquid crystal layer between the color filter substrate and the array substrate, a rubbing procedure with respect to the alignment layer is further included.

Next, a process of applying a sealant (or a sealing material) to the rubbed color filter substrate to form a predetermined seal pattern is performed, and at the same time, the liquid crystal layer is formed on the array substrate by a liquid crystal dropping program ( S106, S107). Alternatively, the sealant application procedure and the liquid crystal dropping procedure can be performed on an array substrate or a color filter substrate, respectively.

Thereby, the color filter substrate and the array substrate are respectively formed on the large-sized mother substrate. That is, a plurality of panel regions are formed in each of the large-sized mother substrates, and TFTs, driving elements, or color filter layers are respectively formed in the panel regions.

Thereafter, in an attaching process (S108), the liquid crystal is dropped and a sealant is applied to any one of the mother substrate in which the array substrate and the color filter substrate are formed, and then, the two mother substrates are aligned And pressure is applied thereto to attach the two mother substrates by the sealant and to allow the dripped liquid crystal to be uniformly distributed over the entire two substrates.

Through these procedures, a plurality of display panels including a liquid crystal layer are formed in the array substrate and the color filter substrate in a state of a large-sized mother substrate, and the first auxiliary substrate and the second auxiliary substrate are large from a plurality of display panels The size mother substrate is removed (S109), and the mother substrate is cut into a plurality of display panels, and each of the plurality of display panels is inspected, thereby manufacturing a flat panel display device (S110).

In this case, the procedure of separating the auxiliary substrate is performed by using the substrate removing device (S109), and the substrate removing device includes an initial gap forming unit and a front surface adsorption type removing unit.

Figure 3 is a schematic illustration of a substrate removal apparatus in accordance with an embodiment of the present invention. Referring to FIG. 3, a substrate removing apparatus according to an embodiment of the present invention includes an initial gap forming unit 100 for performing an initial gap forming process for removing an auxiliary substrate from a panel substrate; and a front adsorption type removing unit 200 for The auxiliary substrate is removed from the panel substrate in which the initial gap is formed.

The single mother substrate 50 undergoing the attaching process is loaded to the initial gap forming unit 100, and the initial gap forming process, and the mother substrate unloading are performed on the first auxiliary substrate attached to one surface of the panel substrate. The mother substrate 50 formed with the initial gap is loaded to the front adsorption type removing unit 200 with respect to the first auxiliary substrate, the first auxiliary substrate is removed, the second auxiliary substrate is controlled to face upward, and the initial gap forming unit 100 is passed The initial gap forming process and the substrate separating process are performed again on the second auxiliary substrate with the front adsorption type removing unit 200.

In order to form an initial gap with respect to the auxiliary substrate by the initial gap forming unit 100, a cutting portion needs to be formed on the substrate to supply a push pin.

4A to 4C are views for explaining a panel substrate having a corner cut portion in which an initial gap program is performed using an initial gap forming unit.

As described above, in the present embodiment, before starting the use of a thin glass substrate having 0.5 t or less, that is, using the manufacturing process of the first panel substrate 51 and the second panel substrate 52, in the transport or unit program The first auxiliary substrate 61 and the second auxiliary substrate 62 are attached to each other There are the same or better than the bending characteristics of those glass substrates having a thickness of about 0.7 t for a conventional LCDS to reduce the occurrence of substrate sagging and the like.

In this case, the corners of the first panel substrate 51 and the second panel substrate 52 in which the plurality of liquid crystal panels are disposed and attached, and the first and second auxiliary substrates 61 and 62 are cut at a predetermined inclination angle .

In particular, at least two corners of the thin first auxiliary substrate 61 and the second auxiliary substrate 62 are relatively slightly cut off compared to the first panel substrate 51 and the second panel substrate 52 (please refer to FIG. 4C) to Make a distinction between direction and subsequent procedures. Therefore, when the substrate is attached, the corner portions of the first auxiliary substrate and the second auxiliary substrate are exposed. The exposed areas are used as the push pin areas A and B and the push pin PP is applied thereon to start the initial gap procedure of the first auxiliary substrate 61 and the second auxiliary substrate 62.

That is, after the first panel substrate 51 and the second panel substrate 52 are cut, the corners of the attached first auxiliary substrate 61 and the second auxiliary substrate 62 protrude. The push pin PP is moved into the push pin regions A and B along the X axis and the Y axis to apply pressure in a state where the substrate is fixed. Therefore, first, a first initial gap program is performed on the first auxiliary substrate 61 attached to a surface to separate the first auxiliary substrate 61 from the first panel substrate 51 or the second panel substrate 52, and at the first auxiliary After the substrate 61 is separated, a second initial gap procedure is performed by using the push pin PP with respect to the second auxiliary substrate 62 to apply pressure to the push pin regions C and D.

Hereinafter, the structure of two units constituting the substrate removing device according to an embodiment of the present invention will be described with reference to the accompanying drawings.

Fig. 5 is a view for explaining an initial gap forming unit of the substrate removing device according to an embodiment of the present invention, and Figs. 6A to 6D are views for explaining components in the initial gap forming unit of Fig. 5.

Referring to FIG. 5, the initial gap forming unit 100 includes a visual alignment module 110 installed in the space 101 and disposed on the support 102 to image a corner cut formed in the mother substrate to position the corresponding The push pin of the corner cut portion; the substrate alignment module 120 is configured to: when the mother substrate is loaded, the alignment mother substrate is in a normal position; and the push pin module 140 is configured to control the pressing of the corner cut portion of the mother substrate; a gap knife module 150 (FIG. 6C) for inserting a gap knife into a substrate contact portion of a corner cut portion pressed by a push pin to form an initial gap; and an adsorption stage 160 for carrying The mother substrate into and out of the transport; and the lift pin module 170 includes a plurality of lift pins coupled to the lower portion of the adsorption stage 160 to support the mother substrate.

Hereinafter, the structure of the initial gap forming unit 100 will be described with reference to FIG. 5 and FIGS. 6A to 6D.

The visual alignment module 110 is coupled to the support 102 and mounted above the adsorption stage 160 and separated from the adsorption stage 160 by a predetermined distance. The visual alignment module 110 can image an area (not shown) loaded onto the mother substrate on the adsorption stage 160, and position the push pin module 140 according to the result to correspond to the corner cut formed in the mother substrate.

For this purpose, the visual alignment module 110 includes a sensor unit 111 having an image sensor for imaging an angle cut; a first transport unit 112 and a second transport unit 113 coupled to the sense The detector unit 111 moves the sensor unit 111 along the first direction and the second direction; and the third conveying unit 114 is coupled to the first conveying unit 112 and the second conveying unit 113 to move the first conveying in the third direction Unit 112 and second transport unit 113. Here, the first direction to the third direction are set to the X, Y, and Z axes.

When the mother substrate is transferred into the space 101 and loaded into the adsorption stage 160, the substrate alignment module 120 first aligns the mother substrate to place the mother substrate in a normal position. When the mother substrate is transferred into the space 101, the mother substrate is loaded onto a plurality of pins (not shown) by penetrating the adsorption stage 160, and the substrate alignment module 120 is fixed to the mother substrate. The stage 160 is aligned with the mother substrate.

According to the imaging result of the visual alignment module 110, the push pin module 140 positions the push pin 141 to correspond to the corner cut of the mother substrate loaded to the adsorption stage 160, and the lift pin 141 presses the corner cut to expose the mother substrate. A contact portion between the auxiliary substrate and the panel substrate. In this case, if the pressure applied to the mother substrate by the push pin 141 is too strong or if the pressure time applied to the mother substrate is long, the mother substrate may be damaged. Therefore, in order to prevent this, when the predetermined pressure is applied, the load cell 142 for lowering the push pin 141 can be further provided. Therefore, the push pin module 140 includes the push pin 141 and the first to third transport units 143 to 145 for positioning the push pin 141 in a position corresponding to the corner cut of the mother substrate.

The gap knife module 150 is used to insert the gap knife 151 to the contact portion of the mother substrate pressed by the push pin 141 to form an initial gap. In detail, when the mother substrate is pressed by the push pin 141, the auxiliary substrate of the mother substrate is separated from the panel substrate to a certain extent, but in this case, when the mother substrate is When transferred to the front adsorption type removal device, the auxiliary substrate can be attached to the panel again, and thus, the auxiliary substrate is not separated. Therefore, in order to reduce this problem, when the contact portion between the auxiliary substrate and the panel substrate is exposed by the pressing of the push pin 141, the gap knife module 150 inserts the gap knife into the exposed contact portion to reduce the substrate. Attachment between them to form a gap.

The gap knife module 150 includes a gap knife 151; a knife controller 152 for inserting the gap knife into the contact portion of the pressurized mother substrate or from the contact portion of the pressurized mother substrate; the first conveying unit 153 To the third conveying unit 155, for moving the knife controller 152 in the first direction to the third direction.

The adsorption stage 160 is mounted inside the space 101 by the support 102, and the transferred mother substrate is loaded thereon, and the adsorption stage 160 serves to stably support the mother substrate in the initial gap forming process. According to a vacuum adsorption method, the adsorption stage 160 supports the mother substrate. For this purpose, the adsorption stage 160 includes a plurality of lifting pinholes 161 such that a plurality of lifting pins lifted from the lower lifting needle module 170 disposed therein enter the lifting pinholes 161; at least one pushing pinhole 165 Formed on the side of the adsorption stage 160 to allow the push pin to enter; the main vacuum adsorption line 167 has a matrix format for dividing the entire area of the mother substrate, and mainly adsorbs the mother substrate; and the sub vacuum adsorption line 169, the sub The vacuum adsorption line 169 has a matrix format located in a region adjacent to the corner cut in the region divided by the main vacuum adsorption line 167 and secondary to the mother substrate.

Specifically, the sub-vacuum adsorption line 169 is formed in a region corresponding to the corner cut of the mother substrate pressed by the push pin 141 to prevent the mother substrate from being separated from the adsorption stage 160 by the pressurization of the push pin 141. That is, the sub-vacuum adsorption line 169 is densely formed with respect to the main vacuum adsorption line 167, and in the vacuum state, the adsorption force thereon is stronger than other regions, thereby alleviating the problem of separation.

The lift pin module 170 is provided on the rear surface of the adsorption stage 160 and temporarily supports the mother substrate that is transported to the inside of the space 101 before the mother substrate is adsorbed. In detail, the lift pin module 170 lifts the lift pins (not shown) such that the lift pins are lifted through the lift pin holes 161 of the adsorption stage 160 to support the transported mother substrate. When the mother substrate is aligned, the lift pin module 170 lowers the lift pins so that the mother substrate is loaded to the adsorption stage 160. Similarly, after the initial gap procedure is completed, when the mother substrate cannot be easily separated from the adsorption stage 160 due to the attaching force, the lift pin module 170 lifts the lift pins to advance the rear surface of the mother substrate, thereby assisting in quickly performing the unloading. program.

According to this configuration, the initial gap forming unit according to the present embodiment performs a process of forming an initial gap to separate the auxiliary substrate from the mother substrate. Hereinafter, the structure of the front adsorption type removing unit according to the present invention will be described.

Fig. 7 is a view for explaining a front adsorption type removing unit of the substrate removing device according to an embodiment of the present invention. 8A to 8C are views for explaining two stages of the front adsorption type removing unit in Fig. 7. 9A to 9B are views for explaining the removal of the gap forming module according to an embodiment of the present invention. 10A through 10B are views illustrating a bending prevention module according to an embodiment of the present invention.

Referring to FIG. 7, the front adsorption type removing unit 200 includes a low stage 210 mounted on a support 202 in the space 201 for allowing the mother substrate to be transported to be loaded thereon, and having an airfoil type O a ring (OR); a high stage 220 disposed on the low stage 210 and having an airfoil O-ring; a separation gap forming module 230 forming a gap between the low stage 210 and the high stage 220; and bending prevention The module 240 is configured to remove static electricity generated in the mother substrate.

Hereinafter, the structure of the front adsorption type removing unit 200 will be described with reference to Fig. 7 and Figs. 8A to 8C.

The low stage 210 is mounted over the support 202 and is used to stably support the mother substrate that is transported into the space 201 and loaded thereon during a process. The low stage 210 includes a plurality of vacuum adsorption lines 211 formed on the inner side and having a matrix format to adsorb the mother substrate and the groove lines 213 in a vacuum state, formed at the outermost portion thereof and allowing the airfoil O-ring (OR) to be inserted among them. Also, a substrate stopper projection 214 is formed on the outer side of the groove line 213 to surround the side surface of the loaded mother substrate.

According to this configuration, the mother substrate transferred to the inside of the front adsorption type removing unit 200 is first aligned by the substrate stopper projection 214 and loaded so that the rear surface thereof comes into contact with the upper portion of the airfoil O-ring. Also, during vacuum suction, the airfoil O-ring is inclined toward the inside of the groove line 213, and the mother substrate is mounted on the upper surface of the low stage 210.

In particular, when the mother substrate is suddenly adsorbed to the low stage 210, the mother substrate may be damaged, and in order to prevent this, an electro-pneumatic regulator may be provided to allow the mother substrate to be slowly adsorbed. As described below, the electro-pneumatic regulator may not be provided on the high stage 220.

The high stage 220 is mounted to correspond to the low stage 210, and the auxiliary substrate is adsorbed to separate the auxiliary substrate from the mother substrate. a vacuum adsorption line 221 having the same shape as those of the low stage 210 and The groove line 223 is formed on the high stage 220 and is inside the high stage 220, and the airfoil O-ring is inserted into the groove line 223.

Also, although not shown, in the high stage 220, a predetermined sensor (not shown) may be further provided in order to determine whether the auxiliary substrate is damaged or removed. When the substrate is damaged, the adsorption pressure is lowered. Thereby, the sensor may include an adsorption pressure sensor for detecting the adsorption pressure, and a pressure sensor for detecting the separation including the protrusion and determining the separation of the auxiliary substrate when the protrusion is pressed, the protrusion being formed on It has an upper portion and has a predetermined height.

As described above, in the vacuum adsorption process through the low stage 210 and the high stage 220, a vacuum state is formed between the high stage and the low stage, and the auxiliary substrate is connected to a vacuum adsorption line through a vacuum pump or the like. And the vacuum adsorption line has a width of 2 mm or less and a depth of 1 mm. In this case, the adsorption pressure can be determined to be in the range of about 30 kPa to 90 kPa.

Also, a heating plate may be provided on the lower surface of the low stage 210 to facilitate removal of the auxiliary substrate by providing heat. The heating plate is used to reduce the degree of adhesion between the panel substrate and the auxiliary substrate by adjusting the temperature range of the mother substrate from 30 ° C to 150 ° C.

According to this configuration, the mother substrate is loaded, the low stage 210 and the high stage 220 are spaced apart from each other by a predetermined distance, and each vacuum suction line is in a vacuum state. In this state, the O-ring sealingly closes the inside, and the auxiliary substrate is separated from the panel substrate from the initial gap.

Fig. 8C is an enlarged view showing a part of Fig. 8A showing the structure of the groove type of the airfoil O-ring inserted into the low stage 210. In particular, the airfoil O-ring is made of an elastic material and can be made of a soft material having excellent temperature, chemical, and physical durability such as natural rubber, foamed enamel or non-foamed enamel.

Also, after the auxiliary substrate is separated, the separated auxiliary substrate may not be removed from the airfoil O-ring. To prevent such problems, one surface of the airfoil O-ring may be coated with parylene. The parylene coating represents a polymer coating deposited on an object having a micro-scale thickness that is gaseous at room temperature under vacuum, regardless of the shape of the object. The parylene coating includes a small amount of polycrystal which is linear and has excellent water repellency, and thereby does not cause a serious chemical reaction. In an embodiment of the invention, the airfoil O-ring is coated with parylene having such characteristics that the auxiliary substrate can be easily slid from the O-ring and the adhesion of the O-ring is reduced.

Also, the airfoil O-ring has a "ㄈ" shape by bending the portion thereon twice, and an upper bent portion is inclined at a predetermined angle and is in contact with the mother substrate. Especially when the airfoil O When the ring is adsorbed to the mother substrate, its shape is not held but bent to be inserted into the groove line 213. Thereby, a predetermined step portion 213a is formed in the groove line 213 for this purpose.

Thereby, the front and rear surfaces of the mother substrate are respectively in contact with the airfoil O-rings provided in the low stage 210 and the high stage 220 spaced apart from each other by a predetermined distance and the inside of the airfoil O-ring causes a vacuum The panel substrate and the auxiliary substrate are respectively adsorbed onto the low stage 210 and the high stage 220 so as to be separated, and for this purpose, separation for adjusting the space between the low stage 210 and the high stage 220 is provided. The gap forms a module 230.

The separation gap forming module 230 is used to adjust the gap between the low stage 210 and the high stage 220, and includes a fixed frame 231 disposed on each side of the stage; one or more moving in/out members 232 coupled Between the fixed frames; a height adjusting unit 233 for adjusting the height of the fixed frame 231; and a bottom frame 234 in which the low stage 210 is mounted.

In particular, by the drive unit 236 disposed at the rear stage, the move in/out member 236 is moved inward to limit the position to which the high stage is lowered. The drive unit 236 can be manually operated or configured as a servo motor or the like. In particular, two or more of the moving in/out members 232 may be vertically stacked to appropriately adjust the gap between the low stage 210 and the high stage 220 according to the height of the mother substrate or other processing environment.

After the mother substrate is loaded, if the temperature is unevenly increased, the mother substrate may be bent and stretched to cause a bending phenomenon in which a part of the mother substrate falls off. This may result in a difference of 20 mm or more between the heights of the substrate regions. Also, when the separation process is performed, static electricity may be introduced to the mother substrate. Thereby, in order to prevent this problem, the bending prevention module 240 can be provided on both sides of the low stage 210 to discharge static electricity.

When the mother substrate is loaded to the low stage 210, the bending prevention module 240 is used to temporarily press both end portions of the low stage 210, and the bending prevention module 240 includes a rod type connected by the rotating members 241 and 242. The member and the connecting member are pressed and enter the low stage 210 and exit from the low stage 210.

A predetermined brush may be attached to the pressing member of the bending prevention module 240 to effectively discharge static electricity introduced to the mother substrate.

Hereinafter, a method of removing a substrate by a substrate removing device in a method of manufacturing a flat panel display device according to an embodiment of the present invention will be described with reference to the accompanying drawings.

Figure 11 is a view for explaining a method of removing a substrate in a method of manufacturing a flat panel display device according to an embodiment of the present invention.

Referring to FIG. 11, the mother substrate includes a panel substrate that has undergone the previous procedure and a first auxiliary substrate and a second auxiliary substrate attached thereto, the mother substrate being transported to the inside of the space of the initial gap forming unit and loaded to the adsorption On the stage (S200).

In this case, the panel substrate may be formed as a thin glass substrate having a thickness of 0.5 t or less, and having a thickness ranging from 0.3 t to 0.7 t, which has been subjected to plasma treatment or surface treatment and having a concavo-convex pattern The substrate and the second auxiliary substrate may be attached to the panel substrate. Here, the thickness of the respective substrates is not limited to a specific size.

Next, the mother substrate loaded to the adsorption stage is aligned to the normal position by the substrate alignment module (S210).

Subsequently, the first auxiliary substrate is separated from the mother substrate (S220). First, the visual alignment module images the corner cut of the mother substrate and positions the push pin module such that it corresponds to the corner cut. The push pin module applies a corner cut to expose a contact portion between the panel substrate and the first auxiliary substrate, and the gap knife enters to form an initial gap (S221). Thereafter, the mother substrate is transported to the front adsorption type removing unit and loaded to the low stage, the high stage is lowered, and the first auxiliary substrate is subsequently separated in a vacuum manner (S222). In this case, the low stage and the high stage respectively comprise an airfoil O-ring, and when the mother substrate is surrounded by the airfoil O-ring and the first auxiliary substrate is adsorbed to the high stage, the first auxiliary substrate is from the panel substrate Separation.

Thereafter, the mother substrate from which the first auxiliary substrate is separated is inverted and loaded again to the adsorption stage of the initial gap forming unit (S230). That is, the mother substrate is loaded to the adsorption stage such that the separated second auxiliary substrate faces upward.

The mother substrate is aligned to the normal position by the substrate alignment module (S240).

Subsequently, the second auxiliary substrate is separated from the mother substrate (S250). First, the corner cut portion of the second auxiliary substrate is upwardly pressurized at a predetermined pressure by the aforementioned push pin to expose a contact portion between the second auxiliary substrate and the thin glass substrate, that is, contact between the panel substrate and the second auxiliary substrate And the gap knife moves from one direction to the other direction to partially separate the contact area of the second auxiliary substrate and the mother substrate to form an initial gap (S251).

Next, the mother substrate is transported to the front adsorption type removing unit and loaded to the low stage, and the high stage is lowered, and the second auxiliary substrate is vacuum-separated (S252). In this situation, The second auxiliary substrate is separated from the panel substrate when the mother substrate is surrounded by the airfoil O-ring and the second auxiliary substrate is adsorbed to the high stage.

According to an embodiment of the present invention, a process of manufacturing a thin panel substrate can be easily performed by using an auxiliary substrate, and with respect to a substrate on which a program is previously completed, the auxiliary substrate is formed by using an initial gap forming unit and having an airfoil O-ring and a plurality of vacuums The substrate removing device of the front adsorption type removing unit of the stage on which the adsorption line is formed can be easily separated from the panel substrate. Thereby, the auxiliary substrate can be separated without damage in the substrate manufacturing process, and the procedure is simplified and the cost is reduced.

The foregoing embodiments and advantages are merely exemplary and are not considered as limiting. This teaching can be easily applied to other types of devices. The description is intended to be illustrative, and not to limit the scope of the claims. Many alternatives, modifications, and variations will be apparent to those skilled in the art. Features, structures, and other features of the embodiments described herein can be combined in various ways to obtain additional and/or alternative embodiments.

The present invention is not limited to the details of the foregoing description, unless otherwise specified, and other features are considered to be clearly within the scope of the appended claims. in. All changes and modifications that fall within the scope of the patent application or equivalent to the scope of the application are intended to be included.

S101~S110‧‧‧Steps

Claims (13)

A substrate removing device includes: an initial gap forming unit configured to form an initial gap in the mother substrate formed by attaching an auxiliary substrate and a panel substrate when a mother substrate is loaded, wherein The initial gap forming unit includes: an adsorption stage into which the transferred mother substrate is loaded, and a push pin module configured to control a push pin to press a corner cut of the mother substrate, a visual alignment a module configured to image the corner cut formed in the mother substrate and position the push pin to correspond to the corner cut, and a gap cutter module configured to supply a gap knife to the pressurization by the push pin a substrate contact portion of the corner cut portion to form an initial gap; and a front adsorption type removal unit configured to be formed on a stage on which the mother substrate formed on the initial gap has been loaded The rectangular airfoil O-ring vacuum adsorbs the auxiliary substrate to separate the auxiliary substrate from the panel substrate. The substrate removing device of claim 1, wherein the push pin module further comprises a load cell configured to measure a pressure applied by the push pin on the mother substrate. The substrate removing device of claim 1, wherein the initial gap forming unit includes a plurality of lifting pins coupled to a lower portion of the adsorption stage to support the mother substrate. The substrate removing device of claim 3, wherein the adsorption stage comprises: a plurality of lifting pin holes, wherein the lifting pins are inserted therein; at least one pushing pin hole is formed on the side of the adsorption stage to allow Inserting a push pin; a plurality of main vacuum adsorption lines forming a matrix format to divide an entire area of the mother substrate and configured to first adsorb the mother substrate; and a plurality of sub-vacuum adsorption lines adjacent to the corner cut of the mother substrate A matrix format is formed in the region, and the mother substrate is secondarily adsorbed in the region divided by the main vacuum adsorption lines. The substrate removing device of claim 1, wherein the front adsorption type removing unit comprises: a low load stage onto which the mother substrate is loaded, the low load stage including the airfoil type O a slot line into which the ring is inserted and a plurality of vacuum absorbing lines forming a matrix format and positioned in an inward direction of the slot lines; a high stage disposed above the low stage and including the airfoil type O a slot line into which the ring is inserted and a plurality of vacuum adsorption lines forming a matrix format and positioned inward along the slot lines; a separation gap forming module disposed between the low stage and the high stage Forming a gap; and a bend prevention module configured to remove static electricity generated in the mother substrate. The substrate removing device of claim 5, wherein the high stage further comprises a separate sensing sensor configured to detect whether the mother substrate is separated toward the low stage. The substrate removing device of claim 5, wherein the low stage further comprises a heating unit that applies heat to the rear surface of the substrate. The substrate removing device of claim 5, wherein each of the airfoil O-rings is bent at least twice and has a cross section having a "ㄈ" shape, and each of the airfoil O-rings The side is curved in a direction toward the mother substrate. The substrate removing device of claim 8, wherein the groove lines have a step into which a bent portion of each of the airfoil O-rings is inserted. The substrate removal device of claim 5, wherein the surface of the airfoil O-rings is coated with a parylene coating. A substrate removal method comprising: Providing a first auxiliary substrate, a second auxiliary substrate, and a thin panel substrate; preparing a mother substrate by attaching the first auxiliary substrate and the second auxiliary substrate to the panel substrate; performing a display on the mother substrate a panel manufacturing process; transporting the mother substrate to an initial gap forming unit to form an initial gap between the first auxiliary substrate and the panel, wherein the first auxiliary substrate or the second auxiliary substrate and the panel substrate The initial gap is formed by loading the mother substrate to an adsorption stage, imaging a corner cut formed in the mother substrate, and positioning a push pin to correspond to the corner cut, and controlling the push pin to press the mother substrate The corner cut portion, and a substrate contact portion inserted into the gap cutter to the corner cut portion pressed by the push pin to form an initial gap; transporting the mother substrate to a front adsorption type removal unit to separate the first An auxiliary substrate; the mother substrate is transported to the initial gap forming unit to form an initial gap between the second auxiliary substrate and the panel substrate; and the mother substrate is transported to the front adsorption type removal sheet In this second auxiliary substrate separated. The substrate removal method of claim 11, wherein the panel substrate comprises an array substrate and a color filter substrate, wherein the execution of the display panel manufacturing program on the mother substrate comprises: Performing an array forming process on the substrate; performing a color filter forming process on the color filter substrate; and attaching the array with a liquid crystal layer interposed between the array substrate and the color filter substrate a substrate and the color filter substrate. The substrate removing method of claim 11, wherein the transport of the mother substrate to the front adsorption type removing unit and the separation of the first auxiliary substrate or the second auxiliary substrate comprise: loading the mother substrate Laying onto the low load stage and contacting the mother substrate with an airfoil O-ring formed on the low stage; Lowering a high stage and bringing the mother substrate into an airfoil O-ring formed in the high stage; controlling a plurality of vacuum adsorption lines in a matrix format formed on the low stage and the high stage a vacuum state to separate the first auxiliary substrate or the second auxiliary substrate; and removing static electricity generated in the mother substrate.