KR100510725B1 - Method for manufacturing liquid crystal display device - Google Patents

Abstract

The present invention relates to a method for manufacturing a liquid crystal display device of a liquid crystal dropping method, comprising: loading a first substrate, a second substrate on which a substance is formed into a combiner chamber, bonding the first and second substrates together; And a step of fixing the bonded first and second substrates, and a step of unloading the fixed first and second substrates.

Description

Method for manufacturing liquid crystal display device

The present invention relates to a method for manufacturing a liquid crystal display device, and more particularly, to a method for manufacturing a liquid crystal display device of a liquid crystal dropping method.

As the information society develops, the demand for display devices is increasing in various forms, and in recent years, liquid crystal display devices (LCDs), plasma display panels (PDPs), electro luminescent displays (ELDs), and vacuum fluorescent (VFD) Various flat panel display devices such as displays have been studied, and some of them are already used as display devices in various devices.

Among them, LCD is the most widely used as the substitute for CRT (Cathode Ray Tube) for mobile image display because of its excellent image quality, light weight, thinness, and low power consumption. In addition to the use of the present invention, a variety of applications such as a television, a computer monitor, and the like for receiving and displaying broadcast signals have been developed.

As described above, although various technical advances have been made in order for a liquid crystal display device to serve as a screen display device in various fields, the task of improving the image quality as a screen display device is often arranged with the above characteristics and advantages. . Therefore, in order to use a liquid crystal display device in various parts as a general screen display device, the key to development is how much high definition images such as high definition, high brightness, and large area can be realized while maintaining the characteristics of light weight, thinness, and low power consumption. It can be said.

Such a liquid crystal display may be largely divided into a liquid crystal panel displaying an image and a driving unit for applying a driving signal to the liquid crystal panel, wherein the liquid crystal panel has a predetermined space and is bonded to the first and second glass substrates. And a liquid crystal layer injected between the first and second glass substrates.

The first glass substrate (TFT array substrate) may include a plurality of gate lines arranged in one direction at a predetermined interval, a plurality of data lines arranged at regular intervals in a direction perpendicular to the gate lines, and A plurality of pixel electrodes formed in a matrix form in each pixel region defined by crossing each gate line and data line, and a plurality of thin films that transmit signals of the data line to each pixel electrode by being switched by signals of the gate line Transistors are formed.

The second glass substrate (color filter substrate) includes a black matrix layer for blocking light in portions other than the pixel region, an R, G and B color filter layer for expressing color colors, and a common electrode for implementing an image. Is formed.

The first and second substrates are bonded to each other by a seal material having a predetermined space by a spacer and having a liquid crystal injection hole, so that the liquid crystal is injected between the two substrates.

At this time, in the liquid crystal injection method, the liquid crystal is injected between the two substrates by osmotic pressure when the liquid crystal injection hole is immersed in the liquid crystal liquid by maintaining the vacuum state between the two substrates bonded by the real material. When the liquid crystal is injected as described above, the liquid crystal injection hole is sealed with a sealing material.

However, the manufacturing method of such a liquid crystal injection type liquid crystal display device has the following problems.

First, after cutting into a unit panel, the liquid crystal injection hole is immersed in the liquid crystal liquid by maintaining the vacuum state between the two substrates, so that the liquid crystal injection takes a lot of time, the productivity is reduced.

Second, in the case of manufacturing a large-area liquid crystal display device, when the liquid crystal is injected by the liquid crystal injection method, the liquid crystal is not completely injected into the panel, which causes a defect.

Third, since the process is complicated and time-consuming as described above, several liquid crystal injection equipment is required, which requires a lot of space.

Therefore, in recent years, the manufacturing method of the liquid crystal display device using the method of dropping a liquid crystal is researched. Among them, Japanese Unexamined Patent Application Publication No. 2000-147528 discloses a technique using the following liquid crystal dropping method.

The manufacturing method of the conventional liquid crystal display device using the liquid crystal dropping method is as follows.

1A to 1F are cross-sectional views of a liquid crystal display device according to a conventional liquid crystal dropping method.

As shown in FIG. 1A, an ultraviolet curable material 1 is applied to the first glass substrate 3 on which the thin film transistor array is formed to have a thickness of about 30 μm, and the liquid crystal 2 is disposed inside the material 1 (a thin film transistor array). Dropping At this time, the material 1 is formed without a liquid crystal injection hole.

The first glass substrate 3 as described above is mounted on the table 4 in the vacuum container C that is movable in the horizontal direction, and the entire lower surface of the first glass substrate 3 is mounted on the first adsorption mechanism 5. ) By vacuum adsorption.

As shown in Fig. 1B, the entire lower surface of the second glass substrate 6 on which the color filter array is formed is vacuum-adsorbed and fixed by the second adsorption mechanism 7, and the vacuum vessel C is closed and vacuumed. Then, the second adsorption mechanism 7 is lowered in the vertical direction so that the distance between the first glass substrate 3 and the second glass substrate 6 is 1 mm, and the first glass substrate 3 is mounted. The table 4 is moved in the horizontal direction to preliminarily position the first glass substrate 3 and the second glass substrate 6.

As shown in FIG. 1C, the second adsorption mechanism 7 is lowered in the vertical direction to bring the second glass substrate 6 into contact with the liquid crystal 2 or the actual material 1.

As shown in FIG. 1D, the table 4 on which the first glass substrate 3 is mounted is moved in the horizontal direction to adjust the position of the first glass substrate 3 and the second glass substrate 6.

As shown in FIG. 1E, the second adsorption mechanism 7 is lowered in the vertical direction to bond the second glass substrate 6 to the first glass substrate 3 through the actual material 1, and to press to 5 μm. .

As shown in FIG. 1F, the bonded first and second glass substrates 3 and 6 are taken out of the vacuum container C, and the ultraviolet rays are irradiated to the actual substance 1 to cure the actual substance 1 to provide a liquid crystal display device. Complete

In this case, the real material 1 refers to a main material and a dummy material surrounding the active area of the liquid crystal display.

However, the conventional method of manufacturing the liquid crystal display device of the liquid crystal dropping method has the following problems.

First, since the actual material is formed on the same substrate and the liquid crystal is dropped, the process time until joining the two substrates takes a lot.

Second, since a real material is applied to the first substrate and liquid crystal is dropped, but no process is performed on the second substrate, an unbalance occurs between the processes of the first substrate and the second substrate, thereby efficiently operating the production line. Difficult to do

Third, since the substance is applied to the first substrate and the liquid crystal is dropped, the substrate to which the substance is applied cannot be cleaned by the cleaning equipment USC before bonding. Therefore, it is not possible to wash the material to which the upper and lower substrates are bonded, so that the particles cannot be removed, resulting in the actual contact failure during the bonding.

Fourth, as the size of the substrate increases, misalignment may occur because the substrate is not fixed when the substrate is transferred for unloading or subsequent processing after bonding.

Fifth, as the substrate size increases, it is difficult to maintain the bonding state until the actual hardening of the substrate is performed in a subsequent process.

Sixth, when the substrate is distorted, flow occurs in the liquid crystal between the substrates, which causes a liquid crystal alignment defect.

Seventh, when the substrate is misaligned, the alignment of the upper and lower substrates may be misaligned, thereby decreasing the aperture ratio.

Eighth, when a misalignment of the liquid crystal occurs, spots such as scratches and spots associated with luminance may occur.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object thereof is to provide a method of manufacturing a liquid crystal display device of a liquid crystal dropping method which can improve productivity by shortening process time and maximizing efficiency.

According to an aspect of the present invention, there is provided a method of manufacturing a liquid crystal display device, including: loading a first substrate on which liquid crystal is dropped and a second substrate on which an actual substance is formed into a polymerizer chamber; And a step of fixing the bonded first and second substrates, and a step of unloading the fixed first and second substrates.

Here, in the step of fixing the bonded substrate, it is preferable to fix the first and second substrates by irradiating light onto the actual material.

It is preferable to fix part by irradiating light to the said substance partially.

In the fixing of the bonded substrate, it is preferable that the fixing substrate is further formed on the second substrate to irradiate light onto the fixing substrate to fix the first and second substrates.

The fixing material is preferably formed at the edge of the substrate.

Preferably, the fixing material is formed on the first substrate or the second substrate.

The fixing material is preferably formed at the cutting portion between each panel and the edge of the substrate.

The step of fixing the bonded substrate includes fixing a plurality of main materials for sealing liquid crystals dropped on a plurality of panel parts, a dummy material for protecting the plurality of main materials, and the first and second substrates. It is preferable to comprise the process of forming a real material for fixing, and the process of fixing a said 1st, 2nd board | substrate by irradiating light to the said fixed material.

Preferably, the fixing material is formed on the first substrate or the second substrate.

The dummy material is preferably formed at the outer portion of the plurality of main materials.

Preferably, a plurality of dummy materials are formed at the outer portions of each main material.

The fixing material is preferably formed between the edge of the substrate or between each panel portion.

The step of fixing the bonded substrate includes forming a plurality of main materials for sealing the liquid crystals dropped on the plurality of panel portions, a dummy material for protecting the plurality of main materials, and a part of the dummy materials. It is preferable to comprise a step of fixing the first and second substrates by irradiating light with the light.

Preferably, the main material is formed on the second substrate and the dummy material is formed on the first substrate.

The dummy material is preferably formed at the outer portion of the plurality of main materials.

Preferably, a plurality of dummy materials are formed at the outer portions of each main material.

In addition, the manufacturing method of the liquid crystal display device according to the present invention for achieving the above object, the process of loading a first substrate in which the liquid crystal is dropped, the main material is formed and the second substrate is formed in the fixing material in the adapter chamber; And attaching the first and second substrates, curing the fixing material to fix the first and second substrates, and unloading the fixed first and second substrates. There is another feature to be done.

In addition, a method of manufacturing a liquid crystal display device according to the present invention for achieving the above object is a step of loading a first substrate and a second substrate in which a liquid crystal is dropped and a main substance and a fixing substance are formed in the combiner chamber. And bonding the first and second substrates, curing the fixing material to fix the first and second substrates, and unloading the fixed first and second substrates. There is another feature to be made.

Hereinafter, a method of manufacturing a liquid crystal display device according to the present invention having such a feature will be described in detail with reference to the accompanying drawings.

2A to 2F are schematic cross-sectional views showing the process of the liquid crystal display device according to the present invention.

2A, the liquid crystal 12 is dripped at the 1st glass substrate 11, and the real material 14 is formed in the 2nd glass substrate 13. As shown in FIG. Here, a plurality of panels are designed on one of the first and second glass substrates 11 and 13 to form a thin film transistor array on each panel, and on the remaining substrates, a plurality of panels are designed to correspond to each panel. As a result, a color filter array including a black matrix layer, a color filter layer, a common electrode, and the like is formed in each panel. For ease of explanation, the substrate on which the thin film transistor array is formed is called a first glass substrate 11, and the substrate on which a color filter array is formed is called a second glass substrate 13.

The first and second glass substrates 11 and 13 are loaded into the vacuum adapter chamber 10 so that the first and second glass substrates 11 and 13 are uniformly filled in the respective panels. Coalesce and pressurize.

The pressurized first and second glass substrates 11 and 13 are cut for each panel, and each cut panel is polished to have final quality inspection to complete a liquid crystal display device.

Here, the bonding process is described in more detail as follows.

3 is a flowchart illustrating a bonding process of the liquid crystal display according to the present invention.

The bonding process according to the present invention includes a step of loading two substrates into a vacuum combiner chamber, a process of bonding the two substrates, and a step of irradiating and fixing light to a substance in the same chamber; In addition, the fixed two substrates may be divided into a process of unloading the vacuum adapter chamber.

First, before loading the first and second glass substrates 11 and 13 into the vacuum adhering chamber, the second glass substrate 13 coated with the actual material is cleaned in a USC (Ultra Sonic Cleaner) and in process Remove generated particles. That is, since the liquid crystal is not dripped but the actual material is apply | coated to the 2nd glass substrate 13, cleaning is possible.

And the loading process is a vacuum adhering chamber (FIG. 2B), so that the part to which the real material 14 was apply | coated may be directed to the 2nd glass substrate 13 to which the real material 14 was apply | coated as shown in FIG. The first glass substrate 11 on which the liquid crystal 12 is dripped is fixed to the upper stage 15 of the vacuum cleaner chamber 10 by the vacuum suction method (31S). It is fixed (32S). At this time, the vacuum adapter chamber 10 maintains the standby state.

Specifically, the loader of the robot (not shown in the drawing) has a second glass substrate 13 coated with a sealant 14 so that the portion coated with the seal 14 faces downward. ) Mounts the second glass substrate and places it into the vacuum adapter chamber 10. In this state, the upper stage 15 of the vacuum adhering chamber 10 descends to fix the second glass substrate 13 by vacuum adsorption, and then rise. At this time, it can be fixed by the electrostatic adsorption method instead of the vacuum adsorption method.

The loader of the robot exits the vacuum combiner chamber 10, and the lower stage 16 in the vacuum combiner chamber 10 is placed on the first glass substrate 11 having the liquid crystal 12 dropped by the loader of the robot. ) To the top.

In the above description, although the liquid crystal 12 is dropped on the first glass substrate 11 having the thin film transistor array and the substance is formed on the second glass substrate 13 having the color filter array, the first glass substrate ( 11) a real substance can be applied, and a liquid crystal can be dripped onto the said 2nd board | substrate, and a liquid crystal can also be dripped and the real thing may be apply | coated to either of the two glass substrates. However, the board | substrate with which liquid crystal was dripped may be located in a lower stage, and the remaining board | substrate may be located in an upper stage.

Subsequently, a substrate receiver (not shown) is positioned immediately below the second glass substrate 13 fixed to the upper stage 15 (33S). At this time, the method of placing the substrate receiver on the second substrate is as follows.

First, the upper stage is lowered or the substrate receiver is raised to bring the second glass substrate and the substrate receiver into close proximity, and then the second glass substrate 13 is lowered on the substrate receiver.

Second, the upper stage is first lowered by a predetermined distance and the substrate receiver is secondly raised to bring the second glass substrate 13 and the substrate receiver into close proximity, and then the second glass substrate 13 is moved to the substrate receiver. Put on top.

Third, the upper stage is lowered, the substrate receiver is raised, or the upper stage is first lowered and the substrate receiver is raised secondly, so that the second glass substrate 13 and the substrate receiver have a predetermined distance. The upper stage then adsorbs the second glass substrate.

At this time, the reason why the substrate receiver is positioned below the second glass substrate 13 is that the stages 15 and 16 adsorb the first and second glass substrates by a vacuum adsorption method. Since the degree of vacuum in the adapter chamber becomes higher than the vacuum of each stage while making the chamber 10 into a vacuum state, the suction force of the first and second glass substrates 11 and 13 held by the stage is lost, in particular The second glass substrate adsorbed on the upper stage is to be prevented from falling off and falling on the first glass substrate 11.

 Therefore, before the vacuum chamber is brought into the vacuum state, the second glass substrate 13 adsorbed on the upper stage is placed on the substrate receiver, or the upper stage and the substrate receiver on which the second glass substrate is adsorbed are spaced at a predetermined interval. The second glass substrate 13 may be positioned from the upper stage to the substrate receiver while positioning and vacuuming the chamber. In addition, when the vacuum chamber is started to be vacuumed, the substrate may move due to flow in the chamber in an initial process, and thus, may further configure a means for fixing the chamber.

The vacuum adhering chamber 10 is brought into a vacuum state (34S). Here, the vacuum degree of the vacuum adapter chamber 10 varies depending on the liquid crystal mode to be bonded, but the IPS mode is about 1.0 x 10 ^-3 Pa to 1Pa, and the TN mode is about 1.1 x 10 ^-3 Pa to 10 ^2. Let Pa.

In the above, the chamber 10 of the vacuum adapter may be vacuumed in two stages. That is, the substrate is adsorbed to the upper / lower stages 15 and 16, the door of the chamber is closed, and the first vacuum is started. The substrate receiver is positioned below the upper stage and the substrate adsorbed on the upper stage is placed on the substrate receiver or the substrate is held at a predetermined interval while the substrate is held at the substrate receiver. Is vacuumed second. At this time, the vacuum is faster at the time of the second vacuum than at the first vacuum, and the primary vacuum ensures that the vacuum degree of the vacuum adhering chamber is not higher than the vacuum suction force of the upper stage.

In addition, without separating the vacuum into primary and secondary, the substrate may be adsorbed to each stage and the chamber door may be closed, and then the vacuum may be started constantly to place the substrate receiver under the upper stage during the vacuum. At this time, the time point at which the substrate receiver is positioned below the upper stage should be positioned before the vacuum degree of the vacuum adapter chamber becomes higher than the vacuum suction force of the upper stage.

The reason why the vacuum of the vacuum adapter chamber is secondly carried out as described above is to prevent the vacuum adapter chamber from suddenly evacuating because the substrate in the chamber may be distorted or flowed.

When the vacuum adhering chamber 10 reaches the vacuum in a predetermined state, the upper and lower stages 15 and 16 are each of the first and second glass substrates 11 and 13 by an electrostatic charge (ESC) method. ) Is fixed (35S), and the substrate receiver is placed in its original position (36S).

Here, the electrostatic adsorption method includes at least two or more plate electrodes formed on the stage to supply negative / positive DC power to the plate electrodes and to adsorb them. That is, when a positive or negative voltage is applied to each of the flat plate electrodes, a negative or positive charge is induced on the stage and a conductive layer (a transparent electrode such as a common electrode or a pixel electrode is formed) is formed on the glass substrate by those charges. Therefore, the substrate is adsorbed by the Coulomb force generated between the conductive layer and the stage. At this time, a voltage of about 0.1 to 1 KV is applied when the surface on which the conductive layer of the substrate is formed is located on the stage side, and 3 to 4 KV when a surface on which the conductive layer of the substrate is formed is located on the side opposite to the stage. do. Here, an elastic sheet may be formed on the upper stage.

As shown in FIGS. 2C and 2D, the first glass substrate 11 is lowered by lowering the upper stage 15 while the two glass substrates 11 and 13 are loaded on the stages 15 and 16 by electrostatic adsorption. And the second glass substrate 13 are pressed in order to bond them (37S). At this time, in the pressing method, the upper stage 15 or the lower stage 16 is moved in the vertical direction to press the two substrates, and at this time, the moving speed and the pressure of the stage are varied and pressed. That is, when the liquid crystal 12 of the 1st glass substrate 11 and the 2nd glass substrate 13 contact, or the real material 14 of the 1st glass substrate 11 and the 2nd glass substrate 13 is contacted, The stage is moved at a constant speed or constant pressure up to a point in time, and the pressure is gradually increased gradually from the point of contact to the desired final pressure. That is, the load cell is installed on the axis of the moving stage to recognize the point of contact, and the two glasses at a pressure of 0.1 ton at the time of contact, 0.3 ton at the middle stage, 0.4 ton at the last stage and 0.5 ton at the final stage The substrates 11 and 13 are bonded together (see Fig. 2D).

At this time, the upper stage 15 pressurizes the substrate by one axis, but is provided with a separate load cell (apparatus for measuring pressure) for each axis by installing a plurality of axes to press independently on each axis. Can be installed. Therefore, when the lower stage and the upper stage are not horizontally aligned and the materials are not uniformly bonded, the shafts of the corresponding portions may be pressed at a relatively higher pressure or at a lower pressure so that the materials may be uniformly bonded.

After pressing and bonding the two substrates 11 and 13, light (eg, UV; Ultra Violet) is irradiated to a material for fixing the first and second glass substrates 11 and 13, as shown in FIG. 2E. The first and second glass substrates 11 and 13 are fixed (38S) by curing the actual material. Here, in the fixing process, since the substrate is enlarged (1000 mm x 1200 mm) and the two substrates are bonded after the dropping of the liquid crystal, the two substrates joined together may be misaligned during the next process or movement after the bonding. Accordingly, the two substrates are fixed to prevent the misalignment of the two bonded substrates during the next process or movement after bonding and to maintain the bonded state.

Here, the fixing method will be described in more detail as follows.

First, the fixing method fixes the two substrates bonded in a vacuum or air state after or after the two substrates are bonded in the bonding chamber.

4 is a layout view of a substrate for explaining fixing according to the first embodiment of the present invention.

In the bonded substrate fixing method of the first embodiment of the present invention, in the photocurable material (UV curable resin) coating process as described above, as shown in FIG. A main material 14a for sealing the liquid crystal, a dummy material 14b formed to enclose a plurality of panel portions to protect the internal main material 14a during the bonding and pressing process, and an edge portion of the substrate (cut and removed) Part), that is, the fixing member 14c is formed on the second glass substrate 13 at a predetermined interval in the outer portion of the dummy member 14b. The dummy material 14b is for protecting the main material 14a and the fixing material 14c is only for fixing two substrates and thus is removed during the cutting process.

Thus, the fixing material 14c is formed and the two substrates are bonded together, and then the fixing material 14c is irradiated with light (UV) to cure the fixing material 14c in that state. The two substrates. Here, the upper stage 15 or / and the lower stage 16 is formed with a plurality of holes (about 14) for irradiating light (UV), each substrate is aligned to each stage before bonding After the adsorption, the fixing material 14c and the holes are aligned. Therefore, when the light UV is irradiated from the upper stage or / and the lower stage where the hole is formed, the fixing substance 14c irradiated with light UV and irradiated with light UV through the hole. The two substrates are fixed because is hardened. At this time, the light (UV) irradiation is irradiated with light (UV) to the fixing material 14c by the pin (Pin) for irradiating the light (UV) descends from the upper side of the adapter chamber or rises from the lower side of the adapter chamber. The light irradiation conditions are 50 to 500mW UV for 5 to 40 seconds (preferably 200mW UV for about 14 seconds).

Of course, the main material 14a, the dummy material 14b and the fixing material 14c may be simultaneously formed on the second glass substrate. However, in some cases, the fixing material 14c may be formed on the first glass substrate 11. It may be formed, the fixing material 14c may be formed of a material different from the main material (14a). That is, when the fixing material 14c is made of the same material as the main material 14a, the fixing material 14c is formed on the substrate (second substrate) on which the main material 14a is formed. If the fixing material 14c is formed of a material different from the main material 14a, the fixing material 14c may be formed of a substrate (first substrate) or a main material (not including the main material 14a). 14a) can be formed in the board | substrate (2nd board | substrate) in which it was formed. The main substance 14a and the liquid crystal are formed on the first substrate 11, and the fixing substance 14c is formed on the second substrate 13, or the fixing substance 14c and the liquid crystal are firstly formed. It is formed in the board | substrate 11, and the main board | substrate 14a or the dummy board | substrate 14b can be formed in the 2nd board | substrate 13. As shown in FIG.

5 is a layout view of a substrate for explaining fixing according to the second embodiment of the present invention.

In the bonded substrate fixing method of the second embodiment of the present invention, in the photocurable material (UV curable resin) coating process as described above, as shown in FIG. The main material 14a which seals the liquid crystal, and the dummy material 14b formed to surround the plurality of panel parts in order to protect the internal main material 14a during the bonding and pressing process, are formed on the dummy material 14b. It is partially fixed by irradiation with light (UV).

That is, in the fixing method of the first embodiment of the present invention as shown in FIG. 4, the dummy material 14b is applied to a portion to which the fixing material is applied, and the dummy material 14b is partially irradiated with light UV to provide the dummy material. The actual material 14b is partially fixed. The remaining light (UV) irradiation conditions are the same as in the first embodiment of the present invention. In Fig. 5, reference numeral 14d denotes a portion where the light UV is irradiated.

6 is a layout view of a substrate for explaining fixing according to a third embodiment of the present invention.

According to the fixing method of the third embodiment of the present invention, in the fixing method of the first embodiment of the present invention, the main actual material 14a and the fixing real material 14c are formed without forming a dummy real material, and the fixing real material 14c is provided. The two substrates are fixed by irradiation with light (UV).

7 is a layout view of a substrate for explaining fixing according to the fourth embodiment of the present invention.

In the bonded substrate fixing method of the fourth embodiment of the present invention, in the bonded substrate fixing method of the third embodiment of the present invention, the fixing material 14c is fixed not only to the periphery of the substrate but also to the cutting portions between the panel portions at regular intervals. The two substrates are fixed by forming the seal material 14c and irradiating UV to each of the fixation material 14c.

8 is a layout view of a substrate for explaining fixing according to a fifth embodiment of the present invention.

In the fixing method according to the fifth embodiment of the present invention, in the first embodiment of the present invention as shown in FIG. 4, the panel member (main) is not formed so as to surround all the panel parts (main material). A plurality of dummy materials 14b are formed to surround each of the materials, and a fixing material 14c is formed at the edge of the substrate. As described above, light (UV) is irradiated to the fixing material 14c so that the two The board is fixed.

9 is a layout view of a substrate for explaining fixing according to the sixth embodiment of the present invention.

In the fixing method according to the sixth embodiment of the present invention, in the fifth embodiment of the present invention as shown in FIG. 8, the fixing method is partially formed in the plurality of dummy materials 14b formed in the panel portions without separately forming the fixing material 14c. It is to fix the two substrates by irradiation with light (UV).

In each of the above embodiments, the main material 14a, the dummy material 14b, and the fixing material 14c may be formed on different substrates or on the same substrate. It can form a reality.

In addition, although not shown in the drawing, the main material (UV curable resin) joining the two substrates is partially irradiated with UV without fixing a separate dummy material and a fixing material on the substrate, thereby partially curing the material. can do.

As such, when the two pressurized substrates are preliminarily fixed, the bonded first and second glass substrates may be prevented from being shifted or deformed when the next process or the next process moves for the next process.

As described above, when the two substrates are bonded and fixed, the adsorption is stopped by the electrostatic adsorption method (ESC off), and then the upper stage 15 is raised by raising the upper stage 15 as shown in FIG. 2F. Separate from the two bonded glass substrates (11, 13).

Then, the substrates 11 and 13 are unloaded (38S). That is, the upper stage 15 rises and unloads the first and second glass substrates 11 and 13 bonded using the loader of the robot, or the first and second glass substrates 11 and 13 bonded together. After the upper stage 15 is absorbed and raised, the robot's loader unloads the upper stage 16.

At this time, in order to shorten the process time, one of the first glass substrate 11 or the second glass substrate 13 to be subjected to the next bonding process is loaded on the stage and the unbonded first and second glass substrates are unloaded. Can be. That is, a second substrate to be bonded next is placed on the upper stage 15 using a loader of a robot so that the upper stage fixes the second substrate by vacuum adsorption, and then on the lower stage 16. Unloading the bonded first and second substrates, or the upper stage 15 adsorbs the first and second glass substrates 11 and 13 to which the upper and lower substrates are bonded, and the loader of the robot moves to the first bonding process. After loading the glass substrate 11 on the lower stage, the bonded first and second glass substrates may be unloaded.

The manufacturing method of the liquid crystal display device according to the present invention as described above has the following effects.

First, since a liquid crystal is dropped on the first substrate and a substance is formed on the second substrate, the process time before joining the two substrates is shortened, thereby improving productivity.

Second, since liquid crystal is dropped on the first substrate and a substance is applied on the second substrate, the process of the first substrate and the second substrate is balanced so that the production line can be efficiently operated.

Third, since the liquid crystal is dropped on the first substrate and the substance is applied to the second substrate, the substrate coated with the substance can be cleaned in the cleaning equipment (USC) just before bonding, thereby preventing the substance from being contaminated from particles. can do.

Fourth, since the substrate receiver is positioned below the substrate and the adapter chamber is made in a vacuum state, the substrate adsorbed on the upper stage can be prevented from falling and the substrate is damaged.

Fifth, since the two substrates are bonded while recognizing the time point at which the two substrates are in contact with each other, the damage that the dropped liquid crystal may affect the alignment layer may be minimized.

Sixth, since the upper stage presses the substrate by a plurality of shafts that can press independently on each axis, when the lower stage and the upper stage are not horizontal to each other and the material is not uniformly bonded, It may be pressurized to a higher pressure or to a lower pressure so that the substance can be uniformly bonded.

Seventh, since vacuuming the adjoiner chamber over a second time, it is possible to prevent the chamber from suddenly vacuuming, thereby preventing the substrate from breaking and flowing due to a sudden vacuum.

Eighth, after the two substrates are bonded together, the fixing or dummy materials are partially cured to fix the two bonded substrates, and then the next process is performed. Therefore, the first glass substrate and the second glass substrate are used during the next process or movement. This misalignment can be prevented.

Ninth, loading and unloading can be done at the same time, reducing the process time.

Tenth, since the liquid crystal spreading step is performed, the process time of the liquid crystal display device can be shortened.

1A to 1F are schematic cross-sectional views showing a conventional liquid crystal display method of a liquid crystal display device.

2a to 2f are schematic cross-sectional views showing a liquid crystal display device process of the liquid crystal dropping method according to the present invention.

3 is a bonding process flow chart according to the present invention

4 is a real layout view for explaining the fixing according to the first embodiment of the present invention.

5 is a real layout view for explaining the fixing according to the second embodiment of the present invention.

6 is a real layout view for explaining the fixing according to the third embodiment of the present invention.

7 is a real layout view illustrating the fixing according to the fourth embodiment of the present invention.

8 is a real layout view for explaining the fixing according to the fifth embodiment of the present invention.

9 is a real layout view for explaining the fixing according to the sixth embodiment of the present invention.

Explanation of symbols for the main parts of the drawings

10 vacuum vacuum chamber 11, 13 glass substrate

12: liquid crystal 14: real

14a: main entity 14b: dummy entity

14c: fixing material 15: upper stage

16: lower stage

Claims (23)

Loading a first substrate and a second substrate on which a main substance and a fixing substance are formed into a combiner chamber having upper and lower stages; Vacuuming the interior of the adapter chamber in two stages; Bonding the first and second substrates by varying moving speeds and pressures of the upper and lower stages; Fixing the bonded first and second substrates; And, And unloading the fixed first and second substrates. The method of claim 1, In the fixing of the bonded substrate, the first and second substrates are fixed by irradiating light onto the fixing material. The method of claim 2, And fixing light by partially irradiating light to the fixing material. delete The method of claim 1, The fixing material is formed on the edge of the substrate manufacturing method of the liquid crystal display device. delete The method of claim 1, The fixing material is formed in the cutting portion between each panel and the edge of the substrate manufacturing method of the liquid crystal display device. The method of claim 1, And forming a dummy material to protect the main material. delete The method of claim 8, And the dummy real material is formed at an outer portion of the plurality of main real materials. The method of claim 8, And a plurality of dummy materials are formed in the outer portion of each main material. The method of claim 1, The fixing material is formed on the edge of the substrate or between each panel portion manufacturing method of the liquid crystal display device. delete delete delete delete Loading a first substrate on which liquid crystal is dropped and a main substance is formed, and a second substrate on which a fixing substance is formed into a combiner chamber having upper and lower stages; Vacuuming the interior of the adapter chamber in two stages; Bonding the first and second substrates by varying moving speeds and pressures of the upper and lower stages; Hardening the fixing material to fix the first and second substrates; And, And unloading the fixed first and second substrates. Loading a first substrate and a second substrate on which a liquid crystal is dropped and a main substance and a fixing substance are formed into a combiner chamber having upper and lower stages; Vacuuming the interior of the adapter chamber in two stages; Bonding the first and second substrates by varying moving speeds and pressures of the upper and lower stages; Hardening the fixing material to fix the first and second substrates; And, And unloading the fixed first and second substrates. The method of claim 18, And partially irradiating light to the fixing material to fix the first and second substrates. Loading a first substrate onto which a liquid crystal is dropped and a fixing substance is applied and a second substrate on which a main substance is applied into a combiner chamber having upper and lower stages; Vacuuming the interior of the adapter chamber in two stages; Bonding the first and second substrates by varying moving speeds and pressures of the upper and lower stages; Hardening the fixing material to fix the first and second substrates; And, And unloading the fixed first and second substrates. The method of claim 2 or 19, The light irradiation irradiates light of 50 kHz to 500 kHz. The method of claim 21, And irradiating the light for 5 seconds or more. The method of claim 2 or 19, The light irradiation is a method for manufacturing a liquid crystal display device, characterized in that the light irradiation pin is lowered from the upper side of the adapter chamber or raised from the lower side to irradiate light to the real.