TWI518922B - Package structure of optical apparatus - Google Patents

Description

Optical device package structure

The present invention relates to a package structure, and more particularly to a package structure for an optical device.

FIG. 1 is a cross-sectional view showing a package structure of a conventional proximity photosensor. Referring to FIG. 1 , the proximity photosensor 100 includes a light source 110 , a photodetector 120 , and a package housing 130 . The package housings 130 have a first accommodating space 132 and a second accommodating space 134 , wherein the illuminating source 110 is disposed in the first accommodating space 132 , and the photodetector 120 is disposed in the second accommodating space 134 . In the proximity photosensor 100, when an object 101 is close to the proximity photosensor 100, the light beam L1 provided by the illumination source 110 is reflected by the object 101 and transmitted back to the photodetector 120. Thereby, it is possible to know whether the object 101 is close to the message.

However, in the proximity photosensor 100, the illumination source 110 located in the first accommodating space 132 is electrically connected to the package housing 130 through a surface adhesion, and the photodetector 120 is usually connected by wire bonding. The way is electrically connected to the package housing 130, as shown in FIG. As a result, the size of the second accommodating space 134 (eg, the width W1) is not easily reduced.

In addition, the package structure 130 further includes a light shielding structure 136 between the light source 110 and the light detector 120 to prevent the light beam L1 provided by the light source 110 from being directly transmitted to the light sensor 120 and unable to operate. However, although the design and use of the light shielding structure 136 can effectively limit the traveling path of the light, the proximity photo sensor is still caused in the same manner. The overall volume of 100 cannot be effectively reduced.

The present invention provides a package structure for an optical device that can be of a smaller size and has better optical performance.

Other objects and advantages of the present invention will become apparent from the technical features disclosed herein.

In order to achieve one or a part or all of the above or other purposes, an embodiment of the present invention provides a package structure for an optical device, comprising a substrate, a light-emitting element, a light-sensing element, and a light-blocking structure. The light emitting element is disposed on the substrate and electrically connected to the substrate. The illuminating element is adapted to provide a light beam. The photosensitive element is disposed on the substrate, and the photosensitive element is a chip scale package (CSP), wherein the photosensitive element is adapted to receive a light beam reflected by an object. The light blocking structure is disposed at the periphery of the photosensitive element.

In an embodiment of the invention, the light blocking structure is disposed on the substrate and physically connected to the substrate. In an embodiment of the invention, the package structure of the optical device further comprises a multilayer film disposed on the photosensitive element, wherein at least a portion of the light beam reflected by the object is adapted to be transmitted to the photosensitive element through the multilayer film. In an embodiment of the invention, if at least a portion of the light beam reflected by the object is incident on the multilayer film at an incident angle less than a predetermined angle, the light beam is adapted to be transmitted to the photosensitive element through the multilayer film.

In an embodiment of the invention, the light blocking structure is physically connected to the photosensitive element. In an embodiment of the invention, the package structure of the optical device further comprises a multilayer film disposed on the photosensitive element, wherein at least a portion of the light beam reflected by the object is adapted to be transmitted to the photosensitive element through the multilayer film. In an embodiment of the invention, the light blocking structure comprises a light blocking cover, and the position And above the photosensitive element and having an opening, wherein at least part of the light beam reflected by the object is adapted to be transmitted to the photosensitive element through the opening. In an embodiment of the invention, the opening exposes a portion of the multilayer film. In an embodiment of the invention, the package structure of the optical device further includes a partition wall disposed on the substrate and located between the photosensitive element and the light emitting element. In an embodiment of the invention, if at least a portion of the light beam reflected by the object is incident on the multilayer film at an incident angle less than a predetermined angle, the light beam is adapted to be transmitted to the photosensitive element through the multilayer film.

In an embodiment of the invention, the light blocking structure comprises a light transmissive material layer and a light shielding material layer, one side of the light transmissive material layer is physically connected to the photosensitive element, and the other side of the light transmissive material layer is The opaque material layer is in physical contact. In an embodiment of the invention, the light transmissive material layer covers the photosensitive element, and the light shielding material layer has an opening to expose a portion of the light transmissive material layer, and at least part of the light beam reflected by the object is adapted to be transmitted through the opening to Photosensitive element.

In an embodiment of the invention, the light-emitting element is an invisible light-emitting element, and the light-sensitive element is an invisible light-sensitive element.

In an embodiment of the invention, the photosensitive element is electrically connected to the substrate through a plurality of conductive materials, and the conductive material is located between the photosensitive element and the substrate.

In an embodiment of the invention, the distance between the light-emitting element and the photosensitive element is greater than 0.1 mm and less than 3 mm.

Based on the above, the package structure of the optical device of the present invention uses the photosensitive member as a wafer-sized package member without using a conventional wire bonding method, thereby reducing the overall size and size of the package structure of the optical device. In addition, the multilayer film is disposed on the photosensitive member, and in addition to reducing the chance of transmission of stray light to the photosensitive member, the overall volume and size of the package structure of the optical device can be reduced. Furthermore, by appropriately adjusting the design of the light blocking structure, in addition to being able to shrink In addition to the overall size and size of the package structure of the optical device, the manufacturing cost and the manufacturing difficulty can be reduced.

The above described features and advantages of the present invention will be more apparent from the following description.

〔this invention〕

100‧‧‧Close-up light sensor

101‧‧‧ objects

110‧‧‧Light source

120‧‧‧Photodetector

130‧‧‧Package housing

132‧‧‧First accommodation space

134‧‧‧Second accommodating space

136‧‧‧ shading structure

200~800‧‧‧Optical device package structure

201‧‧‧ objects

210‧‧‧Substrate

220‧‧‧Lighting elements

230‧‧‧Photosensitive elements

232‧‧‧Electrical materials

240, 410, 710, 710' ‧ ‧ light blocking structure

310‧‧‧Multilayer film

412‧‧‧Light blocking cover

412a, 714a‧‧‧ openings

610‧‧‧ partition wall

712, 712'‧‧‧Lighting material layer

714, 714'‧‧‧ shading material layer

712a‧‧‧ inside

712b‧‧‧Outside

L1‧‧‧ Beam

L1’‧‧‧ Beam

Θ‧‧‧incident angle

N1‧‧‧ normal

FIG. 1 is a cross-sectional view showing a package structure of a conventional proximity photosensor.

2 is a schematic view showing a package structure of an optical device according to an embodiment of the present invention.

3A is a schematic view showing a package structure of an optical device according to another embodiment of the present invention.

3B is a partial enlarged view of the package structure of the optical device of FIG. 3A.

4 is a schematic view showing a package structure of an optical device according to still another embodiment of the present invention.

FIG. 5 is a schematic diagram of a package structure of an optical device according to still another embodiment of the present invention.

FIG. 6 is a schematic diagram of a package structure of an optical device according to a further embodiment of the present invention.

FIG. 7 is a schematic diagram of a package structure of an optical device according to still another embodiment of the present invention.

FIG. 8 is a schematic diagram of a package structure of an optical device according to still another embodiment of the present invention.

The above and other technical contents, features and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments. The directional terms mentioned in the following embodiments, such as up, down, left, right, front or back, etc., are only directions referring to the additional drawings. Therefore, the directional terminology used is for the purpose of illustration and not limitation.

2 is a schematic view showing a package structure of an optical device according to an embodiment of the present invention. The package structure 200 of the optical device of this embodiment can be described as an architecture of a proximity photosensor. Specifically, the package structure 200 of the optical device includes a substrate 210, a light emitting element 220, a photosensitive element 230, and a light blocking structure 240. The light emitting element 220 is disposed on the substrate 210 and electrically connected to the substrate 210. Light-emitting element 220 is adapted to provide a light beam L1. In this embodiment, the light-emitting element 220 can be a light-emitting diode or a laser diode. The light-emitting diode 220 of the present embodiment is an example of a light-emitting diode because the cost of the light-emitting diode is relatively low. Description, but not limited to this. If the package structure 200 of the optical device can provide a long operable distance and does not consider the cost, the light-emitting element 220 can also be a laser diode. In addition, in order to prevent the user from observing the light of the light-emitting element 220, the light-emitting element 220 of the present embodiment is exemplified by invisible light, wherein the light-emitting element 220 of infrared light is preferred, but is not limited thereto.

In addition, when the light emitting element 220 is a light emitting diode, in order to effectively reduce or reduce the overall volume and size of the package structure 200 of the optical device, the light emitting element 220 may be a surface mounted technology (SMT) light emitting element. The electrical connection with the substrate 210 can be a circuit board or a lead frame.

In the package structure 200 of the optical device, the photosensitive element 230 is disposed on the substrate 210, and the photosensitive element 230 is adapted to receive the light beam L1' reflected by an object 201. In particular, in order to effectively reduce or reduce the overall size and size of the package structure 200 of the optical device, the photosensitive element 230 may be a chip scale package (CSP), wherein the chip size package (CSP) technology is After the chip is packaged, the package size is no more than 1.2 times the original chip. Specifically, the wafer-sized package component in the present embodiment refers to the photosensitive component 230 packaged in various manners, wherein the package body length is less than 20% longer than the length of the inner wafer, or the area of the package is an embedded wafer. Within 1.5 times the area. In other words, the photosensitive element 230 of the embodiment is transparent. By using the chip size package (CSP) technology, the package size of the photosensitive element 230 can be reduced to 1/4 to 1/10 of the original to match the current trend of light, thin, short, and small products.

In addition, in order to avoid the conventional connection of the photosensitive element 230 and the substrate 210 by wire bonding, the overall package size is not easily reduced. The photosensitive element 230 of the embodiment can be electrically connected to the substrate 210 through a plurality of conductive materials 232. Sexually connected, and these conductive materials 232 are interposed between the photosensitive element 230 and the substrate 210, as shown in FIG. In this embodiment, the conductive material 232 can be a solder ball.

Referring to FIG. 2, in order to prevent the light beam L1 provided by the light-emitting element 220 from being directly transmitted to the photosensitive element 220, the package structure 200 of the optical device cannot be operated (for example, determining whether an object is close), and therefore, the light blocking structure The light blocking structure 240 is disposed on the substrate 210 and physically connected to the substrate 210, as shown in FIG. 2 . It should be noted that, since the photosensitive element 230 is a chip-sized package component, and the photosensitive element 230 can be directly electrically connected to the substrate 210 through the conductive material 232, without using a conventional wire bonding method, the photosensitive element 230 can be blocked. The distance between the light structures 240 is relatively close (without the need to consider the space required for wire bonding), further reducing the overall size and size of the package structure 200 of the optical device.

3A is a schematic view showing a package structure of an optical device according to another embodiment of the present invention. Referring to FIG. 2 and FIG. 3A simultaneously, the package structure 300 of the optical device of the present embodiment adopts a similar structure to the package structure 200 of the optical device, and the difference is that the package structure 300 of the optical device further includes a plurality of layers. The film 310, wherein the multilayer film 310 is disposed on the photosensitive element 230, and at least a portion of the light beam L1' reflected by the object 201 is adapted to be transferred to the photosensitive element 230 through the multilayer film 310.

In particular, the multilayer film 310 can be stacked by a film layer 312 of different refractive index to filter light of a specific wavelength, so that the light beam L1' of a specific wavelength can be penetrated, wherein the incident light rays deviating from the normal line N1 The penetrable wavelength can be the wavelength offset of a particular wavelength. For example, if the stacked film layer 312 of the multilayer film 310 is permeable at a design wavelength of 680 nm, it can pass when the incident angle θ of the incident light beam L1 ′ having a wavelength of 680 nm is 0 degrees, and when it deviates from the normal line (ie, When the incident angle θ is greater than 0 degrees, it means that other wavelengths (for example, 670 nm to 690 nm) can be transmitted to the photosensitive element 230 through the multilayer film 310. In other words, the multilayer film 310 of the present embodiment can be an IR pass filter element.

In detail, if the incident angle θ of the at least partial light beam L1 ′ reflected by the object 201 incident on the multilayer film 310 is less than a predetermined angle, the light beam L1 ′ is adapted to be transmitted to the photosensitive element 230 through the multilayer film 310 , as shown in FIG. 3B . 3B is a partial enlarged view of the package structure of the optical device of FIG. 3A. In detail, when the incident angle θ of the light beam L1 ′ of a specific wavelength range incident on the multilayer film 310 is smaller (that is, the closer the light beam L1 ′ is to the normal line N1 ), the light beam L1 ′ of a specific wavelength range passes through the multilayer film 310 more easily. The light is transmitted to the photosensitive element 230. Conversely, when the incident angle θ of the light beam L1' of a specific wavelength range is incident on the multilayer film 310 (i.e., the farther the light beam L1' is away from the normal line N1), the light beam L1' of a specific wavelength range is It is not transmitted to the photosensitive member 230 through the multilayer film 310. It is worth mentioning that the specific wavelength range mentioned above may refer to the wavelength of the light beam L1' provided by the light-emitting element 220, and the light-blocking structure 240 of a suitable height will limit the incident angle θ of the light beam L1' incident on the multilayer film 310. Thus, the light beam L1' of a specific wavelength range can be filtered more efficiently, and the light beam L1' of a specific wavelength range is transmitted to the photosensitive element 230 through the multilayer film 310. In one embodiment, the height of the light blocking structure 240 is greater than the height of the light emitting element and the photosensitive element and is less than 5 mm.

Based on the above, the package structure 300 of the optical device of the present embodiment can not only have the advantages mentioned in the package structure 200 of the optical device described above, but also can reduce the chance of transmission of stray light to the photosensitive element 230 through the use of the multilayer film 310. Thereby, the optical sensing performance of the package structure 300 of the optical device can be improved.

4 is a schematic view showing a package structure of an optical device according to still another embodiment of the present invention. Referring to FIG. 4 and FIG. 3 simultaneously, the package structure 400 of the optical device of the present embodiment adopts a similar structure to the package structure 300 of the optical device. The difference is that the light blocking structure 410 is physically connected to the photosensitive element 230, but It is not physically connected to the substrate 210. Specifically, in this embodiment, the light blocking structure 410 is disposed at the periphery of the photosensitive element 230 and physically connected to the photosensitive element 230, so that the foregoing light blocking structure 240 is not required to be disposed on the substrate 210. That is, when the photosensitive element 230 is disposed on the substrate 210, the light blocking structure 240 is simultaneously disposed on the substrate 210 along with the photosensitive element 230. This will further reduce the overall size and size of the package structure 400 of the optical device.

Based on the above, the package structure 400 of the optical device of the present embodiment can be connected to the design of the photosensitive element 230 by physically connecting the light blocking structure 410, in addition to the advantages mentioned in the package structure 200, 300 of the optical device. The overall volume and size of the package structure 400 of the optical device is further reduced.

FIG. 5 is a schematic diagram of a package structure of an optical device according to still another embodiment of the present invention. Referring to FIG. 5 and FIG. 4 simultaneously, the package structure 500 of the optical device of the present embodiment and the package structure 400 of the optical device are similar in structure, and the difference is that the light blocking structure 410 further includes a light blocking cover 412. The light blocking cover 412 is located above the photosensitive element 230 and has an opening 412a exposing a portion of the multilayer film 310, and at least a portion of the light beam L1' reflected by the object 201. It is adapted to be transmitted to the photosensitive element 230 through the opening 412a. In this embodiment, the package structure 500 of the optical device may have the advantages mentioned in the package structure 200-400 of the optical device, and the light blocking cover 412 having the opening 412a may be disposed above the photosensitive element 230, thereby further The transfer of stray light to the photosensitive member 230 can be more effectively reduced.

FIG. 6 is a schematic diagram of a package structure of an optical device according to a further embodiment of the present invention. Referring to FIG. 6 and FIG. 5 simultaneously, the package structure 600 of the optical device of the present embodiment adopts a similar structure to the package structure 500 of the optical device, and the difference is that the package structure 600 of the optical device further includes a partition wall. 610, wherein the partition wall 610 is disposed on the substrate 210 and located between the photosensitive element 230 and the light emitting element 220, so as to reduce the possibility that the light beam L1 provided by the light emitting element 220 is directly transmitted from the side to the photosensitive element 230. The stray light is reduced from being transmitted to the photosensitive member 230. In addition, the package structure 600 of the optical device of the present embodiment also has the advantages mentioned in the package structure 200-500 of the foregoing optical device, and details are not described herein again.

FIG. 7 is a schematic diagram of a package structure of an optical device according to still another embodiment of the present invention. Referring to FIG. 7 and FIG. 4 simultaneously, the package structure 700 of the optical device of the present embodiment and the package structure 400 of the optical device are similar in structure, and the difference is that the light blocking structure 710 of the embodiment includes a transparent The light material layer 712 and a light shielding material layer 714, wherein one side 712a of the light transmissive material layer 712 is physically connected to the photosensitive element 230, and the other side 712b of the light transmissive material layer 712 is in physical contact with the light shielding material layer 714. In this embodiment, a light transmissive material (eg, a transparent adhesive material) may be first formed on the periphery of the photosensitive member 230 to form a light transmissive material layer 712 as shown in FIG. 7, and then coated or attached. In a manner, a light-shielding material such as black resin is formed on the outer side 712b of the light-transmitting material layer. Alternatively, after the light blocking structure 710 as shown in FIG. 7 is formed, the light blocking structure 710 is connected to the photosensitive element 230 (eg, attached), and all of the above are examples that can be implemented. However, it is not limited to this, and this part can be slightly adjusted according to the user. Based on the above, the package structure 700 of the optical device of the present embodiment may have the advantages mentioned in the package structure 200-400 of the above optical device, and details are not described herein again.

FIG. 8 is a schematic diagram of a package structure of an optical device according to still another embodiment of the present invention. Referring to FIG. 8 and FIG. 7 simultaneously, the package structure 800 of the optical device of the present embodiment is similar to the package structure 700 of the optical device, and the difference is that the light transmissive material layer 712' covers the photosensitive element 230. The light shielding material layer 714' has an opening 714a to expose a portion of the light transmissive material layer 712', wherein at least a portion of the light beam L1' reflected by the object 201 is adapted to be transmitted to the photosensitive element 230 through the opening 714a, as shown in FIG. Show. In this embodiment, the light-transmissive encapsulant is directly formed on the photosensitive element 230 to form the light-transmissive material layer 712' as shown in FIG. 8, and then the coating is applied by coating or attaching. A material such as black resin is formed on the outer side of the light transmissive material layer 712' as shown in FIG. Similarly, the package structure 800 of the optical device of the present embodiment may have the advantages mentioned in the package structure 200-400 of the above optical device, and details are not described herein again.

It is to be noted that, since the overall size of the package structure 200-800 of the optical device of the present embodiment can be greatly reduced compared with the overall size of the package structure 100 of the conventional optical device, the above-mentioned light-emitting element 210 and the above-mentioned light-sensitive element are The distance W1 between the elements 230 may fall between at least 0.1 mm to 3 mm.

In summary, the package structure of the optical device of the present invention has at least the following advantages. First, the photosensitive element is a wafer-sized package component and does not require conventional wire bonding, thereby reducing the overall size and size of the package structure of the optical device. In addition, the multi-layer film is disposed on the photosensitive element, in addition to reducing the chance of transmission of stray light to the photosensitive element, The overall size and size of the package structure of the small optical device. Furthermore, by appropriately adjusting the design of the light blocking structure, in addition to reducing the overall size and size of the packaging structure of the optical device, the manufacturing cost and the manufacturing difficulty can be reduced.

The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent. In addition, any of the objects or advantages or features of the present invention are not required to be achieved by any embodiment or application of the invention. In addition, the abstract sections and headings are only used to assist in the search of patent documents and are not intended to limit the scope of the invention.

200‧‧‧Encapsulation structure of optical device

201‧‧‧ objects

210‧‧‧Substrate

220‧‧‧Lighting elements

230‧‧‧Photosensitive elements

232‧‧‧Electrical materials

240‧‧‧Light blocking structure

L1‧‧‧ Beam

L1’‧‧‧ Beam

Claims (5)

A package structure of an optical device, comprising: a substrate; a light-emitting element disposed on the substrate and electrically connected to the substrate, wherein the light-emitting element is adapted to provide a light beam; a light-sensing element disposed on the substrate, and The photosensitive element is a chip scale package (CSP), wherein the photosensitive element is adapted to receive the light beam reflected by an object; a multilayer film disposed on the photosensitive element, wherein the object is reflected by the object And at least part of the light beam is adapted to be transmitted to the photosensitive element through the multilayer film; and a light blocking structure is disposed on a periphery of the photosensitive element, wherein the light blocking structure is physically connected to the photosensitive element, but the light blocking structure is not Physically coupled to the substrate, and the light blocking structure includes: a light blocking cover over the photosensitive element and having an opening, wherein at least a portion of the light beam reflected by the object is adapted to be transmitted to the photosensitive element through the opening . The package structure of the optical device of claim 1, wherein at least a portion of the light beam reflected by the object is incident on the multilayer film at an incident angle of less than a predetermined angle, the light beam is adapted to pass through the multilayer film And passed to the photosensitive element. The package structure of the optical device according to claim 1, wherein the light-emitting element is an invisible light-emitting element, and the photosensitive element is an invisible light-sensitive element. The package structure of the optical device according to claim 1, wherein the photosensitive element is electrically connected to the substrate through a plurality of conductive materials, and the conductive materials are located between the photosensitive element and the substrate. The package structure of the optical device according to claim 1, wherein the distance between the light-emitting element and the photosensitive element is greater than 0.1 mm and less than 3 mm.