TW201635089A - Portable electronic device and light sensing package thereof - Google Patents

Abstract

The invention discloses a portable electronic device, which comprises a housing, a cover and a light sensing package. The cover body is disposed on the housing. The cover has a first light transmissive area and a second light transmissive area. The light sensing package is disposed in the housing. The light sensing package includes a first wafer, a second wafer, and a blocking portion. The first wafer provides a light source. The second wafer has a first sensing region and a second sensing region. The first sensing area provides an ambient light sensing signal, and the second sensing area provides a proximity sensing signal. The second sensing region is located between the first wafer and the first sensing region. The blocking portion is disposed between the first wafer and the second wafer. The first sensing region is located below the first light transmissive region. The first wafer and the second sensing region are located below the second light transmissive region.

Description

Portable electronic device and light sensing package thereof

The present invention relates to light sensing, and more particularly to a portable electronic device capable of increasing a field of view (FOV) angle and visible light transmittance and a light sensing package thereof.

In recent years, with the advancement of optical sensing technology, various light sensors with different functions, such as Ambient Light Sensor (ALS) and Proximity Sensor (PS), have been gradually developed. And has been widely used in portable electronic devices such as notebooks, tablets and smart phones.

However, as shown in FIG. 1 , since the common light sensing package 1 on the market mostly adopts a design of double light transmission holes (including a light emitting light transmission hole and a light sensing light transmission hole), it is located in the light sensing light transmission hole. The underlying ambient light and proximity sensor wafer 10 are subject to the problem that the field of view (FOV) of the light sensing is too small. Once the light sensing package 1 is applied to a portable electronic device, the ambient light and the brightness variation of the ambient light sensed by the proximity sensor wafer 10 are significantly different from the brightness changes of the ambient light actually perceived by the human eye.

Furthermore, as shown in FIG. 2, if the photo-sensing package 2 is additionally provided with a black rubber sleeve 24, the ambient light under the light-sensing light-transmitting aperture and the proximity sensor wafer 20 receive light. The angle of view becomes smaller than that of Figure 1. In addition, since the ambient light and the proximity sensor chip 20 also need to receive infrared light when performing proximity sensing, the light sensing light transmission holes located on the ambient light and the proximity sensor chip 20 also need to be provided with infrared light. Through the film, the ambient light and the brightness of the visible light sensed by the proximity sensor wafer 20 are greatly attenuated by the influence of the infrared light penetrating the film.

In view of the above, the present invention provides a portable electronic device capable of increasing the viewing angle and visible light transmittance of ambient light sensing and a light sensing package thereof to solve the problems described in the prior art.

A preferred embodiment of the present invention is a light sensing package. In this embodiment, the light sensing package is disposed in the housing. The housing has a first light transmissive area and a second light transmissive area. The light sensing package includes a first wafer, a second wafer, and a first blocking portion. The first wafer provides a light source. The second wafer has a first sensing region and a second sensing region. The first sensing area provides an ambient light sensing signal, and the second sensing area provides a proximity sensing signal. The second sensing region is located between the first wafer and the first sensing region. The first blocking portion is disposed between the first wafer and the second wafer. The first sensing region is located below the first light transmitting region, and the first wafer and the second sensing region are located below the second light transmitting region.

In an embodiment of the invention, the second light transmissive region is of a circular shape and has a diameter of less than 2 mm.

In an embodiment of the invention, the first sensing area and the second sensing area have a first distance and the second sensing area and the first wafer have a second distance, the first distance is greater than the second distance .

In an embodiment of the invention, the one side of the second sensing region has a third distance to one side of the first wafer, and the third distance is less than 2 mm.

In an embodiment of the invention, the second light transmissive region is provided with a first film to filter out light of other non-infrared light wavelengths.

In an embodiment of the invention, the first light transmissive region is provided with a second film to enhance the passage of ambient light.

In an embodiment of the invention, the light sensing package further includes a second blocking portion. The second blocking portion is disposed on the second wafer and located between the first sensing region and the second sensing region.

Another preferred embodiment of the present invention is a portable electronic device. In this embodiment, the portable electronic device includes a housing, a cover, and a light sensing package. The cover body is disposed on the housing. The cover has a first light transmissive area and a second light transmissive area. The light sensing package is disposed in the housing. The light sensing package includes a first wafer, a second wafer, and a blocking portion. First wafer supply a light source. The second wafer has a first sensing region and a second sensing region. The first sensing area provides an ambient light sensing signal, and the second sensing area provides a proximity sensing signal. The second sensing region is located between the first wafer and the first sensing region. The blocking portion is disposed between the first wafer and the second wafer. The first sensing region is located below the first light transmitting region, and the first wafer and the second sensing region are located below the second light transmitting region.

Compared with the prior art, the portable electronic device and the light sensing package thereof according to the present invention separate the ambient light sensor and the proximity sensor disposed on the same light sensing wafer from each other by a distance. Therefore, the independent light-transmitting hole corresponding only to the ambient light sensor is increased to increase the viewing angle thereof, and the independent light-transmitting hole is not located under the infrared light penetrating film disposed on the surface glass, so Under the influence of the infrared light penetrating film, the visible light transmittance can be effectively improved, so that the ambient light brightness change sensed by the ambient light sensor can more closely conform to the ambient light brightness change actually perceived by the human eye.

The advantages and spirit of the present invention will be further understood from the following detailed description of the invention.

1~3, 7‧‧‧Light sensing package

10, 20‧‧‧ Ambient light and proximity sensor chip

11, 21‧‧‧ substrate

12, 22‧‧‧Infrared light-emitting diode (IR-LED) wafer

13, 23‧‧ ‧ barrier

24‧‧‧Black rubber sleeve

L‧‧‧Light

30, 70‧‧‧ second chip

31, 71‧‧‧ substrate

32, 72‧‧‧ first chip

33‧‧‧Barrier

73‧‧‧First barrier

75‧‧‧second barrier

34, 74‧‧‧Encapsulation materials

S1‧‧‧First Sensing Area

S2‧‧‧Second Sensing Area

L1‧‧‧First light

L2‧‧‧second light

L1’‧‧‧ proximity sensing light

CL1‧‧‧First light transmission area

CL2‧‧‧second light transmission area

G‧‧‧Surface glass

F1‧‧‧ first film

F2‧‧‧second film

D1, D1'‧‧‧distance between the first sensing area and the second sensing area

D2, D2'‧‧‧distance between the second sensing region and the first wafer

K‧‧‧ Straight line

1 and 2 are schematic views respectively showing light sensing packages having different structures in the prior art.

3 and 4 are respectively a cross-sectional view and a top view of a light sensing package according to an embodiment of the present invention.

5 and FIG. 6 are respectively a top view and a cross-sectional view showing the light sensing package of FIG. 3 disposed under the surface glass of the portable electronic device.

7 and 8 are respectively a cross-sectional view and a top view of a light sensing package according to another embodiment of the present invention.

9 and 10 are respectively a top view and a cross-sectional view showing the light sensing package of FIG. 7 disposed under the surface glass of the portable electronic device.

Reference will now be made in detail to the exemplary embodiments embodiments In addition, the same or used in the drawings and embodiments Like elements or components are used to denote the same or similar parts.

A preferred embodiment of the invention is a light sensing package. In this embodiment, the light sensing package may include an ambient light sensor (ALS) and a proximity sensor (PS), which can be applied to portable electronic devices such as notebooks, tablets, and smart phones. But not limited to this.

In order to effectively improve the problem that the photographic field of view of the ambient light sensor is too small and the brightness of the visible light is greatly attenuated, the light sensing package in this embodiment has the following features:

(1) Separating the ambient light sensor on the same light sensing chip from the proximity sensor, and not combining it, thereby corresponding to the independent light transmission hole of the ambient light sensor. It is no longer affected by the infrared light penetrating film coated on the surface glass of the portable electronic device, so it can effectively avoid the occurrence of a large attenuation of visible light brightness.

(2) Increasing the photosensitive aperture of the ambient light sensor, whereby the sensitized viewing angle of the ambient light sensor is also increased, so that the brightness variation felt by the user's eyes can be closer.

Please refer to FIG. 3 and FIG. 4 , which are respectively a cross-sectional view and a top view of a light sensing package according to an embodiment of the invention. It should be noted that, as shown in FIG. 3 and FIG. 4, the light sensing package 3 in this embodiment has a package structure with double light transmission holes, but is not limited thereto.

As shown in FIG. 3, the light sensing package 3 includes a substrate 31, a first wafer 32, a second wafer 30, a barrier portion 33, and an encapsulation material 34. The first chip 32 is an infrared light emitting diode (IR-LED) chip for emitting infrared light L1; the second chip 30 is a light sensing chip having an ambient light sensing function and a proximity sensing function, and the second chip The first sensing region S1 and the second sensing region S2 are disposed apart from each other, and the second sensing region S2 is located between the first wafer 32 and the first sensing region S1, wherein the light output by the first wafer 32 is The second sensing region S2 can receive the reflected light source energy through an object (for example, a human face), and the first sensing region S1 can receive the ambient light. The first sensing area S1 is configured to receive the visible light line L2 and provide an ambient light sensing signal, and the second sensing area S2 is configured to receive the infrared light L1 ′ and provide a proximity sensing signal; the substrate 31 is configured to carry The first wafer 32, the second wafer 30, the barrier portion 33, and the encapsulating material 34 are not particularly limited in the kind of constituent materials; the blocking portion 33 is made of an opaque material; The material 34 may be a light transmissive material such as a resin, but is not limited thereto.

In this embodiment, the first wafer 32 and the second wafer 30 are both disposed on the substrate 31 and separated from each other; the blocking portion 33 is also disposed on the substrate 31 and located between the first wafer 32 and the second wafer 30; 34 is formed on the substrate 31, the first wafer 32, and the second wafer 30 to cover the first wafer 32 and the second wafer 30.

It should be noted that it is assumed that the distance between the first sensing region S1 and the second sensing region S2 on the second wafer 30 is D1 and the second sensing region S2 on the second wafer 30 and the first wafer 32 are The distance between them is D2, then D1 will be greater than D2. This means that the second sensing region S2 on the second wafer 30 receiving the infrared light L1' will be closer to the first wafer 32 emitting the infrared light L1, and the second sensing region S2 will be farther away from the second wafer 30. The first sensing region S1 of L2. In an embodiment, D1 may be twice or more than D2, but is not limited thereto.

As shown in FIG. 4, the light sensing package 3 has a package structure with double light transmission holes, and the first sensing area S1 and the second sensing area S2 on the second wafer 30 are respectively located under the large transparent holes on the left side. And disposed separately from each other; the first wafer 32 is located under the smaller light transmission hole on the right side; the center of the first wafer 32, the center of the first sensing region S1, and the center of the second sensing region S2 are all located on the same straight line K. The distance D1 between the first sensing region S1 and the second sensing region S2 is greater than the distance D2 between the second sensing region S2 and the first wafer 32; the left side of the second sensing region S2 to the first wafer The distance between the right sides of 32 is less than 2 mm, preferably 1.2 to 1.5 mm, but not limited thereto.

In one embodiment, the portable electronic device further includes a housing and a cover, and the cover is disposed on the housing. The light sensing package described above is disposed in the housing and under the cover. In fact, the housing of the portable electronic device may be a common metal or plastic housing without particular limitation.

It should be noted that the cover of the portable electronic device may be a surface glass, and the surface glass has at least two transparent areas and a display area, and the display area is permeable to light, but not limited thereto. As for the other peripheral areas of the surface glass, most of them are opaque, and even if there is partial light transmission, the light transmittance is less than 30%.

5 and FIG. 6 , FIG. 5 and FIG. 6 respectively show a top view and a cross-sectional view of the light sensing package of FIG. 3 disposed under the surface glass of the portable electronic device. As shown in FIG. 5 and FIG. 6, the surface glass G has a first light transmissive area CL1 and a second light transmissive area. CL2. The first sensing region S1 of the second wafer 30 is located below the first light-transmissive region CL1 of the surface glass G, that is, the first light-transmitting region CL1 of the surface glass G is vertically projected on the first sensing region of the second wafer 30. S1; the second sensing region S2 of the second wafer 30 and the first wafer 32 are located under the second transparent region CL2 of the surface glass G, that is, the second transparent region CL2 of the surface glass G is vertically projected on the second wafer. The second sensing region S2 of 30 and the first wafer 32.

It should be noted that the shape of the first light-transmissive area CL1 of the surface glass G should at least cover the first sensing area S1 of the second wafer 30 below it. In an embodiment, the shape of the first light-transmissive area CL1 of the surface glass G may be a circular shape, such as a circular shape, an elliptical shape, an oblong shape close to a rectangular shape, or the like. As for the surface glass G in FIG. 6 except for the first light-transmitting region CL1 and the second light-transmitting region CL2, the oblique region is an opaque region, and even if there is partial light transmission, the light transmittance is less than 30%. .

In fact, the first light-transmitting region CL1 of the surface glass G may be provided with a first film F1, such as a visible light penetrating film, to enhance the passage of ambient light. In one embodiment, the first film F1 is disposed on the lower surface of the first light-transmissive region CL1 of the surface glass G, but is not limited thereto. Of course, the first light-transmitting region CL1 of the surface glass G may not be provided with a film, and is not particularly limited.

As for the shape of the second light-transmissive region CL2 of the surface glass G, at least the second sensing region S2 of the second wafer 30 and the first wafer 32 below it can be covered. In an embodiment, the shape of the second light-transmissive region CL2 of the surface glass G may be a circular shape, such as a circular shape, an elliptical shape, a long oval shape close to a rectangular shape, etc., and the diameter thereof is less than 2 mm, but not limit.

In fact, the second light-transmissive region CL2 of the surface glass G may be provided with a second film F2, such as an infrared light penetrating film, to filter out light of other non-infrared light wavelengths. In one embodiment, the second film F2 is disposed on the lower surface of the second light-transmissive region CL2 of the surface glass G, but is not limited thereto.

It should be noted that, since the second light-transmitting region CL2 provided with the infrared light-transmitting film is not vertically projected on the first sensing region S1 of the second wafer 30 that receives visible light, so that the first sensing region S1 receives visible light It is less affected by the infrared light penetrating film provided on the second light-transmitting region CL2, so that the transmittance of visible light can be effectively improved.

Further, since the first wafer 32 emitting the infrared ray L1 and the second sensing region S2 receiving the infrared ray L1' are disposed adjacent to each other and are both located in the second light-transmitting region CL2 of the surface glass G Below, that is, the first wafer 32 and the second sensing region S2 performing the proximity sensing function are located under the same small light-transmissive hole (second light-transmitting region CL2) of the surface glass G. When the user operates the portable electronic device, only a small light-transmissive hole (the second light-transmitting region CL2) of the surface glass G can be slightly seen from the appearance of the portable electronic device, and the surface glass is more difficult to see. The first light transmitting region CL1 of G.

For example, it is assumed that the transmittance of the visible light transmissive film disposed on the first light-transmissive region CL1 of the surface glass G to the light wavelength of 550 nm is 50%, and the infrared light disposed on the second light-transmitting region CL2 of the surface glass G is infrared. The light transmissive film has a transmittance of 20% for a light wavelength of 550 nm and a transmittance of 85% for a light wavelength of 940 nm.

When the visible light L2 passes through the visible light penetrating film disposed on the first light transmitting region CL1 of the surface glass G and is incident on the first sensing region S1 of the second wafer 30, the first sensing region S1 can be sensed. The brightness of the light is about 50% of the brightness of the visible light L2, and a larger viewing angle and higher visible light transmittance than the prior art can be obtained.

When the infrared light L1 emitted from the first wafer 32 is reflected by the object and passes through the infrared light penetrating film disposed on the second light transmitting area CL2 of the surface glass G, it is reflected and reflected as infrared light L1' penetrates through the infrared light. When the film is incident on the second sensing region S2 of the second wafer 30, the light energy sensed by the second sensing region S2 is about 72.25% of the energy of the infrared light L1.

7 and FIG. 8 respectively illustrate a cross-sectional view and a top view of a light sensing package according to another embodiment of the present invention. It should be noted that, as shown in FIG. 7 and FIG. 8 , the light sensing package 3 in the foregoing embodiment has a package structure with double light transmission holes, and the light sensing package 7 in this embodiment has three light transmissions. The package structure of the hole, but not limited to this.

As shown in FIG. 7 , the light sensing package 7 includes a substrate 71 , a first wafer 72 , a second wafer 70 , a first blocking portion 73 , a second blocking portion 75 , and an encapsulating material 74 . The photo-sensing package 7 in this embodiment is different from the photo-sensing package 3 in the foregoing embodiment in that the photo-sensing package 7 further includes a second blocking portion 75, and the second blocking portion 75 is disposed on The second wafer 70 is located between the first sensing region S1 and the second sensing region S2.

As shown in FIG. 8 , the light sensing package 7 has a three-transmission hole package structure, and the first sensing region S1 and the second sensing region S2 on the second wafer 70 are separated from each other, and the first sensing region is disposed. S1 is located below the larger transparent aperture on the left side and the second sensing region S2 is located below the smaller transparent aperture in the middle; the first wafer 72 is located below the smaller transparent aperture on the right side; the first sensing region S1 The distance D1' with the second sensing region S2 is greater than the distance D2' between the second sensing region S2 and the first wafer 32; between the left side of the second sensing region S2 and the right side of the first wafer 72 The distance is less than 2 mm, preferably 1.2 to 1.5 mm, but not limited thereto.

9 and FIG. 10 are respectively a top view and a cross-sectional view showing the light sensing package of FIG. 7 disposed under the surface glass of the portable electronic device. The technical content shown in FIG. 9 and FIG. 10 is similar to that of the foregoing embodiment, except that the photo-sensing package 7 further includes a second blocking portion between the first sensing region S1 and the second sensing region S2. 75. Therefore, please refer to the related description of the foregoing embodiment, and details are not described herein.

Compared with the prior art, the portable electronic device and the light sensing package thereof according to the present invention separate the ambient light sensor and the proximity sensor disposed on the same light sensing wafer from each other by a distance. Therefore, the independent light-transmitting hole corresponding only to the ambient light sensor is increased to increase the viewing angle thereof, and the independent light-transmitting hole is not located under the infrared light penetrating film disposed on the surface glass, so Under the influence of the infrared light penetrating film, the visible light transmittance can be effectively improved, so that the ambient light brightness change sensed by the ambient light sensor can more closely conform to the ambient light brightness change actually perceived by the human eye.

The features and spirit of the present invention will be more apparent from the detailed description of the preferred embodiments. On the contrary, the intention is to cover various modifications and equivalents within the scope of the invention as claimed.

3‧‧‧Light sensing package

30‧‧‧second chip

31‧‧‧Substrate

32‧‧‧First chip

33‧‧‧Barrier

34‧‧‧Packaging materials

S1‧‧‧First Sensing Area

S2‧‧‧Second Sensing Area

L1, L1’‧‧‧ infrared light

L2‧‧‧ Visible light

D1‧‧‧Distance between the first sensing area and the second sensing area

D2‧‧‧Distance between the second sensing area and the first wafer

Claims (14)

An optical sensing package is disposed in a housing, the housing has a first light transmissive area and a second light transmissive area, the photo sensing package includes: a first wafer, providing a light source; The second chip has a first sensing area and a second sensing area, wherein the first sensing area provides an ambient light sensing signal, the second sensing area provides a proximity sensing signal, and the second The second sensing region is located between the first wafer and the first sensing region; and a first blocking portion is disposed between the first wafer and the second wafer, wherein the first sensing region is located Below the first light transmissive region, the first wafer and the second sensing region are located below the second light transmissive region. The photo-sensing package of claim 1, wherein the second light-transmissive region is of a circular shape and has a diameter of less than 2 mm. The photo-sensing package of claim 1, wherein the first sensing area and the second sensing area have a first distance and the second sensing area and the first chip are There is a second distance between the first distance and the second distance. The photo-sensing package of claim 1, wherein a side of the second sensing region to a side of the first wafer has a third distance, the third distance being less than 2 mm. The photo-sensing package of claim 1, wherein the second light-transmissive region is provided with a first film to filter out light of other non-infrared wavelengths. The photo-sensing package of claim 1, wherein the first light-transmissive region is provided with a second film to enhance the passage of ambient light. The photo-sensing package of claim 1, further comprising: a second blocking portion disposed on the second wafer and located between the first sensing region and the second sensing region. A portable electronic device includes: a housing; a cover disposed on the housing, the cover having a first light transmissive area and a second light transmissive area; and a light sensing package The light sensing package includes: a first wafer, providing a light source; and a second wafer having a first sensing region and a second sensing region, wherein the first sensing The measurement area provides an ambient light sensing signal, the second sensing area provides a proximity sensing signal, and the second sensing area is located between the first wafer and the first sensing area; and a first blocking a first portion is disposed between the first wafer and the second wafer, wherein the first sensing region is located below the first light transmissive region, and the first wafer and the second sensing region are located at the second transparent portion Below the light area. The portable electronic device of claim 8, wherein the second light transmissive region is of a circular shape and has a diameter of less than 2 mm. The portable electronic device of claim 8, wherein the first sensing area There is a first distance from the second sensing region and a second distance between the second sensing region and the first wafer, the first distance being greater than the second distance. The portable electronic device of claim 8, wherein a side of the second sensing region to a side of the first wafer has a third distance, the third distance being less than 2 mm. The portable electronic device of claim 8, wherein the second transparent region is provided with a first film to filter out light of other non-infrared wavelengths. The portable electronic device of claim 8, wherein the first light-transmitting region is provided with a second film to enhance the passage of ambient light. The portable electronic device of claim 8, further comprising: a second blocking portion disposed on the second wafer and located between the first sensing region and the second sensing region.