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TWI516629B - Method and device for making carbon nanotube array - Google Patents

Method and device for making carbon nanotube array Download PDF

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TWI516629B
TWI516629B TW099102177A TW99102177A TWI516629B TW I516629 B TWI516629 B TW I516629B TW 099102177 A TW099102177 A TW 099102177A TW 99102177 A TW99102177 A TW 99102177A TW I516629 B TWI516629 B TW I516629B
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reaction chamber
carbon nanotube
nanotube array
cylindrical substrate
heating device
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TW201126008A (en
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馮辰
劉亮
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北京富納特創新科技有限公司
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奈米碳管陣列之製備裝置及製備方法Nano carbon tube array preparation device and preparation method

本發明涉及一種奈米碳管陣列之製備裝置及製備方法。The invention relates to a preparation device and a preparation method of a carbon nanotube array.

奈米碳管係一種新型之一維奈米材料,其具有優良之綜合力學性能,如高彈性模量、高楊氏模量和低密度,以及優異之電學性能、熱學性能和吸附性能。隨著奈米碳管碳原子排列方式之變化,奈米碳管可呈現出金屬性或半導體性質。由於奈米碳管之優異特性,故可望其於奈米電子學、材料科學、生物學、化學等領域中發揮重要作用,而奈米碳管陣列因其中之奈米碳管排列整齊有序,使其更有利於工業應用。形成奈米碳管陣列之方法主要係化學氣相沈積法(CVD)。化學氣相沈積法主要係運用奈米尺度之過渡金屬或其氧化物作為催化劑,於一定溫度下熱解碳源氣體來製備奈米碳管陣列。目前化學氣相沈積法一般選用平面型之生長基底,而該平面型之生長基底由於受反應室尺寸之限制,其面積無法做到很大,從而使得生長於其上之奈米碳管陣列面積也無法做到很大。The carbon nanotube is a new type of Venom material with excellent comprehensive mechanical properties such as high elastic modulus, high Young's modulus and low density, as well as excellent electrical properties, thermal properties and adsorption properties. The carbon nanotubes may exhibit metallic or semiconducting properties as the carbon nanotube arrangement of the carbon nanotubes changes. Due to the excellent properties of the carbon nanotubes, it is expected to play an important role in the fields of nanoelectronics, materials science, biology, and chemistry, and the carbon nanotube arrays are neatly arranged due to the arrangement of the carbon nanotubes. To make it more conducive to industrial applications. The method of forming a carbon nanotube array is mainly a chemical vapor deposition (CVD) method. The chemical vapor deposition method mainly uses a nanometer-scale transition metal or its oxide as a catalyst to pyrolyze a carbon source gas at a certain temperature to prepare a carbon nanotube array. At present, the chemical vapor deposition method generally adopts a planar growth substrate, and the planar growth substrate is not limited by the size of the reaction chamber, so that the area of the carbon nanotube array grown thereon is increased. It can't be done very much.

范守善等人於2008年1月1日公開之第200801224號台灣發明專利申請公佈說明書中揭示了一種大面積生長奈米碳管膜之方法。該方法具體為提供一筒狀基底,並於該基底之外表面上沈積一催化劑層;將該沈積有催化劑層之基底放置於一反應室內;向該反應室內通入保護氣體,使該反應室保持一預定氣壓;加熱反應室至一預定溫度;向反應室內通入碳源氣體,一預定時間後,於基底上得到一層奈米碳管膜。該專利申請採用筒狀基底作為奈米碳管膜生長之載體,使得一定容量空間之反應室內可容納更大面積之基底,從而實現奈米碳管膜於較小反應室內之大面積生長。A method for growing a large area of carbon nanotube film is disclosed in the specification of Taiwan Patent Application No. 200801224, published on Jan. 1, 2008. The method is specifically for providing a cylindrical substrate, and depositing a catalyst layer on the outer surface of the substrate; placing the substrate on which the catalyst layer is deposited in a reaction chamber; and introducing a shielding gas into the reaction chamber to make the reaction chamber Maintaining a predetermined gas pressure; heating the reaction chamber to a predetermined temperature; introducing a carbon source gas into the reaction chamber, and obtaining a layer of carbon nanotube film on the substrate after a predetermined time. The patent application adopts a cylindrical substrate as a carrier for the growth of the carbon nanotube film, so that a reaction chamber with a certain capacity can accommodate a larger area of the substrate, thereby realizing large-area growth of the carbon nanotube film in a small reaction chamber.

然,上述製備方法通過加熱反應室之方式加熱基底,當於筒狀基底之外表面生長奈米碳管時,基底表面形成奈米碳管膜後,熱量將通過該奈米碳管膜傳遞到所述基底表面,由於奈米碳管將會吸收一部分熱量,使得加熱基底上催化劑之時間變長,從而使得熱解碳源氣之速度減慢,最終使得生長奈米碳管之速度減慢。隨著奈米碳管生長高度之增加,這一現象將變得尤為明顯。However, the above preparation method heats the substrate by heating the reaction chamber. When the carbon nanotube is grown on the surface of the cylindrical substrate, after the surface of the substrate forms a carbon nanotube film, heat is transferred to the carbon nanotube film through the carbon nanotube film. The surface of the substrate, because the carbon nanotubes will absorb a part of the heat, makes the time for heating the catalyst on the substrate longer, so that the speed of pyrolysis of the carbon source gas is slowed down, and finally the speed of growing the carbon nanotubes is slowed down. This phenomenon will become more apparent as the height of the carbon nanotubes grows.

有鑒於此,提供一種基底之加熱速度較快、進而使奈米碳管之生長速度較快之奈米碳管陣列之製備方法及製備裝置實為必要。In view of the above, it is necessary to provide a method and a device for preparing a carbon nanotube array in which the heating speed of the substrate is faster and the growth speed of the carbon nanotubes is faster.

一種奈米碳管陣列之製備方法,其包括以下步驟:提供一筒狀基底,該筒狀基底具有一平滑之外表面,該外表面沈積有一催化劑層;提供一反應室,將該沈積有催化劑層之筒狀基底設置於該反應室內;提供一加熱裝置,使該加熱裝置設置於該筒狀基底之內部,並將所述反應室內之空氣排出,之後,採用該加熱裝置加熱該筒狀基底至一預定溫度;向該反應室內通入碳源氣體,從而於該筒狀基底上生長獲得一奈米碳管陣列。A method for preparing a carbon nanotube array, comprising the steps of: providing a cylindrical substrate having a smooth outer surface, the outer surface is deposited with a catalyst layer; providing a reaction chamber for depositing a catalyst a cylindrical base of the layer is disposed in the reaction chamber; a heating device is provided, the heating device is disposed inside the cylindrical substrate, and the air in the reaction chamber is discharged, and then the heating device is used to heat the cylindrical substrate To a predetermined temperature; a carbon source gas is introduced into the reaction chamber to grow on the cylindrical substrate to obtain an array of carbon nanotubes.

一種奈米碳管陣列之製備方法,其包括以下步驟:提供一外表面具催化劑層之筒狀基底,將其設置於一通有保護氣體之反應室內;提供一加熱裝置,將其設置於上述筒狀基底內部,並將該反應室內之空氣排出,之後,採用該加熱裝置加熱該筒狀基底至一預定溫度;以及向該反應室內通入一預定分壓之碳源氣,從而於該筒狀基底外表面生長一奈米碳管陣列。A method for preparing a carbon nanotube array, comprising the steps of: providing a cylindrical substrate having a catalyst layer on an outer surface, disposing it in a reaction chamber through which a protective gas is passed; providing a heating device and placing the same in the cylindrical shape Inside the substrate, and discharging the air in the reaction chamber, after which the heating device is used to heat the cylindrical substrate to a predetermined temperature; and a predetermined partial pressure carbon source gas is introduced into the reaction chamber, thereby forming the cylindrical substrate An outer carbon nanotube array is grown on the outer surface.

一種奈米碳管陣列之製備裝置,其包括:一反應室,該反應室包括一進氣口和一出氣口;一設置於該反應室內之一筒狀基底;其中,該奈米碳管陣列之製備裝置進一步包括一設置於該筒狀基底內部之一加熱裝置。A preparation device for a carbon nanotube array, comprising: a reaction chamber comprising an air inlet and an air outlet; a cylindrical base disposed in the reaction chamber; wherein the carbon nanotube array The preparation device further includes a heating device disposed inside the cylindrical substrate.

相較於先前技術,本發明直接將加熱裝置設置於所述筒狀基底之通孔內部,使所述加熱裝置與所生長獲得之奈米碳管陣列分別置於所述筒狀基底之兩側,從而使該加熱裝置所傳導之熱量不易被所生長之奈米碳管或其他介質所吸收且可充分被所述基底所吸收。故,該方法可使所述基底之加熱速度加快,並進一步使奈米碳管之生長速度加快。Compared with the prior art, the present invention directly places the heating device inside the through hole of the cylindrical substrate, so that the heating device and the grown carbon nanotube array are respectively placed on both sides of the cylindrical substrate. Therefore, the heat conducted by the heating device is not easily absorbed by the grown carbon nanotubes or other medium and can be sufficiently absorbed by the substrate. Therefore, the method can accelerate the heating rate of the substrate and further accelerate the growth rate of the carbon nanotubes.

以下將結合附圖詳細說明本發明實施例提供之奈米碳管陣列之製備方法及製備裝置。The preparation method and preparation apparatus of the carbon nanotube array provided by the embodiment of the present invention will be described in detail below with reference to the accompanying drawings.

請參閱圖1,圖2及圖3,本發明實施例提供一種奈米碳管陣列之製備方法,其包括以下步驟:Referring to FIG. 1 , FIG. 2 and FIG. 3 , an embodiment of the present invention provides a method for preparing a carbon nanotube array, which includes the following steps:

步驟一:提供一筒狀基底10,該筒狀基底10具有一外表面12。Step 1: A cylindrical substrate 10 is provided, the cylindrical substrate 10 having an outer surface 12.

所述筒狀基底10為一中空柱體結構,該筒狀基底10具有一通孔16,該通孔16之橫截面可為圓形、橢圓形、三角形、四邊形,或者其他規則或不規則之多邊形,且該整個筒狀基底10之橫截面也可為圓形、橢圓形、三角形、四邊形,或者其他規則或不規則之多邊形。該筒狀基底10之材料由耐高溫之材料製成,如石英、陶瓷、耐高溫玻璃基底、矽或金屬材料。本實施例中,該筒狀基底10和其通孔16之橫截面均為圓形,其材料為石英。為能獲得一有序排列之奈米碳管陣列40,該筒狀基底10需具有一平滑之外表面12,該平滑之外表面12可通過機械拋光或電化學拋光等方法獲得。進一步地,請參閱圖3,該筒狀基底10之筒壁上可進一步包括一開口18,該開口18之具體形狀及大小不限,可根據實際需要而具體選定,優選為,該開口18之尺寸以能將該製備方法之後續步驟中之加熱裝置置入所述筒狀基底10之通孔16內為宜。The cylindrical substrate 10 is a hollow cylinder structure, and the cylindrical substrate 10 has a through hole 16 which may have a circular, elliptical, triangular, quadrangular cross section or other regular or irregular polygonal shape. And the cross section of the entire cylindrical substrate 10 may also be a circle, an ellipse, a triangle, a quadrangle, or other regular or irregular polygons. The material of the cylindrical substrate 10 is made of a material resistant to high temperatures such as quartz, ceramics, a high temperature resistant glass substrate, tantalum or a metal material. In this embodiment, the cylindrical substrate 10 and the through hole 16 have a circular cross section, and the material thereof is quartz. In order to obtain an ordered array of carbon nanotube arrays 40, the cylindrical substrate 10 is required to have a smooth outer surface 12 which can be obtained by mechanical polishing or electrochemical polishing. Further, referring to FIG. 3, the cylindrical wall of the cylindrical substrate 10 may further include an opening 18, and the specific shape and size of the opening 18 are not limited, and may be specifically selected according to actual needs, and preferably, the opening 18 The size is preferably such that the heating means in the subsequent step of the preparation method can be placed in the through hole 16 of the cylindrical substrate 10.

步驟二,於該筒狀基底10之外表面12形成一催化劑層14。In step two, a catalyst layer 14 is formed on the outer surface 12 of the cylindrical substrate 10.

所述催化劑層14之材料可選用鐵(Fe)、鈷(Co)、鎳(Ni)或者該幾種金屬之氧化物,該催化劑層14可採用熱沈積、電子束沈積、蒸鍍或磁控濺射等方法形成於上述筒狀基底10之外表面12。該催化劑層14之厚度可根據實際需要而具體設定,本實施例中,其厚度為1奈米至10奈米即可。The material of the catalyst layer 14 may be selected from iron (Fe), cobalt (Co), nickel (Ni) or oxides of the metals, and the catalyst layer 14 may be formed by thermal deposition, electron beam deposition, evaporation or magnetron. A method such as sputtering is formed on the outer surface 12 of the cylindrical substrate 10 described above. The thickness of the catalyst layer 14 can be specifically set according to actual needs. In the present embodiment, the thickness thereof is from 1 nm to 10 nm.

該步驟可進一步包括退火處理該催化劑層14,使得該催化劑層14形成奈米級之催化劑顆粒。若催化劑為金屬,則於退火過程中伴隨著發生氧化反應,將金屬氧化成金屬氧化物。該退火後得到之顆粒之大小將決定以後生長奈米碳管之直徑大小。This step may further include annealing the catalyst layer 14 such that the catalyst layer 14 forms nano-sized catalyst particles. If the catalyst is a metal, the metal is oxidized to a metal oxide accompanied by an oxidation reaction during the annealing. The size of the particles obtained after the annealing will determine the diameter of the carbon nanotubes to be grown later.

步驟三:提供一反應室20,將該形成有催化劑層14之筒狀基底10設置於該反應室20內。Step 3: A reaction chamber 20 is provided, and the cylindrical substrate 10 on which the catalyst layer 14 is formed is disposed in the reaction chamber 20.

所述反應室20包括分別設置於該反應室20兩端之一進氣口22及一出氣口24。本實施例中,該反應室為一石英管,該進氣口22及出氣口24位於石英管沿軸向之兩端。該步驟進一步包括提供一支撐體26並通過該支撐體26將所述筒狀基底10固定於所述反應室20內。優選地,該筒狀基底10沿該反應室20之軸線方向放置,即該筒狀基底10之通孔16之延伸方向沿該反應室20之軸線方向。該設置方式可使得從進氣口22進入反應室20之反應氣體被筒狀基底10阻擋之量最少,從而避免降低奈米碳管之生長速度。同時,由於該筒狀基底10之形狀為筒狀,相較於平面狀之基底,該筒狀基底10可有效利用該反應室之空間,使得其可容納更大面積之基底,從而可獲得更大面積之奈米碳管陣列。The reaction chamber 20 includes an air inlet 22 and an air outlet 24 respectively disposed at two ends of the reaction chamber 20. In this embodiment, the reaction chamber is a quartz tube, and the air inlet 22 and the air outlet 24 are located at both ends of the quartz tube along the axial direction. The step further includes providing a support 26 and securing the cylindrical substrate 10 within the reaction chamber 20 through the support 26. Preferably, the cylindrical substrate 10 is placed along the axial direction of the reaction chamber 20, that is, the extending direction of the through hole 16 of the cylindrical substrate 10 is along the axial direction of the reaction chamber 20. This arrangement allows the reaction gas entering the reaction chamber 20 from the inlet port 22 to be blocked by the cylindrical substrate 10 to a minimum, thereby avoiding a decrease in the growth rate of the carbon nanotubes. Meanwhile, since the cylindrical substrate 10 has a cylindrical shape, the cylindrical substrate 10 can effectively utilize the space of the reaction chamber as compared with the planar substrate, so that it can accommodate a larger area of the substrate, thereby obtaining more Large area of carbon nanotube array.

步驟四:提供一加熱裝置30,使該加熱裝置30設置於該筒狀基底10之內部,並將所述反應室20內之空氣排出,之後,採用該加熱裝置加熱該筒狀基底10至一預定溫度。Step 4: providing a heating device 30, the heating device 30 is disposed inside the cylindrical substrate 10, and the air in the reaction chamber 20 is discharged, and then the heating device is used to heat the cylindrical substrate 10 to a Scheduled temperature.

具體地,該加熱裝置30設置於該筒狀基底10之通孔16內,其具體設置方式以使該整個筒狀基底10均勻加熱為目之,可依據整個筒狀基底10和通孔16之橫截面積而具體設定。本實施例中,由於該筒狀基底10及其通孔16之橫截面均為圓形,故該加熱裝置30設置於該筒狀基底10之通孔16之中軸線處,從而可使整個筒狀基底10受熱均勻。該加熱裝置30可通過所述筒狀基底10之通孔16之兩端裝入該筒狀基底10內,也可通過所述筒狀基底10之開口18處裝入。所述加熱裝置30可為電阻絲加熱管、紅外線加熱燈管或矽鉬棒加熱器等。本實施例中,所述加熱裝置30可為一紅外線石英加熱燈管,該紅外線加熱燈管之兩端可通過一支架28夾持並固定於筒狀基底10內。具體為,所述加熱裝置30可通過所述開口18裝入所述通孔16內,並且該加熱裝置30的兩端可通過所述支架28固定。另外,該加熱裝置30也可通過所述通孔16的一端插入所述通孔16內,且該加熱裝置30的一端通過所述支架28固定。Specifically, the heating device 30 is disposed in the through hole 16 of the cylindrical substrate 10, and is specifically arranged to uniformly heat the entire cylindrical substrate 10 according to the entire cylindrical substrate 10 and the through hole 16 Specific settings for cross-sectional area. In this embodiment, since the cylindrical substrate 10 and the through hole 16 have a circular cross section, the heating device 30 is disposed at the axis of the through hole 16 of the cylindrical substrate 10, so that the entire cylinder can be The substrate 10 is heated uniformly. The heating device 30 can be loaded into the cylindrical substrate 10 through both ends of the through hole 16 of the cylindrical substrate 10, or can be loaded through the opening 18 of the cylindrical substrate 10. The heating device 30 may be a resistance wire heating tube, an infrared heating tube or a bismuth molybdenum rod heater or the like. In this embodiment, the heating device 30 can be an infrared quartz heating lamp tube, and both ends of the infrared heating lamp tube can be clamped and fixed in the cylindrical substrate 10 through a bracket 28. Specifically, the heating device 30 can be inserted into the through hole 16 through the opening 18, and both ends of the heating device 30 can be fixed by the bracket 28. In addition, the heating device 30 can also be inserted into the through hole 16 through one end of the through hole 16, and one end of the heating device 30 is fixed by the bracket 28.

將該加熱裝置30設置於該筒狀基底10內後,需將反應室20內之空氣排出,以防止後續步驟中之碳源氣體與空氣發生反應,之後再採用該加熱裝置30加熱該筒狀基底10至一預定溫度。After the heating device 30 is disposed in the cylindrical substrate 10, the air in the reaction chamber 20 needs to be discharged to prevent the carbon source gas in the subsequent step from reacting with the air, and then the heating device 30 is used to heat the cylindrical device. Substrate 10 to a predetermined temperature.

排出空氣之方式可包括以下三種:直接將反應室抽真空;向反應室內通入保護氣體,通過該保護氣體將反應室內之空氣排出;另外,該方式也可將反應室20抽真空之後通入保護氣體,並使該保護氣體於該反應室20內保持一預定之氣壓。本實施例中選擇了第三種方式。The manner of discharging the air may include the following three types: directly evacuating the reaction chamber; introducing a shielding gas into the reaction chamber, and discharging the air in the reaction chamber through the shielding gas; in addition, the method may also vacuum the reaction chamber 20 and then pass through The gas is shielded and maintained at a predetermined gas pressure in the reaction chamber 20. The third mode is selected in this embodiment.

通入保護氣體之具體方式為:從上述進氣口22向反應室20內通入保護氣體,該保護氣體可選用氬氣,也可為氮氣或其他不與後續通入之碳源氣體發生反應之氣體。該保護氣體之輸入可使反應室20內之空氣經由該出氣口24排出。優選地,該步驟於通入保護氣體之前先對該反應室20抽真空處理。於所述保護氣體之環境下,採用上述加熱裝置30將該筒狀基底10表面之催化劑層14加熱至奈米碳管之生長溫度,即500℃~800℃。The specific manner of introducing the shielding gas is: introducing a shielding gas into the reaction chamber 20 from the air inlet 22, and the shielding gas may be argon gas or nitrogen gas or other carbon source gas that does not subsequently pass through. Gas. The input of the shielding gas allows air in the reaction chamber 20 to be discharged through the gas outlet 24. Preferably, this step vacuums the reaction chamber 20 prior to passing the shielding gas. In the environment of the shielding gas, the catalyst layer 14 on the surface of the cylindrical substrate 10 is heated to a growth temperature of the carbon nanotubes by the above-described heating device 30, that is, 500 ° C to 800 ° C.

步驟五:向該反應室20內通入一碳源氣,以生長奈米碳管陣列40。Step 5: A carbon source gas is introduced into the reaction chamber 20 to grow the carbon nanotube array 40.

所述碳源氣體為乙烯、甲烷、乙烷、乙炔或其他氣態烴類。本實施例中,該碳源氣體為乙烯。反應時間為10分鐘~2個小時,從而於所述筒狀基底10之外表面12生長獲得一奈米碳管陣列40。The carbon source gas is ethylene, methane, ethane, acetylene or other gaseous hydrocarbons. In this embodiment, the carbon source gas is ethylene. The reaction time is from 10 minutes to 2 hours, so that an outer surface 12 of the cylindrical substrate 10 is grown to obtain an array of carbon nanotubes 40.

具體地,該碳源氣體和保護氣體以一預定體積比並以一固定之流速從上述進氣口22通入反應室20內,並同時將該混合氣體以相同之流速從出氣口24輸出反應室20,這樣可保持碳源氣體於反應室20內處於流動狀態,反應室20內參加反應之碳源氣體會得到及時之更新以使其濃度基本維持不變,從而可得到高品質之奈米碳管陣列40。該保護氣體與碳源氣體之體積比優選為1:0~1:10,該保護氣體之流速和碳源氣體之流速依據反應室20之腔體之具體尺寸而定,若反應室20之腔體直徑為4寸~6寸時,保護氣體之流速可為200 sccm (Standard Cubic Centimeters Minute)~500sccm,碳源氣體之流速可為20sccm~60sccm。本實施例中,該反應室20之腔體之直徑為4寸,保護氣體之流速為360sccm;碳源氣體之流速為40 sccm。Specifically, the carbon source gas and the shielding gas are introduced into the reaction chamber 20 from the inlet port 22 at a predetermined volume ratio and at a fixed flow rate, and simultaneously the reaction gas is outputted from the gas outlet port 24 at the same flow rate. The chamber 20 is configured to keep the carbon source gas flowing in the reaction chamber 20, and the carbon source gas participating in the reaction in the reaction chamber 20 is updated in time to maintain the concentration substantially unchanged, thereby obtaining high quality nanometer. Carbon tube array 40. The volume ratio of the shielding gas to the carbon source gas is preferably 1:0 to 1:10, and the flow rate of the shielding gas and the flow rate of the carbon source gas depend on the specific size of the cavity of the reaction chamber 20, if the chamber of the reaction chamber 20 When the body diameter is 4 inches to 6 inches, the flow rate of the shielding gas may be 200 sccm (Standard Cubic Centimeters Minute) ~ 500 sccm, and the flow rate of the carbon source gas may be 20 sccm to 60 sccm. In this embodiment, the chamber of the reaction chamber 20 has a diameter of 4 inches, the flow rate of the shielding gas is 360 sccm, and the flow rate of the carbon source gas is 40 sccm.

進一步地,本實施例製備奈米碳管陣列40之方法中,所述反應室20可直接由一加熱爐(圖未示)之腔體構成,該加熱爐也可進一步與加熱裝置30同時加熱該反應室20,從而使所述反應室20更快達到生長奈米碳管陣列40之反應溫度。Further, in the method for preparing the carbon nanotube array 40 in the embodiment, the reaction chamber 20 may be directly constituted by a cavity of a heating furnace (not shown), and the heating furnace may be further heated simultaneously with the heating device 30. The reaction chamber 20 is such that the reaction chamber 20 reaches the reaction temperature of the growth carbon nanotube array 40 faster.

請參閱圖2及圖3,具體地,上述奈米碳管陣列40之製備方法中所採用之製備裝置包括:一反應室20,該反應室20包括一進氣口22和一出氣口24;一設置於該反應室20內之一筒狀基底10;及一設置於該筒狀基底10內部之一加熱裝置30。此外,該製備裝置還進一步包括一用於支撐該筒狀基底10之支撐體26,該筒狀基底10之筒壁上還可進一步設置一開口18。該製備裝置之具體結構於上述實施例之製備方法中已經詳細描述,於此將不再贅述。Referring to FIG. 2 and FIG. 3, specifically, the preparation device used in the method for preparing the carbon nanotube array 40 includes: a reaction chamber 20, the reaction chamber 20 includes an air inlet 22 and an air outlet 24; A cylindrical substrate 10 disposed in the reaction chamber 20; and a heating device 30 disposed inside the cylindrical substrate 10. In addition, the preparation device further includes a support body 26 for supporting the cylindrical substrate 10, and an opening 18 may be further disposed on the wall of the cylindrical substrate 10. The specific structure of the preparation apparatus has been described in detail in the preparation method of the above embodiment, and will not be described herein.

於上述實施例之製備方法及製備裝置中,由於所述加熱裝置設置於所述筒型基底之內部,故於所述加熱裝置與所述筒型基底之間除所述保護氣體與碳源氣體之外無其他介質吸收該加熱裝置所產生之熱量,使得加熱生長基底之速度較快,從而使奈米碳管可具有更快之生長速度。另外,該方法可均勻加熱所述基底,且通過控制所述加熱裝置就可直接控制所述基底之加熱速度和加熱溫度,使基底之溫度可控,進而可較好地控制奈米碳管之生長速度。In the preparation method and the preparation device of the above embodiment, since the heating device is disposed inside the cylindrical substrate, the protective gas and the carbon source gas are removed between the heating device and the cylindrical substrate. No other medium absorbs the heat generated by the heating device, so that the growth of the substrate is faster, so that the carbon nanotubes can have a faster growth rate. In addition, the method can uniformly heat the substrate, and the heating speed and the heating temperature of the substrate can be directly controlled by controlling the heating device, so that the temperature of the substrate can be controlled, thereby better controlling the carbon nanotubes. speed of growth.

綜上所述,本發明確已符合發明專利之要件,遂依法提出專利申請。惟,以上所述者僅為本發明之較佳實施方式,自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝之人士援依本發明之精神所作之等效修飾或變化,皆應涵蓋於以下申請專利範圍內。In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

10‧‧‧筒狀基底10‧‧‧Cylinder base

12‧‧‧外表面12‧‧‧ outer surface

14‧‧‧催化劑層14‧‧‧ catalyst layer

16‧‧‧通孔16‧‧‧through hole

18‧‧‧開口18‧‧‧ openings

20‧‧‧反應室20‧‧‧Reaction room

22‧‧‧進氣口22‧‧‧air inlet

24‧‧‧出氣口24‧‧‧ outlet

26‧‧‧支撐體26‧‧‧Support

28‧‧‧支架28‧‧‧ bracket

30‧‧‧加熱裝置30‧‧‧ heating device

40‧‧‧奈米碳管陣列40‧‧‧Nano Carbon Tube Array

圖1係本發明實施例提供之奈米碳管陣列之製備方法流程圖。1 is a flow chart of a method for preparing a carbon nanotube array provided by an embodiment of the present invention.

圖2係本發明實施例提供之奈米碳管陣列之製備裝置示意圖。2 is a schematic view of a preparation apparatus of a carbon nanotube array provided by an embodiment of the present invention.

圖3係本發明實施例提供之具有開口之筒狀基底剖視圖。3 is a cross-sectional view of a cylindrical base having an opening according to an embodiment of the present invention.

10‧‧‧筒狀基底 10‧‧‧Cylinder base

12‧‧‧外表面 12‧‧‧ outer surface

14‧‧‧催化劑層 14‧‧‧ catalyst layer

16‧‧‧通孔 16‧‧‧through hole

20‧‧‧反應室 20‧‧‧Reaction room

22‧‧‧進氣口 22‧‧‧air inlet

24‧‧‧出氣口 24‧‧‧ outlet

26‧‧‧支撐體 26‧‧‧Support

28‧‧‧支架 28‧‧‧ bracket

30‧‧‧加熱裝置 30‧‧‧ heating device

40‧‧‧奈米碳管陣列 40‧‧‧Nano Carbon Tube Array

Claims (18)

一種奈米碳管陣列之製備方法,其包括以下步驟:
提供一筒狀基底,該筒狀基底具有一平滑之外表面,該外表面沈積有一催化劑層;
提供一反應室,將該沈積有催化劑層之筒狀基底設置於該反應室內;
提供一加熱裝置,使該加熱裝置設置於該筒狀基底之內部,並將所述反應室內之空氣排出,之後,採用該加熱裝置加熱該筒狀基底至一預定溫度;
向該反應室內通入碳源氣體,從而於該筒狀基底上生長獲得一奈米碳管陣列。
A method for preparing a carbon nanotube array, comprising the steps of:
Providing a cylindrical substrate having a smooth outer surface, the outer surface being deposited with a catalyst layer;
Providing a reaction chamber, the cylindrical substrate on which the catalyst layer is deposited is disposed in the reaction chamber;
Providing a heating device, the heating device is disposed inside the cylindrical substrate, and the air in the reaction chamber is discharged, and then the heating device is used to heat the cylindrical substrate to a predetermined temperature;
A carbon source gas is introduced into the reaction chamber to grow on the cylindrical substrate to obtain an array of carbon nanotubes.
如申請專利範圍第1項所述之奈米碳管陣列之製備方法,其中,於該反應室內通入碳源氣體之步驟之前,向該反應室內通入保護氣體,使該反應室保持一預定氣壓。The method for preparing a carbon nanotube array according to claim 1, wherein before the step of introducing a carbon source gas into the reaction chamber, a shielding gas is introduced into the reaction chamber to keep the reaction chamber for a predetermined period. Air pressure. 如申請專利範圍第1項所述之奈米碳管陣列之製備方法,其中,所述整個生長奈米碳管陣列的過程中始終維持通入碳源氣体。The method for preparing a carbon nanotube array according to claim 1, wherein the carbon source gas is always maintained during the entire growth of the carbon nanotube array. 如申請專利範圍第1項所述之奈米碳管陣列之製備方法,其中,所述預定溫度為500℃~800℃。The method for preparing a carbon nanotube array according to claim 1, wherein the predetermined temperature is 500 ° C to 800 ° C. 如申請專利範圍第1項所述之奈米碳管陣列之製備方法,其中,該筒狀基底具有一沿筒狀基底軸向方向設置的通孔,該通孔之延伸方向沿該反應室之軸線方向。The method for preparing a carbon nanotube array according to claim 1, wherein the cylindrical substrate has a through hole disposed along an axial direction of the cylindrical base, and the extending direction of the through hole is along the reaction chamber. The direction of the axis. 如申請專利範圍第5項所述之奈米碳管陣列之製備方法,其中,所述通孔之橫截面為圓形、橢圓形、三角形、四邊形或多邊形。The method for preparing a carbon nanotube array according to claim 5, wherein the through hole has a circular, elliptical, triangular, quadrangular or polygonal cross section. 如申請專利範圍第5項所述之奈米碳管陣列之製備方法,其中,該加熱裝置設置於該筒狀基底內部之通孔中,位於該筒狀基底之中軸線處。The method for preparing a carbon nanotube array according to claim 5, wherein the heating device is disposed in a through hole in the interior of the cylindrical substrate at an axis of the cylindrical substrate. 如申請專利範圍第1項所述之奈米碳管陣列之製備方法,其中,所述筒狀基底之橫截面可為圓形、橢圓形、三角形、四邊形或多邊形。The method for preparing a carbon nanotube array according to claim 1, wherein the cylindrical substrate has a circular, elliptical, triangular, quadrangular or polygonal cross section. 如申請專利範圍第1項所述之奈米碳管陣列之製備方法,其中,所述加熱裝置為電阻絲加熱管、紅外線加熱燈管或矽鉬棒加熱器。The method for preparing a carbon nanotube array according to claim 1, wherein the heating device is a resistance wire heating tube, an infrared heating tube or a bismuth molybdenum rod heater. 一種奈米碳管陣列之製備方法,其包括以下步驟:
提供一外表面具催化劑層之筒狀基底,將該筒狀基底設置於一通有保護氣體之反應室內;
提供一加熱裝置,將該加熱裝置設置於上述筒狀基底內部,並將該反應室內之空氣排出,之後,採用該加熱裝置加熱該筒狀基底至一預定溫度;以及
向該反應室內通入一預定分壓之碳源氣,從而於該筒狀基底外表面生長一奈米碳管陣列。
A method for preparing a carbon nanotube array, comprising the steps of:
Providing a cylindrical substrate having a catalyst layer on the outer surface, the cylindrical substrate being disposed in a reaction chamber through which a shielding gas is passed;
Providing a heating device, disposing the heating device inside the cylindrical substrate, and discharging air in the reaction chamber, and then heating the cylindrical substrate to a predetermined temperature by using the heating device; and introducing a reaction chamber into the reaction chamber A carbon source gas is divided in a predetermined pressure to grow an array of carbon nanotubes on the outer surface of the cylindrical substrate.
一種奈米碳管陣列之製備裝置,其包括:
一反應室,該反應室包括一進氣口和一出氣口;
一設置於該反應室內之一筒狀基底;其中,
該奈米碳管陣列之製備裝置進一步包括一設置於該筒狀基底內部之一加熱裝置。
A preparation device for a carbon nanotube array, comprising:
a reaction chamber comprising an air inlet and an air outlet;
a cylindrical substrate disposed in the reaction chamber; wherein
The preparation device of the carbon nanotube array further includes a heating device disposed inside the cylindrical substrate.
如申請專利範圍第11項所述之奈米碳管陣列之製備裝置,其中,該筒狀基底進一步包括一設置於該筒狀基底筒壁之開口。The apparatus for preparing a carbon nanotube array according to claim 11, wherein the cylindrical base further comprises an opening provided in the wall of the cylindrical base. 如申請專利範圍第12項所述之奈米碳管陣列之製備裝置,其中,所述加熱裝置通過一支架固定於所述反應室中。The apparatus for preparing a carbon nanotube array according to claim 12, wherein the heating device is fixed in the reaction chamber by a bracket. 如申請專利範圍第13項所述之奈米碳管陣列之製備裝置,其中,所述加熱裝置通過所述開口設置於筒狀基底的內部,且該加熱裝置的兩端通過該支架固定於所述反應室內。The apparatus for preparing a carbon nanotube array according to claim 13, wherein the heating device is disposed inside the cylindrical base through the opening, and both ends of the heating device are fixed to the same by the bracket Said reaction chamber. 如申請專利範圍第13項所述之奈米碳管陣列之製備裝置,其中,該筒狀基底具有一沿筒狀基底軸向方向設置的通孔,該通孔之延伸方向沿該反應室之軸線方向。The apparatus for preparing a carbon nanotube array according to claim 13, wherein the cylindrical base has a through hole disposed along an axial direction of the cylindrical base, and the extending direction of the through hole is along the reaction chamber The direction of the axis. 如申請專利範圍第15項所述之奈米碳管陣列之製備裝置,其中,所述加熱裝置從該筒狀基底的通孔的一端插入所述通孔的內部,且該加熱裝置的一端通過該支架固定於所述反應室中。The apparatus for producing a carbon nanotube array according to claim 15, wherein the heating device is inserted into the inside of the through hole from one end of the through hole of the cylindrical substrate, and one end of the heating device passes The stent is fixed in the reaction chamber. 如申請專利範圍第11項所述之奈米碳管陣列之製備裝置,其中,該加熱裝置為一紅外線加熱燈管。The apparatus for preparing a carbon nanotube array according to claim 11, wherein the heating device is an infrared heating lamp. 如申請專利範圍第11項所述之奈米碳管陣列之製備裝置,其中,進一步包括一用於支撐所述筒狀基底之支撐體。The apparatus for preparing a carbon nanotube array according to claim 11, further comprising a support for supporting the cylindrical base.
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