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TWI508852B - Method for manufacturing single side metal-clad laminate - Google Patents

Method for manufacturing single side metal-clad laminate Download PDF

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Publication number
TWI508852B
TWI508852B TW100103277A TW100103277A TWI508852B TW I508852 B TWI508852 B TW I508852B TW 100103277 A TW100103277 A TW 100103277A TW 100103277 A TW100103277 A TW 100103277A TW I508852 B TWI508852 B TW I508852B
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Taiwan
Prior art keywords
film
clad laminate
metal
foil
insulating film
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TW100103277A
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Chinese (zh)
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TW201202022A (en
Inventor
Shohei Arai
Yuki Okazaki
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Nippon Steel & Sumikin Chem Co
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Publication of TW201202022A publication Critical patent/TW201202022A/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/22Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of both discrete and continuous layers
    • B32B37/223One or more of the layers being plastic
    • B32B37/226Laminating sheets, panels or inserts between two continuous plastic layers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/20Layered products comprising a layer of metal comprising aluminium or copper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/16Layered products comprising a layer of synthetic resin specially treated, e.g. irradiated
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/28Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • B32B37/025Transfer laminating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/12Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/50Properties of the layers or laminate having particular mechanical properties
    • B32B2307/538Roughness
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/50Properties of the layers or laminate having particular mechanical properties
    • B32B2307/546Flexural strength; Flexion stiffness
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/70Other properties
    • B32B2307/732Dimensional properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/02Temperature
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/04Time
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/08Dimensions, e.g. volume
    • B32B2309/10Dimensions, e.g. volume linear, e.g. length, distance, width
    • B32B2309/105Thickness
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00Metals, their alloys or their compounds
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/08PCBs, i.e. printed circuit boards
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0007Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
    • B32B37/0015Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality to avoid warp or curl
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0137Materials
    • H05K2201/0141Liquid crystal polymer [LCP]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15Position of the PCB during processing
    • H05K2203/1536Temporarily stacked PCBs

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Description

單面覆金屬積層體的製造方法Method for manufacturing single-sided metal-clad laminate

本發明係關於一種單面覆金屬積層體的製造方法,係製造在具有由熱塑性樹脂所構成之接著面之絕緣性薄膜上接著金屬箔而成之單面覆金屬積層體的方法。The present invention relates to a method for producing a single-sided metal-clad laminate, which is a method for producing a single-sided metal-clad laminate obtained by bonding a metal foil to an insulating film having a bonding surface made of a thermoplastic resin.

近年來由於電氣機器之小型化‧輕量化‧高機能化之發展,使軟性電路基板(flexible circuit board)之使用隨之增加,例如在其表面具有熱塑性之聚醯亞胺薄膜及液晶聚合物薄膜等絕緣薄膜上熱壓合(thermocompression)金屬箔而成之覆金屬積層體,即為適於使用之例。具有此種構造之積層體,其製造法一般係採用將絕緣薄膜與金屬箔以滾輪對滾輪(roll-to-roll)之方式輸送,一邊加熱一邊使其通過一對之加壓滾輪之間而連續地進行熱壓合的方法。In recent years, the use of flexible circuit boards has increased due to the miniaturization, light weight, and high performance of electrical equipment, such as thermoplastic polyimide films and liquid crystal polymer films on the surface. A metal-clad laminate formed by thermocompression metal foil on an insulating film is an example suitable for use. The laminated body having such a structure is generally manufactured by conveying an insulating film and a metal foil by a roll-to-roll method, and heating it while passing between a pair of pressing rollers. A method of performing thermal compression bonding continuously.

例如在專利文獻1中所揭示之提案,係在耐熱性薄膜之兩面具有熱塑性樹脂層之接著片之單面上熱壓合金屬箔時,藉由在熱壓合裝置之加壓面與接著片之間配置保護材料,而防止未積層金屬箔之側之熱塑性樹脂層熔接於金屬滾輪及保護薄膜之方法。然而,在該方法中,因缺少用以進行均勻加壓之壓力緩衝效果,特別在使用薄之接著片及薄之金屬箔時,由於加壓不均,而有產生未接著之部份及接著強度弱之部份之虞,並且亦可能在接著片與金屬箔之層間形成空隙,而有發生皺紋等外觀不良之缺陷。For example, in the proposal disclosed in Patent Document 1, when a metal foil is thermocompression-bonded on one surface of a sheet having a thermoplastic resin layer on both sides of a heat-resistant film, the pressing surface and the sheet of the thermocompression bonding apparatus are used. A method of preventing the thermoplastic resin layer on the side of the unlaminated metal foil from being welded to the metal roller and the protective film by disposing a protective material therebetween. However, in this method, due to the lack of a pressure buffering effect for uniform pressurization, particularly when a thin back sheet and a thin metal foil are used, due to uneven pressure, there is a non-adult part and then The weak portion is also likely to form a void between the layer of the adhesive sheet and the metal foil, and there is a defect that the appearance is poor such as wrinkles.

另外,在專利文獻2中所揭示之提案,係在將液晶聚合物薄膜與金屬箔重疊並以金屬加壓滾輪進行熱壓合時,在與金屬加壓滾輪接觸之面上再重疊耐熱性樹脂薄膜而製造積層體之方法。以該方法,在製造目的之積層體與滾輪之間係介置有耐熱性樹脂薄膜,因此可期待產生一定之緩衝效果,但相反地,其加壓滾輪之熱傳導至被積層體之傳熱效果卻會受阻,因此使金屬箔與液晶聚合物薄膜之接著力降低,而可能發生接著力不均之情形。Further, in the proposal disclosed in Patent Document 2, when the liquid crystal polymer film is overlapped with the metal foil and thermally pressed by a metal pressure roller, the heat resistant resin is superposed on the surface in contact with the metal pressure roller. A method of producing a laminate by a film. According to this method, a heat-resistant resin film is interposed between the laminate and the roller for the purpose of production, so that a certain cushioning effect can be expected, but conversely, the heat transfer of the pressure roller to the heat transfer effect of the laminated body However, it is hindered, so that the adhesion between the metal foil and the liquid crystal polymer film is lowered, and uneven adhesion may occur.

另外,在專利文獻3中所揭示之提案,係將熱塑性聚合物薄膜與被接著體於滾輪間進行熱處理且同時使其壓合之積層體之製造方法,其中,將熱塑性聚合物薄膜與被接著體重疊,在從其兩側以被覆材包夾之狀態下進行壓合,藉此而使薄膜與被接著體在短時間中強穩地壓合。惟該方法中,會有因為保護材料與加熱加壓面直接接觸而使保護材料易於劣化,因此減少保護材料之再利用次數,而增加製造成本等之缺點。同時,其亦有與專利文獻1同樣之情形,在使用薄之熱塑性聚合物薄膜及薄之被接著體時,會有易於形成未接著部份及弱接著部份之虞慮,此外亦可能發生層間空隙及皺紋等。Further, the proposal disclosed in Patent Document 3 is a method for producing a laminate in which a thermoplastic polymer film and a substrate are heat-treated between rolls, and simultaneously pressed, wherein a thermoplastic polymer film is followed. The body is superposed and pressed together in a state of being sandwiched by the covering material on both sides thereof, whereby the film and the adherend are strongly pressed in a short time. However, in this method, since the protective material is easily contacted by the direct contact between the protective material and the heated and pressed surface, the number of reuse of the protective material is reduced, and the manufacturing cost and the like are disadvantageous. At the same time, in the same manner as in Patent Document 1, when a thin thermoplastic polymer film and a thin adherend are used, there is a concern that it is easy to form a non-subsequent portion and a weakly succeeding portion, and may also occur. Interlayer voids, wrinkles, etc.

[先前技術文獻][Previous Technical Literature] [專利文獻][Patent Literature]

[專利文獻1] 日本特開2008-272958號公報[Patent Document 1] Japanese Patent Laid-Open Publication No. 2008-272958

[專利文獻2] WO2004/108397號公報[Patent Document 2] WO2004/108397

[專利文獻3] 日本特開2001-88219號公報[Patent Document 3] Japanese Patent Laid-Open Publication No. 2001-88219

因此,本發明之目的係提供一種使絕緣性薄膜與金屬箔之層間密接性佳,接著強度不會不均,抑制皺紋等外觀不良之發生,且可工業生產性佳地製造單面覆金屬積層體的方法。Therefore, an object of the present invention is to provide a good adhesion between layers of an insulating film and a metal foil, and to prevent unevenness in strength, to suppress occurrence of appearance defects such as wrinkles, and to produce a single-sided metal-clad layer with good industrial productivity. Body method.

本發明人等為解決上述先前技術之問題而精心研究之結果,發現將絕緣性薄膜與金屬箔之組合以間隔薄膜為中心而形成上下對稱之2組並予以重疊,經加壓滾輪進行熱壓合後,不會有薄膜熔接至加壓滾輪上之虞,並且由於使加壓滾輪間之壓力更均勻地傳導,因此可防止接著強度不均、及皺紋之發生等,而且若從間隔薄膜剝離,即可一次獲得2組此種品質安定之單面覆金屬積層體,而完成本發明。As a result of intensive studies to solve the problems of the prior art described above, the present inventors have found that the combination of the insulating film and the metal foil is formed into two groups of upper and lower symmetry centering on the spacer film and superimposed thereon, and is subjected to hot pressing by a pressure roller. After the combination, there is no flaw in the film to be welded to the pressure roller, and since the pressure between the pressure rollers is more uniformly transmitted, uneven strength, wrinkles, and the like can be prevented, and if the film is peeled off from the spacer film, The present invention can be completed by obtaining two sets of single-sided metal-clad laminates of such quality stability at one time.

亦即,本發明之單面覆金屬積層體的製造方法,係製造在具有由熱塑性樹脂所構成之接著面之絕緣性薄膜(A)上接著有金屬箔(B)之單面覆金屬積層體的方法,其特徵係使用表面及內面皆為表面粗度(Rz)2.0μm以下之間隔薄膜(C),並在一對之加壓滾輪(r1、r2)之間以(r1)/(B)/(A)/(C)/(A)/(B)/(r2)之順序,將絕緣性薄膜(A)、金屬箔(B)、及間隔薄膜(C)重疊並熱壓合,從間隔薄膜(C)剝離而獲得2個單面覆金屬積層體。That is, the method for producing the single-sided metal-clad laminate according to the present invention is a single-sided metal-clad laminate in which an insulating film (A) having a bonding surface made of a thermoplastic resin is followed by a metal foil (B). The method is characterized in that the surface and the inner surface are both a film (C) having a surface roughness (Rz) of 2.0 μm or less, and (r1)/( between a pair of pressure rollers (r1, r2). In the order of B)/(A)/(C)/(A)/(B)/(r2), the insulating film (A), the metal foil (B), and the spacer film (C) are superposed and thermocompression bonded. Two single-sided metal-clad laminates were obtained by peeling off the spacer film (C).

依據本發明,可以優良之工業生產性製造不產生皺紋及接著強度不均,且絕緣性薄膜與金屬箔之層間密接性佳之高品質之單面覆金屬積層體。亦即,相較於以往之方法,本發明之製造方法可大幅提高工業生產效率,因此可以更低之成本製成高品質之單面覆金屬積層體。此外,本發明所獲得之單面覆金屬積層體,具有高品質且可靠性(reliability)優良,故可適合使用於作為例如形成精細圖案(fine pattern)時所需之電路基板、及多層電路基板用之基板材料。According to the present invention, it is possible to produce a high-quality single-sided metal-clad laminate which is excellent in the adhesion between the insulating film and the metal foil without causing wrinkles and uneven strength, and which is excellent in industrial productivity. That is, the manufacturing method of the present invention can greatly improve the industrial production efficiency as compared with the conventional method, and thus a high-quality single-sided metal-clad laminate can be produced at a lower cost. Further, since the single-sided metal-clad laminate obtained by the present invention has high quality and excellent reliability, it can be suitably used as, for example, a circuit substrate required for forming a fine pattern, and a multilayer circuit substrate. Substrate material used.

以下詳細說明本發明。The invention is described in detail below.

本發明中,係在一對之加壓滾輪(r1、r2)之間,以金屬箔(B)/絕緣性薄膜(A)/間隔薄膜(C)/絕緣性薄膜(A)/金屬箔(B)之順序重疊並熱壓合,之後從間隔薄膜(C)剝離,而同時製造2個在絕緣性薄膜(A)上接著金屬箔(B)而成之單面覆金屬積層體。In the present invention, between a pair of pressing rollers (r1, r2), a metal foil (B) / an insulating film (A) / a spacer film (C) / an insulating film (A) / a metal foil ( The order of B) is superposed and thermocompression-bonded, and then peeled off from the spacer film (C), and two single-sided metal-clad laminates obtained by adhering the metal foil (B) to the insulating film (A) are simultaneously produced.

其中,本發明所使用之絕緣性薄膜(A),只要是具有由熱塑性樹脂所構成之接著面且可經由熱壓合而在接著面上貼合金屬箔(B)者即可,並無特別之限定,其例可列舉如:i)由熱塑性樹脂薄膜所構成者;以及其他例如ii)在耐熱性樹脂薄膜之單面上設置熱塑性樹脂層而形成接著面者;iii)在耐熱性樹脂薄膜之兩面上設置熱塑性樹脂層,並以其中任一者作為與金屬箔之接著面者等。此外,亦可使用將其中之1種或2種以上重疊而製成複數層者。In addition, the insulating film (A) used in the present invention is not particularly limited as long as it has a bonding surface made of a thermoplastic resin and can be bonded to the bonding surface via a thermocompression bonding. For example, i) is composed of a thermoplastic resin film; and other, for example, ii) a thermoplastic resin layer is provided on one surface of the heat resistant resin film to form a bonding surface; and iii) a heat resistant resin film is formed. A thermoplastic resin layer is provided on both surfaces, and any one of them is used as a back surface of the metal foil. Further, one or two or more of them may be used to form a plurality of layers.

其中,i)由熱塑性樹脂薄膜所構成之絕緣性薄膜(A)之例,可列舉如聚對苯二甲酸乙二酯樹脂、聚萘二甲酸乙二酯樹脂、聚碳酸酯樹脂、丙烯腈/苯乙烯共聚樹脂、熱塑性聚醯亞腰樹脂、液晶聚合物等,其中在加工性、電氣特性、耐熱性等觀點上,以液晶聚合物或熱塑性聚醯亞腰樹脂較佳。In the examples of the insulating film (A) composed of a thermoplastic resin film, for example, polyethylene terephthalate resin, polyethylene naphthalate resin, polycarbonate resin, acrylonitrile/ A styrene copolymer resin, a thermoplastic polythene resin, a liquid crystal polymer or the like is preferable, and a liquid crystal polymer or a thermoplastic polythene resin is preferable from the viewpoints of workability, electrical properties, heat resistance and the like.

液晶聚合物之例,可列舉如由如下之(1)至(4)分類之化合物及其衍生物所導出之周知之熱向型液晶(thermotropic liquid crystal)聚酯、熱向型液晶聚酯醯胺等。Examples of the liquid crystal polymer include well-known thermotropic liquid crystal polyesters and thermotropic liquid crystal polyesters derived from the compounds classified by the following (1) to (4) and derivatives thereof. Amines, etc.

(1)芳族或脂族二羥基化合物(1) aromatic or aliphatic dihydroxy compounds

(2)芳族或脂族二羧酸(2) aromatic or aliphatic dicarboxylic acid

(3)芳族羥基羧酸(3) Aromatic hydroxycarboxylic acid

(4)芳族二胺、芳族羥基胺或芳族胺基羧酸(4) aromatic diamine, aromatic hydroxylamine or aromatic aminocarboxylic acid

由此等原料化合物所獲得之液晶聚合物中,又以分子中不含脂族鏈之芳族液晶聚合物較佳。此類液晶聚合物之代表例,可列舉如以6-羥基-2-萘甲酸及對羥基苯甲酸為原料所製成且含有下述式所示構成單位之共聚物。其中,下述式中之m2 及n2 為顯示各構成單位之存在莫耳數比的正數。Among the liquid crystal polymers obtained by such a raw material compound, an aromatic liquid crystal polymer containing no aliphatic chain in the molecule is preferable. Representative examples of such a liquid crystal polymer include a copolymer prepared by using 6-hydroxy-2-naphthoic acid and p-hydroxybenzoic acid as raw materials and containing a constituent unit represented by the following formula. Here, m 2 and n 2 in the following formula are positive numbers showing the molar ratio of each constituent unit.

液晶聚合物中,在考慮其耐熱性及在熱壓合時之加工性上,以較好為在200至400℃之範圍,更好為在250至350℃之範圍內具有往光學異向性(optically anisotropy)之熔融相的轉移溫度者較佳。又,液晶聚合物中在不減損其特性之範圍內,亦可調配例潤滑劑、抗氧化劑、填充劑等。In the liquid crystal polymer, optical anisotropy is preferably in the range of 200 to 400 ° C, more preferably in the range of 250 to 350 ° C, in consideration of heat resistance and workability at the time of thermocompression bonding. The transfer temperature of the molten phase of (optically anisotropy) is preferred. Further, in the liquid crystal polymer, a lubricant, an antioxidant, a filler, and the like may be blended in a range that does not detract from the characteristics.

將液晶聚合物予以薄膜化之方法,可例舉如T模具法(T die method)、層合體延伸法、充氣法(inflation method)等。其中,若使用充氣法及層合體延伸法,則不只會在薄膜之機械軸方向(MD方向)施加應力,亦會在與其垂直之方向(TD方向)施加應力,因此,可製成其MD方向與TD方向之機械性質達成平衡之薄膜。液晶聚合物薄膜亦可使用市售商品,例如KURARAY公司製造之Vecstar(註冊商標)、及日本GORE-TEX公司製造之BIAC、STABIAX(均為註冊商標)等。The method of thinning the liquid crystal polymer may, for example, be a T die method, a laminate stretching method, an inflation method or the like. In the case where the inflation method and the laminate stretching method are used, stress is not applied only in the mechanical axis direction (MD direction) of the film, and stress is applied in the direction perpendicular thereto (TD direction), so that the MD direction can be made. A film that balances the mechanical properties of the TD direction. Commercially available products such as Vecstar (registered trademark) manufactured by KURARAY Co., Ltd., and BIAC and STABIAX (both registered trademarks) manufactured by GORE-TEX Corporation of Japan may be used as the liquid crystal polymer film.

此外,熱塑性聚醯亞胺樹脂係可藉由將其前驅物之聚醯胺酸進行醯亞胺化(硬化)而形成,其中之聚醯胺酸可藉由將一般已知之二胺與酸酐在溶劑存在下進行反應而製成。Further, the thermoplastic polyimide resin can be formed by ruthenium (hardening) the polyamic acid of its precursor, wherein the polyamine can be obtained by using a generally known diamine and an acid anhydride. It is prepared by carrying out a reaction in the presence of a solvent.

熱塑性聚醯亞胺樹脂中所使用之前驅物,係以具有下述通式(1)所示之構造單位之前驅物較佳。通式(1)中,Ar3 表示式(2)、式(3)或式(4)所示之2價芳基;Ar4 表示式(5)或式(6)所示之4價芳基;R2 係獨立地表示碳原子數1至6之1價烴基或烷氧基;V及W獨立地表示單鍵或選自由碳原子數1至15之2價烴基、O、S、CO、SO2 、或CONH中之2價基;m1 獨立地表示0至4之整數;p表示構成單位之存在莫耳比,為0.1至1.0之值。The precursor used in the thermoplastic polyimide resin is preferably a precursor having a structural unit represented by the following formula (1). In the formula (1), Ar 3 represents a divalent aryl group represented by the formula (2), the formula (3) or the formula (4); and Ar 4 represents a tetravalent aromatic group represented by the formula (5) or the formula (6). R 2 is independently a monovalent hydrocarbon group or alkoxy group having 1 to 6 carbon atoms; V and W independently represent a single bond or a divalent hydrocarbon group selected from 1 to 15 carbon atoms, O, S, CO a divalent group in SO 2 or CONH; m 1 independently represents an integer of 0 to 4; and p represents a molar ratio of the constituent units, which is a value of 0.1 to 1.0.

其中使用之二胺,可例舉如4,4’-二胺基二苯基醚、2’-甲氧基-4,4’-二胺基苯甲醯苯胺、1,4-雙(4-胺基苯氧基)苯、1,3-雙(4-胺基苯氧基)苯、2,2’-雙[4-(4-胺基苯氧基)苯]丙烷、2,2’-二甲基-4,4’-二胺基聯苯、3,3’-二羥基-4,4’-二胺基聯苯、4,4’-二胺基苯甲醯苯胺等。酸酐之例,可列舉如均苯四甲酸二酐(pyromellitic dianhydride)、3,3’,4,4’-聯苯四羧酸二酐、3,3’,4,4’-二苯基碸四羧酸二酐、4,4’-氧雙鄰苯二甲酸酐(4,4’-oxydiphthalic anhydride)等。二胺及酸酐可分別只使用其1種,亦可併用2種以上。聚醯亞胺樹脂並不限定為由如上述之二胺與酸酐所製成者。The diamine used therein may, for example, be 4,4'-diaminodiphenyl ether, 2'-methoxy-4,4'-diaminobenzimidamide, 1,4-bis (4) -aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene, 2,2'-bis[4-(4-aminophenoxy)benzene]propane, 2,2 '-Dimethyl-4,4'-diaminobiphenyl, 3,3'-dihydroxy-4,4'-diaminobiphenyl, 4,4'-diaminobenzimidamide, and the like. Examples of the acid anhydride include pyromellitic dianhydride, 3,3', 4,4'-biphenyltetracarboxylic dianhydride, and 3,3',4,4'-diphenylanthracene. Tetracarboxylic dianhydride, 4,4'-oxydiphthalic anhydride, and the like. The diamine and the acid anhydride may be used alone or in combination of two or more. The polyimine resin is not limited to those made of the above-described diamine and acid anhydride.

絕緣性薄膜(A)在使用熱塑性聚醯亞胺樹脂薄膜時,該薄膜可由聚醯亞胺樹脂前驅物之聚醯胺酸經由拉幅法(tentering)及鑄製法(cast method)等一般已知之方法使其薄膜化。其代表方法之一之拉幅法,為將聚醯胺酸溶液流延至旋轉之滾輪,以聚醯胺酸之膠體薄膜之狀態自旋轉之滾輪上剝離,之後再經拉幅爐(tenter oven)進行加熱/硬化(醯亞胺化)而製成聚醯亞胺薄膜之方法。鑄製法為在任意之支持基材上將聚醯胺酸溶液塗佈、乾燥後,經熱處理而硬化(醯亞胺化)以製成聚醯亞胺薄膜之方法。醯亞胺化可藉由例如在80至400℃之溫度條件下於1至60分鐘之時間範圍內加熱而進行。又,聚醯亞胺樹脂在不減損其特性之範圍內,亦可調配例如潤滑劑、抗氧化劑、填充劑等。In the insulating film (A), when a thermoplastic polyimide film is used, the film can be generally known from tentering and casting methods of polyamic acid of a polyimide resin precursor. The method is to make it thin. One of the representative methods of the tenter method is to cast a polyaminic acid solution to a rotating roller, peel off from the rotating roller in the state of a colloidal acid colloidal film, and then pass through a tenter oven. A method of forming a polyimide film by heating/hardening (醯imination). The casting method is a method in which a polyaminic acid solution is coated and dried on an arbitrary supporting substrate, and then cured by heat treatment to obtain a polyimide film. The ruthenium imidization can be carried out, for example, by heating at a temperature of from 80 to 400 ° C for a period of from 1 to 60 minutes. Further, the polyimine resin may be formulated with, for example, a lubricant, an antioxidant, a filler, or the like, within a range not detracting from its characteristics.

絕緣性薄膜(A),在使用ii)在耐熱性樹脂薄膜之單面上設置熱塑性樹脂層者、或iii)在耐熱性樹脂薄膜之兩面上設置熱塑性樹脂層者時,該耐熱性樹脂薄膜只要是其熱變形溫度係比熱塑性樹脂層高者即可,並無特別之限定,其中以非熱塑性之聚醯亞胺樹脂薄膜較佳。非熱塑性聚醯亞胺樹脂係與熱塑性聚醯亞胺相同,可藉由將一般已知之二胺與酸酐在溶劑存在下反應而製成,其中可藉由改變其所使用之原料組合而製成耐熱性之聚醯亞胺樹脂。該非熱塑性聚醯亞胺樹脂薄膜有市售商品,可列舉如Du Pont-Toray股份公司製造之Kapton EN、Kapton H、Kapton V(均為商品名);鐘淵化學股份公司製造之APICAL NPI(商品名);宇部興產股份公司製造之UPILEX-S(商品名)等。非熱塑性聚醯亞胺樹脂薄膜,以玻璃轉移溫度在300℃以上者為佳,並且以在由滾輪所致之熱壓合之溫度下亦不變形者更佳。In the insulating film (A), when ii) a thermoplastic resin layer is provided on one surface of the heat-resistant resin film, or iii) a thermoplastic resin layer is provided on both surfaces of the heat-resistant resin film, the heat-resistant resin film is only required The heat distortion temperature is preferably higher than that of the thermoplastic resin layer, and is not particularly limited, and a non-thermoplastic polyimide film is preferred. The non-thermoplastic polyimine resin is the same as the thermoplastic polyimine, and can be produced by reacting a generally known diamine with an acid anhydride in the presence of a solvent, which can be produced by changing the combination of raw materials used therein. Heat resistant polyimide resin. The non-thermoplastic polyimide film is commercially available, and examples thereof include Kapton EN, Kapton H, and Kapton V (all trade names) manufactured by Du Pont-Toray Co., Ltd.; and APICAL NPI manufactured by Zhongyuan Chemical Co., Ltd. Name); UPILEX-S (trade name) manufactured by Ube Industries Co., Ltd., etc. The non-thermoplastic polyimide film is preferably one having a glass transition temperature of 300 ° C or more, and preferably not deformed at a temperature of thermal compression by a roller.

此外,在耐熱性樹脂薄膜之單面或兩面所設置之熱塑性樹脂層,只要是由至少在熱壓合之加熱溫度以下具有玻璃轉變溫度之樹脂所形成者即可,且樹脂之種類並無特別之限定,其例可列舉如熱塑性聚醯亞腰樹脂、熱塑性液晶聚合物、聚醚醚酮、聚萘二甲酸乙二酯等。又,該熱塑性樹脂層,可藉由在耐熱性樹脂薄膜上接合熱塑性樹脂薄膜而形成,亦可藉由將其前驅物以鑄製法等塗佈而形成。In addition, the thermoplastic resin layer provided on one surface or both surfaces of the heat-resistant resin film may be formed of a resin having a glass transition temperature at least below the heating temperature of the thermocompression bonding, and the type of the resin is not particularly limited. The examples thereof include, for example, a thermoplastic polythene resin, a thermoplastic liquid crystal polymer, polyether ether ketone, polyethylene naphthalate, and the like. Further, the thermoplastic resin layer can be formed by bonding a thermoplastic resin film to a heat-resistant resin film, or can be formed by applying a precursor to a filming method or the like.

絕緣性薄膜(A)之厚度,以5至200μm為佳,10至100μm更佳。絕緣性薄膜(A)過薄時會減低其剛性,在覆金屬積層體之製造步驟中及在使用所得之積層體之配線基板之加工步驟中,有產生皺紋及破裂等缺陷之虞。另一方面,在其過厚時,會使其絕緣性薄膜缺乏柔軟性,在覆金屬積層體之製造步驟中會使滾輪對滾輪(roll-to-roll)之輸送產生困難,此外,會發生經電路加工之配線基板不易裝入狹小框體中等之缺陷。The thickness of the insulating film (A) is preferably 5 to 200 μm, more preferably 10 to 100 μm. When the insulating film (A) is too thin, the rigidity is reduced, and defects such as wrinkles and cracks occur in the manufacturing steps of the metal-clad laminate and in the processing steps of the wiring board using the obtained laminate. On the other hand, when it is too thick, the insulating film lacks flexibility, and in the manufacturing step of the metal-clad laminate, the roller-to-roll conveyance is difficult, and in addition, it may occur. The wiring board processed by the circuit is not easily loaded into a narrow frame or the like.

本發明中使用之金屬箔(B)之材質並無特別之限定,可例舉如金、銀、銅、不銹鋼、鎳、鋁等。其中,在導電性、操作容易性、價格等之觀點上,以銅箔及不銹鋼箔較佳。其中之銅箔,可使用以任意之壓延法(rolling process)及電解法所製成者。此外,對於金屬箔,在提高其與絕緣薄膜之接著力之目的下,亦可預先進行粗化處理等物理性表面處理,以及酸洗淨、UV處理、電漿處理等化學性表面處理。The material of the metal foil (B) used in the present invention is not particularly limited, and examples thereof include gold, silver, copper, stainless steel, nickel, aluminum, and the like. Among them, copper foil and stainless steel foil are preferable from the viewpoints of conductivity, ease of handling, and price. Among them, the copper foil can be produced by any of a rolling process and an electrolytic method. Further, for the purpose of improving the adhesion between the metal foil and the insulating film, physical surface treatment such as roughening treatment, and chemical surface treatment such as pickling, UV treatment, and plasma treatment may be performed in advance.

金屬箔(B)之厚度,以1至100μm為佳,5至70μm更佳,8至20μm之範圍又更佳。若使金屬箔之厚度減低,則在電路加工中易於形成精細圖案之觀點上為較佳,惟過薄時,不只在覆金屬積層體的製造步驟中容易於金屬箔產生皺紋,且在經電路加工之配線基板中亦容易發生配線斷裂,而有使作為配線基板之可靠性減損之虞慮。相反地在在其過厚時,在金屬箔經蝕刻加工而形成電路時,在電路側面上容易發生漸縮(taper)之情形,對精細圖案之形成為不利。The thickness of the metal foil (B) is preferably from 1 to 100 μm, more preferably from 5 to 70 μm, still more preferably in the range of from 8 to 20 μm. If the thickness of the metal foil is reduced, it is preferable from the viewpoint of easily forming a fine pattern in circuit processing, but when it is too thin, not only wrinkles are easily formed in the metal foil in the manufacturing step of the metal-clad laminate, but also in the circuit. In the processed wiring board, wiring breakage is also likely to occur, and there is a concern that the reliability of the wiring board is degraded. Conversely, when it is too thick, when the metal foil is etched to form a circuit, taper is likely to occur on the side of the circuit, which is disadvantageous for the formation of the fine pattern.

本發明中所使用之間隔薄膜(C),除了須有耐熱壓合溫度之耐熱性之外,亦必須在熱壓合後可容易地與絕緣性薄膜(A)剝離。在後者之觀點上,以使用間隔薄膜(C)之表面及內面均為表面粗度(Rz)2.0μm以下者為佳,以0.5至1.5μm者更佳。在易於同時確保耐熱性與表面平滑性方面,間隔薄膜(C)係以使用非熱塑性之聚醯亞胺薄膜及聚醯胺薄膜等耐熱性樹脂薄膜、或鋁箔及不銹鋼箔等金屬箔較佳。此外,亦可使用樹脂薄膜之表面及內面具有金屬箔之複合薄膜。間隔薄膜(C)在表面及內面之表面粗度(Rz)超過2.0μm時,由於錨定作用(anchoring effect)會使絕緣性薄膜(A)與間隔薄膜(C)之層間密接力提高,使由絕緣性薄膜(A)及金屬箔(B)所製成之單面覆金屬積層體在從間隔薄膜(C)剝離時之剝離阻力增加,因此而有使單面覆金屬積層體產生斷裂及皺紋等外觀上缺陷之虞慮。The spacer film (C) used in the present invention must be easily peeled off from the insulating film (A) after thermocompression bonding in addition to heat resistance at a heat-resistant pressure bonding temperature. From the viewpoint of the latter, the surface and the inner surface of the spacer film (C) are preferably those having a surface roughness (Rz) of 2.0 μm or less, more preferably 0.5 to 1.5 μm. The spacer film (C) is preferably a heat-resistant resin film such as a non-thermoplastic polyimide film or a polyimide film, or a metal foil such as an aluminum foil or a stainless steel foil, in order to ensure heat resistance and surface smoothness at the same time. Further, a composite film having a metal foil on the surface and the inner surface of the resin film may also be used. When the surface roughness and the surface roughness (Rz) of the inner surface and the inner surface of the spacer film (C) exceed 2.0 μm, the interlayer adhesion between the insulating film (A) and the spacer film (C) is improved by the anchoring effect. When the single-sided metal-clad laminate made of the insulating film (A) and the metal foil (B) is peeled off when peeled off from the spacer film (C), the single-sided metal-clad laminate is broken. And wrinkles and other defects in appearance.

對於間隔薄膜(C),在增加其熱壓合後與絕緣性薄膜(A)之剝離性之目的上,以將間隔薄膜(C)之單面或雙面進行離型處理為佳。離型處理之具體方法,可列舉如在間隔薄膜(C)上設置聚矽氧(silicone)樹脂、氟系樹脂等耐熱離型樹脂皮膜之方法等。It is preferable that the spacer film (C) is subjected to release treatment on one side or both sides of the spacer film (C) for the purpose of increasing the peeling property after the thermocompression bonding and the insulating film (A). Specific examples of the release treatment include a method of providing a heat-resistant release resin film such as a silicone resin or a fluorine resin on the spacer film (C).

間隔薄膜(C)之厚度,較好在10至300μm,更好在20至150μm,又更好在30至100μm之範圍。間隔薄膜(C)過薄時,使熱壓合時之壓力均勻分散之壓力緩衝效果會降低,而使製成之覆金屬積層體之絕緣性薄膜(A)與金屬箔(B)之層間密接性會有不均之虞慮。另一方面,在其過厚時,可能會阻礙滾輪對滾輪之方式之輸送,或是在熱壓合後從覆金屬積層體剝離時有使作業性變差之虞慮。The thickness of the spacer film (C) is preferably from 10 to 300 μm, more preferably from 20 to 150 μm, still more preferably from 30 to 100 μm. When the spacer film (C) is too thin, the pressure buffering effect of uniformly dispersing the pressure during the thermocompression bonding is lowered, and the insulating film (A) of the metal-clad laminate formed and the layer of the metal foil (B) are closely adhered. Sex will have uneven considerations. On the other hand, when it is too thick, the conveyance of the roller to the roller may be hindered, or the workability may be deteriorated when peeling off from the metal-clad laminate after the thermocompression bonding.

就絕緣性薄膜(A)、金屬箔(B)、及間隔薄膜(C)之組合而言,在熱壓合步驟中之操作容易性及經濟性(材料成本、間隔薄膜之再利用性等)、及製成之單面覆金屬積層體的特性(機械特性、電氣特性、熱特性、加工性等)之觀點上,較佳為:其絕緣性薄膜(A)係使用厚度10至100μm之液晶聚合物薄膜、或在至少一方之表面上具有熱塑性樹脂層之聚醯亞腰薄膜;其金屬箔(B)係使用厚度5至70μm之銅箔;其間隔薄膜(C)係使用表面及內面皆為表面粗度(Rz)2.0μm以下,且厚度為5至70μm之鋁箔。In the combination of the insulating film (A), the metal foil (B), and the spacer film (C), the ease of handling and economy in the thermocompression bonding step (material cost, reusability of the spacer film, etc.) From the viewpoint of the characteristics (mechanical properties, electrical properties, thermal properties, processability, etc.) of the produced single-sided metal-clad laminate, it is preferred that the insulating film (A) is a liquid crystal having a thickness of 10 to 100 μm. a polymer film or a polyimide film having a thermoplastic resin layer on at least one of the surfaces; a metal foil (B) using a copper foil having a thickness of 5 to 70 μm; and a spacer film (C) using a surface and an inner surface All are aluminum foils having a surface roughness (Rz) of 2.0 μm or less and a thickness of 5 to 70 μm.

在一對之加壓滾輪(r1、r2)之間,將以(r1)/(B)/(A)/(C)/(A)/(B)/(r2)之順序重疊之絕緣性薄膜(A)、金屬箔(B)、及間隔薄膜(C)進行熱壓合時,可使用具備具有加熱裝置之一對之加壓滾輪的一般已知之加熱加壓裝置。此時,對於絕緣性薄膜(A)、金屬箔(B)、及間隔薄膜(C),若各自將捲成滾輪狀之長形材料與加熱加壓裝置組合使用,即可連續製造單面覆金屬積層體。此外,加壓滾輪之溫度及加壓滾輪之壓力條件並無特別之限定,惟由於絕緣性薄膜(A)之熱塑性樹脂必須藉由變形等而與金屬箔(B)良好地接著,因此,以比熱塑性樹脂之Tg或熔點稍低之溫度操作為佳。例如在絕緣性薄膜(A)係使用液晶聚合物薄膜時,以比其熔點低5至100℃之溫度範圍較佳,以比其熔點低20至80℃之溫度範圍更佳。此外,以其加壓壓力在20至200kN/m之範圍時又為更佳。Insulation in the order of (r1) / (B) / (A) / (C) / (A) / (B) / (r2) between a pair of pressure rollers (r1, r2) When the film (A), the metal foil (B), and the spacer film (C) are thermocompression-bonded, a generally known heating and pressurizing device having a pressure roller having one pair of heating devices can be used. In this case, when the insulating film (A), the metal foil (B), and the spacer film (C) are each used in combination with a heating and pressurizing device, a single-sided coating can be continuously produced. Metal laminate. Further, the temperature of the pressure roller and the pressure condition of the pressure roller are not particularly limited. However, since the thermoplastic resin of the insulating film (A) must be well adhered to the metal foil (B) by deformation or the like, It is preferred to operate at a temperature slightly lower than the Tg or melting point of the thermoplastic resin. For example, when the insulating film (A) is a liquid crystal polymer film, it is preferably in a temperature range of 5 to 100 ° C lower than the melting point thereof, and more preferably in a temperature range of 20 to 80 ° C lower than the melting point. Further, it is more preferable that the pressurizing pressure is in the range of 20 to 200 kN/m.

本發明中,隔著間隔薄膜(C)而在其兩面側配置之絕緣性薄膜(A)及金屬箔(B),由於係形成以間隔薄膜(C)為中心而分別位於對稱位置之關係,故其一對之加壓滾輪(r1、r2)可設為相同之溫度而進行熱壓合,因此可防止滾輪間不必要之熱損失。此外,由於加壓滾輪均與金屬箔(B)接觸,因此,加壓滾輪上之熱傳導不易受阻。又,在經熱壓合後,如下述實施例中之說明,其絕緣性薄膜(A)與間隔薄膜(C)之層間剝離強度為0.1kN/m以下而極易於剝離,可防止其接著強度不均、皺紋之發生,因此,可生產性良好地獲得高品質之單面覆金屬積層體。再者,雖然本發明係藉由介置間隔薄膜(C)而從2組之絕緣性薄膜(A)及金屬箔(B)獲得單面覆金屬積層體,但亦可另檢討藉由介置間隔薄膜(C)並使用2組之(B)/(A)/(B)組合,而一次製成2個在兩面具有金屬箔之雙面覆金屬積層體的變化例。In the present invention, the insulating film (A) and the metal foil (B) which are disposed on both sides of the spacer film (C) are disposed at a symmetrical position around the spacer film (C). Therefore, the pair of pressing rollers (r1, r2) can be thermocompression-bonded at the same temperature, thereby preventing unnecessary heat loss between the rollers. Further, since the pressure roller is in contact with the metal foil (B), heat conduction on the pressure roller is not easily hindered. Further, after thermocompression bonding, as described in the following examples, the interlayer peeling strength of the insulating film (A) and the spacer film (C) is 0.1 kN/m or less, and it is extremely easy to peel off, thereby preventing the subsequent peeling. Since uneven strength and wrinkles occur, a high-quality single-sided metal-clad laminate can be obtained with good productivity. Further, although the present invention obtains a single-sided metal-clad laminate from the two sets of the insulating film (A) and the metal foil (B) by interposing the spacer film (C), it is also possible to further evaluate the spacer film by interposing (C) A two-layered (B)/(A)/(B) combination was used, and two modified double-sided metal-clad laminates having metal foils on both sides were produced at one time.

實施例Example

以下,以實施例具體說明本發明,惟本發明並不限定於以下之內容。此外,在後述之本發明實施例中,除非特別限定,其加工條件、測定(評估)之條件係如下述中所述。Hereinafter, the present invention will be specifically described by way of examples, but the present invention is not limited to the following. Further, in the examples of the invention to be described later, the conditions of the processing conditions and the measurement (evaluation) are as described below unless otherwise specified.

[表面粗度之測定][Measurement of surface roughness]

依照JIS B 0601,使用觸針式表面粗度測定器(TENCOR公司製造,TENCOR P-10),以負載100μN、掃描速度20μm/秒鐘、測定距離800μm之條件測定Rz(十點平均粗度)。Rz (ten-point average thickness) was measured in accordance with JIS B 0601 using a stylus type surface roughness measuring instrument (TENCOR P-10, manufactured by TENCOR Co., Ltd.) under the conditions of a load of 100 μN, a scanning speed of 20 μm/sec, and a measurement distance of 800 μm. .

[間隔薄膜(C)之剝離性之評估][Evaluation of the peelability of the spacer film (C)]

將經熱壓合後而含有間隔薄膜(C)之積層物(B/A/C/A/B),以對其加壓滾輪之長方向切割成寬度10mm、對其層合進行方向(MD方向)切割成長度150mm而製備成板條狀剝離性試驗片,並將其絕緣性薄膜(A)與間隔薄膜(C)之層間剝離性依照JIS K 6854-3(T型剝離)測定。其中之剝離速度定為100mm/分鐘。The laminate (B/A/C/A/B) containing the spacer film (C) after thermocompression bonding is cut into a width of 10 mm in the longitudinal direction of the press roller, and the direction of lamination is performed (MD) The direction was cut into a length of 150 mm to prepare a strip-like peeling test piece, and the interlayer peeling property of the insulating film (A) and the spacer film (C) was measured in accordance with JIS K 6854-3 (T-type peeling). The peeling speed was set at 100 mm/min.

[覆金屬積層體之密接性之評估][Evaluation of the adhesion of metal-clad laminates]

將所得之單面覆金屬積層體對其層合進行方向(MD方向)切割成長度150mm,使用市售之蝕刻液(ADEKA CHELUMICA FE-210,ADEKA股份公司製造)以減色法(subtractive method)蝕刻銅箔,並沿著其層合進行方向而形成寬度1mm、長度100mm之直線導體圖案7(參考第3圖)。其中,直線導體圖案7,係在單面覆金屬積層體之寬方向(加壓滾輪之長方向)之中央位置、由中央往寬方向在左右各間隔30mm之位置上形成3處圖案,而作為密接性試驗片。對該密接性試驗片之3條直線導體圖案,依照JISC 6471 8.1之方法B(往180°方向之拉離)測定其從絕緣性薄膜(A)剝離之強度。之後,3條之剝離強度之平均值係以1.0kN/m以上時為良好,0.5kN/m以上且未達1.0kN/m時為尚可,未達0.5kN/m時為不良之3等級評估其「密接性」。此外,3條之剝離強度中之最大值與最小值之差係評估為「密接性之不均程度」。The obtained single-sided metal-clad laminate was cut into a length of 150 mm in the direction of lamination, and was etched by a subtractive method using a commercially available etching solution (ADEKA CHELUMICA FE-210, manufactured by ADEKA AG). The copper foil was formed along the direction in which the lamination was performed to form a linear conductor pattern 7 having a width of 1 mm and a length of 100 mm (refer to Fig. 3). In the linear conductor pattern 7, three patterns are formed at a central position in the width direction of the single-sided metal-clad laminate (longitudinal direction of the pressure roller), and three points are formed at a position spaced apart from each other by 30 mm from the center to the width direction. Adhesion test piece. The three linear conductor patterns of the adhesion test piece were measured for the strength of peeling from the insulating film (A) in accordance with Method B of JIS C 6471 8.1 (stretching in the 180° direction). After that, the average of the peel strengths of the three strips is preferably 1.0 kN/m or more, and 0.5 kN/m or more and less than 1.0 kN/m is acceptable, and when it is less than 0.5 kN/m, it is a bad grade of 3. Evaluate its "adhesiveness". In addition, the difference between the maximum value and the minimum value of the peel strengths of the three pieces was evaluated as "the degree of unevenness of the adhesion".

(實施例1)(Example 1)

準備將厚度為50μm、寬度為70mm之液晶聚合物薄膜1(熔點320℃)捲成滾輪狀之長形薄膜以作為絕緣性薄膜(A),另準備將厚度為12μm、寬度為70mm之市售之電解銅箔2(表面粗度Rz:絕緣性薄膜積層面1.6μm、露出面1.4μm)捲成滾輪狀之長形銅箔以作為金屬箔(B),再準備將厚度為50μm、寬度為70mm之鋁箔3(表面及內面均為表面粗度Rz:1.2μm)捲成滾輪狀之長形鋁箔以作為間隔薄膜(C)。如第1圖所示,將此等分別裝設至絕緣性薄膜饋出滾輪A、金屬箔饋出滾輪B、間隔薄膜饋出滾輪C,再在一對之加壓滾輪4(r1、r2)之間以"電解銅箔2/液晶聚合物薄膜1/鋁箔3/液晶聚合物薄膜1/電解銅箔2"之順序重疊並供給(如第2圖),其經熱壓後使其自然冷卻,並使用剝離滾輪6而將鋁箔3與液晶聚合物薄膜1層間剝離,鋁箔3則由間隔薄膜捲取滾輪C’回收,貼合有液晶聚合物薄膜1及電解銅箔2之單面覆銅積層體5則各由設置在2處之製品捲取滾輪x所回收。A liquid crystal polymer film 1 (melting point 320 ° C) having a thickness of 50 μm and a width of 70 mm was rolled into a roll-shaped elongated film as an insulating film (A), and a commercially available thickness of 12 μm and a width of 70 mm was prepared. The electrodeposited copper foil 2 (surface roughness Rz: 1.6 μm of the insulating film layer and 1.4 μm of the exposed surface) is rolled into a roll-shaped elongated copper foil as a metal foil (B), and then prepared to have a thickness of 50 μm and a width of A 70 mm aluminum foil 3 (the surface and the inner surface are both surface roughness Rz: 1.2 μm) is rolled into a roll-shaped elongated aluminum foil as a spacer film (C). As shown in Fig. 1, these are respectively attached to the insulating film feeding roller A, the metal foil feeding roller B, the spacer film feeding roller C, and the pair of pressing rollers 4 (r1, r2). The film is superimposed and supplied in the order of "electrolytic copper foil 2 / liquid crystal polymer film 1 / aluminum foil 3 / liquid crystal polymer film 1 / electrolytic copper foil 2" (as shown in Fig. 2), which is naturally cooled by hot pressing And the aluminum foil 3 and the liquid crystal polymer film 1 are peeled off by using the peeling roller 6, and the aluminum foil 3 is recovered by the spacer film winding roller C', and the single-sided copper coating of the liquid crystal polymer film 1 and the electrolytic copper foil 2 is bonded. The laminated bodies 5 are each recovered by the product take-up rolls x provided at two places.

之後,再使電解銅箔2、液晶聚合物薄膜1、及鋁箔3均以0.7m/分鐘之速度移動,並在2個均為表面溫度240℃之加壓滾輪4之間,以其滾輪間壓力40kN/m進行熱壓合,熱壓合後再經自然冷卻使該積層物冷卻,並由間隔薄膜捲取滾輪C’回收鋁箔3,且由設置在2處之製品捲取滾輪x各回收實施例1中之單面覆銅積層體5。其中,實施例1所使用之裝置之加壓滾輪4均為由長度130mm、滾輪直徑150mm之碳鋼製金屬滾輪所構成。Thereafter, the electrolytic copper foil 2, the liquid crystal polymer film 1, and the aluminum foil 3 are all moved at a speed of 0.7 m/min, and between the two pressure rollers 4 each having a surface temperature of 240 ° C, with the roller between them The pressure is 40kN/m for thermocompression bonding, and after hot pressing, the laminate is cooled by natural cooling, and the aluminum foil 3 is recovered by the spacer film winding roller C', and is recovered by the product winding roller x disposed at two places. The one-sided copper clad laminate 5 of the first embodiment. The pressurizing roller 4 of the apparatus used in the first embodiment is composed of a carbon steel metal roller having a length of 130 mm and a roller diameter of 150 mm.

在上述實施例1中,熱壓合後之液晶聚合物薄膜1與鋁箔3之層間剝離係無缺陷而極順利地進行,且分別以目視觀察回收之單面覆銅積層體5之液晶聚合物薄膜面及電解銅箔面時,完全未確認到發生破裂及皺紋、表面粗糙之情形。實施例1之單面覆銅積層體5在製造過程中,在經加壓滾輪4熱壓合後到送入剝離滾輪6之前,切割前述剝離試驗片,對其測定液晶聚合物薄膜1與鋁箔3之層間剝離性之結果,確認其界面剝離之數值為無法測得之程度,可極良好地剝離。此外,從由2處回收之單面覆銅積層體5中之一方,如上述般操作而製成密接性試驗片後,評估其液晶聚合物薄膜1與電解銅箔2之密接性之結果,依3條之直線導體圖案所得之剝離強度之平均值而評估之「密接性」為良好。此外,由該3條之剝離強度中之最大值與最小值之差所求出之「密接性之不均程度」為0.03kN/m,而確認液晶聚合物薄膜1與電解銅箔2係在面內均勻地接著。其結果如表1所示。In the above-mentioned first embodiment, the interlayer peeling of the liquid-polymer polymer film 1 and the aluminum foil 3 after the thermocompression bonding was carried out extremely smoothly without any defects, and the liquid crystal polymer of the recovered single-sided copper-clad laminate 5 was visually observed. When the film surface and the electrodeposited copper foil surface were not confirmed, cracking, wrinkles, and surface roughness were not observed. In the manufacturing process, the single-sided copper-clad laminate 5 of the first embodiment is subjected to hot-pressing by the pressure roller 4 and before being fed to the peeling roller 6, the peeling test piece is cut, and the liquid crystal polymer film 1 and the aluminum foil are measured. As a result of the interlaminar peelability of 3, it was confirmed that the value of the interfacial peeling was unmeasurable, and it was excellently peeled off. In addition, one of the single-sided copper-clad laminates 5 recovered from the two was subjected to the above-described operation to form an adhesion test piece, and the adhesion between the liquid crystal polymer film 1 and the electrolytic copper foil 2 was evaluated. The "adhesiveness" evaluated based on the average of the peel strengths obtained from the three linear conductor patterns was good. In addition, the "degree of unevenness in adhesion" obtained from the difference between the maximum value and the minimum value of the peel strengths of the three strips was 0.03 kN/m, and it was confirmed that the liquid crystal polymer film 1 and the electrolytic copper foil 2 were The surface is evenly followed. The results are shown in Table 1.

(實施例2)(Example 2)

除了間隔薄膜(C)係使用厚度50μm之非熱塑性之市售之耐熱性聚醯亞胺薄膜3(Tg:340℃,表面及內面均為粗度Rz:0.9μm)以外,其餘與實施例1同樣地操作而獲得實施例2之單面覆金屬積層體。Except for the spacer film (C), a non-thermoplastic commercially available heat-resistant polyimide film 3 having a thickness of 50 μm (Tg: 340 ° C, surface and inner surface are both roughness Rz: 0.9 μm) was used. 1 A single-sided metal-clad laminate of Example 2 was obtained in the same manner.

在實施例2中,在熱壓合後之液晶聚合物薄膜1與耐熱性聚醯亞胺薄膜3之層間剝離係無缺陷而極順利地進行,以目視觀察回收之單面覆銅積層體5之表面及內面時,完全未確認到破裂及皺紋、表面粗糙之情形。另外,在使用剝離試驗片之測定中,確認其界面剝離為0.07kN/m。此外,在依密接性試驗片而進行之評估中,其「密接性」良好,「密接性之不均程度」為0.02kN/m,而確認到液晶聚合物薄膜1與電解銅箔2係在面內均勻地接著。其結果如表1所示。In the second embodiment, the interlayer peeling of the liquid crystal polymer film 1 and the heat-resistant polyimide film 3 after the thermocompression bonding was carried out extremely smoothly without any defects, and the recovered single-sided copper-clad laminate 5 was visually observed. On the surface and the inner surface, cracks, wrinkles, and rough surfaces were not confirmed at all. Further, in the measurement using the peeling test piece, it was confirmed that the interfacial peeling was 0.07 kN/m. In addition, in the evaluation based on the adhesion test piece, the "adhesiveness" was good, and the "degree of unevenness of adhesion" was 0.02 kN/m, and it was confirmed that the liquid crystal polymer film 1 and the electrolytic copper foil 2 were The surface is evenly followed. The results are shown in Table 1.

(實施例3)(Example 3)

除了間隔薄膜(C)係使用雙面覆銅積層體(新日鐵化學公司製造之ESPANEX M系列產品(MB12-25-12CEG))以外,其餘與實施例1進行同樣操作而獲得實施例3之單面覆銅積層體。該雙面覆銅積層體中,其中心具有厚度25μm之聚醯亞胺樹脂作為絕緣層,且在其兩面分別設置厚度12μm之銅箔,該銅箔之露出面之表面粗度(Rz)均為1.0μm。Example 3 was carried out in the same manner as in Example 1 except that the spacer film (C) was a double-sided copper-clad laminate (ESPANEX M series product (MB12-25-12CEG) manufactured by Nippon Steel Chemical Co., Ltd.). Single-sided copper-clad laminate. The double-sided copper-clad laminate has a polyimide film having a thickness of 25 μm as an insulating layer at its center, and a copper foil having a thickness of 12 μm is provided on both surfaces thereof, and the surface roughness (Rz) of the exposed surface of the copper foil is It is 1.0 μm.

在實施例3之製造中,在熱壓合後之液晶聚合物薄膜1與耐熱性聚醯亞胺薄膜3之層間剝離係無缺陷而極順利地進行,以目視觀察回收之單面覆銅積層體5之表面及內面時,完全未確認到破裂及皺紋、表面粗糙之情形。此外,在使用剝離試驗片之測定中,確認其界面剝離為0.04kN/m;在依據密接性試驗片而進行之評估中,其「密接性」良好,「密接性之不均程度」為0.03kN/m,而確認到單面覆銅積層體5係在面內均勻地接著。其結果如表1所示。In the production of the third embodiment, the interlayer peeling of the liquid crystal polymer film 1 and the heat-resistant polyimide film 3 after the thermocompression bonding was carried out extremely smoothly without any defects, and the recovered single-sided copper-clad laminate was visually observed. When the surface and the inner surface of the body 5 were not found, cracks, wrinkles, and rough surfaces were not observed at all. In addition, in the measurement using the peeling test piece, it was confirmed that the interface peeling was 0.04 kN/m; in the evaluation based on the adhesion test piece, the "adhesiveness" was good, and the "degree of unevenness of adhesion" was 0.03. kN/m, and it was confirmed that the single-sided copper-clad laminate 5 was uniformly followed in the plane. The results are shown in Table 1.

(比較例1)(Comparative Example 1)

除了間隔薄膜(C)係使用厚度為25μm且表面及內面具有熱塑性聚醯亞腰之複合聚醯亞胺薄膜以外,其餘與實施例1同樣地操作而獲得比較例1之單面覆銅積層體。該複合聚醯亞胺薄膜,係在約21μm之非熱塑性聚醯亞胺之兩側設置約2μm之熱塑性聚醯亞腰而成者,由熱塑性聚醯亞胺所構成之表面及內面之表面粗度(Rz)為2.3μm。A single-sided copper-clad laminate of Comparative Example 1 was obtained in the same manner as in Example 1 except that the spacer film (C) was a composite polyimide film having a thickness of 25 μm and a thermoplastic polyimide layer having a surface and an inner surface. body. The composite polyimine film is formed by setting a thermoplastic polyylide waist of about 2 μm on both sides of a non-thermoplastic polyimide of about 21 μm, and the surface and the inner surface of the thermoplastic polyimide. The thickness (Rz) was 2.3 μm.

該比較例1中,作為間隔薄膜而使用之複合聚醯亞胺薄膜並無法順利地從熱壓後之液晶聚合物薄膜1剝離,在使用剝離試驗片之測定中為0.50kN/m,確認到凝聚破壞(cohesive failure)。此外,以目視觀察回收之單面覆銅積層體5之表面及內面時,在液晶聚合物薄膜表面之整面確認到因凝聚破壞而造成之粗糙情形。另一方面,在依密接性試驗片而進行之評估中,其「密接性」雖為尚可,但「密接性之不均程度」為0.15kN/m,與實施例之結果比較,可知其單面覆銅積層體5之面內之接著性不均勻。其結果如表1所示。In the comparative example 1, the composite polyimide film used as the spacer film was not peeled off smoothly from the liquid crystal polymer film 1 after the hot pressing, and it was confirmed to be 0.50 kN/m in the measurement using the peeling test piece. Cohesive failure. Further, when the surface and the inner surface of the recovered single-sided copper-clad laminate 5 were visually observed, the roughness of the surface of the liquid crystal polymer film was confirmed to be rough due to aggregation failure. On the other hand, in the evaluation based on the adhesion test piece, although the "adhesiveness" is acceptable, the "degree of unevenness of adhesion" is 0.15 kN/m, which is compared with the results of the examples. The adhesion in the plane of the single-sided copper clad laminate 5 is uneven. The results are shown in Table 1.

(比較例2)(Comparative Example 2)

除了不使用間隔薄膜(C)以外,其餘與實施例1同樣地操作而製成比較例2之單面覆銅積層體,其中在經熱壓合並冷卻後,雖欲使單面覆銅積層體分離,但其作為絕緣性薄膜(A)而使用之液晶聚合物薄膜1彼此之間發生熱熔接,在採取剝離試驗片之測定中為0.70kN/m,確認到凝聚破壞。並且,該所得之單面覆銅積層體在以目視觀察後,在液晶聚合物薄膜之表面整面確認到因凝聚破壞而造成之粗糙情形,無法製成外觀良好之單面覆銅積層體。A single-sided copper-clad laminate of Comparative Example 2 was produced in the same manner as in Example 1 except that the spacer film (C) was not used, and the single-sided copper-clad laminate was intended to be laminated after being subjected to hot pressing and cooling. The liquid crystal polymer film 1 used as the insulating film (A) was thermally welded to each other, and was 0.70 kN/m in the measurement of the peeling test piece, and the aggregation failure was confirmed. Further, after the obtained single-sided copper-clad laminate was visually observed, the surface of the liquid crystal polymer film was roughened due to aggregation failure, and a single-sided copper-clad laminate having a good appearance could not be obtained.

(比較例3)(Comparative Example 3)

除了在一對之加壓滾輪4之間以"電解銅箔2/液晶聚合物薄膜1/鋁箔3"之順序重疊以外,其餘與實施例1同樣地操作而製成比較例3之單面覆銅積層體。The single surface of Comparative Example 3 was prepared in the same manner as in Example 1 except that the "electrolytic copper foil 2 / liquid crystal polymer film 1 / aluminum foil 3" was superposed between the pair of pressure rollers 4 in the same order. Copper laminate.

該比較例3中,雖只可獲得1個單面覆銅積層體,但熱壓合後之液晶聚合物薄膜1與鋁箔3之層間剝離係順利地進行,且在回收之單面覆銅積層體5之表面及內面完全未確認到破裂及皺紋、表面粗糙之情形。此外,在依據剝離試驗片而進行之測定中,確認界面剝離為0.01kN/m,在依據密接性試驗片而進行之評估中,「密接性」為尚可。但其「密接性之不均程度」為0.17kN/m,與實施例之結果比較,可知其面內之接著均勻性不佳。In the comparative example 3, only one single-sided copper-clad laminate was obtained, but the interlayer peeling of the liquid-polymer polymer film 1 and the aluminum foil 3 after the thermocompression bonding was smoothly performed, and the single-sided copper-clad laminate was recovered. The surface and the inner surface of the body 5 were not confirmed to have cracks, wrinkles, or rough surfaces. Further, in the measurement by the peeling test piece, it was confirmed that the interface peeling was 0.01 kN/m, and in the evaluation based on the adhesion test piece, "adhesiveness" was acceptable. However, the "degree of unevenness in adhesion" was 0.17 kN/m, and as compared with the results of the examples, it was found that the in-plane uniformity was not good.

(比較例4)(Comparative Example 4)

除了在一對之加壓滾輪4之間以”鋁箔3/電解銅箔2/液晶聚合物薄膜1/鋁箔3”之順序重疊以外,其餘與實施例1同樣地操作而製成比較例4之單面覆銅積層體。The same procedure as in Example 1 was carried out except that the "aluminum foil 3 / the electrolytic copper foil 2 / the liquid crystal polymer film 1 / the aluminum foil 3" were overlapped between the pair of pressure rollers 4, and the comparative example 4 was produced. Single-sided copper-clad laminate.

該比較例4中,與比較例3同樣地只可製成1個單面覆銅積層體,但熱壓合後之液晶聚合物薄膜1與鋁箔3之層間剝離係順利地進行,且在回收之單面覆銅積層體5之表面及內面完全未確認到破裂及皺紋、表面粗糙之情形。此外,在依據剝離試驗片而進行之測定中,確認界面剝離為0.01kN/m,在依據密接性試驗片而進行之評估中,「密接性」良好。但其「密接性之不均情形」為0.07kN/m,與實施例之結果比較,可知其面內接著之均勻性不佳。In Comparative Example 4, only one single-sided copper-clad laminate was produced in the same manner as in Comparative Example 3, but the interlayer peeling of the liquid-polymer polymer film 1 and the aluminum foil 3 after the thermocompression bonding was smoothly performed and recovered. The surface and the inner surface of the single-sided copper-clad laminate 5 were completely free from cracks, wrinkles, and rough surfaces. In the measurement by the peeling test piece, it was confirmed that the interface peeling was 0.01 kN/m, and the "adhesiveness" was good in the evaluation based on the adhesion test piece. However, the "unevenness of adhesion" was 0.07 kN/m, and as compared with the results of the examples, it was found that the uniformity in the in-plane was not good.

由以上之結果可知,若依據本發明之製造方法,即可以良好之工業生產性製造不會發生皺紋及接著強度不均,且絕緣性薄膜與金屬箔之層間密接性優良之高品質之單面覆金屬積層體。此外,本發明不受上述實施形態之限定,可作各種之變化。From the above results, according to the production method of the present invention, it is possible to produce a high-quality single-sided surface which is excellent in industrial strength and which does not cause wrinkles and subsequent unevenness, and which has excellent adhesion between the insulating film and the metal foil. Metal-clad laminate. Further, the present invention is not limited to the above embodiments, and various changes can be made.

1‧‧‧液晶聚合物薄膜(絕緣性薄膜(A))1‧‧‧Liquid polymer film (insulating film (A))

2‧‧‧電解銅箔(金屬箔(B))2‧‧‧Electrolytic copper foil (metal foil (B))

3‧‧‧鋁箔(間隔薄膜(C))3‧‧‧Aluminum foil (spacer film (C))

4‧‧‧加壓滾輪4‧‧‧Pressure roller

5‧‧‧單面覆銅積層體5‧‧‧Single-sided copper-clad laminate

6‧‧‧剝離滾輪6‧‧‧ peeling roller

7‧‧‧直線導體圖案7‧‧‧Line conductor pattern

A‧‧‧絕緣性薄膜饋出滾輪A‧‧‧Insulating film feed roller

B‧‧‧金屬箔饋出滾輪B‧‧‧metal foil feeding roller

C‧‧‧間隔薄膜饋出滾輪C‧‧‧ spacer film feed roller

C’‧‧‧間隔薄膜捲取滾輪C'‧‧‧ spacer film take-up roller

MD‧‧‧層合進行方向MD‧‧‧Layer direction

r1、r2‧‧‧一對之加壓滾輪R1, r2‧‧‧ pair of pressure rollers

x‧‧‧製品捲取滾輪x‧‧‧Product take-up roller

第1圖係說明本發明之實施形態之單面覆金屬積層體之製造裝置之側面示意圖。Fig. 1 is a side view showing a manufacturing apparatus of a single-sided metal-clad laminate according to an embodiment of the present invention.

第2圖係將加壓滾輪附近放大之示意圖。Fig. 2 is a schematic view showing the vicinity of the pressure roller.

第3圖係說明在評估絕緣性薄膜與金屬箔之密接性時所使用之試驗片之平面示意圖。Fig. 3 is a plan view showing the test piece used in the evaluation of the adhesion between the insulating film and the metal foil.

1...液晶聚合物薄膜(絕緣性薄膜(A))1. . . Liquid crystal polymer film (insulating film (A))

2...電解銅箔(金屬箔(B))2. . . Electrolytic copper foil (metal foil (B))

3...鋁箔(間隔薄膜(C))3. . . Aluminum foil (spacer film (C))

4...加壓滾輪4. . . Pressurized roller

5...單面覆銅積層體5. . . Single-sided copper-clad laminate

6...剝離滾輪6. . . Stripping roller

A...絕緣性薄膜饋出滾輪A. . . Insulating film feed roller

B...金屬箔饋出滾輪B. . . Metal foil feeding roller

C...間隔薄膜饋出滾輪C. . . Spacer film feed roller

C’...間隔薄膜捲取滾輪C’. . . Spacer film take-up roller

MD...層合進行方向MD. . . Lamination direction

r1、r2...一對之加壓滾輪R1, r2. . . Pair of pressure rollers

x...製品捲取滾輪x. . . Product take-up roller

Claims (6)

一種單面覆金屬積層體的製造方法,其係製造在具有由熱塑性樹脂所構成之接著面之絕緣性薄膜上接著有金屬箔之單面覆金屬積層體的方法,其特徵為:使用表面及內面皆為表面粗度(Rz)2.0μm以下之間隔薄膜,並在一對之加壓滾輪之間以其中一個加壓滾輪/前述金屬箔/前述絕緣性薄膜/前述間隔薄膜/前述絕緣性薄膜/前述金屬箔/另一個加壓滾輪之順序使前述絕緣性薄膜、前述金屬箔、及前述間隔薄膜重疊並熱壓合,再從前述間隔薄膜剝離而獲得2個單面覆金屬積層體。 A method for producing a single-sided metal-clad laminate, which is a method for producing a single-sided metal-clad laminate having a metal foil followed by an insulating film having a bonding surface made of a thermoplastic resin, characterized in that the surface is used and The inner surface is a spacer film having a surface roughness (Rz) of 2.0 μm or less, and one of the pressure rollers/the aforementioned metal foil/the aforementioned insulating film/the aforementioned spacer film/the aforementioned insulation between the pair of pressure rollers In the order of the film/the metal foil/the other pressure roller, the insulating film, the metal foil, and the spacer film are laminated and thermocompression-bonded, and then peeled off from the spacer film to obtain two single-sided metal-clad laminates. 如申請專利範圍第1項所述之單面覆金屬積層體的製造方法,其中,前述絕緣性薄膜係由熱塑性液晶聚合物薄膜、或在至少一面具備熱塑性樹脂層之耐熱性樹脂薄膜所構成者。 The method for producing a single-sided metal-clad laminate according to the first aspect of the invention, wherein the insulating film is composed of a thermoplastic liquid crystal polymer film or a heat-resistant resin film having a thermoplastic resin layer on at least one surface thereof. . 如申請專利範圍第1或2項所述之單面覆金屬積層體的製造方法,其中,前述間隔薄膜係由鋁箔、耐熱性樹脂薄膜、或在樹脂薄膜之表面及內面具有金屬箔之複合薄膜所構成者。 The method for producing a single-sided metal-clad laminate according to the first or second aspect, wherein the spacer film is composed of an aluminum foil, a heat-resistant resin film, or a composite of a metal foil on a surface and an inner surface of the resin film. The film is composed of. 如申請專利範圍第1或2項所述之單面覆金屬積層體的製造方法,其中,前述間隔薄膜之單面或雙面係經離型處理。 The method for producing a single-sided metal-clad laminate according to the first or second aspect of the invention, wherein the one or both sides of the spacer film are subjected to a release treatment. 如申請專利範圍第1或2項所述之單面覆金屬積層體的製造方法,其中,前述金屬箔為厚度1至100μm之銅 箔。 The method for producing a single-sided metal-clad laminate according to claim 1 or 2, wherein the metal foil is copper having a thickness of 1 to 100 μm. Foil. 如申請專利範圍第1或2項所述之單面覆金屬積層體的製造方法,其中,在熱壓合後之前述絕緣性薄膜與前述間隔薄膜之層間剝離強度為0.1kN/m以下。 The method for producing a single-sided metal-clad laminate according to the first or second aspect of the invention, wherein the interlayer insulating strength between the insulating film and the spacer film after thermocompression bonding is 0.1 kN/m or less.
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