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TWI504504B - Attached copper foil - Google Patents

Attached copper foil Download PDF

Info

Publication number
TWI504504B
TWI504504B TW102142237A TW102142237A TWI504504B TW I504504 B TWI504504 B TW I504504B TW 102142237 A TW102142237 A TW 102142237A TW 102142237 A TW102142237 A TW 102142237A TW I504504 B TWI504504 B TW I504504B
Authority
TW
Taiwan
Prior art keywords
layer
carrier
resin
copper foil
copper
Prior art date
Application number
TW102142237A
Other languages
English (en)
Chinese (zh)
Other versions
TW201434622A (zh
Inventor
Michiya Kohiki
Tomota Nagaura
Kazuhiko Sakaguchi
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2012271613A external-priority patent/JP5286443B1/ja
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of TW201434622A publication Critical patent/TW201434622A/zh
Application granted granted Critical
Publication of TWI504504B publication Critical patent/TWI504504B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW102142237A 2012-11-20 2013-11-20 Attached copper foil TWI504504B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012254793 2012-11-20
JP2012271613A JP5286443B1 (ja) 2012-11-20 2012-12-12 キャリア付き銅箔
JP2013187783 2013-09-10

Publications (2)

Publication Number Publication Date
TW201434622A TW201434622A (zh) 2014-09-16
TWI504504B true TWI504504B (zh) 2015-10-21

Family

ID=50776138

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102142237A TWI504504B (zh) 2012-11-20 2013-11-20 Attached copper foil

Country Status (6)

Country Link
JP (1) JP2015078422A (fr)
KR (4) KR102015838B1 (fr)
CN (4) CN110863221A (fr)
PH (1) PH12015501129A1 (fr)
TW (1) TWI504504B (fr)
WO (1) WO2014080959A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI687552B (zh) * 2018-02-01 2020-03-11 南韓商Ｋｃｆ科技有限公司 具有高溫尺寸穩定性和織構穩定性的電解銅箔及其製造方法

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JP5746402B2 (ja) * 2013-06-13 2015-07-08 Jx日鉱日石金属株式会社 キャリア付銅箔、銅張積層板、プリント配線板、電子機器、及び、プリント配線板の製造方法
JP2017035843A (ja) * 2015-08-11 2017-02-16 日立化成株式会社 接着層付き金属箔、これを用いた金属張積層板および多層プリント配線板
CN107926121B (zh) 2015-08-11 2021-04-30 昭和电工材料株式会社 多层印刷布线板的制造方法、带粘接层的金属箔、覆金属的层叠板、多层印刷布线板
JP6204430B2 (ja) * 2015-09-24 2017-09-27 Ｊｘ金属株式会社 金属箔、離型層付き金属箔、積層体、プリント配線板、半導体パッケージ、電子機器及びプリント配線板の製造方法
CN106544709B (zh) * 2016-11-03 2019-04-05 山东金宝电子股份有限公司 一种提高电解铜箔高温防氧化性能的表面处理工艺
CN106757245B (zh) * 2016-11-16 2019-05-21 山东金宝电子股份有限公司 一种黑化铜箔的表面处理工艺
CN106757181B (zh) * 2016-11-16 2019-04-16 山东金宝电子股份有限公司 一种超薄载体铜箔的制备方法
JP7356209B2 (ja) * 2017-03-31 2023-10-04 Ｊｘ金属株式会社 表面処理銅箔、樹脂層付き表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
WO2019131093A1 (fr) * 2017-12-26 2019-07-04 Ｊｘ金属株式会社 Feuille de cuivre pour dissipation de chaleur et élément de dissipation de chaleur
CN110079840A (zh) * 2019-04-26 2019-08-02 山东金宝电子股份有限公司 一种提高铜箔高温防氧化性能的表面处理混合添加剂
CN112226790B (zh) * 2020-10-19 2022-04-22 九江德福科技股份有限公司 一种超薄高强度电子铜箔的生产方法
TWI748769B (zh) * 2020-11-27 2021-12-01 臻鼎科技股份有限公司 高分子分散液及其製備方法、高分子複合膜及其應用
CN112792339A (zh) * 2020-12-23 2021-05-14 东莞市新饰界材料科技有限公司 钨合金薄片的制备方法
CN116745462A (zh) * 2021-03-25 2023-09-12 纳美仕有限公司 叠层体的制造方法
CN113286439A (zh) * 2021-07-22 2021-08-20 深圳市志金电子有限公司 一种内置引线电镀线路板制作方法
EP4665885A1 (fr) 2023-02-15 2025-12-24 CuNex GmbH Feuille métallique contenant du cuivre et procédé de production d'une feuille métallique contenant du cuivre
CN121398964A (zh) * 2023-07-13 2026-01-23 三井金属株式会社 粘接性层叠片、层叠体及线路板的制造方法

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TW201229322A (en) * 2010-10-06 2012-07-16 Furukawa Electric Co Ltd Copper foil and manufacturing method therefor, copper foil with carrier and manufacturing method therefor, printed circuit board, and multilayer printed circuit board
TW201243110A (en) * 2010-11-15 2012-11-01 Jx Nippon Mining & Metals Corp Electrolytic copper foil

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI687552B (zh) * 2018-02-01 2020-03-11 南韓商Ｋｃｆ科技有限公司 具有高溫尺寸穩定性和織構穩定性的電解銅箔及其製造方法

Also Published As

Publication number Publication date
KR20190025739A (ko) 2019-03-11
KR20190103452A (ko) 2019-09-04
KR20160145198A (ko) 2016-12-19
PH12015501129A1 (en) 2015-08-03
TW201434622A (zh) 2014-09-16
KR102015838B1 (ko) 2019-08-29
KR102051787B1 (ko) 2019-12-03
JP2015078422A (ja) 2015-04-23
KR20150086541A (ko) 2015-07-28
CN104812944A (zh) 2015-07-29
KR101954051B1 (ko) 2019-03-05
CN110117799A (zh) 2019-08-13
CN104812944B (zh) 2019-02-19
CN108277509A (zh) 2018-07-13
CN110863221A (zh) 2020-03-06
WO2014080959A1 (fr) 2014-05-30

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