TWI503231B - Apparatus and process for producing laminated sheet - Google Patents
Apparatus and process for producing laminated sheet Download PDFInfo
- Publication number
- TWI503231B TWI503231B TW101111295A TW101111295A TWI503231B TW I503231 B TWI503231 B TW I503231B TW 101111295 A TW101111295 A TW 101111295A TW 101111295 A TW101111295 A TW 101111295A TW I503231 B TWI503231 B TW I503231B
- Authority
- TW
- Taiwan
- Prior art keywords
- roller
- sheet
- laminated sheet
- space
- rolls
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 6
- 229920005989 resin Polymers 0.000 claims description 291
- 239000011347 resin Substances 0.000 claims description 291
- 239000000463 material Substances 0.000 claims description 172
- 239000000835 fiber Substances 0.000 claims description 123
- 239000000758 substrate Substances 0.000 claims description 117
- 238000004519 manufacturing process Methods 0.000 claims description 92
- 239000011342 resin composition Substances 0.000 claims description 35
- 230000006837 decompression Effects 0.000 claims description 30
- 230000002093 peripheral effect Effects 0.000 claims description 29
- 230000001681 protective effect Effects 0.000 claims description 24
- 238000011144 upstream manufacturing Methods 0.000 claims description 17
- 239000007787 solid Substances 0.000 claims description 13
- 230000002829 reductive effect Effects 0.000 claims description 12
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000006835 compression Effects 0.000 claims description 7
- 238000007906 compression Methods 0.000 claims description 7
- 230000007246 mechanism Effects 0.000 claims description 7
- 238000013459 approach Methods 0.000 claims description 4
- 238000001514 detection method Methods 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 3
- 238000000926 separation method Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 232
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 25
- 238000005470 impregnation Methods 0.000 description 24
- 239000003822 epoxy resin Substances 0.000 description 17
- 229920000647 polyepoxide Polymers 0.000 description 17
- 239000011521 glass Substances 0.000 description 15
- -1 polyparaphenylene Polymers 0.000 description 15
- 229910052751 metal Inorganic materials 0.000 description 13
- 239000002184 metal Substances 0.000 description 13
- 239000004065 semiconductor Substances 0.000 description 11
- 239000000203 mixture Substances 0.000 description 10
- 239000000470 constituent Substances 0.000 description 9
- 229920003986 novolac Polymers 0.000 description 7
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 5
- 229910000420 cerium oxide Inorganic materials 0.000 description 5
- 239000003365 glass fiber Substances 0.000 description 5
- 239000011256 inorganic filler Substances 0.000 description 5
- 229910003475 inorganic filler Inorganic materials 0.000 description 5
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 5
- 239000011148 porous material Substances 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 4
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 4
- 238000007654 immersion Methods 0.000 description 4
- 229920001225 polyester resin Polymers 0.000 description 4
- 239000004645 polyester resin Substances 0.000 description 4
- 239000005060 rubber Substances 0.000 description 4
- 239000003566 sealing material Substances 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 229920001973 fluoroelastomer Polymers 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000004745 nonwoven fabric Substances 0.000 description 3
- 239000000123 paper Substances 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 2
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- 229920000459 Nitrile rubber Polymers 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 2
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 229920006311 Urethane elastomer Polymers 0.000 description 2
- 239000004760 aramid Substances 0.000 description 2
- 229920003235 aromatic polyamide Polymers 0.000 description 2
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 2
- 229920005549 butyl rubber Polymers 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- XLJMAIOERFSOGZ-UHFFFAOYSA-N cyanic acid Chemical compound OC#N XLJMAIOERFSOGZ-UHFFFAOYSA-N 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 150000002466 imines Chemical class 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 125000000654 isopropylidene group Chemical group C(C)(C)=* 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 239000002655 kraft paper Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 125000001624 naphthyl group Chemical group 0.000 description 2
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920005749 polyurethane resin Polymers 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000002759 woven fabric Substances 0.000 description 2
- HMHLDAMOJGEOMQ-UHFFFAOYSA-N (1-cyanato-4-phenylcyclohexa-2,4-dien-1-yl) cyanate Chemical group C1=CC(OC#N)(OC#N)CC=C1C1=CC=CC=C1 HMHLDAMOJGEOMQ-UHFFFAOYSA-N 0.000 description 1
- OFIWROJVVHYHLQ-UHFFFAOYSA-N (7-cyanatonaphthalen-2-yl) cyanate Chemical compound C1=CC(OC#N)=CC2=CC(OC#N)=CC=C21 OFIWROJVVHYHLQ-UHFFFAOYSA-N 0.000 description 1
- HCNHNBLSNVSJTJ-UHFFFAOYSA-N 1,1-Bis(4-hydroxyphenyl)ethane Chemical compound C=1C=C(O)C=CC=1C(C)C1=CC=C(O)C=C1 HCNHNBLSNVSJTJ-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- FBJCVQANAIOLJH-UHFFFAOYSA-N 2-[5,7-bis(cyanomethoxy)naphthalen-2-yl]oxyacetonitrile Chemical compound C(#N)COC1=CC(=CC2=CC(=CC=C12)OCC#N)OCC#N FBJCVQANAIOLJH-UHFFFAOYSA-N 0.000 description 1
- MEVBAGCIOOTPLF-UHFFFAOYSA-N 2-[[5-(oxiran-2-ylmethoxy)naphthalen-2-yl]oxymethyl]oxirane Chemical compound C1OC1COC(C=C1C=CC=2)=CC=C1C=2OCC1CO1 MEVBAGCIOOTPLF-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 241000208340 Araliaceae Species 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- PXKLMJQFEQBVLD-UHFFFAOYSA-N Bisphenol F Natural products C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004709 Chlorinated polyethylene Substances 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229920000181 Ethylene propylene rubber Polymers 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- 241000668842 Lepidosaphes gloverii Species 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- PJTSDUPMCKZWRW-UHFFFAOYSA-N O(C#N)C1=CC=C(C=C1)PC1=CC=C(C=C1)OC#N Chemical compound O(C#N)C1=CC=C(C=C1)PC1=CC=C(C=C1)OC#N PJTSDUPMCKZWRW-UHFFFAOYSA-N 0.000 description 1
- DYSXSHIEICLRBN-UHFFFAOYSA-N OP(O)(=O)OC1=CC=C(OC#N)C=C1 Chemical compound OP(O)(=O)OC1=CC=C(OC#N)C=C1 DYSXSHIEICLRBN-UHFFFAOYSA-N 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- CNUHQZDDTLOZRY-UHFFFAOYSA-N [4-(4-cyanatophenyl)sulfanylphenyl] cyanate Chemical compound C1=CC(OC#N)=CC=C1SC1=CC=C(OC#N)C=C1 CNUHQZDDTLOZRY-UHFFFAOYSA-N 0.000 description 1
- AHZMUXQJTGRNHT-UHFFFAOYSA-N [4-[2-(4-cyanatophenyl)propan-2-yl]phenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1C(C)(C)C1=CC=C(OC#N)C=C1 AHZMUXQJTGRNHT-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 229920005558 epichlorohydrin rubber Polymers 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- AZDCYKCDXXPQIK-UHFFFAOYSA-N ethenoxymethylbenzene Chemical compound C=COCC1=CC=CC=C1 AZDCYKCDXXPQIK-UHFFFAOYSA-N 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- JMANVNJQNLATNU-UHFFFAOYSA-N glycolonitrile Natural products N#CC#N JMANVNJQNLATNU-UHFFFAOYSA-N 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 239000011630 iodine Substances 0.000 description 1
- 229920003049 isoprene rubber Polymers 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000012783 reinforcing fiber Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 125000003003 spiro group Chemical group 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
- B32B37/0053—Constructional details of laminating machines comprising rollers; Constructional features of the rollers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
- B29C63/02—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor using sheet or web-like material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/18—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
- B29C65/7858—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus characterised by the feeding movement of the parts to be joined
- B29C65/7888—Means for handling of moving sheets or webs
- B29C65/7894—Means for handling of moving sheets or webs of continuously moving sheets or webs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
- B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
- B29C66/112—Single lapped joints
- B29C66/1122—Single lap to lap joints, i.e. overlap joints
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/303—Particular design of joint configurations the joint involving an anchoring effect
- B29C66/3034—Particular design of joint configurations the joint involving an anchoring effect making use of additional elements, e.g. meshes
- B29C66/30341—Particular design of joint configurations the joint involving an anchoring effect making use of additional elements, e.g. meshes non-integral with the parts to be joined, e.g. making use of extra elements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
- B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
- B29C66/43—Joining a relatively small portion of the surface of said articles
- B29C66/433—Casing-in, i.e. enclosing an element between two sheets by an outlined seam
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/72—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined
- B29C66/721—Fibre-reinforced materials
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/81—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
- B29C66/816—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the mounting of the pressing elements, e.g. of the welding jaws or clamps
- B29C66/8161—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the mounting of the pressing elements, e.g. of the welding jaws or clamps said pressing elements being supported or backed-up by springs or by resilient material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/82—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps
- B29C66/824—Actuating mechanisms
- B29C66/8242—Pneumatic or hydraulic drives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/82—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps
- B29C66/826—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps without using a separate pressure application tool, e.g. the own weight of the parts to be joined
- B29C66/8266—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps without using a separate pressure application tool, e.g. the own weight of the parts to be joined using fluid pressure directly acting on the parts to be joined
- B29C66/82661—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps without using a separate pressure application tool, e.g. the own weight of the parts to be joined using fluid pressure directly acting on the parts to be joined by means of vacuum
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
- B29C66/834—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools moving with the parts to be joined
- B29C66/8341—Roller, cylinder or drum types; Band or belt types; Ball types
- B29C66/83411—Roller, cylinder or drum types
- B29C66/83413—Roller, cylinder or drum types cooperating rollers, cylinders or drums
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/18—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools
- B29C65/24—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools characterised by the means for heating the tool
- B29C65/26—Hot fluid
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/72—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined
- B29C66/721—Fibre-reinforced materials
- B29C66/7212—Fibre-reinforced materials characterised by the composition of the fibres
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/72—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined
- B29C66/721—Fibre-reinforced materials
- B29C66/7214—Fibre-reinforced materials characterised by the length of the fibres
- B29C66/72141—Fibres of continuous length
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/72—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined
- B29C66/721—Fibre-reinforced materials
- B29C66/7214—Fibre-reinforced materials characterised by the length of the fibres
- B29C66/72143—Fibres of discontinuous lengths
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/60—In a particular environment
- B32B2309/68—Vacuum
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
- B32B37/20—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of continuous webs only
- B32B37/203—One or more of the layers being plastic
- B32B37/206—Laminating a continuous layer between two continuous plastic layers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Description
本發明係關於積層片之製造裝置、積層片之製造方法。The present invention relates to a manufacturing apparatus of a laminated sheet and a method of manufacturing a laminated sheet.
近年來,欲使電子零件/電子機器等小型化/薄膜化,而要求將其所使用之電路基板等小型化/薄膜化。為了回應此要求,係使用多層構造之電路基板,並減薄其之各層。In recent years, in order to reduce the size and thickness of electronic components and electronic devices, it is required to reduce the size and thickness of circuit boards used. In response to this requirement, a multi-layered circuit substrate is used and the layers thereof are thinned.
多層構造之電路基板,係使用例如在纖維基材之兩面,配置樹脂組成物片材(樹脂層)使其層合接黏的片材(例如參照專利文獻1)。In the circuit board of the multilayer structure, for example, a sheet in which a resin composition sheet (resin layer) is laminated and adhered on both surfaces of the fiber base material is used (for example, see Patent Document 1).
該片材係藉由於纖維基材之兩面,重疊B階段樹脂組成物片材,對該積層體進行加壓而製造。This sheet is produced by superposing a B-stage resin composition sheet on both sides of a fibrous base material and pressurizing the laminated body.
(專利文獻1)日本專利特開2003-340952號公報(Patent Document 1) Japanese Patent Laid-Open Publication No. 2003-340952
然而,此種製造方法中,有對樹脂層之纖維基材之壓黏不足的可能性,其結果有樹脂層由纖維基材發生剝離之虞。However, in such a production method, there is a possibility that the pressure of the fiber base material of the resin layer is insufficient, and as a result, the resin layer is peeled off from the fiber base material.
尚且,此種課題不僅止於將纖維基材與樹脂層積層的情況,即使在將樹脂層彼此積層的情況、將含有纖維基材之預浸體彼此積層的情況下亦會發生。Further, such a problem is not limited to the case where the fiber base material and the resin layer are laminated, and even when the resin layers are laminated to each other, and the prepreg containing the fiber base material is laminated to each other.
本發明即有鑑於此種課題而產生者。The present invention has been made in view of such problems.
亦即,根據本發明,提供一種積層片之製造裝置,係將具有樹脂層之片材接合於薄板狀之基材之單面或兩面以製造 積層片者;其具有:外周面彼此互相抵接合,並送出上述基材的一對之第1輥;外周面彼此互相抵接合,並送出由上述第1輥所送出之上述基材的一對之第2輥;配置於上述第1輥之基材搬送方向下游側,並配置於上述第2輥之基材搬送方向上游側,且分別配置於由上述一對之第1輥所送出之上述基材的表面側及背面側的第3輥;與對由上述一對之第1輥、上述一對之第2輥、上述第3輥所包圍之空間內進行減壓的減壓手段;上述一對之第1輥係將上述基材送出至上述空間內的輥,於上述基材之表面側或背面側,由一方之上述第3輥與一方之上述第2輥之間,朝上述空間內送出上述片材;上述第2輥係對上述基材與上述片材之上述樹脂層進行壓黏,並將含有上述基材及上述片材之積層片送出至上述空間之外部的輥。That is, according to the present invention, there is provided a manufacturing apparatus for a laminated sheet which is obtained by joining a sheet having a resin layer to one side or both sides of a thin plate-shaped substrate. a laminated sheet; the pair of first rolls that are joined to each other by the outer peripheral surface and the outer peripheral surface; and the outer peripheral surfaces are mutually abutted to each other, and the pair of the substrates fed by the first roll are fed out The second roller is disposed on the downstream side of the first roller in the substrate transfer direction, and is disposed on the upstream side of the second roller in the substrate transfer direction, and is disposed on the first roller that is fed by the pair of first rollers a third roller on the front side and the back side of the substrate; and a decompression means for decompressing a space surrounded by the pair of first rolls, the pair of second rolls, and the third roll; a pair of first rolls that feed the substrate into the space, and between the one of the third rolls and the one of the second rolls on the front side or the back side of the substrate, facing the space The sheet is fed inwardly, and the second roller is formed by press-bonding the base material and the resin layer of the sheet, and conveying the laminated sheet containing the base material and the sheet to a roller outside the space.
於此,所謂輥之外周面彼此抵接合,並不限於輥彼此直接接觸的情形,亦包含經由基材等而接觸的情形。Here, the outer peripheral surfaces of the rolls are in contact with each other, and are not limited to the case where the rolls are in direct contact with each other, and may be in contact with each other via a substrate or the like.
根據此發明,可藉由減壓手段,對由一對之第1輥、上述一對之第2輥、上述第3輥所包圍之空間內進行減壓。According to the invention, the space in the space surrounded by the pair of first rolls, the pair of second rolls, and the third rolls can be depressurized by the pressure reducing means.
於上述空間內係供給基材及片材,藉由減壓手段,使上述空間內進行減壓而使基材及片材壓黏。由於經壓黏之基材及片材於第2輥之間進一步被壓黏,故基材、片材被強固地壓黏,而於基材、片材間不易發生剝離。The substrate and the sheet are supplied in the space, and the space is decompressed by a pressure reducing means to pressurize the substrate and the sheet. Since the pressure-bonded base material and the sheet are further pressure-bonded between the second rolls, the base material and the sheet are strongly pressed, and peeling is less likely to occur between the base material and the sheet.
再者,根據本發明,亦可提供使用上述製造裝置的積層片之製造方法。Furthermore, according to the present invention, a method of manufacturing a laminated sheet using the above-described manufacturing apparatus can also be provided.
根據本發明,提供可確實進行構成積層片之基材與樹脂層間之接合的積層片之製造裝置及積層片之製造方法。According to the present invention, there is provided a manufacturing apparatus and a method of producing a laminated sheet which can reliably perform bonding of a substrate constituting a laminated sheet and a resin layer.
以下,根據圖式說明本發明之實施形態。又,所有圖式中,對相同之構成要件係註記同一符號,其詳細說明則不重複而適當省略。Hereinafter, embodiments of the present invention will be described based on the drawings. In the drawings, the same components are denoted by the same reference numerals, and the detailed description is omitted as appropriate.
圖1係顯示本發明之積層片製造裝置之第1實施形態的概略剖面側面圖,圖2係圖1中之A-A線剖面圖,圖3係圖1中之B-B線剖面圖,圖4係圖1中之由一點鏈線所包圍區域[C]的擴大圖,圖5為圖1中之由一點鏈線所包圍區域[C]之積層片的D-D線剖面圖。圖10為顯示本發明積層片的剖面圖,圖11為顯示使用圖10所示積層片所製造之基板的剖面圖,圖12為顯示使用圖11所示基板所製造之半導體裝置的剖面圖。又,以下說明中,以圖中上側作為「上」或「上方」、以下側作為「下」或「下方」進行說明。又,圖10~圖12係將厚度方向(圖中之上下方向)誇張擴大表示。1 is a schematic cross-sectional side view showing a first embodiment of the laminated sheet manufacturing apparatus of the present invention, FIG. 2 is a cross-sectional view taken along line AA of FIG. 1, and FIG. 3 is a cross-sectional view taken along line BB of FIG. An enlarged view of a region [C] surrounded by a single chain line in Fig. 1, and Fig. 5 is a DD line sectional view of a laminated sheet of a region [C] surrounded by a one-point chain line in Fig. 1. Fig. 10 is a cross-sectional view showing a laminated sheet of the present invention, Fig. 11 is a cross-sectional view showing a substrate produced by using the laminated sheet shown in Fig. 10, and Fig. 12 is a cross-sectional view showing a semiconductor device manufactured using the substrate shown in Fig. 11. In the following description, the upper side of the drawing is referred to as "upper" or "upper", and the lower side is referred to as "lower" or "lower". 10 to 12 are exaggerated and enlarged in the thickness direction (upward and downward directions in the drawing).
圖1所示之積層片製造裝置30,係製造圖10所示構成之積層片40的裝置。The laminated sheet manufacturing apparatus 30 shown in Fig. 1 is an apparatus for manufacturing the laminated sheet 40 of the configuration shown in Fig. 10.
首先,針對積層片40,參照圖10進行說明。又,若將積層片40於其長度方向之途中切斷為既定尺寸,則得到預浸體1。First, the laminated sheet 40 will be described with reference to FIG. Moreover, when the laminated sheet 40 is cut into a predetermined size in the longitudinal direction, the prepreg 1 is obtained.
圖10所示之積層片40,係其全體形狀呈帶狀(長尺狀),具有:薄板狀(平板狀)之纖維基材(基材)2;位於纖維基材2之一面(上面)側,由固形或半固形之第1樹脂組成物所構成的第1樹脂層(樹脂層)3;位於纖維基材2之另一面(下面)側,由固形或半固形之第2樹脂組成物所構成的第2樹脂層(樹脂層)4。各樹脂層3、4為B-階段狀態。該積層片40係被切斷為既定尺寸而使用。The laminated sheet 40 shown in Fig. 10 has a strip shape (long scale shape) as a whole, and has a thin plate-like (flat-plate) fibrous base material (substrate) 2; one surface (upper surface) of the fibrous base material 2 a first resin layer (resin layer) 3 composed of a solid or semi-solid first resin composition, and a second resin composition which is solid or semi-solid on the other surface (lower surface) side of the fiber substrate 2 The second resin layer (resin layer) 4 is formed. Each of the resin layers 3 and 4 is in a B-stage state. The laminated sheet 40 is cut into a predetermined size and used.
纖維基材2具有提升積層片40之機械強度的機能。The fibrous base material 2 has a function of enhancing the mechanical strength of the laminated sheet 40.
作為纖維基材2,可舉例如玻璃織布、玻璃不織布等之玻璃纖維基材,以包括聚醯胺樹脂纖維、芳香族聚醯胺樹脂纖維或全芳香族聚醯胺樹脂纖維等之芳醯胺纖維等之聚醯胺系樹脂纖維,聚酯樹脂纖維、芳香族聚酯樹脂纖維、全芳香族聚酯樹脂纖維等之聚酯系樹脂纖維,聚醯亞胺樹脂纖維、聚對伸苯基苯并雙唑、氟樹脂纖維等作為主成分之織布或不織布所構成的合成纖維基材,以牛皮紙、棉絨紙、棉絨與牛皮紙漿之混抄紙等作為主成分的紙纖維基材等之有機纖維基材等的纖維基材等。The fiber base material 2 may, for example, be a glass fiber base material such as a glass woven fabric or a glass nonwoven fabric, and may include a polyamide resin fiber, an aromatic polyamide resin fiber, or a wholly aromatic polyamide resin fiber. Polyurethane resin fiber such as amine fiber, polyester resin fiber such as polyester resin fiber, aromatic polyester resin fiber or wholly aromatic polyester resin fiber, polyimine resin fiber, polyparaphenylene Benzobis a synthetic fiber base material composed of a woven fabric or a non-woven fabric as a main component such as an azole or a fluororesin fiber, and an organic fiber such as a paper fiber base material containing kraft paper, cotton wool paper, mixed paper of cotton velvet and kraft pulp, or the like as a main component A fibrous substrate or the like of a substrate or the like.
尚且,纖維基材可使用上述纖維之任一種,亦可使用2種以上。In addition, any of the above fibers may be used as the fiber base material, and two or more types may be used.
此等之中,纖維基材2較佳為玻璃纖維基材。藉由使用此種玻璃纖維基材,可更加提升切斷積層片40所得預浸體1的機械強度。又,亦有可使預浸體1之熱膨脹係數減小的效果。Among these, the fibrous base material 2 is preferably a glass fiber base material. By using such a glass fiber base material, the mechanical strength of the prepreg 1 obtained by cutting the laminated sheet 40 can be further enhanced. Further, there is an effect that the coefficient of thermal expansion of the prepreg 1 can be reduced.
作為構成此種玻璃纖維基材之玻璃,可舉例如E玻璃、C玻璃、A玻璃、S玻璃、D玻璃、NE玻璃、T玻璃、H玻璃、石英玻璃等。此等之中,玻璃較佳為S玻璃、石英玻璃或T玻璃。藉此,可相較地減小玻璃纖維基材之熱膨脹係數,因此可儘可能地減小積層片40的熱膨脹係數。Examples of the glass constituting the glass fiber substrate include E glass, C glass, A glass, S glass, D glass, NE glass, T glass, H glass, and quartz glass. Among these, the glass is preferably S glass, quartz glass or T glass. Thereby, the coefficient of thermal expansion of the glass fiber substrate can be relatively reduced, so that the coefficient of thermal expansion of the laminated sheet 40 can be reduced as much as possible.
纖維基材2之平均厚度T並無特別限定,較佳為150μm以下、更佳100μm以下、再更佳10~50μm左右。藉由使用此種厚度的纖維基材2,則可確保預浸體1(積層片40)之機械強度,達到其薄型化。進而亦可提升預浸體1之加工性。The average thickness T of the fiber base material 2 is not particularly limited, but is preferably 150 μm or less, more preferably 100 μm or less, still more preferably about 10 to 50 μm. By using the fiber base material 2 having such a thickness, the mechanical strength of the prepreg 1 (the laminated sheet 40) can be ensured and the thickness thereof can be reduced. Further, the workability of the prepreg 1 can be improved.
於該纖維基材2之一面側,設置第1樹脂層3,又,於另一面側設置第2樹脂層4。又,第1樹脂層3係由第1樹脂組成物所構成,另一方面,第2樹脂層4係由第2樹脂組成物所構成。第1樹脂組成物與第2樹脂組成物可為相同組成物,亦可為相異。本實施形態中設為相同組成物。The first resin layer 3 is provided on one surface side of the fiber base material 2, and the second resin layer 4 is provided on the other surface side. Further, the first resin layer 3 is composed of a first resin composition, and the second resin layer 4 is composed of a second resin composition. The first resin composition and the second resin composition may be the same composition or may be different. In the present embodiment, the same composition is used.
如圖10所示,本實施形態中係於纖維基材2之厚度方向之一部分含浸第1樹脂組成物(第1樹脂層3)(以下將此部分稱為「第1含浸部31」),於纖維基材2之未含浸第1樹脂組成物的殘餘部分,含浸第2樹脂組成物(第2樹脂層4)(以 下將此部分稱為「第2含浸部41」)。藉此,使第1樹脂層3之一部分的第1含浸部31與第2樹脂層4之一部分的第2含浸部41位於纖維基材2內。而且,於纖維基材2內,使第1含浸部31(第1樹脂層3之下面)與第2含浸部41(第2樹脂層4之上面)接觸。換言之,第1樹脂組成物係由纖維基材2之上面側含浸至纖維基材2中,第2樹脂組成物係由纖維基材2之下面側含浸至纖維基材2,藉此等樹脂組成物填充纖維基材2內的空隙。As shown in FIG. 10, in the present embodiment, the first resin composition (first resin layer 3) is impregnated in one of the thickness directions of the fiber base material 2 (hereinafter referred to as "the first impregnation portion 31"). The second resin composition (second resin layer 4) is impregnated into the remaining portion of the fibrous base material 2 which is not impregnated with the first resin composition ( This portion is referred to as "the second impregnation portion 41"). Thereby, the first impregnation portion 31 of one of the first resin layers 3 and the second impregnation portion 41 of one of the second resin layers 4 are placed in the fiber base material 2. In the fiber base material 2, the first impregnation portion 31 (the lower surface of the first resin layer 3) is brought into contact with the second impregnation portion 41 (the upper surface of the second resin layer 4). In other words, the first resin composition is impregnated into the fibrous base material 2 from the upper surface side of the fibrous base material 2, and the second resin composition is impregnated into the fibrous base material 2 from the lower surface side of the fibrous base material 2, thereby forming a resin composition. The material fills the voids in the fibrous substrate 2.
本實施形態中,第1含浸部31之厚度與第2含浸部41之厚度相等。In the present embodiment, the thickness of the first impregnation portion 31 is equal to the thickness of the second impregnation portion 41.
再者,第1樹脂層3之第1含浸部31除外的部分(第1非含浸部32)的厚度、與第2樹脂層4之第2含浸部41除外的部分(第2非含浸部42)的厚度相等。第1非含浸部32之厚度、第2非含浸部42之厚度為例如2~20μm。又,第1含浸部31之厚度與第2含浸部41的厚度亦可為相異,又,第1非含浸部32之厚度與第2非含浸部42之厚度亦可為相異。又,符號20係概略地表示含浸部31、41間之邊界。In addition, the thickness of the portion (the first non-impregnated portion 32) excluding the first impregnation portion 31 of the first resin layer 3 and the portion excluding the second impregnation portion 41 of the second resin layer 4 (the second non-impregnation portion 42) ) the thickness is equal. The thickness of the first non-impregnated portion 32 and the thickness of the second non-impregnated portion 42 are, for example, 2 to 20 μm. Further, the thickness of the first impregnation portion 31 and the thickness of the second impregnation portion 41 may be different, and the thickness of the first non-impregnation portion 32 and the thickness of the second non-impregnation portion 42 may be different. Further, reference numeral 20 schematically shows the boundary between the impregnation portions 31 and 41.
如圖1所示,第1樹脂層3係作為薄板狀之第1支撐體(片材)5a,供給至積層片製造裝置30。該片材5a具備第1樹脂層3、支撐該樹脂層3之未圖示的支撐基材、與保護第1樹脂層3的保護片材51。支撐基材係挾持第1樹脂層3而設於保護片材51的相反側。因此,圖1中雖未圖示,但在第 2輥72a係經由支撐基材而接觸著第1樹脂層3。As shown in FIG. 1 , the first resin layer 3 is supplied to the laminated sheet manufacturing apparatus 30 as a first support (sheet) 5 a in the form of a thin plate. The sheet 5a includes a first resin layer 3, a support substrate (not shown) that supports the resin layer 3, and a protective sheet 51 that protects the first resin layer 3. The support substrate is placed on the opposite side of the protective sheet 51 while holding the first resin layer 3 . Therefore, although not shown in Figure 1, it is in the first The 2 roller 72a contacts the first resin layer 3 via the support substrate.
同樣地,第2樹脂層4係作為薄板狀之第2支撐體(片材)5b,供給至積層片製造裝置30。該片材5b具備第2樹脂層4、支撐該樹脂層4之未圖示的支撐基材、與保護第2樹脂層4的保護片材51。支撐基材係挾持第2樹脂層4而設於保護片材51的相反側。因此,圖1中雖未圖示,但在第2輥72b係經由支撐基材而接觸著第2樹脂層4。In the same manner, the second resin layer 4 is supplied to the laminated sheet manufacturing apparatus 30 as a second support (sheet) 5b having a thin plate shape. The sheet 5b includes a second resin layer 4, a support substrate (not shown) that supports the resin layer 4, and a protective sheet 51 that protects the second resin layer 4. The support substrate is placed on the opposite side of the protective sheet 51 while holding the second resin layer 4 . Therefore, although not shown in FIG. 1, the second roller 72b contacts the second resin layer 4 via the support substrate.
保護片材51,較佳為例如樹脂薄膜。作為構成樹脂薄膜之樹脂材料,可舉例如氟系樹脂、聚醯亞胺、聚對苯二甲酸丁二酯、聚對苯二甲酸乙二酯等之聚酯、聚乙烯等。而且,作為構成樹脂薄膜之樹脂材料,此等之中,由耐熱性優越、廉價而言,較佳為聚對苯二甲酸乙二酯、聚乙烯。又,樹脂薄膜較佳係於樹脂薄膜之樹脂層側之面實施了可剝離之處理者。藉此,可如後述般使保護片材51與樹脂層容易分離。The protective sheet 51 is preferably, for example, a resin film. The resin material constituting the resin film may, for example, be a polyester such as a fluorine resin, a polyimide, a polybutylene terephthalate or a polyethylene terephthalate, or a polyethylene. Further, among the resin materials constituting the resin film, among these, polyethylene terephthalate or polyethylene is preferred because of its excellent heat resistance and low cost. Moreover, it is preferable that the resin film is subjected to a peelable treatment on the side of the resin layer side of the resin film. Thereby, the protective sheet 51 and the resin layer can be easily separated as will be described later.
作為支撐基材,可使用與保護片材51相同之物。As the support substrate, the same thing as the protective sheet 51 can be used.
保護片材51或支撐基材之平均厚度並無特別限定,較佳為8~70μm左右、更佳12~40μm左右。The average thickness of the protective sheet 51 or the support substrate is not particularly limited, but is preferably about 8 to 70 μm, more preferably about 12 to 40 μm.
第1樹脂組成物及第2樹脂組成物較佳係設為如下述組成。It is preferable that the first resin composition and the second resin composition have the following composition.
各樹脂組成物係例如含有硬化性樹脂,視需要含有硬化助劑(例如硬化劑、硬化促進劑等)及無機填充材中之至少1種而構成。Each of the resin compositions contains, for example, a curable resin, and optionally contains at least one of a curing aid (for example, a curing agent, a curing accelerator, and the like) and an inorganic filler.
作為硬化性樹脂,可舉例如脲(尿素)樹脂、三聚氰胺樹脂、馬來醯亞胺化合物、聚胺基甲酸酯樹脂、不飽和聚酯樹脂、具有苯并環之樹脂、雙烯丙基納特醯亞胺化合物、乙烯基苄基樹脂、乙烯基苄基醚樹脂、苯并環丁烯樹脂、氰酸酯樹脂、環氧樹脂等之熱硬化性樹脂、紫外線硬化性樹脂、厭氣硬化性樹脂等。此等之中,硬化性樹脂較佳係玻璃轉移溫度為200℃以上的組合。例如,較佳係使用含有螺環、雜環式、三羥甲基型、聯苯型、萘基、蒽型、酚醛清漆型之2或3官能以上的環氧樹脂、氰酸酯樹脂(包括氰酸酯樹脂之預聚物)、馬來醯亞胺化合物、苯并環丁烯樹脂、具有苯并環之樹脂。Examples of the curable resin include urea (urea) resin, melamine resin, maleic imine compound, polyurethane resin, unsaturated polyester resin, and benzoic acid. a thermosetting resin such as a ring resin, a bisallyl nalenimine compound, a vinyl benzyl resin, a vinyl benzyl ether resin, a benzocyclobutene resin, a cyanate resin, or an epoxy resin; An ultraviolet curable resin, an anaerobic resin, or the like. Among these, the curable resin is preferably a combination in which the glass transition temperature is 200 ° C or higher. For example, it is preferred to use an epoxy resin or a cyanate resin containing a spiro ring, a heterocyclic formula, a trimethylol type, a biphenyl type, a naphthyl group, a fluorene type, a novolac type, or a cyanate resin (including Prepolymer of cyanate resin), maleic imine compound, benzocyclobutene resin, with benzoic acid Ring resin.
上述硬化性樹脂中,藉由使用熱硬化性樹脂,進而在製作了後述基板10(參照圖11)後,於硬化後之樹脂層3、4中增加交聯密度,則可達到硬化後之樹脂層3、4(所得基板)的耐熱性之提升。In the above-mentioned curable resin, by using a thermosetting resin, after the substrate 10 (see FIG. 11) to be described later is produced, and the crosslinking density is increased in the resin layers 3 and 4 after curing, the cured resin can be obtained. The heat resistance of the layers 3, 4 (the resulting substrate) is improved.
藉由併用上述熱硬化性樹脂與填充材,可減小預浸體1之熱膨脹係數(以下亦稱為「低熱膨脹化」)。再者,亦可達到預浸體1之電氣特性(低介電係數、低介電損耗正切)等之提升。作為上述環氧樹脂,可舉例如酚酚醛清漆型環氧樹脂、雙酚型環氧樹脂、萘型環氧樹脂、蒽型環氧樹脂、芳基伸烷基型環氧樹脂等。By using the thermosetting resin and the filler in combination, the thermal expansion coefficient of the prepreg 1 (hereinafter also referred to as "low thermal expansion") can be reduced. Furthermore, the electrical characteristics (low dielectric constant, low dielectric loss tangent) of the prepreg 1 can be improved. Examples of the epoxy resin include a phenol novolak type epoxy resin, a bisphenol type epoxy resin, a naphthalene type epoxy resin, a fluorene type epoxy resin, and an aryl alkylene type epoxy resin.
此等之中,環氧樹脂較佳為萘型、芳基伸烷基型環氧樹 脂。藉由使用萘基、芳基伸烷基型環氧樹脂,於硬化後之樹脂層3、4(所得基板)中,可提升吸濕焊錫耐熱性(吸濕後之焊錫耐熱性)及難燃性。作為萘型環氧樹脂,可舉例如DIC(股)製之HP-4700、HP-4770、HP-4032D、HP-5000、HP-6000、日本化藥(股)製之NC-7300L、新日鐵化學(股)製之ESN-375等。作為芳基伸烷基型環氧樹脂,可舉例如日本化藥(股)製之NC-3000、NC-3000L、NC-3000-FH、日本化藥(股)製NC-7300L、新日鐵化學(股)製之ESN-375等。所謂芳基伸烷基型環氧樹脂,係指於重複單體中含有一個以上之芳香族基與亞甲基等之伸烷基之組合的環氧樹脂,其耐熱性、難燃性及機械強度優越。又,在對應於無鹵素之佈線板方面,較佳係使用實質上不含鹵素的環氧樹脂。Among these, the epoxy resin is preferably a naphthalene type or an arylalkyl group-type epoxy tree. fat. By using a naphthyl group or an arylalkylene type epoxy resin, the heat-resistant solder heat resistance (solder heat resistance after moisture absorption) and flame retardancy can be improved in the cured resin layers 3 and 4 (the obtained substrate). . Examples of the naphthalene type epoxy resin include HP-4700, HP-4770, HP-4032D, HP-5000, HP-6000, and Nippon Chemical Co., Ltd., NC-7300L, manufactured by DIC Co., Ltd. ECN-375, etc. made by Iron Chemical Co., Ltd. Examples of the arylalkylene-based epoxy resin include NC-3000, NC-3000L, NC-3000-FH, Nippon Chemical Co., Ltd., NC-7300L, and Nippon Steel Chemical Co., Ltd., manufactured by Nippon Kayaku Co., Ltd. (share) system ESN-375 and so on. The term "aryl extended alkyl type epoxy resin" refers to an epoxy resin which contains a combination of one or more aromatic groups and an alkylene group such as a methylene group in a repeating monomer, and has heat resistance, flame retardancy and mechanical strength. superior. Further, in terms of a halogen-free wiring board, it is preferred to use an epoxy resin which does not substantially contain a halogen.
上述氰酸酯樹脂例如可藉由使鹵化氰化合物與酚類或萘酚類反應,視需要依加熱等方法進行預聚物化而獲得。又,亦可使用如此調製之市售物。The cyanate resin can be obtained, for example, by reacting a halogenated cyanide compound with a phenol or a naphthol, and if necessary, prepolymerizing by a method such as heating. Further, a commercially available product thus prepared can also be used.
上述氰酸酯樹脂可舉例如酚醛清漆型氰酸酯樹脂、雙酚A型氰酸酯樹脂、雙酚E型氰酸酯樹脂、四甲基雙酚F型氰酸酯樹脂等之雙酚型氰酸酯樹脂及萘酚芳烷基型氰酸酯樹脂等。The cyanate resin may, for example, be a bisphenol type such as a novolak type cyanate resin, a bisphenol A type cyanate resin, a bisphenol E type cyanate resin, or a tetramethyl bisphenol F type cyanate resin. Cyanate resin, naphthol aralkyl type cyanate resin, and the like.
另外,上述氰酸酯樹脂較佳係於分子內具有2個以上氰酸酯基(-O-CN)。可舉例如2,2’-雙(4-氰氧基苯基)亞異丙基、1,1’-雙(4-氰氧基苯基)乙烷、雙(4-氰氧基-3,5-二甲基苯基) 甲烷、1,3-雙(4-氰氧基苯基-1-(1-甲基亞乙基))苯、雙(4-氰氧基苯基)硫醚、雙(4-氰氧基苯基)醚、1,1,1-參(4-氰氧基苯基)乙烷、參(4-氰氧基苯基)亞磷酸、雙(4-氰氧基苯基)碸、2,2-雙(4-氰氧基苯基)丙烷、1,3-、1,4-、1,6-、1,8-、2,6-或2,7-二氰氧基萘、1,3,6-三氰氧基萘、4,4-二氰氧基聯苯,及酚酚醛清漆型、甲酚酚醛清漆型、二環戊二烯型等之多元酚類與鹵化氰間之反應所得的氰酸酯樹脂,萘酚芳烷基型之多元萘酚類與鹵化氰間之反應所得的氰酸酯樹脂等。此等之中,酚酚醛清漆型氰酸酯樹脂係難燃性及低熱膨脹性優越,2,2-雙(4-氰氧基苯基)亞異丙基及二環戊二烯型氰酸酯樹脂係交聯密度之控制及耐濕可靠性優越。尤其是酚酚醛清漆型氰酸酯樹脂係由低熱膨脹性的觀點而言為較佳。又,亦可進一步併用1種或2種以上之其他氰酸酯樹脂,並無特別限定。Further, the cyanate resin preferably has two or more cyanate groups (-O-CN) in the molecule. For example, 2,2'-bis(4-cyanooxyphenyl)isopropylidene, 1,1'-bis(4-cyanooxyphenyl)ethane, bis(4-cyanooxy-3) ,5-dimethylphenyl) Methane, 1,3-bis(4-cyanooxyphenyl-1-(1-methylethylidene))benzene, bis(4-cyanooxyphenyl) sulfide, bis(4-cyanooxy) Phenyl)ether, 1,1,1-gin(4-cyanooxyphenyl)ethane, ginseng (4-cyanooxyphenyl)phosphoric acid, bis(4-cyanooxyphenyl)phosphonium, 2 , 2-bis(4-cyanooxyphenyl)propane, 1,3-, 1,4-, 1,6-, 1,8-, 2,6- or 2,7-dicyanooxynaphthalene, 1,3,6-Tricyanomethoxynaphthalene, 4,4-dicyanooxybiphenyl, and phenol novolac type, cresol novolac type, dicyclopentadiene type, and the like The cyanate resin obtained by the reaction, the cyanate resin obtained by the reaction between the naphthol aralkyl type polyhydric naphthol and the cyanogen halide. Among these, the phenol novolac type cyanate resin is excellent in flame retardancy and low thermal expansion property, and 2,2-bis(4-cyanooxyphenyl)isopropylidene and dicyclopentadiene type cyanic acid. The ester resin is excellent in control of crosslinking density and moisture resistance reliability. In particular, the phenol novolac type cyanate resin is preferred from the viewpoint of low thermal expansion. Further, one or two or more kinds of other cyanate resins may be further used in combination, and are not particularly limited.
上述氰酸酯樹脂可單獨使用,亦可併用重量平均分子量不同之氰酸酯樹脂,或可併用上述氰酸酯樹脂與其預聚物。The cyanate resin may be used singly or as a cyanate resin having a different weight average molecular weight, or the above cyanate resin and its prepolymer may be used in combination.
藉由使用此等氰酸酯樹脂,可有效表現耐熱性及難燃性。By using such cyanate resins, heat resistance and flame retardancy can be effectively exhibited.
另外,上述硬化性樹脂亦可合併使用2種以上。例如,於使用上述環氧樹脂作為硬化性樹脂時,在更加提升難燃性方面,可併用上述氰酸酯樹脂,又,在更加提升耐熱性方面,可併用上述馬來醯亞胺化合物。再者,於使用上述氰酸酯樹脂作為硬化性樹脂時,在更加提升耐熱性或難燃性等方面,可併用上述環氧樹脂。Further, the curable resin may be used in combination of two or more kinds. For example, when the epoxy resin is used as the curable resin, the cyanate resin can be used in combination for further improving the flame retardancy, and the maleidene compound can be used in combination for further improving the heat resistance. Further, when the cyanate resin is used as the curable resin, the above epoxy resin can be used in combination for further improving heat resistance, flame retardancy and the like.
硬化性樹脂之含量並無特別限定,較佳係樹脂組成物整體之5~70質量%、更佳10~50質量%。若硬化性樹脂之含量未滿上述下限值,則視硬化性樹脂之種類等,有樹脂組成物之清漆黏度過低、難以形成預浸體1的情形。另一方面,若硬化性樹脂之含量超過上述上限值,則因其他成分之量過少,視硬化性樹脂之種類等而有預浸體1之機械強度降低的情形。The content of the curable resin is not particularly limited, but is preferably 5 to 70% by mass, more preferably 10 to 50% by mass based on the entire resin composition. When the content of the curable resin is less than the above-mentioned lower limit, depending on the type of the curable resin, etc., the varnish viscosity of the resin composition is too low, and it is difficult to form the prepreg 1. On the other hand, when the content of the curable resin is more than the above-described upper limit, the amount of the other components is too small, and the mechanical strength of the prepreg 1 may be lowered depending on the type of the curable resin or the like.
另外,樹脂組成物較佳係含有無機填充材。藉由,即使使預浸體1薄型化(例如厚度35μm以下),仍可得到機械強度優越的基板10。再者,亦可提升基板10之低熱膨脹化。Further, the resin composition preferably contains an inorganic filler. By making the prepreg 1 thin (for example, having a thickness of 35 μm or less), the substrate 10 having excellent mechanical strength can be obtained. Furthermore, the low thermal expansion of the substrate 10 can also be improved.
作為無機填充材,可舉例如滑石、氧化鋁、玻璃、熔融二氧化矽等之二氧化矽、雲母、氫氧化鋁、氫氧化鎂等。又,配合無機填充材之使用目的,適當選擇破碎狀、球狀者。此等之中,由低熱膨脹性優越的觀點而言,無機填充材較佳為二氧化矽,更佳為熔融二氧化矽(尤其是球狀熔融二氧化矽)。Examples of the inorganic filler include cerium oxide such as talc, alumina, glass, and molten cerium oxide, mica, aluminum hydroxide, and magnesium hydroxide. Further, in accordance with the purpose of use of the inorganic filler, a crushed or spherical shape is appropriately selected. Among these, the inorganic filler is preferably cerium oxide, and more preferably molten cerium oxide (especially spherical molten cerium oxide) from the viewpoint of superior low thermal expansion property.
另外,樹脂組成物係除了上述說明之成分以外,在不阻礙本發明效果的範圍內,視需要可調配其他成分。作為其他成分,可舉例如ORBEN、BENTONE等之增黏劑,聚矽氧系、氟系、高分子系之消泡劑或均平劑,偶合劑等之密黏性賦予劑,難燃劑,酞菁/藍、酞菁/綠、碘/綠、二偶氮黃(Disazo Yellow)、碳黑、蒽醌類等之著色劑等。Further, in addition to the components described above, the resin composition may be blended with other components as needed within the range not inhibiting the effects of the present invention. Examples of the other component include a tackifier such as ORBEN or BENTONE, a polysulfonium-based, a fluorine-based, a polymer-based antifoaming agent or a leveling agent, a tackifier such as a coupling agent, and a flame retardant. A coloring agent such as phthalocyanine/blue, phthalocyanine/green, iodine/green, disazo yellow, carbon black, anthraquinone, and the like.
接著,針對積層片40之製造中所使用之積層片製造裝置30、亦即本發明之積層片製造方法之實施形態中所使用的積層片製造裝置30,參照圖1~圖5進行說明。Next, the laminated sheet manufacturing apparatus 30 used in the embodiment of the laminated sheet manufacturing method of the present invention, which is used in the production of the laminated sheet 40, will be described with reference to Figs. 1 to 5 .
首先,說明積層片製造裝置30之概要。First, an outline of the laminated sheet manufacturing apparatus 30 will be described.
積層片製造裝置30係具備:對向配置之一對之第1輥71a、71b;將由一對之第1輥71a、71b所送出之基材2送出、對向配置之一對之第2輥72a、72b;配置於第1輥71a、71b之片材搬送方向下游側,並配置於第2輥72a、72b之片材搬送方向上游側,且挾持由上述一對之第1輥71a、71b所送出之基材2而配置的2個之第3輥73a、73b。The laminated sheet manufacturing apparatus 30 includes a first roller 71a and 71b that are disposed opposite to each other, and a second roller that feeds the substrate 2 fed by the pair of first rollers 71a and 71b and is disposed opposite to each other. 72a and 72b are disposed on the downstream side in the sheet conveying direction of the first rolls 71a and 71b, and are disposed on the upstream side in the sheet conveying direction of the second rolls 72a and 72b, and are held by the pair of first rolls 71a and 71b. The two third rolls 73a and 73b which are disposed on the substrate 2 to be delivered.
上述各輥71a、71b、72a、72b、73a、73b係配置成使旋轉軸互相平行。Each of the rollers 71a, 71b, 72a, 72b, 73a, and 73b is disposed such that the rotation axes are parallel to each other.
另外,積層片製造裝置30具有對由一對之第1輥71a、71b、上述一對之第2輥72a、72b、上述2個之第3輥73a、73b所包圍之空間70內進行減壓的減壓手段8。Further, the laminated sheet manufacturing apparatus 30 has a pressure reduction in the space 70 surrounded by the pair of first rolls 71a and 71b, the pair of second rolls 72a and 72b, and the two third rolls 73a and 73b. Decompression means 8.
上述一對之第1輥71a、71b係將基材2送出至上述空間70內的輥。由配置於基材2一面側(例如表面側)之一方之第3輥73a與一方之第2輥72a之間朝空間70內送出屬於片材之支撐體5a。而且,第2輥72a、72b係對基材2及支撐體5a之樹脂層3進行壓黏,並將含有基材2及支撐體5a之積層片40送出至上述空間70之外部的輥。The pair of first rolls 71a and 71b are rolls that feed the substrate 2 into the space 70. The support 5a belonging to the sheet is fed into the space 70 between the third roller 73a disposed on one side (for example, the surface side) of the substrate 2 and the second roller 72a. Further, the second rolls 72a and 72b pressurize the resin layer 3 of the base material 2 and the support 5a, and feed the laminated sheet 40 including the base material 2 and the support 5a to the outside of the space 70.
於此,在積層片製造裝置30中,纖維基材2、支撐體5a、5b為長尺狀,沿著其長度方向連續地進行搬送。In the laminated sheet manufacturing apparatus 30, the fiber base material 2 and the support bodies 5a and 5b have a long shape and are continuously conveyed along the longitudinal direction thereof.
接著,詳細說明積層片製造裝置30。Next, the laminated sheet manufacturing apparatus 30 will be described in detail.
如圖1所示,積層片製造裝置30係具備:殼體6;收納於殼體6內之第1輥71a、71b、第2輥72a、72b及第3輥73a、73b;與對殼體6內進行減壓的減壓手段8。以下說明各部的構成。As shown in Fig. 1, the laminated sheet manufacturing apparatus 30 includes a casing 6, first rollers 71a and 71b, second rollers 72a and 72b, and third rollers 73a and 73b housed in the casing 6, and a pair of casings. The decompression means 8 for decompressing in 6 is used. The configuration of each unit will be described below.
如圖2所示,殼體6係具有隔著間隔而彼此相對向配置的一對壁部61,形成為例如箱狀。作為壁部61之構成材料並無特別限定,可舉例如鐵、不銹鋼、鋁等之各種金屬,或含有此等的合金。又,除了此種金屬材料以外,例如聚乙烯、聚四氟乙烯等之樹脂材料亦可使用作為壁部61之構成材料。As shown in Fig. 2, the casing 6 has a pair of wall portions 61 that are disposed to face each other with a space therebetween, and is formed, for example, in a box shape. The constituent material of the wall portion 61 is not particularly limited, and examples thereof include various metals such as iron, stainless steel, and aluminum, or alloys containing the same. Further, in addition to such a metal material, a resin material such as polyethylene or polytetrafluoroethylene may be used as a constituent material of the wall portion 61.
於此,壁部61較佳為平板狀者,但並不限定於此。藉由第1輥71a及71b、第2輥72a及72b與第3輥73a及73b,構成沿著片材搬送方向之兩端面呈開口的筒狀體。壁部61只要為將該筒狀體之上述開口封閉者即可。又,一對之壁部61特佳係跨越各輥71a、71b、72a、72b、73a、73b者。Here, the wall portion 61 is preferably a flat plate, but is not limited thereto. The first rolls 71a and 71b, the second rolls 72a and 72b, and the third rolls 73a and 73b constitute a cylindrical body that is open along both end faces in the sheet conveying direction. The wall portion 61 may be any one that closes the opening of the cylindrical body. Further, the pair of wall portions 61 are particularly preferably formed so as to straddle the respective rollers 71a, 71b, 72a, 72b, 73a, and 73b.
殼體6之2個壁部61間,分別架設第1輥71a及71b與第2輥72a及72b與第3輥73a及73b。此等輥係旋轉軸彼此平行。而且,此等輥係例如經由配置了多數齒輪之齒輪機構(未圖示)而與馬達(未圖示)連結。而且,若該馬達作動, 則該動力經由齒輪機構而傳達,使各輥分別進行旋轉。無需贅言,各輥的驅動並不限定於齒輪機構,視需要亦可對各輥個別地連接馬達而使其驅動。The first rolls 71a and 71b and the second rolls 72a and 72b and the third rolls 73a and 73b are placed between the two wall portions 61 of the casing 6. These roller system rotation axes are parallel to each other. Further, these rollers are coupled to a motor (not shown) via, for example, a gear mechanism (not shown) in which a large number of gears are disposed. Moreover, if the motor is activated, Then, the power is transmitted via the gear mechanism, and each roller is rotated. Needless to say, the driving of each roller is not limited to the gear mechanism, and the motor may be individually driven and driven by each roller as needed.
尚且,此等輥除了大小相異以外,其餘為相同構成。以下,針對第1輥71a之構成進行代表性說明,其他輥亦為相同構造。Moreover, these rolls have the same composition except for the difference in size. Hereinafter, the configuration of the first roller 71a will be representatively described, and the other rollers have the same structure.
如圖2所示,第1輥71a係外形形狀呈圓柱狀,由位於其長度方向之中間部的本體部74與分別位於本體部74之兩端側的軸75所構成。各軸75之外徑分別較本體部74之外徑呈縮徑。As shown in FIG. 2, the first roller 71a has a cylindrical outer shape, and is composed of a main body portion 74 located at an intermediate portion in the longitudinal direction thereof and a shaft 75 located at both end sides of the main body portion 74. The outer diameter of each of the shafts 75 is reduced in diameter from the outer diameter of the body portion 74, respectively.
第1輥71a係使各軸75分別插入至設於壁部61之軸承(bearing)76中,藉由該軸承76而可旋轉地由壁部61所支撐。The first roller 71a is inserted into each of the bearings 76 provided in the wall portion 61, and is rotatably supported by the wall portion 61 by the bearing 76.
尚且,第1輥71a係於圖1、圖2所示構成中為實心體,但並不限定於此,亦可為例如中空體。於使用中空體的情況,視需要可於各輥中使熱媒循環而對輥進行加熱,故更佳。此時之熱媒並無特別限定,可舉例如水、油等。Further, the first roller 71a is a solid body in the configuration shown in Figs. 1 and 2, but is not limited thereto, and may be, for example, a hollow body. In the case of using a hollow body, it is more preferable to circulate the heat medium in each roll as needed to heat the roll. The heat medium at this time is not particularly limited, and examples thereof include water and oil.
另外,作為第1輥71a之構成材料並無特別限定,可使用例如於壁部61之構成材料中所列舉的材料。於第1輥71a之本體部74的外周面741,亦可實施防止外周面741磨損的處理。作為此處理,可舉例如於外周面741形成DLC(Diamond Like Carbon,類鑽碳)之被膜的方法。又,作為第1輥71a之構成材料,除了於壁部61之構成材料中所 列舉之材料以外,亦可使用例如腈橡膠、丁基橡膠、胺基甲酸酯橡膠、聚矽氟橡膠、氟橡膠般之各種橡膠材料。In addition, the constituent material of the first roller 71a is not particularly limited, and for example, the materials listed in the constituent materials of the wall portion 61 can be used. The outer peripheral surface 741 of the main body portion 74 of the first roller 71a may be subjected to a treatment for preventing the outer peripheral surface 741 from being worn. As such a treatment, for example, a method of forming a film of DLC (Diamond Like Carbon) on the outer peripheral surface 741 can be mentioned. Moreover, as a constituent material of the first roller 71a, it is included in the constituent material of the wall portion 61. In addition to the materials listed, various rubber materials such as nitrile rubber, butyl rubber, urethane rubber, polyfluorinated fluororubber, and fluororubber may be used.
第1輥71a與第1輥71b係配置成於水平方向上彼此平行,本體部74之外周面741彼此經由纖維基材2而互相抵接(壓接)合(參照圖1、2)。而且,若第1輥71a與第1輥71b旋轉,則可於此等之間將長尺狀之纖維基材2沿著其長度方向、由圖1中之左側搬送至右側。藉此,片材狀之纖維基材2被搬送至後述空間70內部。The first roller 71a and the first roller 71b are disposed to be parallel to each other in the horizontal direction, and the outer peripheral surface 741 of the main body portion 74 is in contact with each other (pressure-bonded) via the fiber base material 2 (see FIGS. 1 and 2). When the first roller 71a and the first roller 71b are rotated, the long-length fibrous base material 2 can be conveyed to the right side in the longitudinal direction of FIG. 1 along the longitudinal direction thereof. Thereby, the sheet-like fibrous base material 2 is conveyed to the inside of the space 70 to be described later.
第2輥72a及第2輥72b係配置於與第1輥71a、71b不同之位置,亦即相對於第1輥71a、71b配置於纖維基材2之搬送方向前方(下游側)。又,第2輥72a與第2輥72b係配置成於水平方向上彼此平行,本體部74之外周部741彼此經由纖維基材2、第1樹脂層3、設於樹脂層3之上述支撐基材(省略圖示)、第2樹脂層4、設於樹脂層4之上述支撐基材(省略圖示),而互相抵接(壓接)合。而且,若第2輥72a與第2輥72b旋轉,則可於此等之間使第1樹脂層3與第2樹脂層4分別壓黏(接合)於纖維基材2(參照圖1)。The second roller 72a and the second roller 72b are disposed at positions different from the first rollers 71a and 71b, that is, in the transport direction (downstream side) of the fiber base material 2 with respect to the first rollers 71a and 71b. Further, the second roller 72a and the second roller 72b are disposed to be parallel to each other in the horizontal direction, and the outer peripheral portion 741 of the main body portion 74 passes through the fiber base material 2, the first resin layer 3, and the above-mentioned support base provided on the resin layer 3. The material (not shown), the second resin layer 4, and the support base material (not shown) provided in the resin layer 4 are brought into contact with each other (pressure-bonded). When the second roller 72a and the second roller 72b are rotated, the first resin layer 3 and the second resin layer 4 can be pressure-bonded (bonded) to the fiber base material 2 (see FIG. 1).
藉由第2輥72a與第2輥72b,對纖維基材2、樹脂層3、4、支撐基板(省略圖示)之積層體於厚度方向上進行加壓,此時,樹脂層3、4含浸至纖維基材2中。又,如上述般,可藉由於第2輥72a、72b中使熱媒循環而使其進行加熱壓黏。藉此,提升第1樹脂層3與第2樹脂層4對纖維基材2 的密黏性。The laminate of the fiber base material 2, the resin layers 3 and 4, and the support substrate (not shown) is pressed in the thickness direction by the second roller 72a and the second roller 72b. At this time, the resin layers 3 and 4 are pressed. Immersion into the fibrous substrate 2. Further, as described above, the heat transfer can be performed by circulating the heat medium in the second rolls 72a and 72b. Thereby, the first resin layer 3 and the second resin layer 4 are raised to the fiber substrate 2 The adhesion.
另外,藉由將第2輥72a、72b設為加熱輥,可使第1樹脂層3與第2樹脂層4容易含浸於纖維基材2。In addition, the first resin layer 3 and the second resin layer 4 can be easily impregnated into the fiber base material 2 by using the second rolls 72a and 72b as heating rolls.
藉由第2輥72a、72b,積層片40被送出至後述空間70外部。於此,較佳係藉由第2輥72a、72b,將積層片40於大氣壓以上之環境下送出。本實施形態中,第2輥72a、72b之片材搬送方向下游側為大氣壓,藉由第2輥72a、72b將積層片40於大氣壓下進行搬送。The laminated sheet 40 is sent out to the outside of the space 70 to be described later by the second rolls 72a and 72b. Here, it is preferable that the laminated sheet 40 is sent out in an atmosphere of atmospheric pressure or more by the second rolls 72a and 72b. In the present embodiment, the downstream side of the second rolls 72a and 72b in the sheet conveyance direction is atmospheric pressure, and the laminated sheets 40 are conveyed under atmospheric pressure by the second rolls 72a and 72b.
第3輥73a、73b挾持纖維基材2而配置。第3輥73a被配置於在纖維基材2之一面側(表面側)所配置之第1輥71a的片材搬送方向下游側。又,第3輥73a被配置於在纖維基材2之一面側(表面側)所配置之第2輥72a的片材搬送方向上游側。The third rolls 73a and 73b are placed while holding the fiber base material 2. The third roller 73a is disposed on the downstream side in the sheet conveying direction of the first roller 71a disposed on one surface side (surface side) of the fiber base material 2. In addition, the third roller 73a is disposed on the upstream side in the sheet conveying direction of the second roller 72a disposed on one surface side (surface side) of the fiber base material 2.
第3輥73b被配置於在纖維基材2之另一面側(背面側)所配置之第1輥71b的片材搬送方向下游側。又,第3輥73b被配置於在纖維基材2之另一面側(背面側)所配置之第2輥72b的片材搬送方向上游側。The third roller 73b is disposed on the downstream side of the first roller 71b disposed on the other surface side (back surface side) of the fiber base material 2 in the sheet conveying direction. In addition, the third roller 73b is disposed on the upstream side in the sheet conveying direction of the second roller 72b disposed on the other surface side (back surface side) of the fiber base material 2.
第3輥73a與第3輥73b互相於上下方向(鉛直方向)離間,並平行地對向配置。而且,若第3輥73a旋轉,則可由第1支撐體5a之第1樹脂層3剝離(捲取)保護片材51(參照圖1)。與此同樣地,若旋轉第3輥73b,則可由第2支撐體5b之第2樹脂層4剝離保護片材51(參照圖1)。The third roller 73a and the third roller 73b are spaced apart from each other in the vertical direction (vertical direction), and are disposed to face each other in parallel. When the third roller 73a is rotated, the protective sheet 51 can be peeled off (rolled up) from the first resin layer 3 of the first support 5a (see FIG. 1). In the same manner, when the third roller 73b is rotated, the protective sheet 51 can be peeled off from the second resin layer 4 of the second support 5b (see FIG. 1).
再者,第3輥73a係使其本體部74之外周面741,分別抵接於第1輥71a之本體部74之外周面741與第2輥72a之本體部74之外周面741。另一方面,第3輥73b係使其本體部74之外周面741,分別抵接於第1輥71b之本體部74之外周面741與第2輥72b之本體部74之外周面741。藉由此種配置,在積層片製造裝置30中,形成由殼體6之各壁部61、第1輥71a及71b、第2輥72a及72b、第3輥73a及73b所包圍的空間70。空間70係藉減壓手段8之作動而被減壓(參照圖3)。In addition, the third roller 73a is formed such that the outer peripheral surface 741 of the main body portion 74 abuts against the outer peripheral surface 741 of the main portion 74 of the first roller 71a and the outer peripheral surface 741 of the main portion 74 of the second roller 72a. On the other hand, the third roller 73b is formed such that the outer peripheral surface 741 of the main body portion 74 abuts against the outer peripheral surface 741 of the main portion 74 of the first roller 71b and the outer peripheral surface 741 of the main portion 74 of the second roller 72b. With this arrangement, in the laminated sheet manufacturing apparatus 30, the space 70 surrounded by the wall portions 61 of the casing 6, the first rollers 71a and 71b, the second rollers 72a and 72b, and the third rollers 73a and 73b is formed. . The space 70 is decompressed by the action of the decompression means 8 (see Fig. 3).
如圖2所示,在第1輥71a及71b(第2輥72a及72b、第3輥73a及73b亦相同)之各別的本體部74之兩端與各壁部61之間,介存密封材62。各密封材62係分別由環狀之彈性體所構成,依壓縮狀態插入至形成於壁部61的環狀凹部612。藉此,確實維持空間70之氣密性,而在藉減壓手段8對空間70進行減壓時,可迅速並確實地進行該減壓。As shown in Fig. 2, between the two ends of the respective main body portions 74 of the first rolls 71a and 71b (the second rolls 72a and 72b and the third rolls 73a and 73b are the same) and the wall portions 61 are interposed. Sealing material 62. Each of the seal members 62 is composed of an annular elastic body and is inserted into the annular recessed portion 612 formed in the wall portion 61 in a compressed state. Thereby, the airtightness of the space 70 is surely maintained, and when the space 70 is decompressed by the decompression means 8, the decompression can be quickly and surely performed.
作為密封材62之構成材料並無特別限定,可舉例如天然橡膠、異戊二烯橡膠、丁二烯橡膠、苯乙烯-丁二烯橡膠、腈橡膠、氯平橡膠、丁基橡膠、丙烯酸系橡膠、乙烯-丙烯橡膠、表氯醇橡膠、胺基甲酸酯橡膠、聚矽氧橡膠、氟橡膠般之各種橡膠材料(尤其是經加硫處理者),或苯乙烯系、聚烯烴系、聚氯乙烯系、聚胺基甲酸酯系、聚酯系、聚醯胺系、聚丁二烯系、反式聚異戊二烯系、氟橡膠系、氯化聚乙烯系 等之各種熱可塑性彈性體,此等之中可使用1種或混合2種以上使用。The constituent material of the sealing material 62 is not particularly limited, and examples thereof include natural rubber, isoprene rubber, butadiene rubber, styrene-butadiene rubber, nitrile rubber, chloroprene rubber, butyl rubber, and acrylic resin. Rubber, ethylene-propylene rubber, epichlorohydrin rubber, urethane rubber, polyoxyethylene rubber, fluororubber-like rubber materials (especially those treated with sulfur), or styrene, polyolefin, Polyvinyl chloride, polyurethane, polyester, polyamine, polybutadiene, trans-polyisoprene, fluororubber, chlorinated polyethylene For each of the thermoplastic elastomers, one type or a mixture of two or more types may be used.
如圖1所示,第1輥71a及71b、第2輥72a及72b、第3輥73a及73b係本體部74之外徑(尺寸)彼此不同。本實施形態中,其大小關係為(第3輥)<(第1輥)<(第2輥)。又,第1輥71a及71b、第2輥72a及72b、第3輥73a及73b之各輥的尺寸為任意,但較佳係儘可能地小至例如在使具有可撓性之片材沿貼於輥時於該片材不發生皺紋的程度。具體而言,直徑較佳為75~300mm、更佳為100~200mm。As shown in FIG. 1, the outer diameters (sizes) of the first rolls 71a and 71b, the second rolls 72a and 72b, and the third rolls 73a and 73b are different from each other. In the present embodiment, the magnitude relationship is (third roller) < (first roller) < (second roller). Further, the sizes of the rollers of the first rolls 71a and 71b, the second rolls 72a and 72b, and the third rolls 73a and 73b are arbitrary, but are preferably as small as possible, for example, in the case of a sheet having flexibility. The degree to which the sheet does not wrinkle when applied to the roll. Specifically, the diameter is preferably from 75 to 300 mm, more preferably from 100 to 200 mm.
又,在假設將第1輥71a與第2輥72a與第3輥73a之中心彼此連結而形成的三角形時,以該三角形之第3輥73a之中心為頂點的角度較佳係超過60°、未滿180°。關於將第1輥71b與第2輥72b與第3輥73b之中心彼此連結而形成的三角形亦相同。In the case of a triangle formed by connecting the center of the first roller 71a and the second roller 72a and the third roller 73a, the angle of the center of the third roller 73a of the triangle is preferably 60°. Less than 180°. The triangle formed by connecting the center of the first roller 71b and the second roller 72b and the third roller 73b is also the same.
如圖3所示,減壓手段8係具有泵81、與將泵81與於各壁部61上分別形成之開口部611連接的連接管82。泵81係設置於殼體6外側,可應用例如真空泵。As shown in FIG. 3, the decompression means 8 has a pump 81 and a connection pipe 82 that connects the pump 81 to the opening 611 formed in each of the wall portions 61. The pump 81 is disposed outside the casing 6, and for example, a vacuum pump can be applied.
減壓手段8係使由輥所包圍之空間70內部成為較空間70外部區域低的氣壓。藉由驅動減壓手段8,空間70之氣壓變得較第1輥71a、71b之片材搬送方向上游側之區域及第2輥72a、72b之片材搬送方向下游側之區域更低,成為負壓。減壓手段8係使由輥71a、71b、72a、72b、73a、73b 所包圍之空間70內部之氣壓減低。以第1輥71a、71b作為邊界,在此第1輥71a、71b之片材搬送方向上游側之區域為大氣壓以上(本實施形態為大氣壓下)。The decompression means 8 is such that the inside of the space 70 surrounded by the rolls becomes a lower air pressure than the outer area of the space 70. When the pressure reducing means 8 is driven, the air pressure in the space 70 becomes lower than the area on the upstream side in the sheet conveying direction of the first rolls 71a and 71b and the area on the downstream side in the sheet conveying direction of the second rolls 72a and 72b. Negative pressure. The decompression means 8 is made up of rollers 71a, 71b, 72a, 72b, 73a, 73b The air pressure inside the enclosed space 70 is reduced. In the region on the upstream side in the sheet conveying direction of the first rolls 71a and 71b, the first rolls 71a and 71b are at a pressure equal to or higher than atmospheric pressure (in the present embodiment, at atmospheric pressure).
同樣地,以第2輥72a、72b為邊界,第2輥72a、72b之片材搬送方向下游側之區域為大氣壓以上(本實施形態為大氣壓下)。In the same manner, the region on the downstream side in the sheet conveying direction of the second rollers 72a and 72b is equal to or higher than the atmospheric pressure in the second roller 72a and 72b (in the present embodiment, at atmospheric pressure).
各連接管82分別為例如由不銹鋼等之金屬材料所構成的硬質管。Each of the connecting pipes 82 is a rigid pipe made of, for example, a metal material such as stainless steel.
各開口部611分別朝空間70開口,連通至空間70。又,圖3所示構成中係於雙面之壁部61分別形成有開口部611,但並不限定於此,例如亦可僅在一方壁部61上形成開口部611。Each of the openings 611 opens into the space 70 and communicates with the space 70. Further, in the configuration shown in FIG. 3, the opening portion 611 is formed in each of the double-walled wall portions 61. However, the opening portion 611 is not limited thereto. For example, the opening portion 611 may be formed only on one of the wall portions 61.
然後,藉由使泵81作動,可由各開口部611吸引空間70內的氣體(空氣G),藉此可使空間70減壓。又,藉此,產生使相鄰接之輥彼此接近的力而進一步予以壓接合,藉此可更確實地維持空間70之氣密性。Then, by operating the pump 81, the gas (air G) in the space 70 can be sucked by the openings 611, whereby the space 70 can be depressurized. Further, by this, a force for bringing the adjacent rollers closer to each other is generated and further pressure-bonded, whereby the airtightness of the space 70 can be more reliably maintained.
接著,針對由積層片製造裝置30進行之積層片40之製造方法進行說明。Next, a method of manufacturing the laminated sheet 40 by the laminated sheet manufacturing apparatus 30 will be described.
首先,在使第1輥71a、71b與第2輥72a、72b與第3輥73a、73b旋轉前,使減壓手段8作動,吸引空間70內的氣體,使空間70內先減壓。First, before the first rolls 71a and 71b and the second rolls 72a and 72b and the third rolls 73a and 73b are rotated, the decompression means 8 is actuated to suck the gas in the space 70, and the space 70 is first decompressed.
空間70內之氣壓成為負壓,例如為800Pa以下、100Pa 以上。The air pressure in the space 70 becomes a negative pressure, for example, 800 Pa or less, 100 Pa. the above.
其次,如圖1所示般,若第1輥71a與第1輥71b旋轉,則由此等輥之間將纖維基材2送出至空間70內(連續性地供給)。Then, as shown in FIG. 1, when the first roller 71a and the first roller 71b are rotated, the fiber base material 2 is fed into the space 70 between the rolls (continuously supplied).
纖維基材2係例如捲附於未圖示之供給輥上,由供給輥經由第1輥71a及第1輥71b,供給至空間70內。The fiber base material 2 is wound, for example, on a supply roller (not shown), and is supplied into the space 70 by the supply roller via the first roller 71a and the first roller 71b.
另外,第2輥72a與第3輥73a旋轉時,由此等輥之間將第1支撐體5a送出至空間70內(連續性地供給)。該第1支撐體5a係使保護片材51沿著第3輥73a外周面被捲取(拉出),藉此由第1樹脂層3剝離保護片材51。剝離了保護片材51之具有支撐基材的第1樹脂層3,係沿著第2輥72a慢慢地接近纖維基材2。又,被剝離之保護片材51係藉由第1輥71a與第3輥73a,被送出至與第2輥72a、72b不同的方向。具體而言,由第1輥71a與第3輥73a之間朝外側(空間70外)送出。When the second roller 72a and the third roller 73a are rotated, the first support 5a is sent out into the space 70 between the rollers (continuously supplied). In the first support 5a, the protective sheet 51 is taken up (pulled) along the outer circumferential surface of the third roller 73a, whereby the protective sheet 51 is peeled off from the first resin layer 3. The first resin layer 3 having the supporting substrate of the protective sheet 51 is peeled off, and the fibrous base material 2 is gradually approached along the second roller 72a. Moreover, the peeled protective sheet 51 is sent out to the direction different from the second rolls 72a and 72b by the 1st roll 71a and the 3rd roll 73a. Specifically, the first roller 71a and the third roller 73a are fed outward (outside the space 70).
另外,第1樹脂層3為B階段狀態,呈固形、半固形或液體的狀態。Further, the first resin layer 3 is in a B-stage state and is in a solid, semi-solid or liquid state.
另外,第2輥72b與第3輥73b旋轉時,由此等輥之間將第2支撐體5b送出至空間70內(連續性地供給)。該第2支撐體5b係使保護片材51被捲取於第3輥73b,藉此由第2樹脂層4剝離保護片材51。剝離了保護片材51之具有支撐基材的第2樹脂層4,係沿著第2輥72b慢慢地接近纖維基 材2。又,被剝離之保護片材51係藉由第1輥71b與第3輥73b,被送出至與第2輥72a、72b不同的方向。具體而言,由第1輥71b與第3輥73b之間朝外側送出。When the second roller 72b and the third roller 73b are rotated, the second support 5b is sent out into the space 70 (continuously supplied) between the rollers. In the second support 5b, the protective sheet 51 is wound around the third roller 73b, whereby the protective sheet 51 is peeled off from the second resin layer 4. The second resin layer 4 having the support substrate peeled off from the protective sheet 51 is slowly approached to the fiber base along the second roller 72b. Material 2. Moreover, the peeled protective sheet 51 is sent out to the direction different from the second rolls 72a and 72b by the 1st roll 71b and the 3rd roll 73b. Specifically, the first roller 71b and the third roller 73b are fed outward between the first roller 71b.
另外,第2樹脂層4為B階段狀態,呈固形、半固形或液體的狀態。Further, the second resin layer 4 is in a B-stage state and is in a solid, semi-solid or liquid state.
如此,藉由在使第1樹脂層3及第2樹脂層4分別即將與纖維基材2壓黏前,於空間70內剝離保護片材51,則可防止該保護片材51妨礙各樹脂層之壓黏的情形,並可在壓黏前藉保護片材51保護各樹脂層。By peeling off the protective sheet 51 in the space 70 immediately before the first resin layer 3 and the second resin layer 4 are pressed against the fiber base material 2, the protective sheet 51 can be prevented from interfering with each resin layer. In the case of pressure bonding, each resin layer can be protected by the protective sheet 51 before pressure bonding.
而且,纖維基材2與具有支撐基材之第1樹脂層3與具有支撐基材之第2樹脂層4,係一次地通過第2輥72a與第2輥72b之間。Further, the fiber base material 2 and the first resin layer 3 having the support base material and the second resin layer 4 having the support base material pass between the second roll 72a and the second roll 72b at a time.
此時,設於第1樹脂層3之支撐基材接觸至第2輥72a,設於第2樹脂層4之支撐基材接觸至第2輥72b。第1樹脂層3及第2樹脂層4係直接接觸至纖維基材2。At this time, the support substrate provided in the first resin layer 3 is in contact with the second roller 72a, and the support substrate provided on the second resin layer 4 is in contact with the second roller 72b. The first resin layer 3 and the second resin layer 4 are in direct contact with the fiber base material 2.
而且,如圖4所示,藉由第2輥72a與第2輥72b之間的壓接力(抵接力)F1,使第1樹脂層3由上側與纖維基材2壓黏,並使第2樹脂層4由下側與纖維基材2壓黏。In addition, as shown in FIG. 4, the first resin layer 3 is pressed against the fiber base material 2 from the upper side by the pressure contact force (contact force) F1 between the second roller 72a and the second roller 72b, and the second resin layer 2 is pressed. The resin layer 4 is pressure-bonded to the fibrous base material 2 from the lower side.
由纖維基材2與具有支撐基材之第1樹脂層3與具有支撐基材之第2樹脂層4所構成的積層片40,係由第2輥72a與第2輥72b之間被連續排出。The laminated sheet 40 composed of the fibrous base material 2 and the first resin layer 3 having the supporting base material and the second resin layer 4 having the supporting base material is continuously discharged between the second roller 72a and the second roller 72b. .
尚且,於此,所謂纖維基材2等連續地供給或排出,係指 除了如片式般使纖維基材等間歇性地供給或排出者以外的意義。例如,係指除了使於空間70內存在纖維基材2等之狀態與不存在之狀態依短期間交替切換以外的意義。其中,視需要亦可停止纖維基材2等之搬送。Further, here, the fiber substrate 2 or the like is continuously supplied or discharged, which means In addition to the fact that the fiber substrate or the like is intermittently supplied or discharged as in the form of a sheet. For example, it means that the state in which the fibrous base material 2 or the like exists in the space 70 and the state in which it does not exist are alternately switched in a short period of time. Among them, the conveyance of the fiber base material 2 or the like can be stopped as needed.
另外,如上述般,空間70係藉由減壓手段8之作動而被減壓。藉此,如圖4所示,於空間70內所產生之減壓力F2可輔助纖維基材2與第1樹脂層3間之壓黏、纖維基材2與第2樹脂層4間之壓黏。Further, as described above, the space 70 is depressurized by the operation of the decompression means 8. Thereby, as shown in FIG. 4, the depressurization F2 generated in the space 70 can assist the adhesion between the fiber base material 2 and the first resin layer 3, and the pressure between the fiber base material 2 and the second resin layer 4. .
此種壓接力F1所造成之壓黏與減壓力F2所造成之壓黏合作,而強化纖維基材2與第1樹脂層3之接合及纖維基材2與第2樹脂層4之接合。藉此,可使樹脂層3、4含浸於纖維基材2內部。然後,例如不論第1樹脂層3或第2樹脂層4之厚度或組成,可製造使該各樹脂層確實且牢固地接合至纖維基材2的積層片40。The pressure-bonding force caused by the pressure-bonding force F1 is bonded to the pressure-reducing force F2, and the bonding of the reinforcing fiber base material 2 and the first resin layer 3 and the joining of the fiber base material 2 and the second resin layer 4 are performed. Thereby, the resin layers 3 and 4 can be impregnated inside the fiber base material 2. Then, for example, regardless of the thickness or composition of the first resin layer 3 or the second resin layer 4, the laminated sheet 40 in which the respective resin layers are reliably and firmly bonded to the fiber base material 2 can be produced.
再者,藉由將第2輥72a與第2輥72b設為加熱輥,則可使樹脂層3、4確實地含浸於纖維基材2內部。In addition, by using the second roller 72a and the second roller 72b as the heating roller, the resin layers 3 and 4 can be surely impregnated into the inside of the fiber base material 2.
再者,藉由對空間70內進行減壓,吸引纖維基材2內部的氣體,藉由第2輥72a與第2輥72b使樹脂層3、4含浸時,則不易在含浸於纖維基材2內部之樹脂層中發生空隙。When the gas inside the fiber base material 2 is sucked by decompressing the space 70, and the resin layers 3 and 4 are impregnated by the second roll 72a and the second roll 72b, it is difficult to impregnate the fiber base material. 2 A void occurs in the inner resin layer.
另外,積層片製造裝置30中,欲減壓之空間係由第1輥71a及71b、第2輥72a及72b、第3輥73a及73b所包圍的空間70,可儘可能地減小欲減壓的空間。藉此,可使積 層片製造裝置30小型化。又,使減壓手段8作動時,可迅速地進行其減壓。又,由於可使欲減壓之空間減小,故亦可使空間70內高真空化。具體而言,藉由採由於壁部61形成開口部611,由該開口部611直接吸引空間70內之氣體的構成,則可僅對空間70內部進行減壓,可使空間70內高真空化。Further, in the laminated sheet manufacturing apparatus 30, the space to be decompressed is reduced by the spaces 70 surrounded by the first rolls 71a and 71b, the second rolls 72a and 72b, and the third rolls 73a and 73b as much as possible. Pressure space. By this, the product can be The layer manufacturing apparatus 30 is miniaturized. Further, when the decompression means 8 is actuated, the decompression can be quickly performed. Further, since the space for which the pressure is to be reduced can be reduced, the space 70 can be made high in vacuum. Specifically, by forming the opening portion 611 by the wall portion 61 and directly absorbing the gas in the space 70 from the opening portion 611, the inside of the space 70 can be decompressed only, and the space 70 can be made highly vacuumed. .
另外,在纖維基材2與第1樹脂層3接合時,即使在此等之間殘留空氣,仍可藉由壓接力F1將該空氣擠出,因此可確實防止在空氣殘留之下予以接合的情形(在纖維基材2與第2樹脂層4接合時亦相同)。Further, when the fiber base material 2 is joined to the first resin layer 3, even if air remains between these, the air can be extruded by the pressure contact force F1, so that it is possible to surely prevent the air from being bonded under the residual air. In the case (the same applies when the fiber base material 2 and the second resin layer 4 are joined).
於此,圖5係顯示圖1之D-D方向之纖維基材2、樹脂層3、4的剖面圖。與纖維基材2之搬送方向呈正交的寬度尺寸,係較與第1樹脂層3及第2樹脂層4之搬送方向呈正交的寬度尺寸小。Here, FIG. 5 is a cross-sectional view showing the fiber base material 2 and the resin layers 3 and 4 in the D-D direction of FIG. The width dimension orthogonal to the conveyance direction of the fiber base material 2 is smaller than the width dimension orthogonal to the conveyance direction of the first resin layer 3 and the second resin layer 4.
藉由一對之第2輥72a、72b,使纖維基材2、第1樹脂層3及第2樹脂層4壓黏。此時,使第1樹脂層3之寬度方向之一端部(搬送方向側之一端部)、與第2樹脂層4之寬度方向之一端部(搬送方向側之一端部)被壓黏(熱壓黏),並使第1樹脂層3之寬度方向之另一端部、與第2樹脂層4之寬度方向之另一端部被壓黏(熱壓黏)。使樹脂層3、4之寬度方向之端部彼此被熔融接合,形成接合部,成為使纖維基材2被內包於第1樹脂層3及第2樹脂層4內的形狀。亦即,積 層片40之寬度方向之兩端部為被密封的狀態。The fiber base material 2, the first resin layer 3, and the second resin layer 4 are pressure-bonded by the pair of second rolls 72a and 72b. In this case, one end portion (one end portion on the transport direction side) in the width direction of the first resin layer 3 and one end portion (one end portion on the transport direction side) in the width direction of the second resin layer 4 are pressed (hot pressed) The other end portion in the width direction of the first resin layer 3 and the other end portion in the width direction of the second resin layer 4 are pressure-bonded (thermally bonded). The end portions in the width direction of the resin layers 3 and 4 are fused to each other to form a joint portion, and the fiber base material 2 is wrapped in the first resin layer 3 and the second resin layer 4 in a shape. That is, the product Both ends of the layer 40 in the width direction are sealed.
纖維基材2為形成有複數孔的多孔質材。形成於纖維基材2的孔係經由其他孔,於片材搬送方向上連通,進而連通至纖維基材2表背面。因此,即使是位於空間70外部之纖維基材2,其內部亦連通至空間70。位於空間70外部之纖維基材2內部的氣體,係經由纖維基材2內部之孔及空間70,而由減壓手段8所吸引。The fibrous base material 2 is a porous material in which a plurality of pores are formed. The pores formed in the fiber base material 2 communicate with each other through the other holes in the sheet conveying direction, and further communicate with the front and back surfaces of the fiber base material 2. Therefore, even the fibrous base material 2 located outside the space 70 is internally connected to the space 70. The gas inside the fiber base material 2 outside the space 70 is sucked by the decompression means 8 through the holes and spaces 70 inside the fiber base material 2.
如上述,藉由一對之第2輥72a、72b,於纖維基材2內部使樹脂層3、4含浸。然而,並未成為被樹脂層3、4完全埋填纖維基材2內部的狀態(完全含浸)。通過第2輥72a及第2輥72b間而得的積層片40中,纖維基材2內部之孔係經由其他孔,連通至位於空間70內之纖維基材2之表背面的孔。As described above, the resin layers 3 and 4 are impregnated inside the fiber base material 2 by the pair of second rolls 72a and 72b. However, it is not in a state in which the inside of the fiber base material 2 is completely buried by the resin layers 3 and 4 (complete impregnation). In the laminated sheet 40 obtained between the second roller 72a and the second roller 72b, the pores inside the fibrous base material 2 are communicated to the pores on the front and back surfaces of the fibrous base material 2 in the space 70 via the other holes.
因此,位於空間部70外部之纖維基材2內部的氣體,經由纖維基材2內部之孔及空間70,被減壓手段8所吸引。Therefore, the gas inside the fiber base material 2 outside the space portion 70 is sucked by the decompression means 8 through the holes and the space 70 inside the fiber base material 2.
另一方面,藉由一對之第2輥72a、72b,加熱樹脂層3、4而成為黏度變低的狀態,故在由空間70被送出之積層片40中,亦進行樹脂層3、4朝纖維基材2的含浸。On the other hand, the resin layers 3 and 4 are heated by the pair of second rolls 72a and 72b, and the viscosity is lowered. Therefore, the resin layers 3 and 4 are also formed in the laminated sheet 40 which is sent out from the space 70. Impregnation towards the fibrous substrate 2.
然後,如上述般,位於空間70外部之纖維基材2內部的氣體,係經由纖維基材2內部之孔及空間70,藉減壓手段8所吸引,此吸引係持續到樹脂層3、4含浸至纖維基材2內部一定程度為止。亦即,在纖維基材2內部氣體被減壓手段 8所吸引之期間,進行樹脂層3、4對纖維基材2的含浸。藉此,使樹脂層3、4更容易含浸至纖維基材2中,並防止於纖維基材2內部發生空隙。Then, as described above, the gas inside the fiber base material 2 outside the space 70 is sucked by the pressure reducing means 8 through the hole and the space 70 inside the fiber base material 2, and the suction continues to the resin layers 3, 4 Immersion to the inside of the fiber base material 2 to some extent. That is, the gas inside the fiber substrate 2 is depressurized During the period of attraction of 8, the resin layers 3 and 4 were impregnated into the fibrous base material 2. Thereby, the resin layers 3 and 4 are more easily impregnated into the fibrous base material 2, and voids are prevented from occurring inside the fibrous base material 2.
另外,由於在積層片40之寬度方向之兩端部,形成有使樹脂層3、4之端部彼此熔融接合的接合部,故於空間70外部,可防止氣體由纖維基材2之端面側流入至纖維基材2內部的情形。因此,可將位於空間70外部之積層片40之纖維基材2內部的氣體,藉由減壓手段8確實地吸引。In addition, since the joint portions which melt-bond the end portions of the resin layers 3 and 4 are formed at both end portions in the width direction of the laminated sheet 40, it is possible to prevent the gas from being on the outer surface side of the fiber base material 2 outside the space 70. The case of flowing into the inside of the fibrous base material 2. Therefore, the gas inside the fiber base material 2 of the laminated sheet 40 located outside the space 70 can be surely sucked by the decompression means 8.
尚且,製造裝置30中,在由空間70所送出之積層片40被搬送的狀態下,仍進行著樹脂層3、4朝纖維基材2的含浸。Further, in the manufacturing apparatus 30, the impregnation of the resin layers 3 and 4 toward the fiber base material 2 is performed while the laminated sheet 40 sent from the space 70 is conveyed.
另外,本實施形態中,第2輥72a、72b之片材搬送方向下游側為大氣壓,由第2輥72a、72b所送出之積層片被大氣壓所加壓。藉此,可使第1樹脂層3與第2樹脂層4對纖維基材2之含浸進行。In the present embodiment, the downstream side of the second rolls 72a and 72b in the sheet conveying direction is atmospheric pressure, and the laminated sheets fed by the second rolls 72a and 72b are pressurized by atmospheric pressure. Thereby, the impregnation of the first resin layer 3 and the second resin layer 4 with respect to the fiber base material 2 can be performed.
接著,針對使用了預浸體1之基板10,參照圖11進行說明。該圖11所示之基板10係具有積層體11、設於該積層體11之兩面的金屬層12。Next, the substrate 10 using the prepreg 1 will be described with reference to FIG. The substrate 10 shown in FIG. 11 has a laminate 11 and a metal layer 12 provided on both surfaces of the laminate 11.
積層體11係具備以第2樹脂層4彼此為內側而配置的2個預浸體1、與由第2樹脂層4彼此間所挾持的纖維基材13。The laminated body 11 includes two prepregs 1 that are disposed inside the second resin layer 4 and a fibrous base material 13 that is held between the second resin layers 4 .
纖維基材13中可使用與上述纖維基材2相同之物。又, 本實施形態中,第2樹脂層4由於具有上述特性(可撓性),故纖維基材13之至少一部分被確實埋覆(埋設)於第2樹脂層4中。The same as the above-mentioned fiber base material 2 can be used for the fiber base material 13. also, In the present embodiment, since the second resin layer 4 has the above-described characteristics (flexibility), at least a part of the fiber base material 13 is surely embedded (embedded) in the second resin layer 4.
金屬層12為被加工為佈線部的部分,藉由例如將銅箔、鋁箔等之金屬箔接合至積層體11、將銅、鋁鍍覆至積層體11表面等而形成。又,本實施形態中,由於第1樹脂層3具有上述特性,故可依高密黏性保持金屬層12,並可依高加工精度將金屬層12形成為佈線部。The metal layer 12 is a portion processed into a wiring portion, and is formed by, for example, bonding a metal foil such as a copper foil or an aluminum foil to the laminated body 11 and plating copper or aluminum on the surface of the laminated body 11. Further, in the present embodiment, since the first resin layer 3 has the above characteristics, the metal layer 12 can be held with high adhesion, and the metal layer 12 can be formed as a wiring portion with high processing precision.
金屬層12與第1樹脂層3間之剝離強度較佳為0.5kN/m以上、更佳0.6kN/m以上。藉此,將使金屬層12加工為佈線部而得到之半導體裝置100(參照圖12)中之連接可靠性更加提升。The peeling strength between the metal layer 12 and the first resin layer 3 is preferably 0.5 kN/m or more, more preferably 0.6 kN/m or more. As a result, the connection reliability in the semiconductor device 100 (see FIG. 12) obtained by processing the metal layer 12 into a wiring portion is further improved.
此種基板10係準備於第1樹脂層3上形成了金屬層12的2個預浸體1,於藉此等預浸體1挾持纖維基材13之狀態,使用例如真空層合法等則可製造。In the substrate 10, two prepregs 1 in which the metal layer 12 is formed on the first resin layer 3 are prepared, and in the state in which the prepreg 1 holds the fiber base material 13, for example, vacuum lamination can be used. Manufacturing.
尚且,基板10亦可省略纖維基材13,為含有使2個預浸體1之第2樹脂層4彼此直接接合而成的積層體,或亦可省略金屬層12。In addition, the substrate 10 may be omitted from the fiber base material 13 and may be a laminate including the second resin layers 4 of the two prepregs 1 being directly joined to each other, or the metal layer 12 may be omitted.
接著,針對使用了基板10之半導體裝置100,參照圖12進行說明。又,圖12中,省略表示纖維基材2、13,並一體表示第1樹脂層3及第2樹脂層4。Next, the semiconductor device 100 using the substrate 10 will be described with reference to FIG. In FIG. 12, the fiber base materials 2 and 13 are omitted, and the first resin layer 3 and the second resin layer 4 are integrally shown.
圖12所示之半導體裝置100,係具有:多層基板(電路基板(多層印刷佈線板))200;設於多層基板200上面之墊部300;設於多層基板200下面的佈線部400;與藉由將凸塊501連接至墊部300,而搭載於多層基板200上之半導體元件500。The semiconductor device 100 shown in FIG. 12 includes a multilayer substrate (a circuit board (multilayer printed wiring board)) 200, a pad portion 300 provided on the upper surface of the multilayer substrate 200, and a wiring portion 400 provided on the lower surface of the multilayer substrate 200. The semiconductor element 500 mounted on the multilayer substrate 200 is connected to the pad portion 300 by the bumps 501.
多層基板200係具備:作為核基板而設置之基板10;設於該基板10上側的3個預浸體1a、1b、1c;與設於基板10下側之3個預浸體1d、1e、1f。分別構成預浸體1a~1c之纖維基材2、第1樹脂層3、第2樹脂層4由基板10起的配置順序,與分別構成預浸體1d~1f之纖維基材2、第1樹脂層3、第2樹脂層4由基板10起的配置順序係相同。亦即,預浸體1a~1c與預浸體1d~1f係彼此上下反轉者。The multilayer substrate 200 includes a substrate 10 provided as a core substrate, three prepregs 1a, 1b, and 1c provided on the upper side of the substrate 10, and three prepregs 1d and 1e provided on the lower side of the substrate 10. 1f. The fiber base material 2, the first resin layer 3, and the second resin layer 4 constituting the prepregs 1a to 1c are arranged in the order of the substrate 10, and the fiber base materials 2 and 1 which constitute the prepregs 1d to 1f, respectively. The arrangement order of the resin layer 3 and the second resin layer 4 from the substrate 10 is the same. That is, the prepregs 1a to 1c and the prepregs 1d to 1f are vertically inverted.
另外,多層板基200係具有:設於預浸體1a與預浸體1b之間的電路部201a;設於預浸體1b與預浸體1c之間的電路部201b;設於預浸體1d與預浸體1e之間的電路部201d;與設於預浸體1e與預浸體1f之間的電路部201e。Further, the multilayer board base 200 includes a circuit portion 201a provided between the prepreg 1a and the prepreg 1b, a circuit portion 201b provided between the prepreg 1b and the prepreg 1c, and a prepreg. a circuit portion 201d between 1d and the prepreg 1e; and a circuit portion 201e provided between the prepreg 1e and the prepreg 1f.
再者,多層基板200係具備分別貫通各預浸體1a~1f而設置,將相鄰接之電路部彼此、或電路部與墊部進行電氣連接的導體部202。Further, the multilayer substrate 200 includes a conductor portion 202 that is provided to penetrate the respective prepregs 1a to 1f, and electrically connect adjacent circuit portions or circuit portions and pad portions.
基板10之金屬層12係分別被加工為既定圖案,該被加工之金屬層12彼此係藉由貫通基板10而設置之導體部203所電氣連接。The metal layers 12 of the substrate 10 are each processed into a predetermined pattern, and the processed metal layers 12 are electrically connected to each other by a conductor portion 203 provided through the substrate 10.
尚且,半導體裝置100(多層基板200)亦可於基板10之單面側設置4個以上的預浸體1。再者,半導體裝置100亦可含有預浸體1以外的預浸體。Further, in the semiconductor device 100 (multilayer substrate 200), four or more prepregs 1 may be provided on one side of the substrate 10. Further, the semiconductor device 100 may include a prepreg other than the prepreg 1 .
圖6為顯示本發明之積層片製造裝置之第2實施形態的概略側面圖。Fig. 6 is a schematic side view showing a second embodiment of the laminated sheet manufacturing apparatus of the present invention.
以下,參照該圖說明本發明之積層片製造裝置、積層片之製造方法及積層片之第2實施形態,但以與上述實施形態間之相異點為中心進行說明,同樣事項則省略其說明。In the following, the second embodiment of the laminated sheet manufacturing apparatus, the laminated sheet manufacturing method, and the laminated sheet of the present invention will be described with reference to the drawings, but the description will be focused on the differences from the above-described embodiments, and the description of the same matters will be omitted. .
本實施形態係除了積層片製造裝置進一步具備調整手段(抵接力調整手段)之外,其餘與上述第1實施形態相同。This embodiment is the same as the above-described first embodiment except that the laminated sheet manufacturing apparatus further includes an adjusting means (abutting force adjusting means).
圖6所示之積層片製造裝置30A,係具備在使空間70減壓時,不論該減壓力F2之大小,用於將相鄰接之輥間、例如第1輥71a、71b彼此間或第2輥72a、72b彼此間之壓接力F1維持為幾乎一定的調整手段(抵接力調整手段)9。The laminated sheet manufacturing apparatus 30A shown in Fig. 6 is provided for, when the space 70 is decompressed, for the purpose of reducing the pressure F2, for the adjacent rolls, for example, the first rolls 71a and 71b or the first The pressure contact force F1 between the two rollers 72a and 72b is maintained at almost constant adjustment means (abutment force adjustment means) 9.
調整手段9係具有對第1輥71a、71b朝其等彼此離間之方向加勢的壓縮螺旋彈簧91。The adjustment means 9 has a compression coil spring 91 that biases the first rollers 71a, 71b in a direction in which they are spaced apart from each other.
尚且,調整手段9亦可具有對第2輥72a、72b朝其等彼此離間之方向加勢的壓縮螺旋彈簧91。Further, the adjustment means 9 may have a compression coil spring 91 that biases the second rollers 72a, 72b in a direction in which they are spaced apart from each other.
第1輥71a之軸75係由壓縮螺旋彈簧91之一端面所抵接之塊狀之一彈簧座92所支撐著。同樣地,第1輥71b之軸75係由壓縮螺旋彈簧91之另一端面所抵接之塊狀之另一彈 簧座92所支撐著。The shaft 75 of the first roller 71a is supported by a block spring seat 92 which is abutted against one end surface of the compression coil spring 91. Similarly, the shaft 75 of the first roller 71b is another block-like piece that is abutted by the other end surface of the compression coil spring 91. The spring seat 92 is supported.
而且,壓縮螺旋彈簧91係於第1輥71a中之彈簧座92與第1輥71b之彈簧座92之間,依壓縮狀態所設置。藉此,對第1輥71a朝上方加勢,並對第1輥71b朝下方加勢,亦即產生使第1輥71a與第1輥71b朝彼此離間之方向進行加勢的加勢力F3。Further, the compression coil spring 91 is provided between the spring seat 92 of the first roller 71a and the spring seat 92 of the first roller 71b in a compressed state. As a result, the first roller 71a is biased upward, and the first roller 71b is biased downward, that is, the biasing force F3 that increases the direction in which the first roller 71a and the first roller 71b are displaced from each other.
藉由此種構成之調整手段9,即使例如空間70被過於減壓、產生過剩之壓接力F1,加勢力F3仍依抵消其過剩份的方式作用。藉此,可確實地防止過剩地擠壓積層片40、非本意地壓潰該積層片40而造成變形的情形。With the adjustment means 9 of such a configuration, even if, for example, the space 70 is excessively decompressed and an excessive pressure contact force F1 is generated, the force F3 acts in such a manner as to offset the excess. Thereby, it is possible to surely prevent the laminate sheet 40 from being excessively pressed, and the laminate sheet 40 is unintentionally crushed to cause deformation.
圖7為顯示本發明之積層片製造裝置之第3實施形態的概略側面圖。Fig. 7 is a schematic side view showing a third embodiment of the laminated sheet manufacturing apparatus of the present invention.
以下,參照該圖說明本發明之積層片製造裝置、積層片之製造方法及積層片之第3實施形態,但以與上述實施形態間之相異點為中心進行說明,同樣事項則省略其說明。In the following, the third embodiment of the laminated sheet manufacturing apparatus, the laminated sheet manufacturing method, and the laminated sheet of the present invention will be described with reference to the drawings, but the description will be focused on the differences from the above-described embodiments, and the description of the same matters will be omitted. .
本實施形態係除了調整手段之構成相異之外,其餘與上述第2實施形態相同。This embodiment is the same as the second embodiment except that the configuration of the adjustment means is different.
圖7所示之積層片製造裝置30B的調整手段9,係具有:檢測空間70內之壓力的壓力感應器(檢測部)93;與使相鄰接之輥彼此、例如第1輥71a、71b彼此或第2輥72a、72b彼此朝接近/離間之方向移動的移動機構94。The adjusting means 9 of the laminated sheet manufacturing apparatus 30B shown in Fig. 7 has a pressure sensor (detecting portion) 93 for detecting the pressure in the space 70, and the adjacent rollers, for example, the first rollers 71a, 71b. The moving mechanism 94 that moves toward each other in the approaching/distance direction of each other or the second rollers 72a and 72b.
壓力感應器93係設置於空間70內。作為該壓力感應器93,例如可使用構成為將對隔膜(光闌)所施加之壓力依膜變形之形式進行檢測的構成者。The pressure sensor 93 is disposed within the space 70. As the pressure sensor 93, for example, a configuration in which the pressure applied to the diaphragm (the diaphragm) is deformed in accordance with the film can be used.
移動機構94係具有汽缸95、使汽缸95作動之泵96、設於汽缸95與泵96之間的電磁閥97、具有控制泵96與電磁閥97之作動之機能的控制部98。The moving mechanism 94 includes a cylinder 95, a pump 96 for actuating the cylinder 95, a solenoid valve 97 provided between the cylinder 95 and the pump 96, and a control unit 98 having a function of controlling the operation of the pump 96 and the solenoid valve 97.
汽缸95係連結於第1輥71b(72b),可使該第1輥71b(72b)於上下方向、亦即對第1輥71a(72a)進行接近/離間之方向移動。又,第1輥71a(72a)係其位置固定。The cylinder 95 is coupled to the first roller 71b (72b), and the first roller 71b (72b) can be moved in the vertical direction, that is, in the direction in which the first roller 71a (72a) approaches/disengages. Further, the first roller 71a (72a) is fixed in position.
此種構成之調整手段9可根據由控制部98所得之壓力感應器93的檢測結果,切換電磁閥97,藉由泵96之作動調整第1輥71b(72b)的位置。藉此,即使例如空間70被過度減壓、產生過剩之壓接力F1,仍可依抵消該過剩份之方式將第1輥71b(72b)之位置調整至下方。藉此,可確實防止過剩地擠壓積層片40、非本意地壓潰該積層片40而變形的情況。The adjustment means 9 of such a configuration can switch the solenoid valve 97 based on the detection result of the pressure sensor 93 obtained by the control unit 98, and adjust the position of the first roller 71b (72b) by the operation of the pump 96. Thereby, even if, for example, the space 70 is excessively decompressed and an excessive pressure contact force F1 is generated, the position of the first roller 71b (72b) can be adjusted to the lower side so as to cancel the excess. Thereby, it is possible to surely prevent the laminated sheet 40 from being excessively crushed, and the laminated sheet 40 is unintentionally crushed and deformed.
圖8為顯示本發明之積層片製造裝置之第4實施形態的概略剖面側面圖。Fig. 8 is a schematic cross-sectional side view showing a fourth embodiment of the laminated sheet manufacturing apparatus of the present invention.
以下,參照該圖說明本發明之積層片製造裝置、積層片之製造方法及積層片之第4實施形態,但以與上述實施形態間之相異點為中心進行說明,同樣事項則省略其說明。In the following, the fourth embodiment of the laminated sheet manufacturing apparatus, the laminated sheet manufacturing method, and the laminated sheet of the present invention will be described with reference to the drawings, but the description will be focused on the differences from the above-described embodiments, and the description of the same matters will be omitted. .
本實施形態係除了輥之配置相異之外,其餘與上述第1實施形態相同。This embodiment is the same as the above-described first embodiment except that the arrangement of the rolls is different.
圖7所示之積層片製造裝置30C,係於第1輥71a、71b與第2輥72a、72b之間,配置3組之第3輥73a、73b、第3輥73c、73d與第3輥73e、73f。第3輥73c、73d、73e、73f之構造係與第3輥73a、73b相同。The laminated sheet manufacturing apparatus 30C shown in Fig. 7 is disposed between the first rolls 71a and 71b and the second rolls 72a and 72b, and arranges three sets of third rolls 73a and 73b, third rolls 73c and 73d, and a third roll. 73e, 73f. The structures of the third rolls 73c, 73d, 73e, and 73f are the same as those of the third rolls 73a and 73b.
更詳細說明之,在第1輥71a之片材搬送方向下游側、第2輥72a之片材搬送方向上游側,配置3個之第3輥73a、73c、73e。More specifically, three third rollers 73a, 73c, and 73e are disposed on the downstream side in the sheet conveying direction of the first roller 71a and on the upstream side in the sheet conveying direction of the second roller 72a.
同樣地,在第1輥71b之片材搬送方向下游側、第2輥72b之片材搬送方向上游側,配置3個之第3輥73b、73d、73f。In the same manner, three third rollers 73b, 73d, and 73f are disposed on the downstream side in the sheet conveying direction of the first roller 71b and on the upstream side in the sheet conveying direction of the second roller 72b.
各輥係配置成旋轉軸彼此平行,各輥係跨設於一對之壁部61間。Each of the rolls is disposed such that the rotation axes are parallel to each other, and each of the rolls is spanned between the pair of wall portions 61.
尚且,於第1輥71a之片材搬送方向下游側、第2輥72a之上游側,雖配置著3個第3輥,但只要為3以上之奇數個即可。同樣地,於第1輥71b之片材搬送方向下游側、第2輥72b之上游側,雖配置著3個第3輥,但只要為3以上之奇數個即可。又,在第1輥71a之片材搬送方向下游側、第2輥72a之上游側,係配置著3個以上奇數個的第3輥,於第1輥71b之片材搬送方向下游側、第2輥72b之上游側,亦可僅配置一個第3輥。In addition, three third rollers are disposed on the downstream side of the first roller 71a in the sheet conveying direction and on the upstream side of the second roller 72a, but may be an odd number of three or more. In the same manner, three third rollers are disposed on the downstream side of the first roller 71b in the sheet conveying direction and on the upstream side of the second roller 72b, but may be an odd number of three or more. In addition, three or more odd-numbered third rollers are disposed on the downstream side of the first roller 71a in the sheet conveying direction and on the upstream side of the second roller 72a, and are on the downstream side of the sheet conveying direction of the first roller 71b. On the upstream side of the 2 roller 72b, only one third roller may be disposed.
第1輥、第2輥、第3輥中,相鄰接之輥彼此相接,構成筒狀體。具體而言,於纖維基材2之一面側(例如表面側),對第1輥71a之外周面,使第3輥73a之外周面直接接觸。又,使第3輥73a之外周面與第3輥73c之外周面經由樹脂層3而接觸。再者,使第3輥73c之外周面與第3輥73e之外周面直接接觸。而且,使第3輥73e之外周面與第2輥72a之外周面經由樹脂層3’接觸。Among the first roller, the second roller, and the third roller, adjacent rollers are in contact with each other to form a tubular body. Specifically, on the outer surface side (for example, the surface side) of the fiber base material 2, the outer peripheral surface of the first roll 71a is brought into direct contact with the outer peripheral surface of the third roll 73a. Moreover, the outer peripheral surface of the third roller 73a and the outer peripheral surface of the third roller 73c are brought into contact via the resin layer 3. Further, the outer circumferential surface of the third roller 73c is brought into direct contact with the outer circumferential surface of the third roller 73e. Further, the outer circumferential surface of the third roller 73e and the outer circumferential surface of the second roller 72a are brought into contact via the resin layer 3'.
同樣地,於纖維基材2之另一面側(例如背面側),對第1輥71b之外周面,使第3輥73b之外周面直接接觸。又,使第3輥73b之外周面與第3輥73d之外周面經由樹脂層4而接觸。再者,使第3輥73d之外周面與第3輥73f之外周面直接接觸。而且,使第3輥73f之外周面與第2輥72b之外周面經由樹脂層4’接觸。Similarly, on the other surface side (for example, the back side) of the fiber base material 2, the outer peripheral surface of the third roll 73b is brought into direct contact with the outer peripheral surface of the first roll 71b. Moreover, the outer peripheral surface of the third roller 73b and the outer peripheral surface of the third roller 73d are brought into contact via the resin layer 4. Further, the outer circumferential surface of the third roller 73d is brought into direct contact with the outer circumferential surface of the third roller 73f. Further, the outer circumferential surface of the third roller 73f and the outer circumferential surface of the second roller 72b are brought into contact via the resin layer 4'.
然後,藉由第1輥、第2輥、第3輥包圍形成一空間70,並藉減壓手段8形成被減壓的空間70。Then, a space 70 is formed by the first roller, the second roller, and the third roller, and the decompressed space 70 is formed by the decompression means 8.
藉由如此配置輥,可製造除了第1樹脂層3、第2樹脂層4之外,積層了與第1樹脂層3組成相異(或相同)之第1樹脂層3’及與第2樹脂層4組成相異(或相同)之第2樹脂層4’的積層片40。By arranging the rolls in this manner, the first resin layer 3' and the second resin which are different in composition (or the same) as the first resin layer 3 except for the first resin layer 3 and the second resin layer 4 can be produced. The layer 4 constitutes a laminated sheet 40 of the second (or the same) second resin layer 4'.
尚且,於積層片製造裝置30C中,係在配置於基材2一面側之相鄰接的第3輥間、以及配置於基材2之上述一面側之第2輥與鄰接於該第2輥之第3輥之間的至少2處之供給 處中,由任一供給處,將片材(例如第1樹脂層3或第2樹脂層4)供給至上述空間70內,並由與供給片材之上述供給處相異的上述供給處,將第二片材(例如第1樹脂層3’或第2樹脂層4’)供給至上述空間內。In the laminated sheet manufacturing apparatus 30C, the third roller disposed adjacent to one surface of the substrate 2 and the second roller disposed on the one surface side of the substrate 2 are adjacent to the second roller. Supply of at least 2 places between the 3rd rolls In any of the places, a sheet (for example, the first resin layer 3 or the second resin layer 4) is supplied into the space 70, and is supplied from the supply portion different from the supply portion of the supply sheet. The second sheet (for example, the first resin layer 3' or the second resin layer 4') is supplied into the space.
具體而言,第1樹脂層3係由第3輥73a與第3輥73c之間供給至空間70內。第1樹脂層3’係由第2輥72a與第3輥73e之間供給至空間70內。第2樹脂層4係由第3輥73b與第3輥73d之間供給至空間70內。第2樹脂層4’係由第2輥72b與第3輥73f之間供給至空間70內。Specifically, the first resin layer 3 is supplied into the space 70 between the third roller 73a and the third roller 73c. The first resin layer 3' is supplied into the space 70 between the second roller 72a and the third roller 73e. The second resin layer 4 is supplied into the space 70 between the third roller 73b and the third roller 73d. The second resin layer 4' is supplied into the space 70 between the second roller 72b and the third roller 73f.
任一樹脂層均為B階段狀態。Any of the resin layers is in a B-stage state.
尚且,本實施形態中,亦可採用第2實施形態、第3實施形態的調整手段。Further, in the present embodiment, the adjustment means of the second embodiment and the third embodiment may be employed.
再者,樹脂層4’、樹脂層3’之與片材搬送方向呈正交之方向的寬度尺寸,可較基材2之寬度尺寸大或小。Further, the width dimension of the resin layer 4' and the resin layer 3' in the direction orthogonal to the sheet conveying direction can be larger or smaller than the width dimension of the substrate 2.
另外,本實施形態中,雖與上述實施形態同樣地,作成使樹脂層3、4之沿著片材搬送方向之端部彼此被壓黏(熔融接合),基材2、樹脂層3、4被內包的構成,但亦可作成使樹脂層4’、樹脂層3’之沿著片材搬送方向之端部彼此被壓黏(熔融接合),基材2、樹脂層3、4被內包的構成。In the same manner as in the above-described embodiment, the end portions of the resin layers 3 and 4 along the sheet conveying direction are pressure-bonded (melt-bonded) to each other, and the base material 2 and the resin layers 3 and 4 are formed. The inside of the resin layer 4' and the resin layer 3' are bonded to each other along the sheet conveying direction (melt bonding), and the base material 2 and the resin layers 3 and 4 are inside. The composition of the package.
另外,與上述各實施形態同樣地,藉由減壓手段8吸引由空間70被送出之積層片40之纖維基材2內部的氣體,進行樹脂層3、4對纖維基材2的含浸。In the same manner as in the above-described embodiments, the gas inside the fiber base material 2 of the laminated sheet 40 sent out from the space 70 is sucked by the pressure reducing means 8, and the resin layers 3 and 4 are impregnated into the fiber base material 2.
根據此種第4實施形態,除了可發揮與第1實施形態相同的效果,亦可發揮以下效果。According to the fourth embodiment, the same effects as those of the first embodiment can be exhibited, and the following effects can be exhibited.
本實施形態中,係藉由依包圍一空間70之方式配置輥。藉此,可使欲減壓之空間作為一個。In the present embodiment, the rollers are arranged in such a manner as to surround a space 70. Thereby, the space to be decompressed can be made one.
另外,本實施形態中,可一次地將複數之樹脂層3、3’、4、4’及纖維基材2藉第2輥72a、72b進行壓黏。藉此,防止複數次地藉輥對纖維基材2進行加壓,而可防止纖維基材2產生變形。Further, in the present embodiment, the plurality of resin layers 3, 3', 4, 4' and the fiber base material 2 can be pressure-bonded by the second rolls 72a and 72b at a time. Thereby, the fiber substrate 2 is prevented from being pressed by the plurality of rollers by a plurality of times, and deformation of the fiber base material 2 can be prevented.
圖9為顯示本發明之積層片製造裝置之第5實施形態的概略剖面側面圖。Fig. 9 is a schematic cross-sectional side view showing a fifth embodiment of the laminated sheet manufacturing apparatus of the present invention.
以下,參照該圖說明本發明之積層片製造裝置、積層片之製造方法及積層片之第5實施形態,但以與上述實施形態間之相異點為中心進行說明,同樣事項則省略其說明。In the following, the fifth embodiment of the laminated sheet manufacturing apparatus, the laminated sheet manufacturing method, and the laminated sheet of the present invention will be described with reference to the drawings, but the description will be focused on the differences from the above-described embodiments, and the description of the same matters will be omitted. .
本實施形態係除了輥之配置相異之外,其餘與上述第1實施形態相同。This embodiment is the same as the above-described first embodiment except that the arrangement of the rolls is different.
圖9所示之積層片製造裝置30D,係於第1實施形態之積層片製造裝置中,加入了2組之第4輥74a、74b與第5輥75a、75b的裝置。The laminated sheet manufacturing apparatus 30D shown in Fig. 9 is a device in which the fourth rolls 74a and 74b and the fifth rolls 75a and 75b of the two sets are added to the laminated sheet manufacturing apparatus of the first embodiment.
第4輥74a、74b係配置於第2輥72a、72b之片材搬送方向下游側,於第4輥74a、74b間,供給來自第2輥72a、72b的積層片(纖維基材2、第1樹脂層3、第2樹脂層4之 積層體)。第4輥74a、74b係挾持上述積層片而相對向配置。The fourth rolls 74a and 74b are disposed on the downstream side of the second rolls 72a and 72b in the sheet conveyance direction, and the laminated sheets from the second rolls 72a and 72b are supplied between the fourth rolls 74a and 74b (fiber base 2, 1 resin layer 3, second resin layer 4 Laminated body). The fourth rollers 74a and 74b are disposed to face each other while sandwiching the laminated sheets.
第4輥74a、74b、第5輥75a、75b之構造係與第1輥71a、71b相同。其中,第4輥74a、74b係與第2輥同樣地較佳為加熱輥。The structures of the fourth rolls 74a and 74b and the fifth rolls 75a and 75b are the same as those of the first rolls 71a and 71b. Among them, the fourth rolls 74a and 74b are preferably heated rolls similarly to the second rolls.
第5輥75a、75b係挾持由第2輥72a、72b所送出之片材而配置。該第5輥75a、75b係配置於第2輥72a、72b之片材搬送方向下游側,並位於第4輥74a、74b之片材搬送方向上游側。The fifth rollers 75a and 75b are arranged to hold the sheets fed by the second rollers 72a and 72b. The fifth rollers 75a and 75b are disposed on the downstream side in the sheet conveying direction of the second rollers 72a and 72b, and are located on the upstream side in the sheet conveying direction of the fourth rollers 74a and 74b.
第1輥~第5輥係跨設於上述一對之壁部61間,旋轉軸彼此平行。第5輥75a之外周面係與第2輥72a之外周面直接接觸。又,第5輥75a之外周面係經由樹脂層3’間接地與第4輥74a接觸。同樣地,第5輥75b之外周面係與第2輥72b之外周面直接接觸。又,第5輥75b之外周面係經由樹脂層4’間接地與第4輥74b接觸。藉此,由第2輥72a、72b、第5輥75a、75b、第4輥74a、74b構成筒狀體,形成由此等輥所包圍的第二空間77。而且,於壁部形成有連通至空間77的開口613。於該開口613連接著減壓手段8之配管,經由配管藉泵吸引第二空間77內的氣體,可對第二空間77內進行減壓。The first to fifth rolls are spanned between the pair of wall portions 61, and the rotation axes are parallel to each other. The outer peripheral surface of the fifth roller 75a is in direct contact with the outer peripheral surface of the second roller 72a. Further, the outer peripheral surface of the fifth roller 75a is in contact with the fourth roller 74a indirectly via the resin layer 3'. Similarly, the outer circumferential surface of the fifth roller 75b is in direct contact with the outer circumferential surface of the second roller 72b. Further, the outer peripheral surface of the fifth roller 75b is in contact with the fourth roller 74b indirectly via the resin layer 4'. Thereby, the second rolls 72a and 72b, the fifth rolls 75a and 75b, and the fourth rolls 74a and 74b constitute a tubular body, and the second space 77 surrounded by the rolls is formed. Further, an opening 613 that communicates with the space 77 is formed in the wall portion. The pipe of the decompression means 8 is connected to the opening 613, and the gas in the second space 77 is sucked by the pump through the pipe to decompress the inside of the second space 77.
本實施形態中,減壓手段可僅對由輥所包圍之空間(空間70、77)進行減壓,而其他區域不減壓。In the present embodiment, the decompression means can decompress only the space (spaces 70, 77) surrounded by the rolls, and the other areas are not depressurized.
亦即,以第1輥71a、71b作為邊界,在第1輥71a、71b 之片材搬送方向上游側的區域成為大氣壓以上(本實施形態中為大氣壓)。That is, the first rolls 71a and 71b are bordered by the first rolls 71a and 71b. The region on the upstream side in the sheet conveying direction is equal to or higher than atmospheric pressure (atmospheric pressure in the present embodiment).
另外,以第4輥74a、74b作為邊界,在第4輥74a、74b之片材搬送方向下游側的區域成為大氣壓以上(本實施形態中為大氣壓)。In addition, in the region on the downstream side in the sheet conveying direction of the fourth rollers 74a and 74b, the fourth roller 74a and 74b are at a pressure equal to or higher than atmospheric pressure (in the present embodiment, atmospheric pressure).
使用此種製造裝置30D,可如下述般製造積層片。With such a manufacturing apparatus 30D, a laminated sheet can be manufactured as follows.
首先,藉減壓手段吸引空間70、77內之氣體(空氣),對空間70、77內進行減壓。First, the gas (air) in the spaces 70 and 77 is sucked by the decompression means, and the inside of the spaces 70 and 77 is decompressed.
接著,與上述實施形態同樣地,於上述空間70內在纖維基材2表面側積層第1樹脂層3,於背面側積層第2樹脂層4。其後,藉由第2輥72a、72b,將纖維基材2、第1樹脂層3、第2樹脂層4壓黏。由第2輥72a、72b所送出之積層片被供給至空間77內。另一方面,由第5輥75a與第4輥74a之間,朝向上述空間77供給樹脂層3’。Then, similarly to the above-described embodiment, the first resin layer 3 is laminated on the surface side of the fiber base material 2 in the space 70, and the second resin layer 4 is laminated on the back surface side. Thereafter, the fiber base material 2, the first resin layer 3, and the second resin layer 4 are pressure-bonded by the second rolls 72a and 72b. The laminated sheets fed by the second rolls 72a and 72b are supplied into the space 77. On the other hand, the resin layer 3' is supplied to the space 77 between the fifth roller 75a and the fourth roller 74a.
又,由第5輥75b與第4輥74b之間,朝向上述空間77供給樹脂層4’。Further, between the fifth roller 75b and the fourth roller 74b, the resin layer 4' is supplied toward the space 77.
樹脂層3’係供給至樹脂層3上,樹脂層4’係供給至樹脂層4上。The resin layer 3' is supplied onto the resin layer 3, and the resin layer 4' is supplied onto the resin layer 4.
而且,由樹脂層4’、樹脂層4、纖維基材2、樹脂層3、樹脂層3’所構成的積層片,係供給至第4輥74a、74b之間,藉第4輥74a、74b進行壓黏。此時,藉由第4輥74a、74b,使由樹脂層4’、樹脂層4、纖維基材2、樹脂層3、樹脂層 3’所構成的積層片進行加熱,進而進行樹脂層3、4對纖維基材2的含浸。Further, the laminated sheet composed of the resin layer 4', the resin layer 4, the fibrous base material 2, the resin layer 3, and the resin layer 3' is supplied between the fourth rolls 74a and 74b, and the fourth rolls 74a and 74b are used. Pressure bonding. At this time, the resin layer 4', the resin layer 4, the fiber base material 2, the resin layer 3, and the resin layer are formed by the fourth rolls 74a and 74b. The laminated sheet composed of 3' is heated, and the resin layers 3 and 4 are impregnated into the fibrous base material 2.
其後,藉由第4輥74a、74b,上述積層片被送出至空間77之外部(大氣壓以上的環境(本實施形態中為大氣壓環境下))。Thereafter, the laminated sheets are sent out to the outside of the space 77 by the fourth rolls 74a and 74b (an environment of atmospheric pressure or higher (in the present embodiment, in an atmospheric pressure environment)).
尚且,本實施形態中,亦可採用第2實施形態、第3實施形態的調整手段。調整手段可設置成調整第4輥74a、74b的壓黏力,亦可設置成調整第2輥72a、72b之壓黏力。Further, in the present embodiment, the adjustment means of the second embodiment and the third embodiment may be employed. The adjustment means may be provided to adjust the pressure-adhesive force of the fourth rollers 74a, 74b, or may be provided to adjust the pressure-adhesive force of the second rollers 72a, 72b.
另外,與上述各實施形態同樣地,藉由減壓手段8吸引由空間70被送出之積層片之纖維基材2內部的氣體,進行樹脂層3、4對纖維基材2的含浸。具體而言,本實施形態中,由空間70被送出至第二空間77之積層片,係一邊藉由減壓手段8吸引纖維基材2內部的氣體,由輥74a、74b所挾持,進行樹脂3、4對纖維基材2的含浸。進而,藉減壓手段8吸引由第二空間77被送出至外部之積層片40的纖維基材2內部的氣體,進一步進行樹脂層3、4對纖維基材2的含浸。In the same manner as in the above-described embodiments, the gas inside the fiber base material 2 of the laminated sheet fed from the space 70 is sucked by the pressure reducing means 8, and the resin layers 3 and 4 are impregnated into the fiber base material 2. Specifically, in the present embodiment, the laminated sheet which is sent out to the second space 77 by the space 70 is sucked by the rollers 74a and 74b while the gas inside the fibrous base material 2 is sucked by the decompression means 8 to carry out the resin. 3, 4 impregnation of the fibrous substrate 2. Further, the gas inside the fiber base material 2 which is sent out to the outer laminated sheet 40 by the second space 77 is sucked by the decompression means 8, and the impregnation of the resin substrates 3, 4 with the fiber base material 2 is further performed.
根據此種第5實施形態,除了可發揮與第1實施形態相同的效果,亦可發揮以下效果。According to the fifth embodiment, the same effects as those of the first embodiment can be exhibited, and the following effects can be exhibited.
藉由積層片製造裝置30D,可依各層之每次積層進行壓黏,藉此,可得到該各層之壓黏狀態牢固的積層片40。By the laminated sheet manufacturing apparatus 30D, it is possible to press-bond each layer of each layer, whereby the laminated sheet 40 in which the respective layers are firmly pressed can be obtained.
另外,本實施形態中,係藉由第2輥72a、72b壓黏樹脂層4、纖維基材2、樹脂層3的積層體(第一段壓黏),藉第4 輥74a、74b壓黏由樹脂層4’、樹脂層4、纖維基材2、樹脂層3、樹脂層4’所構成的積層片(第二段壓黏)。因此,可改變第一段之壓黏力與第二段之壓黏力,可得到所需之壓黏狀態的積層片。Further, in the present embodiment, the laminated body (the first stage is pressed) of the resin layer 4, the fibrous base material 2, and the resin layer 3 is pressed by the second rolls 72a and 72b, and the fourth step is applied. The rolls 74a and 74b are pressure-bonded to the laminated sheet (second stage pressure-bonding) composed of the resin layer 4', the resin layer 4, the fiber base material 2, the resin layer 3, and the resin layer 4'. Therefore, the pressure-adhesive force of the first stage and the pressure-bonding force of the second stage can be changed to obtain a laminated sheet of a desired pressure-bonding state.
再者,本實施形態中,係藉由輥之配置,複數形成欲減壓空間70、77,而可使各空間70、77之體積成為較小。因此,可迅速地對各空間70、77內進行減壓。Further, in the present embodiment, the spaces to be decompressed 70, 77 are formed in plural by the arrangement of the rolls, and the volume of each of the spaces 70, 77 can be made small. Therefore, the pressure in each of the spaces 70 and 77 can be quickly reduced.
尚且,樹脂層4’、樹脂層3’之與片材搬送方向呈正交之方向的寬度尺寸,可較基材2之寬度尺寸大或小。Further, the width dimension of the resin layer 4' and the resin layer 3' in the direction orthogonal to the sheet conveying direction can be larger or smaller than the width dimension of the substrate 2.
另外,本實施形態中,雖與上述實施形態同樣地,作成使樹脂層3、4之沿著片材搬送方向之端部彼此被壓黏(熔融接合),基材2、樹脂層3、4被內包的構成,但亦可作成使樹脂層4’、樹脂層3’之沿著片材搬送方向之端部彼此被壓黏(熔融接合),形成接合部,基材2、樹脂層3、4被內包的構成。In the same manner as in the above-described embodiment, the end portions of the resin layers 3 and 4 along the sheet conveying direction are pressure-bonded (melt-bonded) to each other, and the base material 2 and the resin layers 3 and 4 are formed. The inside of the resin layer 4' and the resin layer 3' are pressure-bonded (fused-bonded) to each other along the sheet conveying direction to form a joint portion, and the base material 2 and the resin layer 3 are formed. 4 is composed of inner package.
以上雖針對圖示之實施形態說明了本發明之積層片製造裝置、積層片之製造方法及積層片,但本發明並不限定於此,積層片製造裝置及構成積層片之各部可與能發揮相同機能的任意構成者置換。又,亦可附加任意之構成物。Although the laminated sheet manufacturing apparatus, the laminated sheet manufacturing method, and the laminated sheet of the present invention have been described above with reference to the embodiments shown in the drawings, the present invention is not limited thereto, and the laminated sheet manufacturing apparatus and the respective components constituting the laminated sheet can be utilized. Any component of the same function is replaced. Further, any constituent may be added.
另外,本發明之積層片製造裝置、積層片之製造方法及積層片,亦可為將上述各實施形態中之任意2個以上構成(特徵)組合者。In addition, the laminated sheet manufacturing apparatus, the laminated sheet manufacturing method, and the laminated sheet of the present invention may be a combination of any two or more of the above-described respective embodiments.
另外,積層片製造裝置係於圖1所示構成中設置1組一對之第3輥,但並不限定於此,亦可設置例如3組以上的奇數組。Further, the laminated sheet manufacturing apparatus is provided with a pair of third rollers in the configuration shown in Fig. 1. However, the present invention is not limited thereto, and for example, three or more odd arrays may be provided.
另外,各第1輥與各第2輥與各第3輥雖於圖1所示構成中其本體部之外徑彼此相異,但並不限定於此,例如本體部之外徑亦可彼此相同。Further, although the outer diameters of the main portions of the first roller, the second rollers, and the third rollers are different from each other in the configuration shown in FIG. 1, the present invention is not limited thereto. For example, the outer diameter of the main body portion may be different from each other. the same.
另外,積層片製造裝置亦可構成為對由空間所送出之積層片進行乾燥。Further, the laminated sheet manufacturing apparatus may be configured to dry the laminated sheet sent from the space.
另外,積層片雖於圖10所示之構成中,在纖維基材之兩面分別接合了樹脂層者,但並不限定於此,亦可僅於纖維基材之單面上接合樹脂層。此種構成之積層片亦可藉由積層片製造裝置進行製造。Further, in the configuration shown in FIG. 10, the laminated sheet is bonded to each other on both surfaces of the fibrous base material. However, the laminated layer is not limited thereto, and the resin layer may be bonded only to one surface of the fibrous base material. The laminated sheet of such a configuration can also be manufactured by a laminated sheet manufacturing apparatus.
另外,積層片雖於圖10所示之構成中,於纖維基材分別含浸了第1樹脂組成物及第2樹脂組成物,但並不限定於此,亦可例如為下述者。第1個例子係涵括纖維基材之厚度方向整體含浸第1樹脂組成物,並未含浸第2樹脂組成物的積層片。In addition, in the configuration shown in FIG. 10, the laminated sheet is impregnated with the first resin composition and the second resin composition in the fiber base material, but the present invention is not limited thereto, and may be, for example, the following. The first example is a laminated sheet in which the first resin composition is impregnated as a whole in the thickness direction of the fiber base material, and the second resin composition is not impregnated.
第2個例子係涵括纖維基材之厚度方向整體含浸第2樹脂組成物,未含浸第1樹脂組成物的積層片。第3個例子係於纖維基材之厚度方向的一部分含浸第1樹脂組成物,未含浸第2樹脂組成物的積層片。第4個例子係於纖維基材之厚度方向之一部分含浸第2樹脂組成物,未含浸第1樹脂組成物 的積層片。以上4個例子之積層片中,第1樹脂組成物與第2樹脂組成物係組成可彼此相異,或組成可彼此相同。而且,此種構成之積層片亦可藉由積層片製造裝置進行製造。The second example is a laminated sheet in which the second resin composition is impregnated as a whole in the thickness direction of the fiber base material, and the first resin composition is not impregnated. The third example is a laminate in which a part of the thickness direction of the fiber base material is impregnated with the first resin composition and the second resin composition is not impregnated. The fourth example is impregnated with the second resin composition in one of the thickness directions of the fibrous substrate, and is not impregnated with the first resin composition. Layered piece. In the laminated sheets of the above four examples, the composition of the first resin composition and the second resin composition may be different from each other, or the compositions may be identical to each other. Further, the laminated sheet of such a configuration can also be produced by a laminated sheet manufacturing apparatus.
另外,積層片係於圖10所示之構成中為具有纖維基材者,但並不限定於此,例如可為取代纖維基材,具有印刷佈線板等之基材。In the configuration shown in FIG. 10, the laminated sheet is a fiber substrate. However, the laminated sheet is not limited thereto. For example, it may be a substrate having a printed wiring board or the like instead of the fibrous base material.
再者,上述各實施形態中,雖製造了纖維基材2與樹脂層3、4的積層片,但並不限定於此,例如亦可於樹脂層之至少一面上積層其他樹脂層而製造積層片。再者,亦可於預浸體之至少一面上,積層樹脂層或其他預浸體而製造積層片。又,亦可於不織布之至少一面上積層樹脂層。In the above-described embodiments, the laminated sheet of the fiber base material 2 and the resin layers 3 and 4 is produced. However, the laminated sheet is not limited thereto. For example, another resin layer may be laminated on at least one surface of the resin layer to form a laminate. sheet. Further, a laminate sheet may be formed by laminating a resin layer or other prepreg on at least one side of the prepreg. Further, a resin layer may be laminated on at least one side of the non-woven fabric.
另外,本發明係根據以下構成者。Further, the present invention is based on the following constituents.
(1)一種積層片之製造裝置,係於一面側具有由固形或半固形之樹脂組成物所構成的樹脂層,將連續供給之薄板狀之支撐體的上述樹脂層,接合至薄板狀之基材之單面或兩面而製造積層片者;其特徵為具備:具有彼此相對向配置之一對壁部的殼體;架設於上述一對壁部間,外周面彼此抵接合之一對之第1輥;架設於上述一對壁部間且與上述一對之第1輥相異的位置,外周面彼此抵接合之一對之第2輥;架設於上述一對壁部間,並配置於上述一對之第1輥與上 述一對之第2輥之間,至少一對的第3輥;與形成於上述一對壁部中之至少一者上,具有朝向由上述一對壁部與上述一對之第1輥與上述一對之第2輥與上述一對之第3輥所包圍的空間開口的開口部,並由該開口部吸引上述空間內之空氣而對該空間進行減壓的減壓手段;構成為一邊於上述一對之第1輥之間送出上述基材,一邊於上述一對之第2輥之間壓黏上述基材與上述樹脂層,此時,藉上述減壓手段對上述空間進行減壓。(1) A manufacturing apparatus for a laminated sheet having a resin layer composed of a solid or semi-solid resin composition on one surface side, and bonding the resin layer of the thin-plate-shaped support continuously supplied to a thin plate-like base a laminated sheet produced by one or both sides of the material; characterized by comprising: a housing having a pair of wall portions disposed opposite to each other; and being disposed between the pair of wall portions, the outer peripheral surfaces abutting each other a roller that is disposed between the pair of wall portions and different from the pair of first rollers, wherein the outer circumferential surface abuts against the pair of second rollers; and is disposed between the pair of wall portions and disposed The first pair of the above rolls and the upper Between the pair of second rollers, at least one pair of third rollers; and at least one of the pair of wall portions having a pair of the first roller and the pair of first rollers a pair of the second roller and the opening of the space opening surrounded by the pair of third rollers, and the decompression means for decompressing the space by sucking the air in the space by the opening; The base material is fed between the pair of first rolls, and the base material and the resin layer are pressure-bonded between the pair of second rolls. At this time, the space is decompressed by the pressure reducing means. .
(2)如(1)之積層片之製造裝置,其中,使上述空間減壓時,藉由其減壓力輔助上述基材與上述樹脂層的壓黏。(2) The apparatus for producing a laminated sheet according to (1), wherein when the space is depressurized, the pressure-sensitive adhesive between the base material and the resin layer is assisted by the pressure reduction.
(3)如(1)或(2)之積層片之製造裝置,其中,上述支撐體係具有支撐上述樹脂層的支持片材,上述第3輥具有在將上述基材與上述樹脂層進行壓黏之前,由上述樹脂層剝離上述支撐片材的機能。(3) The apparatus for manufacturing a laminated sheet according to (1) or (2), wherein the support system has a support sheet supporting the resin layer, and the third roll has a pressure-sensitive adhesive layer between the base material and the resin layer. Previously, the function of the above-mentioned support sheet was peeled off by the above resin layer.
(4)如(1)至(3)中任一項之積層片之製造裝置,其中,上述積層片係於上述基材之兩面分別接合了上述樹脂層者,於上述一對之第2輥之間將上述樹脂層一次地分別壓黏於上述基材之兩面。(4) The apparatus for manufacturing a laminated sheet according to any one of (1) to (3), wherein the laminated sheet is bonded to the resin layer on both surfaces of the substrate, and the second roller of the pair The resin layer is pressure-bonded to both sides of the substrate at a time.
(5)如(1)至(4)中任一項之積層片之製造裝置,其中,上述減壓手段係具有泵、與連接該泵及上述開口部的連接管。(5) The apparatus for manufacturing a laminated sheet according to any one of (1) to (4), wherein the pressure reducing means includes a pump and a connecting pipe connecting the pump and the opening.
(6)如(1)至(5)中任一項之積層片之製造裝置,其中,進一步具備將上述空間被減壓時之上述一對之第1輥彼此的抵接 力與上述一對之第2輥彼此的抵接力分別維持一定的抵接力維持手段。(6) The apparatus for manufacturing a laminated sheet according to any one of (1) to (5), further comprising: abutting the pair of first rolls when the space is decompressed The contact force between the force and the pair of second rollers is maintained at a constant abutting force maintaining means.
(7)如(6)之積層片之製造裝置,其中,上述抵接力維持手段係具有對上述一對之第1輥彼此、上述一對之第2輥彼此朝分別離間之方向進行加勢的壓縮螺旋彈簧。(7) The apparatus for manufacturing a laminated sheet according to (6), wherein the abutting force maintaining means has a compression force for biasing the pair of first rolls and the pair of second rolls in a direction away from each other Coil spring.
(8)如(6)之積層片之製造裝置,其中,上述抵接力維持手段係具有:檢測上述空間內之壓力的檢測部;與根據該檢測部之檢測結果,使上述一對之第1輥彼此朝其等接近/離間之方向移動,並使上述一對之第2輥彼此朝其等接近/離間之方向移動的移動機構。(8) The apparatus for manufacturing a laminated sheet according to (6), wherein the abutting force maintaining means includes: a detecting unit that detects a pressure in the space; and the first one of the pair is determined based on a detection result of the detecting unit A moving mechanism in which the rollers move in the direction in which they approach/disengage, and the second pair of rollers are moved in the direction in which they approach/disengage.
(9)如(1)至(8)中任一項之積層片之製造裝置,其中,進一步具備分別介存於上述各壁間與上述各第1輥之兩端部之間、上述各壁部與上述各第2輥之兩端部之間的密封材。(9) The apparatus for manufacturing a laminated sheet according to any one of (1) to (8) further comprising: each of the walls between the respective walls and the end portions of each of the first rolls a sealing material between the portion and the end portions of each of the second rolls.
(10)一種積層片之製造方法,其特徵為,使用(1)至(9)中任一項之積層片之製造裝置製造上述積層片。(10) A method of producing a laminated sheet, characterized in that the laminated sheet is produced by using the apparatus for producing a laminated sheet according to any one of (1) to (9).
(11)一種積層片,其特徵為,使用(1)至(9)中任一項之積層片之製造裝置所製造。(11) A laminated sheet produced by the apparatus for producing a laminated sheet according to any one of (1) to (9).
(12)如(11)之積層片,其中,該積層片係於其長度方向之途中被切斷,該經切斷者成為預浸體。(12) The laminated sheet according to (11), wherein the laminated sheet is cut in the longitudinal direction thereof, and the cut sheet is a prepreg.
本申請案係主張以2011年3月30日所申請之日本專利申請案2011-076663及2012年3月22日所申請之日本專利申請案2012-065013為基礎的優先權,將其揭示內容全部取用 於此。The present application claims priority based on the Japanese Patent Application No. 2011-076663, filed on March 30, 2011, and the Japanese Patent Application No. 2012-065013, filed on March 22, 2012. Access herein.
1、1a、1b、1c、1d、1e、1f‧‧‧預浸體1, 1a, 1b, 1c, 1d, 1e, 1f‧‧‧ prepreg
2‧‧‧纖維基材2‧‧‧Fiber substrate
3、3’‧‧‧第1樹脂層3, 3'‧‧‧1st resin layer
4、4’‧‧‧第2樹脂層4, 4'‧‧‧ second resin layer
5a‧‧‧第1支撐體(片材)5a‧‧‧1st support (sheet)
5b‧‧‧第2支撐體(片材)5b‧‧‧2nd support (sheet)
6‧‧‧殼體6‧‧‧Shell
8‧‧‧減壓手段8‧‧‧Decompression
9‧‧‧調整手段9‧‧‧Adjustment means
10‧‧‧基板10‧‧‧Substrate
11‧‧‧積層體11‧‧‧Layer
12‧‧‧金屬層12‧‧‧metal layer
13‧‧‧纖維基材13‧‧‧Fiber substrate
20‧‧‧邊界20‧‧‧ border
30、30A、30B、30C、30D‧‧‧積層片製造裝置30, 30A, 30B, 30C, 30D‧‧‧ laminated sheet manufacturing equipment
31‧‧‧第1含浸部31‧‧‧1st impregnation
32‧‧‧第1非含浸部32‧‧‧1st Non-Immersion Department
40‧‧‧積層片40‧‧‧Layered film
41‧‧‧第2含浸部41‧‧‧2nd Impregnation Department
42‧‧‧第2非含浸部42‧‧‧2nd Non-Immersion Department
51‧‧‧保護片材51‧‧‧Protected sheet
61‧‧‧壁部61‧‧‧ wall
62‧‧‧密封材62‧‧‧ Sealing material
70‧‧‧空間70‧‧‧ space
71a、71b‧‧‧第1輥71a, 71b‧‧‧1st roll
72a、72b‧‧‧第2輥72a, 72b‧‧‧ second roller
73a、73b、73c、73d、73e、73f‧‧‧第3輥73a, 73b, 73c, 73d, 73e, 73f‧‧‧ third roller
74‧‧‧本體部74‧‧‧ Body Department
74a、74b‧‧‧第4輥74a, 74b‧‧‧4th roller
75‧‧‧軸75‧‧‧Axis
75a、75b‧‧‧第5輥75a, 75b‧‧‧5th roller
76‧‧‧軸承76‧‧‧ bearing
77‧‧‧第二空間77‧‧‧Second space
81‧‧‧泵81‧‧‧ pump
82‧‧‧連接管82‧‧‧Connecting tube
91‧‧‧壓縮螺旋彈簧91‧‧‧Compressed coil spring
92‧‧‧彈簧座92‧‧‧ spring seat
93‧‧‧壓力感應器(檢測部)93‧‧‧Pressure sensor (detection department)
94‧‧‧移動機構94‧‧‧Mobile agencies
95‧‧‧汽缸95‧‧‧ cylinder
96‧‧‧泵96‧‧‧ pump
97‧‧‧電磁閥97‧‧‧ solenoid valve
98‧‧‧控制部98‧‧‧Control Department
100‧‧‧半導體裝置100‧‧‧Semiconductor device
200‧‧‧多層基板200‧‧‧Multilayer substrate
201a、201b、201d、201e‧‧‧電路部201a, 201b, 201d, 201e‧‧‧ Circuit Department
202、203‧‧‧導體部202, 203‧‧‧ conductor
300‧‧‧墊部300‧‧‧Mats
400‧‧‧佈線部400‧‧‧Wiring Department
500‧‧‧半導體元件500‧‧‧Semiconductor components
501‧‧‧凸塊501‧‧‧Bumps
611‧‧‧開口部611‧‧‧ openings
612‧‧‧凹部612‧‧‧ recess
613‧‧‧開口613‧‧‧ openings
741‧‧‧外周面741‧‧‧ outer perimeter
F1‧‧‧壓黏力(抵接力)F1‧‧‧adhesive force (abutment force)
F2‧‧‧減壓力F2‧‧‧Reducing pressure
F3‧‧‧加勢力F3‧‧‧Additional forces
G‧‧‧空氣G‧‧‧Air
圖1為顯示本發明之積層片製造裝置之第1實施形態的概略剖面側面圖。Fig. 1 is a schematic cross-sectional side view showing a first embodiment of a laminated sheet manufacturing apparatus of the present invention.
圖2為圖1中之A-A線剖面圖。Figure 2 is a cross-sectional view taken along line A-A of Figure 1.
圖3為圖1中之B-B線剖面圖。Figure 3 is a cross-sectional view taken along line B-B of Figure 1.
圖4為圖1中之由一點鏈線所包圍區域[C]的擴大圖。Fig. 4 is an enlarged view of a region [C] surrounded by a one-dot chain line in Fig. 1.
圖5為圖1中之由一點鏈線所包圍區域[C]之積層片的D-D線剖面圖。Fig. 5 is a cross-sectional view taken along line D-D of the laminated sheet of the region [C] surrounded by a one-dot chain line in Fig. 1.
圖6為顯示本發明之積層片製造裝置之第2實施形態的概略側面圖。Fig. 6 is a schematic side view showing a second embodiment of the laminated sheet manufacturing apparatus of the present invention.
圖7為顯示本發明之積層片製造裝置之第3實施形態的概略側面圖。Fig. 7 is a schematic side view showing a third embodiment of the laminated sheet manufacturing apparatus of the present invention.
圖8為顯示本發明之積層片製造裝置之第4實施形態的概略剖面側面圖。Fig. 8 is a schematic cross-sectional side view showing a fourth embodiment of the laminated sheet manufacturing apparatus of the present invention.
圖9為顯示本發明之積層片製造裝置之第5實施形態的概略剖面側面圖。Fig. 9 is a schematic cross-sectional side view showing a fifth embodiment of the laminated sheet manufacturing apparatus of the present invention.
圖10為顯示本發明積層片的剖面圖。Figure 10 is a cross-sectional view showing a laminated sheet of the present invention.
圖11為顯示使用圖10所示積層片所製造之基板的剖面圖。Fig. 11 is a cross-sectional view showing a substrate produced by using the laminated sheet shown in Fig. 10.
圖12為顯示使用圖11所示基板所製造之半導體裝置的剖面圖。Figure 12 is a cross-sectional view showing a semiconductor device manufactured using the substrate shown in Figure 11.
2‧‧‧纖維基材2‧‧‧Fiber substrate
4‧‧‧第2樹脂層4‧‧‧2nd resin layer
3‧‧‧第1樹脂層3‧‧‧1st resin layer
5b‧‧‧第2支撐體(片材)5b‧‧‧2nd support (sheet)
5a‧‧‧第1支撐體(片材)5a‧‧‧1st support (sheet)
8‧‧‧減壓手段8‧‧‧Decompression
6‧‧‧殼體6‧‧‧Shell
40‧‧‧積層片40‧‧‧Layered film
30‧‧‧積層片製造裝置30‧‧‧Laminated sheet manufacturing equipment
61‧‧‧壁部61‧‧‧ wall
51‧‧‧保護片材51‧‧‧Protected sheet
71a‧‧‧第1輥71a‧‧‧1st roll
70‧‧‧空間70‧‧‧ space
72a‧‧‧第2輥72a‧‧‧2nd roller
71b‧‧‧第1輥71b‧‧‧1st roll
73a‧‧‧第3輥73a‧‧‧3rd roller
72b‧‧‧第2輥72b‧‧‧2nd roller
74‧‧‧本體部74‧‧‧ Body Department
73b‧‧‧第3輥73b‧‧‧3rd roller
741‧‧‧外周面741‧‧‧ outer perimeter
611‧‧‧開口部611‧‧‧ openings
Claims (16)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011076663 | 2011-03-30 | ||
| JP2012065013A JP5263420B2 (en) | 2011-03-30 | 2012-03-22 | Laminated sheet manufacturing apparatus, laminated sheet manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201244942A TW201244942A (en) | 2012-11-16 |
| TWI503231B true TWI503231B (en) | 2015-10-11 |
Family
ID=46930157
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101111295A TWI503231B (en) | 2011-03-30 | 2012-03-30 | Apparatus and process for producing laminated sheet |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5263420B2 (en) |
| KR (1) | KR101814234B1 (en) |
| TW (1) | TWI503231B (en) |
| WO (1) | WO2012132381A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2933089A1 (en) * | 2014-04-14 | 2015-10-21 | Jowat SE | Laminating method with grid-shaped adhesive application |
| JP7224706B1 (en) | 2022-11-14 | 2023-02-20 | 株式会社エヌ・シー・ティ | vacuum laminator |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0952286A (en) * | 1995-08-14 | 1997-02-25 | Nippon Steel Corp | Laminating apparatus and method with controlled atmosphere and pressure |
| JP2002052610A (en) * | 2000-05-30 | 2002-02-19 | Taisei Laminator Co Ltd | Laminating apparatus |
| JP2002361748A (en) * | 2001-06-05 | 2002-12-18 | Taisei Laminator Co Ltd | Laminating device |
| JP2003340952A (en) * | 2002-05-28 | 2003-12-02 | Mitsubishi Gas Chem Co Inc | A method for producing a B-stage resin composition sheet containing a fiber cloth base for additive. |
| TWI250077B (en) * | 1999-03-29 | 2006-03-01 | Kuraray Co | Metal laminate for a circuit board |
| TW200724583A (en) * | 2005-09-30 | 2007-07-01 | Sumitomo Bakelite Co | Method of manufacturing prepreg with carrier, prepreg with carrier, method of manufacturing thin double-faced board, thin double-faced board, and method of manufacturing multilayer printed wiring board |
| JP2008087342A (en) * | 2006-10-02 | 2008-04-17 | Sumitomo Bakelite Co Ltd | Laminate sheet |
-
2012
- 2012-03-22 JP JP2012065013A patent/JP5263420B2/en not_active Expired - Fee Related
- 2012-03-26 WO PCT/JP2012/002068 patent/WO2012132381A1/en not_active Ceased
- 2012-03-26 KR KR1020137028606A patent/KR101814234B1/en not_active Expired - Fee Related
- 2012-03-30 TW TW101111295A patent/TWI503231B/en not_active IP Right Cessation
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0952286A (en) * | 1995-08-14 | 1997-02-25 | Nippon Steel Corp | Laminating apparatus and method with controlled atmosphere and pressure |
| TWI250077B (en) * | 1999-03-29 | 2006-03-01 | Kuraray Co | Metal laminate for a circuit board |
| JP2002052610A (en) * | 2000-05-30 | 2002-02-19 | Taisei Laminator Co Ltd | Laminating apparatus |
| JP2002361748A (en) * | 2001-06-05 | 2002-12-18 | Taisei Laminator Co Ltd | Laminating device |
| JP2003340952A (en) * | 2002-05-28 | 2003-12-02 | Mitsubishi Gas Chem Co Inc | A method for producing a B-stage resin composition sheet containing a fiber cloth base for additive. |
| TW200724583A (en) * | 2005-09-30 | 2007-07-01 | Sumitomo Bakelite Co | Method of manufacturing prepreg with carrier, prepreg with carrier, method of manufacturing thin double-faced board, thin double-faced board, and method of manufacturing multilayer printed wiring board |
| JP2008087342A (en) * | 2006-10-02 | 2008-04-17 | Sumitomo Bakelite Co Ltd | Laminate sheet |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201244942A (en) | 2012-11-16 |
| KR20140020985A (en) | 2014-02-19 |
| WO2012132381A1 (en) | 2012-10-04 |
| JP5263420B2 (en) | 2013-08-14 |
| KR101814234B1 (en) | 2018-01-02 |
| JP2012214031A (en) | 2012-11-08 |
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|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |