TWI599786B - Conductor pattern inspection device - Google Patents
Conductor pattern inspection device Download PDFInfo
- Publication number
- TWI599786B TWI599786B TW105138409A TW105138409A TWI599786B TW I599786 B TWI599786 B TW I599786B TW 105138409 A TW105138409 A TW 105138409A TW 105138409 A TW105138409 A TW 105138409A TW I599786 B TWI599786 B TW I599786B
- Authority
- TW
- Taiwan
- Prior art keywords
- signal
- conductor pattern
- inspection
- detection signal
- electrode
- Prior art date
Links
- 239000004020 conductor Substances 0.000 title claims description 135
- 238000007689 inspection Methods 0.000 title claims description 90
- 238000001514 detection method Methods 0.000 claims description 84
- 230000007547 defect Effects 0.000 claims description 34
- 238000012545 processing Methods 0.000 claims description 22
- 244000126211 Hericium coralloides Species 0.000 claims description 10
- 230000007246 mechanism Effects 0.000 claims description 7
- 238000012360 testing method Methods 0.000 claims description 4
- 230000003321 amplification Effects 0.000 description 12
- 238000003199 nucleic acid amplification method Methods 0.000 description 12
- 230000015654 memory Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000010248 power generation Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 210000001520 comb Anatomy 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
- G01R31/2812—Checking for open circuits or shorts, e.g. solder bridges; Testing conductivity, resistivity or impedance
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
- G01R31/2836—Fault-finding or characterising
- G01R31/2839—Fault-finding or characterising using signal generators, power supplies or circuit analysers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/312—Contactless testing by capacitive methods
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015250121A JP6014950B1 (ja) | 2015-12-22 | 2015-12-22 | 導電体パターン検査装置 |
| JP2015-250121 | 2015-12-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TWI599786B true TWI599786B (zh) | 2017-09-21 |
| TW201812331A TW201812331A (zh) | 2018-04-01 |
Family
ID=57197568
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW105138409A TWI599786B (zh) | 2015-12-22 | 2016-11-23 | Conductor pattern inspection device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6014950B1 (ja) |
| KR (1) | KR101763535B1 (ja) |
| CN (1) | CN107064706B (ja) |
| TW (1) | TWI599786B (ja) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018169338A (ja) * | 2017-03-30 | 2018-11-01 | 大日本印刷株式会社 | 検査装置、検査方法、および、検査装置用のプログラム |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1645609A (zh) * | 2004-01-20 | 2005-07-27 | 三星电子株式会社 | 半导体器件的测试图案及利用其的测试方法 |
| JP2008026320A (ja) * | 2006-07-20 | 2008-02-07 | Microinspection Inc | 非接触シングルサイドプローブ及び、これを用いたパターン電極の断線・短絡検査装置及びその方法 |
| JP2008076187A (ja) * | 2006-09-20 | 2008-04-03 | Oht Inc | 回路パターン検査装置 |
| TW200819762A (en) * | 2006-10-19 | 2008-05-01 | Tokyo Cathode Lab | Pattern inspection device |
| TW201132996A (en) * | 2009-08-17 | 2011-10-01 | Fcom Corp | Detecting device of conductive pattern and detecting method |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001221824A (ja) * | 2000-02-10 | 2001-08-17 | Oht Inc | 検査装置及び検査方法、検査ユニット |
| JP2004184385A (ja) * | 2002-11-30 | 2004-07-02 | Oht Inc | 回路パターン検査装置及びパターン検査方法 |
| CN1720458B (zh) * | 2002-11-30 | 2010-06-23 | Oht株式会社 | 电路图案检查装置及电路图案检查方法 |
| JP2004264272A (ja) * | 2003-02-28 | 2004-09-24 | Oht Inc | 導電体検査装置及び導電体検査方法 |
| CN1566975A (zh) * | 2003-06-23 | 2005-01-19 | Oht株式会社 | 检查装置和检查方法 |
| JP4730904B2 (ja) * | 2006-04-28 | 2011-07-20 | 日本電産リード株式会社 | 基板検査装置及び基板検査方法 |
| JP5387818B2 (ja) * | 2008-12-11 | 2014-01-15 | オー・エイチ・ティー株式会社 | 回路パターン検査装置 |
| JP4644745B2 (ja) * | 2009-08-04 | 2011-03-02 | オー・エイチ・ティー株式会社 | 回路パターン検査装置 |
| JP5305111B2 (ja) * | 2011-01-21 | 2013-10-02 | オー・エイチ・ティー株式会社 | 回路パターン検査装置 |
| JP2013210247A (ja) * | 2012-03-30 | 2013-10-10 | Nidec-Read Corp | 絶縁検査装置及び絶縁検査方法 |
| JP5433876B1 (ja) | 2013-03-26 | 2014-03-05 | オー・エイチ・ティー株式会社 | 回路パターン検査装置 |
-
2015
- 2015-12-22 JP JP2015250121A patent/JP6014950B1/ja not_active Expired - Fee Related
-
2016
- 2016-11-22 KR KR1020160155702A patent/KR101763535B1/ko not_active Expired - Fee Related
- 2016-11-23 TW TW105138409A patent/TWI599786B/zh not_active IP Right Cessation
- 2016-11-25 CN CN201611060604.0A patent/CN107064706B/zh not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1645609A (zh) * | 2004-01-20 | 2005-07-27 | 三星电子株式会社 | 半导体器件的测试图案及利用其的测试方法 |
| JP2008026320A (ja) * | 2006-07-20 | 2008-02-07 | Microinspection Inc | 非接触シングルサイドプローブ及び、これを用いたパターン電極の断線・短絡検査装置及びその方法 |
| JP2008076187A (ja) * | 2006-09-20 | 2008-04-03 | Oht Inc | 回路パターン検査装置 |
| TW200819762A (en) * | 2006-10-19 | 2008-05-01 | Tokyo Cathode Lab | Pattern inspection device |
| TW201132996A (en) * | 2009-08-17 | 2011-10-01 | Fcom Corp | Detecting device of conductive pattern and detecting method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6014950B1 (ja) | 2016-10-26 |
| CN107064706A (zh) | 2017-08-18 |
| JP2017116331A (ja) | 2017-06-29 |
| KR20170074748A (ko) | 2017-06-30 |
| CN107064706B (zh) | 2019-07-30 |
| KR101763535B1 (ko) | 2017-07-31 |
| TW201812331A (zh) | 2018-04-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |