TWI590316B - Substrate processing apparatus - Google Patents

Description

Substrate processing device

The present invention discloses a substrate processing apparatus that supplies a processing liquid to a back surface of a substrate such as a glass substrate for a liquid crystal display device.

A coating apparatus described in Patent Document 1 is known as a substrate processing apparatus that supplies a processing liquid to the back surface of a substrate. The coating device applies a treatment liquid to the back surface of the substrate via a coating roller that abuts against the back surface of the substrate conveyed in the horizontal direction. Moreover, it is a structure which supplies an adhesion prevention liquid to the surface of a board|substrate.

Further, in the conventional coating apparatus, the treatment liquid and the adhesion prevention liquid are separated and recovered, and the recovered treatment liquid is circulated and supplied to the coating roller via the storage tank.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2013-146727 (for example, paragraph 0056, FIG. 1)

As described above, in the conventional coating apparatus, the treatment liquid is separated from the adhesion prevention liquid to be recovered, but it is difficult to completely separate and collect it. Therefore, the adhesion preventing liquid is mixed into the storage tank for recovering the treatment liquid. When the amount of the adhesion preventing liquid phase to be mixed with the treatment liquid is increased, the concentration of the treatment liquid is lowered, and the desired effect of the treatment liquid cannot be obtained. Therefore, in order to maintain the effect of the treatment liquid, the following measures are taken into consideration: all the treatment liquids stored in the storage tank are periodically discarded, and then the new liquid of the treatment liquid is supplied to the storage tank.

However, as described above, when all the treatment liquids are discarded (all discarded), there is a problem that the amount of use of the treatment liquid increases.

In view of the above, an object of the present invention is to provide a substrate processing apparatus capable of reducing the amount of use of a processing liquid.

A first aspect of the invention (substrate processing apparatus) includes: a conveying unit that conveys a substrate in a direction along a surface thereof; a processing tank that forms a processing space therein; and a back surface supply unit that is disposed in the processing tank by the conveying unit The surface of the substrate to be transported is supplied with a processing liquid; the surface supply unit supplies an adhesion preventing liquid of a different type of liquid to the surface of the substrate conveyed by the conveying unit in the processing tank; the storage unit stores the processing liquid; The processing liquid is sent from the storage unit to the back surface supply unit, and the collection unit is disposed in the processing tank and collects the processing liquid supplied from the back surface supply unit to the back surface of the substrate. The return unit returns the processing liquid collected by the recovery unit to the storage unit. The detecting unit detects the degree of mixing of the adhesion preventing liquid mixed into the processing liquid stored in the storage unit, the replenishing unit replenishes the processing liquid with the storage unit, and the waste liquid portion and the waste storage unit are mixed with the adhesion preventing liquid. The treatment liquid and the control unit discard the adhesion from the storage unit based on the detection result of the detection unit. The treatment liquid of the liquid, and the treatment portion is supplemented with the treatment liquid by the replenishing portion.

According to a second aspect of the present invention, in the first aspect of the invention, the detecting unit is a specific resistance meter that detects a specific resistance of the processing liquid stored in the storage unit.

According to a third aspect of the present invention, in the first aspect of the invention, the back surface supply unit includes a cylindrical supply roller that abuts against a cylindrical surface of the substrate conveyed by the transport unit; The nozzle for the back surface discharges the processing liquid toward the cylindrical surface of the supply roller.

According to a fourth aspect of the invention, the surface supply unit includes a plurality of supply tubes arranged in a transport direction of the substrate, and the supply tube has a plurality of width directions arranged orthogonal to the transport direction. A spray outlet.

According to a fourth aspect of the invention, the conveying unit has a plurality of conveying rollers provided along the conveying direction, and at least the conveying roller provided on the downstream side in the conveying direction of the supply roller has the width direction. A plurality of intermediate rolls are provided and abutted against the back surface of the substrate, and the discharge ports of the supply pipes are disposed at positions facing the plurality of intermediate rolls.

According to a sixth aspect of the present invention, in the first aspect of the invention, the conveying unit supports and transports the substrate in a horizontal posture, and the collecting unit has an opening disposed below the substrate conveyed by the conveying unit and having an opening at the upper side. Barrel members.

According to the invention of any one of the first aspect to the sixth aspect, the amount of the treatment liquid used can be reduced.

2‧‧‧ Washing Department

3‧‧‧Backside Processing Department

4‧‧‧Decontamination Department

5‧‧‧Control Department

6‧‧‧Transportation Department

11‧‧‧ Surface Supply Department

12‧‧‧Back Supply Department

21‧‧‧Washing tank

22, 32, 42‧‧‧

23, 33, 43 ‧ ‧ moving out

24, 34‧‧‧ upper nozzle

25‧‧‧ lower nozzle

31‧‧‧Back processing tank

35, 92‧‧‧Supply source

36‧‧‧Supply piping

37, 74, 83, 85, 94, 97‧‧‧ valves

41‧‧‧Removal tank

44‧‧‧Air knife

45‧‧‧Air knife

61‧‧‧Transport roller

71‧‧‧Air nozzle

72‧‧‧Air supply source

73, 77, 93‧‧‧ supply piping

75‧‧‧Supply roller

76‧‧‧Back nozzle

78‧‧‧ pump

81‧‧‧ barrel components

82‧‧‧Return to piping

84, 86, 96‧‧‧ waste pipe

87‧‧‧ Waste Recycling Department

90‧‧‧ treatment solution

91‧‧‧ Storage Department

95‧‧‧Specific resistance meter

100‧‧‧Substrate processing unit

311‧‧‧Draining port

341‧‧‧Spray area

342‧‧‧Supply tube

343‧‧‧Nozzle head

611‧‧‧Flanged roller

612‧‧‧Intermediate roller

613‧‧‧ Roller

761‧‧‧ spout

811‧‧‧Draining port

S‧‧‧Substrate

S10~S40‧‧‧Steps

X, Y, Z‧‧ Direction

Fig. 1 is a schematic side view showing a substrate processing apparatus according to an embodiment of the present invention.

2(a) and 2(b) are a plan view and a side view showing a back surface supply portion, a barrel member, and the like.

3(a) and 3(b) are views for explaining a discharge area of the upper nozzle.

4 is a block diagram showing an electrical connection relationship with a control unit.

Fig. 5 is a flow chart showing the disposal and replenishment operation of the treatment liquid.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a schematic side view showing a substrate processing apparatus 100 according to an embodiment of the present invention. The substrate processing apparatus 100 is a device that performs processing on the substrate S that is supported by the transport unit 6 in a horizontal posture and that is transported in the Y direction along the surface thereof by the water washing unit 2, the back surface processing unit 3, and the liquid-repellent unit 4, respectively. Further, the substrate processing apparatus 100 includes a control unit 5 for collectively controlling the apparatus.

The substrate S is, for example, a rectangular glass substrate for a liquid crystal display device. In addition, the substrate S may be a glass substrate for an organic electroluminescence (EL) display device, a panel substrate for a solar cell, a glass substrate for a plasma display panel (PDP), or a mask substrate for a semiconductor manufacturing device. .

The conveying unit 6 includes a plurality of conveying rollers 61 arranged in parallel in the Y direction. The plurality of conveying rollers 61 are disposed in the washing tank 21 of the water washing unit 2 and the back of the back surface processing unit 3, respectively. The surface treatment tank 31 and the liquid removal tank 41 of the liquid removal unit 4 are provided in the liquid removal tank 41. In addition, although not shown in the figure, a plurality of conveying rollers 61 are provided on the upstream side of the washing tank 21 and the downstream side of the liquid removing tank 41, respectively.

As shown in FIGS. 3(a) and 3(b), the conveying roller 61 has a roller shaft 613, and is provided at both ends of the roller shaft 613 to support the lower surface of the end portion of the substrate S to be conveyed and to restrict the substrate S. A flanged roller 611 that is displaced in the X direction. The roller shaft 613 between the pair of flanged rollers is provided with a plurality of disc-shaped intermediate rollers 612 that support the lower surface of the substrate S to be conveyed. The roller shaft 613, the flanged roller 611, and the intermediate roller 612 are integrally rotationally driven around the axis thereof by a drive mechanism (not shown).

The water washing unit 2 performs a water washing process on the substrate S. The water washing unit 2 includes a substantially box-shaped water washing tank 21 for forming a water washing processing space inside the water washing unit 2. The inlet 22 for carrying the substrate S into the washing tank 21 is provided on the upstream side (-Y side) of the substrate S in the washing tank 21 in the conveying direction. In addition, a transfer port 23 for carrying out the substrate S from the washing tank 21 is provided on the downstream side (+Y side) of the conveyance direction of the substrate S of the washing tank 21.

On the upper side (+Z side) of the conveyance roller 61 in the washing tank 21, a plurality of upper nozzles 24 are arranged in the Y direction. Further, a plurality of lower nozzles 25 are arranged in the Y direction on the lower side (-Z side) of the conveyance roller 61 in the water washing tank 21. In the upper nozzle 24, a plurality of discharge ports (not shown) are provided in the X direction which is the width direction of the substrate S orthogonal to the Y direction of the substrate S. The upper nozzle 24 discharges a washing liquid such as pure water from the plurality of discharge ports toward the upper surface (surface) of the substrate S conveyed by the plurality of conveying rollers 61. In the lower nozzle 25, a plurality of discharge ports (not shown) are provided in the X direction. The lower nozzle 25 discharges a washing liquid such as pure water from the plurality of discharge ports toward the lower surface (back surface) of the substrate S conveyed by the plurality of conveying rollers 61.

The back surface processing unit 3 performs a desired process (for example, a cleaning process) on the back surface of the substrate S. The back surface processing unit 3 includes a substantially box-shaped back surface treatment tank 31 for forming a back surface treatment space inside the back surface treatment unit 3 . On the -Y side of the back surface treatment tank 31, a transfer port 32 that communicates with the discharge port 23 of the water washing tank 21 and that carries the substrate S into the back surface treatment tank 31 is provided. Further, a transfer port 33 for carrying out the substrate S from the back surface treatment tank 31 is provided on the +Y side of the back surface treatment tank 31.

The back surface processing unit 3 includes a back surface supply unit 12 that supplies a processing liquid such as a cleaning liquid to the back surface of the substrate S transported by the transport unit 6 in the back surface processing tank 31. The back surface supply unit 12 includes a supply roller 75, a back surface nozzle 76, a supply pipe 77, a pump 78, and the like.

The supply roller 75 is a cylindrical member. As shown in the plan view of Fig. 2(a), the width dimension is slightly smaller than the width dimension of the substrate S, and the supply roller 75 abuts on a region other than the both ends of the back surface of the substrate S. Mode configuration. As a result, the supply liquid is applied to the substantially entire surface of the back surface of the substrate S by the supply roller 75 as described later. However, since the processing liquid is not applied to both ends, the processing liquid is prevented from flowing around the surface of the substrate S.

Moreover, as shown in the side view of FIG. 2(b), the supply roller 75 is arrange|positioned at the height position of the back surface of the board|substrate S which the cylindrical surface was supported by the several conveyance rollers 61 and carried by the several conveyance roller 61. Further, the supply roller 75 rotates clockwise around its axis as shown in the figure along with the conveyance of the substrate S.

The back surface nozzle 76 has a tubular shape and is disposed in parallel with the supply roller 75 at a position on the upstream side (−Y side) and below (−Z side) of the supply roller 75 . Back side with nozzle 76 along It has a plurality of discharge ports 761 in the width direction. The processing liquid is ejected from the plurality of ejection ports 761 toward the cylindrical surface of the supply roller 75.

The treatment liquid discharged from the back surface nozzle 76 adheres to the cylindrical surface of the supply roller 75. The cylindrical surface of the supply roller 75 to which the processing liquid adheres is rotated in accordance with the conveyance of the substrate S, and sequentially abuts against the back surface of the substrate S. As a result, the treatment liquid adhering to the cylindrical surface of the supply roller 75 is transferred and applied to the back surface of the substrate S, and the treatment liquid is supplied to the back surface of the substrate S. The supply roller 75 and the back surface nozzle 76 correspond to the back surface supply portion of the present invention.

Returning to Fig. 1, one end of the supply pipe 77 is connected to the flow path of the back surface nozzle 76. The other end flow path of the supply pipe 77 is connected to the storage portion 91 in which the processing liquid 90 is stored. The pump 78 is inserted into the supply pipe 77, and the pump 78 is driven, and the processing liquid 90 is sent from the storage unit 91 to the back surface nozzle 76 via the supply pipe 77, and the processing liquid is discharged from the plurality of discharge ports 761. . The pump 78 and the supply pipe 77 correspond to the liquid supply portion of the present invention.

On the upstream side of the supply roller 75, an air nozzle 71 for blowing water (gas) to the back surface of the substrate S to be conveyed to remove the water washing liquid such as pure water adhering to the back surface of the substrate S is provided. The air nozzle 71 is connected to the air supply source 72 through the supply pipe 73. A valve 74 for opening and closing the flow path is inserted into the supply pipe 73.

A tub member 81 is disposed below the supply roller 75, for example, the bottom surface of the back surface treatment tank 31. The barrel-shaped member 81 is a box shape having an opening at the top, and is received and recovered from the processing liquid dropped from the supply roller 75 or the back surface of the substrate S. The tub member 81 is a collecting portion for separating and recovering the treatment liquid from an adhesion preventing liquid to be described later.

A liquid discharge port 811 shown in Figs. 2(a) and 2(b) is formed on the bottom surface of the barrel member 81. The liquid discharge port 811 communicates with the liquid discharge port 311 formed on the bottom surface of the back surface treatment tank 31. One end of the return pipe (return portion) 82 shown in Fig. 1 is connected to the liquid discharge port 311 in a flow path. The other end flow path of the return pipe 82 is connected to the storage portion 91. A valve 83 for opening and closing the flow path is inserted into the return pipe 82.

A drain port (not shown) mainly for discharging the adhesion preventing liquid is provided on the bottom surface of the back surface treatment tank 31, and one end of the waste liquid pipe 86 shown in Fig. 1 is connected to the liquid discharge port flow path. The other end flow path of the waste liquid pipe 86 is connected to the waste liquid recovery unit 87.

A waste liquid pipe 84 is provided on the side of the back surface treatment tank 31 of the valve 83 inserted in the return pipe 82, and one end flow path of the waste liquid pipe 84 is connected to the return pipe 82. In other words, the waste liquid pipe 84 is a branch pipe branched from the return pipe 82. The other end flow path of the waste liquid pipe 84 is connected to the waste liquid pipe 86. A valve 85 for opening and closing the flow path is provided in the waste liquid pipe 84.

One end of the supply pipe 93 is connected to the flow path of the reservoir 91. The other end flow path of the supply pipe 93 is connected to the supply source 92 of the processing liquid. A valve 94 for opening and closing the flow path is inserted into the supply pipe 93. The supply pipe 93 and the valve 94 correspond to the replenishing portion of the present invention.

Further, one end of the waste liquid pipe 96 is connected to the flow path of the storage portion 91. The other end flow path of the waste liquid pipe 96 is connected to the waste liquid recovery unit 87. A valve 97 for opening and closing the flow path is inserted in the waste liquid pipe 96. The waste liquid pipe 96 and the valve 97 correspond to the waste liquid portion of the present invention.

Further, a specific resistance meter 95 that measures the specific resistance value of the processing liquid 90 stored in the storage unit 91 is provided in the storage unit 91. The specific resistance meter 95 is a detecting unit that detects the degree of mixing of the adhesion preventing liquid mixed into the processing liquid 90 stored in the storage unit 91. For example, if the degree of mixing increases, the specific resistance value rises, so the value is detected by the specific resistance meter 95. When the degree of mixing of the adhesion preventing liquid in the treatment liquid 90 is increased to a certain value or more, the desired treatment cannot be performed on the back surface of the substrate S.

The back surface processing unit 3 includes a surface supply unit 11 that supplies an adhesion preventing liquid to the surface of the substrate S. In order to prevent the treatment liquid supplied from the back surface supply portion 12 to the back surface (lower surface) of the substrate S from flowing to the surface (upper surface) of the substrate S, the treatment liquid adheres to the surface of the substrate S, and the surface supply portion 11 faces the surface of the substrate S. Supply adhesion prevention liquid. The adhesion preventing liquid and the treatment liquid are different types of liquid, and are, for example, pure water or a liquid obtained by dissolving carbon dioxide in pure water.

The surface supply unit 11 includes a plurality of upper nozzles 34 arranged in the Y direction above the substrate S transported by the plurality of transport rollers 61 in the back surface treatment tank 31. One end of a branch pipe of the supply pipe 36 is connected to each of the plurality of upper nozzles 34 in a flow path. The other end flow path of the supply pipe 36 is connected to the supply source 35 for the adhesion preventing liquid. A valve 37 for opening and closing the flow path is inserted into the supply pipe 36.

The one end flow path of the supply pipe 36 is connected to the supply pipe 342 of the upper nozzle 34 shown in Fig. 3(b). In the supply pipe 342, a plurality of nozzle tips 343 are provided in the X direction. The adhesion preventing liquid sent from the supply source 35 to the nozzle heads 343 via the supply pipe 36 and the supply pipe 342 is sprayed downward from the discharge port provided at the tip end (lower end) of the nozzle head 343.

The plurality of nozzle heads 343 are disposed such that their ejection ports are opposed to the plurality of intermediate rollers 612, respectively. The nozzle head 343 sprays the adhesion preventing liquid, for example, in a conical shape, and the discharge region 341 is set to cover the intermediate roller 612 in plan view as shown in Fig. 3(a). As a result, as shown in FIG. 3(b), in the state where the conveyance roller 61 does not support the substrate S, the adhesion prevention liquid discharged from the plurality of nozzle heads 343 is supplied to the plurality of intermediate rollers 612. In addition, as shown in FIG. 3( a ), in the state in which the transport roller 61 transports the substrate S, the adhesion preventing liquid discharged from the plurality of nozzle heads 343 is uniformly supplied in the width direction of the substrate S.

In the liquid-repellent portion 4, the liquid-removing portion 4 removes a liquid such as a deposition preventing liquid adhering to the surface of the substrate S from the surface, and removes a liquid such as a processing liquid adhering to the back surface of the substrate S from the back surface. The liquid removing portion 4 includes a substantially box-shaped liquid removing tank 41 for forming a liquid removing processing space inside the liquid removing portion 4. On the -Y side of the liquid removal tank 41, a transfer port 42 that communicates with the discharge port 33 of the back surface treatment tank 31 and that carries the substrate S into the liquid removal tank 41 is provided. Further, a delivery port 43 for carrying out the substrate S from the liquid removal tank 41 is provided on the +Y side of the liquid removal tank 41.

A pair of upper and lower upper air knifes 44 and lower air knifes 45 are disposed inside the liquid removal tank 41. The upper air knife 44 is disposed above the substrate S transported by the plurality of transport rollers 61. Further, the upper air knife 44 includes a slit-shaped discharge port that faces the upper surface of the substrate S and extends in the X direction, and supplies a gas flow toward the upstream side of the discharge port in the X direction of the substrate S. . Similarly, the lower air knife 45 includes a slit-shaped discharge port that faces the lower surface of the substrate S and extends in the X direction, and supplies gas toward the upper side and the upstream side of the discharge port in the X direction of the substrate S. flow.

FIG. 4 is a block diagram showing a main electrical configuration of the substrate processing apparatus 100. The control unit 5 includes a read only memory (ROM) in which an operation program required for control of the device is stored, a random access memory (RAM) that temporarily stores data and the like during control, and a logical operation. And centrally control the central processing unit (CPU) of each department. Further, the control unit 5 is electrically connected to the transport unit 6, the pump 78, the specific resistance meter 95, the valves 37, the valves 74, the valves 83, the valves 85, the valves 94, the valves 97, and the like.

Next, the operation of the substrate processing apparatus 100 will be described. As a whole operation, the substrate S supported by the transport unit 6 in a horizontal posture and transported in the Y direction is collectively controlled by the control unit 5 to sequentially perform the water washing process of the water washing unit 2, the back surface treatment of the back surface processing unit 3, and the liquid removing unit. 4 liquid removal treatment. As shown in FIG. 1, when the length dimension of the substrate S in the Y direction is the size of the water washing unit 2, the back surface processing unit 3, and the liquid removing unit 4, the liquid removal is performed on the upstream side of the +Y side of the substrate S. The portion 4 performs the liquid removal treatment, performs the back surface treatment of the back surface treatment portion 3 at the center portion of the substrate S, and performs the water washing treatment of the water washing portion 2 on the downstream portion of the substrate S.

The water washing liquid is ejected from the upper surface (surface) of the substrate S of the washing tank 21 that is carried into the water washing unit 2 from the plurality of upper nozzles 24, and the water washing liquid is ejected from the lower nozzles 25 on the lower surface (back surface) of the substrate S, thereby The upper and lower surfaces of the substrate S are subjected to a water washing treatment.

The substrate S subjected to the water washing treatment by the water washing unit 2 is carried into the back surface processing unit 3, and the back surface treatment is performed. First, air is blown from the air nozzle 71 to the back surface of the substrate S to remove the water washing liquid adhering to the back surface. Then, the supply that abuts against the back surface of the substrate S is utilized. The roller 75 is coated with a supply of the treatment liquid. Further, the adhesion preventing liquid is supplied to the surface of the substrate S from the plurality of upper nozzles 34, thereby preventing the processing liquid from flowing around the surface of the substrate S.

The upper nozzle 34 that faces at least the transport roller 61 disposed on the downstream side of the supply roller 75 is configured to eject the adhesion preventing liquid before the substrate S reaches the transport roller 61 or after the substrate S passes the transport roller 61. The opening and closing of the valve 37 is controlled by the control unit 5. As a result, the adhesion preventing liquid is supplied from the upper nozzle 34 to the intermediate roller 612 of the conveying roller 61, and the processing liquid adhered to the intermediate roller 612 from the back surface of the substrate S is washed by the adhesion preventing liquid.

When the back surface treatment is performed on the next substrate S while the processing liquid adheres to the intermediate roller 612, the processing liquid adhering to the intermediate roller 612 is further transferred onto the processing liquid applied by the supply roller 75. Since the intermediate roller 61 partially contacts the back surface of the substrate S, the transfer of the treatment liquid is also local, and the back surface treatment cannot be performed uniformly in the back surface. Therefore, as described above, by flushing the treatment liquid adhering to the intermediate roller 612 with the adhesion preventing liquid, the treatment liquid is not partially transferred to the back surface of the substrate S, and the back surface treatment can be performed uniformly on the back surface of the substrate S.

The substrate S carried out from the back surface treatment tank 31 is carried into the liquid removal tank 41 of the liquid removal unit 4, and the liquid removal process is performed. The upper surface of the substrate S horizontally supported by the plurality of transport rollers 61 in the liquid removal tank 41 and transported in the Y direction is blown upward and downward from the upper air knife 44. Further, on the lower surface of the substrate S, the airflow toward the upstream and the upper side is blown from the lower air knife 45. As a result, the adhesion preventing liquid adhering to the upper surface of the substrate S is removed from the upper surface, and the treatment liquid adhering to the lower surface is removed from the lower surface. The substrate S thus removed is carried out from the delivery port 43 of the liquid removal tank 41 to the downstream side.

Then, the operation related to the disposal and replenishment of the processing liquid circulated and supplied to the back surface of the substrate S by the back surface supply unit 12 will be described using a flowchart shown in FIG. 5 and the like.

As described above, in the back surface treatment portion 3, the treatment liquid dropped from the supply roller 75 or the back surface of the substrate S or the like is received by the tub member 81 and recovered. The barrel-shaped member 81 sets the arrangement position or the opening position in such a manner that the treatment liquid is mainly collected and the adhesion prevention liquid is not recovered, but a small amount of the adhesion prevention liquid flowing down from the upper surface of the substrate S is recovered to the barrel member 81. Happening.

In this manner, the treatment liquid in which the adhesion preventing liquid is mixed is temporarily stored in the storage portion 91, and then supplied to the back surface of the substrate S by the back surface supply 12 in a cycle. When the amount of the adhesion preventing liquid to be mixed into the treatment liquid is small, the required treatment for the back surface of the substrate S can be maintained, but if the amount of the mixture is increased to a certain value or more, the effect of the back surface treatment is lowered.

Therefore, in order to prevent the adhesion preventing liquid of a certain value or more from being mixed into the processing liquid supplied to the back surface of the substrate S by the back surface supply part 12, the following operation is performed. That is, as shown in FIG. 5, first, in step 10, in parallel with the processing of the substrate S by the substrate processing apparatus 100, the specific resistance value of the processing liquid stored in the storage unit 91 by the resistance meter 95 is measured. In the adhesion preventing liquid in the treatment liquid, if the degree of mixing increases, the specific resistance value increases. Therefore, it is monitored whether or not the specific resistance value is equal to or greater than a certain value (set value) (step 20). If the specific resistance value is smaller than the set value (in the case of No), the operation is completed, but the operation is periodically performed during the operation of the substrate processing apparatus 100.

In the case where the specific resistance value is equal to or greater than the set value (Yes), the process proceeds to the next step S30. In step S30, the valve 97 inserted into the waste liquid pipe 96 connected to the storage unit 91 by the flow path is opened by the control unit 5 for a predetermined period of time. shut down. As a result, a predetermined amount of the treatment liquid (mixed liquid) in which the adhesion preventing liquid is mixed is discarded from the storage unit 91 to the waste liquid recovery unit 87 via the waste liquid pipe 96.

Then, in step S40, the valve 94 inserted into the supply pipe 93 connected to the storage unit 91 in the flow path is opened for a predetermined time and then closed. As a result, a new liquid of a predetermined amount of the processing liquid is supplied from the supply source 92 to the storage unit 91 via the supply pipe 93.

As described above, since the mixed liquid is discarded from the storage unit 91 and the new liquid of the treatment liquid is supplied to the storage unit 91, the degree of mixing of the adhesion prevention liquid in the treatment liquid is lowered, and as a result, the specific resistance value is also lowered, and the back surface treatment can be maintained. Effect.

Further, in the maintenance of the substrate processing apparatus 100, the supply roller 75 is cleaned, and the cleaning operation will be described. The valve 83 is closed by the control unit 5 and the valve 85 is opened. After the entire processing liquid 90 is discarded from the storage unit 91, the cleaning liquid is stored in the storage unit 91. The cleaning liquid is supplied to the supply roller 75 via the supply pipe 77 and the back surface nozzle 76 by the driving of the pump 78, thereby cleaning the cylindrical surface of the supply roller 75. The cleaning liquid supplied to the supply roller 75 is collected by the tub member 81 and sent to the waste liquid recovery unit 87 via the waste liquid pipe 84 branched from the return pipe 82.

In the above-described embodiment, the substrate S is supported by the transport unit 6 in a horizontal posture and transported in the Y direction, and the substrate S may be supported in an inclined posture inclined in the left-right direction in the Y direction and along the surface thereof. It is transported in the Y direction.

In the above-described embodiment, the specific resistance meter 95 is used as the detecting unit, and a conductivity meter or a pH meter or the like may be used as the detecting unit to mix the adhesion preventing liquid mixed into the processing liquid 90 stored in the storage unit 91. Detection.

In addition, the treatment liquid is exhausted due to the number of blocks of the substrate to be processed, elapsed time, and the like. Therefore, the effect is lowered. Therefore, the number of processing blocks of the substrate, the elapsed time, and the like may be measured in advance, and the discarding operation from the storage portion 91 and the replenishing operation of the new liquid of the processing liquid in the storage portion 91 may be performed in accordance with the measurement result. At this time, all of the storage unit 91 may be discarded and replenished, or a part may be discarded and replenished.

2‧‧‧ Washing Department

3‧‧‧Backside Processing Department

4‧‧‧Decontamination Department

5‧‧‧Control Department

6‧‧‧Transportation Department

11‧‧‧ Surface Supply Department

12‧‧‧Back Supply Department

21‧‧‧Washing tank

22, 32, 42‧‧‧

23, 33, 43 ‧ ‧ moving out

24, 34‧‧‧ upper nozzle

25‧‧‧ lower nozzle

31‧‧‧Back processing tank

35, 92‧‧‧Supply source

36‧‧‧Supply piping

37, 74, 83, 85, 94, 97‧‧‧ valves

41‧‧‧Removal tank

44‧‧‧Air knife

45‧‧‧Air knife

61‧‧‧Transport roller

71‧‧‧Air nozzle

72‧‧‧Air supply source

73, 77, 93‧‧‧ supply piping

75‧‧‧Supply roller

76‧‧‧Back nozzle

78‧‧‧ pump

81‧‧‧ barrel components

82‧‧‧Return to piping

84, 86, 96‧‧‧ waste pipe

87‧‧‧ Waste Recycling Department

90‧‧‧ treatment solution

91‧‧‧ Storage Department

95‧‧‧Specific resistance meter

100‧‧‧Substrate processing unit

S‧‧‧Substrate

X, Y, Z‧‧ Direction

Claims (6)

A substrate processing apparatus includes: a conveying unit that conveys a substrate in a direction along a surface thereof; a processing tank that forms a processing space therein; and a back surface supply unit that supplies a processing liquid to a back surface of the substrate conveyed by the conveying unit in the processing tank The surface supply unit supplies an adhesion preventing liquid of a different type of liquid to the surface of the substrate conveyed by the conveying unit in the processing tank; a storage unit stores the processing liquid; and a liquid feeding unit that sends the processing liquid from the storage unit to the surface. a back surface supply unit; a collection unit installed in the treatment tank and collecting the treatment liquid supplied from the back surface supply unit to the back surface of the substrate; the return unit returning the treatment liquid collected by the collection unit to the storage unit; and the detection unit mixing and storing The degree of mixing of the adhesion preventing liquid of the processing liquid stored in the part is detected; the replenishing part replenishes the processing liquid to the storage part; the waste liquid part, the processing liquid in which the adhesion preventing liquid is stored in the waste storage part; and the control unit is based on As a result of the detection by the detecting unit, the waste liquid portion discards the treatment liquid in which the adhesion preventing liquid is mixed from the storage portion, and the replenishing portion replenishes the treatment liquid to the storage portion. The substrate processing apparatus according to claim 1, wherein the detecting unit is a specific resistance meter that detects a specific resistance of the processing liquid stored in the storage unit. The substrate processing apparatus according to claim 1 or 2, wherein The middle-back surface supply unit includes a cylindrical supply roller whose cylindrical surface abuts against the back surface of the substrate conveyed by the transport unit, and a back surface nozzle that discharges the processing liquid toward the cylindrical surface of the supply roller. The substrate processing apparatus according to the third aspect of the invention, wherein the surface supply unit has a plurality of supply tubes arranged in a transport direction of the substrate, and the supply tube has a plurality of width directions arranged in a width direction orthogonal to the transport direction. A spray outlet. The substrate processing apparatus according to claim 4, wherein the conveying unit has a plurality of conveying rollers provided along the conveying direction, and at least the conveying roller provided on the downstream side of the feeding roller in the conveying direction has the width direction A plurality of intermediate rolls are provided and abutted against the back surface of the substrate, and the discharge ports of the supply pipes are disposed at positions facing the plurality of intermediate rolls. The substrate processing apparatus according to the first aspect of the invention, wherein the transport unit supports and transports the substrate in a horizontal posture, and the collection unit has an opening disposed below the substrate conveyed by the transport unit and having an opening thereon. Barrel member.