JPH11165116A - Processing liquid coating device - Google Patents

Abstract

(57) [Summary] [PROBLEMS] To effectively reduce the consumption of a cleaning liquid by effectively using the cleaning liquid. SOLUTION: A supply system of a cleaning liquid to each cleaning nozzle of a spin coater 10 is configured as follows. That is, a tank 60 for storing a cleaning liquid is provided, a cleaning liquid supply pipe 62 is provided between the tank 60 and each of the cleaning nozzles, and a cleaning liquid collection pipe 66 is provided between the liquid storage section 44 of the substrate holder 12 and the tank 60. Was arranged. The cleaning liquid supply pipe 62 and the cleaning liquid recovery pipe 66 are provided with opening / closing valves 64 and 68, respectively. The tank 60 is further connected to a gas supply pipe 70 connected to a nitrogen gas supply source (not shown) via a regulator 72 equipped with a pressure gauge and an opening / closing valve 74, and to a vacuum pump 80 via an opening / closing valve 78. Negative pressure pipe 7
6 and an exhaust pipe 82 opened to the atmosphere via an on-off valve 84.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a processing liquid application apparatus for applying a processing liquid to substrates such as semiconductor substrates, flat panel display substrates such as liquid crystal and plasma display substrates, and photomask glass substrates. The present invention relates to a processing liquid application apparatus having a cleaning function of cleaning and removing a processing liquid attached to a component of a device accompanying a thin film forming process.

[0002]

2. Description of the Related Art As a processing liquid coating apparatus as described above, for example, an apparatus disclosed in Japanese Patent Application Laid-Open No. 6-106126 is known. This apparatus supplies a processing liquid such as a resist to a substrate sucked and held on a table, and then rotates the substrate and the table integrally, thereby using a centrifugal force to expand the processing liquid on the substrate surface. Is a so-called spin coater.

In this device, the periphery of the table is covered with an annular cup. During rotation of the substrate, a lid is set on the cup to form a closed space formed by the cup and the lid. The substrate is arranged inside. By doing so, the processing liquid is prevented from being scattered outside the apparatus due to the rotation of the substrate.

In the spin coater, a cleaning nozzle for spraying a cleaning liquid toward the inner surface of the cup or the table is provided, and the cleaning liquid is sprayed onto the inner surface of the cup or the table at a predetermined timing to form the inner surface of the cup with the thin film forming process. It is designed to wash off the processing liquid and the like adhering to the like. This prevents the treatment liquid adhering to the cup or the like from drying and solidifying to cause particles.

[0005]

In this type of apparatus, the cleaning liquid conventionally used for cleaning cups and the like is drained out of the apparatus through, for example, a drain pipe.

However, as the size of the substrate increases, such as the size of the liquid crystal display, the amount of the processing solution applied to the substrate tends to increase, and the amount of the processing solution attached to the cup or the like also increases. Therefore, the amount of the cleaning liquid used for cleaning the cups and the like tends to increase, and such an increase in the consumption of the cleaning liquid is one factor that increases the production cost of the substrate.

In addition, when a processing solution that is hardly dissolved in a cleaning solution such as a resist for a color filter is used, a large amount of the cleaning solution is used to wash away the processing solution attached to a cup or the like. It is a cause of increasing production costs by increasing consumption.

The present invention has been made in view of such circumstances, and has a cleaning function of cleaning and removing a processing liquid attached to each part of an apparatus in association with a processing liquid coating processing (thin film forming processing). It is an object of the present invention to provide a processing liquid application apparatus capable of effectively suppressing the consumption of the cleaning liquid by effectively utilizing the cleaning liquid in the liquid application apparatus.

[0009]

In order to solve the above-mentioned problems, the present invention provides a processing liquid for supplying a processing liquid to a surface of a substrate held by a substrate holding portion to form a thin film of the processing liquid on the substrate surface. In the coating apparatus, a liquid discharging means arranged so as to be able to discharge a cleaning liquid toward a device constituent part, and a cleaning liquid is sent to the liquid discharging means, and the cleaning liquid is supplied from the liquid discharging means to the device constituent part, thereby forming the device constituent part. And a liquid supply system for cleaning the components, wherein the liquid supply system is configured to collect the cleaning liquid used for cleaning the components of the apparatus and to resupply the liquid to the liquid discharging means.

[0010] In this apparatus, the cleaning liquid is discharged from the liquid discharging means toward the constituent parts of the apparatus, whereby the processing liquid attached to the constituent parts of the apparatus is cleaned and removed in association with the processing of forming a thin film of the processing liquid. Then, the cleaning liquid used for this cleaning is collected and supplied again to the liquid discharging means by the liquid supply system. As a result, the cleaning liquid is used repeatedly. Therefore, the cleaning liquid can be effectively used, and the amount of the cleaning liquid used per substrate can be effectively suppressed.

[0011]

Embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a schematic perspective view showing a spin coater which is a processing liquid coating apparatus according to the present invention. As shown in this figure, a spin coater 10 includes a substrate holder 12 provided on a base or the like, a lid 14 supported above and below the substrate holder 12 so as to be able to move up and down, and a process disposed on the side of the substrate holder 12. And a liquid supply device 16.

The substrate holder 12 has a circular table 20 for holding the substrate W. A cup 22 for preventing the processing liquid from scattering is provided so as to surround the table 20.

The table 20 has a suction portion 20a at the center thereof.
The substrate W is vacuum-adsorbed by the
It is held above zero. Table 20
Is connected to a rotating mechanism driven by a motor 24 and a lifting mechanism driven by an air cylinder as a driving source.
When loading and unloading, the suction unit 2 of the table 20 is
0a is moved up and down to transfer the substrate W to and from a transport means (not shown), and at the time of applying the processing liquid, the substrate W is rotated by rotating the entire table 20 including the suction unit 20a. It is configured to rotate.

The processing liquid supply device 16 has an arm 26 supported rotatably about a vertical axis. A processing liquid discharge nozzle 28 for discharging a processing liquid such as a resist is provided at the tip of the arm 26. I have it. The arm 26 is driven to rotate around the axis by the driving of a motor (not shown), and the processing liquid discharge nozzle 28 is moved to a retracted position outside the cup 22 (a position shown in the drawing) and a predetermined supply above the table 20. It is configured to be displaced over a position. During processing, a predetermined amount of processing liquid is supplied from the processing liquid discharge nozzle 28 to the surface of the substrate W while the processing liquid discharge nozzle 28 is set at the supply position.

On the other hand, the lid 14 has a main body 30 which is connected to an air cylinder or the like (not shown) and supported so as to be able to move up and down. The lid 14 is configured to unite with the substrate holder 12 when lowered to a predetermined height position. During processing, the substrate holder 12 and the lid 14 are united in this manner. , Substrate W on table 20
And the main body 30 of the lid 22 and the cup 22 of the substrate holder 12.
And are arranged in a closed space formed by.
This prevents the processing liquid from scattering to the outside of the apparatus during processing. Note that, as described above, the lid 14
When the substrate holder 12 and the substrate holder 12 are combined, the plate 32 of the lid 14 is interposed in the cup 22 of the substrate holder 12 and engages with the table 20 while forming a predetermined gap with the surface of the table 20. , Can be freely rotated with respect to the main body 30. During the processing, the table 20 and the plate 32 are covered with the plate 32 over the substrate W.
And rotate together.

The substrate holder 12 and the lid 14 include:
A plurality of cleaning nozzles are provided as liquid discharging means of the present invention for spraying a cleaning liquid to wash and remove a processing liquid such as a resist liquid attached to the table 20 and the cup 22 during the processing.

Specifically, as shown in FIG. 2, a cup cleaning nozzle 37 and a back cleaning nozzle 38 are provided on the substrate holder 12.
While three types of cleaning nozzles, namely, a trap cleaning nozzle 39, are provided, as shown in FIG. 3, two types of cleaning nozzles, a plate cleaning nozzle 40a and a table cleaning nozzle 40b, are provided on the lid 14.

The cup washing nozzle 37 is provided for the cup 22.
The inner peripheral surface of the cup 22 is provided at a position facing the peripheral edge of the table 20, sprays the cleaning liquid toward the peripheral edge 20 b of the table 20, and is washed with the cleaning liquid repelled by the peripheral edge 20 b. Is to be cleaned.

The back washing nozzle 38 is mounted on the table 2
The cleaning device is provided at a position facing the lower surface of the table 20, and the lower surface of the table 20 is cleaned by spraying a cleaning liquid.

The trap cleaning nozzle 39 is provided below the table 20 so as to face the lower surface of the peripheral portion 20b, and a processing liquid discharge port 42 (trap portion) formed in the peripheral portion 20b of the table 20. The cleaning liquid is sprayed toward. That is, as shown in FIG.
A processing liquid discharge port 42 is formed to lead the processing liquid accumulated on the peripheral edge of the processing liquid to a liquid storage section 44 formed in the cup 22. The cleaning liquid is ejected from the trap cleaning nozzle 39 to discharge the processing liquid. The processing liquid attached to the outlet 42 is washed off.

On the other hand, the plate cleaning nozzle 40a and the table cleaning nozzle 40b are, as shown in FIG.
Are provided integrally with the central portion of the main body 30.

The plate cleaning nozzle 40a and the table cleaning nozzle 40b have an operating position (position shown in FIG. 3) in which each nozzle tip projects downward from an opening 32a formed in the center of the plate 32,
The plate cleaning nozzle 40a can be displaced to the later retracted position above and in the above-mentioned operating position,
The cleaning liquid is sprayed on the lower surface of the table 2, and the table cleaning nozzle 40b
Is designed to spray a cleaning liquid onto the upper surface of the table 20.

That is, the cleaning nozzles 40a, 40
3B, the support member 4 is attached to the output shaft of the rotary actuator 48 fixed to the main body 30, as shown in FIGS.
6 and is vertically displaced integrally with the rotary actuator 48 by an air cylinder 50. After the cleaning, the cleaning nozzle 40a is driven by the rotary actuator 48 and the air cylinder 50. , 40b are moved from the operating position to a position above the plate 32 (the position shown by the dashed line in FIG. 3), and further turned by 90 °, so that the retracted position on the central axis side of the main body 30 (one point in FIG. (Position indicated by a chain line). At the time of processing, the stopper 32 supported up and down above the opening 32a is moved to the lower end position by driving the air cylinder 54, so that the opening 32a is closed. .

FIG. 5 shows a supply system (liquid supply system) of the cleaning liquid to each of the above-mentioned cleaning nozzles. As shown in this figure,
The spin coater 10 has a tank 6 for storing a cleaning liquid.
A cleaning liquid supply pipe 62 is provided between the tank 60 and each of the cleaning nozzles, and a cleaning liquid collection pipe is provided between the liquid storage section 44 of the substrate holder 12 and the tank 60. 66 are provided.

The cleaning liquid supply pipe 62 is disposed in the tank 60 on the upstream side, that is, the upstream side in the supply direction of the cleaning liquid, while the downstream side passes through an opening / closing valve 64 and then branches (not shown) to form each cleaning nozzle. Connected to each other. On the other hand, the upstream side of the cleaning liquid recovery pipe 66 is connected to the liquid storage section 44, while the downstream side reaches the tank 60 via an opening / closing valve 68.

The tank 60 further includes a gas supply pipe 70 connected to a nitrogen gas supply source (not shown) through a regulator 72 equipped with a pressure gauge and an opening / closing valve 74, and a vacuum pump through an opening / closing valve 78. A negative pressure pipe 76 connected to the exhaust pipe 82 and an exhaust pipe 82 opened to the atmosphere via an on-off valve 84 are connected.

Reference numeral 86 denotes a drain pipe connected to the liquid storage section 44 of the substrate holder 12, and is connected to a waste liquid facility (not shown) via an opening / closing valve 88.

Although not shown, the spin coater 10 is provided with a controller having a computer as a component. The controller 24 includes a motor 24 for operating the table 20, a valve for driving the air cylinder, and a cleaning liquid. Each of the open / close valves and the like in the supply system described above is electrically connected to the controller. When the spin coater 10 is operated, the motor 24 and the like are collectively controlled by this controller,
The operation of applying the processing liquid on the substrate W and the operation of cleaning the cup 22 and the like as described below are performed.

Hereinafter, the operation of the spin coater 10 will be described. First, the substrate W is carried into the upper part of the table 20 by a transport means (not shown). At this time, the lid 14
Is held at the rising end position, and the arm 26 of the processing liquid supply device 16 is set at the retracted position. In the cleaning liquid supply system, all the on / off valves are fully closed except for the on / off valves 84 and 88 of the exhaust pipe 82 and the drain pipe 86.

When the substrate W is loaded, the table 20
Is set at the rising end position, the substrate W is transferred from the transport means to the suction unit 20a, and the substrate W is vacuum-sucked to the suction unit 20a. Thereafter, the substrate W is held on the table 20 by resetting the suction unit 20a to the lower end position.

Next, the arm 26 of the processing liquid supply device 16
Is rotated to move the processing liquid discharge nozzle 28 to the table 20.
The processing liquid discharge nozzle 2 is set at the upper
From 8, the processing liquid is supplied to the surface of the substrate W. When a predetermined amount of the processing liquid is supplied, the arm 26 is driven to rotate, and the processing liquid discharge nozzle 28 is reset to the retracted position.

When the supply of the processing liquid to the substrate W is completed in this way, the lid 14 is combined with the substrate holder 12 and the lid 14 is closed by the main body 30 of the lid 14 and the cup 22 of the substrate holder 12. The substrate W is arranged in the space.

Then, the table 20 is rotated by the operation of the motor 24, and the substrate W is rotated integrally with the table 20 and the plate 32 for a predetermined time. Thereby, the processing liquid on the substrate is uniformly spread on the substrate surface. At this time, the processing liquid is scattered with the rotation of the substrate W. However, since the substrate W is arranged in the closed space, the scatter of the processing liquid to the outside of the apparatus is prevented. The scattered processing liquid is collected in the liquid storage section 44 through the processing liquid discharge port 42 on the periphery of the table or by being attached to the cup 22 and falling by its own weight, while the drainage pipe 8 is being collected.
6 to the waste liquid facility.

When the table 20 stops, the lid 14 is reset to the rising end position, and the suction portion 20a is displaced to the rising end position. Then, the substrate W is delivered from the suction unit 20a to the transport unit, and the substrate W is unloaded to the next step by the transport unit. Thereafter, the suction unit 20a is reset to the lower end position, whereby the operation of applying the processing liquid to the substrate W ends.

Then, for example, after the coating operation of the processing liquid is repeatedly performed on a predetermined number of substrates W, or at a timing such as when the production lot is switched, the cups 22 are removed.
Is performed.

First, in a cleaning operation of a cup or the like (hereinafter simply referred to as a cleaning operation), the lid 14 is combined with the substrate holder 12 and the plate 32 is engaged with the table 20. After the plate cleaning nozzle 40a and the table cleaning nozzle 40b are set at the operating positions, the open / close valves 84 and 88 of the exhaust pipe 82 and the waste liquid pipe 86 are fully closed, and the open / close valve 74 of the gas supply pipe 70 is closed. Is switched to the fully open state, and after the inside of the tank 60 is pressurized, the cleaning liquid supply pipe 6
The second opening / closing valve 64 is fully opened, and the table 20 is driven to rotate by the operation of the motor 24.

Thus, while the cleaning liquid is supplied from the tank 60 to each of the cleaning nozzles, the cleaning liquid is jetted from each of the cleaning nozzles for a certain period of time, and the processing liquid and the like attached to the cup 22 and the like are washed away. At this time, the cleaning liquid used for the cleaning is scattered around as the table 20 and the plate 32 rotate, and is collected in the liquid storage unit 44. The cleaning liquid is sprayed by pressure-feeding the cleaning liquid in the tank 60 through the cleaning liquid supply pipe 62 by the pressure of the nitrogen gas supplied to the tank 60 through the gas supply pipe 70.

When a predetermined time has elapsed, the open / close valve 6
4, 74 are switched to fully closed, and in synchronization with this, the table 20 is stopped, and after the table 20 is stopped, the plate cleaning nozzle 40a and the table cleaning nozzle 40b are stopped.
Is reset to the retracted position.

When the plate cleaning nozzle 40a and the table cleaning nozzle 40b are completely reset to the retracted position, the table 20 is driven to rotate again for a predetermined time, whereby the cleaning liquid adhering to the table 20 and the plate 32 is centrifuged. Removed by force (called spin drying). Further, in synchronization with the spin drying, the washing liquid collecting pipe 66 is provided.
The opening / closing valves 68 and 78 of the negative pressure tube 76 are switched to the full open state, whereby the cleaning liquid used for cleaning and stored in the liquid storage section 44 is collected in the tank 60. At this time, the pressure in the tank 60 is reduced through the negative pressure pipe 76,
The cleaning liquid in the liquid storage section 44 is quickly sucked while the tank 6
0 will be collected.

When the cleaning liquid in the liquid storage section 44 is collected in the tank 60 in this manner, the open / close valves 68 and 78 are fully closed, and the open / close valve 84 is switched to the full open state. Open to the atmosphere through. This ends the cleaning operation.

According to the spin coater 10 described above, the cleaning liquid in the tank 60 is supplied to the cleaning of the cup 22 and the like via the cleaning liquid supply pipe 62 as described above, and then the cleaning liquid recovery pipe 6
6 and is collected in the tank 60. That is, in the above-described cleaning liquid supply system, the cleaning liquid is circulated while the cup 22 is being circulated.
And so on. Therefore, compared with a conventional spin coater of this type, in which the cleaning liquid used for cleaning is drained as it is, the cleaning liquid can be used more effectively, and the consumption of the cleaning liquid per substrate can be effectively reduced. it can. Therefore, even when a large substrate is used or when a processing liquid that is difficult to remove is used, the consumption of the cleaning liquid can be effectively suppressed, and the consumption of the cleaning liquid, which has been a problem in the conventional apparatus of this type, can be reduced. The increase in the production cost of the substrate W due to the increase in the amount can be effectively suppressed.

Since the spin coater 10 is used repeatedly while circulating the cleaning liquid, the cleaning function is naturally deteriorated due to deterioration of the cleaning liquid. Therefore, for example, it is desirable to experimentally determine the number of times of cleaning that can maintain the cleaning function, and replace the cleaning liquid in the tank 60 with each number of times to maintain the function of the cleaning liquid. In addition, regardless of the number of washings, for example, the tank 60
A sensor for detecting the concentration of the cleaning liquid in the tank may be provided, and the deterioration state of the cleaning liquid may be detected based on the concentration detection to replace the cleaning liquid in the tank 60.

In the spin coater 10, the pressure in the tank 60 is reduced when the cleaning liquid stored in the liquid storage section 44 is collected, so that the introduction of the cleaning liquid into the tank 60 is promoted. It is not necessary to reduce the pressure inside the tank 60, and the cleaning liquid may naturally flow into the tank 60. However, if the pressure in the tank 60 is reduced to promote the introduction of the cleaning liquid, the time required for cleaning the cup 22 and the like including the recovery of the cleaning liquid can be effectively reduced.

By the way, as the supply system of the cleaning liquid which is used while circulating the cleaning liquid as described above, various modifications other than the supply system shown in FIG. 5 can be considered.
Some examples thereof will be described with reference to FIGS. The basic configuration of each of the following examples is also shown in FIG.
Therefore, the same reference numerals are given to the common parts, the description thereof will be omitted, and only the differences will be described in detail.

FIG. 6 shows a first modification of the processing liquid supply system. In the cleaning liquid supply system shown in this figure, a tank 61 for storing the cleaning liquid is provided separately from the tank 60, and the negative pressure pipe 76 leading to the vacuum pump 80 is connected to the tank 61. Further, the opening / closing valve 85
An exhaust pipe 83 opened to the atmosphere through the tank 61 is connected to the tank 61, and a supply pipe 90 having a pump 92 and an opening / closing valve 94 is connected across the tank 60 and the tank 61.

The drain pipe 86 is provided with a three-way valve 89 instead of the open / close valve 88, and a recovery pipe 96 is provided between the drain pipe 86 and the tank 61 via the three-way valve 89. It is arranged. In this supply system, FIG.
The cleaning liquid recovery pipe 66 for directly connecting the liquid storage section 44 and the tank 60 as in the supply system shown in FIG.

In the above-described cleaning liquid supply system, the substrate W
When the processing liquid is applied to the exhaust pipes 82 and 83, the open / close valves 84 and 85 of the exhaust pipes 82 and 83 are fully opened.
All open / close valves other than 4,85 are fully closed. Thereby, the supply of the cleaning liquid is stopped. On the other hand, the three-way valve 89 of the drainage pipe 86 is switched so that the liquid storage unit 44 communicates with the waste liquid facility, whereby the liquid storage unit 4 is connected with the processing.
The treatment liquid collected in 4 is led to a waste liquid facility.

During the cleaning operation, the exhaust pipe 8
The opening / closing valves 84, 85 of the cleaning liquid supply pipe 62, the gas supply pipe 70, and the opening / closing valves 6 of the negative pressure pipe 76 are fully closed.
4, 74 and 78 are respectively switched to full open. Also,
The three-way valve 89 of the drain pipe 86 is switched so that the liquid storage section 44 communicates with the tank 61.

As a result, the cleaning liquid is supplied from the tank 60 to the respective cleaning nozzles through the cleaning liquid supply pipe 62 while being jetted, and the inside of the tank 61 is depressurized through the negative pressure pipe 76 so that the cleaning liquid stored in the liquid storage section 44 is removed. It will be collected in the tank 61 via the collection pipe 96. That is, while the cup 22 and the like are being washed, the washing liquid used for the washing is collected at the same time.

When the amount of the cleaning liquid in the tank 60 falls below a certain level due to the supply of the cleaning liquid, the open / close valve 94 is fully opened, for example, during the application of the processing liquid. 60
The cleaning liquid is introduced into the tank 60 by the pump 92, whereby the cleaning liquid in the tank 60 is supplemented.

According to the cleaning liquid supply system shown in FIG. 6, the cleaning of the cup 22 and the like and the recovery of the cleaning liquid used for the cleaning can be performed in parallel as described above.
Compared with the supply system shown in FIG. 5, there is an advantage that the time required from cleaning of the cup 22 and the like to recovery of the cleaning liquid can be greatly reduced.

FIG. 7 shows a second modification of the processing liquid supply system. The supply system shown in FIG.
0, 60 'are provided, and the upstream side of the cleaning liquid supply pipe 62 is branched into two branch supply pipes 62a, 62b to reach the tanks 60, 60', respectively, and these branch supply pipes 62a, 62b are respectively provided. Open / close valve 64a,
64b are interposed. Further, the gas supply pipe 70 has a downstream side branched into two branch gas pipes 70a and 70b to reach tanks 60 and 60 ', respectively, and these branch gas pipes 70a and 70b have regulators 72a and 72b and open / close valves respectively. 74a, 74b
Is interposed. The vacuum pump 80 has two negative pressure tubes 76a, 76b reaching the respective tanks 60, 60 '.
Are connected to each other, and open / close valves 78a and 78b are interposed in these negative pressure tubes 76a and 76b, respectively. The cleaning liquid recovery pipe 66 has two branch recovery pipes 66 on the downstream side.
a and 66b, which reach tanks 60 and 60 ', respectively, and open / close valves 68a and 68b are interposed in the branch collection pipes 66a and 66b, respectively.
The exhaust pipes 82, 82 'open to the atmosphere via opening / closing valves 84, 84' are connected to the tanks 60, 60 ', respectively.

In the above-described supply system, the opening / closing valve 8 of each exhaust pipe 82, 82 'is used during the operation of applying the processing liquid to the substrate W.
All of the open / close valves are fully closed, except that the open / close valves 88 of the drain pipe 86 are completely opened. As a result, the supply of the cleaning liquid is stopped, and the liquid storage 44
Is discharged to a waste liquid facility through a drain pipe 86.

During the cleaning operation, each exhaust pipe 82,
82 ', opening and closing valves 84, 84', 88 of the drain pipe 86
Are fully closed, and each open / close valve is switched so that one of the tanks 60 and 60 'functions as a supply of the cleaning liquid and the other functions as a tank for collecting the cleaning liquid.

For example, when one tank 60 is used for supply and the other tank 60 'is used for recovery, each of the branch supply pipe 62a, the branch gas pipe 70a, the branch recovery pipe 66b, and the negative pressure pipe 76b is used. Open / close valve 64a, 7
4a, 68b and 78b are respectively switched to full open.
As a result, the cleaning liquid in the tank 60 is transferred to the branch supply pipe 62a.
While being supplied to and jetted to each of the cleaning nozzles, the cleaning liquid used for the cleaning is collected in the tank 60 'through the branch collection pipe 66b.

On the other hand, when the tank 60 is used for recovery and the other tank 60 'is used for supply, the branch supply pipe 62b and the branch gas pipe 70 are used.
b, opening / closing valve 6 of branch recovery pipe 66a and negative pressure pipe 76a
4b, 74b, 68a, and 78a can be switched to full open. As a result, the cleaning liquid in the tank 60 'is supplied to each cleaning nozzle via the branch supply pipe 62b and is jetted, and the cleaning liquid used for the cleaning is collected in the tank 60 via the branch recovery pipe 66a. Becomes

According to the above-described supply system, the cleaning of the cup 22 and the like and the recovery of the cleaning liquid used for the cleaning can be performed in parallel, similarly to the supply system shown in FIG. In addition, a processing liquid supply system and a recovery system are provided for each of the tanks 60 and 60 '. That is, the cleaning liquid is supplied from each of the tanks 60 and 60' to each of the cleaning nozzles. Since the cleaning liquid can be collected in each of the tanks 60 and 60 ', if the cleaning liquid is alternately supplied from each of the tanks, the liquid in the tank 60 on the supply side may become insufficient as in the supply system of FIG. Accordingly, there is an advantage that it is not necessary to supply the cleaning liquid from the tank 61 on the recovery side to the tank 60 on the supply side.

When the cup 22 or the like is washed, for example, only the opening / closing valves 64a and 74a of the branch supply pipe 62a and the branch gas pipe 70a among the opening / closing valves are fully opened to open the branch supply pipe 64a from the tank 60. The cleaning liquid supplied to the cleaning is stored in the liquid storage unit 44 while supplying the cleaning system via the, and after the cleaning is completed, the open / close valves 64a and 74a of the branch supply pipe 62a and the branch gas pipe 70a are fully closed, and One opening / closing valve 68a, 78a of the branch collection pipe 66a and the negative pressure pipe 76a is fully opened, whereby the cleaning liquid collected in the liquid storage section 44 is collected in the tank 60. Can also be used together. Therefore, even if the supply of the cleaning liquid from one tank or the recovery of the cleaning liquid becomes impossible due to a valve failure or the like, the spin coater 10 is continued by collecting the cleaning liquid into the tank while supplying the cleaning liquid from the other tank. Can be activated. Therefore, it is also effective in terms of safety measures such as preventing interruption of substrate processing due to equipment failure or the like.

FIG. 8 shows a third modification of the processing liquid supply system. In the supply system of the cleaning liquid shown in this figure, in the supply system shown in FIG.
Is connected. The new liquid supply pipe 100 communicates with a new liquid supply source (not shown), and according to the opening operation of the opening / closing valve 101 provided in the middle thereof, the new liquid, that is, not supplied to the tank 60 for cleaning at all. The cleaning liquid used can be supplied.

The drain pipe 86 is provided with a three-way valve 99 instead of the open / close valve 88, and a recovery pipe 98 is provided between the drain pipe 86 and the tank 60 through the three-way valve 99. And the three-way valve 99
A chromaticity identification sensor 102 for identifying the chromaticity of the waste liquid in the drain pipe 86 and an opening / closing valve 104 are provided at a more upstream side. The chromaticity identification sensor 102 is, for example, a drain pipe 8.
6 has a light-emitting part and a light-receiving part disposed opposite to each other, and detects the light transmittance of the cleaning liquid. In addition, in this supply system, as in the supply system shown in FIG.
A cleaning liquid recovery pipe 66 for directly connecting the tank 60 and the pump 60 and a negative pressure pipe 76 for reducing the pressure in the tank 60 are not provided.

In the cleaning liquid supply system described above, the substrate W
When the processing liquid is applied to the exhaust pipe 82, the open / close valves 84 and 104 of the exhaust pipe 82 and the drain pipe 86 are fully opened, and all the open / close valves other than the open / close valves 84 and 104 are fully closed. Further, the three-way valve 99 of the drain pipe 86 is switched so that the liquid storage section 44 communicates with the waste liquid facility. As a result, the supply of the cleaning liquid to each cleaning nozzle is stopped, and the processing liquid collected in the liquid storage unit 44 during the coating operation is discharged to the waste liquid facility.

During the cleaning operation, the exhaust pipe 82
The opening and closing valves 84 and 104 of the drainage pipe 86 are fully closed, the opening and closing valves 64 and 74 of the cleaning liquid supply pipe 62 and the gas supply pipe 70 are fully opened, and the liquid storage section 44 communicates with the tank 60. Drain pipe 8 as
The three-way valve 99 is switched. As a result, the cleaning liquid is supplied through the cleaning liquid supply pipe 62. At this time, even if the three-way valve 99 of the drain pipe 86 is switched so that the liquid storage part 44 communicates with the tank 60 as described above, the open / close valve 104 is fully closed, so that it is used for cleaning. The washing liquid that has been collected is not collected in the tank 60, and is not collected in the tank 60.
Will accumulate.

When the cleaning operation is completed, the respective open / close valves of the exhaust pipe 82 and the drain pipe 86 are fully opened, whereby the cleaning liquid in the liquid storage section 44 is recovered in the tank 60 via the recovery pipe 98. At this time, the light transmittance of the collected cleaning liquid is detected by the chromaticity identification sensor 104. For example, when the transmittance is equal to or higher than a predetermined value, that is, when the contamination of the cleaning liquid is equal to or lower than a predetermined level, all The cleaning liquid is collected in the tank 60.

However, when the transmittance is less than a predetermined value, that is, when the contamination of the cleaning liquid exceeds a predetermined level,
The three-way valve 99 of the drain pipe 86 is switched so that the liquid storage unit 44 communicates with the waste liquid facility, whereby the cleaning liquid is discharged to the waste liquid facility. In this case, when the cleaning liquid in the tank 60 becomes equal to or less than a certain amount, the opening and closing valve 10 of the new liquid supply pipe 100
1 is opened and the new liquid is supplied to the tank 60. Thus, a certain amount of the cleaning liquid is secured in the tank 60.

According to the above-described cleaning liquid supply system, the cleaning liquid is drained while detecting the actual state of deterioration of the cleaning liquid.
In addition, since the new liquid is supplied, the cleaning liquid can be used rationally. In other words, when the cleaning liquid in the tank 60 is exchanged at a predetermined number of times of use, a cleaning liquid that is too dirty and cannot properly perform the cleaning function is used, or a cleaning liquid that has hardly deteriorated. May be drained, but if the cleaning liquid is drained based on the detection of the state of deterioration of the cleaning liquid as described above, the cleaning liquid may be drained at the most appropriate timing in relation to the state of deterioration of the cleaning liquid. Can be drained.

When supplying the new liquid, the drainage amount, that is, the supply amount corresponding to the amount of the cleaning liquid to be subjected to one cleaning is set in advance, and after the drainage, the set amount of the new liquid is supplied. Alternatively, for example, a liquid level sensor may be provided in the tank 60, and a new liquid may be supplied until a certain amount of the cleaning liquid is stored in the tank 60. Further, based on the detection of the weight of the cleaning liquid in the tank 60, a new liquid may be supplied so that a fixed amount of the cleaning liquid is stored in the tank 60. In the case where a constant amount of the cleaning liquid is stored in the tank 60 while constantly replenishing the new liquid,
It is preferable to provide an overflow pipe in the tank 60. That is, the amount of the cleaning liquid consumed in each cleaning cycle varies depending on evaporation of the cleaning liquid, adhesion to the cup or the like, or staying in the cup, and the like. May be stored in Therefore, by providing an overflow pipe, it is possible to overflow such an excessive cleaning liquid and to appropriately maintain the amount of the liquid stored in the tank 60.

Further, in this example, the deterioration state of the cleaning liquid is detected by interposing the chromaticity identification sensor 104 in the drainage pipe 86. For example, the chromaticity identification sensor is used to detect the cleaning liquid in the tank 60. When the deterioration state is detected and the cleaning liquid is contaminated by a certain level or more, the cleaning liquid used in the next cleaning operation may be drained. In this case, a pipe connecting the tank 60 and the waste liquid facility may be provided, and the entire cleaning liquid in the tank 60 may be directly discharged to the waste liquid facility via this pipe.

Incidentally, the spin coater 10 described above is used.
Is an example of a part of the treatment liquid application device according to the present invention,
The specific configuration, or the application operation and cleaning operation of the processing liquid can be appropriately changed without departing from the gist of the present invention.

For example, as long as the cleaning liquid supply system can be used repeatedly while circulating the cleaning liquid, FIGS.
The configuration may be other than each supply system shown in FIG. Further, a supply system combining the characteristic parts of the supply systems of FIGS. 5 to 8 may be configured. For example, in each of the supply systems shown in FIGS. 5 to 7, the deterioration state of the cleaning liquid may be detected by using a chromaticity identification sensor as in the supply system shown in FIG. Further, a new liquid may be added to the tanks 60, 61, 60 'of FIGS.

As in the cleaning liquid supply system shown in FIG. 6, the cleaning liquid is supplied to each of the cleaning nozzles from the tank 60, and at the same time, the cleaning liquid used for cleaning is collected in the tank 61. For example, instead of collecting all of the cleaning liquid used for cleaning, the cleaning liquid may be drained for a certain period of time immediately after the start of cleaning, and the cleaning liquid may be collected in the tank 61 after this time has elapsed. .

In other words, immediately after the start of cleaning, the cleaning liquid is often extremely dirty and is not suitable for reuse. By draining such a dirty cleaning liquid, deterioration of the recovered cleaning liquid is effectively suppressed. It becomes possible. In this case, besides switching between draining and recovery of the cleaning liquid at the time timing, for example, while the deterioration state of the cleaning liquid is detected by the chromaticity identification sensor as in the supply system of FIG. The switching between the drainage and the recovery of the cleaning liquid may be switched at a timing when the cleaning liquid drops below a certain level. In addition,
Depending on the number of washings and the type of processing solution, the use of a new solution may cause deterioration to the extent that it is not suitable for reuse if it is used only once. Instead, for example, a certain amount of a part of the cleaning liquid used for the cleaning may be collected, and a new liquid may be added to the collected cleaning liquid for use. In this way, even a dirty cleaning solution can be reused.

In the spin coater 10 according to the above-described embodiment, the cleaning liquid is repeatedly used regardless of the cleaning location of the apparatus. For example, the cleaning liquid is cleaned at a specific location using only the new liquid. May be configured. That is, for example, in the adsorption section 20a of the table 20, when a reuse cleaning liquid is used for cleaning,
It is conceivable that the suction holes for vacuum suction are clogged and the suction function is impaired. Therefore, it is preferable to clean such a portion using only a new solution. Also,
Immediately after the start of cleaning, perform rough cleaning using the reused cleaning solution,
The cleaning liquid supply system may be configured so that a new liquid is supplied after a predetermined time has elapsed to perform finish cleaning.

[0073]

As described above, according to the present invention, in a processing liquid coating apparatus for supplying a processing liquid to the surface of a substrate and forming a thin film of the processing liquid on the surface of the substrate, the cleaning liquid is discharged toward a component of the apparatus. A liquid discharging means arranged so as to be capable of being provided, and a liquid supply system for supplying a cleaning liquid to the liquid discharging means and supplying the cleaning liquid from the liquid discharging means to the device constituent parts to clean the device constituent parts, Since the supply system is configured to collect the cleaning liquid used for cleaning the part and resupply the cleaning liquid to the liquid discharging unit, the cleaning liquid used for cleaning the component part of the apparatus can be used repeatedly, and An increase in the consumption of the cleaning liquid per sheet can be effectively suppressed. Therefore, it is possible to effectively suppress an increase in substrate production cost due to an increase in the consumption of the cleaning liquid.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a spin coater which is a processing liquid coating apparatus according to the present invention.

FIG. 2 is a sectional view of a main part of a spin coater (substrate holder) for explaining the arrangement of each cleaning nozzle.

FIG. 3 is a cross-sectional view of a main part of a spin coater (lid) for explaining an arrangement of each cleaning nozzle.

FIG. 4 is a schematic diagram of a direction A in FIG. 3 for explaining a driving mechanism of a cleaning nozzle.

FIG. 5 is a diagram illustrating a supply system of a cleaning liquid to each cleaning nozzle.

FIG. 6 is a diagram illustrating a modified example (first modified example) of a cleaning liquid supply system.

FIG. 7 is a diagram illustrating a modification (second modification) of the supply system of the cleaning liquid.

FIG. 8 is a diagram illustrating a modified example (third modified example) of the supply system of the cleaning liquid.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Spin coater 12 Substrate holder 14 Lid 16 Treatment liquid supply apparatus 20 Table 22 Cup 60 Tank 62 Cleaning liquid supply pipe 64, 68, 74, 78, 84, 88 Opening / closing valve 66 Cleaning liquid collection pipe 70 Gas supply pipe 72 Regulator 76 Negative pressure pipe 82 Exhaust pipe 86 Drain pipe

Claims (1)

[Claims] In a processing liquid coating apparatus for supplying a processing liquid to a surface of a substrate held by a substrate holding unit to form a thin film of the processing liquid on the surface of the substrate, a cleaning liquid is disposed so as to be able to discharge a cleaning liquid toward a component of the apparatus. Liquid discharging means, and a liquid supply system that sends a cleaning liquid to the liquid discharging means, supplies a cleaning liquid from the liquid discharging means to the device component, and cleans the device component, and the liquid supply system includes: A processing liquid coating apparatus, wherein a cleaning liquid used for cleaning the constituent parts of the apparatus is collected and supplied to the liquid discharging means again.