TWI590362B - Pickup device - Google Patents
Pickup device Download PDFInfo
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- TWI590362B TWI590362B TW104135782A TW104135782A TWI590362B TW I590362 B TWI590362 B TW I590362B TW 104135782 A TW104135782 A TW 104135782A TW 104135782 A TW104135782 A TW 104135782A TW I590362 B TWI590362 B TW I590362B
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- 238000003825 pressing Methods 0.000 claims description 10
- 230000002093 peripheral effect Effects 0.000 description 17
- 230000004048 modification Effects 0.000 description 11
- 238000012986 modification Methods 0.000 description 11
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 230000013011 mating Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 238000007664 blowing Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
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Description
本發明係關於一種自薄片拾取電子零件之方法。 The present invention relates to a method of picking up electronic parts from a sheet.
於使用電子零件之產品的製程中,一般來說,電子零件係以貼附於薄片之狀態而供給,並藉由拾取電子零件之裝置自薄片剝起而使用。一般的裝置係一邊藉由吸著噴嘴吸著電子零件,一邊自薄片之背面以頂起銷將電子零件自薄片頂起而剝起,並在藉由吸著噴嘴加以吸著之狀態下將電子零件搬送至作業位置。 In the process of using a product of an electronic component, generally, the electronic component is supplied in a state of being attached to the sheet, and is used by peeling off the sheet by means of picking up the electronic component. In a general device, while absorbing the electronic component by the suction nozzle, the electronic component is peeled off from the back of the sheet by the jacking pin, and the electronic component is sucked by the suction nozzle. The parts are transferred to the working position.
於專利文獻1記載有自晶圓薄片拾取電子零件之頂起裝置之一例。 Patent Document 1 describes an example of a jacking device for picking up electronic components from a wafer sheet.
[專利文獻1]日本專利特開2014-197697號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2014-197697
藉由如上所述之裝置,以頂起銷自下朝上頂起被貼附於薄片之電子零件,若弄破薄片而拾取元件,便存在有殘留於弄破薄片之銷之前端的黏著劑或薄片之一部分等會附著於電子零件之背面,而殘留下來之問題。 With the device as described above, the electronic component attached to the sheet is lifted from the bottom up with the jacking pin, and if the sheet is broken and the component is picked up, there is an adhesive remaining at the front end of the pin which breaks the sheet or One of the sheets may adhere to the back side of the electronic component and remains a problem.
作為本發明所欲解決之問題,可列舉上述內容作為一例。本發明之目的,在於以使黏著劑等不殘留於電子零件背面之方式,而自薄片拾取電子零件。 As a problem to be solved by the present invention, the above contents can be cited as an example. An object of the present invention is to pick up an electronic component from a sheet so that an adhesive or the like does not remain on the back surface of the electronic component.
第1發明係一拾取裝置,其特徵在於具備有:第1工作台,其載置貼附有元件之薄片,並具有開口;第2工作台,其係設置於上述開口之內部,具有較上述元件小之載置面,並自上述薄片之下側支撐上述元件;壓力賦予手段,其對上述薄片施加壓力;及吸著噴嘴,其在對上述薄片施加壓力之狀態下,吸著上述元件而進行拾取。 According to a first aspect of the invention, a pickup device includes: a first stage on which a sheet to which an element is attached is placed, and an opening; and a second stage that is disposed inside the opening and has the above a small mounting surface of the element, and supporting the element from a lower side of the sheet; a pressure applying means for applying pressure to the sheet; and a suction nozzle for absorbing the element while applying pressure to the sheet Pick up.
1、1a‧‧‧拾取裝置 1, 1a‧‧‧ picking device
2‧‧‧框體 2‧‧‧ frame
3‧‧‧腔室 3‧‧‧ chamber
4‧‧‧排氣裝置 4‧‧‧Exhaust device
5‧‧‧吸著噴嘴 5‧‧‧Sucking nozzle
7‧‧‧頂起銷 7‧‧‧Top pin
8‧‧‧吹風機 8‧‧‧hair dryer
9‧‧‧筒狀體 9‧‧‧Cylinder
10、10a、10b、10c‧‧‧吸著平台 10, 10a, 10b, 10c‧‧‧ suction platform
11、11a、11b、11c‧‧‧拾取部 11, 11a, 11b, 11c‧‧‧ picking department
12‧‧‧開口 12‧‧‧ openings
12e‧‧‧外周緣部 12e‧‧‧The outer periphery
12ex‧‧‧外周緣部 12ex‧‧‧ outer peripheral part
13‧‧‧支撐部 13‧‧‧Support
13a‧‧‧貫通孔 13a‧‧‧through hole
13b‧‧‧支撐部 13b‧‧‧Support
14‧‧‧貫通孔 14‧‧‧through holes
15‧‧‧周邊部 15‧‧‧ peripherals
20‧‧‧薄片 20‧‧‧Sheet
21‧‧‧晶圓環 21‧‧‧ wafer ring
25‧‧‧電子零件(元件) 25‧‧‧Electronic parts (components)
40‧‧‧虛線 40‧‧‧dotted line
51~54、57~59‧‧‧箭頭 51~54, 57~59‧‧‧ arrows
圖1係顯示第1實施例之拾取裝置之概略構成。 Fig. 1 is a view showing the schematic configuration of a pickup device of a first embodiment.
圖2(A)及(B)係示意地顯示自上方觀察吸著平台之狀態。 2(A) and (B) schematically show the state of the suction platform viewed from above.
圖3(A)至(C)係顯示吸著平台之拾取部之構造。 3(A) to (C) show the construction of the pickup portion of the suction platform.
圖4係顯示第1實施例之拾取裝置之動作。 Fig. 4 is a view showing the operation of the pickup device of the first embodiment.
圖5係顯示將元件配置於拾取部之狀態之一例。 Fig. 5 is a view showing an example of a state in which an element is placed on a pickup unit.
圖6(A)及(B)係顯示第2實施例之拾取裝置之構成。 Fig. 6 (A) and (B) show the configuration of the pickup device of the second embodiment.
圖7係顯示第2實施例之拾取裝置之動作。 Fig. 7 is a view showing the operation of the pickup device of the second embodiment.
圖8係顯示變形例1之吸著平台之構造。 Fig. 8 is a view showing the configuration of a sorption platform of Modification 1.
圖9(A)及(B)係顯示變形例2之吸著平台之構造。 9(A) and (B) show the structure of the absorbing platform of the second modification.
圖10(A)及(B)係顯示變形例3之拾取裝置之例。 10(A) and (B) show an example of the pick-up device of Modification 3.
在本發明較佳之實施形態中,拾取裝置具備有:第1 工作台,其載置貼附有元件之薄片,並具有開口;第2工作台,其係設置於上述開口之內部,具有較上述元件小之載置面,並自上述薄片之下側支撐上述元件;壓力賦予手段,其對上述薄片施加壓力;及吸著噴嘴,其在對上述薄片施加壓力之狀態下,吸著上述元件而進行拾取。 In a preferred embodiment of the present invention, the pick-up device is provided with: first a table on which a sheet to which an element is attached is placed and has an opening; and a second stage provided inside the opening, having a mounting surface smaller than the above-mentioned element, and supporting the above from the lower side of the sheet a pressure applying means for applying pressure to the sheet; and a suction nozzle for sucking the element in a state where pressure is applied to the sheet to pick up.
在上述拾取裝置中,薄片係以元件位於開口上之方式被配置於第1工作台上,且元件係自薄片之下側由第2工作台所支撐。由於第2工作台之載置面較元件小,因此成為元件之一部分由第2工作台所支撐,而上述一部分以外之區域則未被支撐之狀態。而且,對薄片施加壓力,並藉由吸著噴嘴來拾取元件。 In the above pickup device, the sheet is placed on the first stage such that the element is positioned on the opening, and the element is supported by the second stage from the lower side of the sheet. Since the mounting surface of the second stage is smaller than the element, one of the components is supported by the second stage, and the area other than the above part is not supported. Moreover, pressure is applied to the sheet and the element is picked up by sucking the nozzle.
於上述拾取裝置之一態樣中,上述壓力賦予手段係藉由對上述薄片施加壓力,而將該薄片朝上述開口側剝離,上述吸著噴嘴係在上述元件自上述薄片被局部地剝起之狀態下,吸著上述元件而進行拾取。在該態樣中,藉由對薄片所施加之壓力使薄片自元件被局部地剝離。自元件被剝起之薄片係朝第1工作台與第2工作台之開口方向延伸,而不會有再次貼附於元件之情形。在該狀態下,吸著噴嘴係對元件抽吸而加以拾取。由於對薄片施加較強的壓力,而在由第2工作台所支撐之區域以外的區域將薄片自元件剝起後加以吸著,因此可使元件變得容易剝起,進而防止黏著劑等殘留於自薄片被剝起之元件上。再者,即使在假如薄片之一部分剝不起來之條件下,由於以較強之力吸著薄片,因此可使元件變得容易剝起。 In one aspect of the pick-up device, the pressure applying means peels the sheet toward the opening side by applying pressure to the sheet, and the absorbing nozzle is partially peeled off from the sheet by the member. In the state, the above components are sucked and picked up. In this aspect, the sheet is partially peeled from the component by the pressure applied to the sheet. The sheet from which the element is peeled off extends toward the opening direction of the first stage and the second stage without being attached to the element again. In this state, the suction nozzle picks up the component and picks it up. Since a strong pressure is applied to the sheet, the sheet is detached from the element after being peeled off from the element in a region other than the area supported by the second stage, so that the element can be easily peeled off, thereby preventing the adhesive or the like from remaining. From the element where the sheet is peeled off. Further, even under the condition that one of the sheets is not peeled off, since the sheet is sucked with a strong force, the element can be easily peeled off.
在上述拾取裝置之另一態樣中,上述開口大於上述元件。藉此,可將薄片自元件之外周側剝起。 In another aspect of the picking device described above, the opening is larger than the component. Thereby, the sheet can be peeled off from the outer peripheral side of the element.
在上述拾取裝置之另一態樣中,於上述第1工作台之開口內設置有貫通孔,上述壓力賦予手段係通過上述貫通孔而抽吸上述開口內部之空氣之排氣裝置。在該態樣中,藉由對位於薄片之開口內之部分施加抽吸力,而將薄片自元件剝起。 In another aspect of the pick-up device, a through hole is provided in an opening of the first table, and the pressure applying means is an exhaust device that sucks air inside the opening through the through hole. In this aspect, the sheet is stripped from the element by applying a suction force to a portion located within the opening of the sheet.
作為較佳之例子,上述貫通孔係設於上述開口之外周附近,上述壓力賦予手段係自上述元件之端部側剝離上述薄片。 In a preferred example, the through hole is provided in the vicinity of the outer circumference of the opening, and the pressure applying means peels the sheet from the end side of the element.
在上述拾取裝置之另一態樣中,上述壓力賦予手段係自上述薄片之上方對該薄片施加空氣壓之裝置。在該態樣中,藉由吹氣等而自薄片之上方施加空氣壓,而將自元件剝去薄片。 In another aspect of the above pickup device, the pressure applying means is means for applying air pressure to the sheet from above the sheet. In this aspect, the air pressure is applied from above the sheet by blowing or the like, and the sheet is peeled off from the element.
在上述拾取裝置之另一態樣中,上述壓力賦予手段係自上述薄片之上方,賦予將該薄片局部地朝上述開口側推出之推壓力的機構。在該態樣中,藉由抵接於薄片之物體施加推壓力而將薄片自元件剝起。 In another aspect of the pick-up device, the pressure applying means is a mechanism for giving a pressing force for pushing the sheet partially toward the opening side from above the sheet. In this aspect, the sheet is stripped from the element by applying a pressing force to the object abutting the sheet.
在上述拾取裝置之另一態樣中,上述開口之外周緣具有鈍角之剖面形狀。在該態樣中,可防止抵接於開口之外周緣之薄片部分變形。 In another aspect of the above pickup device, the outer periphery of the opening has an obtuse cross-sectional shape. In this aspect, it is possible to prevent the sheet portion abutting against the periphery of the opening from being deformed.
作為較佳之例子,於拾取裝置設置有複數個第2工作台。藉由設置複數個第2工作台,則即便每個第2工作台之面積小,仍可穩定地支撐元件。 As a preferred example, a plurality of second stages are provided in the pickup device. By providing a plurality of second stages, even if the area of each of the second stages is small, the elements can be stably supported.
在上述拾取裝置之另一態樣中,於上述第2工作台設置有供頂起銷通過之孔,並具備有透過上述孔而以推起上述元件之方式使上述頂起銷上下移動之頂起機構。在該態樣中,藉由頂起機構,可促進薄片自元件之剝離。 In another aspect of the pick-up device, the second table is provided with a hole through which the jacking pin passes, and a top portion for moving the jacking pin up and down to push the element through the hole. Starting the institution. In this aspect, the peeling of the sheet from the component can be promoted by the jacking mechanism.
以下,參照圖式對本發明之較佳實施例進行說明。 Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.
圖1係顯示第1實施例之拾取裝置之概略構成之剖面圖。拾取裝置1係將多數個配列於切割薄片(以下,簡稱為「薄片」)20上之電子零件或是電子元件(以下,簡稱為「元件」)25一個個地拾取,並將其移動至既定之位置。再者,在圖1中,於薄片20之外周部設置有晶圓環21。 Fig. 1 is a cross-sectional view showing a schematic configuration of a pick-up device of a first embodiment. In the pick-up device 1, a plurality of electronic components or electronic components (hereinafter simply referred to as "components") 25 arranged on a dicing sheet (hereinafter simply referred to as "slice") 20 are picked up one by one, and moved to a predetermined one. The location. Furthermore, in FIG. 1, the wafer ring 21 is provided in the outer periphery of the sheet 20.
拾取裝置1具備有:框體(本體)2、排氣裝置4、吸著噴嘴5及吸著平台10。框體2係呈圓筒形狀,並成為用於載置薄片20之基座。於框體2之上部設置有圓板狀之吸著平台10,薄片20係配置於吸著平台10上。 The pickup device 1 includes a housing (main body) 2, an exhaust device 4, a suction nozzle 5, and a suction platform 10. The casing 2 has a cylindrical shape and serves as a susceptor for placing the sheet 20. A disk-shaped suction platform 10 is disposed on the upper portion of the frame 2, and the sheet 20 is disposed on the suction platform 10.
於框體2之內部,藉由框體2之內壁與吸著平台10而形成有腔室(空間)3。此外,於框體2之側壁安裝有排氣裝置4。排氣裝置4係藉由將腔室3內之空氣朝外部排出,而對腔室3之內部進行減壓。詳細內容如後所述,但於吸著平台10設置有連通於腔室3之複數個貫通孔,並藉由驅動排氣裝置4將腔室3內部之空氣朝外部排出,產生抽吸力而將薄片20吸著於吸著平台10。 Inside the casing 2, a chamber (space) 3 is formed by the inner wall of the casing 2 and the suction platform 10. Further, an exhaust device 4 is attached to the side wall of the casing 2. The exhaust device 4 decompresses the inside of the chamber 3 by discharging the air in the chamber 3 to the outside. As will be described later, the suction platform 10 is provided with a plurality of through holes communicating with the chamber 3, and the air inside the chamber 3 is discharged to the outside by driving the exhaust device 4, thereby generating suction force. The sheet 20 is sucked onto the suction platform 10.
吸著噴嘴5係朝上下移動而拾取薄片20上之元件25。具體而言,在作為對象之元件25位於正下方之狀態下,吸著噴嘴5下降而吸著元件25。然後,吸著噴嘴5上升,在進行水平移動而將元件25搬送至既定之位置後,藉由停止抽吸放開元件25,而將其配置於既定之位置。 The suction nozzle 5 is moved up and down to pick up the component 25 on the sheet 20. Specifically, in a state where the target element 25 is positioned directly below, the suction nozzle 5 is lowered to suck the element 25. Then, the suction nozzle 5 is raised, and after the horizontal movement is performed to transport the element 25 to a predetermined position, the suction/release element 25 is stopped and placed at a predetermined position.
薄片20係藉由未圖示之水平移動機構沿水平方向移 動。藉此,被貼附於薄片20之元件25每次一個地依序移動至吸著平台10之中央的拾取位置。亦即,若吸著噴嘴5拾取1個元件25,薄片20便水平移動而使下一個元件25移動至拾取位置,吸著噴嘴5係拾取下一個元件25。藉由重覆進行上述動作,薄片20上之複數個元件25便被依序地移動至既定之位置。 The sheet 20 is moved in the horizontal direction by a horizontal moving mechanism not shown. move. Thereby, the elements 25 attached to the sheet 20 are sequentially moved one at a time to the pickup position in the center of the suction platform 10. That is, if the absorbing nozzle 5 picks up one element 25, the sheet 20 moves horizontally to move the next element 25 to the pickup position, and the absorbing nozzle 5 picks up the next element 25. By repeating the above operation, the plurality of elements 25 on the sheet 20 are sequentially moved to a predetermined position.
圖2(A)係示意地顯示自圖1中之上方所觀察吸著平台10周邊之狀態。此外,圖2(A)為了圖示上的方便,而省略薄片20。如圖2(A)所示,於吸著平台10上配置有複數個元件25。 Fig. 2(A) schematically shows the state of the periphery of the sorption platform 10 as viewed from above in Fig. 1. In addition, FIG. 2(A) omits the sheet 20 for the convenience of illustration. As shown in FIG. 2(A), a plurality of elements 25 are disposed on the suction platform 10.
圖2(B)係圖2(A)未載置有薄片20之狀態,亦即、不存在元件25之狀態的吸著平台10之俯視圖。如虛線40所示,於吸著平台10中央的拾取位置,設置有用於藉由吸著噴嘴5拾取元件25之部分(構造)11。以下,將該部分11稱為「拾取部」。吸著噴嘴5係在拾取部11自上方下降,而吸著薄片20上之元件25。在吸著平台10,將較拾取部11更外側之部分稱為「周邊部15」。 Fig. 2(B) is a plan view showing the state in which the sheet 20 is not placed in Fig. 2(A), that is, the state in which the element 25 is not present. As shown by the broken line 40, a portion (structure) 11 for picking up the component 25 by the suction nozzle 5 is provided at the pickup position at the center of the suction platform 10. Hereinafter, this portion 11 will be referred to as a "pickup portion". The suction nozzle 5 is lowered from the upper portion of the pickup portion 11 to suck the member 25 on the sheet 20. In the suction platform 10, a portion that is outside the pickup portion 11 is referred to as a "peripheral portion 15".
接著,對吸著平台10之拾取部11之構造進行說明。圖3(A)係拾取部11之立體圖。再者,圖3(A)係將圖2(B)中虛線40之內部加以放大者。 Next, the structure of the pickup unit 11 of the suction platform 10 will be described. FIG. 3(A) is a perspective view of the pickup unit 11. Further, Fig. 3(A) is an enlarged view of the inside of the broken line 40 in Fig. 2(B).
如圖所示,於拾取部11形成有矩形之開口(凹部)12。開口12之底面係成為相較於比開口12更外側之部分即周邊部15朝下方凹陷之狀態。另一方面,在吸著平台10,比開口12更外側之區域即周邊部15係成為高度均勻之平面。 As shown in the figure, a rectangular opening (concave portion) 12 is formed in the pickup portion 11. The bottom surface of the opening 12 is in a state of being recessed downward as compared with the portion outside the opening 12, that is, the peripheral portion 15. On the other hand, in the suction platform 10, the peripheral portion 15 which is the outer side of the opening 12 is a plane which is highly uniform.
於開口12之中央附近設置有島狀之支撐部13。支撐部13具有用以自下方支撐薄片20及被貼附於其上之元件25之功能。支撐部13上表面的高度係與周邊部15之高度一致。此外,於 開口12之底面形成有複數個貫通孔14。 An island-shaped support portion 13 is provided near the center of the opening 12. The support portion 13 has a function of supporting the sheet 20 from below and the member 25 attached thereto. The height of the upper surface of the support portion 13 coincides with the height of the peripheral portion 15. In addition, A plurality of through holes 14 are formed in the bottom surface of the opening 12.
圖3(B)係以虛線表示拾取部11中元件25之位置。如圖所示,支撐部13之上表面小於元件25之面積。此外,開口12大於元件25之面積。藉此,元件25係於被支撐在支撐部13上之狀態下,收容於開口12之內側。再者,由於支撐部13小於元件25,因此成為元件25之中央附近雖由支撐部13支撐,但元件25之外周附近卻未被支撐部13支撐之狀態。 Fig. 3(B) shows the position of the element 25 in the pickup unit 11 by a broken line. As shown, the upper surface of the support portion 13 is smaller than the area of the element 25. Furthermore, the opening 12 is larger than the area of the element 25. Thereby, the element 25 is housed inside the opening 12 while being supported by the support portion 13. Further, since the support portion 13 is smaller than the element 25, the vicinity of the center of the element 25 is supported by the support portion 13, but the vicinity of the outer periphery of the element 25 is not supported by the support portion 13.
圖3(C)係圖3(B)之A-A’剖面圖,其顯示薄片20被配置於吸著平台10上之狀態。在將薄片20載置於吸著平台10之狀態下,薄片20之下表面係抵接於周邊部15及支撐部13而由該等所支撐。更詳細而言,在開口12之內側,薄片20之下表面僅抵接於支撐部13之上表面,而在該內側抵接有支撐部13以外之區域,於薄片20之下方則形成有開口12之深度的空間。 Fig. 3(C) is a cross-sectional view taken along line A-A' of Fig. 3(B) showing a state in which the sheet 20 is placed on the suction platform 10. In a state where the sheet 20 is placed on the absorbing platform 10, the lower surface of the sheet 20 is abutted against the peripheral portion 15 and the support portion 13 and supported by the same. More specifically, on the inner side of the opening 12, the lower surface of the sheet 20 abuts only on the upper surface of the support portion 13, and an area other than the support portion 13 is abutted on the inner side, and an opening is formed below the sheet 20. 12 depth space.
於開口12之底面形成有複數個貫通孔14。貫通孔14係貫通吸著平台10,而與圖1所示之腔室3相通。藉此,若驅動排氣裝置4,存在於薄片20與開口12之間的空間內之空氣,便會透過貫通孔14朝腔室3被排出。藉此,在開口12內係產生將薄片20向下拉之抽吸力。詳細內容雖如後所述,但藉由該抽吸力可使薄片20自元件25之下表面被局部地剝離。 A plurality of through holes 14 are formed in the bottom surface of the opening 12. The through hole 14 passes through the suction platform 10 and communicates with the chamber 3 shown in FIG. Thereby, when the exhaust device 4 is driven, the air existing in the space between the sheet 20 and the opening 12 is discharged through the through hole 14 toward the chamber 3. Thereby, a suction force for pulling the sheet 20 downward is generated in the opening 12. Although the details are as described later, the sheet 20 can be partially peeled off from the lower surface of the member 25 by the suction force.
再者,在上述構成中,吸著平台10之周邊部15係相當於本發明之第1工作台,而支撐部13係相當於本發明之第2工作台。此外,排氣裝置4、腔室3、貫通孔14係相當於本發明之壓力賦予手段。 Further, in the above configuration, the peripheral portion 15 of the suction platform 10 corresponds to the first table of the present invention, and the support portion 13 corresponds to the second table of the present invention. Further, the exhaust device 4, the chamber 3, and the through hole 14 correspond to the pressure applying means of the present invention.
接著,對拾取裝置1之動作進行說明。圖4係顯示藉 由拾取裝置1拾取1個元件25之步驟。再者,作為前提,係設定為於吸著平台10上配置有薄片20,且作為拾取對象之元件25係配置於吸著平台10之拾取部11上。 Next, the operation of the pickup device 1 will be described. Figure 4 shows the loan The step of picking up one element 25 by the pickup device 1. Further, as a premise, the sheet 20 is placed on the suction platform 10, and the element 25 to be picked up is placed on the pickup unit 11 of the suction platform 10.
首先,在步驟1中,如箭頭51所示,吸著噴嘴5下降,而吸著作為對象之元件25之上表面。 First, in step 1, as indicated by an arrow 51, the suction nozzle 5 is lowered to attract the upper surface of the target member 25.
其次,在步驟2中,排氣裝置4運作而使吸著平台10下方之腔室3減壓,如箭頭52所示,開口12內之空氣便透過貫通孔14而朝腔室3被排出。藉此,在元件25之周邊部分,於薄片20被施加有箭頭53所示之抽吸力。 Next, in step 2, the exhaust device 4 operates to decompress the chamber 3 below the suction platform 10. As indicated by the arrow 52, the air in the opening 12 is discharged through the through hole 14 toward the chamber 3. Thereby, the suction force indicated by the arrow 53 is applied to the sheet 20 at the peripheral portion of the element 25.
如此,如步驟3所示,薄片20係在開口12內如箭頭54所示般被向下拉,而自元件25之下表面被剝離。此處,如參照圖3(B)所說明,由於支撐部13小於元件25,因此薄片20係自元件25之外周側逐漸地被剝起。然後,如步驟N所示,薄片20僅剩下藉由支撐部13所支撐之區域,而自元件25之下表面被剝起。再者,在該狀態下,以箭頭54所示之拉力係在由薄片20之支撐部13所支撐之區域中成為大致水平方向。 Thus, as shown in step 3, the sheet 20 is pulled down in the opening 12 as indicated by the arrow 54, and the lower surface of the element 25 is peeled off. Here, as described with reference to FIG. 3(B), since the support portion 13 is smaller than the element 25, the sheet 20 is gradually peeled off from the outer peripheral side of the element 25. Then, as shown in step N, the sheet 20 leaves only the area supported by the support portion 13, and the lower surface of the element 25 is peeled off. Further, in this state, the pulling force indicated by the arrow 54 is substantially horizontal in the region supported by the support portion 13 of the sheet 20.
如此,若薄片20除了抵接於支撐部13之區域以外,自元件25之下表面被剝起,則在步驟X~步驟Y中,吸著噴嘴5便如箭頭51所示般上升,將元件25自薄片20剝起而進行拾取。此時,如步驟N所示,由於元件25在抵接於支撐部13之區域以外處已經自薄片20被剝離,因此即使吸著噴嘴5之吸著力並不大,亦可容易地拾取元件25。再者,於步驟Y中,在吸著噴嘴5拾取元件25之後,停止排氣裝置4。 Thus, if the sheet 20 is peeled off from the lower surface of the element 25 except for the area in contact with the support portion 13, the suction nozzle 5 rises as indicated by the arrow 51 in steps X to Y, and the element is moved. 25 is peeled off from the sheet 20 to be picked up. At this time, as shown in the step N, since the element 25 has been peeled off from the sheet 20 at a position other than the region abutting on the support portion 13, even if the suction force of the suction nozzle 5 is not large, the member 25 can be easily picked up. . Further, in step Y, after the suction nozzle 5 picks up the component 25, the exhaust device 4 is stopped.
如此,在第1實施例之拾取裝置1中,由於藉由利用 排氣裝置4所產生之抽吸力,可在抵接於支撐部13之區域以外之區域將薄片20自元件25之下表面剝離,因此即使吸著噴嘴5之吸著力較小,亦可容易地自薄片20拾取元件25。此外,由於藉由吸著噴嘴5之上升,可在支撐部13之區域中將元件25之下表面自薄片20剝離,因此可防止於黏著劑等附著在元件25之下表面之狀態下拾取元件25。 Thus, in the pickup device 1 of the first embodiment, by utilizing The suction force generated by the exhaust device 4 can peel the sheet 20 from the lower surface of the element 25 in a region other than the region abutting on the support portion 13, so that even if the suction force of the suction nozzle 5 is small, it is easy. The component 25 is picked up from the sheet 20. Further, since the lower surface of the member 25 is peeled off from the sheet 20 in the region of the support portion 13 by the rise of the suction nozzle 5, it is possible to prevent the pickup member from being attached to the lower surface of the member 25 while the adhesive or the like is attached. 25.
其次,對支撐部13之大小(上表面之面積)進行檢討。如上所述,由於薄片20係藉由利用排氣裝置4所產生之抽吸力,而在抵接於支撐部13之區域以外之區域自元件25之下表面被剝起,因此支撐部13之上表面之面積較小者,於利用吸著噴嘴5進行拾取前,可將薄片20較多之區域自元件25剝離。另一方面,由於支撐部13具有支撐薄片20及其上之元件25之功能,因此若將其之面積設為過小,由支撐部13對元件25之支撐便會不穩定,而有對吸著噴嘴5所進行的吸著動作造成妨礙之可能性。因此,支撐部13之面積較佳為在可確保由吸著噴嘴5進行之吸著動作時所必要之穩定性的範圍內,盡可能地小。 Next, the size of the support portion 13 (the area of the upper surface) is reviewed. As described above, since the sheet 20 is peeled off from the lower surface of the member 25 in a region other than the region abutting on the support portion 13 by the suction force generated by the exhaust device 4, the support portion 13 is When the area of the upper surface is smaller, a large area of the sheet 20 can be peeled off from the element 25 before being picked up by the suction nozzle 5. On the other hand, since the support portion 13 has the function of supporting the sheet 20 and the member 25 thereon, if the area thereof is made too small, the support of the member 25 by the support portion 13 is unstable, and there is a pair of suction. The possibility that the suction operation by the nozzle 5 is hindered is caused. Therefore, the area of the support portion 13 is preferably as small as possible within a range that can ensure the stability necessary for the suction operation by the suction nozzle 5.
其次,對貫通孔14進行檢討。貫通孔14較佳為基本上於開口12內以均等之間隔設置複數個。以可得到將薄片20自元件25之下表面剝離所需要之抽吸力之方式,來調整貫通孔14之個數及位置、以及各貫通孔14之大小等。此外,為了如上述般將薄片20自元件25之外周側逐漸地剝起,較佳為將貫通孔14形成在對應於元件25之外周之位置,即開口12之外周附近。 Next, the through hole 14 is reviewed. The through holes 14 are preferably provided in a plurality of substantially equal intervals in the opening 12. The number and position of the through holes 14 and the size of each of the through holes 14 are adjusted so that the suction force required to peel the sheet 20 from the lower surface of the element 25 can be obtained. Further, in order to gradually peel the sheet 20 from the outer peripheral side of the element 25 as described above, it is preferable to form the through hole 14 at a position corresponding to the outer circumference of the element 25, that is, near the outer circumference of the opening 12.
再者,在上述實施例中,將開口12之大小設為較元件25大。具體而言,如圖3(B)所示,開口12縱橫的長度較矩形之 元件25縱橫的長度長,而成為元件25之外周可收容於開口12之內側之大小。不過,亦可僅在縱橫中之任一者,使開口12的大小大於元件25。圖5係顯示該情形的例子。矩形之元件25a,雖然圖中縱方向的長度較開口12短,但橫方向的長度較開口12長,在橫方向上元件25a係超出開口12之外部。於該情形時,即便藉由排氣裝置4施加抽吸力,雖然在元件25左右之端部,無法將薄片20自元件25剝起,但在上下之端部,則可將薄片20自元件25剝起。此外,即便於元件25之橫方向上,雖然在周邊部15上之區域無法將薄片20自元件25剝起,但較其內側之區域,即在開口12內之區域,則可藉由抽吸力使薄片20之黏著力降低。因此,元件25之整體可不必為可收容於開口12之內側之大小關係,亦可藉由排氣裝置4之抽吸力而得到將薄片20自元件25剝離之效果。 Furthermore, in the above embodiment, the size of the opening 12 is made larger than the element 25. Specifically, as shown in FIG. 3(B), the length of the opening 12 is longer than the rectangle. The length of the element 25 is long and horizontal, and the outer circumference of the element 25 can be accommodated inside the opening 12. However, the size of the opening 12 may be made larger than the element 25 only in either of the vertical and horizontal directions. Fig. 5 shows an example of this case. The rectangular element 25a has a length in the longitudinal direction that is shorter than the opening 12, but the length in the lateral direction is longer than the opening 12, and the element 25a extends beyond the opening 12 in the lateral direction. In this case, even if the suction force is applied by the exhaust device 4, the sheet 20 cannot be peeled off from the element 25 at the left and right end portions of the element 25, but the sheet 20 can be self-assembled at the upper and lower ends. 25 peeled off. Further, even in the lateral direction of the element 25, although the area on the peripheral portion 15 cannot peel the sheet 20 from the element 25, the area on the inner side, that is, the area inside the opening 12, can be suctioned. The force reduces the adhesion of the sheet 20. Therefore, the entire element 25 need not be sized to be accommodated inside the opening 12, and the effect of peeling the sheet 20 from the element 25 can be obtained by the suction force of the exhaust device 4.
接著,對本發明之第2實施例進行說明。除了第1實施例之特徵以外,第2實施例還具有利用頂起銷7之特徵。 Next, a second embodiment of the present invention will be described. In addition to the features of the first embodiment, the second embodiment has the feature of using the jacking pin 7.
圖6(A)係顯示第2實施例之拾取裝置1a之構成的剖面圖。第2實施例之拾取裝置1a係除了第1實施例之拾取裝置1以外,還在框體2內部配置有頂起銷7。頂起銷7係藉由未圖示之機構,如箭頭57所示般進行上下移動。 Fig. 6(A) is a cross-sectional view showing the configuration of the pickup device 1a of the second embodiment. In the pick-up device 1a of the second embodiment, in addition to the pick-up device 1 of the first embodiment, a jacking pin 7 is disposed inside the casing 2. The jacking pin 7 is moved up and down as indicated by an arrow 57 by a mechanism (not shown).
圖6(A)係拾取裝置1a之吸著平台10a之拾取部11a的立體圖。與圖3(A)比較即可得知,在第2實施例之拾取部11a中,於支撐部13之大致中央形成有貫通孔13a。貫通孔13a係貫通吸著平台11a,而連通於框體2內部的腔室3。頂起銷7係位於該貫通孔13a之下方。於自薄片20拾取元件25時,頂起銷7會上升,並 通過貫通孔13a而將元件25之下表面朝上方推起。藉此,元件25被抬起而變得容易自薄片20被剝起。亦即,頂起銷7之上升,可促進薄片20自元件25的剝離。再者,除了該等以外之構成,第2實施例之拾取裝置1a係與第1實施例之拾取裝置1相同。 Fig. 6(A) is a perspective view of the pickup portion 11a of the suction platform 10a of the pickup device 1a. As can be seen from comparison with FIG. 3(A), in the pick-up portion 11a of the second embodiment, a through hole 13a is formed substantially at the center of the support portion 13. The through hole 13a passes through the suction platform 11a and communicates with the chamber 3 inside the casing 2. The jacking pin 7 is located below the through hole 13a. When picking up the component 25 from the sheet 20, the jacking pin 7 will rise, and The lower surface of the element 25 is pushed upward by the through hole 13a. Thereby, the element 25 is lifted up and becomes easily peeled off from the sheet 20. That is, the rise of the jacking pin 7 promotes the peeling of the sheet 20 from the element 25. In addition to the above configuration, the pickup device 1a of the second embodiment is the same as the pickup device 1 of the first embodiment.
圖7係顯示藉由拾取裝置1a拾取1個元件25之步驟。再者,作為前提,於吸著平台10a上配置有薄片20,且作為拾取對象之元件25係配置於吸著平台10a之拾取部11a。 Fig. 7 shows the step of picking up one element 25 by the pickup device 1a. Further, as a premise, the sheet 20 is placed on the suction platform 10a, and the element 25 to be picked up is disposed on the pickup unit 11a of the suction platform 10a.
首先,在步驟1中,如箭頭51所示,吸著噴嘴5係下降,而吸著作為對象之元件25之上表面。 First, in step 1, as indicated by an arrow 51, the suction nozzle 5 is lowered to attract the upper surface of the target member 25.
其次,在步驟2中,排氣裝置4運作而如箭頭52所示般,使開口12內之空氣通過貫通孔14而朝腔室3被排出,在元件25之周邊部分,對薄片20施加有抽吸力。此外,頂起銷7上升,而抵接於薄片20之下表面。 Next, in step 2, the exhaust device 4 operates to cause the air in the opening 12 to be discharged toward the chamber 3 through the through hole 14 as indicated by the arrow 52, and the sheet 20 is applied to the peripheral portion of the member 25. Suction force. Further, the jacking pin 7 is raised to abut against the lower surface of the sheet 20.
在步驟3中,薄片20係在開口12內被向下拉,而自元件25之下表面被剝起。除此之外,藉由頂起銷7上升而將薄片20之下表面抬起,以促進薄片20之剝離。 In step 3, the sheet 20 is pulled down within the opening 12 and is peeled off from the lower surface of the element 25. In addition to this, the lower surface of the sheet 20 is lifted by raising the jacking pin 7 to promote peeling of the sheet 20.
如此,若薄片20除了支撐部13之區域以外,自元件25之下表面被剝起,則在步驟X~步驟Y中,吸著噴嘴5便如箭頭51所示般上升,吸著噴嘴5係將元件25自薄片20剝離並加以拾取。於步驟Y中,在吸著噴嘴5拾取元件25之後,排氣裝置4便停止。 Thus, if the sheet 20 is peeled off from the lower surface of the element 25 except for the region of the support portion 13, in the step X to the step Y, the suction nozzle 5 is raised as indicated by the arrow 51, and the nozzle 5 is sucked. Element 25 is peeled from sheet 20 and picked up. In step Y, after the suction nozzle 5 picks up the component 25, the exhaust device 4 is stopped.
如上所述,在第2實施例中,藉由利用頂起銷7將薄片20朝上方抬起,可促進薄片20自元件25的剝離。藉此,可防止黏著劑等殘留於被拾取之元件25上。 As described above, in the second embodiment, peeling of the sheet 20 from the element 25 can be promoted by lifting the sheet 20 upward by the jacking pin 7. Thereby, it is possible to prevent the adhesive or the like from remaining on the picked-up element 25.
於第1及第2實施例中,雖然在拾取部11之開口12內設置1個支撐部13,但亦可設置複數個支撐部而加以取代。圖8係顯示變形例1之吸著平台10b之拾取部11b。於圖8之例中,在開口12內設置4個支撐部13b。與第1及第2實施例之支撐部13相同地,4個支撐部13b係自下方支撐薄片20及元件25。此外,於4個支撐部13b之間設置有複數個貫通孔14。藉由該構造,可利用排氣裝置4所產生之吸著力,在4個支撐部13b以外之區域,將薄片20自元件25之下表面剝離。 In the first and second embodiments, one support portion 13 is provided in the opening 12 of the pickup unit 11, but a plurality of support portions may be provided instead. Fig. 8 shows the pickup portion 11b of the absorbing platform 10b of the first modification. In the example of Fig. 8, four support portions 13b are provided in the opening 12. Similarly to the support portions 13 of the first and second embodiments, the four support portions 13b support the sheet 20 and the element 25 from below. Further, a plurality of through holes 14 are provided between the four support portions 13b. With this configuration, the sheet 20 can be peeled off from the lower surface of the element 25 in a region other than the four support portions 13b by the suction force generated by the exhaust device 4.
再者,在圖8之例子中,雖設置4個支撐部13,但支撐部13之數量亦可為任意數。藉由設置複數個支撐部13,則即便每個支撐部13之面積較小,亦可穩定地支撐元件。此外,藉由於設置有複數個之支撐部13的周圍設置貫通孔14,可促進薄片20之剝離。 Further, in the example of Fig. 8, although four support portions 13 are provided, the number of the support portions 13 may be any number. By providing a plurality of support portions 13, even if the area of each support portion 13 is small, the components can be stably supported. Further, by providing the through holes 14 around the plurality of support portions 13, the peeling of the sheets 20 can be promoted.
圖9(A)係顯示圖3(B)所示之拾取部11之A-A’剖面。如圖所示,在第1、第2實施例及變形例1中,拾取部11之開口12之外周緣部12e,其剖面係呈大致直角。於該情形時,若驅動排氣裝置4而將薄片20吸向腔室3側,抽吸力便會集中於外周緣部12e之角落,將存在薄片20會局部地延伸而變形之情形。若薄片20局部地變形,則會有為了使下一元件25朝拾取部11移動,而在薄片20水平移動時造成妨礙之情形。 Fig. 9(A) shows the A-A' cross section of the pickup unit 11 shown in Fig. 3(B). As shown in the figure, in the first and second embodiments and the first modification, the outer peripheral edge portion 12e of the opening 12 of the pickup portion 11 has a substantially right angle in cross section. In this case, when the ejector unit 4 is driven to suck the sheet 20 toward the chamber 3 side, the suction force is concentrated on the corner of the outer peripheral edge portion 12e, and the sheet 20 is partially extended and deformed. If the sheet 20 is partially deformed, there is a case where the sheet member 20 is horizontally moved in order to move the next member 25 toward the pickup portion 11.
因此,在變形例2中,如圖9(B)所示,將拾取部11c 之外周緣部12ex之剖面形狀設為鈍角,使其成為平緩之傾斜。藉此,可防止在薄片20被抽吸時,抽吸力局部地集中而使薄片20局部地變形。 Therefore, in Modification 2, as shown in FIG. 9(B), the pickup portion 11c is to be used. The cross-sectional shape of the outer peripheral edge portion 12ex is an obtuse angle, so that it has a gentle inclination. Thereby, it is possible to prevent the suction force from being locally concentrated when the sheet 20 is sucked, and the sheet 20 is locally deformed.
在上述第1、第2實施例及變形例1、2中,於拾取裝置1設置排氣裝置4,而在拾取部11之開口12內將薄片20向下吸,藉此將薄片20自元件25剝離。不過,亦可設為自薄片20之上方施加壓力,藉此將薄片20自元件25剝離。 In the first and second embodiments and the first and second modifications, the exhaust device 4 is provided in the pickup device 1, and the sheet 20 is sucked downward in the opening 12 of the pickup portion 11, whereby the sheet 20 is self-assembled. 25 peeling. However, it is also possible to apply pressure from above the sheet 20, thereby peeling the sheet 20 from the element 25.
例如,在圖10(A)之例子中,於吸著噴嘴5之外周設置吹風機8,如箭頭58所示般朝下方吹送空氣(air),即進行送風,藉此將薄片20自元件25剝離。吹風機8之剖面形狀,較佳為配合元件之俯視形狀。亦即,若元件25之俯視形狀為矩形,則吹風機8之剖面形狀較佳為較元件25之剖面形狀稍大之矩形。再者,藉由吹風機8所進行之送風,較佳為在作為拾取之對象的元件25之外周附近且不會吹到周圍之元件25之區域進行。 For example, in the example of Fig. 10(A), the blower 8 is provided on the outer circumference of the suction nozzle 5, and air is blown downward as indicated by an arrow 58, i.e., air is blown, whereby the sheet 20 is peeled off from the member 25. . The cross-sectional shape of the blower 8 is preferably a top view shape of the mating component. That is, if the element 25 has a rectangular shape in plan view, the cross-sectional shape of the blower 8 is preferably a rectangle slightly larger than the cross-sectional shape of the element 25. Further, the air blow by the blower 8 is preferably carried out in the vicinity of the outer periphery of the element 25 which is the object of picking up and is not blown to the surrounding element 25.
在圖10(B)之例子中,於吸著噴嘴5之外周設置樹脂等之筒狀體9。使筒狀體9如箭頭59所示般下降而壓抵於薄片20,即施加壓抵力,藉此將薄片20自元件25剝離。於該情形時,筒狀體9之剖面形狀,較佳亦為配合元件之俯視形狀,若元件25之俯視形狀為矩形,則筒狀體9之剖面形狀較佳為較元件25之俯視形狀稍大之矩形。再者,筒狀體9必須設為不會接觸作為拾取對象之元件25之周圍之元件25的大小。 In the example of FIG. 10(B), the cylindrical body 9 of resin or the like is provided on the outer circumference of the suction nozzle 5. The cylindrical body 9 is lowered as shown by an arrow 59 to be pressed against the sheet 20, that is, a pressing force is applied, whereby the sheet 20 is peeled off from the element 25. In this case, the cross-sectional shape of the tubular body 9 is preferably a plan view of the mating component. If the planar shape of the component 25 is rectangular, the cross-sectional shape of the tubular body 9 is preferably slightly larger than the planar shape of the component 25. Large rectangle. Further, the cylindrical body 9 must be set to a size that does not contact the element 25 around the element 25 to be picked up.
1‧‧‧拾取裝置 1‧‧‧ picking device
2‧‧‧框體 2‧‧‧ frame
3‧‧‧腔室 3‧‧‧ chamber
4‧‧‧排氣裝置 4‧‧‧Exhaust device
5‧‧‧吸著噴嘴 5‧‧‧Sucking nozzle
10‧‧‧吸著平台 10‧‧‧ suction platform
20‧‧‧薄片 20‧‧‧Sheet
21‧‧‧晶圓環 21‧‧‧ wafer ring
25‧‧‧電子零件(元件) 25‧‧‧Electronic parts (components)
Claims (9)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015120862A JP2017005222A (en) | 2015-06-16 | 2015-06-16 | Pickup device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201701388A TW201701388A (en) | 2017-01-01 |
| TWI590362B true TWI590362B (en) | 2017-07-01 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104135782A TWI590362B (en) | 2015-06-16 | 2015-10-30 | Pickup device |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2017005222A (en) |
| TW (1) | TWI590362B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7421950B2 (en) * | 2020-02-25 | 2024-01-25 | リンテック株式会社 | Sheet peeling method and sheet peeling device |
| CN112599467B (en) * | 2020-12-15 | 2022-08-09 | 长江存储科技有限责任公司 | Die picking method and device |
| TWI800003B (en) * | 2021-09-23 | 2023-04-21 | 均華精密工業股份有限公司 | Chip peeling apparatus and chip pre-peeling device |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01321651A (en) * | 1988-06-22 | 1989-12-27 | Kawasaki Steel Corp | Pick-up device for semiconductor chip |
| JPH0371642U (en) * | 1989-11-16 | 1991-07-19 | ||
| JP2000353710A (en) * | 1999-06-14 | 2000-12-19 | Toshiba Corp | Pellet pickup device and method of manufacturing semiconductor device |
| CH697213A5 (en) * | 2004-05-19 | 2008-06-25 | Alphasem Ag | Method and apparatus for peeling a film adhered to a flexible component. |
| JP2006319150A (en) * | 2005-05-13 | 2006-11-24 | Nec Corp | Semiconductor chip pick-up device and method therefor |
| JP2016219573A (en) * | 2015-05-19 | 2016-12-22 | 富士通株式会社 | Pickup apparatus and method |
-
2015
- 2015-06-16 JP JP2015120862A patent/JP2017005222A/en active Pending
- 2015-10-30 TW TW104135782A patent/TWI590362B/en active
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| JP2017005222A (en) | 2017-01-05 |
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