TWI584175B - Touch module and manufacturing method thereof - Google Patents

Description

Touch module and manufacturing method thereof

The present invention relates to an electronic device and a method of manufacturing the same. In particular, it relates to a touch module and a method of manufacturing the same.

With the rapid development of electronic technology, touch modules have been widely used in various electronic devices, such as mobile phones, tablets, and the like.

A typical touch module can be disposed on the display screen, for example, and includes a plurality of touch electrodes. When an object (finger or touch pen, etc.) approaches or touches the display screen, the corresponding touch electrode generates an electrical signal, thereby achieving touch sensing.

In the manufacturing process, the conductive material between the touch electrodes is generally removed by etching to pattern the touch electrodes and insulate the touch electrodes from each other. However, the removal of a portion of the conductive material and the removal of only a portion of the conductive material result in a non-uniform refractive index of the touch module, which affects the optical consistency of the appearance of the touch module.

Therefore, in order to avoid uneven light refractive index of the touch module, a touch module is provided in one aspect of the present invention. According to an embodiment of the present disclosure, a touch module includes a substrate, at least one first touch electrode, at least one second touch electrode, and an insulating block. The first touch electrode is formed on the substrate. The second touch electrode is formed on the substrate and is parallel to the first touch electrode. Insulation block embedding Formed in the substrate and located between the first touch electrode and the second touch electrode. The first touch electrode is electrically insulated from the second touch electrode.

According to an embodiment of the present invention, the first touch electrode, the second touch electrode and the insulating block are formed of the same conductive material layer and have the same conductive material, and the insulating block is dispersed and electrically conductive. The material is insulated to have a separate conductive material.

According to an embodiment of the present disclosure, the insulating block is located around the first touch electrode and the second touch electrode.

According to an embodiment of the present invention, an orthographic projection of the insulating block on the surface of the substrate is between an orthographic projection of the first touch electrode and the second touch electrode on a surface of the substrate.

According to an embodiment of the present invention, the first touch electrode, the second touch electrode, and the orthographic projection of the insulating block on a surface of the substrate do not overlap.

According to an embodiment of the present invention, the touch module further includes a plurality of wires electrically connected to the first touch electrode and the second touch electrode.

According to an embodiment of the present invention, the touch module further includes a plurality of auxiliary wires respectively located under the wires and electrically connected to the wires.

According to an embodiment of the present invention, the touch module further includes a plurality of contact pads disposed on the first touch electrodes and the second touch electrodes, and a plurality of wires electrically connected to the contact pads.

According to an embodiment of the present disclosure, the first touch electrode and the second touch electrode are fishbone shaped.

Another embodiment of the present disclosure discloses a method of manufacturing a touch module. The manufacturer The method includes: providing a substrate; and forming at least one first touch electrode and at least one first touch electrode on the substrate, and simultaneously embedding to form an insulating block in the substrate, wherein the insulating block is located at the first touch The first touch electrode is electrically insulated from the second touch electrode.

According to an embodiment of the present invention, the step of forming the first touch electrode and the first touch electrode on the substrate and simultaneously embedding the insulating block in the substrate comprises: providing a conductive material layer on the substrate Providing a plurality of masks and a plurality of wires on the conductive material layer; and insulating a portion of the conductive material layer exposed to the masks to form the first touch electrode and the second touch Control electrode, and the insulating block.

According to an embodiment of the present invention, the manufacturing method further includes: providing a plurality of strips before insulating the portion of the conductive material layer to form the first touch electrode, the second touch electrode, and the insulating block A wire is on the layer of electrically conductive material.

According to an embodiment of the present invention, the step of insulating the portion of the conductive material exposed to the portions of the mask to form the first touch electrode, the second touch electrode, and the insulating block comprises: Dispersing a conductive material in the conductive material layer exposed to the mask and a first portion other than the wires to insulate the first portion of the conductive material layer to form the insulating block, And the plurality of second portions of the conductive material layer under the masks respectively form the first touch electrode and the second touch electrode.

According to an embodiment of the present invention, the step of insulating the conductive material layer to be exposed to a portion of the mask to form the first touch electrode, the second touch electrode, and the insulating block further includes : forming a plurality of auxiliary wires in the plurality of third portions of the conductive material layer under the plurality of wires.

According to an embodiment of the present invention, the dispersing the conductive material in the conductive material layer exposed to the mask and a first portion other than the wires comprises: providing an embedding liquid exposed in the conductive material layer The first portion of the mask and the first portion of the conductive material are dispersed outside the mask to disperse the conductive material in the first portion of the conductive material layer.

According to an embodiment of the present invention, the manufacturing method further includes: insulating a portion of the conductive material layer exposed to the masks to form the first touch electrode, the second touch electrode, and the Prior to insulating the block, a plurality of contact pads are provided on the layer of electrically conductive material.

According to an embodiment of the present invention, the step of insulating the portion of the conductive material exposed to the portions of the mask to form the first touch electrode, the second touch electrode, and the insulating block comprises: Dispersing a conductive material in the conductive material layer exposed to the mask and a first portion outside the contact pads to insulate the first portion of the conductive material layer to form the insulating block And the plurality of second portions of the conductive material layer under the masks respectively form the first touch electrode and the second touch electrode, and the conductive material layer is located in the contact layer The plurality of third portions below form a plurality of auxiliary wires.

According to an embodiment of the present invention, the manufacturing method further includes: providing a plurality of wires on the conductive material layer, and electrically connecting the contact pads respectively.

According to an embodiment of the present invention, an orthographic projection of the insulating block on a surface of the substrate is between an orthogonal projection of the first touch electrode and the second touch electrode on the surface of the substrate.

According to an embodiment of the present invention, the first touch electrode, the second touch electrode, and the orthographic projection of the insulating block on a surface of the substrate do not overlap.

In summary, a touch module can be implemented by applying the above embodiment. The touch electrodes can be insulated from each other by forming insulating blocks in the substrate. In this way, the touch electrode can be prevented from being patterned by etching, and the optical refractive index of the touch module is not uniform, thereby affecting the optical consistency of the appearance of the touch module.

100‧‧‧ touch module

110‧‧‧Substrate

120‧‧‧ Conductive material layer

122‧‧‧ second part

124‧‧‧ first part

126‧‧‧Part III

SF1‧‧‧ surface

E1‧‧‧first touch electrode

INS‧‧‧Insulated block

MT‧‧‧Metal wire

TR‧‧‧Transparent wire

PD‧‧‧ contact pads

MSK1‧‧‧ mask

MSK2‧‧‧ mask

AUX‧‧‧Auxiliary wire

SNW‧‧Nee silver wire

200‧‧‧Manufacture method

S1-S2‧‧‧ steps

1A-3A are schematic views of a method for manufacturing a touch module according to an embodiment of the present invention; and FIGS. 1B-3B are cross-sectional views of the touch module of FIG. 1A-3A along a line Aa direction; 4 is a cross-sectional view showing a touch electrode and an insulating block according to a comparative example of the present invention; and FIGS. 5A-7A are schematic views showing a method of manufacturing a touch module according to an embodiment of the present invention; 7B is a cross-sectional view of the touch module of FIG. 5A-7A along the direction of the line Aa; FIG. 8A-11A is a schematic diagram of a method for manufacturing the touch module according to an embodiment of the present invention; 11B is a cross-sectional view of the touch module of FIG. 8A-11A along the direction of the line Aa; FIG. 12A is a schematic diagram of a step in the manufacturing method of the touch module according to an embodiment of the present disclosure; FIG. 12B is a cross-sectional view of the touch module of FIG. 12A along the line Aa direction; FIG. 13A-14A is a schematic diagram of a method for manufacturing the touch module according to an embodiment of the present invention; 14B is a cross-sectional view of the touch module of FIG. 13A-14A along the direction of the line Aa; FIG. 15A-16A is according to the present case. FIG. 15B-16B are cross-sectional views of the touch module of FIG. 15A-16A along the line Aa direction; FIG. 17A is a schematic diagram of a step in the manufacturing method of the touch module; -20A is a schematic diagram of a method for manufacturing a touch module according to an embodiment of the present disclosure FIG. 17B is a cross-sectional view of the touch module of FIG. 17A-20A along the line Aa direction; FIG. 21A is a diagram of a method for manufacturing a touch module according to an embodiment of the present disclosure; FIG. 21B is a cross-sectional view of the touch module of FIG. 21A along the line Aa direction; FIG. 22A-25A is a method of manufacturing a touch module according to an embodiment of the present invention. FIG. 22B is a cross-sectional view of the touch module of FIG. 22A-25A along the line Aa direction; FIG. 26A is a diagram of a method for manufacturing a touch module according to an embodiment of the present disclosure; FIG. 26B is a cross-sectional view of the touch module of FIG. 26A along the line Aa direction; and FIG. 27 is a flow chart of a method for manufacturing the touch module according to an embodiment of the present invention. Figure.

The spirit and scope of the present disclosure will be apparent from the following description of the preferred embodiments of the present disclosure. Modifications do not depart from the spirit and scope of the disclosure.

The use of the terms "first", "second", ", etc." as used herein does not specifically mean the order or the order, and is not intended to limit the present invention. It is merely to distinguish between elements or operations described in the same technical terms.

Regarding the directional terms used in this article, such as: up, down, left, right, front or back, etc., only refer to the direction of the additional schema. Therefore, the direction used is used to explain Not used to limit this creation.

The terms "including", "including", "having", "containing", etc., as used in this document are all open terms, meaning, but not limited to.

With respect to "and/or" as used herein, it is meant to include any or all combinations of the recited.

The terms used in this document, unless otherwise specified, generally have the usual meaning of each term used in the art, in the context of the disclosure, and in the particular content. Certain terms used to describe the disclosure are discussed below or elsewhere in this specification to provide additional guidance to those skilled in the art in the description of the disclosure.

One embodiment of the present invention is a method of manufacturing a touch module. In the following paragraphs, the present invention will be described by using the following first to sixth embodiments as examples. However, the present invention is not limited to the details in the following embodiments, and other embodiments are also within the scope of the present invention.

First embodiment

1A-3A are schematic diagrams showing a method of fabricating a touch module 100 according to an embodiment of the present invention. 1B-3B are cross-sectional views of the touch module 100 of FIG. 1A-3A taken along line A-a.

First, referring specifically to FIGS. 1A and 1B, in a first step, a conductive material layer 120 is provided on the upper surface SF1 of the substrate 110. Next, in a second step, a plurality of metal wires MT are provided on the conductive material layer 120.

In one embodiment, an embedding solvent containing a conductive additive is provided on the upper surface SF1 of the substrate 110 to partially embed the conductive additive in the substrate 110 to form a conductive material layer. 120. That is, the conductive material layer 120 is a portion The portion is embedded on the upper surface SF1 of the substrate 110.

In one embodiment, the substrate 110 is, for example, polymethyl methacrylate (PMMA), polycarbonate (PC), polyethylene terephthalate (PET), cyclic olefin. It is realized by a suitable polymer material such as a cycloolefin polymer (COP). In one embodiment, the embedding fluid containing the conductive additive is achieved, for example, by dissolving the conductive additive in a specific solvent, wherein the solubility parameter of the specific solvent is close to the dissolution of the material of the substrate 110. The parameter is such that the conductive additive dissolved in the specific solvent penetrates into the substrate 110 to achieve an embedding effect. In one embodiment, the conductive additive is, for example, a suitable conductive material such as a carbon nanotube, a nanowire, a conductive paste, a conductive polymer, a graphite thinner, or a nano metal.

By providing an embedding liquid containing a conductive additive on the upper surface SF1 of the substrate 110 formed of a polymer material, a portion of the substrate 110 adjacent to the upper surface SF1 may be expanded to allow a part of the conductive additive to penetrate into the substrate 110. Among them, to achieve partial embedding effect.

In order to clarify the description, in the following paragraphs, the above-mentioned conductive additive will be described by taking a silver nanowire as an example, but the present invention is not limited thereto.

2A and 2B, in a third step, a plurality of first masks MSK1 and second masks MSK2 are provided on the conductive material layer 120 and a portion of the metal wires MT. In one embodiment, the first mask MSK1 is used to pattern the first touch electrode E1 in a subsequent step, and the second mask MSK2 is used to pattern the second touch electrode E2 in a subsequent step.

At this time, the conductive material layer 120 includes a first portion 124 exposed outside the masks MSK1, MSK2 and the metal wires MT, a second portion 122 under the masks MSK1, MSK2, and under the metal wires MT. And contacting the third portion 126 of the metal wire MT.

In one embodiment, a transparent material layer is first formed on the conductive material layer 120 and the metal wire MT, and then a portion of the transparent material layer is removed to form the first mask MSK1 and the second layer. Mask MSK2. In an embodiment, the removal process can be implemented by yellow etching or dry etching, but the present invention is not limited thereto.

In an embodiment, the first mask MSK1 and the second mask MSK2 can be implemented, for example, by a photoresist material or other transparent conductive or non-conductive materials, but the present invention is not limited thereto.

Referring to FIG. 3A and FIG. 3B, in a fourth step, the first portion 124 of the conductive material layer 120 is insulated to form a first touch electrode E1, a second touch electrode E2, and an auxiliary conductor AUX. And insulating block INS.

Further, in the fourth step, the conductive material (such as a nano silver wire) exposed in a first portion 124 of the conductive material layer 120 exposed to the masks MSK1, MSK2 and the metal wires MT is dispersed. The conductive material is further sunk and dispersed into the substrate 110 to form the insulating block INS, and the conductive material layer 120 is located under the first mask MSK1 and contacts the second portion 122 of the first mask MSK1. Forming the first touch electrode E1, the second portion 122 of the conductive material layer 120 under the second mask MSK2 and contacting the second mask MSK2 forms the second touch electrode E2, and the conductive material layer 120 is The third portion 126 located under the metal wire MT and contacting the metal wire MT forms the auxiliary wire AUX.

In one embodiment, the conductive material layer is dispersed by providing an embedding liquid containing no conductive additive to the first portion 124 of the conductive material layer 120 outside the masks MSK1, MSK2 and the metal wires MT. The conductive material in the first portion 124 of 120 causes the conductive material to further sink and disperse into the substrate 110 to form an embedded insulating block INS in the substrate 110.

For example, refer specifically to Figure 4. As shown in FIG. 4, the plurality of nano silver wires SNW under the first mask MSK1 are connected to each other to form a first touch electrode E1 having conductivity, and further, exposed to the first mask MSK1 and the metal wires. The nano silver wire SNW outside the MT is not connected to each other due to being dispersed by the embedding liquid containing no conductive additive to form an insulating block INS having no conductivity. In other words, the touch electrodes E1, E2 and the auxiliary wires AUX have conductive substances electrically connected to each other, and the insulating blocks INS have conductive substances that are dispersed and electrically isolated from each other.

In one embodiment, the embedding fluid without the conductive additive is achieved, for example, by the aforementioned specific solvent having specific dissolution parameters.

In one embodiment, the insulating block INS is formed between the touch electrodes E1 and E2 to insulate the touch electrodes E1 and E2 from each other. In an embodiment, the insulating block INS is also formed around the touch electrodes E1 and E2. In an embodiment, the insulating block INS is exposed to the upper surface SF1 of the substrate 110.

The touch module 100 can be realized by the above manufacturing method. The insulating block INS is formed in the substrate 110 to insulate the touch electrodes E1 and E2 from each other. In this way, the touch electrodes E1 and E2 can be prevented from being patterned by etching, and the optical refractive index of the touch module 100 can be prevented from being uneven, thereby affecting the optical consistency of the appearance of the touch module 100.

In other words, by the method of dispersing the conductive material of the conductive material layer 120 to form the insulating block INS in the substrate 110, the touch electrodes E1 and E2, the auxiliary conductive line AUX and the insulating block INS may be on the upper surface SF1 of the substrate 110. The upper orthographic projections have substantially no gaps or substantially no overlap. That is, the positive projections of the touch electrodes E1, E2, the auxiliary wires AUX and the insulating blocks INS on the upper surface SF1 of the substrate 110 may form a complete plane. In this way, the optical consistency of the appearance of the touch module 100 can be avoided due to the uneven refractive index.

It is noted that the term "roughly" in this case is used to modify the amount of slight variations and the slight errors caused by the manufacturing process, but such slight variations and slight errors do not change their nature. For example, in the process of forming the insulating block INS, an error may occur, so that there is a slight gap between the touch electrodes E1, E2, the metal wires MT, and the orthographic projection of the insulating block INS on the upper surface SF1 of the substrate 110. Or slightly overlapping. However, some of the slight errors caused by the manufacturing process are also within the scope of this case.

In an embodiment, the orthographic projection of the insulating block INS on the upper surface SF1 of the substrate 110 is between the orthographic projections of the touch electrodes E1, E2 on the upper surface SF1 of the substrate 100. In an embodiment, the orthographic projection of the insulating block INS on the upper surface SF1 of the substrate 110 is located around the orthographic projection of the touch electrodes E1, E2 on the upper surface SF1 of the substrate 100.

In one embodiment, the touch electrodes E1, E2 are alternately arranged along a first direction. In one embodiment, the touch electrode E1 is located under the mask MSK1, and the touch electrode E2 is located under the mask MSK2.

In an embodiment, the touch electrodes E1 and E2 are all fishbone. That is, each of the touch electrodes E1 and E2 includes a trunk and a plurality of branches electrically connected to the trunk. These branches are placed on opposite sides of the trunk. It should be noted that the above embodiments are merely illustrative, and the touch electrodes E1 and E2 of other shapes are also in the scope of the present case, and thus the present invention is not limited thereto.

In an embodiment, the touch electrodes E1 and E2 are physically and electrically separated from each other.

In an embodiment, the masks MSK1, MSK2 are alternately arranged along a first direction. In one embodiment, the masks MSK1, MSK2 are all fishbone shaped.

In an embodiment, the masks MSK1, MSK2 are separated from one another. In an embodiment, the masks MSK1, MSK2 do not overlap each other between the orthographic projections on the upper surface SF1 of the substrate 100.

In an embodiment, the masks MSK1 and MSK2 are selectively removed after the touch electrodes E1 and E2 are formed to further improve the appearance of the touch module 100. Therefore, the present invention is not limited to the above embodiments.

In an embodiment, the auxiliary conductor AUX is located below the metal conductor MT. In an embodiment, the auxiliary wires AUX are electrically connected to the metal wires MT, and are electrically connected to the touch electrodes E1 and E2, respectively. In an embodiment, the auxiliary wire AUX can assist the metal wire MT to transmit the touch signal.

In an embodiment, the auxiliary wire AUX, the insulating block INS, and the touch electrodes E1, E2 have the same conductive material.

On the other hand, it should be noted that in a variant embodiment of the present disclosure, the substrate 110 may include an active layer (not shown) and a bottom layer (not shown). The active layer is disposed on the bottom layer, and the touch electrodes E1, E2 and the auxiliary wires AUX are partially embedded on the active layer of the substrate 110, and the insulating block INS is formed on the active layer of the substrate 110. in.

In one embodiment, the bottom layer can be a rigid or soft material, such as glass, polyethylene terephthalate (PET), and/or polycarbonate (PC). The active layer can be realized, for example, by a suitable polymer material such as polymethyl acrylate, polyvinyl chloride (PVC), and/or polystyrene.

In one embodiment, since the first touch electrode E1, the second touch electrode E2, and the insulating block INS are formed of the same conductive material layer 120, they have the same conductive material. The insulating block INS has a conductive material separated from the conductive material layer 120 by an insulating treatment of the conductive material in the dispersed conductive material layer 120 (i.e., the aforementioned embedding process).

Second embodiment

In the following, through the second embodiment, another manufacturing method of the touch module 100 is provided. law. This manufacturing method is substantially the same as the manufacturing method in the first embodiment, and the difference is only in the order in which the masks MSK1, MSK2 and the metal wires MT are provided. Therefore, in the following description, the repeated parts will not be described.

5A-7A are schematic diagrams showing a method of fabricating a touch module 100 according to an embodiment of the present invention. 5B-7B are cross-sectional views of the touch module 100 of FIGS. 5A-7A taken along line A-a.

First, referring specifically to FIGS. 5A and 5B, in a first step, a conductive material layer 120 is provided on the upper surface SF1 of the substrate 110. Next, in a second step, a plurality of first masks MSK1 and second masks MSK2 are provided on the conductive material layer 120.

In the present embodiment, the details of the conductive material layer 120 and the masks MSK1, MSK2 can be referred to the foregoing paragraphs, and thus will not be described herein.

Next, referring to FIG. 6A and FIG. 6B, in a third step, a plurality of metal wires MT are provided on the conductive material layer 120, the first mask MSK1, and the second mask MSK2.

At this time, the conductive material layer 120 includes a first portion 124 exposed outside the masks MSK1, MSK2 and the metal wires MT, a second portion 122 under the masks MSK1, MSK2, and under the metal wires MT. And contacting the third portion 126 of the metal wire MT.

In the present embodiment, the details of the metal wire MT can be referred to the foregoing paragraphs, and thus will not be described herein.

Next, referring to FIG. 7A and FIG. 7B, in a fourth step, the first portion 124 of the conductive material layer 120 is insulated to form a first touch electrode E1, a second touch electrode E2, an auxiliary lead AUX, And insulating block INS.

Further, in the fourth step, the dispersed conductive material layer 120 is exposed a conductive substance (such as a nano silver wire) in a first portion 124 other than the MSK1, MSK2 and the metal wires MT, and further sinking and dispersing the conductive materials into the substrate 110 to form an insulation The block INS, and the second portion 122 of the conductive material layer 120 under the first mask MSK1 and contacting the first mask MSK1 forms the first touch electrode E1, and the second layer of the conductive material layer 120 is located The second portion 122 under the cover MSK2 and contacting the second mask MSK2 forms the second touch electrode E2, and forms the third portion 126 of the conductive material layer 120 under the metal wire MT and contacting the metal wire MT to form an auxiliary. Wire AUX.

In the present embodiment, the details of the conductive material in the first portion 124 of the dispersed conductive material layer 120 exposed to the masks MSK1, MSK2 and the metal wires MT can be referred to the foregoing paragraphs, and thus will not be described herein.

In one embodiment, the insulating block INS is formed between the touch electrodes E1 and E2 to insulate the touch electrodes E1 and E2 from each other. In an embodiment, the insulating block INS is also formed around the touch electrodes E1 and E2. In an embodiment, the insulating block INS is exposed to the upper surface SF1 of the substrate 110.

The touch module 100 can be realized by the above manufacturing method. The insulating block INS is formed in the substrate 110 to insulate the touch electrodes E1 and E2 from each other. In this way, the touch electrodes E1 and E2 can be prevented from being patterned by etching, and the optical refractive index of the touch module 100 can be prevented from being uneven, thereby affecting the optical consistency of the appearance of the touch module 100.

In other words, by the method of dispersing the conductive material of the conductive material layer 120 to form the insulating block INS in the substrate 110, the touch electrodes E1 and E2, the auxiliary conductive line AUX and the insulating block INS may be on the upper surface SF1 of the substrate 110. The upper orthographic projections have substantially no gaps or substantially no overlap. That is, the touch electrodes E1, E2, the auxiliary wire AUX and the insulating block INS are on the substrate 110. The orthographic projection on the upper surface SF1 can form a complete plane. In this way, the optical consistency of the appearance of the touch module 100 can be avoided due to the uneven refractive index.

In an embodiment, the orthographic projection of the insulating block INS on the upper surface SF1 of the substrate 110 is between the orthographic projections of the touch electrodes E1, E2 on the upper surface SF1 of the substrate 100. In an embodiment, the orthographic projection of the insulating block INS on the upper surface SF1 of the substrate 110 is located around the orthographic projection of the touch electrodes E1, E2 on the upper surface SF1 of the substrate 100.

In one embodiment, the touch electrodes E1, E2 are alternately arranged along a first direction. In one embodiment, the touch electrode E1 is located under the mask MSK1, and the touch electrode E2 is located under the mask MSK2.

In an embodiment, the touch electrodes E1 and E2 are all fishbone. That is, each of the touch electrodes E1 and E2 includes a trunk and a plurality of branches electrically connected to the trunk. These branches are placed on opposite sides of the trunk. It should be noted that the above embodiments are merely illustrative, and the touch electrodes E1 and E2 of other shapes are also in the scope of the present case, and thus the present invention is not limited thereto.

In an embodiment, the touch electrodes E1 and E2 are physically and electrically separated from each other.

In an embodiment, the masks MSK1, MSK2 are alternately arranged along a first direction. In one embodiment, the masks MSK1, MSK2 are all fishbone shaped.

In an embodiment, the masks MSK1, MSK2 are separated from one another. In an embodiment, the masks MSK1, MSK2 do not overlap each other between the orthographic projections on the upper surface SF1 of the substrate 100.

In an embodiment, the masks MSK1 and MSK2 are selectively removed after the touch electrodes E1 and E2 are formed to further improve the appearance of the touch module 100. Therefore, the present invention is not limited to the above embodiments.

In an embodiment, the auxiliary conductor AUX is located below the metal conductor MT. In a In the embodiment, the auxiliary wires AUX are electrically connected to the metal wires MT, and are electrically connected to the touch electrodes E1 and E2, respectively. In an embodiment, the auxiliary wire AUX can assist the metal wire MT to transmit the touch signal.

In an embodiment, the auxiliary wire AUX, the insulating block INS, and the touch electrodes E1, E2 have the same conductive material.

On the other hand, in the embodiment, the substrate 110 may also include an active layer (not shown) and a bottom layer (not shown), and details are not described herein.

Third embodiment

Another method of manufacturing the touch module 100 will be provided below through the third embodiment. This manufacturing method is substantially the same as the manufacturing method in the second embodiment, except that the present embodiment further provides the transparent wiring TR. Therefore, in the following description, the repeated parts will not be described.

8A-11A are schematic diagrams showing a method of fabricating a touch module 100 according to an embodiment of the present invention. 8B-11B are cross-sectional views of the touch module 100 of FIG. 8A-11A taken along line A-a.

First, referring specifically to FIGS. 8A and 8B, in a first step, a conductive material layer 120 is provided on the upper surface SF1 of the substrate 110. Next, in a second step, a plurality of transparent wires TR are provided on the conductive material layer 120.

In an embodiment, the transparent wire TR may be formed of a transparent conductive material.

In the present embodiment, the details of the conductive material layer 120 can be referred to the foregoing paragraphs, and thus will not be described herein.

Next, referring to FIG. 9A and FIG. 9B, in a third step, a plurality of first masks MSK1 and second masks MSK2 are provided on the conductive material layer 120 and a portion of the transparent wires TR.

At this time, the conductive material layer 120 includes a first portion 124 exposed outside the masks MSK1, MSK2 and the transparent wires TR, a second portion 122 under the masks MSK1, MSK2, and under the transparent wires TR. And contacting the third portion 126 of the transparent wire TR.

In the present embodiment, the details of the masks MSK1 and MSK2 can be referred to the foregoing paragraphs, and thus will not be described herein.

Then, referring to FIG. 10A and FIG. 10B, in a fourth step, the first portion 124 of the conductive material layer 120 is insulated to form a first touch electrode E1, a second touch electrode E2, an auxiliary lead AUX, And insulating block INS.

Further, in the fourth step, the conductive material (such as a nano silver wire) exposed in a first portion 124 of the conductive material layer 120 exposed to the masks MSK1, MSK2 and the transparent wire TR is dispersed. The conductive material is further sunk and dispersed into the substrate 110 to form the insulating block INS, and the conductive material layer 120 is located under the first mask MSK1 and contacts the second portion 122 of the first mask MSK1. Forming the first touch electrode E1, the second portion 122 of the conductive material layer 120 under the second mask MSK2 and contacting the second mask MSK2 forms the second touch electrode E2, and the conductive material layer 120 is The third portion 126 located under the transparent wire TR and contacting the transparent wire TR forms the auxiliary wire AUX.

In the present embodiment, details of the conductive material in the first portion 124 of the dispersed conductive material layer 120 exposed to the masks MSK1, MSK2 and the transparent conductive line TR can be referred to the foregoing paragraphs, and thus will not be described herein.

Next, referring specifically to FIGS. 11A and 11B, in a fifth step, a metal wire MT is provided over the transparent wire TR and the masks MSK1, MSK2.

In this embodiment, the details of the metal wire MT can refer to the foregoing paragraph, so This will not go into details.

The touch module 100 can be realized by the above manufacturing method. The insulating block INS is formed in the substrate 110 to insulate the touch electrodes E1 and E2 from each other. In this way, the touch electrodes E1 and E2 can be prevented from being patterned by etching, and the optical refractive index of the touch module 100 can be prevented from being uneven, thereby affecting the optical consistency of the appearance of the touch module 100.

In other words, by the method of dispersing the conductive material of the conductive material layer 120 to form the insulating block INS in the substrate 110, the touch electrodes E1 and E2, the auxiliary conductive line AUX and the insulating block INS may be on the upper surface SF1 of the substrate 110. The upper orthographic projections have substantially no gaps or substantially no overlap. That is, the positive projections of the touch electrodes E1, E2, the auxiliary wires AUX and the insulating blocks INS on the upper surface SF1 of the substrate 110 may form a complete plane. In this way, the optical consistency of the appearance of the touch module 100 can be avoided due to the uneven refractive index.

In an embodiment, the orthographic projection of the insulating block INS on the upper surface SF1 of the substrate 110 is between the orthographic projections of the touch electrodes E1, E2 on the upper surface SF1 of the substrate 100. In an embodiment, the orthographic projection of the insulating block INS on the upper surface SF1 of the substrate 110 is located around the orthographic projection of the touch electrodes E1, E2 on the upper surface SF1 of the substrate 100.

In one embodiment, the touch electrodes E1, E2 are alternately arranged along a first direction. In one embodiment, the touch electrode E1 is located under the mask MSK1, and the touch electrode E2 is located under the mask MSK2.

In an embodiment, the touch electrodes E1 and E2 are all fishbone. That is, each of the touch electrodes E1 and E2 includes a trunk and a plurality of branches electrically connected to the trunk. These branches are placed on opposite sides of the trunk. It should be noted that the above embodiments are merely illustrative, and the touch electrodes E1 and E2 of other shapes are also in the scope of the present case, and thus the present invention is not limited thereto.

In an embodiment, the touch electrodes E1 and E2 are physically and electrically separated from each other.

In an embodiment, the masks MSK1, MSK2 are alternately arranged along a first direction. In one embodiment, the masks MSK1, MSK2 are all fishbone shaped.

In an embodiment, the masks MSK1, MSK2 are separated from one another. In an embodiment, the masks MSK1, MSK2 do not overlap each other between the orthographic projections on the upper surface SF1 of the substrate 100.

In an embodiment, the masks MSK1 and MSK2 are selectively removed after the touch electrodes E1 and E2 are formed to further improve the appearance of the touch module 100. Therefore, the present invention is not limited to the above embodiments.

In an embodiment, the auxiliary conductor AUX is located below the transparent conductor TR. In one embodiment, the auxiliary wire AUX is electrically connected to the transparent wire TR and the metal wire MT, and electrically connected to the touch electrodes E1 and E2, respectively. In an embodiment, the auxiliary wire AUX can assist the transparent wire TR and the metal wire MT to transmit the touch signal.

In an embodiment, the auxiliary wire AUX, the insulating block INS, and the touch electrodes E1, E2 have the same conductive material.

In an embodiment, the metal wire MT can assist the transparent wire TR to transmit the touch signal.

On the other hand, in the embodiment, the substrate 110 may also include an active layer (not shown) and a bottom layer (not shown), and details are not described herein.

It is noted that the order of forming the metal wire MT and forming the first touch electrode E1, the second touch electrode E2, the auxiliary wire AUX, and the insulating block INS can be changed according to actual needs, instead of being in the above embodiment. Said to be limited.

For example, referring to Figures 12A and 12B, in the foregoing corresponding Figures 9A and 9B After the third step (that is, after forming the masks MSK1, MSK2), the metal wires MT may be first provided on the transparent wires TR and the masks MSK1, MSK2 in the fourth step, and then in correspondence with FIGS. 11A and 11B. In the fifth step, the first portion 124 of the conductive material layer 120 is insulated to form a first touch electrode E1, a second touch electrode E2, an auxiliary wire AUX, and an insulating block INS.

It should be noted that the specific details of these steps can be referred to the foregoing paragraphs, and thus will not be described herein.

Fourth embodiment

Another method of manufacturing the touch module 100 will be provided below through the fourth embodiment. This manufacturing method is substantially the same as the manufacturing method in the first embodiment, except that the transparent wire TR and the masks MSK1, MSK2 in the present embodiment are formed of the same material, and the transparent wire TR is formed and the mask is formed. The steps of MSK1 and MSK2 are integrated in the same process. Therefore, in the following description, the repeated parts will not be described.

13A-14A are schematic diagrams showing a method of fabricating a touch module 100 according to an embodiment of the present invention. 13B-14B are cross-sectional views of the touch module 100 of FIG. 13A-14A taken along line A-a.

First, referring specifically to FIGS. 13A and 13B, in a first step, a conductive material layer 120 is provided on the upper surface SF1 of the substrate 110. Next, in a second step, a plurality of transparent wires TR and masks MSK1, MSK2 are provided on the conductive material layer 120.

In an embodiment, the transparent wire TR and the masks MSK1, MSK2 may be formed of a transparent conductive material. In one embodiment, the transparent wire TR and the masks MSK1, MSK2 are formed of the same material. Thereby, the steps of forming the transparent wiring TR and forming the masks MSK1, MSK2 can be integrated in the same process.

At this time, the conductive material layer 120 includes a first portion 124 exposed outside the masks MSK1, MSK2 and the transparent wires TR, a second portion 122 under the masks MSK1, MSK2, and under the transparent wires TR. And contacting the third portion 126 of the transparent wire TR.

Next, referring to FIG. 14A and FIG. 14B, in a third step, the first portion 124 of the conductive material layer 120 is insulated to form a first touch electrode E1, a second touch electrode E2, an auxiliary lead AUX, And insulating block INS.

Further, in the third step, the conductive material (such as a nano silver wire) exposed in a first portion 124 of the conductive material layer 120 exposed to the masks MSK1, MSK2 and the transparent wire TR is dispersed. The conductive material is further sunk and dispersed into the substrate 110 to form the insulating block INS, and the conductive material layer 120 is located under the first mask MSK1 and contacts the second portion 122 of the first mask MSK1. The first touch electrode E1 is formed, and the second portion 122 of the conductive material layer 120 under the first mask MSK2 and contacting the second mask MSK2 forms the second touch electrode E2 and is disposed in the conductive material layer 120. The third portion 126 located under the transparent wire TR and contacting the transparent wire TR forms the auxiliary wire AUX.

In the present embodiment, details of the conductive material in the first portion 124 of the dispersed conductive material layer 120 exposed to the masks MSK1, MSK2 and the transparent conductive line TR can be referred to the foregoing paragraphs, and thus will not be described herein.

The touch module 100 can be realized by the above manufacturing method. The insulating block INS is formed in the substrate 110 to insulate the touch electrodes E1 and E2 from each other. In this way, the touch electrodes E1 and E2 can be prevented from being patterned by etching, and the optical refractive index of the touch module 100 can be prevented from being uneven, thereby affecting the optical consistency of the appearance of the touch module 100.

In other words, the conductive material of the conductive material layer 120 is dispersed on the substrate The method of forming the insulating block INS in 110 can make the touch electrodes E1, E2, the auxiliary wires AUX and the insulating block INS have substantially no gap or substantially no overlap between the orthographic projections on the upper surface SF1 of the substrate 110. That is, the positive projections of the touch electrodes E1, E2, the auxiliary wires AUX and the insulating blocks INS on the upper surface SF1 of the substrate 110 may form a complete plane. In this way, the optical consistency of the appearance of the touch module 100 can be avoided due to the uneven refractive index.

In an embodiment, the orthographic projection of the insulating block INS on the upper surface SF1 of the substrate 110 is between the orthographic projections of the touch electrodes E1, E2 on the upper surface SF1 of the substrate 100. In an embodiment, the orthographic projection of the insulating block INS on the upper surface SF1 of the substrate 110 is located around the orthographic projection of the touch electrodes E1, E2 on the upper surface SF1 of the substrate 100.

In one embodiment, the touch electrodes E1, E2 are alternately arranged along a first direction. In one embodiment, the touch electrode E1 is located under the mask MSK1, and the touch electrode E2 is located under the mask MSK2.

In an embodiment, the touch electrodes E1 and E2 are all fishbone. That is, each of the touch electrodes E1 and E2 includes a trunk and a plurality of branches electrically connected to the trunk. These branches are placed on opposite sides of the trunk. It should be noted that the above embodiments are merely illustrative, and the touch electrodes E1 and E2 of other shapes are also in the scope of the present case, and thus the present invention is not limited thereto.

In an embodiment, the touch electrodes E1 and E2 are physically and electrically separated from each other.

In an embodiment, the masks MSK1, MSK2 are alternately arranged along a first direction. In one embodiment, the masks MSK1, MSK2 are all fishbone shaped.

In an embodiment, the masks MSK1, MSK2 are separated from one another. In an embodiment, the masks MSK1, MSK2 do not overlap each other between the orthographic projections on the upper surface SF1 of the substrate 100.

In an embodiment, the masks MSK1, MSK2 can form the touch electrode E1. The E2 is selectively removed to further improve the appearance of the touch module 100. Therefore, the present invention is not limited to the above embodiment.

In an embodiment, the auxiliary conductor AUX is located below the transparent conductor TR. In an embodiment, the auxiliary wires AUX are electrically connected to the transparent wires TR, and are electrically connected to the touch electrodes E1 and E2, respectively. In an embodiment, the auxiliary wire AUX can assist the transparent wire TR to transmit the touch signal.

In an embodiment, the auxiliary wire AUX, the insulating block INS, and the touch electrodes E1, E2 have the same conductive material.

On the other hand, in the embodiment, the substrate 110 may also include an active layer (not shown) and a bottom layer (not shown), and details are not described herein.

It is noted that in some variant embodiments, a metal wire MT may be provided on the transparent wire TR to assist the transparent wire TR to transmit the touch signal.

For example, referring specifically to FIGS. 15A-16A and 15B-16B, after the second step described above (ie, after forming the masks MSK1, MSK2 and the transparent wires TR), the third step corresponding to FIGS. 13A and 13B may be performed. Then, the metal wire MT is first provided on the transparent wire TR (as shown in FIGS. 15A and 15B), and then the first portion 124 of the conductive material layer 120 is insulated in the fourth step to form the first touch electrode E1. The second touch electrode E2, the auxiliary wire AUX, and the insulating block INS (as shown in FIGS. 16A and 16B).

It should be noted that the specific details of these steps can be referred to the foregoing paragraphs, and thus will not be described herein.

Fifth embodiment

A method of manufacturing another touch module 100 will be provided below through the fifth embodiment. This manufacturing method is substantially the same as the manufacturing method in the third embodiment, and the only difference is that This embodiment provides a contact pad PD instead of a transparent wire TR. Therefore, in the following description, the repeated parts will not be described.

17A-20A are schematic diagrams showing a method of fabricating a touch module 100 according to an embodiment of the present invention. 17B-20B are cross-sectional views of the touch module 100 of FIGS. 17A-20A taken along line A-a.

First, referring specifically to FIGS. 17A and 17B, in a first step, a conductive material layer 120 is provided on the upper surface SF1 of the substrate 110. Next, in a second step, a plurality of contact pads PD are provided on the conductive material layer 120.

In an embodiment, the contact pads PD may be formed of a transparent conductive material.

In the present embodiment, the details of the conductive material layer 120 can be referred to the foregoing paragraphs, and thus will not be described herein.

Next, with particular reference to FIGS. 18A and 18B, in a third step, a plurality of first masks MSK1 and second masks MSK2 are provided on the conductive material layer 120 and a portion of the contact pads PD.

At this time, the conductive material layer 120 includes a first portion 124 exposed outside the masks MSK1, MSK2 and the contact pads PD, a second portion 122 under the masks MSK1, MSK2, and under the contact pads PD. And contacting the third portion 126 of the contact pad PD.

In the present embodiment, the details of the masks MSK1 and MSK2 can be referred to the foregoing paragraphs, and thus will not be described herein.

Next, referring to FIG. 19A and FIG. 19B, in a fourth step, the first portion 124 of the conductive material layer 120 is insulated to form a first touch electrode E1, a second touch electrode E2, an auxiliary lead AUX, And insulating block INS.

Further, in the fourth step, the conductive material (such as a nano silver wire) exposed in a first portion 124 of the conductive material layer 120 exposed to the masks MSK1, MSK2 and the contact pads PD is dispersed, and The conductive material is further sunk and dispersed into the substrate 110 to form the insulating block INS, and the conductive material layer 120 is located under the first mask MSK1 and contacts the second portion 122 of the first mask MSK1. Forming the first touch electrode E1, the second portion 122 of the conductive material layer 120 under the second mask MSK2 and contacting the second mask MSK2 forms the second touch electrode E2, and the conductive material layer 120 is The third portion 126 located under the contact pad PD and contacting the contact pad PD forms the auxiliary lead AUX.

In the present embodiment, the details of the conductive material in the first portion 124 of the dispersed conductive material layer 120 exposed to the masks MSK1, MSK2 and the contact pads PD can be referred to the foregoing paragraphs, and thus will not be described herein.

Next, referring specifically to FIGS. 20A and 20B, in a fifth step, a metal wire MT is provided over the contact pad PD and the insulating block INS.

In the present embodiment, the details of the metal wire MT can be referred to the foregoing paragraphs, and thus will not be described herein.

The touch module 100 can be realized by the above manufacturing method. The insulating block INS is formed in the substrate 110 to insulate the touch electrodes E1 and E2 from each other. In this way, the touch electrodes E1 and E2 can be prevented from being patterned by etching, and the optical refractive index of the touch module 100 can be prevented from being uneven, thereby affecting the optical consistency of the appearance of the touch module 100.

In other words, by the method of dispersing the conductive material of the conductive material layer 120 to form the insulating block INS in the substrate 110, the touch electrodes E1 and E2, the auxiliary conductive line AUX and the insulating block INS may be on the upper surface SF1 of the substrate 110. There is no gap or roughly between the orthographic projections on the top overlapping. That is, the positive projections of the touch electrodes E1, E2, the auxiliary wires AUX and the insulating blocks INS on the upper surface SF1 of the substrate 110 may form a complete plane. In this way, the optical consistency of the appearance of the touch module 100 can be avoided due to the uneven refractive index.

Further, by the above-described manufacturing method, it is possible to prevent the metal wire MT from being short-circuited by contacting the conductive material in the substrate 110.

In an embodiment, the orthographic projection of the insulating block INS on the upper surface SF1 of the substrate 110 is between the orthographic projections of the touch electrodes E1, E2 on the upper surface SF1 of the substrate 100. In an embodiment, the orthographic projection of the insulating block INS on the upper surface SF1 of the substrate 110 is located around the orthographic projection of the touch electrodes E1, E2 on the upper surface SF1 of the substrate 100.

In one embodiment, the touch electrodes E1, E2 are alternately arranged along a first direction. In one embodiment, the touch electrode E1 is located under the mask MSK1, and the touch electrode E2 is located under the mask MSK2.

In an embodiment, the touch electrodes E1 and E2 are all fishbone. That is, each of the touch electrodes E1 and E2 includes a trunk and a plurality of branches electrically connected to the trunk. These branches are placed on opposite sides of the trunk. It should be noted that the above embodiments are merely illustrative, and the touch electrodes E1 and E2 of other shapes are also in the scope of the present case, and thus the present invention is not limited thereto.

In an embodiment, the touch electrodes E1 and E2 are physically and electrically separated from each other.

In an embodiment, the masks MSK1, MSK2 are alternately arranged along a first direction. In one embodiment, the masks MSK1, MSK2 are all fishbone shaped.

In an embodiment, the masks MSK1, MSK2 are separated from one another. In an embodiment, the masks MSK1, MSK2 do not overlap each other between the orthographic projections on the upper surface SF1 of the substrate 100.

In an embodiment, the masks MSK1, MSK2 can form the touch electrode E1. The E2 is selectively removed to further improve the appearance of the touch module 100. Therefore, the present invention is not limited to the above embodiment.

In an embodiment, the auxiliary lead AUX is located below the contact pad PD. In an embodiment, the auxiliary wire AUX is electrically connected to the contact pad PD and the metal wire MT, and electrically connected to the touch electrodes E1 and E2, respectively. In an embodiment, the auxiliary wire AUX can assist the touch electrodes E1, E2 and the metal wire MT to transmit touch signals.

In an embodiment, the auxiliary wire AUX, the insulating block INS, and the touch electrodes E1, E2 have the same conductive material.

On the other hand, in the embodiment, the substrate 110 may also include an active layer (not shown) and a bottom layer (not shown), and details are not described herein.

It is noted that the order of forming the metal wire MT and forming the first touch electrode E1, the second touch electrode E2, the auxiliary wire AUX, and the insulating block INS can be changed according to actual needs, instead of being in the above embodiment. Said to be limited.

For example, referring to FIGS. 21A and 21B, after the foregoing third step corresponding to FIGS. 18A and 18B (that is, after forming the masks MSK1, MSK2), the metal wire MT may be first provided in the contact pad PD in the fourth step. Then, the first portion 124 of the conductive material layer 120 is insulated in the fifth step to form the first touch electrode E1, the second touch electrode E2, the auxiliary conductive line AUX, and the insulating block INS.

It should be noted that the specific details of these steps can be referred to the foregoing paragraphs, and thus will not be described herein.

Sixth embodiment

The manufacturer of another touch module 100 will be provided through the sixth embodiment. law. This manufacturing method is substantially the same as the manufacturing method in the fifth embodiment, except that the order in which the contact pads PD are formed in this embodiment is different from the order in which the masks MSK1, MSK2 are formed. Therefore, in the following description, the repeated parts will not be described.

22A-25A are schematic diagrams showing a method of fabricating a touch module 100 according to an embodiment of the present invention. 22B-25B are cross-sectional views of the touch module 100 of FIG. 22A-25A taken along line A-a.

First, referring specifically to FIGS. 22A and 22B, in a first step, a conductive material layer 120 is provided on the upper surface SF1 of the substrate 110. Next, in a second step, a plurality of first masks MSK1 and second masks MSK2 are provided on the conductive material layer 120.

In the present embodiment, the details of the conductive material layer 120 can be referred to the foregoing paragraphs, and thus will not be described herein.

In the present embodiment, the details of the masks MSK1 and MSK2 can be referred to the foregoing paragraphs, and thus will not be described herein.

Next, referring specifically to FIGS. 23A and 23B, in a third step, a plurality of contact pads PD are provided on the conductive material layer 120 and the masks MSK1, MSK2.

In the present embodiment, the details of the contact pad PD can be referred to the foregoing paragraphs, and thus will not be described herein.

At this time, the conductive material layer 120 includes a first portion 124 exposed outside the masks MSK1, MSK2 and the contact pads PD, a second portion 122 under the masks MSK1, MSK2, and under the contact pads PD. And contacting the third portion 126 of the contact pad PD.

Next, referring to FIG. 24A and FIG. 24B, in a fourth step, the first portion 124 of the conductive material layer 120 is insulated to form a first touch electrode E1 and a second touch electrode E2. Auxiliary wire AUX, and insulating block INS.

Further, in the fourth step, the conductive material (such as a nano silver wire) exposed in a first portion 124 of the conductive material layer 120 exposed to the masks MSK1, MSK2 and the contact pads PD is dispersed, and The conductive material is further sunk and dispersed into the substrate 110 to form the insulating block INS, and the conductive material layer 120 is located under the first mask MSK1 and contacts the second portion 122 of the first mask MSK1. Forming the first touch electrode E1, the second portion 122 of the conductive material layer 120 under the second mask MSK2 and contacting the first mask MSK1 forms the second touch electrode E2, and the conductive material layer 120 is The third portion 126 located under the contact pad PD and contacting the contact pad PD forms the auxiliary lead AUX.

In the present embodiment, the details of the conductive material in the first portion 124 of the dispersed conductive material layer 120 exposed to the masks MSK1, MSK2 and the contact pads PD can be referred to the foregoing paragraphs, and thus will not be described herein.

Next, referring specifically to FIGS. 25A and 25B, in a fifth step, a metal wire MT is provided over the contact pad PD and the insulating block INS.

In the present embodiment, the details of the metal wire MT can be referred to the foregoing paragraphs, and thus will not be described herein.

The touch module 100 can be realized by the above manufacturing method. The insulating block INS is formed in the substrate 110 to insulate the touch electrodes E1 and E2 from each other. In this way, the touch electrodes E1 and E2 can be prevented from being patterned by etching, and the optical refractive index of the touch module 100 can be prevented from being uneven, thereby affecting the optical consistency of the appearance of the touch module 100.

In other words, by the method of dispersing the conductive material of the conductive material layer 120 to form the insulating block INS in the substrate 110, the touch electrodes E1, E2, the auxiliary wires AUX and the The edge blocks INS have substantially no or substantially no overlap between the orthographic projections on the upper surface SF1 of the substrate 110. That is, the positive projections of the touch electrodes E1, E2, the auxiliary wires AUX and the insulating blocks INS on the upper surface SF1 of the substrate 110 may form a complete plane. In this way, the optical consistency of the appearance of the touch module 100 can be avoided due to the uneven refractive index.

Further, by the above-described manufacturing method, it is possible to prevent the metal wire MT from being short-circuited by contacting the conductive material in the substrate 110.

In an embodiment, the orthographic projection of the insulating block INS on the upper surface SF1 of the substrate 110 is between the orthographic projections of the touch electrodes E1, E2 on the upper surface SF1 of the substrate 100. In an embodiment, the orthographic projection of the insulating block INS on the upper surface SF1 of the substrate 110 is located around the orthographic projection of the touch electrodes E1, E2 on the upper surface SF1 of the substrate 100.

In one embodiment, the touch electrodes E1, E2 are alternately arranged along a first direction. In one embodiment, the touch electrode E1 is located under the mask MSK1, and the touch electrode E2 is located under the mask MSK2.

In an embodiment, the touch electrodes E1 and E2 are all fishbone. That is, each of the touch electrodes E1 and E2 includes a trunk and a plurality of branches electrically connected to the trunk. These branches are placed on opposite sides of the trunk. It should be noted that the above embodiments are merely illustrative, and the touch electrodes E1 and E2 of other shapes are also in the scope of the present case, and thus the present invention is not limited thereto.

In an embodiment, the touch electrodes E1 and E2 are physically and electrically separated from each other.

In an embodiment, the masks MSK1, MSK2 are alternately arranged along a first direction. In one embodiment, the masks MSK1, MSK2 are all fishbone shaped.

In an embodiment, the masks MSK1, MSK2 are separated from one another. In an embodiment, the masks MSK1, MSK2 do not overlap each other between the orthographic projections on the upper surface SF1 of the substrate 100.

In an embodiment, the masks MSK1 and MSK2 are selectively removed after the touch electrodes E1 and E2 are formed to further improve the appearance of the touch module 100. Therefore, the present invention is not limited to the above embodiments.

In an embodiment, the auxiliary lead AUX is located below the contact pad PD. In an embodiment, the auxiliary wire AUX is electrically connected to the contact pad PD and the metal wire MT, and electrically connected to the touch electrodes E1 and E2, respectively. In an embodiment, the auxiliary wire AUX can assist the touch electrodes E1, E2 and the metal wire MT to transmit touch signals.

In an embodiment, the auxiliary wire AUX, the insulating block INS, and the touch electrodes E1, E2 have the same conductive material.

On the other hand, in the embodiment, the substrate 110 may also include an active layer (not shown) and a bottom layer (not shown), and details are not described herein.

It is noted that the order of forming the metal wire MT and forming the first touch electrode E1, the second touch electrode E2, the auxiliary wire AUX, and the insulating block INS can be changed according to actual needs, instead of being in the above embodiment. Said to be limited.

For example, referring to FIGS. 26A and 26B, after the third step corresponding to the foregoing FIGS. 23A and 23B (that is, after forming the contact pad PD), the metal wire MT may be first provided on the contact pad PD in the fourth step. Then, the first portion 124 of the conductive material layer 120 is insulated in the fifth step to form the first touch electrode E1, the second touch electrode E2, the auxiliary conductive line AUX, and the insulating block INS.

It should be noted that the specific details of these steps can be referred to the foregoing paragraphs, and thus will not be described herein.

FIG. 27 is a diagram of a method for manufacturing a touch module according to an embodiment of the present disclosure Flow chart of 200. The manufacturing method 200 can be used to fabricate the touch module 100 in the first embodiment to the sixth embodiment, but not limited thereto. In the following paragraphs, the description of the manufacturing method 200 is performed by using the touch module 100 in the first embodiment as an example. However, the present invention is not limited thereto. Manufacturing method 200 includes the following steps.

In step S1, a substrate 110 is provided.

In step S2, at least one first touch electrode E1 and at least one first touch electrode E2 are formed on a substrate 110, and are simultaneously embedded to form an insulating block INS in the substrate 110, wherein the insulating block INS is located at A touch electrode E and a second touch electrode E2 are electrically insulated from the second touch electrode E2.

The touch module 100 can be realized by the above manufacturing method. The insulating block INS is formed in the substrate 110 to insulate the touch electrodes E1 and E2 from each other. In this way, the touch electrodes E1 and E2 can be prevented from being patterned by etching, and the optical refractive index of the touch module 100 can be prevented from being uneven, thereby affecting the optical consistency of the appearance of the touch module 100.

In summary, an embodiment of the present disclosure discloses a touch module. The touch module includes a substrate, at least one first touch electrode, at least one second touch electrode, and an insulating block. The first touch electrode is formed on the substrate. The second touch electrode is formed on the substrate and is parallel to the first touch electrode. The insulating block is embedded in the substrate and located between the first touch electrode and the second touch electrode. The first touch electrode is electrically insulated from the second touch electrode.

Another embodiment of the present disclosure discloses a method of manufacturing a touch module. The manufacturing method includes: forming at least one first touch electrode and at least one first touch electrode on a substrate, and embedding an insulating block in the substrate, wherein the insulating block is located at the first touch electrode and the second The first touch electrodes are electrically insulated from the second touch electrodes.

By applying the above embodiments, the touch electrodes can be patterned by etching, and the optical refractive index of the touch module is not uniform, thereby affecting the optical consistency of the appearance of the touch module.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present case. Anyone skilled in the art can make various changes and refinements without departing from the spirit and scope of the present case. The scope defined in the patent application is subject to change.

100‧‧‧ touch module

110‧‧‧Substrate

SF1‧‧‧ surface

E1‧‧‧first touch electrode

INS‧‧‧Insulated block

MT‧‧‧Metal wire

MSK1‧‧‧ mask

AUX‧‧‧Auxiliary wire

Claims (18)

A touch module includes: a substrate; at least one first touch electrode is formed on the substrate; at least one second touch electrode is formed on the substrate parallel to the first touch electrode; An insulating block is embedded in the substrate and located between the first touch electrode and the second touch electrode; wherein the first touch electrode is electrically insulated from the second touch electrode, and the first A touch electrode, the second touch electrode, and an orthographic projection of the insulating block on a surface of the substrate do not overlap. The touch module of claim 1, wherein the first touch electrode, the second touch electrode and the insulating block are formed of the same conductive material layer and have the same conductive material, and The insulating block has a separate conductive material by an insulating treatment of a dispersed conductive material. The touch module of claim 1, wherein the insulating block is located around the first touch electrode and the second touch electrode. The touch module of claim 1, wherein an orthographic projection of the insulating block on a surface of the substrate is located on the surface of the first touch electrode and the second touch electrode on the substrate Between the orthographic projections. The touch module of claim 1, further comprising: a plurality of wires electrically connected to the first touch electrode and the second touch electrode. For example, the touch module described in claim 5 of the patent scope further includes: A plurality of auxiliary wires are respectively located under the wires and electrically connected to the wires. The touch module of claim 1, further comprising: a plurality of contact pads respectively disposed on the first touch electrode and the second touch electrode; and a plurality of wires electrically connected The contact pads. The touch module of claim 1, wherein the first touch electrode and the second touch electrode are fishbone shaped. A method for manufacturing a touch module includes: providing a substrate; and forming at least one first touch electrode and at least one second touch electrode on the substrate, and simultaneously embedding to form an insulating block in the substrate, The first touch electrode is electrically insulated from the second touch electrode; wherein the first touch electrode is electrically insulated from the second touch electrode; The two touch electrodes do not overlap with the orthographic projection of the insulating block on a surface of the substrate. The method of manufacturing the touch module of claim 9, wherein the first touch electrode and the second touch electrode are formed on the substrate, and the insulating block is synchronously embedded to form the insulating block in the substrate. The method includes: providing a conductive material layer on the substrate; providing a plurality of masks and a plurality of wires on the conductive material layer; and insulating a portion of the conductive material layer exposed to the masks, Forming the first touch electrode, the second touch electrode, and the insulating block. The method of manufacturing the touch module of claim 10, further comprising: insulating a portion of the conductive material layer to form the first touch electrode, the second touch electrode, and Before the insulating block, a plurality of wires are provided on the conductive material layer. The method of manufacturing the touch module of claim 11, wherein the insulating material layer is exposed to a portion of the mask to form the first touch electrode, the second The step of the touch electrode and the insulating block includes: dispersing a conductive material in the conductive material layer exposed to the mask and a first portion other than the wires to insulate the conductive material layer The first portion is formed to form the insulating block, and the plurality of second portions of the conductive material layer under the masks respectively form the first touch electrode and the second touch electrode. The method of manufacturing the touch module of claim 11, wherein the insulating material layer is exposed to a portion of the mask to form the first touch electrode, the second The step of the touch electrode and the insulating block further includes: forming a plurality of auxiliary wires in the plurality of third portions of the conductive material layer under the wires. The method of manufacturing a touch module according to claim 12, wherein the step of dispersing the conductive material in the conductive material layer exposed to the mask and a first portion other than the wires comprises Providing an embedding liquid in the conductive material layer exposed on the first portion outside the mask and outside the wires to disperse the conductive material in the first portion of the conductive material layer . The method for manufacturing a touch module according to claim 10, further comprising: Providing a plurality of contact pads before insulating the layer of the conductive material exposed to a portion of the mask to form the first touch electrode, the second touch electrode, and the insulating block On the layer of conductive material. The method of manufacturing the touch module of claim 15, wherein the insulating material layer is exposed to a portion of the mask to form the first touch electrode and the second The step of the touch electrode and the insulating block includes: dispersing a conductive material in the conductive material layer exposed to the mask and a first portion other than the contact pads to insulate the conductive material layer The first portion is formed to form the insulating block, and the plurality of second portions of the conductive material layer under the mask respectively form the first touch electrode and the second touch electrode And forming a plurality of auxiliary wires in the plurality of third portions of the conductive material layer under the contacts. The method of manufacturing the touch module of claim 16, further comprising: providing a plurality of wires on the conductive material layer, and electrically connecting the contact pads respectively. The method of manufacturing the touch module of claim 9, wherein the orthographic projection of the insulating block on a surface of the substrate is located on the first touch electrode and the second touch electrode on the substrate Between the orthographic projections on the surface.