TWI579772B - Tamperproof rfid tag and manufacturing method thereof - Google Patents

Description

Tamper-proof radio frequency identification tag and its manufacturing method

The invention relates to a tamper-evident radio frequency identification tag (abbreviated as an RFID tag), in particular to a burglar-proof radio frequency identification tag which is used in a radio frequency identification system to detect whether an item has been stolen.

Conventional RFID tags can be applied to items for tracking and identification purposes, particularly in the logistics and related transportation industries, involving high value items. However, the RFID tag is still only a tag, and its corresponding interrogation device can only read the RFID tag, and cannot directly detect or identify the item to which the RFID tag is attached. Thus, removing the item from the RFID identification system while leaving the RFID tag of the item in place will render the RFID identification system ineffective. For example, in some cases, the RFID tag is only applied to the package of the item, so if the item is removed from the package with the label, the package is left in the system. Subsequently, when the interrogating device is in monitoring, the RFID tag on the package will still answer the interrogation device, causing the RFID identification system to be unable to detect that the item has been removed or stolen. In other words, until the package is opened before the final destination is opened, the theft will not be discovered, and it will be difficult to determine at which stage of the supply and transportation chain the item is taken out.

In this regard, Chinese Patent No. 101452622 provides an RFID seal label that is applied to the opening of the package of the article, thereby reducing the difficulty of taking the article out of the package. The RFID seal tag includes an RFID chip and an antenna coupled to the RFID chip. The RFID chip can communicate with an external RFID interrogation device in the event of a complete loss. The RFID seal label also includes an outer weakening line that extends across at least a portion of the antenna or between the antenna and the RFID wafer. When the RFID seal label is broken along the outer weak line, it will lead The RFID transponder is unable to communicate with the RFID interrogation device. However, if a person with a heart has reconnected the broken tag line, it will be able to communicate again, so that the state of the item being stolen will still not be detected by the RFID identification system.

The invention provides a tamper-proof radio frequency identification tag and a manufacturing method thereof, which will be difficult to return to the original state once it is destroyed by the thief, so that the remote RFID interrogation device can instantly discover the lost item and perform it in time. remedy.

Specifically, the RFID tag of the present invention comprises a label surface layer, a spacer, a radio frequency identification circuit layer, a double-sided adhesive layer, a release paper layer and an inner layer weakening line. Wherein, the back surface of the label layer is a glue surface. The front surface of the spacer is attached to the adhesive surface of the surface layer of the label. The RFID circuit layer includes a substrate, an RFID chip disposed on the substrate, and an antenna matching the RFID chip. One side of the double-sided adhesive layer is adhered to the back surface of the radio frequency identification circuit layer, and the other side is adhered to an object. The release surface of the release paper layer is attached to the other side of the double-sided adhesive layer. The inner layer weakening line penetrates the radio frequency identification circuit layer and the double-sided adhesive layer corresponding to the position of the isolation pad to divide the radio frequency identification circuit layer together with the double-sided adhesive layer into a reserved area and a non-reserved area. In addition, the reserved area of the radio frequency identification circuit layer corresponds to the back surface of the isolation pad, and the non-retention area is directly adhered to the back surface of the label surface layer.

Thus, when the tag is torn off, the reserved area of the radio frequency identification circuit layer will stay on the item and be separated from the non-reserved area, thereby greatly destroying the antenna of the radio frequency identification circuit layer, and the thief can hardly easily The line of the antenna is restored, and the RFID chip can no longer communicate with the outside world through the antenna, so that it can be timely determined whether the item to which the tag is attached is stolen.

Preferably, at least one small line segment of the metal line in the reserved area of the radio frequency identification circuit layer is expanded to form a metal pad, and the two small knife marks of the inner layer weakening line are respectively passed through the two ends of the metal pad. To weaken the metal line. As such, the metal line is easily torn off when the RFID tag is torn open. More preferably, the surface of the metal pad of the radio frequency identification circuit layer may be coated with an insulating varnish to prevent the metal circuit from being reconnected.

The method for manufacturing a radio frequency identification tag of the present invention comprises the following steps. First providing a superscript layer, the superscript layer comprising a label surface layer containing the adhesive and attached to the label sheet At least one spacer on the back of the layer. Next, a subscript layer is provided. The subscript layer includes a radio frequency identification circuit layer, a double-sided adhesive layer attached to the back surface of the radio frequency identification circuit layer, and a release paper layer attached to the back surface of the double-sided adhesive layer. And then performing a first punching on the subscript layer to form at least one inner layer weakening line extending through the release paper layer, the double-sided adhesive layer and the radio frequency identification circuit layer, to The double-sided adhesive layer is divided into at least one reserved area corresponding to the spacer of the superscript layer. Finally, the superscript layer is attached to the undercut layer to make the spacer of the superscript layer align with the reserved area of the subscript layer to form the radio frequency identification tag.

Preferably, in the above method for manufacturing a radio frequency identification tag, the step of providing the superscript layer further includes the following process. The adhesive-coated label surface layer and a release paper are provided first. The release paper is first die cut to divide the release paper into the spacer and other non-isolated areas. The die-cut release paper is attached to the back of the label layer. Finally, the non-isolated area of the first release paper is torn off so that the release liner of the release paper remains on the back side of the label skin.

Preferably, in the above method for manufacturing a radio frequency identification tag, the step of providing the subscript layer further includes the following process.

Providing the radio frequency identification circuit layer, comprising: a substrate, an RFID chip disposed on the substrate, and an antenna matching the RFID chip, the radio frequency identification circuit layer is divided into a crystal segment, an antenna body segment, and the connection A bridge segment of the crystal segment and the antenna body segment. Further providing the double-sided adhesive layer and the release paper layer, the double-sided adhesive layer comprises an organic cotton double-sided film and an anti-metal interference absorbing material double-sided film, the release paper layer comprises two release papers, respectively attached to The back side of the double-sided film of the organic cotton material and the back side of the double-sided film of the metal interference absorbing material. Next, the front side of the double-sided film of the organic cotton material is attached to the back surface of the crystal segment of the radio frequency identification circuit layer correspondingly to the release paper on the back side thereof. Finally, the double-sided film of the metal interference absorbing material is attached to the antenna body segment of the RFID circuit layer correspondingly to the release paper on the back side thereof.

Preferably, in the above method for manufacturing a radio frequency identification tag, after completing the radio frequency identification tag, the following steps are also performed. And punching the superscript layer and the subscript layer after punching to punch out a bridge line extending through the label surface layer, the radio frequency identification circuit layer, and at least one outer layer weakening line of the double-sided adhesive layer, so as to facilitate The segment of the radio frequency identification circuit layer is disconnected from the antenna body segment.

Preferably, in the above step, in addition to punching out the outer layer weakening line, and simultaneously bonding the superscript layer and the subscript layer after punching, an outer contour line is cut through the label table. a layer, the radio frequency identification circuit layer and the double-sided adhesive layer.

100‧‧‧ identification label

200‧‧‧ items

1‧‧‧ label surface

11‧‧‧ positive

12‧‧‧ Back

2‧‧‧Isolation layer

21‧‧‧First isolation mat

211‧‧‧ positive

212‧‧‧Back

22‧‧‧Second isolation mat

3‧‧‧RF circuit layer

30‧‧‧Substrate

31‧‧‧ crystal fragments

32‧‧‧RFID chip

33‧‧‧Antenna body segment

34‧‧‧Antenna

341, 343, 345‧‧‧ metal mats

342, 344, 346‧‧‧ insulating paint

35‧‧‧Bridge section

4‧‧‧ double-sided adhesive layer

41‧‧‧First double-sided film

42‧‧‧Second double-sided film

5‧‧‧ release paper layer

51‧‧‧First release paper

52‧‧‧Second release paper

61, 62‧‧‧ inner weakening line

621, 622‧‧ ‧ knife marks

71, 72‧‧‧ outer weakening line

711, 712‧‧ ‧ knife marks

8a‧‧‧Superscript layer

8b‧‧‧Subscript layer

901, 902, 903, 904, 905‧‧ steps

A1, A2‧‧‧ reserved area

B‧‧‧non-reserved area

1a‧‧‧ label surface original film

2a‧‧‧First release paper

4a‧‧ ‧ double-sided adhesive layer

5a‧‧‧ release paper layer

5b‧‧‧away paper

8a‧‧‧Superscript layer

8b‧‧‧Subscript layer

100a‧‧‧Outline

The first figure is a schematic diagram of a three-dimensional structure of a radio frequency identification tag of the present invention applied to an article.

The second figure is an exploded view of the radio frequency identification tag of the present invention.

The third figure is a schematic plan view of the radio frequency identification circuit layer of the radio frequency identification tag of the present invention.

The fourth figure is a schematic cross-sectional view of a radio frequency identification tag of the present invention.

Fig. 5 is a schematic cross-sectional view showing the radio frequency identification target of the present invention when it is torn off from the surface of the article.

The sixth figure shows the situation in which the radio frequency identification tag of the present invention is torn off from the surface of the article.

The seventh figure shows the situation in which the radio frequency identification target of the present invention is destroyed as the article is unscrewed.

The eighth figure is a block flow diagram of the method of manufacturing the radio frequency identification tag of the present invention.

The ninth, a, b, ten, eleven, twelve, thirteenth, and fourteenth drawings show the manufacturing process of the radio frequency identification tag of the present invention.

The tenth b, eleventh, twelfth, thirteenth and fourteenth bth diagrams are respectively a cross-sectional view of the tenth a, eleventh, twelveteenth, thirteenth and fourteenth a diagrams.

Figures 13c and 14c are respectively schematic views of another section of the thirteenth and fourteenth a diagrams.

The first figure shows a preferred embodiment of the tamper-evident radio frequency identification tag 100 of the present invention applied to a canned item 200. As shown in the second figure, the identification tag 100 generally includes a label surface layer 1, an isolation layer 2, a radio frequency identification circuit layer 3, a double-sided adhesive layer 4, and a release paper layer 5 from top to bottom. The radio frequency identification circuit layer 3 is a flexible printed circuit board, and a plurality of inner weakening lines 61 and 62 and a plurality of outer weakening lines 71 and 72 are punched out by a punching knife to facilitate damage at an appropriate timing. The identification tag 100 is as shown in the fifth or sixth figure.

Specifically, the label skin 1 is a single-sided adhesive sticker having a front side 11 for printing a suitable pattern or typeface and a back side 12 being a glue side. Radio frequency identification circuit layer 3 substantially divided into a crystal segment 31, an antenna body segment 33, and a bridge segment 35 connecting the crystal segment 31 and the antenna body segment 33. The isolation layer 2 has a first isolation pad 21 and a second isolation pad 22 corresponding to the crystal segment 31 and the antenna body segment 33, respectively. The arrangement of the first spacer 21 and the second spacer 22 is substantially the same, only the difference in shape or size. Referring to FIGS. 2 and 3, the RFID circuit layer 3 includes a PET substrate 30, an RFID chip 32 disposed on the substrate 30, and an antenna 34 matching the RFID chip 32. The RFID chip 32 is located in the crystal segment 31, and the metal line of the antenna 34 spans the crystal segment 31, the antenna body segment 33, and the bridge segment 35.

Referring to the second figure, the double-sided adhesive layer 4 is used to adhere the RFID circuit layer 3 and the article 200. However, it is worth noting that the release surface of the release paper layer 5 is attached to the back side of the double-sided adhesive layer 4 to provide a protective function before the double-sided adhesive layer 4 has been applied to the article 200. In the embodiment, the double-sided adhesive layer 4 includes a first double-sided film 41 and a second double-sided film 42. The first double-sided film 41 is a double-sided tape of an organic cotton material, corresponding to the crystal segment 31 of the radio frequency identification circuit layer 3; and the second double-sided film 42 is a double-sided tape resistant to the metal interference wave absorbing material, corresponding to The antenna body segment 33 of the RFID circuit layer 3 is pasted to reduce electromagnetic interference. Similarly, the release paper layer 5 includes a first release paper 51 and a second release paper 52, respectively corresponding to the back sides of the first double-sided film 41 and a second double-sided film 42 to provide protection.

A cross-sectional view of the fourth figure shows a situation in which the identification tag 100 is adhered to the article 200. The one side of the double-sided adhesive layer 4 is adhered to the back surface of the radio frequency identification circuit layer 3, and the other side is adhered to the article 200. A back surface 212 of the first spacer 21 is attached to the front surface of the radio frequency identification circuit layer 3. The adhesive surface 12 of the label surface layer 1 is partially adhered to the front surface 211 of the first isolation spacer 21 and is isolated from the radio frequency identification circuit layer 3, and the other portion is directly contacted and adhered to the radio frequency identification circuit layer 3. positive. Although the second spacer 22 is not shown in the fourth figure, it is substantially the same as the arrangement of the first spacer 21.

Referring also to Figures 2 to 4, the two inner weakening lines 61, 62 are each arranged in a circular shape and have diameters slightly smaller than the diameters of the two spacers 21, 22, respectively. The two inner layer weakening lines 61, 62 are corresponding to the position of the two isolation pads 21, 22 penetrating the radio frequency identification circuit layer 3 and the double-sided adhesive layer 4, so that the radio frequency identification circuit layer 3 together with the double-sided adhesive layer 4 It is divided into two reserved areas A1, A2 and other parts of the non-reserved area B. One of the two reserved areas A1 is located in the crystal segment 31 of the radio frequency identification circuit layer 3; and the other reserved area A2 is located in the radio frequency identification circuit layer 3 Inside the line body segment 33. In addition, the two reserved areas A1 and A2 respectively correspond to the back surfaces of the two isolation pads 21 and 22, and the non-reserved area B is directly adhered to the back surface 12 of the label surface layer 1, that is, the adhesive surface.

As can be seen from the above, the two reserved areas A1, A2 are not adhered to the label surface layer 1 via the two spacers 21, 22. On the contrary, the two reserved areas A1 and A2 are bonded to the double-sided adhesive layer 4. Thus, as shown in the sixth figure, when the identification tag 100 is torn off, the reserved areas A1, A2 of the radio frequency identification circuit layer 3 will stay on the item 200 by the double-sided adhesive layer 4; The non-reserved area B is separated, thereby destroying the overall structure of the antenna 34 of the radio frequency identification circuit layer 3. It is difficult for the thief to easily restore the line of the antenna 34 of the radio frequency identification circuit layer 3, so that the RFID chip 32 can no longer be borrowed. The antenna 34 communicates with the outside world, and an external inquiry device (not shown) can detect in time that the article 200 or its contents have been invaded or destroyed.

It is worth noting that, as shown in the enlarged view of the third figure, in order to provide a sufficient spatial range setting of the inner layer weakening line 61, at least one of the metal lines of the first reserved area A1 of the radio frequency identification circuit layer 3 is provided. The small line segments are enlarged to form a metal pad 341, and the two small knife marks 611, 612 of the inner layer weakening line 61 are respectively slid across the metal pads 341 to weaken the metal lines. Similarly, at least one small line segment of the metal line of the second reserved area A2 of the radio frequency identification circuit layer 3 is also enlarged to form a metal pad 343, and the two small knife marks 621, 622 of the inner layer weakening line 62 are respectively crossed. Both ends of the metal pad 343 are used to weaken the metal line. In this way, it is ensured that the metal line of the antenna 34 can operate normally on the one hand, and can be easily torn off on the other hand, and theft of the item can be found in time. In addition, the surface of the metal pads 341, 343 of the radio frequency identification circuit layer 3 may be coated with insulating varnishes 342, 344, such as printing a common green lacquer, thereby preventing the metal lines from being stolen back, improving safety.

As shown in the fourth and fifth figures, the two outer weakening lines 71 (shown in the drawing) and 72 (not shown) are mainly disconnected from the central area of the identification tag 100 for convenience, as shown in the seventh figure. Shown. When the body of the article 200 and the cap are unscrewed from each other, the identification tag 100 is disconnected from the outer weakening line 71 or the outer weakening line 72. Referring to the fourth and fifth figures, an outer weakening line 71 is taken as an example. The outer weakening line 71 extends from the top to the bottom of the label surface layer 1 and the bridge area 35 of the radio frequency identification circuit layer 3, thereby weakening the identification label. The central section of 100. In addition, referring to the third figure, in order to provide a sufficient spatial range setting of the outer weakening line 71, at least a small line segment of the metal line located in the bridging area 35 of the radio frequency identification circuit layer 3 is also expanded to form a metal pad. And the two small knife traces 711 and 712 of the outer weakening line 71 are respectively slid across the metal pads 345 to weaken the metal lines. In addition, the surface of the metal pad 345 of the radio frequency identification circuit layer 3 may be coated with an insulating varnish 346, thereby preventing the metal circuit from being reconnected, thereby improving safety.

As described above, the radio frequency identification tag 100 of the present invention is broken and broken when it is torn off, and its antenna line is difficult to recover, and the thief cannot make a fraud, and can promptly judge whether the article to which the tag is attached is stolen.

The eighth figure shows a manufacturing method of the tamper-evident radio frequency identification tag 100, which is specifically disclosed as follows:

Referring to the eighth figure, in step 901, a superscript layer 8a is provided first, as shown in the tenth and tenth bth views. The specific method is as follows. First, as shown in the ninth and ninth b, a label surface original sheet 1a and a first release paper 2a are provided. The label sheet original sheet 1a has a plurality of label surface layers 1 containing a backing. The first release paper 2a has been previously punched and divided into a plurality of spacers 21, 22 and other non-isolated portions 23. Next, the punched first release paper 2a is aligned and attached to the back surface of the label sheet original sheet 1a. Finally, the non-isolated area of the first release paper 2a is torn off, so that the isolation pads 21, 22 on the first release paper 2a are correspondingly adhered to specific positions on the label surface layer 1, such as the tenth a And ten b diagram. As for the remaining first release paper 2a, it is additionally recycled. The tenth a and tenth b diagrams show the first spacer 21 and the second spacer 22 corresponding to one of the label surface layers 1 and the back surface thereof, and the three together form a superscript layer 8a. The other label surface layers 1 on the label sheet original sheet 1a are also formed by the above-described processing methods, and the first spacer 21 and the second spacer 22 adhered to the back surface thereof constitute the other superscript layers 8a.

Then proceeding to step 902, providing a subscript layer 8b, as shown in the eleventh and eleventh b, the specific method is to first provide an original radio frequency identification circuit (not shown) having the original radio frequency identification circuit The structure of the plurality of radio frequency identification circuit layers 3 as described above includes a substrate 30, an RFID chip 32 disposed on the substrate 30, and an antenna 34 matching the RFID chip 32. In the eleventh figure, only one of the radio frequency identification circuit layers 3 on the original radio frequency identification circuit is shown. In addition, the radio frequency identification circuit layer 3 is divided into a crystal segment 31, an antenna body segment 33, and a bridge segment 35 connecting the crystal segment 31 and the antenna body segment 33, and the radio frequency identification circuit layer 3 The metal line of the antenna spans the crystal segment 31, the antenna body segment 33, and the bridge segment 35.

On the other hand, a plurality of first double-sided films 41 and a plurality of pre-cuts are provided The second double-sided film 42. The materials and functions of the first double-sided film 41 and the second double-sided film 42 are as described above, and therefore will not be described again. A first release paper 51 is adhered to the back surface of each of the first double-sided films 41, and a second release paper 52 is adhered to the back surface of each of the second double-sided films 42.

Next, the front surface of each of the first double-sided film 41 is attached to the back surface of the crystal segment 31 of each radio frequency identification circuit layer 3 correspondingly to the release paper 51 on the back thereof, and each second double-sided film 42 is attached thereto. The release paper 52 on the back is correspondingly attached to the antenna body segment 33 of each radio frequency identification circuit layer 3. It should be noted that the bridging section 35 of each radio frequency identification circuit layer 3 is not adhered to the double-sided film.

At this time, referring to the 11th and 11th b, the first double-sided film 41 and the second double-sided film 42 are adhered to the back surface of the RFID circuit layer 3, and the first double-sided film 41 and the first The double-sided film 42 constitutes a double-sided adhesive layer 4a. Similarly, the first release paper 51 and the second release paper 51 respectively adhered to the back surface of the first double-sided film 41 and the second double-sided film 42 constitute a release paper layer 5a. The radio frequency identification circuit layer 3 and the corresponding double-sided adhesive layer 4a and the release paper layer 5a together form a subscript layer 8b. The other radio frequency identification circuit layers 3 on the original radio frequency identification circuit are also respectively processed by the foregoing processing method, and the first double-sided film 41 and the second double-sided film 42 adhered to the back surface thereof constitute the other subscript layers 8b. .

Proceeding to step 903, the subscript layer 8b is first punched to form a plurality of inner weakening lines 61, 62 extending through the release paper layer 5a, the double-sided adhesive layer 4a and the radio frequency identification circuit layer 3. As shown in the twelfth bth, the radio frequency identification circuit layer 3, together with the double-sided adhesive layer 4a and the release paper layer 5a, are divided into two reserved areas A1, A2 and other parts of the non-reserved area B, such as Shown in Figure 12a. At this time, referring to the second to fourth figures, one of the two reserved areas A1 is located in the crystal segment 31 of the radio frequency identification circuit layer 3; and the other reserved area A2 is located in the radio frequency identification circuit layer 3. Inside the antenna body segment 33. The other subscript layers 8b are also punched out of the inner layer weakening lines 61, 62 by the above-described processing methods.

Proceeding to step 904, the superscript layer 8a is adhered to the underprinted lower layer 8b, that is, the label surface layer 1a to which the first isolation pads 21 and the second isolation pads 22 are pasted. Attaching to the radio frequency identification circuit original sheet to which the first double-sided film 41 and the second double-sided film 42 are pasted, and the original surface of the label surface layer 1a is larger than the original piece of the radio frequency identification circuit. The area is slightly wider, as shown in the thirteenth c. Therefore, a release paper 5b is attached to the back surface of the original radio frequency identification circuit to protect the bare back of the original sheet 1a of the label. The glue is free from sticking to the implement, causing unnecessary sticking. 13th to 13th are diagrams showing the state in which the superscript layer 8a and the subscript layer 8b after punching have been attached, and the first spacer 21 and the second spacer 22 of the superscript layer 8a are respectively The two reserved areas A1, A2 of the subscript layer 8b are aligned to form the radio frequency identification tag 100. The other superscript layers 8a are also bonded to the corresponding subscript layer 8b by the above-described processing method to constitute the radio frequency identification tag 100.

Finally, proceeding to step 905, as shown in the fourteenth and fourteenth bth diagrams, the superposed superscript layer 8a and the subscript layer 8b are die-cut to punch out the surface of the label 1 and its radio frequency. Identifying the bridging section 35 of the circuit layer 3, the double-sided adhesive layer 4a and the plurality of outer weakening lines 71, 72 of the release paper layer 5a, as shown in the fourteenth c-c, to facilitate the radio frequency identification circuit layer 3 The crystal segment 31 is disconnected from the antenna body segment 33. In addition, at the same time, in addition to punching out the outer weakening lines 71, 72, and simultaneously punching an outer contour line 100a on the superscript layer 8a and the subscript layer 8b, through the label surface layer 1, The radio frequency identification circuit layer 3 and its double-sided adhesive layer 4a are used to obtain a desired appearance, as shown in the first or second figure, and in the same processing manner, thereby forming a plurality of radio frequency identification tags 100 finished products.

In any event, anyone can obtain sufficient teaching from the description of the above examples, and it is understood that the present invention is indeed different from the prior art, and is industrially usable and progressive. It is the invention that has indeed met the patent requirements and has filed an application in accordance with the law.

100‧‧‧ identification label

1‧‧‧ label surface

11‧‧‧ positive

12‧‧‧ Back

2‧‧‧Isolation layer

21‧‧‧First isolation mat

211‧‧‧ positive

22‧‧‧Second isolation mat

3‧‧‧RF circuit layer

30‧‧‧Substrate

31‧‧‧ crystal fragments

32‧‧‧RFID chip

33‧‧‧Antenna body segment

34‧‧‧Antenna

35‧‧‧Bridge section

4‧‧‧ double-sided adhesive layer

41‧‧‧First double-sided film

42‧‧‧Second double-sided film

5‧‧‧ release paper layer

51‧‧‧First release paper

52‧‧‧Second release paper

61, 62‧‧‧ inner weakening line

71, 72‧‧‧ outer weakening line

Claims (15)

A tamper-evident radio frequency identification tag comprising: a radio frequency identification circuit layer comprising a substrate, an RFID chip disposed on the substrate, and an antenna matching the RFID chip; a double-sided adhesive layer on one side thereof Adhering to the back side of the radio frequency identification circuit layer, and the other side is for adhering to an object; an inner layer weakening line runs through the radio frequency identification circuit layer and the double-sided adhesive layer to connect the radio frequency identification circuit layer together with the double The adhesive layer is divided into a reserved area and a non-reserved area; a label surface layer has a glue surface on the back surface, and a part of the adhesive surface is directly adhered to the non-reserved area of the RFID circuit layer; and an isolation The pad is located between the radio frequency identification circuit layer and the surface layer of the label, and has a front surface adhered to another portion of the adhesive surface of the label surface, and a back surface thereof corresponding to the reserved area of the radio frequency identification circuit layer. The tamper-evident radio frequency identification tag of claim 1, wherein at least one small line segment of the metal line in the reserved area of the radio frequency identification circuit layer is expanded to form a metal pad, and the inner layer is weakened. The two small knife marks of the line are respectively passed across the ends of the metal pad to weaken the metal line. The tamper-evident radio frequency identification tag of claim 2, wherein the surface of the metal pad of the radio frequency identification circuit layer is coated with an insulating varnish. The tamper-evident radio frequency identification tag of claim 1, wherein the radio frequency identification circuit layer is divided into a crystal segment, an antenna body segment, and a bridge segment connecting the crystal segment and the antenna body segment, and The radio frequency A metal line identifying the antenna of the circuit layer spans the crystal segment, the antenna body segment, and the bridge segment. The tamper-evident radio frequency identification tag of claim 4, wherein the double-sided adhesive layer comprises a first double-sided film and a second double-sided film; the first double-sided film is an organic cotton material The double-sided tape corresponds to the crystal segment of the radio frequency identification circuit layer; and the second double-sided film is a double-sided adhesive tape for the metal interference absorbing material, corresponding to the antenna body segment of the radio frequency identification circuit layer. The tamper-evident radio frequency identification tag of claim 4, wherein the reserved area of the radio frequency identification circuit layer is located in a crystal segment of the radio frequency identification circuit layer. The tamper-evident radio frequency identification tag of claim 4, wherein the radio frequency identification circuit layer is located in an antenna body segment of the radio frequency identification circuit layer. The radio frequency identification tag of the tamper-evident seal of claim 4, further comprising an outer weakening line extending from the top to the bottom of the label surface layer and the bridge area of the radio frequency identification circuit layer; wherein the radio frequency identification is located At least one small line segment of the metal line of the bridging region of the circuit layer is expanded to form a metal pad, and the two small tool marks of the outer weakening line are respectively drawn across the metal pad to weaken the metal line. A radio frequency identification tag for tamper-evident sealing comprises: a label surface layer having an adhesive surface on the back side; a radio frequency identification circuit layer having a front surface adhered to the adhesive surface of the label surface layer, and comprising a substrate disposed on An RFID chip on the substrate and an antenna matching the RFID chip; a double-sided adhesive layer, one side of which is adhered to the back surface of the radio frequency identification circuit layer, and the other side is adhered to an object; and an inner weakening line extends from the top to the bottom of the label surface layer and the radio frequency identification circuit layer; At least one small line segment of the metal line of the antenna of the radio frequency identification circuit layer is expanded to form a metal pad, and two small tool marks of the inner layer weakening line are respectively drawn across the metal pad to weaken the metal line. The tamper-evident radio frequency identification tag of claim 9, wherein the radio frequency identification circuit layer is coated with an insulating varnish on the surface of the metal pad. A method for manufacturing a tamper-evident radio frequency identification tag comprises the following steps: (a) providing a superscript layer, wherein the superscript layer comprises a label surface layer containing a backing and at least the backing layer attached to the surface layer of the label a spacer layer; (b) providing a subscript layer, wherein the subscript layer comprises a radio frequency identification circuit layer, a double-sided adhesive layer attached to the back surface of the radio frequency identification circuit layer, and a back surface attached to the double-sided adhesive layer a release paper layer; (c) first punching the subscript layer to form at least one inner layer weakening line extending through the release paper layer, the double-sided adhesive layer and the radio frequency identification circuit layer, The radio frequency identification circuit layer is divided into at least one reserved area together with the double-sided adhesive layer, and the at least one reserved area is a spacer for the superscript layer; and (d) the superscript layer and the punched layer The subscript layer is adhered such that the spacer of the superscript layer is located in a reserved area of the subscript layer and is sandwiched between the label surface layer and the radio frequency identification circuit layer. The method for manufacturing a tamper-evident radio frequency identification tag according to claim 11, wherein the step (a) comprises the following steps: providing the adhesive-containing label surface layer and a release paper; and punching the release paper, Dividing the release paper into the spacer and other non-isolated areas; attaching the punched release paper to the back of the label layer; tearing off the non-isolated area of the first release paper to The release liner of the release paper is left on the back of the label. The method for manufacturing a tamper-evident radio frequency identification tag according to claim 11, wherein the step (b) comprises the step of: providing the radio frequency identification circuit layer, comprising a substrate, disposed on the substrate An RFID chip and an antenna matching the RFID chip, the RFID circuit layer is divided into a crystal segment, an antenna body segment, and a bridge segment connecting the crystal segment and the antenna body segment; providing the double-sided adhesive layer and the separation layer a paper layer, wherein the double-sided adhesive layer comprises an organic cotton double-sided film and an anti-metal interference absorbing material double-sided film, the release paper layer comprises two release papers respectively attached to the double-sided film of the organic cotton material a back surface and a back side of the double-sided film of the metal interference absorbing material; the front side of the double-sided film of the organic cotton material is adhered to the back surface of the crystal segment of the radio frequency identification circuit layer correspondingly to the release paper on the back side thereof; The double-sided film of the metal interference absorbing material is adhered to the antenna body segment of the RFID circuit layer correspondingly to the release paper on the back side thereof. For example, the method for preparing a tamper-evident radio frequency identification tag according to claim 11 of the patent scope further includes the following steps: (e) punching the superscript layer and the subscript layer after the bonding, to punch out the bridge layer extending through the label surface layer, the radio frequency identification circuit layer, and at least one outer layer of the double-sided adhesive layer a wire so that the crystallographic segment of the radio frequency identification circuit layer is disconnected from the antenna body segment. The method for manufacturing a tamper-evident radio frequency identification tag according to claim 14, wherein in the step (e), when the punching is performed, the outer layer weakening line is punched out, and the same is applied The superscript layer and the subscript layer are punched out to form an outer contour line extending through the label surface layer, the radio frequency identification circuit layer and the double-sided adhesive layer.