TWI568821B - Protect the tape - Google Patents

Description

Protective tape

The present invention relates to a protective tape for protecting a substrate that has been subjected to reflow engineering.

Conventionally, when an electronic component such as a resistor, a capacitor, or an IC is connected to a substrate, first, solder is applied to a connection portion on the substrate, and suitable electronic components are placed thereon to enter a reflow process. In the reflow process, the solder is melted by heat, and then the solder is cooled and solidified, whereby the connection portion on the substrate is connected to the electronic component.

Here, when the substrate passes through the above-described reflow process, the melted solder sometimes scatters. At this time, a portion other than the connection portion to which the electronic component is connected to the substrate, particularly the portion close to the connection portion, is adhered by the scattered solder, which causes electrical failure or deteriorates in appearance. Therefore, in order to prevent the scattered solder from adhering during the reflow process, a protective tape is attached in advance to the place where the connection portion is located. Thereby, even if solder is scattered near the connection portion, it will only adhere to the surface of the protective tape, and it can be prevented from adhering to the place below the connection portion.

However, the conventional protective tape is a structure in which a bismuth resin which is an adhesive layer having high heat resistance is laminated on polyimine (PI), so that the temperature of the protective tape is heated in the reflow process. When it rises, the adhesion force of the adhesive layer attached to the substrate side becomes stronger than the initial state. In such a case, it will cause: in subsequent projects, it is difficult to remove the protective tape from The substrate is peeled off, or after the protective tape is peeled off, residual of the adhesive layer or the like occurs. As a result, it takes time and the like to peel off the protective tape, and the workability is deteriorated. Therefore, the protective tape for protecting the substrate subjected to the reflow process requires that the adhesion is not increased even if it is heated, and it is easy to peel off.

Further, in the case of the above-mentioned conventional protective tape, the enamel resin as the adhesive layer is adversely affected by the electronic component, and the polyimide is expensive. Therefore, in actuality, instead of using a conventional protective tape, it is possible to correspond to solder or the like scattered after the reflow process is removed.

Here, from the viewpoint of easy peeling, Patent Document 1 discloses an adhesive tape which is thin and excellent in workability.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent No. 3902162

However, the adhesive tape disclosed in Patent Document 1 is attached to a user between an LCD panel of an LCD module and a backlight frame, and has both light reflectivity and light blocking property for light from a light source. Adhesive tape. Therefore, the protective tape used to protect the substrate subjected to the reflow process is completely different in its use or use state. Therefore, in the case where the adhesive tape disclosed in Patent Document 1 is attached to a substrate and enters a reflow process, the adhesive tape is used. It may be deteriorated by heat in the project, resulting in difficulty in peeling off, or generation of defects such as residues.

The present invention has been made in view of the above problems, and an object thereof is to provide a protective tape capable of protecting a substrate subjected to reflow engineering, and which does not cause an increase in adhesion even if it is heated in a reflow process. The ease of peeling is well maintained.

The protective tape of the present invention is attached to a substrate subjected to a reflow process, and at least a part of the substrate is protected, the protective tape having an adhesive layer attached to the substrate, a metal layer, and The resin layer is provided with at least the metal layer and the resin layer on the adhesive layer.

According to the above configuration, the heat in the reflow process can be reflected and dissipated to the outside by protecting all the metal layers of the protective tape against at least a portion of the substrate. In this way, since the metal layer can hardly conduct heat to the adhesive layer attached to the substrate, the temperature rise of the adhesive layer can be alleviated. Thereby, it is not difficult to peel off from the substrate after the reflow process, or it remains after peeling, so that workability can be prevented from deteriorating. Further, even if the protective tape is bent, the influence of the bending on the metal layer can be alleviated by the elasticity of the resin layer which the protective tape has. Therefore, it is possible to prevent cracking of the metal layer when the protective tape is peeled off from the substrate by the resin layer.

Further, in the protective tape of the present invention, the resin layer and the metal layer may be provided in the order of the resin layer and the metal layer. Said on the adhesive layer.

According to the above configuration, even in the case where the resin layer or the metal layer is provided on the adhesive layer in the order of the resin layer or the metal layer, it is difficult to conduct heat to the adhesive layer attached to the substrate by the metal layer, and further, by the resin The elasticity of the layer can alleviate the effect on the metal layer caused by the bending.

Further, in the protective tape of the present invention, the resin layer and the metal layer may be provided on the adhesive layer in the order of the metal layer and the resin layer.

According to the above configuration, even in the case where the metal layer or the resin layer is provided on the adhesive layer in the order of the metal layer or the resin layer, it is difficult to conduct heat to the adhesive layer attached to the substrate by the metal layer, and further, by the resin The elasticity of the layer can alleviate the effect on the metal layer caused by the bending.

Further, in the protective tape of the present invention, the thickness of the metal layer may be 6 μm to 30 μm.

According to the above configuration, since the thickness of the metal layer is appropriate, it is easy to efficiently reflect and dissipate heat. Further, by the thickness of the metal layer, the protective tape is not too hard to be peeled off, or a large amount of material is required to cause high cost.

Further, in the protective tape of the present invention, the metal layer may be formed of aluminum.

According to the above configuration, since the metal layer is formed of a suitable material, heat can be more efficiently reflected and radiated to the outside. Thereby, the temperature rise of the adhesive layer can be further alleviated, and the protective tape can be easily peeled off during the peeling operation, and the work efficiency can be improved.

Further, in the protective tape of the present invention, in the above-mentioned reflow process, the temperature of the substrate may be at most 270 °C.

According to the above configuration, in the above-described reflow process, the protective tape can be applied even when the temperature of the substrate is at most 270 °C.

Further, in the protective tape of the present invention, the above-mentioned reflow process may also use infrared rays as a heat source.

According to the above configuration, the heat in the reflow process using infrared rays as a heat source can be reflected and radiated to the outside by the metal layer. As described above, the protective tape can be applied even in a reflow process using infrared rays as a heat source.

According to the protective tape of the present invention, it is difficult to conduct heat to the adhesive layer attached to the substrate by the metal layer, so that the temperature rise of the adhesive layer can be alleviated. Thereby, it is not difficult to peel off from the substrate after the reflow process, or it remains after peeling, so that workability can be prevented from deteriorating. Further, the resin layer can prevent cracking of the metal layer when the protective tape is peeled off from the substrate.

Hereinafter, suitable embodiments of the present invention will be described with reference to the accompanying drawings.

(protective tape)

The outline of the protective tape 1 of the present embodiment will be described with reference to Figs. 1 and 2 . The protective tape 1 of the present embodiment is attached to the substrate 30 subjected to the reflow process, and at least a part of the substrate 30 is protected. The protective tape has an adhesive layer 11 attached to the substrate 30, The metal layer 14 and the resin layer 13 are provided with at least a metal layer 14 and a resin layer 13 on the adhesive layer 11. Further, in the protective tape 1 shown in Figs. 1 and 2, the resin layer 13 and the metal layer 14 are provided on the adhesive layer 11 in the order of the resin layer 13 and the metal layer 14. Further, the resin layer 13 and the metal layer 14 may be provided on the adhesive layer 11 in the order of the metal layer 14 and the resin layer 13 in order not to be limited thereto. Here, in the reflow process of the present embodiment, the temperature at the substrate 30 is at most 270 °C.

As shown in Fig. 1, the protective tape 1 is wound into a roll shape as a general tape, and is cut into a desired size by the operator's hand or the like when used. Further, the protective tape 1 which has been cut out is such that the adhesive layer 11 is the surface side of the substrate 30 and is attached to the substrate 30 to be protected.

The protective tape 1 is formed by laminating the adhesive layer 11, the resin layer 13, and the metal layer 14 from the side attached to the substrate 30. Further, the metal layer 14 is attached to the resin layer 13 by the adhesive layer 12. Further, the metal layer 14 located at the outermost layer of the protective tape 1 reflects the heat 70 of the reflow process and heats the heat 70a entering the metal layer 14 to the outside. Therefore, the protective tape 1 can easily conduct heat to the adhesive layer 11 located under the metal layer 14. In addition, the protective tape 1 is even In the case where the adhesive layer 11, the metal layer 14, and the resin layer 13 are laminated in this order from the side attached to the substrate 30, the heat that has passed through the resin layer 13 can also be made by the metal layer 14. Reflected, and the incoming heat 70a is radiated to the outside.

(How to use protective tape)

Specifically, a method of using the protective tape 1 will be described with reference to Fig. 2 . In the substrate 30 of the present embodiment, a flexible printed circuit board (FPC) is used. The substrate 30 is placed on the support plate 20 used in the reflow process of Fig. 3 to be described later. Further, on the substrate 30, connection portions 35a and 35b for connecting the electronic component 40 and the like are provided. In the case of Fig. 2, the electronic component 40 is connected to the connecting portion 35a via the solder 45, and the protective tape 1 is attached to the connecting portion 35b. As a result, the protective tape 1 attached to the substrate 30 is also attached to the surface of the support plate 20, and the substrate 30 is fixed to the support plate 20 by the protective tape 1. As described above, by attaching the protective tape 1 to the connecting portion 35b where the electronic component 40 is not attached, the solder 45 is prevented from being melted in the reflow process, and the scattered solder 45 is attached to the substrate 30. Further, the protective tape 1 is not limited to the connecting portion 35b of the substrate 30, but may be attached to the portion to be protected on the substrate 30 as appropriate.

Here, as described above, the flexible printed circuit board such as the substrate 30 of the present embodiment is often bent frequently during work. As the above occurs, the protective tape 1 for protecting the substrate 30 is sometimes bent. In addition, since the protective tape 1 is peeled off from the substrate 30 In addition, the protective tape 1 is also bent. Therefore, in addition to the countermeasure against the heat caused by the reflow process, the protective tape 1 is also considered to have flexibility and strength which are not easily broken even if bent, and The material or thickness of the composition is set.

Each configuration of the protective tape 1 of the present embodiment will be described.

(metal layer)

First, the metal layer 14 of the protective tape 1 will be described. The metal layer 14 is attached to the resin layer 13 to be described later by the adhesive layer 12, and is disposed on the outermost layer of the protective tape 1, and has a function of reflecting heat in the reflow process or dissipating heat. Further, the thickness of the metal layer 14 is preferably 6 μm to 30 μm. This is because if the thickness of the metal layer 14 is thinner than 6 μm, it may be easily broken during the peeling operation or it may become difficult to dissipate heat. On the other hand, if the thickness of the metal layer 14 is thicker than 30 μm, the protective tape 1 becomes too hard to be peeled off due to the thickness, or a large amount of material is required to cause high cost. Further, the metal layer 14 may be plated with a metal such as aluminum, silver or copper, and a metal foil may also be used. Among them, it is easy to reflect heat in the reflow process, and in terms of heat dissipation characteristics, it is preferable to use aluminum in the metal layer 14.

According to this configuration, since the heat can be more effectively reflected and radiated to the outside, the temperature rise of the adhesive layer 11 can be alleviated, and the protective tape can be easily peeled off during the peeling operation, and the work efficiency can be improved.

Further, since the thickness of the metal layer 14 is appropriate, it becomes easy to efficiently reflect and dissipate heat. Further, by the thickness of the metal layer 14, The protective tape 1 is not made too hard to be peeled off, or a large amount of material is required to cause high cost.

(adhesive layer)

The adhesive layer 12 is interposed between the metal layer 14 and the resin layer 13 and has a function of attaching the metal layer 14 to the resin layer 13. The adhesive layer 12 is formed of a polyurethane adhesive or a polyester adhesive, and has a thickness of 1 to 6 μm.

(resin layer)

Next, the resin layer 13 of the protective tape 1 will be described. The resin layer 13 is provided on the adhesive layer 11 to be described later together with the metal layer 14 to be attached by the adhesive layer 12. In the case of FIG. 1, the resin layer 13 is interposed between the metal layer 14 and the adhesive layer 11, and is bonded to the metal layer 14 by the adhesive layer 12. Further, the resin layer 13 prevents cracking of the metal layer 14 when the protective tape 1 is peeled off.

The resin layer 13 is formed of a resin such as polyethylene terephthalate (PET), polyimine (PI), or epoxy (resin). Among them, polyethylene terephthalate is preferably used from the viewpoint of preventing cracking of the metal layer 14 when the protective tape 1 is peeled off, and without excessive cost. Further, the thickness of the resin layer 13 is 6 μm to 50 μm. This is because if the thickness of the resin layer 13 is thinner than 6 μm, it is difficult to alleviate the influence on the bending of the metal layer 14. On the other hand, because the thickness of the resin layer 13 is thicker than 50 μm, it is guaranteed by the thickness. The protective tape 1 becomes too hard to be peeled off, or a large amount of material is required to cause high cost. Further, the polyethylene terephthalate used in the resin layer 13 turns yellow at a temperature of about 180 ° C to start thermal deformation, and shrinks at a temperature of about 240 ° C. Therefore, the metal layer 14 of the present embodiment reflects heat and dissipates heat so that the temperature of the resin layer 13 does not reach 180 ° C which starts to change color.

Further, in the case of Fig. 1, the resin layer 13 is interposed between the metal layer 14 and the adhesive layer 11, but may be provided on the surface of the metal layer 14 (the outermost layer of the protective tape 1). At this time, not only the function of alleviating the influence on the bending of the metal layer 14 but also the function of protecting the metal layer 14 from the acidic drug or the like can be provided.

According to the configuration of the resin layer 13 as described above, even if the protective tape 1 is bent, the influence on the metal layer 14 due to the bending can be alleviated by the elasticity of the resin layer 13. Therefore, cracking of the metal layer 14 when the protective tape 1 is peeled off from the substrate 30 can be prevented by the resin layer 13.

(adhesive layer)

Next, the adhesive layer 11 of the protective tape 1 will be described. The adhesive layer 11 is disposed on the side in contact with the substrate 30, and is attached to the substrate 30 together with the resin layer 13 laminated on the metal layer 14. The adhesive layer 11 is formed of a resin such as acrylic, rubber, lanthanide, or urethane. Among these, it is preferable to form the adhesive layer 11 by using an acrylic resin in consideration of transparency, adhesion stability, and the like. Further, the thickness of the adhesive layer 11 is 5 μm to 20 μm. this When the thickness of the adhesive layer 11 is thinner than 5 μm, it becomes difficult to adhere to the substrate 30, and if it is thicker than 20 μm, it tends to cause residue when the protective tape 1 is peeled off. Further, when the adhesive layer 11 is formed of an acrylic resin, heat of 250 ° C or more is started to deteriorate, so that the temperature of the heat applied to the adhesive layer 11 is required to be at least 250 ° C or less. .

(substrate)

Next, the substrate 30 to which the protective tape 1 having the above configuration is attached will be described. The substrate 30 of the present embodiment is a flexible printed circuit board (FPC). The substrate 30 is provided on a base member formed of polyimide by a plurality of wiring patterns such as a signal wiring pattern or a ground wiring pattern (not shown), and is provided on the surface thereof by an insulating layer. Etc. The substrate 30 having such a structure is provided with a connection portion 35a and a connection portion 35b, and the connection terminal disposed on the connection portion 35a and the connection terminal disposed on the electronic component 40 are connected by the solder 45. Both are electrically connected. Further, the substrate 30 formed of polyimine can withstand heat of 300 ° C or higher. Further, as shown in FIG. 2, the protective tape 1 is attached to the connection portion 35b of the substrate 30 where the electronic component 40 is not connected, so that the solder 45 scattered in the reflow process is prevented from adhering to the substrate 30. Further, in the present embodiment, the flexible printed circuit (FPC) is used as the substrate 30, but other types of substrates may be used.

(reflow welding project)

Next, the reflow process of this embodiment will be described using FIG. First, the reflow device 50 used in the reflow process will be described. The reflow device 50 has a base portion 51, a conveyor belt 52, and a hot furnace portion 55. The base portion 51 has a long-sized frame and serves as a base of the reflow device 50. The conveyor belt 52 is disposed on the base portion 51, and is internally provided with a plurality of rollers 53 which are held at a certain distance and arranged side by side in the same direction, and are provided with a belt covering the upper and lower sides of the rollers 53. . The roller 53 has an elongated cylindrical shape in a circular cross section, and the belt of the conveyor belt 52 is moved in the left-right direction by rotating each roller 53 about the center of the circle. The hot furnace portion 55 has a total length of 2 m and is provided with an infrared ray irradiation portion 56 inside, and is capable of irradiating infrared rays onto the conveyor belt 52. Further, the infrared ray irradiation unit 56 is provided at a constant interval from the conveyor belt 52. Thereby, infrared rays can be irradiated from the infrared ray irradiation part 56 to the board|substrate 30 which passes the conveyance belt 52.

Here, before the reflow process, a plurality of substrates 30 are arranged on the support plate 20, and the protective tape 1 is attached to the connection portion 35b to which the electronic component 40 is not attached. At this time, the protective tape 1 is attached to the support plate 20 at the same time so that the substrate 30 is fixed to the support plate 20. Moreover, the adhesive layer 11 of the protective tape 1 is attached with the protective tape 1 in order to contact the board|substrate 30. Next, solder paste is applied to the connection portion 35a of the substrate 30, and the electronic component 40 is placed thereon to prepare for reflow.

Then, as shown in Fig. 3(a), the support plate 20 on which the substrate 30 prepared as described above is placed is placed on the conveyor belt 52. Then, by the rotation of each roller 53 of the conveyor belt 52, the conveyor belt 52 is moved toward the right direction of the figure. The support plate 20, which is arranged with the substrate 30, also moves together. The substrate 30 that has moved in the right direction by the conveyor belt 52 is as shown in FIG. 3(b), and then reaches the position below the hot furnace portion 55, and the infrared ray irradiation portion 56 irradiates infrared rays onto the substrate 30. At this time, the substrate 30 that moves under the hot furnace portion 55 is moved in the hot furnace portion 55 having a total length of 2 m in three minutes. On the other hand, the temperature on the moving substrate 30 gradually rises from the initial position of the hot furnace portion 55, and then reaches the maximum temperature of 270 ° C, and the temperature rises as it moves to the last position of the hot furnace portion 55. Slowly falling. By the heat of this temperature (270 ° C), the solder 45 applied to the connection portion 35a is melted, and the connection portion where the connection portion 35a and the electronic component 40 are disposed is followed by the solder 45, thereby making it possible to Both are electrically connected. Further, as shown in Fig. 3(b), the heat applied to the protective tape 1 is conducted to the lower portion of the support plate 20 by the metal layer 14. As a result, the temperature of the adhesive layer 11 of the protective tape 1 is reflected by the metal layer 14 to the outside, and the heat generated by the infrared rays is dissipated, so that at least the deterioration of the adhesive layer 11 is suppressed. Below °C. Further, in Fig. 3, the reflow process of the present embodiment uses infrared rays as a heat source, but is not necessarily limited thereto. For example, it is also possible to perform welding by hot air blowing. Any means that can reflect and dissipate heat by the metal layer 14 of the protective tape 1 can be used.

In this way, by protecting at least a portion of the substrate 30, all of the metal layer 14 of the protective tape 1 can reflect and dissipate heat from the reflow process to the outside. As a result, the metal layer 14 can easily conduct heat to the adhesive layer 11 attached to the substrate 30, so that the adhesive layer 11 can be alleviated. The temperature rises. Thereby, it is not difficult to peel off from the substrate 30 after the reflow process, or it remains after peeling, and it can prevent deterioration of workability.

Further, by the metal layer 14, heat in the reflow process using infrared rays as a heat source can be reflected and radiated to the outside. In this way, the protective tape 1 can be applied even in a reflow process using infrared rays as a heat source.

Further, in the above-described reflow process, the protective tape 1 of the present embodiment can be applied even when the temperature of the substrate 30 is at most 270 °C.

(Example 1 and Comparative Example 1)

Next, the present invention will be specifically described using Example 1 and Comparative Example 1 of the protective tape 1 of the present embodiment.

In the first embodiment, the protective tape 1 of the present invention shown in Fig. 1 is used, and is composed of a metal layer 14, a resin layer 13, and an adhesive layer 11. Specifically, the metal layer 14 is formed of an aluminum (Al) foil and has a thickness of 9 μm. Further, the resin layer 13 was formed of polyethylene terephthalate (PET) and had a thickness of 12 μm. Further, the adhesive layer 11 was formed of an acrylic resin and had a thickness of 10 μm. On the other hand, in the comparative example, the metal layer 14 was not used, but only the resin layer 13 made of polyethylene terephthalate (PET) and the adhesive layer 11 made of an acrylic resin were used. The experiment was carried out, but the protective tape shrinks and cannot be measured. Therefore, in Comparative Example 1, a structure in which the resin layer 13 made of only an epoxy resin and the adhesive layer 11 made of an acrylic resin were used was used.

Then, as far as the evaluation method is concerned, the system has been used in accordance with JIS Z 0237. Peel test for the specified adhesive tape and adhesive sheet test method. Specifically, the protective tape 1 cut into a width of 10 mm and a length of 100 mm is attached to a test plate made of a stainless steel material, and the protective tape 1 is measured from the test plate toward the 180° direction by a tensile tester. Pull the pulling force when peeling off.

The peeling test as described above was carried out before and after the reflow process shown in Fig. 3. In other words, the peeling test was carried out before the reflow process in which the temperature of the substrate 30 under infrared rays was 270 ° C, after the first reflow process was performed, and after the third reflow process was performed. Further, in the test, the test pieces of the four kinds of samples were prepared in each of Example 1 and Comparative Example 1, and the respective tensile forces were measured. The results are shown in Figure 4.

According to the test results shown in Fig. 4, the measured values before the reflow process were the same as the average values of the tensile forces in Example 1 and Comparative Example 1 being 0.27 N, and there was no difference. Thereafter, if the test was carried out after one reflow process, the average tensile force of Example 1 was 0.30 N, and the average value of the tensile force of Comparative Example 1 was 0.61 N, and the tensile forces of the two were different. Next, when the test was carried out after three times of reflowing, the average value of the tensile force with respect to Example 1 was 0.33 N, and the average value of the tensile force of Comparative Example 1 was 1.04 N, and the tensile force of the two showed a large difference. Further, in the first embodiment, in the case of the first reflow process, the tensile force was 1.1 times, and when the reflow process was performed three times, the tensile force was changed to 1.22 times with almost no change, but in the comparative example 1, When the reflowing project was carried out once, the pulling force was 2.25 times, and when it was passed through the three reflowing projects, it greatly increased to 3.85 times. This is considered to be because in the case of Comparative Example 1, since there is no metal layer 14, there is no The method reflects heat and dissipates heat, and causes the temperature of the adhesive layer 11 below it to rise. In other words, it is considered that the temperature of the adhesive layer 11 rises to 250 ° C or more at which the adhesive layer 11 starts to deteriorate by the heat of the reflow process, and the material of the adhesive layer 11 is decomposed to increase the adhesive force. As a result, the tensile force at the time of peeling from the test plate 60 becomes large. On the other hand, in the case of Embodiment 1, since the outermost layer is the metal layer 14, heat is radiated and dissipated by the metal layer 14, and heat is not easily conducted to the adhesive layer 11, and the temperature of the adhesive layer 11 is maintained. It will not rise above 250 °C. Therefore, the adhesive force of the adhesive layer 11 is maintained at the initial state, and the tensile force when the protective tape 1 is peeled off from the substrate 30 is less likely to change, and does not cause adhesion when peeled off from the test plate 60. The residue of layer 11 is produced. As described above, all of the test articles of Example 1 were obtained as "○", and the comparative example was "X".

(Examples 2 to 4 and Comparative Example 2)

Next, the present invention will be specifically described using Examples 2 to 4 and Comparative Example 2 of the protective tape 1 of the present embodiment.

In Examples 2, 3 and Comparative Example 2, the same structure as the protective tape 1 of the present embodiment was obtained, but only the thickness of the metal layer 14 was different. Specifically, the thickness of the metal layer 14 in Example 2 was 6 μm, the thickness of the metal layer 14 in Example 3 was 9 μm, and the thickness of the metal layer 14 in Comparative Example 2 was 0.1 μm. In addition, the other thickness is the same as that of the first embodiment shown in Fig. 4. In addition, in the embodiment 4, the metal layer 14 having a thickness of 9 μm is disposed on the adhesive layer 11 and further on the metal layer 14 A resin layer 13 composed of 12 μm polyimine (PI) was laminated. In the case of the fourth embodiment, the resin layer 13 composed of polyimine (PI) prevents cracking of the metal layer 14 when the protective tape 1 is peeled off from the substrate 30. Further, since the resin layer 13 composed of polyimine (PI) is located at the outermost layer of the protective tape 1, the metal layer 14 can be protected from chemicals such as acid.

Using the examples 2 to 4 and the comparative example 2 having the above-described structures, the peeling test was carried out before the reflow process was carried out, after the first reflow process, and after the third reflow process. Further, the protective tapes of Examples 2 to 4 and Comparative Example 2 were placed in a hot air dryer having different temperatures for 3 minutes, and then a peeling test was performed. Further, in the test of the hot air dryer, a test of heating at a temperature of 200 ° C for 3 minutes and a test of heating at a temperature of 270 ° C for 3 minutes were respectively carried out. The results are shown in Figure 5.

According to the test results shown in Fig. 5, the measured values before the reflow process were as follows: Example 2 was 0.38 N, Example 3 was 0.45 N, Example 4 was 0.32 N, and Comparative Example 2 was 0.17 N. Next, when the test was carried out after passing through the primary reflow process, Example 2 was 0.43 N, Example 3 was 0.51 N, Example 4 was 0.39 N, and Comparative Example 2 was 0.52 N. Further, when the test was carried out after passing through the three reflow processes, Example 2 was 0.49 N, Example 3 was 0.55 N, Example 4 was 0.36 N, and Comparative Example 2 was 0.62 N. As described above, in terms of the thickness of the metal layer 14 and the presence or absence of the resin layer 13 on the metal layer 14, even if the reflow process is performed three times, the tensile force is not greatly different.

Further, in the test of the hot air dryer after heating at a temperature of 200 ° C for 3 minutes, Example 2 was 0.44 N, Example 3 was 0.48 N, Example 4 was 0.35 N, and Comparative Example 2 was 0.34 N. However, in the test of the hot air dryer after heating at 270 ° C for 3 minutes, Example 2 was 0.41 N, Example 3 was 0.38 N, and Example 4 was 0.37 N, and relative to the temperature at 200 ° C. There was not much change in the test of the hot air dryer after heating for 3 minutes, and in the case of Comparative Example 2, the protective tape was shrunk and could not be measured.

This is considered to be because in the case of Comparative Example 2, since the thickness of the metal layer 14 was thin, the metal layer 14 was not heat-resistant in the hot air dryer test at a temperature of 270 °C. As a result, it is known that, in the case where the thickness of the metal layer 14 is at least 6 μm or more, whether after the execution of the three-time reflow process or after the hot air dryer is heated at a temperature of 270 ° C for 3 minutes, The adhesion of the adhesive layer 11 is also less likely to increase.

As a result, the heat in the reflow process can be reflected and radiated to the outside by the metal layer 14 of the protective tape 1 according to the test using the embodiment and the comparative example. As a result, the metal layer 14 can easily conduct heat to the adhesive layer 11 attached to the substrate 30, so that the temperature rise of the adhesive layer 11 can be alleviated. Thereby, it is not difficult to peel off from the substrate 30 after the reflow process, or it remains after peeling, and it can prevent deterioration of workability.

Further, when the thickness of the metal layer 14 is 6 μm or more, the thickness of the metal layer 14 is moderate, and it is easy to efficiently reflect and dissipate heat.

Further, in the above-described reflow process, the protective tape 1 of the present embodiment can be applied even when the temperature of the substrate 30 is at most 270 °C.

The embodiments of the present invention have been described above, but the specific examples are exemplified, and the present invention is not limited thereto, and specific structures and the like can be appropriately modified. Further, the actions and effects described in the embodiments of the present invention are merely illustrative of the most appropriate actions and effects produced by the present invention, and the actions and effects produced by the present invention are not limited to the embodiments of the present invention. Recorded.

[Industrial availability]

The present invention is applicable to a protective tape for protecting a substrate subjected to reflow engineering.

1‧‧‧Protection tape

11‧‧‧Adhesive layer

13‧‧‧ resin layer

14‧‧‧metal layer

70‧‧‧Hot

[Fig. 1] is an explanatory view showing the appearance and cross section of the protective tape of the present embodiment.

[Fig. 2] is an explanatory view showing a state in which the protective tape of the embodiment is attached to a substrate.

[Fig. 3] is an explanatory view showing a reflowing work of the embodiment.

[Fig. 4] is an explanatory view showing the results of the peeling test of Example 1 and Comparative Example 1 using the protective tape of the present embodiment.

[Fig. 5] is an explanatory view showing the results of peeling tests of Examples 2 to 4 and Comparative Example 2 using the protective tape of the present embodiment.

1‧‧‧Protection tape

11‧‧‧Adhesive layer

12‧‧‧Adhesive layer

13‧‧‧ resin layer

14‧‧‧metal layer

70, 70a‧‧‧ hot

Claims (6)

A protective tape attached to a substrate subjected to a reflow process and protecting at least a portion of the substrate, and the adhesion in an initial state attached to the substrate is difficult to rise The protective tape is characterized in that it has an adhesive layer, a metal layer, and a resin layer attached to the substrate, and the thickness of the adhesive layer is 5 μm to 20 μm. The thickness of the metal layer is 6 μm to 30 μm, and the thickness of the resin layer is 6 μm to 50 μm. The protective tape according to the first aspect of the invention, wherein the resin layer and the metal layer are provided on the adhesive layer in the order of the resin layer and the metal layer. The protective tape according to the first aspect of the invention, wherein the resin layer and the metal layer are provided on the adhesive layer in the order of the metal layer and the resin layer. The protective tape according to any one of claims 1 to 3, wherein the metal layer is made of aluminum. The protective tape according to any one of claims 1 to 3, wherein in the reflowing process, the temperature of the substrate is at most 270 °C. The protective tape according to any one of claims 1 to 3, wherein the reflowing process uses infrared rays as a heat source.