TWI568703B - In-Ga-Sn-based oxide sintered body - Google Patents
In-Ga-Sn-based oxide sintered body Download PDFInfo
- Publication number
- TWI568703B TWI568703B TW101130510A TW101130510A TWI568703B TW I568703 B TWI568703 B TW I568703B TW 101130510 A TW101130510 A TW 101130510A TW 101130510 A TW101130510 A TW 101130510A TW I568703 B TWI568703 B TW I568703B
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- sintered body
- oxide
- oxide sintered
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- film
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/453—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zinc, tin, or bismuth oxides or solid solutions thereof with other oxides, e.g. zincates, stannates or bismuthates
- C04B35/457—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zinc, tin, or bismuth oxides or solid solutions thereof with other oxides, e.g. zincates, stannates or bismuthates based on tin oxides or stannates
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/62605—Treating the starting powders individually or as mixtures
- C04B35/62645—Thermal treatment of powders or mixtures thereof other than sintering
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- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
- C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
- C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
- C23C14/086—Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
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- C04B2235/3284—Zinc oxides, zincates, cadmium oxides, cadmiates, mercury oxides, mercurates or oxide forming salts thereof
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- C04B2235/3286—Gallium oxides, gallates, indium oxides, indates, thallium oxides, thallates or oxide forming salts thereof, e.g. zinc gallate
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Structural Engineering (AREA)
- Mechanical Engineering (AREA)
- Inorganic Chemistry (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Thermal Sciences (AREA)
- Physics & Mathematics (AREA)
- Physical Vapour Deposition (AREA)
- Thin Film Transistor (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Electrodes Of Semiconductors (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011180929 | 2011-08-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201309616A TW201309616A (zh) | 2013-03-01 |
| TWI568703B true TWI568703B (zh) | 2017-02-01 |
Family
ID=47746155
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101130510A TWI568703B (zh) | 2011-08-22 | 2012-08-22 | In-Ga-Sn-based oxide sintered body |
Country Status (3)
| Country | Link |
|---|---|
| JP (2) | JP6167039B2 (ja) |
| TW (1) | TWI568703B (ja) |
| WO (1) | WO2013027391A1 (ja) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9224820B2 (en) * | 2012-05-31 | 2015-12-29 | Samsung Corning Advanced Glass, Llc | Oxide semiconductor sputtering target, method of manufacturing thin-film transistors using the same, and thin film transistor manufactured using the same |
| TWI566413B (zh) * | 2013-09-09 | 2017-01-11 | 元太科技工業股份有限公司 | 薄膜電晶體 |
| US10515787B2 (en) | 2013-11-29 | 2019-12-24 | Kobelco Research Institute, Inc. | Oxide sintered body and sputtering target, and method for producing same |
| JP5952891B2 (ja) * | 2014-02-14 | 2016-07-13 | 株式会社コベルコ科研 | 酸化物焼結体、およびスパッタリングターゲットの製造方法 |
| WO2016035503A1 (ja) * | 2014-09-02 | 2016-03-10 | 株式会社神戸製鋼所 | 薄膜トランジスタ |
| JP6659255B2 (ja) * | 2014-09-02 | 2020-03-04 | 株式会社神戸製鋼所 | 薄膜トランジスタ |
| JP2016054171A (ja) * | 2014-09-02 | 2016-04-14 | 株式会社神戸製鋼所 | 薄膜トランジスタの酸化物半導体薄膜、薄膜トランジスタ、およびスパッタリングターゲット |
| US20190067489A1 (en) * | 2016-04-04 | 2019-02-28 | Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) | Thin film transistor |
| JP7173044B2 (ja) | 2017-12-05 | 2022-11-16 | ソニーグループ株式会社 | 撮像素子、積層型撮像素子及び固体撮像装置 |
| TWI820114B (zh) * | 2018-04-20 | 2023-11-01 | 日商索尼股份有限公司 | 攝像元件、積層型攝像元件及固體攝像裝置 |
| US11705530B2 (en) * | 2018-04-20 | 2023-07-18 | Sony Corporation | Imaging device, stacked imaging device, and solid-state imaging apparatus |
| JP7468347B2 (ja) * | 2018-09-28 | 2024-04-16 | ソニーグループ株式会社 | 撮像素子、積層型撮像素子及び固体撮像装置 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200952122A (en) * | 2008-04-16 | 2009-12-16 | Sumitomo Metal Mining Co | TFT-type substrate, TFT LCD device and method for making TFT-type substrate |
| WO2010070944A1 (ja) * | 2008-12-15 | 2010-06-24 | 出光興産株式会社 | 酸化インジウム系焼結体及びスパッタリングターゲット |
| TW201114937A (en) * | 2009-10-30 | 2011-05-01 | Samsung Corning Prec Mat Co | Indium tin oxide sputtering target and transparent conductive film fabricated using the same |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04272612A (ja) * | 1991-02-26 | 1992-09-29 | Kojundo Chem Lab Co Ltd | 透明電極 |
| US5407602A (en) * | 1993-10-27 | 1995-04-18 | At&T Corp. | Transparent conductors comprising gallium-indium-oxide |
| JP3925977B2 (ja) * | 1997-02-21 | 2007-06-06 | 旭硝子セラミックス株式会社 | 透明導電膜とその製造方法およびスパッタリングターゲット |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP6389545B2 (ja) | 2018-09-12 |
| JP6167039B2 (ja) | 2017-07-19 |
| WO2013027391A1 (ja) | 2013-02-28 |
| JPWO2013027391A1 (ja) | 2015-03-05 |
| TW201309616A (zh) | 2013-03-01 |
| JP2017206430A (ja) | 2017-11-24 |
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