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TWI568509B - Apparatus for preventing chamber from particle pollution and cleaning chamber - Google Patents

Apparatus for preventing chamber from particle pollution and cleaning chamber Download PDF

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Publication number
TWI568509B
TWI568509B TW102127233A TW102127233A TWI568509B TW I568509 B TWI568509 B TW I568509B TW 102127233 A TW102127233 A TW 102127233A TW 102127233 A TW102127233 A TW 102127233A TW I568509 B TWI568509 B TW I568509B
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chamber
gas
platform
storage container
cleaning device
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TW102127233A
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Chinese (zh)
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TW201503967A (en
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李瑞評
江嘉恩
黃世維
賴政楡
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兆遠科技股份有限公司
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Description

防止塵粒進入腔室及清理腔室的裝置 Device for preventing dust particles from entering the chamber and cleaning the chamber

本發明是有關於一種腔室裝置,特別是有關於一種防止塵粒進入腔室及清理腔室的裝置。 This invention relates to a chamber apparatus, and more particularly to an apparatus for preventing dust particles from entering the chamber and cleaning the chamber.

近年來電子產品的蓬勃發展,半導體裝置因為具有極高的積集度,及輕薄短小的特性,所以被廣泛應用在許多電子產品中,例如:處理器(processor),記憶體(memory),其他積體電路(IC),發光二極體(LED),電荷耦合元件(CCD),互補式金屬氧化物半導體(CMOS)等。而在影像顯示方面,由於對於平面顯示的需求增加,液晶顯示面板(LCD panel),或發光二極體顯示面板(LED panel),有機發光二極體面板(OLED panel)也被廣泛地運用。再者,封裝基板(package substrate)及印刷電路板(PCB),更是在積體電路元件及許多電子設備中不可或缺的元件。 In recent years, electronic products have flourished, and semiconductor devices have been widely used in many electronic products because of their high degree of integration, lightness, and shortness, such as processors, memory, and others. Integrated circuit (IC), light-emitting diode (LED), charge coupled device (CCD), complementary metal oxide semiconductor (CMOS), etc. In terms of image display, an LCD panel, or a LED panel, and an OLED panel are widely used due to an increase in demand for a flat display. Furthermore, package substrates and printed circuit boards (PCBs) are indispensable components in integrated circuit components and many electronic devices.

上述這些產品或半成品的製造,大多都在一基板上進行,舉例來說,半導體裝置大部分在一半導體基底上製造,比如矽基底,鍺基底,砷化鎵基底等。而液晶顯示面板則在一玻璃基板上進行製造,甚至近期還發展可撓性塑膠基板上製造。發光二極體的基板比如是藍寶石基板,磊晶基板等。封裝基板及印刷電路板則是在一有機基板上製造。然而這些產品的製造方法包括:薄膜沉積,比如物理氣相沉積(PVD),化學氣相沉積 (CVD),電漿加強化學氣相沉積(PECVD)等,微影(photolithography),電鍍,蝕刻,熱氧化,化學機械研磨,旋轉塗佈,網版印刷等。而每一個產品都是經過數十道或數百道上述的製程,才得以完成。為了提高這些產品生產的良率與品質,上述這些製程都需要在一個很潔淨的環境中進行,比如無塵室,或真空腔室中進行,因為這些製程或產品對於塵粒十分敏感。舉例來說,對於微影製程而言,一般會在一曝光機(stepper)中進行曝光,當基板(比如晶圓)或平台受到塵粒汙染,則會影響曝光的良率。例如,當晶圓背面或曝光機之平台(stage)上有塵粒,會造成晶圓放置在平台上不能保持絕對平面,而呈現輕微傾斜,則會導致某些區域的曝光會散焦(defocus),進而影響曝光良率。 Most of these products or semi-finished products are manufactured on a substrate. For example, semiconductor devices are mostly fabricated on a semiconductor substrate such as a germanium substrate, a germanium substrate, a gallium arsenide substrate, or the like. The liquid crystal display panel is fabricated on a glass substrate, and even recently developed on a flexible plastic substrate. The substrate of the light-emitting diode is, for example, a sapphire substrate, an epitaxial substrate or the like. The package substrate and the printed circuit board are fabricated on an organic substrate. However, the manufacturing methods of these products include: thin film deposition, such as physical vapor deposition (PVD), chemical vapor deposition. (CVD), plasma enhanced chemical vapor deposition (PECVD), etc., photolithography, electroplating, etching, thermal oxidation, chemical mechanical polishing, spin coating, screen printing, and the like. And each product is completed after dozens or hundreds of the above processes. In order to improve the yield and quality of these products, these processes need to be carried out in a very clean environment, such as a clean room, or a vacuum chamber, because these processes or products are very sensitive to dust particles. For example, for a lithography process, exposure is typically performed in a stepper, which affects the yield of the substrate when the substrate (such as a wafer) or platform is contaminated with dust particles. For example, when there are dust particles on the back of the wafer or on the stage of the exposure machine, the wafer will not be placed on the platform and it will not remain absolutely flat, but it will be slightly tilted, which will cause the exposure of some areas to defocus (defocus ), which in turn affects the exposure yield.

習知為了防止晶圓背面或曝光機之平台的塵粒汙染,係在進行曝光前對於晶圓背面進行摩擦清理(scrubber),去除晶圓背面的塵粒。然而此方法會增加製程步驟與成本。另一種習知的解決方法,當曝光製程發現有某個固定位置發生散焦,會以強光確認平台塵粒的位置,然後以人工方式用溶劑進行擦拭。然後反覆進行檢查擦拭步驟,直到塵粒完全去除,大約耗費1~2小時。此方法的缺點在於耗費時間與成本,且效率不彰。 In order to prevent dust contamination on the back surface of the wafer or the platform of the exposure machine, the wafer back surface is scrubbed before the exposure to remove dust particles on the back side of the wafer. However, this method increases process steps and costs. Another conventional solution, when the exposure process finds that a certain fixed position is defocused, the position of the platform dust particles is confirmed by strong light, and then the solvent is manually wiped. Then, the inspection wiping step is repeated until the dust particles are completely removed, which takes about 1 to 2 hours. The disadvantage of this method is that it takes time and cost, and is inefficient.

因此,本發明的範疇之一為提供一種腔室防塵裝置,可以有效防止塵粒進入腔室中,並可以有效清除腔室中平台上可能存在的塵粒。 Accordingly, it is an object of the present invention to provide a chamber dustproof device that can effectively prevent dust particles from entering the chamber and effectively remove dust particles that may be present on the platform in the chamber.

根據本發明的一較佳實施例,提出一種腔室防塵裝置,適用於一腔室中,腔室具有至少一入口,及一平台配置於腔室中,腔室防塵裝置包括至少一氣簾裝置,配置於入口,用於噴射一氣體,以適於防止至少 一塵粒進入腔室中。 According to a preferred embodiment of the present invention, a chamber dustproof device is provided, which is suitable for use in a chamber having at least one inlet, and a platform disposed in the chamber, the chamber dustproof device including at least one air curtain device, Disposed at the inlet for injecting a gas to prevent at least A dust particle enters the chamber.

根據本發明的另一實施例,提出一種腔室防塵裝置,適用於一腔室中,腔室具有至少一平台配置於腔室中,腔室防塵裝置包括一平台清理裝置,可卸除地配置於腔室中,以適於利用一氣體清除平台上的至少一塵粒。 According to another embodiment of the present invention, a chamber dustproof device is proposed, which is suitable for use in a chamber having at least one platform disposed in the chamber, the chamber dustproof device including a platform cleaning device, removably configured In the chamber, at least one dust particle on the platform is adapted to utilize a gas purge.

根據本發明的再一實施例,其中氣簾裝置噴射氣體的方向係朝向腔室的外部。平台清理裝置包括一氣刀或一氣體噴射裝置。氣體噴射裝置具有一氣體儲存容器,及一氣體噴嘴與氣體儲存容器連接,其中氣體儲存容器適於儲存一氣體,使得氣體處於高壓低溫狀態,且氣體噴嘴適於將氣體噴射於腔室中的平台上,當腔室為常溫常壓時,部分氣體噴出為固態。然而噴於平台上的氣體係為氮,氬,氦,或其他之鈍氣。 According to still another embodiment of the present invention, the direction in which the air curtain device injects the gas is toward the outside of the chamber. The platform cleaning device includes an air knife or a gas injection device. The gas injection device has a gas storage container, and a gas nozzle is connected to the gas storage container, wherein the gas storage container is adapted to store a gas such that the gas is in a high pressure and low temperature state, and the gas nozzle is adapted to spray the gas into the platform in the chamber. When the chamber is at normal temperature and pressure, part of the gas is ejected into a solid state. However, the gas system sprayed on the platform is nitrogen, argon, helium, or other inert gas.

10‧‧‧腔室 10‧‧‧ chamber

12‧‧‧入口 12‧‧‧ Entrance

14‧‧‧平台 14‧‧‧ platform

16‧‧‧基板 16‧‧‧Substrate

18‧‧‧氣簾裝置 18‧‧‧Air curtain device

α‧‧‧角度 ‧‧‧‧ angle

20,38‧‧‧氣體 20,38‧‧‧ gas

30‧‧‧平台清理裝置 30‧‧‧ Platform cleaning device

32‧‧‧氣體儲存容器 32‧‧‧ gas storage container

34‧‧‧氣體噴嘴 34‧‧‧ gas nozzle

圖一為根據本發明之一實施例,一種腔室防塵裝置的示意圖。 1 is a schematic view of a chamber dustproof device in accordance with an embodiment of the present invention.

圖二為根據本發明之另一實施例,一種腔室防塵裝置的示意圖。 2 is a schematic view of a chamber dustproof device according to another embodiment of the present invention.

圖三為根據本發明之再一實施例,一種腔室防塵裝置的示意圖。 3 is a schematic view of a chamber dustproof device according to still another embodiment of the present invention.

關於本發明的優點,精神與特徵,將以實施例並參照所附圖式,進行詳細說明與討論。值得注意的是,為了讓本發明能更容易理解,後附的圖式僅為示意圖,相關尺寸並非以實際比例繪示。 The advantages, spirits and features of the present invention will be described and discussed in detail by reference to the accompanying drawings. It is to be noted that, in order to make the invention more comprehensible, the appended drawings are only schematic representations, and the related dimensions are not shown in actual scale.

為了讓本發明的優點,精神與特徵可以更容易且明確地了解,後續將以實施例並參照所附圖式進行詳述與討論。值得注意的是,這些實施例僅為本發明代表性的實施例,其中所舉例的特定方法,裝置,條件,材質等並非用以限定本發明或對應的實施例。 For the sake of the advantages and spirit of the invention, the spirit and the features may be more easily and clearly understood, and the detailed description and discussion will be made by way of example and with reference to the accompanying drawings. It is noted that the embodiments are merely representative embodiments of the present invention, and the specific methods, devices, conditions, materials, and the like are not intended to limit the invention or the corresponding embodiments.

本發明的腔室防塵裝置,可以應用在各種基板的曝光機台中,比如半導體裝置對應的半導體基底(比如矽基底,鍺基底,砷化鎵基底等),液晶顯示面板的玻璃基板,可撓性塑膠基板,發光二極體的藍寶石基板,磊晶基板等,封裝基板及印刷電路板的有機基板等等的曝光機台。甚至可以應用於上述基板的其他機台,只要機台中平台對於表面塵粒會影響製程或產品之良率者,皆可以適用。 The chamber dustproof device of the present invention can be applied to an exposure machine of various substrates, such as a semiconductor substrate corresponding to a semiconductor device (such as a germanium substrate, a germanium substrate, a gallium arsenide substrate, etc.), a glass substrate of a liquid crystal display panel, and flexibility. An exposure machine for a plastic substrate, a sapphire substrate of a light-emitting diode, an epitaxial substrate, an organic substrate such as a package substrate and a printed circuit board. It can even be applied to other machines of the above-mentioned substrate, as long as the platform in the machine can affect the process or product yield for surface dust particles.

請參照圖一,其繪示根據本發明一實施例的一種腔室防塵裝置的示意圖。本發明的腔室防塵裝置適用於一腔室10中,比如是曝光機台(stepper)的腔室(chamber)。腔室10具有一入口12,可以讓欲進行製程處理的基板進入,比如讓一晶圓可以從入口12進入腔室10中。腔室10內並具有一平台14(stage),用以承載及固定欲進行製程處理的基板16,比如一半導體晶圓。一般而言,腔室10在入口12處具有一門(未繪示),且腔室10應保持一定的潔淨度,以確保製程良率。當基板16要進入腔室10時,門會打開,此時腔室10會與外界相通,而讓塵粒有進入腔室10的風險。本發明的腔室防塵裝置包括一氣簾裝置18,配置於入口12處,用於噴射一氣體(如箭頭20所示),比如是空氣或其他鈍性氣體。氣簾裝置18的配置較佳是具有一傾斜角度α,使得噴出之氣體20朝向腔室10外部。當腔室10門打開時會啟動氣簾裝置18,噴射氣體20,以形成一氣簾(air curtain),除了可以做為塵粒的屏障, 也可以將塵粒向外吹,達到防止塵粒進入腔室10中的效果。值得注意的是,氣簾裝置18所噴出的氣體20,可以具有一定的壓力或速度,以達到屏障的效果。此外,氣簾裝置18之角度α也可以等於零,也就是氣簾裝置18以垂直向下噴射氣體20。 Please refer to FIG. 1 , which is a schematic diagram of a chamber dustproof device according to an embodiment of the invention. The chamber dust guard of the present invention is suitable for use in a chamber 10, such as a chamber of an exposure stepper. The chamber 10 has an inlet 12 that allows the substrate to be processed for processing, such as allowing a wafer to enter the chamber 10 from the inlet 12. The chamber 10 has a platform 14 for carrying and fixing a substrate 16 to be processed, such as a semiconductor wafer. In general, the chamber 10 has a door (not shown) at the inlet 12, and the chamber 10 should maintain a certain degree of cleanliness to ensure process yield. When the substrate 16 is about to enter the chamber 10, the door will open, at which point the chamber 10 will communicate with the outside, leaving the dust particles at risk of entering the chamber 10. The chamber dust protection device of the present invention includes an air curtain device 18 disposed at the inlet 12 for injecting a gas (as indicated by arrow 20), such as air or other passive gas. The configuration of the air curtain device 18 preferably has an angle of inclination a such that the ejected gas 20 faces the exterior of the chamber 10. When the chamber 10 door is opened, the air curtain device 18 is activated to inject the gas 20 to form an air curtain, which can be used as a barrier for dust particles. It is also possible to blow the dust particles outward to prevent the dust particles from entering the chamber 10. It should be noted that the gas 20 ejected by the air curtain device 18 may have a certain pressure or speed to achieve the effect of the barrier. Furthermore, the angle α of the air curtain device 18 can also be equal to zero, that is, the air curtain device 18 injects the gas 20 vertically downward.

請參照圖二,其繪示根據本發明另一實施例的一種腔室防塵裝置的示意圖。以曝光機台為例,如前所述,當腔室10中平台14與基板16(如圖一所示)之間存在塵粒時,比如10微米的塵粒,就可能造成基板16局部或全面的些微傾斜,而造成曝光製程散焦,圖形轉換失真造成後續製程的誤差與缺陷。根據本發明的另一實施例,本發明的腔室防塵裝置,適用於腔室10中,腔室10具有平台14配置於腔室10中,腔室防塵裝置包括一平台清理裝置。在本發明的某些實施例中,平台清理裝置30可以是一氣刀(air knife),提供高壓高速的氣流。當腔室10進行製程一段時間後,可能有塵粒污染的疑慮,此時可以利用氣刀的氣流噴射於平台14上,以清除塵粒。 Referring to FIG. 2, a schematic diagram of a chamber dustproof device according to another embodiment of the present invention is shown. Taking the exposure machine as an example, as described above, when there are dust particles between the platform 14 and the substrate 16 (shown in FIG. 1) in the chamber 10, for example, 10 micron dust particles may cause the substrate 16 to be partially or The overall slight tilt causes the exposure process to defocus, and the distortion of the graphics conversion causes errors and defects in subsequent processes. In accordance with another embodiment of the present invention, the chamber dust protection device of the present invention is suitable for use in a chamber 10 having a platform 14 disposed in the chamber 10 and a chamber dust containment device including a platform cleaning device. In certain embodiments of the invention, the platform cleaning device 30 can be an air knife that provides high pressure, high velocity airflow. When the chamber 10 is subjected to a process for a period of time, there may be a concern of dust particle contamination, and at this time, the airflow of the air knife may be sprayed on the platform 14 to remove the dust particles.

在本發明的另一實施例中,平台清理裝置30可以是一氣體噴射裝置。氣體噴射裝置30具有一氣體儲存容器32,及一氣體噴嘴34透過管路36與氣體儲存容器32連接,其中氣體儲存容器適於儲存一氣體,使得氣體處於高壓低溫狀態(氣體分子可能呈現液態),且氣體噴嘴34適於將氣體38噴射於腔室10中的平台14上,當腔室10為常溫常壓時,由於氣體38由高壓瞬間降為低壓膨脹,會吸收大量環境中的熱能,使得噴嘴34出口附近呈現極低溫,部分氣體分子噴出時呈現固態。上述之氣體38可以是氮,氬,氦,或其他之鈍氣,較佳是氬,其具有較大的分子量,可以撞擊平台14上附著的塵粒,使其脫落並由氣體38之氣流帶離平台14表面。雖然氣體38噴出時 部分呈現固態,以撞擊平台14表面,但隨之會汽化而揮發。 In another embodiment of the invention, the platform cleaning device 30 can be a gas injection device. The gas injection device 30 has a gas storage container 32, and a gas nozzle 34 is connected to the gas storage container 32 through a line 36. The gas storage container is adapted to store a gas such that the gas is in a high pressure and low temperature state (the gas molecules may be in a liquid state). And the gas nozzle 34 is adapted to spray the gas 38 onto the platform 14 in the chamber 10. When the chamber 10 is at normal temperature and pressure, the gas 38 absorbs a large amount of heat in the environment due to the instantaneous drop from the high pressure to the low pressure. The vicinity of the outlet of the nozzle 34 is extremely cold, and some of the gas molecules appear solid when ejected. The gas 38 may be nitrogen, argon, helium, or other inert gas, preferably argon, which has a relatively large molecular weight and can impinge on the dust particles attached to the platform 14, causing it to fall off and be carried by the gas stream 38. Off the surface of the platform 14. Although gas 38 is ejected Part of the solid state appears to hit the surface of the platform 14, but then vaporizes and volatilizes.

由圖二可知,前述利用本發明之平台清理裝置30進行塵粒清除時,是在基板(如圖一所示)移出腔室10之後進行。因此使用者也可以設定一固定周期,即進行塵粒清除工作,比如N片基板完成曝光製程後,即進行一次平台清理程序。上述週期性的清理程序可以利用適當的硬體及/或軟體來達成。而為了可以清理整個平台14的表面,平台清理裝置30可以裝設在腔室10中的一傳送裝置(未繪示)上,比如機械手臂(robot),或一滑軌,甚至可以直接裝設於曝光機台中曝光鏡頭的傳動裝置上。在本發明的某些實施例中,平台清理裝置30可以用可卸除的方式(detachable)裝設於腔室10中,亦即當平台受塵粒汙染時,才裝設於腔室10中,完成塵粒清除後,即拆卸下來,繼續進行後續的製程動作。 As can be seen from FIG. 2, the dust cleaning of the platform cleaning device 30 of the present invention is performed after the substrate (shown in FIG. 1) is removed from the chamber 10. Therefore, the user can also set a fixed period, that is, perform dust cleaning work, for example, after the N-sheet substrate completes the exposure process, a platform cleaning process is performed. The periodic cleaning procedure described above can be achieved using appropriate hardware and/or software. In order to clean the surface of the entire platform 14, the platform cleaning device 30 can be mounted on a conveyor (not shown) in the chamber 10, such as a robot, or a slide rail, or even directly mounted. On the actuator of the exposure lens in the exposure machine. In some embodiments of the present invention, the platform cleaning device 30 can be detachably mounted in the chamber 10, that is, when the platform is contaminated by dust particles, it is installed in the chamber 10. After the dust particles are removed, they are disassembled and the subsequent process moves are continued.

請同時參照圖一,圖二及圖三,圖三為根據本發明之再一實施例,一種腔室防塵裝置的示意圖。如圖三所室,本發明的腔室防塵裝置,可以結合圖一的氣簾裝置18及圖二的平台清理裝置30,在基板進入腔室時,由氣簾裝置18防止塵粒進入腔室10,並當基板移出腔室10後的適當時機,以平台清理裝置30,清除平台14上的塵粒,以免除塵粒對製程的影響,提高製程及產品良率。值得注意的是,氣簾裝置18及平台清理裝置30可以同時應用並裝設於腔室10中(如圖三所示),也可以單獨配置於腔室10中,如圖一或圖二所示。 Please refer to FIG. 1 , FIG. 2 and FIG. 3 simultaneously. FIG. 3 is a schematic diagram of a chamber dustproof device according to still another embodiment of the present invention. As shown in FIG. 3, the chamber dustproof device of the present invention can be combined with the air curtain device 18 of FIG. 1 and the platform cleaning device 30 of FIG. 2, and the air curtain device 18 prevents the dust particles from entering the chamber 10 when the substrate enters the chamber. And when the substrate is removed from the chamber 10, the platform cleaning device 30 is used to remove the dust particles on the platform 14 to avoid the influence of the dust particles on the process and improve the process and product yield. It should be noted that the air curtain device 18 and the platform cleaning device 30 can be simultaneously applied and installed in the chamber 10 (as shown in FIG. 3), or can be separately disposed in the chamber 10, as shown in FIG. 1 or FIG. .

藉由以上較佳具體實施例之詳述,係希望能更加清楚描述本發明之特徵與精神,而並非以上述所揭露的較佳具體實施例來對本發明之範疇加以限制。相反地,其目的是希望能涵蓋各種改變及具相等性的安排 於本發明所欲申請之專利範圍的範疇內。雖然本發明已以實施方式揭露如上,然其並非用以限定本發明,任何熟習此技藝者,在不脫離本創作之精神和範圍內,當可作各種之更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。 The features and spirit of the present invention will be more apparent from the detailed description of the preferred embodiments. On the contrary, its purpose is to cover various changes and equal arrangements. Within the scope of the patent scope of the invention as claimed. The present invention has been disclosed in the above embodiments, and is not intended to limit the present invention. Any one skilled in the art can make various modifications and retouchings without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.

10‧‧‧腔室 10‧‧‧ chamber

12‧‧‧入口 12‧‧‧ Entrance

14‧‧‧平台 14‧‧‧ platform

18‧‧‧氣簾裝置 18‧‧‧Air curtain device

α‧‧‧角度 ‧‧‧‧ angle

20,38‧‧‧氣體 20,38‧‧‧ gas

30‧‧‧平台清理裝置 30‧‧‧ Platform cleaning device

32‧‧‧氣體儲存容器 32‧‧‧ gas storage container

34‧‧‧氣體噴嘴 34‧‧‧ gas nozzle

Claims (8)

一種腔室防塵裝置,適用於一腔室中,該腔室具有至少一入口,及一平台配置於該腔室中,該腔室防塵裝置包括:至少一氣簾裝置,配置於該入口,用於噴射一氣體,以適於防止至少一塵粒進入該腔室中;以及一平台清理裝置,適於配置於該腔室中,以清除該平台上的至少一塵粒;其中該平台清理裝置包括一氣體噴射裝置,其中該氣體噴射裝置具有一氣體儲存容器,及一氣體噴嘴與該氣體儲存容器連接,其中該氣體儲存容器適於儲存一氣體,使得該氣體處於高壓低溫狀態,且該氣體噴嘴適於將該氣體噴射於該腔室中的該平台上,當該腔室為常溫常壓時,該氣體噴出為固態,以撞擊該平台上附著的該塵粒,且該氣體撞擊該平台後隨之汽化揮發。 A chamber dustproof device is suitable for use in a chamber having at least one inlet, and a platform is disposed in the chamber, the chamber dustproof device comprising: at least one air curtain device disposed at the inlet for Spraying a gas to prevent at least one dust particle from entering the chamber; and a platform cleaning device adapted to be disposed in the chamber to remove at least one dust particle on the platform; wherein the platform cleaning device comprises A gas injection device, wherein the gas injection device has a gas storage container, and a gas nozzle is connected to the gas storage container, wherein the gas storage container is adapted to store a gas such that the gas is in a high pressure and low temperature state, and the gas nozzle Suitable for spraying the gas onto the platform in the chamber. When the chamber is at normal temperature and pressure, the gas is ejected to a solid state to strike the dust particles attached to the platform, and the gas hits the platform. It is vaporized and volatilized. 如請求項1所述之腔室防塵裝置,其中該氣簾裝置噴射該氣體的方向係朝向該腔室的外部。 The chamber dustproof device of claim 1, wherein the air curtain device injects the gas in a direction toward the outside of the chamber. 如請求項1所述之腔室防塵裝置,其中該平台清理裝置為可卸除地配置於該腔室中。 The chamber dustproof device of claim 1, wherein the platform cleaning device is removably disposed in the chamber. 如請求項1所述之腔室防塵裝置,其中該平台清理裝置包括一氣刀。 The chamber dustproof device of claim 1, wherein the platform cleaning device comprises an air knife. 如請求項1所述之腔室防塵裝置,其中該氣體係選自於由氮,氬,氦,鈍氣,及其組合所組成之族群中的一種氣體。 The chamber dust protection device of claim 1, wherein the gas system is selected from the group consisting of nitrogen, argon, helium, blunt gas, and combinations thereof. 一種腔室防塵裝置,適用於一腔室中,該腔室具有至少一平台配置於該 腔室中,該腔室防塵裝置包括:一平台清理裝置,可卸除地配置於該腔室中,以適於利用一氣體清除該平台上的至少一塵粒;其中該平台清理裝置包括一氣體噴射裝置,其中該氣體噴射裝置具有一氣體儲存容器,及一氣體噴嘴與該氣體儲存容器連接,其中該氣體儲存容器適於儲存該氣體,使得該氣體處於高壓低溫狀態,且該氣體噴嘴適於將該氣體噴射於該腔室中的該平台上,當該腔室為常溫常壓時,部分該氣體噴出為固態,以撞擊該平台上附著的該塵粒,且該氣體撞擊該平台後隨之汽化揮發。 A chamber dustproof device suitable for use in a chamber having at least one platform disposed therein In the chamber, the chamber dustproof device comprises: a platform cleaning device removably disposed in the chamber to be adapted to remove at least one dust particle on the platform by using a gas; wherein the platform cleaning device comprises a a gas injection device, wherein the gas injection device has a gas storage container, and a gas nozzle is connected to the gas storage container, wherein the gas storage container is adapted to store the gas so that the gas is in a high pressure and low temperature state, and the gas nozzle is suitable Spraying the gas on the platform in the chamber. When the chamber is at normal temperature and pressure, part of the gas is ejected into a solid state to hit the dust particles attached to the platform, and the gas hits the platform. It is vaporized and volatilized. 如請求項6所述之腔室防塵裝置,其中該平台清理裝置包括一氣刀。 The chamber dustproof device of claim 6, wherein the platform cleaning device comprises an air knife. 如請求項6所述之腔室防塵裝置,其中該氣體係選自於由氮,氬,氦,鈍氣,及其組合所組成之族群中的一種氣體。 The chamber dust protection device of claim 6, wherein the gas system is selected from the group consisting of nitrogen, argon, helium, blunt gas, and combinations thereof.
TW102127233A 2013-07-30 2013-07-30 Apparatus for preventing chamber from particle pollution and cleaning chamber TWI568509B (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200633036A (en) * 2004-12-13 2006-09-16 Varian Semiconductor Equipment Technique for reducing backside particles
TW201201918A (en) * 2010-07-06 2012-01-16 Au Optronics Corp Process system

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200633036A (en) * 2004-12-13 2006-09-16 Varian Semiconductor Equipment Technique for reducing backside particles
TW201201918A (en) * 2010-07-06 2012-01-16 Au Optronics Corp Process system

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