TWI567839B - Wire construction and wire bonding method - Google Patents

Description

Wire construction and wire bonding method

The invention relates to a wire bonding process, in particular to a wire bonding method and a wire bonding structure.

In the existing semiconductor packaging technology, the bonding wire is electrically connected to the carrier such as the lead frame or the package substrate by wire bonding technology (that is, through gold wire or copper wire, etc.), and the carrier is further It is electrically connected to an external device such as a circuit board by a conductive member such as a solder ball.

Conventional wire bonding can form a first ball on a semiconductor device or a carrier by a steel nozzle by a supersonic vibration state to perform a ball bond operation, so that the surface of the pad and the ball end are mutually Fixed, and then the ball extends from the wire body to the surface of the pad of another semiconductor device or carrier for contact pressurization, bonding operation, and finally the excess wire is cut by the steel nozzle. .

As shown in FIG. 1A, it is a cross-sectional view of a conventional wire-bonding device for performing a wire-bonding process, and the wire-bonding device has a weldment 10 such as a steel nozzle and a wire clamp (not shown). When the ball end pressing operation of the wire bonding process is performed, a bonding wire 3 passes through the threading hole 100 of the welding member 10, and the wire clamp clamps the bonding wire 3, The soldering wire 10 is further used to form the wire end 30 on the electrode pad 80 of an electronic component 8. After the ball end 30 is heated and pressed to fix the ball end 30 to the electrode pad 80, the bonding wire 3 is stretched to a pad 90 for carrying the carrier 9 of the electronic component 8. on.

Next, the joint pressurization and heating work are performed. First, the first bonding wire 3 is electrically connected to the bonding pad 90, and then the soldering member 10 is moved upward (such as the arrow direction A) to break the bonding wire 3 to make the bonding wire remaining on the welding component 10. 3' produces a tail 3a, and the tail 3a extends beyond the lower end of the weldment 10 to prepare for the ball end press of the next wire-bonding process.

With the rapid development of the electronics industry, electronic products are gradually moving toward a thinner and lighter trend, so the technology of chip packaging is shrinking, and the size of the wire used (such as line width or contact) is also shrinking, resulting in an increase in the wire bonding process. The difficulty. For example, when conventional contact pressurization and warming work are performed, the bonding wire 3 may not be effectively bonded to the bonding pad 90, so when the welding element 10 is moved upward (such as the arrow direction A'), The wire 3 is pulled off, as shown in Fig. 1B, so that the joint pressurization and warming operation cannot be completed.

Therefore, the conventional wire bonding device is provided with a squealing device, so that when the wire bonding wire 3 is not effectively bonded to the bonding pad 90, the squealing device automatically stops operating and issues a warning ring to call the operator. .

However, when the welding wire 3 is not combined, it is necessary to wait for the operator to perform the manual inspection, which may result in the inability to continue the wire-making process, so that the production line is stagnant, thereby greatly reducing the productivity of the wire-bonding device, and the detection is extremely Time-consuming and increased production costs. Specifically, the current operation process after the activation of the calling device first asks the operator to switch the wire bonding device to the hand motion. In the industry, it is confirmed whether the welding wire 3 is not combined, and then the wire bonding function is manually tested, and the excess wire tail is manually removed. Finally, the wire bonding device is switched to the automatic operation, and the wire quality is confirmed.

Therefore, how to overcome the problems in the prior art has become a problem that is currently being solved.

In view of the above-mentioned various deficiencies of the prior art, the present invention provides a method of forming a bonding wire, comprising: providing a bonding wire device having a weldment, the weldment housing a first bonding wire and a second bonding wire; The first bonding wire is coupled to the contact, and when the first bonding wire is not bonded to the contact, the welding member automatically bonds the first bonding wire to the contact; forming a reinforcing structure on the first a second bonding wire; and bonding the reinforcing structure to the junction of the contact and the first bonding wire.

In the above method of forming a bonding wire, the contact is provided on the first electronic component, and the other end of the first bonding wire is bonded to the second electronic component. Furthermore, the reinforcing structure is coupled to the junction of the other end of the first bonding wire and the other electronic component.

In the above method of forming a bonding wire, the first bonding wire is connected to the second bonding wire, and when the first bonding wire is bonded to the contact, the first bonding wire is separated from the second bonding wire.

In the above method of forming a bonding wire, the end portion of the second bonding wire has a reinforcing structure, and the soldering member bonds the reinforcing structure to the first bonding wire. For example, the reinforcing structure is formed by sintering the ends of the second bonding wires, and the reinforcing structure is a block.

In the foregoing method of forming a bonding wire, the soldering member bonds the reinforcing structure to the first bonding wire.

In the above-described bonding wire forming method, the bonding wire forming method is a forward bonding type or a reverse bonding type.

In the foregoing method of forming a bonding wire, a support structure is formed on the contact to allow the reinforcing structure to sandwich the first bonding wire with the supporting structure.

The present invention further provides a wire bonding structure, comprising: a bonding wire having opposite first and second ends; a first contact for bonding the first end of the bonding wire; and a second contact for providing Bonding the second end of the bonding wire; and reinforcing the structure to the second contact to cover the second end of the bonding wire.

In the above-mentioned wire bonding structure, the first end of the bonding wire is a ball end, and the reinforcing structure is a block. For example, the shape of the block is different from the shape of the ball end; or the shape of the block is the same as the shape of the ball end.

In the wire bonding structure described above, the second end of the wire is linear.

In the wire bonding structure described above, the first contact is provided on the electronic component. For example, the electronic component is an active component, a passive component, or a combination thereof.

In the wire bonding structure described above, the second contact is provided on the electronic component. For example, the electronic component is a lead frame, a package substrate, an active component, a passive component, or a combination thereof.

In the above-mentioned wire bonding structure, the position of the first contact is equal to the position of the second contact.

In the above-mentioned wire bonding structure, the position of the first contact has a height difference from the position of the second contact.

In the foregoing wire bonding structure, the reinforcing structure is further formed to the first contact Upper to cover the first end of the bonding wire.

In the above-mentioned wire bonding structure, the second contact is formed with a supporting structure such that the reinforcing structure and the supporting structure sandwich the second end of the bonding wire.

It can be seen from the above that the wire bonding method and the wire bonding structure of the present invention are designed by the automatic control system so that when the first bonding wire is not effectively coupled to the contact, it can be switched to the manual detection mode. In this case, the welding member is repeatedly subjected to the step of pressing and heating the joint until the first bonding wire is effectively bonded to the joint, so that the welding wire is formed according to the conventional manual method. The method not only can continue the wire bonding process to maintain the productivity of the wire bonding equipment, but also saves time and greatly reduces the production cost.

10,20‧‧‧ Weldments

100,200‧‧‧ threading hole

2,2’,3,3’,7‧‧‧welding line

2a, 4a, 7a‧‧‧ first end

2b, 4b, 7b‧‧‧ second end

3a, 5a’‧‧‧ end of line

30,40‧‧‧ ball end

4‧‧‧First wire bond

5,5’‧‧‧second welding line

5a‧‧‧End

50,50’,70‧‧‧Strengthened structure

60‧‧‧carriers

61‧‧‧First electronic component

610‧‧‧First contact

62,62’,62”‧‧‧second electronic components

620, 620’, 620” ‧ ‧ second contact

70’‧‧‧Support structure

8‧‧‧Electronic components

80‧‧‧electrode pads

80’‧‧‧Pat Department

9‧‧‧Carrier

90,90’‧‧· solder pads

A, A’, A”, B, C, D, E, S, R‧‧‧ arrow directions

H‧‧‧ height difference

1A is a schematic cross-sectional view of a conventional wire bonding process; FIG. 1B is a practical view of FIG. 1A; and FIGS. 2A to 2F are cross-sectional views of a wire bonding method of the present invention; 3 and 3' The drawings are schematic cross-sectional views of different aspects of the wire bonding structure of the present invention; and Figs. 4A to 4C are schematic cross-sectional views showing other embodiments of the wire bonding structure of the present invention.

The other embodiments of the present invention will be readily understood by those skilled in the art from this disclosure.

It should be noted that the structure, proportion and size depicted in the drawings of this specification And the like, which are used for the understanding and reading of those skilled in the art, and are not intended to limit the implementation of the invention, and thus do not have technical significance, any structural modification, The change of the proportional relationship or the adjustment of the size should be within the scope of the technical content disclosed by the present invention without affecting the effects and the achievable effects of the present invention. In the meantime, the terms "upper", "lower", "first", "second", "one", and the like, are used for convenience of description, and are not intended to limit the present invention. The scope of the invention, the change or adjustment of the relative relationship, is also considered to be within the scope of the invention.

2A to 2F are schematic cross-sectional views showing a method of forming a bonding wire of the present invention. In this embodiment, the wire bonding method is performed by a wire bonding device on a carrier 9 (which can be regarded as a second electronic component) provided with an electronic component 8 (which can be regarded as a first electronic component). The wire bonding equipment includes a weldment 20, a clamp (not shown) and an automatic control system, and the carrier 9 has at least one pad 90 (which can be regarded as a second joint).

As shown in FIG. 2A, a first bonding wire 4 passes through the threading hole 200 of the soldering member 20, and a second bonding wire 5 is received in the threading hole 200 and is sandwiched in the wire clamp. The first bonding wire 4 is connected to the second bonding wire 5 . Then, the first bonding wire 4 is formed by the soldering member 20 to form a ball end 40 on the electrode pad 80 (which can be regarded as a first contact) of the electronic component 8. After the ball end 40 is heated and pressed to fix the ball end 40 to the electrode pad 80, the first bonding wire 4 is stretched onto the pad 90 of the carrier 9.

Next, performing contact pressurization and heating work, first making the first bonding wire 4 is bonded to the bonding pad 90 to be electrically connected to each other, and then moved to the soldering member 20 (such as the arrow direction A) to break the first bonding wire 4.

In the embodiment, the first bonding wire 4 is not effectively bonded to the bonding pad 90. Therefore, when the soldering member 20 is moved upward, the first bonding wire 4 and the second bonding wire 5 are not separated from each other. Therefore, the first bonding wire 4 needs to be automatically reattached and heated.

As shown in FIG. 2B, the automatic control system of the wire bonding apparatus automatically commands the weldment 20 to re-bond the first bonding wire 4 to the bonding pad 90, that is, the direction of the weldment 20 toward the carrier 9. (ie, downward, as in the direction of the arrow B) to perform contact pressurization and warming.

In the embodiment, the wire bonding device can add a tweet device according to requirements, but does not affect the operation of the overall production line, that is, the operator does not need to switch the wire bonding device to the manual mode, and thus does not need to perform detection.

As shown in FIG. 2C, after the first bonding wire 4 is effectively bonded to the bonding pad 90, the soldering member 20 is moved upward (such as the arrow direction C) to break the first bonding wire 4 to make the first wire. The bonding wire 4 and the second bonding wire 5 are separated from each other.

In this embodiment, the two ends of the first bonding wire 4 are respectively coupled to the electrode pad 80 of the electronic component 8 and the bonding pad 90, and after the first bonding wire 4 is pulled off, the second bonding wire is One of the ends 5a of the 5 will protrude from the weldment 20.

As shown in FIG. 2D, a reinforcing structure 50 is formed on the second bonding wire 5.

In the present embodiment, the reinforcing structure 50 is formed on the end portion 5a of the second bonding wire 5 in a sintered manner, so that the reinforcing structure 50 is a block, such as a spherical shape.

As shown in FIG. 2E, the weldment 20 is oriented in the direction of the carrier 9 (ie Moving downward, as in the direction of the arrow D), the reinforcing structure 50 is bonded to the junction of the bonding pad 90 and the first bonding wire 4, and then heating and pressurizing work is performed to make the reinforcing structure 50 A bonding wire 4 is fixed on the bonding pad 90 to enhance the bonding of the bonding pad 90 and the first bonding wire 4.

As shown in FIG. 2F, the weldment 20 is moved upward (such as the arrow direction E) to separate the reinforcing structure 50 and the second bonding wire 5' so that the second bonding wire 5' remaining on the welding member 20 is removed. A tail 4a' is produced, and the tail 5a' extends beyond the lower end of the weldment 20 to prepare for another ball end press.

The wire bonding method of the present invention is designed by the automatic control system so that when the first bonding wire 4 is not effectively bonded to the bonding pad 90, the switching can be performed without switching to the manual detecting mode. The welding member 20 repeats the steps of the joint pressing and warming operation until the first bonding wire 4 is effectively bonded to the bonding pad 90, so that the bonding wire forming method of the present invention is not only compared with the conventional manual method. The wire bonding process can be continued to maintain the productivity of the wire bonding equipment, and the time can be saved to substantially reduce the production cost.

The present invention provides a wire bonding structure, as shown in FIGS. 2F and 3, comprising: a bonding wire 2 (or a first bonding wire 4) and a first contact (ie, a pad portion 80' such as an electrode pad 80). A second contact (such as pad 90, 90') and a reinforced structure 50, 50'.

The bonding wire 2 (or the first bonding wire 4) has opposite first ends 2a, 4a and second ends 2b, 4b, and the first ends 2a, 4a of the bonding wires 2, 4 are ball ends 40 And the second ends 2b, 4b of the bonding wire 2 (or the first bonding wire 4) are linear.

The first contact (e.g., electrode pad 80 or pad portion 80') is for bonding the first ends 2a, 4a of the bonding wire 2 (or the first bonding wire 4). In this embodiment, The first contact generally refers to an external connection on the first electronic component, wherein the first electronic component is an active component, a passive component or a combination thereof, and the active component is, for example, a semiconductor wafer, and the passive component For example, resistors, capacitors, and inductors.

The second contact (e.g., pad 90, 90') is for bonding the second ends 2b, 4b of the bonding wire 2 (or the first bonding wire 4). In this embodiment, the second contact generally refers to an external connection on the second electronic component, for example, a lead of a lead frame, a contact pad of a package substrate, or the like, or a contact on other electronic components. The electronic component is an active component, a passive component, or a combination thereof, and the active component is, for example, a semiconductor wafer, and the passive component is, for example, a resistor, a capacitor, an inductor, or the like.

The reinforcing structure 50, 50' is formed on the second contact to cover the second ends 2b, 4b of the bonding wire 2 (or the first bonding wire 4), and the reinforcing structure 50, 50' Is a block. In one embodiment, the shape of the reinforcing structure 50 is different from the shape of the ball end 40; alternatively, the reinforcing structure 50' has the same shape as the ball end 40.

In an embodiment, as shown in FIG. 3', the reinforcing structure 50' is overlaid onto the first contact (ie, the pad portion 80', such as the electrode pad 80 of the electronic component 8) to cover the bonding wire. The first end 2a, 4a of 2' (or the first bonding wire 4).

Therefore, the reinforcing structure can be formed on one end or both ends of a bonding wire as needed.

In addition, as shown in FIG. 4A, the first electronic component 61 and the second electronic component 62 are wafers and are located on the same carrier 60, such that the position of the first contact 610 and the position of the second contact 620 are equal. High, a weld line 7 One end 7a is coupled to the first contact 610 of the first electronic component 61, and the second end 7b of the bonding wire 7 is coupled to the second contact 620 of the second electronic component 62, and the reinforcing structure 70 is The second contact 620 is formed to cover the second end 7b of the bonding wire 7.

In this embodiment, the wire bonding method is a forward bond, such as an arrow direction S, that is, the first end 7a of the bonding wire 7 is first bonded to the first contact 610, and then the bonding wire is The second end 7b of the seventh end 7b is bonded to the second contact 620, after which the reinforcing structure 70 is formed onto the second contact 620.

Furthermore, the second contact 620 can be formed with a supporting structure 70' such that the reinforcing structure 70 and the supporting structure 70' sandwich the second end 7b of the bonding wire 7. The manufacturing method of the supporting structure 70' can refer to the manufacturing method of the reinforcing structure 50.

Moreover, as shown in FIG. 4B, the first electronic component 61 and the second electronic component 62' are stacked as a wafer and are stacked on each other such that the position of the first contact 610 and the position of the second contact 620' have The height difference is h.

In another embodiment, the wire bonding method may also be reversed. Specifically, as shown in FIG. 4C, the first electronic component 61 is a wafer, and the second electronic component 62" is a carrier carrying the first electronic component 61, wherein the wire bonding method is reverse bonding ( Reverse bond), as in the direction of the arrow R, first bonding the second end 7b of the bonding wire 7 to the second contact 620" of the second electronic component 62", and then the first end 7a of the bonding wire 7 Bonding to the first contact 610, the reinforcing structure 70 is formed on the second contact 620" (dashed line in the figure).

Therefore, the wire bonding method of the present invention is suitable for positive combination and reverse To the combination.

In summary, the wire bonding method and the wire bonding structure of the present invention are mainly designed by an automatic design to automatically command the weldment to repeat the joint when the first wire is not effectively bonded to the joint. The steps of pressing and warming up until the first bonding wire is effectively bonded to the joint, the invention can not only continue the wire bonding process to maintain the productivity of the wire bonding equipment, but also save time and greatly reduce the manufacturing cost.

The above embodiments are intended to illustrate the principles of the invention and its effects, and are not intended to limit the invention. Any of the above-described embodiments may be modified by those skilled in the art without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention should be as set forth in the appended claims.

2‧‧‧welding line

2a‧‧‧ first end

2b‧‧‧second end

40‧‧‧ ball end

50’‧‧‧Strengthen structure

80’‧‧‧Pat Department

90'‧‧‧ solder pads

Claims (21)

A method for forming a bonding wire, comprising: providing a bonding wire device having a welding member, wherein the welding member receives a first bonding wire and a second bonding wire connected; and bonding the first bonding wire to the joint, And when the first bonding wire is not bonded to the contact, the welding member automatically bonds the first bonding wire to the contact; forming a reinforcing structure on the second bonding wire; and combining the reinforcing structure To the junction of the contact and the first bonding wire. The bonding wire forming method according to claim 1, wherein the contact is provided on the electronic component, and the other end of the first bonding wire is bonded to the other electronic component. The bonding wire forming method of claim 2, wherein the reinforcing structure is coupled to a junction of the other end of the first bonding wire and the other electronic component. The bonding wire forming method according to claim 1, wherein the first bonding wire is separated from the second bonding wire when the first bonding wire is bonded to the contact. The bonding wire forming method according to claim 1, wherein the reinforcing structure is formed on an end portion of the second bonding wire. The method of forming a bonding wire according to claim 1, wherein the reinforcing structure is formed by sintering an end portion of the second bonding wire. A method of forming a bonding wire according to claim 1, wherein The reinforced structure is a block. The bonding wire forming method according to claim 1, wherein the welding member bonds the reinforcing structure to the first bonding wire. The method of forming a bonding wire according to claim 1, wherein the bonding wire forming method is a forward bonding type or a reverse bonding type. The method of forming a bonding wire according to claim 1, wherein a support structure is formed on the joint to cause the reinforcing structure to sandwich the first bonding wire with the supporting structure. A wire bonding structure includes: a bonding wire having opposite first and second ends; and a first contact for bonding the first end of the bonding wire, wherein the first end of the bonding wire is a ball end; a second contact for bonding the second end of the bonding wire; and a reinforcing structure formed on the second contact to cover the second end of the bonding wire, wherein the reinforcing structure is It is a block, and the shape of the block is the same as the shape of the ball end. The wire bonding structure according to claim 11, wherein the second end of the wire is linear. The wire bonding structure according to claim 11, wherein the reinforcing structure is a block. The wire bonding structure of claim 11, wherein the first contact is provided on the electronic component. The wire bonding structure of claim 14, wherein the electronic component is an active component, a passive component, or a combination thereof. The wire bonding structure of claim 11, wherein the second contact is provided on the electronic component. The wire bonding structure of claim 16, wherein the electronic component is a lead frame, a package substrate, an active component, a passive component, or a combination thereof. The wire bonding structure of claim 11, wherein the position of the first contact is equal to the position of the second contact. The wire bonding structure of claim 11, wherein the position of the first contact has a height difference from the position of the second contact. The wire bonding structure of claim 11, wherein the reinforcing structure is formed over the first contact to cover the first end of the bonding wire. The wire bonding structure of claim 11, wherein the second contact is formed with a supporting structure such that the reinforcing structure and the supporting structure sandwich the second end of the bonding wire.