TWI566723B - Cross-structure thermal conductivity device with different thermal characteristics - Google Patents

Description

Cross-structure thermal conductivity device with different thermal characteristics

The present invention is at least two kinds of thermoelectric conductive materials having different heat transfer coefficient or unit heat capacity value or emissivity, at least one of which is different to form at least two layers in a specific cross laminated structure. The warm energy transmission structure is used to improve the performance of the warm energy transmission.

The traditional heat dissipation structure usually constitutes a warm energy conduction structure by a single material. Because of the cold source or heat source as the first warm energy body, the heat pipe or other refrigeration or other heat can be contacted in a closed space, and the contact is often The smaller heat conduction area of one of the thermoelectric conduction devices, for example, the heat source of the first warm energy body is the thermal energy of the central processor of the computer, or the thermal energy of the power semiconductor heat loss, or the heat loss of the LED (LED) When the thermal energy is coupled to the heating element for heat dissipation function, if the temperature conduction structure is made of a single material, even if the heat conductivity of the single material itself is better, the unit heat capacity value is usually not optimal, for example, A heat sink made of a central processing unit or a power semiconductor or a light-emitting diode made of copper, which is heavy and expensive, has a good heat transfer coefficient, but has a unit heat capacity value lower than that of aluminum; A single material, which is lighter in weight and lower in price, such as a central processing unit made of aluminum, or a power semiconductor, or a heat sink of a light-emitting diode, has a unit heat capacity value and heat. The reflection coefficient (emissivity, Emissivity) although high thermal conductivity material but which is less than copper, it is made using a single material capable of conducting structure temperature, which temperature can transmit more limited effect.

The invention discloses a heat conduction device with cross-structures with different thermal characteristics, which is a heat conduction structure which is formed by a material of different heat conduction characteristics and has a specific cross-laminated structure, and is different from a conventional heat conduction device composed of a single material. This item The thermal conductivity principle and device with different thermal characteristics in a specific cross-laminated structure type is to use a material with a good thermal conductivity as a relay thermal conductor, and the first end or surface of the relay thermal conductor is provided with heat or cold. The thermal energy body is thermally coupled, and the other end of the relay heat conductor is coupled to the interface heat conductor, and the other portion is directly coupled to the second warm energy body, and the interface thermal conductor has ( 1) having a higher unit heat capacity value relative to the relay heat conductor, or (2) having a better thermal conductivity relative to the relay heat conductor to the second warm energy body, or (3) relative to the relay heat conductor For the second warm energy body, the three characteristics of the better thermal emissivity (emissivity) are better or at least one of the heat transfer characteristics is better, and as the relay heat conductor and the second warm energy body The heat conduction carrier; when there is a temperature difference between the first warm energy body and the second warm energy body, the materials of different thermal characteristics are used for the specific cross-stacking structure to facilitate the conduction of the warm energy.

The invention discloses a heat conduction device with cross-structures with different thermal characteristics, which is a heat conduction structure which is formed by a material of different heat conduction characteristics and has a specific cross-laminated structure, and is different from a conventional heat conduction device composed of a single material. The heat conduction principle and device with different thermal characteristics in a specific cross-laminated structure type is a relay heat conductor with a material having a good heat transfer coefficient, and one end or surface of the relay heat conductor is heated or cooled. The first warm energy body is thermally coupled, and the other end of the relay heat conductor is coupled to the interface heat conductor, and the other portion is directly coupled to the second warm energy body. In order to have (1) a higher unit heat capacity value relative to the relay heat conductor, or (2) a relatively good heat transfer coefficient with respect to the relay heat conductor to the second warm energy body, or (3) relative to the middle After the thermal conductor is good for the second warm energy body, the three characteristics of the better thermal emissivity (emissivity) are better or at least one of the heat conduction characteristics is better, and the relay heat conductor is used as the relay heat conductor. The second temperature between the thermal energy body by a conductive carrier; thermal energy when the first body and the second thermal energy body When there is a temperature difference between them, the materials with different thermal characteristics are used for the specific cross-stacking structure to facilitate the conduction of the temperature.

The cross-structure thermal conduction device with different thermal characteristics may be further combined with the multi-layer structure for heat conduction in addition to the multi-layer structure which is layered as described above. Composition of the structure to further improve the heat transfer function;

FIG. 1 is a schematic diagram of the structure principle of the prior art three-layer stacking.

2 is a schematic structural diagram of the prior art FIG. 1 in which a thermal conductive interlayer (110) is interposed between an interface thermal conductor (103) and a relay thermal conductor (102).

The above FIG. 1 and FIG. 2 are the infrastructures of the multi-layer structure which are stacked one by one; under this infrastructure, the heat source of the first warm energy body (101) in FIG. 1 is the heat energy of the central processor of the computer, or The heat energy of the heat loss of the power semiconductor, or the heat energy of the heat loss of the light emitting diode (LED) is not directly combined with the interface heat conductor (103); the heat source of the first warm energy body (101) in Fig. 2 is the central processing of the computer The thermal energy of the heat loss, or the thermal energy of the heat loss of the power semiconductor, or the thermal energy of the light-emitting diode (LED) is not directly combined with the thermal conductive interlayer (110) or the interface thermal conductor (103), and the relay thermal conductor (102) The interface thermal conductor (103) is also not directly combined; therefore, the structure can be further improved according to the application requirements and manufacturing and space considerations, and the structure is further formed as a cross-layer combination for heat conduction. That is, according to FIG. 1, the heat conduction surface of the first warm energy body (101) can be further combined with the relay heat conductor (102), and part of the heat conduction surface is bonded to the interface heat conductor (103). A warm energy body (101) for heat conduction surface combined with the relay heat conductor (102) and heat conduction with the interface Thermal bonding of (103) plane of the conductive position, and to follow the distribution of the temperature difference between heat application conditions as a selector.

FIG. 3 is a schematic structural view showing a part of a multi-layer structure in which a cross-layer is combined for heat conduction according to the present invention.

In Figure 3, the structural features of its cross-layer bonding are as follows: ─ a part of the heat conduction surface of the first warm energy body (101) is combined with the relay heat conductor (102), and a heat conduction surface of the part of the first temperature energy body (101) is provided for bonding with the interface heat conductor (103); ─ part of the heat conduction surface of the relay heat conductor (102) is combined with the first warm energy body (101), and part of the heat conduction surface is provided for bonding with the interface heat conductor (103); ─ part of the heat conduction of the interface heat conductor (103) The surface is supplied to the second warm energy body (104); the conduction area and thickness of the cross-layer joint surface and the original multi-layer joint surface of each layer and the thermal characteristics of the heat conductive material are selected according to the temperature heat flow distribution and application conditions. The first warm energy body (101) may be a heat source or a heat absorbing body; and the second warm energy body (104) may be a heat absorbing body or a heat source.

Fig. 4 is a schematic view showing the structure of a part of the multi-layer structure of the present invention which is cross-layered for heat conduction.

In Figure 4, the structural features of the cross-layer bonding are as follows: - part of the heat conduction surface of the first warm energy body (101) is combined with the relay heat conductor (102), and part of the first warm energy body (101) The heat conducting surface is combined with the heat conducting interlayer (110); the part of the heat conducting surface of the relay heat conductor (102) is combined with the first warm energy body (101), and the heat conducting surface of the partial heat conducting body (102) is relayed. For bonding with the thermal interlayer (110); the thermal conduction surface of the thermal interlayer (110) is combined with the interface thermal conductor (103), and the thermal conduction surface of the partial thermal interlayer (110) is coupled to the relay thermal conductor (102) And a heat conducting surface of the portion of the thermal conductive interlayer (110) is provided for bonding with the first warm energy body (101); a part of the heat conducting surface of the interface heat conducting body (103) is combined with the heat conducting interlayer (110), and a part of the heat conducting surface is provided The second warm energy body (104) coupler; ─ the conduction area and thickness of the cross-layer joint surface and the original multi-layer joint surface of each layer The thermal property of the thermal material may be selected according to the temperature heat flow distribution and application conditions; the first warm energy body (101) may be a heat source or a heat absorbing body; and the second warm energy body (104) may be a heat absorbing body or a heat source.

Fig. 5 is a schematic view showing the structure of a portion of the multi-layer structure of the present invention which is cross-layered for heat conduction.

In Figure 5, the structural features of the cross-layer bonding are as follows: - the heat conduction surface of the first warm energy body (101) is combined with the relay heat conductor (102); - the relay heat conductor (102) Part of the heat conduction surface is combined with the first warm energy body (101), and part of the heat conduction surface is combined with the heat conduction interlayer (110), and the heat conduction surface of the partial relay heat conductor (102) is provided for bonding with the interface heat conductor (103). ; part of the thermal conduction surface of the thermal interlayer (110) for bonding with the interface thermal conductor (103), and a portion of the thermal conduction surface for bonding with the relay thermal conductor (102); - part of the thermal conduction surface of the interface thermal conductor (103) For bonding with the thermal conductive interlayer (110), and the thermal conduction surface of the partial interface thermal conductor (103) for bonding with the relay thermal conductor (102), and the thermal conduction surface of the partial interface thermal conductor (103) for supplying the second thermal energy body ( 104) coupler; ─ the conduction area and thickness of the cross-layer joint surface and the original multi-layer joint surface of each layer and the thermal characteristics of the heat conductive material can be selected according to the temperature heat flow distribution and application conditions; the first warm energy body ( 101) may be a heat source or a heat absorbing body; the second warm energy body (104) may be a heat absorbing body or a heat source .

Fig. 6 is a third schematic view showing the structure of the intermediate portion of the multi-layer structure of the present invention in which the cross-layer is combined for heat conduction.

In Figure 6, the structural features of the cross-layer bonding are as follows: - part of the heat conduction surface of the first warm energy body (101) is combined with the relay heat conductor (102), and part of the first warm energy body (101) The heat conducting surface is coupled to the heat conducting interlayer (110), and a portion of the heat conducting surface of the first warm energy body (101) is coupled to the interface heat conductor (103); ─ a part of the heat conduction surface of the relay heat conductor (102) is combined with the first warm energy body (101), and part of the heat conduction surface of the relay heat conductor (102) is combined with the heat conduction interlayer (110); A part of the heat conduction surface of (110) is combined with the interface heat conductor (103), a part of the heat conduction surface of the heat conduction interlayer (110) is combined with the relay heat conductor (102), and a part of the heat conduction surface of the heat conduction interlayer (110) is provided for a thermal energy body (101) combiner; - part of the heat conduction surface of the interface thermal conductor (103) is combined with the thermal conductive interlayer (110), and part of the heat conduction surface of the interface thermal conductor (103) is supplied to the first warm energy body (101) Combining, and a part of the thermal conduction surface of the interface thermal conductor (103) is coupled to the second warm energy body (104); ─ the conduction area and thickness of the cross-layer bonding surface and the original composite bonding surface of each layer and the thermal conductive material The choice of thermal characteristics may be selected according to the temperature heat flow distribution and application conditions; the first warm energy body (101) may be a heat source or a heat absorbing body; and the second warm energy body (104) may be a heat absorbing body or a heat source.

Fig. 7 is a fourth schematic view showing the structure of the intermediate portion of the multi-layer structure of the present invention in which the cross-layer is combined for heat conduction.

In Fig. 7, the structural features of the cross-layer bonding are as follows: - part of the heat conduction surface of the first warm energy body (101) is combined with the relay heat conductor (102), and part of the first warm energy body (101) The heat conduction surface is combined with the heat conduction interlayer (110), and part of the heat conduction surface of the first temperature energy body (101) is combined with the interface heat conductor (103); - part of the heat conduction surface of the relay heat conductor (102) is supplied A warm energy body (101) is combined, and a part of the heat conduction surface of the relay heat conductor (102) is combined with the heat conduction interlayer (110), and a part of the heat conduction surface of the relay heat conductor (102) is used for bonding with the interface heat conductor (103). A part of the heat conduction surface of the heat conduction interlayer (110) is combined with the first temperature energy body (101), and a part of the heat conduction surface of the heat conduction interlayer (110) is combined with the relay heat conductor (102), and the heat conduction interlayer (110) Part of the heat conduction surface is to be combined with the interface heat conductor (103); ─ part of the heat conduction surface of the interface heat conductor (103) is combined with the first temperature energy body (101); part of the heat conduction surface of the interface heat conductor (103) is provided Relay thermal conductor (102) junction a portion of the heat conducting surface of the interface heat conductor (103) is coupled to the heat conducting interlayer (110); a portion of the heat conducting surface of the interface heat conductor (103) is coupled to the second warm energy body (104); The conduction area and thickness of the bonding surface and the original composite bonding surface and the thermal characteristics of the thermal conductive material may be selected according to the temperature heat flow distribution and application conditions; the first warm energy body (101) may be a heat source or a heat absorbing body; The warm energy body (104) can be a heat absorbing body or a heat source.

Fig. 8 is a fifth schematic view showing the structure of the intermediate portion of the multi-layer structure of the present invention in which the cross-layer is combined for heat conduction.

In Figure 8, the structural features of the cross-layer bonding are as follows: - part of the heat conduction surface of the first warm energy body (101) is combined with the relay heat conductor (102), and part of the first warm energy body (101) The heat conduction surface is provided for bonding with the interface heat conductor (103); the part of the heat conduction surface of the relay heat conductor (102) is combined with the first warm energy body (101), and the heat conduction of the partial relay heat conductor (102) The surface is combined with the thermal conductive interlayer (110), and the heat conducting surface of the first first warm energy body (101) is provided for bonding with the interface thermal conductor (103); the heat conducting surface of the thermal conductive interlayer (110) is provided for relay heat conduction. The body (102) is bonded, and the heat conduction surface of the partial heat conduction interlayer (110) is combined with the interface heat conductor (103); the partial heat conduction surface of the interface heat conductor (103) is combined with the first temperature energy body (101). And a portion of the interface heat conductor (103) heat conduction surface for bonding with the relay heat conductor (102); and a portion of the interface heat conductor (103) heat conduction surface for bonding with the heat conduction interlayer (110); and the interface heat conductor (103) Part of the heat conduction surface is coupled to the second warm energy body (104); the first warm energy body (101) may be a heat source or an endothermic ; A second thermal energy body (104) may be a heat-absorbing body or a heat source.

Fig. 9 is a view showing the structure of the intermediate structure of the multi-layer structure of the present invention in a cross-layer combination for heat conduction.

In Figure 9, the structural features of the cross-layer bonding are as follows: - part of the heat conduction surface of the first warm energy body (101) is combined with the relay heat conductor (102), and part of the first warm energy body (101) The heat conducting surface is provided for bonding with the interface heat conductor (103); the part of the heat conducting surface of the relay heat conductor (102) is combined with the first warm energy body (101), and the part of the first warm energy body (101) The heat conducting surface is combined with the heat conducting interlayer (110), and the heat conducting surface of the portion of the first warm energy body (101) is provided for bonding with the interface heat conductor (103); the heat conducting surface of the heat conducting interlayer (110) is provided for the first The thermal energy body (101) is combined, and the heat conduction surface of the partial thermal conduction interlayer (110) is combined with the relay thermal conductor (102), and the thermal conduction surface of the partial thermal conduction interlayer (110) is provided for bonding with the interface thermal conductor (103); ─ a part of the heat conduction surface of the interface heat conductor (103) is combined with the first warm energy body (101); and a heat conduction surface of the partial interface heat conductor (103) is combined with the relay heat conductor (102); and part of the interface heat conduction The heat conducting surface of the body (103) is combined with the heat conducting interlayer (110); and the heat conducting surface of the interface heat conductor (103) Coupled with the second warm energy body (104); ─ the conduction area and thickness of the cross-layer joint surface and the original multi-layer joint surface of each layer and the thermal characteristics of the heat conductive material can be selected according to the temperature heat flow distribution and application conditions. The first warm energy body (101) may be a heat source or a heat absorbing body; and the second warm energy body (104) may be a heat absorbing body or a heat source.

3 to 9 above are application examples. If the thermal conductive interlayer (110) is one or more layers, the principle of cross-layer bonding can be analogized.

This cross-structure thermal conductivity device with different thermal characteristics, regardless of the stacking The application of the layer structure, or the further application of the cross-layer combination between the layers, can be made into various geometric shapes depending on the conditions of use.

The cross-structure thermal conduction device with different thermal characteristics, in addition to the heat dissipation or refrigeration application, can be applied as a cookware or boiler or a cross-layer combination of specific structures between the cross-structure and the multi-layer structure. Various applications such as water heaters that are heated by external heat sources are described below:

FIG. 10 is a schematic view showing the main structure of the cross-layer composite structure of the cross-layer structure of the present invention as a flat-bottomed cookware.

In Fig. 10, the main components thereof include: - a first warm energy body (101): a source for providing heat energy by means of conduction and/or convection and/or radiation, including various combustion flame heat source devices, or An electrothermal heat source device, or a heat source device generated by an electromagnetic effect or a microwave effect heating body (or when the interface heat conductor (103) is composed of an electromagnetic effect or a microwave effect heating material, the interface heat conductor (103) The heat source device directly generates heat energy, or the heat source device indirectly transmitted by the warm heat fluid, or the heat source of the solar heat source or other natural heat energy, for simultaneously heating the interface heat conductor (103) and the relay heat conductor (102), so as to enable The thermal energy transfers thermal energy to the heated second warm energy body (104) via the interface thermal conductor (103), and simultaneously heats the relay thermal conductor (102), and the thermal energy is diffused and transmitted to the interface by the relay thermal conductor (102). The heat conductor (103) is not in direct contact with the first warm energy body (101) to transmit thermal energy to the heated second warm energy body (104); - the relay heat conductor (102): for heat conduction The coefficient is relatively better than the material of the bonded interface thermal conductor (103) including gold and silver. a metal having a better thermal conductivity such as copper or aluminum, which is interposed between the interface heat conductor (103) and the portion not directly in contact with the first warm energy body (101) for acceptance by the interface heat conductor (103) The thermal energy from the first warm energy body (101) is re-diffused and transmitted to a portion of the interface heat conductor (103) that is not in direct contact with the first warm energy body (101); -- Interface thermal conductor (103): The interface thermal conductor (103) is for receiving the thermal energy of the first warm energy body (101) for transmission to the second warm energy body (104), and the interface thermal conductor (103) is suitable for The material in contact with the second warm energy body (104) comprises aluminum, iron, cast iron, stainless steel, ceramics, stone, gold, etc., for use as a flat bottom cookware structure for receiving from the first warm energy body ( 101) thermal energy is an interface thermal conductor (103) that transmits thermal energy to the second warm energy body (104), and the interface thermal conductor (103) is adapted to receive thermal energy directly transmitted from the first warm energy body (101), and The portion that is not in direct contact with the first warm energy body (101) and is in contact with the relay heat conductor (102) receives thermal energy diffused from the relay heat conductor (102), and the thermal energy of the relay heat conductor (102) is From the portion in contact with the first warm energy body (101); the flat bottom cookware includes a coverless or coverable cover (111); and the device is used to neutralize the liquid state in which the interface thermal conductor (103) is heated and/or The solid state and/or gaseous second warm energy body (104) transmits heat energy.

Figure 11 is a schematic view showing the main structure of the cross-layer composite structure of the cross-layer structure of the present invention as a round bottom cooker.

In Fig. 11, the main composition comprises: - a first warm energy body (101): a source for providing heat energy by means of conduction and / or convection and / or radiation, including various combustion flame heat source devices, or An electrothermal heat source device, or a heat source device generated by an electromagnetic effect or a microwave effect heating body (or when the interface heat conductor (103) is composed of an electromagnetic effect or a microwave effect heating material, the interface heat conductor (103) The heat source device directly generates heat energy, or the heat source device indirectly transmitted by the warm heat fluid, or the heat source of the solar heat source or other natural heat energy, for simultaneously heating the interface heat conductor (103) and the relay heat conductor (102), so as to enable The thermal energy transfers thermal energy to the heated second warm energy body (104) via the interface thermal conductor (103), and simultaneously heats the relay thermal conductor (102), and the thermal energy is diffused and transmitted to the interface by the relay thermal conductor (102). The heat conductor (103) is not in direct contact with the first warm energy body (101) to transmit heat The second thermal energy body (104) can be heated; -- the relay thermal conductor (102): the material whose thermal conductivity is relatively better than the bonded interface thermal conductor (103) includes gold, silver, copper, aluminum And a metal having a better thermal conductivity, which is disposed on a portion of the interface heat conductor (103) that is not directly in contact with the first warm energy body (101), for receiving the interface heat conductor (103) from the first temperature The thermal energy of the energy body (101) is diffused and transmitted to the portion of the interface heat conductor (103) that is not in direct contact with the first warm energy body (101); -- the interface heat conductor (103): the interface heat conductor (103) In order to receive the thermal energy of the first warm energy body (101) for transmission to the second warm energy body (104), the interface thermal conductor (103) is made of a material suitable for contact with the second warm energy body (104), including aluminum. , iron, cast iron, stainless steel, ceramics, stone, gold, etc., for use as a round bottom cookware structure for receiving thermal energy from the first warm energy body (101) to the second warm energy body (104) An interface thermal conductor (103) for transmitting thermal energy, the interface thermal conductor (103) is for receiving thermal energy directly transmitted from the first warm energy body (101), and by not being coupled with the first warm energy The portion of the body (101) that is in direct contact with the relay heat conductor (102) receives thermal energy diffused from the relay heat conductor (102), and the thermal energy of the relay heat conductor (102) is derived from the first temperature energy. The portion of the body (101) that is in contact; the round bottom cookware includes a coverless or coverable cover (111); and the second temperature of the solid or liquid or gaseous state in which the interface thermal conductor (103) is heated by the above device The energy body (104) transmits heat energy.

Figure 12 is a schematic view showing the main structure of the cross-layer combination of the cross-structured structures of the present invention as a boiler device.

In Fig. 12, the main components thereof include: - a first warm energy body (101): a source for providing heat energy by means of conduction and/or convection and/or radiation, including various combustion flame heat source devices, or An electrothermal heat source device, or a heat source device generated by an electromagnetic effect or a microwave effect heating body (or The interface heat conductor (103) is a heat source device or a solar heat source or other natural energy that is formed by an electromagnetic effect or a microwave effect heating material, directly generates heat energy at the interface heat conductor (103), or indirectly transmitted by a warm heat fluid. The heat source of heat energy is configured to simultaneously heat the interface heat conductor (103) and the relay heat conductor (102), so that the heat energy transfers heat energy to the heated second temperature body (104) via the interface heat conductor (103), And simultaneously heating the relay heat conductor (102), and transferring the thermal energy to the portion of the interface heat conductor (103) that is not in direct contact with the first warm energy body (101) by the relay heat conductor (102) to transmit thermal energy. To the heated second warm energy body (104); -- the relay heat conductor (102): the material whose thermal conductivity is relatively better than the bonded interface thermal conductor (103) includes gold, silver, copper, aluminum, etc. The metal having better thermal conductivity is disposed on a portion of the interface heat conductor (103) that is not directly in contact with the first warm energy body (101) for receiving the interface thermal conductor (103) from the first temperature energy. The thermal energy of the body (101) is re-diffused and transmitted to the interface heat conductor (103) without being directly connected to the first warm energy body (101) Part of the contact; --- Interface thermal conductor (103): The interface thermal conductor (103) is for receiving the thermal energy of the first warm energy body (101) for transmission to the second warm energy body (104), the interface thermal body (103) The material suitable for being in contact with the second warm energy body (104) comprises aluminum, iron, cast iron, stainless steel, ceramics, stone, gold, etc., for use as a boiler device (112) structure, An interface thermal conductor (103) that receives thermal energy from the first warm energy body (101) to transfer thermal energy to the inner second warm energy body (104), and the interface thermal heat conductor (103) is adapted to receive from the first warm energy body (101) directly transmitting thermal energy, and receiving part of the contact with the relay heat conductor (102) by direct contact with the first warm energy body (101), receiving heat energy diffused from the relay heat conductor (102), and The thermal energy of the relay heat conductor (102) is from the portion in contact with the first warm energy body (101); the fluid inlet and outlet interface device (113) of the boiler device: the fluid inlet and outlet disposed in the boiler device (112) a fluid inlet and outlet interface device such as a pipeline and/or a control valve; The above boiler device (112) comprises a closed or semi-closed external combustion type industrial heat pump or steam boiler which is heated by combustion heat energy or electrothermal heat energy or solar heat energy, a boiler of an external combustion type power machine such as a steam engine, and a steam boiler. Forest engine boilers, solar thermal boilers, solar water heaters, solar-heated stoves or pots such as teapots or coffee makers, or boilers or water heaters or heaters that burn heavy oil heating systems, or electric heaters or Burning gas-heated water heaters such as gas alcohol or coal or firewood, or stoves or pots such as teapots or coffee makers that can be covered.

FIG. 13 is a schematic diagram showing the main structure of the cross-layer combination of the cross-structured structures of the present invention as a teapot device.

FIG. 14 is a schematic view showing the main structure of the cross-layer composite structure of the cross structure of the present invention as a main structure of the hot pot.

The device transmits heat energy to a second warm energy body (104) placed in a solid or liquid or gaseous state in which the interface heat conductor (103) is heated.

The cross-structure thermal conduction device with different thermal characteristics can be applied to the application structure of the cross-layered package between the cross-structured multi-layer structure as a deep-bottom cookware;

Fig. 15 is a schematic view showing the principle of a cross-layer and a sandwich for heat conduction combined structure between the cross-structured structures of the cross-structure of the present invention.

In Fig. 15, the main components include: - a first warm energy body (101): a source for providing heat energy by means of conduction and / or convection and / or radiation, including various combustion flame heat source devices, or electric heating a heat source device, or a heat source device generated by an electromagnetic effect or a microwave effect heating body (or when the interface heat conductor (103) is composed of an electromagnetic effect or a microwave heat generating material, directly generates heat energy at the interface heat conductor (103) Or a heat source device indirectly transmitted by a warm fluid, or a solar heat source, or a heat source of other natural heat, for heating the interface heat conductor (103) so that the heat energy is transferred from the interface heat conductor (103) to the heat Heating The second warm energy body (104), and the relay heat conductor (102) interposed by the interface heat conductor (103) transmits thermal energy, and then transfers the heat energy to the interface heat conductor (103) without the first warm energy. The body (101) is in direct contact with the portion to transmit thermal energy to the heated second warm energy body (104); -- the relay heat conductor (102): is relatively superior in heat transfer coefficient to the bonded interface thermal conductor (103) The material comprises a metal having better thermal conductivity such as gold, silver, copper or aluminum, and is disposed on a portion of the interface heat conductor (103) that is not directly in contact with the first warm energy body (101) for the interface. The heat conductor (103) receives the thermal energy from the first warm energy body (101), and then diffuses and transmits to the portion of the interface heat conductor (103) that is not in direct contact with the first warm energy body (101); --- interface heat conduction Body (103): the interface heat conductor (103) is for receiving the thermal energy of the first warm energy body (101) for transmission to the second warm energy body (104), and the interface heat conductor (103) is suitable for the second temperature The material contacting the body (104) includes aluminum, iron, cast iron, stainless steel, ceramics, stone, gold, etc., and is accepted for direct transmission from the first warm energy body (101). The heat energy, and the portion that is in direct contact with the first heat energy body (101) and is in contact with the relay heat conductor (102), receives heat energy diffused from the relay heat conductor (102), and relays the heat conductor ( 102) the thermal energy is from the portion of the interface thermal conductor (103) that is in direct contact with the first warm energy body (101); by means of the above device, the liquid and/or solid state and/or solid state in which the interface thermal conductor (103) is heated Or the second warm energy body (104) of the gaseous state transmits heat energy.

Fig. 16 is a schematic view showing the application structure of a cross-layered sandwich between the cross-structured multi-layer structures of the present invention as a deep-bottomed cookware.

In Fig. 16, the main components include: - a first warm energy body (101): a source for providing heat energy by means of conduction and/or convection and/or radiation, including various combustion flame heat source devices, or electrothermal Heat source device, or heat source device generated by electromagnetic effect or microwave effect heating body (or The surface heat conductor (103) is a heat source device or a solar heat source or other natural heat energy which is formed by an electromagnetic effect or a microwave heat generating material, directly generates heat energy at the interface heat conductor (103), or indirectly transmitted by a warm heat fluid. The heat source is configured to heat the interface heat conductor (103) such that the heat energy is transferred from the interface heat conductor (103) to the heated second body (104), and the interface heat conductor (103) is itself The interposed relay heat conductor (102) transmits thermal energy, and then diffuses the thermal energy to a portion of the interface thermal conductor (103) that is not in direct contact with the first warm energy body (101) to transmit thermal energy to the second temperature to be heated. The energy conductor (104); -- the relay heat conductor (102): is composed of a metal having a thermal conductivity better than that of the bonded interface heat conductor (103), such as gold, silver, copper, aluminum, etc. a portion of the interface heat conductor (103) that is not directly in contact with the first warm energy body (101) for receiving the thermal energy from the first warm energy body (101) by the interface heat conductor (103), Re-diffusion transmission to the portion of the interface heat conductor (103) that is not in direct contact with the first warm energy body (101) ;-- Interface thermal conductor (103): The interface thermal conductor (103) is for receiving the thermal energy of the first warm energy body (101) for transmission to the second warm energy body (104), and the interface thermal conductor (103) is suitable for The material for contacting the second warm energy body (104) comprises aluminum, iron, cast iron, stainless steel, ceramics, stone, gold, etc., for use as a deep bottom cookware structure for receiving from the first warm energy. The thermal energy of the body (101) is an interface thermal conductor (103) for transmitting thermal energy to the second warm energy body (104), and the interface thermal conductor (103) is for receiving thermal energy directly transmitted from the first warm energy body (101). And a portion that is in contact with the relay heat conductor (102) by direct contact with the first warm energy body (101), receives heat energy diffused from the relay heat conductor (102), and relays the heat conductor (102) The thermal energy is a portion directly contacting the interface thermal conductor (103) and the first warm energy body (101); the deep bottom cookware includes a coverless or coverable cover (111); and the device is placed opposite to the interface thermal conductor (103) heated liquid and / or solid The second and/or gaseous second warm energy body (104) transmits heat energy.

Fig. 17 is a schematic view showing the application structure of a cross-layered sandwich between the cross-structured structures of the present invention as a bowl-shaped cookware.

In Fig. 17, the main components include: - a first warm energy body (101): a source for supplying heat by means of conduction and / or convection and / or radiation, including various combustion flame heat source devices, or electric heating a heat source device, or a heat source device generated by an electromagnetic effect or a microwave effect heating body (or when the interface heat conductor (103) is composed of an electromagnetic effect or a microwave heat generating material, directly generates heat energy at the interface heat conductor (103) Or a heat source device indirectly transmitted by a warm fluid, or a solar heat source, or a heat source of other natural heat, for heating the interface heat conductor (103) so that the heat energy is transferred from the interface heat conductor (103) to the heat The heated second warm energy body (104) and the relay heat conductor (102) interposed by the interface heat conductor (103) transmit heat energy, and then transfer the heat energy to the interface heat conductor (103). a portion of the warm energy body (101) that directly contacts the heat energy to the second warm energy body (104) that is heated; -- the relay heat conductor (102): heat conduction coefficient is relatively better than that of the bonded interface The material of the body (103) includes gold, silver, copper, aluminum, etc. Preferably, the metal is sandwiched between the interface thermal conductor (103) and the portion not directly contacting the first warm energy body (101) for receiving the interface thermal conductor (103) from the first warm energy body. (101) The thermal energy is re-diffused and transmitted to the portion of the interface thermal conductor (103) that is not in direct contact with the first warm energy body (101); -- the interface thermal conductor (103): the interface thermal conductor (103) is for Receiving thermal energy of the first warm energy body (101) for transmission to the second warm energy body (104), the interface thermal heat conductor (103) being made of a material suitable for contact with the second warm energy body (104), including aluminum, iron , cast iron, stainless steel, ceramics, stone, gold, etc., for use as a bowl-shaped cookware structure for receiving thermal energy from the first warm energy body (101) to the second warm energy body (104) An interface thermal conductor (103) for transmitting thermal energy, the interface thermal conductor (103) is for receiving thermal energy directly transmitted from the first warm energy body (101), and is not in direct contact with the first warm energy body (101) The portion of the relay heat conductor (102) that contacts the thermal energy diffused from the relay heat conductor (102), and the thermal energy of the relay heat conductor (102) is from the interface heat conductor (103) and the first warm energy body ( 101) a person who is in direct contact; the above-mentioned bowl-shaped cookware comprises a coverless or coverable cover (111); by means of the above device, the liquid heat and/or solid and/or gaseous state which is heated to the interface heat conductor (103) The second warm energy body (104) transmits heat energy.

FIG. 18 is a schematic view showing the application structure of a cross-layered package between the cross-structured multi-layer structures of the present invention as a boiler device.

In Fig. 18, the main components include: - a first warm energy body (101): a source for providing heat energy by means of conduction and/or convection and/or radiation, including various combustion flame heat source devices, or electrothermal a heat source device, or a heat source device generated by an electromagnetic effect or a microwave effect heating body (or when the interface heat conductor (103) is composed of an electromagnetic effect or a microwave heat generating material, directly generates heat energy at the interface heat conductor (103) Or a heat source device indirectly transmitted by a warm fluid, or a solar heat source, or a heat source of other natural heat, for heating the interface heat conductor (103) so that the heat energy is transferred from the interface heat conductor (103) to the heat The heated second warm energy body (104) and the relay heat conductor (102) interposed by the interface heat conductor (103) transmit heat energy, and then transfer the heat energy to the interface heat conductor (103). a portion of the warm energy body (101) that directly contacts the heat energy to the second warm energy body (104) that is heated; -- the relay heat conductor (102): heat conduction coefficient is relatively better than that of the bonded interface The material of the body (103) includes gold, silver, copper, aluminum, etc. Preferably, the metal is sandwiched between the interface thermal conductor (103) and the portion not directly contacting the first warm energy body (101) for receiving the interface thermal conductor (103) from the first warm energy body. (101) heat Energy, re-diffusion transmission to the portion of the interface thermal conductor (103) that is not in direct contact with the first warm energy body (101); -- interface thermal conductor (103): interface thermal conductor (103) for accepting the first temperature The thermal energy of the energy body (101) is transmitted to the second warm energy body (104), and the interface thermal heat conductor (103) is made of a material suitable for contact with the second warm energy body (104), including aluminum, iron, cast iron, stainless steel. , ceramic, stone, gold, etc., for use as a boiler device (112) structure for receiving thermal energy from the first warm energy body (101) to transfer thermal energy to the inner second warm energy body (104) The interface heat conductor (103), the interface heat conductor (103) is for receiving thermal energy directly transmitted from the first warm energy body (101), and is not directly contacted with the first warm energy body (101) and relayed The portion of the heat conductor (102) that contacts the thermal energy diffused from the relay heat conductor (102), and the thermal energy of the relay heat conductor (102) is from the interface heat conductor (103) and the first warm energy body (101) Part of the direct contact; - the fluid inlet and outlet interface device (113) of the boiler device: a fluid inlet and outlet pipe and/or a control valve disposed in the boiler device (112) The fluid inlet and outlet interface device; the boiler device (112) comprises a closed or semi-closed external combustion type industrial heat pump or steam boiler or an external combustion type power machine, which is heated by combustion heat energy or electric heat energy or solar heat energy. Steam boilers, Stirling engine boilers, solar thermal boilers, solar water heaters, solar heated stoves or pots such as teapots or coffee makers, or boilers or water heaters that burn heavy oil heating systems or Heating stoves, or electric heating or burning gas alcohol or coal or firewood, such as heat-heating water heaters, or stoves or pots such as teapots or coffee makers.

FIG. 19 is a schematic view showing the application structure of the cross-layered package between the cross-structured multi-layer structures of the present invention as a teapot device.

FIG. 20 is a schematic view showing the application structure of a cross-layered package between the cross-structured multi-layer structures of the present invention as a hot pot.

By means of the above device, the liquid and/or solid state in which the interface heat conductor (103) is heated and / or the second warm body (104) in the gaseous state transmits heat.

The relay heat conductor (102) described in the above embodiments of FIGS. 10 to 20 further includes the following specific structure, and is configured as follows: - a relay heat conductor (102): a circular ring structure, or a triangle a ring structure, or a square ring structure or a more surface ring structure for bonding to the bottom of the interface heat conductor (103) to the position of the first warm energy body (101), and to the first warm energy body The heating surface of (101) is a ring-shaped hole whose taper shape is gradually reduced toward the heat receiving surface of the interface heat conductor (103), and the relay heat conductor (102) has a radially enlarged annular structure, and the thickness is further away from the center of the circle. Thin is characteristic.

The cross-structure thermal conduction device with different thermal characteristics and/or the cross-layer and the sandwich between the cross-structure and the multi-layer structure are used as a heat conduction combined structure, wherein the solid body is the first warm energy body (101), Between the relay thermal conductor (102), the interface thermal conductor (103), the second solid body (104) in the solid state, and/or between the thermally conductive interlayer (110), the heat transfer characteristics required by the multi-layer structure may be The thermally conductive material of the gradation structure constitutes a thermal energy conducting structure or a heat dissipating structure assembly, and if all or part of the heat conducting bodies constituting the thermoelectric conducting structure or the heat dissipating structure assembly are solid bodies, Then, the bonding manner between the adjacent two heat conductors is combined by one or more of the following methods, including: 1. screwing with a screw nut; and/or 2. screwing the spiral column and the spiral hole structure And/or 3. the spiral column and the spiral hole structure are mutually screwed together for pre-force clamping; and/or 4. riveting; and/or 5. pressing; and/or 6. fixing the clamping; And/or 7. bonding; and/or 8. welding; and/or 9. Casting; and/or 10. Clamping; and/or 11. Fitting; and/or 12. Powder metallurgy sintering; and/or 13. Friction welding; and/or 14. Adjacent thermal conductors And/or 15. the adjacent heat conductor is formed by plating; and/or 16. a heat conducting structure having a fixed fit or a conformable movement between the adjacent heat conductor and the other heat conductor And/or 17. the adjacent heat conductors are brought together by gravity; and/or 18. the adjacent heat conductor is abutting by the attraction of the magnet device; and/or 19. adjacent The heat conductor is combined in a cladding structure.

The cross-structure thermal conductivity device having different thermal characteristics between the first warm energy body (101) and the relay heat conductor (102); or between the relay heat conductor (102) and the interface heat conductor (103); Or between the interface thermal conductor (103) and the second warm energy body (104); or between the relay thermal conductor (102) and the thermal conductive interlayer (110) when the thermal conductive interlayer (110) is disposed; or When the thermal conductive interlayer (110) is between the thermal conductive interlayer (110) and the thermal conductive interlayer (110); or between the thermal conductive interlayer (110) and the interface thermal conductor (103), one or more of the following may be selected as needed Auxiliary for thermal energy transmission: including: 1. Set insulating thermal conductive sheet; or 2. Apply thermal grease; or 3. Set insulating thermal conductive sheet and apply thermal grease.

The cross-structure thermal conduction device with different thermal characteristics can be applied to various heat-transfer or heat-dissipating or cooling heat conduction application devices, such as heat absorption or heat dissipation of various casings, heat absorption or heat dissipation of various structural shells, and various semiconductor components. Heat absorption or heat dissipation by heat or heat, various ventilation devices, or information devices, or audio or imaging devices It can transmit heat, heat dissipation of various lamps or light-emitting diodes (LED), heat absorption or heat dissipation or temperature transmission of air conditioners, heat absorption or heat dissipation of heat of motor or engine, or heat transfer of mechanical devices. Heat-dissipating, or burning flame or electric heating or solar heating heaters or other household appliances or combustion flames or electric or solar energy cookers for heat release or warm energy transmission, or combustion of flame or electric energy or solar heating including boilers, external combustion power machines Endothermic or warm energy transfer of boilers, Stirling engine boilers or household stoves or cookware or water heaters, or heat or heat or heat transfer of formation or water temperature, plant or building construction or building materials or building structures Heat absorption or heat dissipation or heat transfer of the device, heat absorption or heat dissipation of the water tower, heat absorption or heat dissipation or temperature transfer of the battery or fuel cell; or application to home appliances, industrial products, electronic products, motors or mechanical devices, power generation equipment, A warm energy transmission application in building, air conditioning, production equipment or industrial processes.

101‧‧‧First warm energy body

102‧‧‧ Relay thermal conductor

103‧‧‧Interfacial thermal conductor

104‧‧‧Second warm energy body

110‧‧‧ Thermal interlayer

111‧‧‧ can cover

112‧‧‧Boiler installation

113‧‧‧Fluid inlet and outlet device for boiler installation

FIG. 1 is a schematic diagram showing the structure principle of a prior art three-layer type by layer.

2 is a schematic view showing the structure of the thermal conductive interlayer (110) between the interface thermal conductor (103) and the relay thermal conductor (102) in the prior art FIG.

Fig. 3 is a schematic view showing the structure of a portion of the multi-layer structure of the present invention which is cross-layered for heat conduction.

Fig. 4 is a schematic view showing the structure of a part of the multi-layer structure of the present invention which is cross-layered for heat conduction.

Fig. 5 is a schematic view showing the structure of a portion of the multi-layer structure of the present invention which is cross-layered for heat conduction.

Fig. 6 is a third schematic view showing the structure of the intermediate portion of the multi-layer structure of the present invention in which the cross-layer is combined for heat conduction.

Fig. 7 is a fourth schematic view showing the structure of the intermediate portion of the multi-layer structure of the present invention in which the cross-layer is combined for heat conduction.

Fig. 8 is a fifth schematic view showing the structure of the intermediate portion of the multi-layer structure of the present invention in which the cross-layer is combined for heat conduction.

Fig. 9 is a view showing the structure of the intermediate structure of the multi-layer structure of the present invention in a cross-layer combination for heat conduction.

FIG. 10 is a schematic view showing the main structure of the cross-layer composite structure of the cross-layer structure of the present invention as a flat-bottomed cookware.

Figure 11 is a schematic view showing the main structure of the cross-layer composite structure of the cross-layer structure of the present invention as a round bottom cooker.

Figure 12 is a schematic view showing the main structure of the cross-layer combination of the cross-structured structures of the present invention as a boiler device.

Figure 13 is a schematic view showing the main structure of the cross-layer combination of the cross-structured structure of the present invention as a teapot device.

Fig. 14 is a schematic view showing the main structure of the cross-layer composite structure of the cross structure of the present invention as a main structure of the hot pot.

Fig. 15 is a schematic view showing the principle of a cross-layer and a sandwich for heat conduction combined structure between the cross-structured structures of the cross-structure of the present invention.

Fig. 16 is a schematic view showing the application structure of a cross-layered package between the complex cross-structures of the present invention as a deep-bottomed cookware.

Fig. 17 is a schematic view showing the application structure of a cross-layered sandwich between the cross-structured structures of the present invention as a bowl-shaped cookware.

FIG. 18 is a schematic view showing the application structure of a cross-layered package between the cross-structured multi-layer structures of the present invention as a boiler device.

FIG. 19 is a schematic view showing the application structure of a cross-layered package between the cross-structured multi-layer structures of the present invention as a teapot device.

FIG. 20 is a schematic view showing the application structure of a cross-layered package between the cross-structured multi-layer structures of the present invention as a hot pot.

101‧‧‧First warm energy body

102‧‧‧ Relay thermal conductor

103‧‧‧Interfacial thermal conductor

104‧‧‧Second warm energy body

111‧‧‧ can cover

Claims (9)

A cross-structure thermal conduction device having different thermal characteristics, comprising a plurality of multi-layered cross-laminated conductors having different thermal conductivity characteristics, comprising: a relay thermal conductor (102) having a first surface in contact with the first thermal energy body (101) And thermal coupling; an interface heat conductor (103) is located between the relay heat conductor (102) and the second warm energy body (104), and the second warm energy body (104) is only in contact with the interface heat conductor (103), and Not contacting the relay heat conductor (102), the interface heat conductor (103) has a first surface in contact with and a second thermal energy body (104), and the first warm energy body (101) and the second warm energy body When there is a temperature difference between (104), the relay heat conductor (102) and the interface heat conductor (103) conduct heat conduction between the first warm energy body (101) and the second warm energy body (104), and the interface heat conductor ( 103) having one of the following thermal characteristics: (1) the unit heat capacity value is higher than the relay heat conductor (102), and (2) the heat transfer coefficient of the second warm energy body (104) is higher than the relay heat conductor ( 102) a heat transfer coefficient to the second warm energy body (104), and (3) a higher thermal radiation coefficient to the second warm energy body relative to the relay thermal conductor (102), wherein the interface thermal conductor (103) ) has a second side, As the first surface of the relay heat conductor (102) is in contact with and thermally coupled to the first warm energy body (101), wherein the first warm energy body (101) may be a heat absorbing body or a heat source, and the second warm energy body (104) The thermal conductivity of the thermal conductivity of the composite thermal conductivity structure may also be determined by the heat absorbing body or the heat source, and the relative thermal contact between the relay heat conductor (102), the interface thermal conductor (103), and the first and second warm energy bodies; The heat conduction surface portion of the first warm energy body (101) is combined with the relay heat conductor (102), and partially combined with the interface heat conductor (103); wherein the heat conduction surface of the relay heat conductor (102) is provided The first warm energy body (101) is partially combined, and is combined with the interface heat conductor (103) portion, and the interface heat conductor (103) includes a central portion. The extension extends to contact the first warm energy body (101) via the relay heat conductor (102), wherein the first warm energy body (101) is an external heat source, and the relay heat conductor (102) therein is thermally conductive than the interface. The metal of the body (103) is interposed between the first warm energy body (101) and the portion of the interface heat conductor (103) that is not directly in direct contact with the first warm energy body (101), so as to be The relay heat conductor (102) receives thermal energy from the first warm energy body (101) to diffuse the interface heat conductor (103). The cross-structure thermal conduction device with different thermal characteristics as described in claim 1, wherein the thermal conduction structure is one of the following: a structure of a device that absorbs heat, dissipates heat, or cools: a casing; a heat pipe structure; a structure Housing; semiconductor component; ventilation device; information device; audio or imaging device; lamp or light emitting diode (LED) device; air conditioning device; motor or engine; mechanical device for generating friction heat loss; electric heater; Or cooking utensils; furnaces for heating flames; buildings with warm energy; buildings, building buildings, or building materials, or building structures; water towers; and batteries or fuel cells. The cross-structure thermal conduction device with different thermal characteristics as described in claim 1 of the patent application, wherein the thermal conductivity structure can be applied to a flat bottom or round bottom cookware without a cover or a cover. The cross-structure thermal conduction device having different thermal characteristics as described in claim 1 wherein the relay thermal conductor (102) is made of gold, silver, copper, or aluminum. The cross-structure thermal conduction device with different thermal characteristics, as described in claim 1, wherein the interface thermal conductor (103) is made of aluminum, iron, cast iron, stainless steel, ceramic, stone, or gold. The cross-structure thermal conduction device with different thermal characteristics as described in claim 1 wherein the thermal conductivity structure can be applied to a fluid inlet and outlet interface device of a boiler, wherein the boiler is a closed or semi-closed device. A cross-structure thermal conductivity device having different thermal characteristics as described in claim 1, wherein the interface thermal conductor (103) comprises a liquid, a solid, or a gas for transferring thermal energy to the second warm energy body (104). The cross-structure thermal conduction device with different thermal characteristics as described in claim 1, wherein the relay thermal conductor (102) comprises a ring structure, facing the first warm energy body (101) and welcoming the interface The aperture between the faces of the heat conductor (103) is gradually reduced, and the further the relay heat conductor (102) is thinner from the hole. The thermal conduction device with different thermal characteristics and cross-structure as described in claim 1 wherein the combination of the thermal conductors comprises one of the following structures, including: (1) a screw nut; (2) The spiral column and the spiral hole structure are mutually screwed together; (3) the spiral column and the spiral hole structure are mutually screwed together for pre-force clamping; (4) the riveting structure; (5) the pressing structure; (6) (7) bonded structure; (8) welded structure; (9) cast structure; (10) sandwich structure; (11) fitting structure; (12) powder metallurgy structure; 13). Friction-dissolving structure; (14) adjacent heat-conducting body casting; (15) plating structure; (16) fixed-fitting or conformable moving structure; (17) structure by gravity; (18) Magnetic structure; and (19) cladding structure.