US20090308584A1

US20090308584A1 - Thermal conduction principle and device of the multi-layers structure with different thermal characteristics

Info

Publication number: US20090308584A1
Application number: US12/155,966
Authority: US
Inventors: Tai-Her Yang
Original assignee: Individual
Current assignee: Individual
Priority date: 2008-06-12
Filing date: 2008-06-12
Publication date: 2009-12-17

Abstract

The present invention innovatively discloses a relay thermal conductor being made of material with better thermal conducting characteristics, wherein one end or face of the relay thermal conductor is thermal conductively coupled with the first thermal body for heating or cooling; while another end or face of the relay thermal conductor is thermal conductively coupled with the interface thermal conductor, wherein the interface thermal conductor having higher specific heat capacity is used as the thermal conduction carrier between the relay thermal conductor and the second thermal body.

Description

BACKGROUND OF THE INVENTION

(a) Field of the Invention
The present invention is disclosed by that at least two thermal conducting layers structure in particular embodiments are integrally constituted by at least two thermal conducting material having both or one of the thermal conductivity coefficient or specific heat capacity so as to promote the thermal transfer performance.
(b) Description of the Prior Art
The cooling or heating source of the first thermal body of the conventional thermal conducting structure constituted by a single material is usually limited by the smaller thermally conducting area of the thermally conducting device, such as that if the thermal energy of CPU heat loss or the thermal energy of power semiconductor heat loss of the computer, thermal energy of light emitting diode (LED) heat loss, or thermal energy of HVAC heat absorbing or release device is the first thermal body to be coupled with the thermal conducting structure for heat dissipating operation, while the thermal conducting structure is made of single material, and even if the heat conductivity coefficient of the single material is better, its specific heat capacity is not necessary the best, such as that if it is made of copper material being heavier and expensive and having a better heat conductivity coefficient, its specific heat capacity is lower than aluminum;
If single material of better specific heat capacity with lighter weight and lower price is adopted, such as aluminum, though it has a higher specific heat capacity a higher thermal radiation coefficient (thermal emission), its thermal conductivity coefficient is lower than that of copper material, therefore the thermal conducting effect for thermal conducting structure made of single material is more limited.

SUMMARY OF THE INVENTION

The present invention innovatively discloses a thermal conduction principle and device of the multi-layers structure with different thermal characteristics, wherein it is through the multi-layers thermal conducting structure with different thermal characteristics to be different from the conventional thermally conducting device constituted by single material, wherein the thermal conduction principle and device of the multi-layers structure with different thermal characteristics having a relay thermal conductor being made of material with better thermal conducting characteristics, one end or face of the relay thermal conductor is thermal conductively coupled with the first thermal body for heating or cooling; while another end or face of the relay thermal conductor is thermal conductively coupled with the interface thermal conductor, wherein the interface thermal conductor having both or either one of the thermal conductivity characteristics including 1) a higher specific heat capacity relative to the relay thermal conductor, or 2) a better thermal conductivity coefficient or thermal radiation coefficient (thermal emission) relative to the relay thermal conductor toward the second thermal body is used as the thermal conduction carrier between the relay thermal conductor and the second thermal body, thus is favorable for thermal conduction when there is a temperature difference between the first thermal body and the second thermal body.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic view showing the principle and structure of the invention being combined in plane shapes.

FIG. 2 is a schematic view showing that the thermal conduction coupling surface and the combined surface between the relay thermal conductor (102) and the interface thermal conductor (103) is concavely and convexly combined.

FIG. 3 is a schematic view showing that the thermal conduction coupling surface and the combined surface between the relay thermal conductor (102) and the interface thermal conductor (103) is clamped combined.

FIG. 4 is a schematic view showing that the thermal conduction coupling surface and the combined surface between the relay thermal conductor (102) and the interface thermal conductor (103) is combined by dovetail slots.

FIG. 5 is a schematic view showing that the thermal conduction coupling surface and the combined surface between the relay thermal conductor (102) and the interface thermal conductor (103) is combined by T type slots.

FIG. 6 is a schematic view showing that the thermal conduction coupling surface and the combined surface between the relay thermal conductor (102) and the interface thermal conductor (103) is combined by stud/hole fastening.

FIG. 7 is a schematic view showing that the thermal conduction coupling surface and the combined surface between the relay thermal conductor (102) and the interface thermal conductor (103) is concavely and convexly combined by multi-fins.

FIG. 8 is a schematic view showing that the thermal conduction coupling surface and the combined surface between the intermediate thermally conductive layer (110), the relay thermal conductor (102), and the interface thermal conductor (103) is combined in plane shapes.

FIG. 9 is a schematic view showing that the thermal conduction coupling surface and the combined surface between the intermediate thermally conductive layer (110), the relay thermal conductor (102), and the interface thermal conductor (103) is concavely and convexly combined.

FIG. 10 is a schematic view showing that the thermal conduction coupling surface and the combined surface between the intermediate thermally conductive layer (110), the relay thermal conductor (102), and the interface thermal conductor (103) is clamped combined.

FIG. 11 is a schematic view showing that the thermal conduction coupling surface and the combined surface between the intermediate thermally conductive layer (110), the relay thermal conductor (102), and the interface thermal conductor (103) is combined by dovetail slots.

FIG. 12 is a schematic view showing that the thermal conduction coupling surface and the combined surface between the intermediate thermally conductive layer (110), the relay thermal conductor (102), and the interface thermal conductor (103) is combined by T type slots.

FIG. 13 is a schematic view showing that the thermal conduction coupling surface and the combined surface between the intermediate thermally conductive layer (110), the relay thermal conductor (102), and the interface thermal conductor (103) is combined by stud/hole fastening.

FIG. 14 is a schematic view showing that the thermal conduction coupling surface and the combined surface between the intermediate thermally conductive layer (110), the relay thermal conductor (102), and the interface thermal conductor (103) is concavely and convexly combined by multi-fins.

FIG. 15 is a schematic view showing that the heat receiving surface of the relay thermal conductor is used to transfer heat of the neighboring combustion type heater in a cooking ware application.

DESCRIPTION OF MAIN COMPONENT SYMBOLS

100: Thermally conducting device
101: First thermal body
102: Relay thermal conductor
103: Interface thermal conductor
104: Second thermal body
110: Thermal conducting intermediate layer

Detailed Description of the Preferred Embodiments

The present invention is disclosed by utilizing the multi-layers thermal conducting structure with different thermal characteristics as the thermal conduction carrier between the first thermal body and the second thermal body in relative temperature difference, so that it is different from the conventional thermally conducting device constituted by single material, wherein the thermal conduction principle and device of the multi-layers structure with different thermal characteristics has a relay thermal conductor being made of material with better thermal conducting characteristics between at least one first thermal body to be thermal conductively coupled with the first thermal body; while the interface thermal conductor is coupled with the relay thermal conductor between the relay thermal conductor and the second thermal body, wherein the interface thermal conductor having both or either one of the thermal conductivity characteristics including 1) a higher specific heat capacity relative to the relay thermal conductor, or 2) a better thermal conductivity coefficient or thermal radiation coefficient (thermal emission) relative to the relay thermal conductor toward the second thermal body is used as the thermal conductor between the relay thermal conductor and the second thermal conductor.
The thermal conduction principle and device of the multi-layers structure with different thermal characteristics is as shown in FIG. 1, wherein FIG. 1 is a schematic view showing the principle and structure of the invention being combined in plane shapes, wherein it mainly comprises including:
The thermally conducting device (100) is constituted by at least two layers of thermal conducting material with different thermal characteristics, wherein the relay thermal conductor (102) with better thermal conductivity coefficient is coupled with the first thermal body (101), and the interface thermal conductor (103) with higher specific heat capacity is coupled between the relay thermal conductor (102) and the second thermal body (104), thereby constituting the thermally conducting device (100);
The thermally conducting device (100) is installed between the first thermal body (101) and the second thermal body (104), and the thermally conducting device (100) can be constituted including by the relay thermal conductor (102) and the interface thermal conductor (103), wherein
The first thermal body (101): It can be an active cooling or heating thermal body or a passive heat absorbing or heat release thermal body being constituted by solid, gaseous, liquid, colloidal, or powder like matters;
The relay thermal conductor (102): It is constituted by at least one layer of solid, gaseous, liquid, colloidal or powder like matters with relatively better thermal conductivity coefficients, wherein the thermal conductivity coefficient of the relay thermal conductor and the first thermal body (101) is better than the one of the interface thermal conductor (103), i.e. its thermal conducting rate is faster than the one of the interface thermal conductor (103), and the thermal conduction coupling area between the relay thermal conductor (102) and the first thermal body (101) is smaller than the thermal conduction coupling area between the relay thermal conductor (102) and the interface thermal conductor (103);
The interface thermal conductor (103): It is made of at least one layer of solid, gaseous, liquid, colloidal or powder like matters, wherein both or either one of its material thermal conductivity characteristics such as 1) the specific heat capacity, or 2) the thermal conductivity coefficient or thermal radiation coefficient (thermal emission) toward the second thermal body (104) are better than the ones of the relay thermal conductor (102), wherein it is installed between the relay thermal conductor (102) and the second thermal body (104), and the thermal conduction coupling area between the interface thermal conductor (103) and the second thermal body (104) is larger or equal to the thermal conduction coupling area between the relay thermal conductor (102) and the interface thermal conductor (103);
The second thermal body (104): It is an active cooling or heating thermal body or a passive heat absorbing or heat release thermal body being constituted by solid, gaseous, liquid, colloidal or powder like matters;
For the thermal conduction principle and device of the multi-layers structure with different thermal characteristics, the geometric shapes of the thermal conduction coupling surface between the first thermal body (101) and the relay thermal conductor (102) as well as the thermal conduction coupling surface between the interface thermal conductor (103) and the second thermal body (104) can be optionally selected as needed;
It is through above said particular structures to lower the thermal resistance between the first thermal body (101) and the second thermal body (104);
The thermal conduction principle and device of the multi-layers structure with different thermal characteristics, the corresponding relationship between the first thermal body (101), the relay thermal conductor (102), the interface thermal conductor (103), the second thermal body (104) are as following:
The thermally conducting device (100) is installed between the first thermal body (101) and the second thermal body (104);
The thermally conducting device (100) is constituted by the thermal conductor having at least two layers of material with different thermal characteristics, wherein the relay thermal conductor (102) having a better thermal conductivity coefficient relative to the one between interface thermal conductor (103) and the first thermal body (101) is coupled with the first thermal body (101), and the interface thermal conductor (103) having both or either one of its material thermal conductivity characteristics such as 1) a higher heat capacity, or 2) a thermal conductivity coefficient or thermal radiation coefficient (thermal emission) toward the second thermal body (104) are better than the ones of the relay thermal conductor (102) is coupled between the relay thermal body (102) and the second thermal body (104);
The thermal conductivity coefficient of the material constituting the relay thermal conductor (102) is better than the one of the interface thermal conductor (103);
Two or either one of the thermal conductivity characteristics such as the material specific heat capacity of the interface thermal conductor (103) or the thermal conductivity coefficient or the thermal radiation coefficient of the material constituting the interface thermal conductor (103) toward the second thermal body (104) are better than the ones of the relay thermal conductor (102);
The thermal conduction coupling area between the relay thermal conductor (102) and the interface thermal conductor (103) is larger than the thermal conduction coupling area between the relay thermal conductor (102) and the first thermal body (101) so as to reduce the thermal resistance;
The thermal conduction coupling area between the interface thermal conductor (103) and the second thermal body (104) is larger or equal to the thermal conduction coupling area between the relay thermal conductor (102) and the interface thermal conductor (103) so as to reduce the thermal resistance;
If the temperature of first thermal body (101) is higher than the one of the second thermal body (104) in the above said structure, the thermal energy of the first thermal body (101) is externally diffused to execute thermal conduction to the relay thermal conductor (102) with better thermal conductivity coefficient through the smaller thermal conducting coupling area between the first thermal body (101) and the relay thermal conductor (102); while the thermal energy is diffused to the interface thermal conductor (103) with larger specific heat capacity through the larger thermal conduction coupling area between the relay thermal conductor (102) and the interface thermal conductor (103), and the thermal energy is released by the interface thermal conductor (103) to the second thermal body (104) through the same or larger thermal conduction coupling area;
If the temperature of first thermal body (101) is lower than the one of the second thermal body (104) in the above said structure, the thermal energy of the second thermal body (104) is diffusely conducted to the interface thermal conductor (103) with larger specific heat capacity through the larger thermal conducting coupling area between the second thermal body (104) and the interface thermal conductor (103), while the thermal energy is conducted to the relay thermal conductor (102) through the smaller thermal conduction coupling area coupled with the interface thermal conductor (103) and the relay thermal conductor (102), and the thermal energy is further released to the first thermal body (101) through the smaller thermal conduction coupling area of the relay thermal conductor (102) with better thermal conductivity coefficient;
The thermal conduction principle and device of the multi-layers structure with different thermal characteristics can be further constituted by the following structures:
If at least one of the first thermal body (101), or the second thermal heater (102), or the interface thermal conductor (103), or the second thermal body (104) is made of gaseous, liquid, colloidal, or powder like matters, then a container structure can be installed for housing them, wherein the container structure can be made of a good thermal conductor or a non-thermal conductor, or made of material with better thermal conductivity coefficient to constitute the relay thermal conductor (102), or made of material with larger specific heat capacity to constitute the function of interface thermal conductor (103);
For the thermal conduction principle and device of the multi-layers structure with different thermal characteristics, the thermal conduction coupling surface and the combined surface between the relay thermal conductor (102) and the interface thermal conductor (103) can be optionally selected as needed to be constituted by one or more than one combined structures of the following, such as combined by two plane surfaces with at least one combined surface is in a round, square, rectangle, polygon, radiate star shape or other geometric shapes, concavely and convexly combined, clamped combined, combined by dovetail slots, combined by T type slots, combined by stud/hole fastening, or concavely and convexly combined by multi-fins, or combined by other conventional methods of combination etc. to enlarge the conducting area;
FIG. 2 is a schematic view showing that the thermal conduction coupling surface and the combined surface between the relay thermal conductor (102) and the interface thermal conductor (103) is concavely and convexly combined.
FIG. 3 is a schematic view showing that the thermal conduction coupling surface and the combined surface between the relay thermal conductor (102) and the interface thermal conductor (103) is clamped combined.
FIG. 4 is a schematic view showing that the thermal conduction coupling surface and the combined surface between the relay thermal conductor (102) and the interface thermal conductor (103) is combined by dovetail slots.
FIG. 5 is a schematic view showing that the thermal conduction coupling surface and the combined surface between the relay thermal conductor (102) and the interface thermal conductor (103) is combined by T type slots.
FIG. 6 is a schematic view showing that the thermal conduction coupling surface and the combined surface between the relay thermal conductor (102) and the interface thermal conductor (103) is combined by stud/hole fastening.
FIG. 7 is a schematic view showing that the thermal conduction coupling surface and the combined surface between the relay thermal conductor (102) and the interface thermal conductor (103) is concavely and convexly combined by multi-fins.
For the thermal conduction principle and device of the multi-layers structure with different thermal characteristics, when the relay thermal conductor (102) or the interface thermal conductor (103) is a multiple layers structure, the relationships between the additional intermediate thermal conducting layer (110) and the relay thermal conductor (102) as well as the interface thermal conductor (103) are as the following:
If the specific heat capacity of the intermediate thermal conducting layer (110) is larger than the one of the relay thermal conductor (102), but smaller than the one of the interface thermal conductor (103), then when the structure of multiple intermediate thermal conducting layers (110) is adopted, the specific heat capacity is smaller for the intermediate thermal conducting layer (110) which is closer to the relay thermal conductor (102) but still larger than the one of the relay thermal conductor (102);
The thermal conductivity coefficient of the intermediate thermal conducting layer (110) is better than the one of the interface thermal conductor (103), and the thermal conductivity coefficient of the relay thermal conductor (102) is better than the one of the intermediate thermal conducting layer (110); then when the structure of multiple intermediate thermal conducting layers (110) is adopted, the thermal conductivity coefficient is better for the intermediate thermal conducting layer (110) which is closer to the relay thermal conductor (102), but still slightly smaller than the one of the relay thermal conductor (102);
The thermal conduction coupling area between the relay thermal conductor (102) and the intermediate thermal conducting layer (110) is larger than the thermal conduction coupling area between the intermediate thermal conducting layer (110) and the interface thermal conductor (103), then when the structure of multiple intermediate thermal conducting layers (110) is optionally installed, its thermal conduction coupling area is larger for the intermediate layer which is closer to the interface thermal conductor (103);
If the number of above said intermediate thermal conducting layers (110) is two or more than two, then the selection of the thermal conductivity coefficient and specific unit heat capacity in the thermal characteristics as well as the selection of the thermal conduction coupling area size of the two sides of the intermediate thermal conducting layer (110) is followed a structural principal that the thermal conduction area size of each layer of a combined structure constituted in sequencing from the first thermal body (101) to the relay thermal conductor (102) to the intermediate thermally conductive layer (110) to the interface thermal conductor (103) and to the second thermal body (104) is sequentially and gradually increasing layer by layer.
For the thermal conduction principle and device of the multi-layers structure with different thermal characteristics, the thermal conduction coupling surface and the combined surface between the relay thermal conductor (102) and the intermediate thermally conductive layer (110) can be optionally selected as needed to be constituted by one or more than one combined structures of the following, such as combined by two plane surfaces with at least one combined surface is in a round, square, rectangle, polygon, radiate star shape or other geometric shapes, concavely and convexly combined, clamped combined, combined by dovetail slots, combined by T type slots, combined by stud/hole fastening, or concavely and convexly combined by multi-fins, or combined by other conventional methods of combination etc. to enlarge the conducting area;
For the thermal conduction principle and device of the multi-layers structure with different thermal characteristics, the thermal conduction coupling surface and the combined surface between the intermediate thermally conductive layer (110) and the interface thermal conductor (103) can be optionally selected as needed to be constituted by one or more than one combined structures of the following, such as combined by two plane surfaces with at least one combined surface is in a round, square, rectangle, polygon, radiate star shape or other geometric shapes, concavely and convexly combined, clamped combined, combined by dovetail slots, combined by T type slots, combined by stud/hole fastening, or concavely and convexly combined by multi-fins, or combined by other conventional methods of combination etc. to enlarge the conducting area;
FIG. 8 is a schematic view showing that the thermal conduction coupling surface and the combined surface between the intermediate thermally conductive layer (110), the relay thermal conductor (102), and the interface thermal conductor (103) is combined in plane shapes.
FIG. 9 is a schematic view showing that the thermal conduction coupling surface and the combined surface between the intermediate thermally conductive layer (110), the relay thermal conductor (102), and the interface thermal conductor (103) is concavely and convexly combined.
FIG. 10 is a schematic view showing that the thermal conduction coupling surface and the combined surface between the intermediate thermally conductive layer (110), the relay thermal conductor (102), and the interface thermal conductor (103) is clamped combined.
FIG. 11 is a schematic view showing that the thermal conduction coupling surface and the combined surface between the intermediate thermally conductive layer (110), the relay thermal conductor (102), and the interface thermal conductor (103) is combined by dovetail slots.
FIG. 12 is a schematic view showing that the thermal conduction coupling surface and the combined surface between the intermediate thermally conductive layer (110), the relay thermal conductor (102), and the interface thermal conductor (103) is combined by T type slots.
FIG. 13 is a schematic view showing that the thermal conduction coupling surface and the combined surface between the intermediate thermally conductive layer (110), the relay thermal conductor (102), and the interface thermal conductor (103) is combined by stud/hole fastening.
FIG. 14 is a schematic view showing that the thermal conduction coupling surface and the combined surface between the intermediate thermally conductive layer (110), the relay thermal conductor (102), and the interface thermal conductor (103) is concavely and convexly combined by multi-fins.
For the thermal conduction principle and device of the multi-layers structure with different thermal characteristics, if two or more than two layers of the intermediate thermally conductive layer (110) is selected, the thermal conduction coupling surface and the combined surface between at least two intermediate thermally conductive layers (110) are as shown in FIGS. 1˜14, which can be optionally selected as needed to be constituted by one or more than one combined structures of the following, such as combined by two plane surfaces with at least one combined surface is in a round, square, rectangle, polygon, radiate star shape or other geometric shapes, concavely and convexly combined, enclosed and clamped combined, combined by dovetail slots, combined by T type slots, combined by stud/hole fastening, or concavely and convexly combined by multi-fins, or combined by other conventional methods of combination etc. to enlarge the conducting area;
For the thermal conduction principle and device of the multi-layers structure with different thermal characteristics, the thermally conducting device (100) is integrally constituted by the first thermal body (101), the relay thermal conductor (102), the interface thermal conductor (103), the second thermal body (104) or the further optionally installed intermediate thermal conducting layer (110) being included, wherein if all or partially neighboring thermal conductors constituting the thermally conducting device (100) are solid bodies, then the thermal conduction coupling surface between the two neighboring thermal conductors can be combined by the following one or more than one methods, including:
1. Locking by additional screws and nuts; or
2. Screwing by itself own screw bolt and screw hole; or
3. Riveting; or
4. Pressing; or
5. Clamping; or
6. Adhesion; or
7. Soldering/welding; or
8. Fusion by frictions; or
9. Neighboring thermal conductors are combined by casting or electroplating; or
10. The thermal conducting structure between neighboring thermal conductors and another thermal conductor can be combined by either immobile or mobile attaching; or
11. The neighboring thermal conductors are in tightly touched combination; or
12. The neighboring thermal conductors are in enclosed combination.
For the thermal conduction principle and device of the multi-layers structure with different thermal characteristics, the thermal conduction coupling surface between the first thermal body (101) and the relay thermal conductor (102); or between the relay thermal conductor (102) and the intermediate thermal conducting layer (110) when the intermediate thermal conducting layer (110) is installed; or between the intermediate thermal conducting layer (110) and the intermediate thermal conducting layer (110) when multiple intermediate thermal conducting layers (110) are installed; or between the intermediate thermal conducting layer (110) and the interface thermal conductor (103); or between the relay thermal conductor (102) and the interface thermal conductor (103) when the intermediate thermal conducting layer (110) is not installed; or between the interface thermal conductor (103) and the second thermal body (104) can be combined by one or more than one of the following methods, including:

- 1. Locking by additional screws and nuts; or
- 2. Screwing by itself own screw bolt and screw hole; or
- 3. Riveting; or
- 4. Pressing; or
- 5. Clamping; or
- 6. Adhesion; or
- 7. Soldering/welding; or
- 8. Fusion by frictions; or
- 9. Neighboring thermal conductors are combined by casting or electroplating; or
- 10. The thermal conducting structure between neighboring thermal conductors and another thermal conductor can be combined by either immobile or mobile attaching; or
- 11. The neighboring thermal conductors are in tightly touched combination; or
- 12. The neighboring thermal conductors are in enclosed combination.

When the thermal conductor neighboring to a solid state thermal conductor is constituted by gaseous, liquid, colloidal or powder like matters, the thermal energy conducting methods for the thermal conduction coupling surfaces include one or more than one of the following:
1. The thermal energy of the neighboring gaseous, liquid, colloidal or powder like matters is transferred through the heat receiving surface of the solid state thermal conductor; or
2. The gaseous, liquid, colloidal or powder like matters at higher temperatures are pumped by liquid pumps or fans to randomly contact with the surface of solid state thermal conductor so as to transfer thermal energy to the neighboring solid state thermal conductor;
For the thermal conduction principle and device of the multi-layers structure with different thermal characteristics, if the first thermal body (101) or the second thermal body (104) is a heat source at combustion state, then methods for their thermal conduction to neighboring solid state thermal conducting structures include:
1. The thermal energy of neighboring heating body at combustion state is transferred by the heat receiving surface of the solid state thermal conductor;
FIG. 15 is a schematic view showing that the heat receiving surface of the relay thermal conductor (102) is used to transfer heat of the neighboring combustion type heater in a cooking ware application.
For the thermal conduction principle and device of the multi-layers structure with different thermal characteristics, if the first thermal body (101) is constituted by gaseous, liquid, colloidal or powder like matters, then its thermal conducting methods include:
1. The stirring mechanism is driven by manual, electrical or mechanical power to stir the colloidal or powder like matters for randomly transfer the thermal energy of the colloidal or powder like matters to the neighboring solid state thermal conductor;
For the thermal conduction principle and device of the multi-layers structure with different thermal characteristics, the thermal conducting methods between the interface thermal conductor (103) and the second thermal body (104) include the following:
When the second thermal body (104) is a solid state heat receiving body, and its thermal conduction coupling surface can be combined with the solid state interface thermal conductor (103) by the one or more than one of the following methods, including:
1. Locking by additional screws and nuts; or
2. Screwing by itself own screw bolt and screw hole; or
3. Riveting; or
4. Pressing; or
5. Clamping; or
6. Adhesion; or
7. Soldering/welding; or
8. Fusion by frictions; or
9. The second thermal body (104) is combined with the interface thermal conductor (103) by casting or electroplating; or
10. The thermal conducting structure between the second thermal body (104) and the interface thermal conductor (103) can be combined by either immobile or mobile attaching; or
11. The neighboring thermal conductors are in tightly touched combination; or
12. The neighboring thermal conductors are in enclosed combination.
When the second thermal body (104) is gaseous, then the methods for thermal conduction coupling with the solid interface thermal conductor (103) can be constituted by one or more than one methods including:
1. The thermal energy is transferred through the heat receiving surface of solid state interface thermal conductor (103) to the gaseous second thermal body (104); or
2. The thermal energy of the gaseous second thermal body (104) is transferred through the interface thermal conductor (103) by the fan;
When the second thermal body (104) is a liquid, the methods for thermal conduction coupling with the interface thermal conductor (103) can be constituted by one or more than one methods including:
1. The interface thermal conductor (103) is soaked in the liquid state second thermal body (104) for thermal energy transfer by free transfer; or
2. The liquid state second thermal body (104) is discharged by the pump to pass through the surface of the interface thermal conductor (103) thereby performing thermal energy transfer with the interface thermal conductor (103).
When the second thermal body (104) is constituted by colloidal or powder like matters, the methods for thermal conduction coupling with the solid state interface thermal conductor (103) include:
1. The stirring mechanism is driven by manual, electrical or mechanical power to stir the colloidal or powder like matters so as to randomly pass through the interface thermal conductor (103) for thermal energy transfer;
For the thermal conduction principle and device of the multi-layers structure with different thermal characteristics, the following one or more than one methods can be optionally selected as needed between the first thermal body (101) and the relay thermal conductor (102); or between the relay thermal conductor (102) and the interface thermal conductor (103); or between the interface thermal conductor (103) and the second thermal body (104); or between the relay thermal conductor (102) and the intermediate thermal conducting layer (110) when the intermediate thermal conducting layer (110) is installed; or between the intermediate thermal conducting layer (110) and the intermediate thermal conducting layer (110) when multiple intermediate thermal conducting layers (110) are installed; or between the intermediate thermal conducting layer (110) and the interface thermal conductor (103) to assist thermal energy transfer; including:
1. To be installed with electrically insulated heat conductive piece; or
2. To be coated with thermally conductive grease; or
3. To be installed with electrically insulated thermal conductive piece and coated with thermally conductive grease.
The thermal conduction principle and device of the multi-layers structure with different thermal characteristics can be applied in various heat transfer devices of heat absorbing, heat dissipating, or cooling, such as various machine casings for heat absorption or dissipation, various structural casing for heat absorption or dissipation, various semiconductor components for heat absorption or dissipation, as well as heat absorption, heat dissipation or thermal energy transfer for various ventilating devices, information technology devices, audio or video devices, heat dissipation for various lamp devices or light emitting diodes (LED), heat absorption or dissipation for HVAC devices, heat absorption, heat dissipation or thermal energy transfer for electrical machineries or engines, heat dissipation for transmission frictional heat loss of mechanical devices, as well as heat dissipation or thermal energy transfer for electric heater, home appliances of electric heating, or electrically heating cooking wares, or heat absorption or thermal energy transfer for flame heating furnace or cooking wares, heat absorption, heat dissipation or thermal energy transfer for earth layer or underwater thermal energy, or heat absorption, heat dissipation or thermal energy transfer for industrial plant or housing buildings, or building material or building structures, heat absorption or dissipation for water towers, heat absorption, heat dissipation or thermal energy transfer for batteries or fuel cells, etc;
In addition, it can also be utilized for thermal energy transfer applications in home electrical appliances, industrial products, electronic products, electrical machineries or mechanical devices, power generation equipments, buildings, HVAC devices, production equipments or the industrial manufacturing process, etc.

Claims

1. A thermal conduction principle and device of the multi-layers structure with different thermal characteristics, having a relay thermal conductor being made of material with better thermal conducting characteristics, one end or face of the relay thermal conductor is thermal conductively coupled with at least one first thermal body for heating or cooling; while another end or face of the relay thermal conductor is thermal conductively coupled with the interface thermal conductor, wherein the interface thermal conductor having both or either one of the thermal conductivity characteristics including 1) a higher specific heat capacity relative to the relay thermal conductor, or 2) a better thermal conductivity coefficient or thermal radiation coefficient (thermal emission) relative to the relay thermal conductor toward the second thermal body is used as the thermal conduction carrier between the relay thermal conductor and the second thermal body, thus is favorable for thermal conduction when there is a temperature difference between the first thermal body and the second thermal body.

2. A thermal conduction principle and device of the multi-layers structure with different thermal characteristics as claimed in claim 1, wherein it has a relay thermal conductor being made of material with better thermal conducting characteristics between the first thermal body to be thermal conductively coupled with the first thermal body; while the interface thermal conductor is coupled with the relay thermal conductor between the relay thermal conductor and the second thermal body, wherein the interface thermal conductor having both or either one of the thermal conductivity characteristics including 1) a higher specific heat capacity relative to the relay thermal conductor, or 2) a better thermal conductivity coefficient or thermal radiation coefficient (thermal emission) relative to the relay thermal conductor toward the second thermal body is used as the thermal conductor between the relay thermal conductor and the second thermal conductor; it mainly comprises including:

The thermally conducting device (100) is constituted by at least two layers of thermal conducting material with different thermal characteristics, wherein the relay thermal conductor (102) with better thermal conductivity coefficient is coupled with the first thermal body (101), and the interface thermal conductor (103) with higher specific heat capacity is coupled between the relay thermal conductor (102) and the second thermal body (104), thereby constituting the thermally conducting device (100);

The thermally conducting device (100) is installed between the first thermal body (101) and the second thermal body (104), and the thermally conducting device (100) can be constituted including by the relay thermal conductor (102) and the interface thermal conductor (103), wherein

The first thermal body (101): It can be an active cooling or heating thermal body or a passive heat absorbing or heat release thermal body being constituted by solid, gaseous, liquid, colloidal, or powder like matters;

The relay thermal conductor (102): It is constituted by at least one layer of solid, gaseous, liquid, colloidal or powder like matters with relatively better thermal conductivity coefficients, wherein the thermal conductivity coefficient of the relay thermal conductor and the first thermal body (101) is better than the one of the interface thermal conductor (103), i.e. its thermal conducting rate is faster than the one of the interface thermal conductor (103), and the thermal conduction coupling area between the relay thermal conductor (102) and the first thermal body (101) is smaller than the thermal conduction coupling area between the relay thermal conductor (102) and the interface thermal conductor (103);

The interface thermal conductor (103): It is made of at least one layer of solid, gaseous, liquid, colloidal or powder like matters, wherein both or either one of its material thermal conductivity characteristics such as 1) the specific heat capacity, or 2) the thermal conductivity coefficient or thermal radiation coefficient (thermal emission) toward the second thermal body (104) are better than the ones of the relay thermal conductor (102), wherein it is installed between the relay thermal conductor (102) and the second thermal body (104), and the thermal conduction coupling area between the interface thermal conductor (103) and the second thermal body (104) is larger or equal to the thermal conduction coupling area between the relay thermal conductor (102) and the interface thermal conductor (103);

The second thermal body (104): It is an active cooling or heating thermal body or a passive heat absorbing or heat release thermal body being constituted by solid, gaseous, liquid, colloidal or powder like matters;

For the thermal conduction principle and device of the multi-layers structure with different thermal characteristics, the geometric shapes of the thermal conduction coupling surface between the first thermal body (101) and the relay thermal conductor (102) as well as the thermal conduction coupling surface between the interface thermal conductor (103) and the second thermal body (104) can be optionally selected as needed;

It is through above said particular structures to lower the thermal resistance between the first thermal body (101) and the second thermal body (104).

3. A thermal conduction principle and device of the multi-layers structure with different thermal characteristics as claimed in claim 2, wherein the corresponding relationship between the first thermal body (101), the relay thermal conductor (102), the interface thermal conductor (103), the second thermal body (104) are as following:

The thermally conducting device (100) is installed between the first thermal body (101) and the second thermal body (104);

The thermally conducting device (100) is constituted by the thermal conductor having at least two layers of material with different thermal characteristics, wherein the relay thermal conductor (102) having a better thermal conductivity coefficient relative to the one between interface thermal conductor (103) and the first thermal body (101) is coupled with the first thermal body (101), and the interface thermal conductor (103) having both or either one of its material thermal conductivity characteristics such as 1) a higher heat capacity, or 2) a thermal conductivity coefficient or thermal radiation coefficient (thermal emission) toward the second thermal body (104) are better than the ones of the relay thermal conductor (102) is coupled between the relay thermal body (102) and the second thermal body (104);

The thermal conductivity coefficient of the material constituting the relay thermal conductor (102) is better than the one of the interface thermal conductor (103);

Two or either one of the thermal conductivity characteristics such as the material specific heat capacity of the interface thermal conductor (103) or the thermal conductivity coefficient or the thermal radiation coefficient of the material constituting the interface thermal conductor (103) toward the second thermal body (104) are better than the ones of the relay thermal conductor (102);

The thermal conduction coupling area between the relay thermal conductor (102) and the interface thermal conductor (103) is larger than the thermal conduction coupling area between the relay thermal conductor (102) and the first thermal body (101) so as to reduce the thermal resistance;

The thermal conduction coupling area between the interface thermal conductor (103) and the second thermal body (104) is larger or equal to the thermal conduction coupling area between the relay thermal conductor (102) and the interface thermal conductor (103) so as to reduce the thermal resistance;

If the temperature of first thermal body (101) is higher than the one of the second thermal body (104) in the above said structure, the thermal energy of the first thermal body (101) is externally diffused to execute thermal conduction to the relay thermal conductor (102) with better thermal conductivity coefficient through the smaller thermal conducting coupling area between the first thermal body (101) and the relay thermal conductor (102); while the thermal energy is diffused to the interface thermal conductor (103) with larger specific heat capacity through the larger thermal conduction coupling area between the relay thermal conductor (102) and the interface thermal conductor (103), and the thermal energy is released by the interface thermal conductor (103) to the second thermal body (104) through the same or larger thermal conduction coupling area;

If the temperature of first thermal body (101) is lower than the one of the second thermal body (104) in the above said structure, the thermal energy of the second thermal body (104) is diffusely conducted to the interface thermal conductor (103) with larger specific heat capacity through the larger thermal conducting coupling area between the second thermal body (104) and the interface thermal conductor (103), while the thermal energy is conducted to the relay thermal conductor (102) through the smaller thermal conduction coupling area coupled with the interface thermal conductor (103) and the relay thermal conductor (102), and the thermal energy is further released to the first thermal body (101) through the smaller thermal conduction coupling area of the relay thermal conductor (102) with better thermal conductivity coefficient.

4. A thermal conduction principle and device of the multi-layers structure with different thermal characteristics as claimed in claim 2, wherein it can be further constituted by the following structures:

If at least one of the first thermal body (101), or the second thermal heater (102), or the interface thermal conductor (103), or the second thermal body (104) is made of gaseous, liquid, colloidal, or powder like matters, then a container structure can be installed for housing them, wherein the container structure can be made of a good thermal conductor or a non-thermal conductor, or made of material with better thermal conductivity coefficient to constitute the relay thermal conductor (102), or made of material with larger specific heat capacity to constitute the function of interface thermal conductor (103).

5. A thermal conduction principle and device of the multi-layers structure with different thermal characteristics as claimed in claim 2, wherein the thermal conduction coupling surface and the combined surface between the relay thermal conductor (102) and the interface thermal conductor (103) can be optionally selected as needed to be constituted by one or more than one combined structures of the following, such as combined by two plane surfaces with at least one combined surface is in a round, square, rectangle, polygon, radiate star shape or other geometric shapes, concavely and convexly combined, clamped combined, combined by dovetail slots, combined by T type slots, combined by stud/hole fastening, or concavely and convexly combined by multi-fins, or combined by other conventional methods of combination etc. to enlarge the conducting area.

6. A thermal conduction principle and device of the multi-layers structure with different thermal characteristics as claimed in claim 2, wherein when the relay thermal conductor (102) or the interface thermal conductor (103) is a multiple layers structure, the relationships between the additional intermediate thermal conducting layer (110) and the relay thermal conductor (102) as well as the interface thermal conductor (103) are as the following:

If the specific heat capacity of the intermediate thermal conducting layer (110) is larger than the one of the relay thermal conductor (102), but smaller than the one of the interface thermal conductor (103), then when the structure of multiple intermediate thermal conducting layers (110) is adopted, the specific heat capacity is smaller for the intermediate thermal conducting layer (110) which is closer to the relay thermal conductor (102) but still larger than the one of the relay thermal conductor (102);

The thermal conductivity coefficient of the intermediate thermal conducting layer (110) is better than the one of the interface thermal conductor (103), and the thermal conductivity coefficient of the relay thermal conductor (102) is better than the one of the intermediate thermal conducting layer (110); then when the structure of multiple intermediate thermal conducting layers (110) is adopted, the thermal conductivity coefficient is better for the intermediate thermal conducting layer (110) which is closer to the relay thermal conductor (102), but still slightly smaller than the one of the relay thermal conductor (102);

The thermal conduction coupling area between the relay thermal conductor (102) and the intermediate thermal conducting layer (110) is larger than the thermal conduction coupling area between the intermediate thermal conducting layer (110) and the interface thermal conductor (103), then when the structure of multiple intermediate thermal conducting layers (110) is optionally installed, its thermal conduction coupling area is larger for the intermediate layer which is closer to the interface thermal conductor (103).

7. A thermal conduction principle and device of the multi-layers structure with different thermal characteristics as claimed in claim 6, wherein if the number of above said intermediate thermal conducting layers (110) is two or more than two, then the selection of the thermal conductivity coefficient and specific heat capacity in the thermal characteristics as well as the selection of the thermal conduction coupling area size of the two sides of the intermediate thermal conducting layer (110) is followed a structural principal that the thermal conduction area size of each layer of a combined structure constituted in sequencing from the first thermal body (101) to the relay thermal conductor (102) to the intermediate thermally conductive layer (110) to the interface thermal conductor (103) and to the second thermal body (104) is sequentially and gradually increasing layer by layer.

8. A thermal conduction principle and device of the multi-layers structure with different thermal characteristics as claimed in claim 6, wherein the thermal conduction coupling surface and the combined surface between the relay thermal conductor (102) and the intermediate thermally conductive layer (110) can be optionally selected as needed to be constituted by one or more than one combined structures of the following, such as combined by two plane surfaces with at least one combined surface is in a round, square, rectangle, polygon, radiate star shape or other geometric shapes, concavely and convexly combined, clamped combined, combined by dovetail slots, combined by T type slots, combined by stud/hole fastening, or concavely and convexly combined by multi-fins, or combined by other conventional methods of combination etc. to enlarge the conducting area.

9. A thermal conduction principle and device of the multi-layers structure with different thermal characteristics as claimed in claim 6, wherein the thermal conduction coupling surface and the combined surface between the intermediate thermally conductive layer (110) and the interface thermal conductor (103) can be optionally selected as needed to be constituted by one or more than one combined structures of the following, such as combined by two plane surfaces with at least one combined surface is in a round, square, rectangle, polygon, radiate star shape or other geometric shapes, concavely and convexly combined, clamped combined, combined by dovetail slots, combined by T type slots, combined by stud/hole fastening, or concavely and convexly combined by multi-fins, or combined by other conventional methods of combination etc. to enlarge the conducting area.

10. A thermal conduction principle and device of the multi-layers structure with different thermal characteristics as claimed in claim 7, wherein if two or more than two layers of the intermediate thermally conductive layer (110) is selected, the thermal conduction coupling surface and the combined surface between at least two intermediate thermally conductive layers (110) can be optionally selected as needed to be constituted by one or more than one combined structures of the following, such as combined by two plane surfaces with at least one combined surface is in a round, square, rectangle, polygon, radiate star shape or other geometric shapes, concavely and convexly combined, clamped combined, combined by dovetail slots, combined by T type slots, combined by stud/hole fastening, or concavely and convexly combined by multi-fins, or combined by other conventional methods of combination etc. to enlarge the conducting area.

11. A thermal conduction principle and device of the multi-layers structure with different thermal characteristics as claimed in claim 2 or claim 7, wherein the thermally conducting device (100) is integrally constituted by the first thermal body (101), the relay thermal conductor (102), the interface thermal conductor (103), the second thermal body (104) or the further optionally installed intermediate thermal conducting layer (110) being included, wherein if all or partially neighboring thermal conductors constituting the thermally conducting device (100) are solid bodies, then the thermal conduction coupling surface between the two neighboring thermal conductors can be combined by the following one or more than one methods, including:

1) Locking by additional screws and nuts; or

2) Screwing by itself own screw bolt and screw hole; or

3) Riveting; or

4) Pressing; or

5) Clamping; or

6) Adhesion; or

7) Soldering/welding; or

8) Fusion by frictions; or

9) Neighboring thermal conductors are combined by casting or electroplating; or

10) The thermal conducting structure between neighboring thermal conductors and another thermal conductor can be combined by either immobile or mobile attaching; or

11) The neighboring thermal conductors are in tightly touched combination; or

12) The neighboring thermal conductors are in enclosed combination.

12. A thermal conduction principle and device of the multi-layers structure with different thermal characteristics as claimed in claim 2 or claim 7, wherein the thermal conduction coupling surface between the first thermal body (101) and the relay thermal conductor (102); or between the relay thermal conductor (102) and the intermediate thermal conducting layer (110) when the intermediate thermal conducting layer (110) is installed; or between the intermediate thermal conducting layer (110) and the intermediate thermal conducting layer (110) when multiple intermediate thermal conducting layers (110) are installed; or between the intermediate thermal conducting layer (110) and the interface thermal conductor (103); or between the relay thermal conductor (102) and the interface thermal conductor (103) when the intermediate thermal conducting layer (110) is not installed; or between the interface thermal conductor (103) and the second thermal body (104) can be combined by one or more than one of the following methods, including:

1) Locking by additional screws and nuts; or

2) Screwing by itself own screw bolt and screw hole; or

3) Riveting; or

4) Pressing; or

5) Clamping; or

6) Adhesion; or

7) Soldering/welding; or

8) Fusion by frictions; or

9) Neighboring thermal conductors are combined by casting or electroplating; or

11) The neighboring thermal conductors are in tightly touched combination; or

12) The neighboring thermal conductors are in enclosed combination;

When the thermal conductor neighboring to a solid state thermal conductor is constituted by gaseous, liquid, colloidal or powder like matters, the thermal energy conducting methods for the thermal conduction coupling surfaces include one or more than one of the following:

1) Thermal energy of the neighboring gaseous, liquid, colloidal or powder like matters is transferred through the heat receiving surface of the solid state thermal conductor; or

2) The gaseous, liquid, colloidal or powder like matters at higher temperatures are pumped by liquid pumps or fans to randomly contact with the surface of solid state thermal conductor so as to transfer thermal energy to the neighboring solid state thermal conductor.

13. A thermal conduction principle and device of the multi-layers structure with different thermal characteristics as claimed in claim 2, wherein if the first thermal body (101) or the second thermal body (104) is a heat source at combustion state, then methods for their thermal conduction to neighboring solid state thermal conducting structures include:

The thermal energy of neighboring heating body at combustion state is transferred by the heat receiving surface of the solid state thermal conductor

14. A thermal conduction principle and device of the multi-layers structure with different thermal characteristics as claimed in claim 2, wherein if the first thermal body (101) is constituted by gaseous, liquid, colloidal or powder like matters, then its thermal conducting methods include:

The stirring mechanism is driven by manual, electrical or mechanical power to stir the colloidal or powder like matters for randomly transfer the thermal energy of the colloidal or powder like matters to the neighboring solid state thermal conductor.

15. A thermal conduction principle and device of the multi-layers structure with different thermal characteristics as claimed in claim 2, wherein the thermal conducting methods between the interface thermal conductor (103) and the second thermal body (104) include the following:

When the second thermal body (104) is a solid state heat receiving body, and its thermal conduction coupling surface can be combined with the solid state interface thermal conductor (103) by the one or more than one of the following methods, including:

1) Locking by additional screws and nuts; or

2) Screwing by itself own screw bolt and screw hole; or

3) Riveting; or

4) Pressing; or

5) Clamping; or

6) Adhesion; or

7) Soldering/welding; or

8) Fusion by frictions; or

9) The second thermal body (104) is combined with the interface thermal conductor (103) by casting or electroplating; or

10) The thermal conducting structure between the second thermal body (104) and the interface thermal conductor (103) can be combined by either immobile or mobile attaching; or

11) The neighboring thermal conductors are in tightly touched combination; or

12) The neighboring thermal conductors are in enclosed combination.

16. A thermal conduction principle and device of the multi-layers structure with different thermal characteristics as claimed in claim 2, wherein the thermal conducting methods between the interface thermal conductor (103) and the second thermal body (104) include:

When the second thermal body (104) is gaseous, then the methods for thermal conduction coupling with the solid interface thermal conductor (103) can be constituted by one or more than one methods including:

1) The thermal energy is transferred through the heat receiving surface of solid state interface thermal conductor (103) to the gaseous second thermal body (104); or

2) The thermal energy of the gaseous second thermal body (104) is transferred through the interface thermal conductor (103) by the fan.

17. A thermal conduction principle and device of the multi-layers structure with different thermal characteristics as claimed in claim 2, wherein the thermal conducting methods between the interface thermal conductor (103) and the second thermal body (104) include:—when the second thermal body (104) is a liquid, the methods for thermal conduction coupling with the interface thermal conductor (103) can be constituted by one or more than one methods including:

1) The interface thermal conductor (103) is soaked in the liquid state second thermal body (104) for thermal energy transfer by free transfer; or

2) The liquid state second thermal body (104) is discharged by the pump to pass through the surface of the interface thermal conductor (103) thereby performing thermal energy transfer with the interface thermal conductor (103).

18. A thermal conduction principle and device of the multi-layers structure with different thermal characteristics as claimed in claim 2, wherein the thermal conducting methods between the interface thermal conductor (103) and the second thermal body (104) include:

When the second thermal body (104) is constituted by colloidal or powder like matters, the methods for thermal conduction coupling with the solid state interface thermal conductor (103) include:

The stirring mechanism is driven by manual, electrical or mechanical power to stir the colloidal or powder like matters so as to randomly pass through the interface thermal conductor (103) for thermal energy transfer.

19. A thermal conduction principle and device of the multi-layers structure with different thermal characteristics as claimed in claim 2, wherein the following one or more than one methods can be optionally selected as needed between the first thermal body (101) and the relay thermal conductor (102); or between the relay thermal conductor (102) and the interface thermal conductor (103); or between the interface thermal conductor (103) and the second thermal body (104); or between the relay thermal conductor (102) and the intermediate thermal conducting layer (110) when the intermediate thermal conducting layer (110) is installed; or between the intermediate thermal conducting layer (110) and the intermediate thermal conducting layer (110) when multiple intermediate thermal conducting layers (110) are installed; or between the intermediate thermal conducting layer (110) and the interface thermal conductor (103) to assist thermal energy transfer; including:

1) To be installed with electrically insulated heat conductive piece; or

2) To be coated with thermally conductive grease; or

3) To be installed with electrically insulated thermal conductive piece and coated with thermally conductive grease.