TWI563352B - Resist developer, method for forming resist pattern and method for manufacturing mold - Google Patents
Resist developer, method for forming resist pattern and method for manufacturing moldInfo
- Publication number
- TWI563352B TWI563352B TW101128095A TW101128095A TWI563352B TW I563352 B TWI563352 B TW I563352B TW 101128095 A TW101128095 A TW 101128095A TW 101128095 A TW101128095 A TW 101128095A TW I563352 B TWI563352 B TW I563352B
- Authority
- TW
- Taiwan
- Prior art keywords
- manufacturing mold
- resist
- developer
- resist pattern
- forming
- Prior art date
Links
- 238000000034 method Methods 0.000 title 2
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
- G03F7/325—Non-aqueous compositions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
- G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Nanotechnology (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mathematical Physics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Theoretical Computer Science (AREA)
- Materials For Photolithography (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011170898 | 2011-08-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201324064A TW201324064A (en) | 2013-06-16 |
| TWI563352B true TWI563352B (en) | 2016-12-21 |
Family
ID=47629096
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101128095A TWI563352B (en) | 2011-08-04 | 2012-08-03 | Resist developer, method for forming resist pattern and method for manufacturing mold |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6124459B2 (en) |
| TW (1) | TWI563352B (en) |
| WO (1) | WO2013018569A1 (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5798466B2 (en) * | 2010-12-27 | 2015-10-21 | Hoya株式会社 | Resist developer, resist pattern forming method, and mold manufacturing method |
| JP5837811B2 (en) * | 2010-12-27 | 2015-12-24 | Hoya株式会社 | Resist developer, resist pattern forming method, and mold manufacturing method |
| JP5837812B2 (en) * | 2010-12-27 | 2015-12-24 | Hoya株式会社 | Resist developer, resist pattern forming method, and mold manufacturing method |
| TWI667708B (en) * | 2013-11-11 | 2019-08-01 | Tokyo Electron Limited | Method and hardware for enhanced removal of post etch polymer and hardmask removal |
| WO2017002497A1 (en) * | 2015-06-30 | 2017-01-05 | 富士フイルム株式会社 | Pattern forming method, and electronic device manufacturing method |
| JP6699203B2 (en) * | 2016-01-29 | 2020-05-27 | 日本ゼオン株式会社 | Resist pattern formation method |
| WO2017130872A1 (en) * | 2016-01-29 | 2017-08-03 | 日本ゼオン株式会社 | Resist pattern forming method |
| CN110050005B (en) | 2016-12-27 | 2021-05-14 | 日本瑞翁株式会社 | Polymer, positive resist composition, and resist pattern forming method |
| TWI626516B (en) * | 2017-07-03 | 2018-06-11 | Crowningtek Inc | Manufacturing method of micron-sized imprinting mold and imprinting mold |
| JP2019140209A (en) | 2018-02-08 | 2019-08-22 | 東芝メモリ株式会社 | Imprint system, method for manufacturing semiconductor device and program |
| WO2024014152A1 (en) * | 2022-07-11 | 2024-01-18 | 東洋合成工業株式会社 | Method for producing patterned base material, curable composition and method for producing component |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02221962A (en) * | 1989-02-23 | 1990-09-04 | Asahi Glass Co Ltd | Resist developer |
| JP2006227174A (en) * | 2005-02-16 | 2006-08-31 | Ricoh Co Ltd | Resist developer and pattern forming method |
| JP2009226762A (en) * | 2008-03-24 | 2009-10-08 | Toppan Printing Co Ltd | Imprint mold, imprint mold manufacturing method and fine structural body |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55100548A (en) * | 1979-01-26 | 1980-07-31 | Japan Synthetic Rubber Co Ltd | Developer |
| JPS61245155A (en) * | 1985-04-23 | 1986-10-31 | Toray Ind Inc | Developing solution for radiation sensitive resist |
| JPH02275462A (en) * | 1989-04-17 | 1990-11-09 | Toppan Printing Co Ltd | Pattern forming method for electron beam resist |
| JPH10228117A (en) * | 1997-02-14 | 1998-08-25 | Nippon Telegr & Teleph Corp <Ntt> | Method for developing resist and rinsing liquid used therefor |
| JP2000039717A (en) * | 1998-07-24 | 2000-02-08 | Fujitsu Ltd | Method of forming resist pattern and method of manufacturing semiconductor device |
| US8703402B2 (en) * | 2009-05-21 | 2014-04-22 | Tokuyama Corporation | Resist pattern forming method and developer |
| JP5602475B2 (en) * | 2010-03-31 | 2014-10-08 | Hoya株式会社 | Resist pattern forming method and mold manufacturing method |
| EP2693270B1 (en) * | 2011-03-28 | 2015-12-09 | FUJIFILM Corporation | Method for producing lithographic printing plate |
-
2012
- 2012-07-23 JP JP2013526819A patent/JP6124459B2/en active Active
- 2012-07-23 WO PCT/JP2012/068596 patent/WO2013018569A1/en not_active Ceased
- 2012-08-03 TW TW101128095A patent/TWI563352B/en active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02221962A (en) * | 1989-02-23 | 1990-09-04 | Asahi Glass Co Ltd | Resist developer |
| JP2006227174A (en) * | 2005-02-16 | 2006-08-31 | Ricoh Co Ltd | Resist developer and pattern forming method |
| JP2009226762A (en) * | 2008-03-24 | 2009-10-08 | Toppan Printing Co Ltd | Imprint mold, imprint mold manufacturing method and fine structural body |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2013018569A1 (en) | 2015-03-05 |
| TW201324064A (en) | 2013-06-16 |
| JP6124459B2 (en) | 2017-05-10 |
| WO2013018569A1 (en) | 2013-02-07 |
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