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TWI563241B - Apparatus and method of using impedance resonance sensor for thickness measurement - Google Patents

Apparatus and method of using impedance resonance sensor for thickness measurement

Info

Publication number
TWI563241B
TWI563241B TW101117845A TW101117845A TWI563241B TW I563241 B TWI563241 B TW I563241B TW 101117845 A TW101117845 A TW 101117845A TW 101117845 A TW101117845 A TW 101117845A TW I563241 B TWI563241 B TW I563241B
Authority
TW
Taiwan
Prior art keywords
thickness measurement
resonance sensor
impedance resonance
impedance
sensor
Prior art date
Application number
TW101117845A
Other languages
English (en)
Other versions
TW201300733A (zh
Inventor
Yury Nikolenko
Matthew Fauss
Original Assignee
Neovision Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Neovision Llc filed Critical Neovision Llc
Publication of TW201300733A publication Critical patent/TW201300733A/zh
Application granted granted Critical
Publication of TWI563241B publication Critical patent/TWI563241B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
    • G01B7/06—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness
    • G01B7/08—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness using capacitive means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
    • G01B7/06—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
    • G01B7/06—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness
    • G01B7/10—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness using magnetic means, e.g. by measuring change of reluctance

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
TW101117845A 2011-05-19 2012-05-18 Apparatus and method of using impedance resonance sensor for thickness measurement TWI563241B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201161487932P 2011-05-19 2011-05-19

Publications (2)

Publication Number Publication Date
TW201300733A TW201300733A (zh) 2013-01-01
TWI563241B true TWI563241B (en) 2016-12-21

Family

ID=46208791

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101117845A TWI563241B (en) 2011-05-19 2012-05-18 Apparatus and method of using impedance resonance sensor for thickness measurement

Country Status (3)

Country Link
US (1) US9528814B2 (zh)
TW (1) TWI563241B (zh)
WO (1) WO2012158930A1 (zh)

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CN109968185B (zh) * 2019-04-17 2024-05-10 北京科技大学 一种金刚石膜研磨工装及其研磨方法
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Also Published As

Publication number Publication date
US20120293188A1 (en) 2012-11-22
TW201300733A (zh) 2013-01-01
US9528814B2 (en) 2016-12-27
WO2012158930A1 (en) 2012-11-22

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