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TWI562405B - Method of manufacturing led package structure for preventing lateral light leakage - Google Patents

Method of manufacturing led package structure for preventing lateral light leakage

Info

Publication number
TWI562405B
TWI562405B TW102134069A TW102134069A TWI562405B TW I562405 B TWI562405 B TW I562405B TW 102134069 A TW102134069 A TW 102134069A TW 102134069 A TW102134069 A TW 102134069A TW I562405 B TWI562405 B TW I562405B
Authority
TW
Taiwan
Prior art keywords
package structure
light leakage
led package
lateral light
preventing lateral
Prior art date
Application number
TW102134069A
Other languages
English (en)
Other versions
TW201513401A (zh
Inventor
Chien Chung Huang
Chih Ming Wu
Tung Po Huang
Original Assignee
Brightek Optoelectronic Shenzhen Co Ltd
Brightek Optoelectronic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Brightek Optoelectronic Shenzhen Co Ltd, Brightek Optoelectronic Co Ltd filed Critical Brightek Optoelectronic Shenzhen Co Ltd
Priority to TW102134069A priority Critical patent/TWI562405B/zh
Priority to US14/490,212 priority patent/US9236541B2/en
Priority to JP2014191688A priority patent/JP6030611B2/ja
Priority to EP14185689.8A priority patent/EP2851971B1/en
Publication of TW201513401A publication Critical patent/TW201513401A/zh
Priority to US14/804,448 priority patent/US9525113B2/en
Application granted granted Critical
Publication of TWI562405B publication Critical patent/TWI562405B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8515—Wavelength conversion means not being in contact with the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10W72/0198—
    • H10W90/00—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0361—Manufacture or treatment of packages of wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0362—Manufacture or treatment of packages of encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0363—Manufacture or treatment of packages of optical field-shaping means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0364—Manufacture or treatment of packages of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/882—Scattering means
    • H10W74/00—
    • H10W74/10—
    • H10W90/754—
TW102134069A 2013-09-23 2013-09-23 Method of manufacturing led package structure for preventing lateral light leakage TWI562405B (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
TW102134069A TWI562405B (en) 2013-09-23 2013-09-23 Method of manufacturing led package structure for preventing lateral light leakage
US14/490,212 US9236541B2 (en) 2013-09-23 2014-09-18 LED package structures for preventing lateral light leakage and method of manufacturing the same
JP2014191688A JP6030611B2 (ja) 2013-09-23 2014-09-19 側面漏光防止用の発光ダイオードパッケージ構造及びその製造方法
EP14185689.8A EP2851971B1 (en) 2013-09-23 2014-09-22 LED package structures for preventing lateral light leakage and method of manufacturing the same
US14/804,448 US9525113B2 (en) 2013-09-23 2015-07-21 Method of manufacturing a LED package structure for preventing lateral light leakage

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW102134069A TWI562405B (en) 2013-09-23 2013-09-23 Method of manufacturing led package structure for preventing lateral light leakage

Publications (2)

Publication Number Publication Date
TW201513401A TW201513401A (zh) 2015-04-01
TWI562405B true TWI562405B (en) 2016-12-11

Family

ID=51570405

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102134069A TWI562405B (en) 2013-09-23 2013-09-23 Method of manufacturing led package structure for preventing lateral light leakage

Country Status (4)

Country Link
US (2) US9236541B2 (zh)
EP (1) EP2851971B1 (zh)
JP (1) JP6030611B2 (zh)
TW (1) TWI562405B (zh)

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US20160111581A1 (en) * 2014-10-16 2016-04-21 Semiconductor Components Industries, Llc Packaged semiconductor devices and related methods
KR101778848B1 (ko) * 2015-08-21 2017-09-14 엘지전자 주식회사 발광소자 패키지 어셈블리 및 이의 제조 방법
CN107946441A (zh) 2016-10-12 2018-04-20 亿光电子工业股份有限公司 发光装置及发光二极管封装结构
DE102016122472A1 (de) * 2016-11-22 2018-05-24 Osram Opto Semiconductors Gmbh Bauteil mit einem optoelektronischen bauelement
TW201824524A (zh) * 2016-12-30 2018-07-01 菱生精密工業股份有限公司 光學模組的封裝結構
WO2018162076A1 (en) * 2017-03-10 2018-09-13 Osram Opto Semiconductors Gmbh Optoelectronic semiconductor component and method for producing an optoelectronic semiconductor component
JP7102675B2 (ja) * 2017-05-09 2022-07-20 ローム株式会社 光学装置
US10410997B2 (en) 2017-05-11 2019-09-10 Cree, Inc. Tunable integrated optics LED components and methods
DE102018102629A1 (de) * 2018-02-06 2019-08-08 Endress+Hauser SE+Co. KG Verfahren zur Herstellung einer Gehäusekomponente mit einem Sichtfenster
CN110391324A (zh) * 2018-04-19 2019-10-29 群创光电股份有限公司 发光元件与电子装置
US11018284B2 (en) 2018-04-19 2021-05-25 Innolux Corporation Light emitting element and electronic device
KR102094402B1 (ko) * 2018-08-24 2020-03-27 주식회사 케이티앤지 발광 소자 및 이를 포함하는 에어로졸 생성 장치
CN109802015B (zh) * 2018-12-25 2024-02-20 广东晶科电子股份有限公司 一种半导体器件及其封装方法
CN109856857B (zh) * 2019-02-28 2021-11-12 重庆京东方光电科技有限公司 一种发光组件、背光源和显示面板
CN112349707A (zh) * 2019-08-09 2021-02-09 隆达电子股份有限公司 阵列发光结构及其制造方法
CN111697117B (zh) * 2020-06-23 2021-08-20 深圳市聚飞光电股份有限公司 芯片级封装方法及led封装器件
US12336350B2 (en) * 2021-04-30 2025-06-17 Samsung Display Co., Ltd. High resolution display device with reduced current consumption and load
DE102022121518A1 (de) * 2022-08-25 2024-03-07 Ams-Osram International Gmbh Verfahren zur herstellung einer vielzahl strahlungsemittierender bauelemente und strahlungsemittierendes bauelement
TWI835452B (zh) * 2022-12-07 2024-03-11 友達光電股份有限公司 發光裝置及其製造方法
CN120085496A (zh) * 2023-04-19 2025-06-03 厦门天马微电子有限公司 一种显示面板及显示装置

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JP2001118865A (ja) * 1999-10-19 2001-04-27 Japan Rec Co Ltd 光電子部品の製造方法
JP2002198558A (ja) * 2000-12-27 2002-07-12 Rohm Co Ltd 光学装置およびフォトインタラプタ
TW201140893A (en) * 2010-01-07 2011-11-16 Seoul Semiconductor Co Ltd Aspherical LED lens and light emitting device including the same
TW201216312A (en) * 2010-10-15 2012-04-16 Primax Electronics Ltd Keyboard
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Also Published As

Publication number Publication date
US9236541B2 (en) 2016-01-12
EP2851971A1 (en) 2015-03-25
US20160087168A1 (en) 2016-03-24
TW201513401A (zh) 2015-04-01
US9525113B2 (en) 2016-12-20
US20150084072A1 (en) 2015-03-26
EP2851971B1 (en) 2018-05-30
JP2015062226A (ja) 2015-04-02
JP6030611B2 (ja) 2016-11-24

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