TWI562271B - - Google Patents

Info

Publication number: TWI562271B
Authority: TW; Taiwan

Application number

TW099144803A

Other versions

TW201133700A (en

Inventor

Daisuke Yuki

Takahiro Miike

Hiroshi Mori

Original Assignee

Nikon Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2009-12-18

Filing date

2010-12-20

Publication date

2016-12-11

2010-12-20 Application filed by Nikon Corp filed Critical Nikon Corp

2011-10-01 Publication of TW201133700A publication Critical patent/TW201133700A/zh

2016-12-11 Application granted granted Critical

2016-12-11 Publication of TWI562271B publication Critical patent/TWI562271B/zh

Classifications

- H10P72/7606—
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
- H10P10/128—
- H10P54/00—
- H10P72/0428—
- H10P72/722—
- H10P72/7608—
- H10P72/7618—
- H10P72/7624—
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor

TW099144803A 2009-12-18 2010-12-20 Pair of substrate holders, method for manufacturing device, separation device, method for separating substrates, substrate holder, and device for positioning substrate TW201133700A (en)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2009288121		2009-12-18
JP2009288261		2009-12-18

Publications (2)

Publication Number	Publication Date
TW201133700A TW201133700A (en)	2011-10-01
TWI562271B true TWI562271B (zh)	2016-12-11

Family

ID=44167044

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW099144803A TW201133700A (en)	2009-12-18	2010-12-20	Pair of substrate holders, method for manufacturing device, separation device, method for separating substrates, substrate holder, and device for positioning substrate

Country Status (6)

Country	Link
US (1)	US8863808B2 (zh)
EP (1)	EP2515322A4 (zh)
JP (1)	JP6051523B2 (zh)
KR (1)	KR101860956B1 (zh)
TW (1)	TW201133700A (zh)
WO (1)	WO2011074274A1 (zh)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP4676026B1 (ja)	2010-09-17	2011-04-27	日東電工株式会社	液晶表示素子の製造システム及び製造方法
JP4733227B1 (ja) *	2010-09-30	2011-07-27	日東電工株式会社	液晶表示素子の製造システム及び製造方法
TWI616975B (zh) *	2011-12-14	2018-03-01	Nikon Corporation	基板固定器及基板貼合裝置
US9947637B2 (en)	2013-11-01	2018-04-17	Nikon Corporation	System and method for clamping wafers together in alignment using pressure
JP6473908B2 (ja) *	2015-02-17	2019-02-27	ボンドテック株式会社	ウエハ接合装置及びウエハ接合方法
CN107749407B (zh) *	2017-09-22	2020-08-28	沈阳拓荆科技有限公司	晶圆承载盘及其支撑结构
WO2019146424A1 (ja) *	2018-01-23	2019-08-01	東京エレクトロン株式会社	基板処理装置、および基板処理方法
KR102217780B1 (ko) *	2018-06-12	2021-02-19	피에스케이홀딩스 (주)	정렬 장치
US11309177B2 (en) *	2018-11-06	2022-04-19	Stmicroelectronics S.R.L.	Apparatus and method for manufacturing a wafer
WO2020194310A1 (en)	2019-03-27	2020-10-01	Yaskawa Europe Technology Ltd.	Semiconductor flipper
JP7267111B2 (ja) *	2019-05-31	2023-05-01	東京エレクトロン株式会社	位置決め機構及び位置決め方法
JP7288832B2 (ja) *	2019-10-01	2023-06-08	キヤノントッキ株式会社	回転駆動装置
CN111668092B (zh) *	2020-04-24	2025-07-15	北京华卓精科科技股份有限公司	晶圆键合的方法
KR102507268B1 (ko) *	2021-04-26	2023-03-07	(주)에스티아이	라미네이션 시스템
US12538756B2 (en) *	2022-05-06	2026-01-27	Nuflare Technology, Inc.	Vapor phase growth apparatus and reflector
US20240006196A1 (en) *	2022-06-29	2024-01-04	Sky Tech Inc.	Bonding machine for warped substrates

Citations (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TWI264080B (en) *	2003-03-24	2006-10-11	Sumitomo Electric Industries	Wafer holder for semiconductor manufacturing device and semiconductor manufacturing device in which it is installed
US7207763B2 (en) *	2004-01-15	2007-04-24	Terasemicon Co., Ltd	Semiconductor manufacturing system and wafer holder for semiconductor manufacturing system
TW200917410A (en) *	2007-08-15	2009-04-16	Nikon Corp	Aligning apparatus, bonding apparatus, laminated substrate manufacturing apparatus, exposure apparatus and aligning method
TW200919626A (en) *	2007-10-25	2009-05-01	Topcon Corp	Wafer holder
TWI483339B (zh) *	2007-06-12	2015-05-01	尼康股份有限公司	Wafer bonding device, wafer bonding method, wafer detection device and wafer detection method

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH11261000A (ja)	1998-03-13	1999-09-24	Japan Science & Technology Corp	３次元半導体集積回路装置の製造方法
JP2005310939A (ja) *	2004-04-20	2005-11-04	Hitachi Cable Ltd	ウェハ接合用治具及びウェハ接合方法
JP2006332563A (ja) *	2005-05-30	2006-12-07	Nikon Corp	ウェハ搬送装置、ウェハ積層体搬送装置及び積層型半導体装置製造方法
JP2007115978A (ja)	2005-10-21	2007-05-10	Nikon Corp	加圧装置及び半導体装置の製造方法
JP4692238B2 (ja) *	2005-11-15	2011-06-01	株式会社ニコン	マスク収納容器開装置、露光装置
JP5098165B2 (ja) *	2005-12-08	2012-12-12	株式会社ニコン	ウェハの接合方法、接合装置及び積層型半導体装置の製造方法
WO2008114337A1 (ja) *	2007-02-22	2008-09-25	Shin-Etsu Engineering Co., Ltd.	真空貼り合わせ方法及び真空貼り合わせ装置
JP5561572B2 (ja) *	2007-08-30	2014-07-30	株式会社チユーオー	屋根上設置物の取付け用金物
TWI471971B (zh) *	2007-10-30	2015-02-01	尼康股份有限公司	Substrate holding member, substrate bonding apparatus, laminated substrate manufacturing apparatus, substrate bonding method, laminated substrate manufacturing method, and laminated semiconductor device manufacturing method
US8245751B2 (en)	2007-11-07	2012-08-21	Advanced Display Process Engineering Co., Ltd.	Substrate bonding apparatus
JP2009194264A (ja)	2008-02-18	2009-08-27	Nikon Corp	基板貼り合わせ装置
JPWO2009113317A1 (ja) *	2008-03-13	2011-07-21	株式会社ニコン	基板ホルダ、基板ホルダユニット、基板搬送装置および基板貼り合わせ装置
JP4786693B2 (ja) *	2008-09-30	2011-10-05	三菱重工業株式会社	ウェハ接合装置およびウェハ接合方法
US8276262B2 (en) *	2008-12-03	2012-10-02	Intel Corporation	Magnetically coupled thin-wafer handling system

2010
- 2010-12-20 EP EP10837305.1A patent/EP2515322A4/en not_active Withdrawn
- 2010-12-20 KR KR1020127018820A patent/KR101860956B1/ko active Active
- 2010-12-20 JP JP2011545995A patent/JP6051523B2/ja active Active
- 2010-12-20 WO PCT/JP2010/007383 patent/WO2011074274A1/ja not_active Ceased
- 2010-12-20 TW TW099144803A patent/TW201133700A/zh unknown
2012
- 2012-06-15 US US13/524,820 patent/US8863808B2/en active Active

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TWI264080B (en) *	2003-03-24	2006-10-11	Sumitomo Electric Industries	Wafer holder for semiconductor manufacturing device and semiconductor manufacturing device in which it is installed
US7207763B2 (en) *	2004-01-15	2007-04-24	Terasemicon Co., Ltd	Semiconductor manufacturing system and wafer holder for semiconductor manufacturing system
TWI483339B (zh) *	2007-06-12	2015-05-01	尼康股份有限公司	Wafer bonding device, wafer bonding method, wafer detection device and wafer detection method
TW200917410A (en) *	2007-08-15	2009-04-16	Nikon Corp	Aligning apparatus, bonding apparatus, laminated substrate manufacturing apparatus, exposure apparatus and aligning method
TW200919626A (en) *	2007-10-25	2009-05-01	Topcon Corp	Wafer holder

Also Published As

Publication number	Publication date
EP2515322A4 (en)	2017-03-01
TW201133700A (en)	2011-10-01
KR101860956B1 (ko)	2018-05-24
JPWO2011074274A1 (ja)	2013-04-25
EP2515322A1 (en)	2012-10-24
KR20120109561A (ko)	2012-10-08
JP6051523B2 (ja)	2016-12-27
WO2011074274A1 (ja)	2011-06-23
US20130008581A1 (en)	2013-01-10
US8863808B2 (en)	2014-10-21

Publication	Publication Date	Title
BRPI0925311A2 (zh)	2016-02-02
BR112012008195A2 (zh)	2021-11-03
BRPI0924307A2 (zh)	2017-08-22
BRPI1009562A2 (zh)	2016-03-22
BR112012008267A2 (zh)	2021-11-03
BR112012012396A2 (zh)	2021-11-03
BR112012012487A2 (zh)	2021-11-23
BR122017024704A2 (zh)	2011-02-03
BR112012012080A2 (zh)	2021-11-03
BRPI0924534A2 (zh)	2021-12-07
BR112012009797A2 (zh)	2017-09-05
BR112012009446A2 (zh)	2021-12-07
BR112012009703A2 (zh)	2017-09-05
BR112012010357A2 (zh)	2017-10-03
BR122019005883A2 (zh)	2019-09-03
BR112012014856A2 (zh)	2021-11-03
TWI562271B (zh)	2016-12-11
BR112012007672A2 (zh)	2017-09-12
BR112012005951A2 (zh)	2017-08-29
BR112012009404A2 (zh)	2017-09-05
BR112012007671A2 (zh)	2017-09-12
BR122017013721A2 (zh)	2011-06-30
BRPI0925022A2 (zh)	2016-02-02
BRPI0924617A2 (zh)	2017-07-11
BR112012016234A2 (zh)	2017-09-12