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TWI562266B - Apparatus for handling semiconductor packages and method of acquiring location information of semiconductor packages using the same - Google Patents

Apparatus for handling semiconductor packages and method of acquiring location information of semiconductor packages using the same

Info

Publication number
TWI562266B
TWI562266B TW104134762A TW104134762A TWI562266B TW I562266 B TWI562266 B TW I562266B TW 104134762 A TW104134762 A TW 104134762A TW 104134762 A TW104134762 A TW 104134762A TW I562266 B TWI562266 B TW I562266B
Authority
TW
Taiwan
Prior art keywords
semiconductor packages
location information
same
acquiring location
handling
Prior art date
Application number
TW104134762A
Other languages
English (en)
Other versions
TW201616591A (zh
Inventor
Kwang Hun Han
Jung Seob Lee
Original Assignee
Semes Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semes Co Ltd filed Critical Semes Co Ltd
Publication of TW201616591A publication Critical patent/TW201616591A/zh
Application granted granted Critical
Publication of TWI562266B publication Critical patent/TWI562266B/zh

Links

Classifications

    • H10P72/78—
    • H10P74/00—
    • H10P72/50—
    • H10P72/70—
TW104134762A 2014-10-24 2015-10-23 Apparatus for handling semiconductor packages and method of acquiring location information of semiconductor packages using the same TWI562266B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020140144755A KR101704124B1 (ko) 2014-10-24 2014-10-24 반도체 패키지 핸들링 장치 및 이를 이용하여 반도체 패키지들의 위치 정보를 획득하는 방법

Publications (2)

Publication Number Publication Date
TW201616591A TW201616591A (zh) 2016-05-01
TWI562266B true TWI562266B (en) 2016-12-11

Family

ID=55831118

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104134762A TWI562266B (en) 2014-10-24 2015-10-23 Apparatus for handling semiconductor packages and method of acquiring location information of semiconductor packages using the same

Country Status (3)

Country Link
KR (1) KR101704124B1 (zh)
CN (1) CN105552015B (zh)
TW (1) TWI562266B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108811327A (zh) * 2017-05-05 2018-11-13 苏州微影激光技术有限公司 一种pcb的真空吸附装置、方法及pcb曝光机
WO2018233825A1 (en) * 2017-06-21 2018-12-27 Hp Indigo B.V. VACUUM TABLES

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040200064A1 (en) * 2003-04-14 2004-10-14 Iszharudin Hassan Semiconductor chip pick and place process and equipment
US20050095100A1 (en) * 2002-11-11 2005-05-05 Cheol-Joon Yoo Method and apparatus for picking up a semiconductor chip, method and apparatus for removing a semiconductor chip from a dicing tape, and a method of forming a perforated dicing tape
US20060003491A1 (en) * 2004-07-05 2006-01-05 Goon-Woo Kim Apparatus for ejecting relatively thin IC chip from semiconductor wafer
US20110290427A1 (en) * 2007-06-19 2011-12-01 Hiroshi Maki Manufacturing method for semiconductor integrated device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100835977B1 (ko) * 2007-02-28 2008-06-09 주식회사 고려반도체시스템 웨이퍼 절삭 장치용 척 테이블 및 그 제어방법
KR101195827B1 (ko) * 2009-04-23 2012-11-05 세크론 주식회사 반도체 칩 패키지의 에지 검출 방법
KR101074458B1 (ko) * 2009-06-11 2011-10-18 세메스 주식회사 기판 가열 유닛 및 이를 포함하는 기판 처리 장치
KR101117256B1 (ko) * 2009-09-28 2012-03-16 송인직 가변형 진공흡착테이블
KR20110138879A (ko) * 2010-06-22 2011-12-28 삼성전기주식회사 광 픽업을 이용한 가공 오차 수정방법
JP5927490B2 (ja) * 2012-02-23 2016-06-01 パナソニックＩｐマネジメント株式会社 電子部品搭載方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050095100A1 (en) * 2002-11-11 2005-05-05 Cheol-Joon Yoo Method and apparatus for picking up a semiconductor chip, method and apparatus for removing a semiconductor chip from a dicing tape, and a method of forming a perforated dicing tape
US20040200064A1 (en) * 2003-04-14 2004-10-14 Iszharudin Hassan Semiconductor chip pick and place process and equipment
US20060003491A1 (en) * 2004-07-05 2006-01-05 Goon-Woo Kim Apparatus for ejecting relatively thin IC chip from semiconductor wafer
US20110290427A1 (en) * 2007-06-19 2011-12-01 Hiroshi Maki Manufacturing method for semiconductor integrated device
US20130299098A1 (en) * 2007-06-19 2013-11-14 Renesas Electronics Corporation Manufacturing method for semiconductor integrated device

Also Published As

Publication number Publication date
KR101704124B1 (ko) 2017-02-07
TW201616591A (zh) 2016-05-01
CN105552015A (zh) 2016-05-04
CN105552015B (zh) 2018-06-01
KR20160048370A (ko) 2016-05-04

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