TWI561791B - Heat dissipating structure and manufacturing method of same - Google Patents
Heat dissipating structure and manufacturing method of sameInfo
- Publication number
- TWI561791B TWI561791B TW104101002A TW104101002A TWI561791B TW I561791 B TWI561791 B TW I561791B TW 104101002 A TW104101002 A TW 104101002A TW 104101002 A TW104101002 A TW 104101002A TW I561791 B TWI561791 B TW I561791B
- Authority
- TW
- Taiwan
- Prior art keywords
- manufacturing
- same
- heat dissipating
- dissipating structure
- heat
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410791259.2A CN105764299B (zh) | 2014-12-19 | 2014-12-19 | 散热结构及其制作方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201623902A TW201623902A (zh) | 2016-07-01 |
| TWI561791B true TWI561791B (en) | 2016-12-11 |
Family
ID=56340438
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104101002A TWI561791B (en) | 2014-12-19 | 2015-01-12 | Heat dissipating structure and manufacturing method of same |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN105764299B (zh) |
| TW (1) | TWI561791B (zh) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107846810A (zh) | 2016-09-18 | 2018-03-27 | 鹏鼎控股(深圳)股份有限公司 | 散热结构及其制作方法及电子设备 |
| US10667428B1 (en) * | 2018-11-22 | 2020-05-26 | Htc Corporation | Heat dissipation module manufacturing method, heat dissipation module and electronic device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1383204A (zh) * | 2001-04-09 | 2002-12-04 | 古河电气工业株式会社 | 板式热管及其制造方法 |
| CN1949486A (zh) * | 2005-10-12 | 2007-04-18 | 索尼计算机娱乐公司 | 半导体装置、半导体装置的制作方法 |
| TW200817646A (en) * | 2006-07-28 | 2008-04-16 | Fuchigami Micro Co | Heat pipe and method of manufacturing it |
| US20110261539A1 (en) * | 2010-04-21 | 2011-10-27 | Rolston Kevin C | Adhesive reinforced open hole interconnect |
| CN103318838A (zh) * | 2013-05-24 | 2013-09-25 | 厦门大学 | 一种应用于微机电系统器件的真空封装方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101137280B (zh) * | 2007-07-17 | 2011-07-27 | 中国南车集团株洲电力机车研究所 | 一种大功率元件散热器的加工制作方法 |
| CN201787855U (zh) * | 2010-07-30 | 2011-04-06 | 索士亚科技股份有限公司 | 均温板的支撑结构及具有该结构的均温板 |
| CN201805671U (zh) * | 2010-09-29 | 2011-04-20 | 游明郎 | 具毛细构体的均温板 |
| CN103157964B (zh) * | 2011-12-13 | 2016-02-10 | 国研高能(北京)稳态传热传质技术研究院有限公司 | 一种铝烧结均温板的制作方法 |
| CN102854667B (zh) * | 2012-09-20 | 2017-05-17 | 京东方科技集团股份有限公司 | 一种液晶装置及其制造方法 |
| JP6031373B2 (ja) * | 2013-02-13 | 2016-11-24 | 日立コンシューマエレクトロニクス株式会社 | 光学部品の固定構造、光学部品の固定方法、光ピックアップ装置の製造方法、及びrgb3原色光源モジュール装置の製造方法 |
| CN203454876U (zh) * | 2013-08-29 | 2014-02-26 | 讯强电子(惠州)有限公司 | 均温板 |
-
2014
- 2014-12-19 CN CN201410791259.2A patent/CN105764299B/zh active Active
-
2015
- 2015-01-12 TW TW104101002A patent/TWI561791B/zh active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1383204A (zh) * | 2001-04-09 | 2002-12-04 | 古河电气工业株式会社 | 板式热管及其制造方法 |
| CN1949486A (zh) * | 2005-10-12 | 2007-04-18 | 索尼计算机娱乐公司 | 半导体装置、半导体装置的制作方法 |
| TW200817646A (en) * | 2006-07-28 | 2008-04-16 | Fuchigami Micro Co | Heat pipe and method of manufacturing it |
| US20110261539A1 (en) * | 2010-04-21 | 2011-10-27 | Rolston Kevin C | Adhesive reinforced open hole interconnect |
| CN103318838A (zh) * | 2013-05-24 | 2013-09-25 | 厦门大学 | 一种应用于微机电系统器件的真空封装方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201623902A (zh) | 2016-07-01 |
| CN105764299A (zh) | 2016-07-13 |
| CN105764299B (zh) | 2018-09-25 |
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