TWI560901B - Epitaxial structure - Google Patents

Epitaxial structure

Info

Publication number: TWI560901B
Authority: TW; Taiwan
Prior art keywords: epitaxial structure; epitaxial
Prior art date: 2012-04-25

Application number

TW101115891A

Other languages

English (en)

Other versions

TW201344946A (zh

Inventor

Yang Wei

Shou-Shan Fan

Original Assignee

Hon Hai Prec Ind Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2012-04-25

Filing date

2012-05-04

Publication date

2016-12-01

2012-05-04 Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd

2013-11-01 Publication of TW201344946A publication Critical patent/TW201344946A/zh

2016-12-01 Application granted granted Critical

2016-12-01 Publication of TWI560901B publication Critical patent/TWI560901B/zh

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/82—Heterojunctions
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/881—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being a two-dimensional material
- H10D62/882—Graphene
- H10P14/2901—
- H10P14/3202—
- H10P14/3206—
- H10P14/3248—
- H10P14/3256—
- H10P14/3402—
- H10P14/36—

TW101115891A 2012-04-25 2012-05-04 Epitaxial structure TWI560901B (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
CN201210122545.0A CN103378239B (zh)	2012-04-25	2012-04-25	外延结构体

Publications (2)

Publication Number	Publication Date
TW201344946A TW201344946A (zh)	2013-11-01
TWI560901B true TWI560901B (en)	2016-12-01

Family

ID=49463077

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW101115891A TWI560901B (en)	2012-04-25	2012-05-04	Epitaxial structure

Country Status (3)

Country	Link
US (1)	US9231060B2 (zh)
CN (1)	CN103378239B (zh)
TW (1)	TWI560901B (zh)

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WO2015126139A1 (en) *	2014-02-19	2015-08-27	Samsung Electronics Co., Ltd.	Wiring structure and electronic device employing the same
KR102809444B1 (ko)	2015-09-08	2025-05-19	메사추세츠 인스티튜트 오브 테크놀로지	그래핀-기반 층 전달 시스템 및 방법
JP2020500424A (ja) *	2016-11-08	2020-01-09	マサチューセッツインスティテュートオブテクノロジー	層転写のための転位フィルタ処理のためのシステムおよび方法
US10825952B2 (en)	2017-01-16	2020-11-03	Apple Inc.	Combining light-emitting elements of differing divergence on the same substrate
US11381060B2 (en)	2017-04-04	2022-07-05	Apple Inc.	VCSELs with improved optical and electrical confinement
CN107083540B (zh) *	2017-04-18	2019-04-16	大连理工大学	一种柔性聚酰亚胺衬底上的氮化镓基薄膜及其制备方法
US20200286786A1 (en) *	2017-11-14	2020-09-10	Massachusetts Institute Of Technology	Epitaxial growth and transfer via patterned two-dimensional (2d) layers
EP3496131B1 (en) *	2017-12-05	2023-06-21	IMEC vzw	Method for forming a semiconductor structure and a semiconductor structure manufactured thereof
US20210125826A1 (en)	2018-06-22	2021-04-29	Massachusetts Institute Of Technology	Systems and methods for growth of silicon carbide over a layer comprising graphene and/or hexagonal boron nitride and related articles
CN119050806A (zh)	2019-02-21	2024-11-29	苹果公司	具有电介质dbr的磷化铟vcsel
CN113711450B (zh)	2019-04-01	2025-02-18	苹果公司	具有紧密节距和高效率的vcsel阵列
US11374381B1 (en)	2019-06-10	2022-06-28	Apple Inc.	Integrated laser module
WO2021026751A1 (zh) *	2019-08-13	2021-02-18	苏州晶湛半导体有限公司	氮化物半导体衬底的制作方法
CN111613697B (zh) *	2020-05-22	2020-11-27	山西穿越光电科技有限责任公司	一种含有石墨烯插层的GaN/AlGaN超晶格薄膜及其制备方法
DE102020128628A1 (de)	2020-05-28	2021-12-02	Taiwan Semiconductor Manufacturing Co. Ltd.	Halbleiterbauelement mit zweidimensionalen materialien
US12494618B2 (en)	2022-09-14	2025-12-09	Apple Inc.	Vertical emitters with integrated final-stage transistor switch

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TW200532776A (en) *	2004-03-17	2005-10-01	Sumitomo Electric Industries	Method of manufacturing single-crystal GaN substrate, and single-crystal GaN substrate
TW201133832A (en) *	2009-11-10	2011-10-01	jian-min Song	Substantially lattice matched semiconductor materials and associated methods
WO2012057517A2 (ko) *	2010-10-26	2012-05-03	주식회사 엘지실트론	화합물 반도체 장치 및 화합물 반도체 제조방법

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US8368118B2 (en)	2008-12-16	2013-02-05	Hewlett-Packard Development Company, L.P.	Semiconductor structure having an ELOG on a thermally and electrically conductive mask
US8409366B2 (en) *	2009-06-23	2013-04-02	Oki Data Corporation	Separation method of nitride semiconductor layer, semiconductor device, manufacturing method thereof, semiconductor wafer, and manufacturing method thereof
US8404588B2 (en) *	2010-10-06	2013-03-26	Electronics And Telecommunications Research Institute	Method of manufacturing via electrode
CN102683209B (zh) *	2011-03-18	2015-01-21	中国科学院微电子研究所	一种半导体器件及其制造方法
CN102201503A (zh) *	2011-03-30	2011-09-28	苏州纳维科技有限公司	一种iii族氮化物衬底的生长方法、衬底以及led

2012
- 2012-04-25 CN CN201210122545.0A patent/CN103378239B/zh active Active
- 2012-05-04 TW TW101115891A patent/TWI560901B/zh active
- 2012-12-13 US US13/713,567 patent/US9231060B2/en active Active

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TW200532776A (en) *	2004-03-17	2005-10-01	Sumitomo Electric Industries	Method of manufacturing single-crystal GaN substrate, and single-crystal GaN substrate
TW201133832A (en) *	2009-11-10	2011-10-01	jian-min Song	Substantially lattice matched semiconductor materials and associated methods
WO2012057517A2 (ko) *	2010-10-26	2012-05-03	주식회사 엘지실트론	화합물 반도체 장치 및 화합물 반도체 제조방법

Also Published As

Publication number	Publication date
US20130285115A1 (en)	2013-10-31
US9231060B2 (en)	2016-01-05
CN103378239B (zh)	2016-06-08
TW201344946A (zh)	2013-11-01
CN103378239A (zh)	2013-10-30

Publication	Publication Date	Title
ZA201503358B (en)	2016-08-31	Structure
DK3327112T3 (en)	2020-05-04	Agse-deficient stamme
DK2830816T3 (en)	2020-02-17	Hidtil ukendt coatingkoncept
TWI560901B (en)	2016-12-01	Epitaxial structure
EP2935220A4 (en)	2016-04-27	PERI-carbinol
GB201411223D0 (en)	2014-08-06	None
GB201319035D0 (en)	2013-12-11	Spolier structure
EP2920142A4 (en)	2016-08-10	MÉTHANOFULLERRÈNES
GB201903206D0 (en)	2019-04-24	n
HUP1300640A2 (en)	2014-05-28	Belt-mounting structure
EP2871919A4 (en)	2015-10-14	STRUCTURE
GB2504611B (en)	2016-07-13	Fastened Structure
GB2500883B (en)	2015-05-27	Improved saw-horse
GB201203307D0 (en)	2012-04-11	Remvox
ZA201305187B (en)	2014-04-30	Improved brattice
GB201410091D0 (en)	2014-07-23	None
GB201223361D0 (en)	2013-02-06	Combines
GB201223358D0 (en)	2013-02-06	Combines
AU345893S (en)	2012-12-04	Treehouse
GB201210088D0 (en)	2012-07-25	Odontalgic preparation
GB201203507D0 (en)	2012-04-11	Keynut
GB201203440D0 (en)	2012-04-11	Blu-seals
GB201203453D0 (en)	2012-04-11	TVtidy
GB201203045D0 (en)	2012-04-04	Chrismar
GB201202980D0 (en)	2012-04-04	Stop-love