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TWI560764B - Pick up device and pick up method of semiconductor die - Google Patents

Pick up device and pick up method of semiconductor die

Info

Publication number
TWI560764B
TWI560764B TW104101196A TW104101196A TWI560764B TW I560764 B TWI560764 B TW I560764B TW 104101196 A TW104101196 A TW 104101196A TW 104101196 A TW104101196 A TW 104101196A TW I560764 B TWI560764 B TW I560764B
Authority
TW
Taiwan
Prior art keywords
pick
semiconductor die
die
semiconductor
Prior art date
Application number
TW104101196A
Other languages
Chinese (zh)
Other versions
TW201533794A (en
Inventor
Kazuaki Nagano
Yoshifumi Katayama
Hiroki Toyoda
Takeshi Ishizuka
Shinsuke Fukumoto
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of TW201533794A publication Critical patent/TW201533794A/en
Application granted granted Critical
Publication of TWI560764B publication Critical patent/TWI560764B/en

Links

Classifications

    • H10P72/0442—
    • H10P72/7402—
    • H10W72/0711—
    • H10P72/742—
    • H10P72/7428—
TW104101196A 2014-02-24 2015-01-14 Pick up device and pick up method of semiconductor die TWI560764B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014033351 2014-02-24
JP2014225729A JP6349496B2 (en) 2014-02-24 2014-11-06 Semiconductor die pickup apparatus and pickup method

Publications (2)

Publication Number Publication Date
TW201533794A TW201533794A (en) 2015-09-01
TWI560764B true TWI560764B (en) 2016-12-01

Family

ID=53877914

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104101196A TWI560764B (en) 2014-02-24 2015-01-14 Pick up device and pick up method of semiconductor die

Country Status (6)

Country Link
JP (1) JP6349496B2 (en)
KR (1) KR102043120B1 (en)
CN (1) CN105900225B (en)
SG (1) SG11201607050YA (en)
TW (1) TWI560764B (en)
WO (1) WO2015125385A1 (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6707396B2 (en) * 2016-05-11 2020-06-10 株式会社ディスコ Cutting equipment
JP6621771B2 (en) * 2017-01-25 2019-12-18 ファスフォードテクノロジ株式会社 Semiconductor manufacturing apparatus and semiconductor device manufacturing method
CN106768991B (en) * 2017-03-10 2020-04-07 东莞市凯格精机股份有限公司 Method for finely detecting working state of suction nozzle
WO2019008674A1 (en) * 2017-07-04 2019-01-10 株式会社Ｆｕｊｉ Component mounting device
KR102037967B1 (en) * 2018-05-30 2019-10-29 세메스 주식회사 Die bonding method
TWI716925B (en) * 2018-07-06 2021-01-21 日商新川股份有限公司 Pickup system for semiconductor die
TWI745710B (en) * 2018-07-06 2021-11-11 日商新川股份有限公司 Pickup system for semiconductor die
JP6627001B1 (en) * 2019-01-21 2019-12-25 株式会社東京精密 Wafer peeling cleaning equipment
JP7237655B2 (en) * 2019-03-01 2023-03-13 ファスフォードテクノロジ株式会社 Semiconductor manufacturing equipment and semiconductor device manufacturing method
JP7135959B2 (en) * 2019-03-22 2022-09-13 株式会社デンソー pickup device
JP7274902B2 (en) * 2019-03-25 2023-05-17 ファスフォードテクノロジ株式会社 Semiconductor manufacturing equipment and semiconductor device manufacturing method
KR102202080B1 (en) * 2019-07-02 2021-01-12 세메스 주식회사 Collet exchange method, die transfer method and die bonding method
JP7377654B2 (en) * 2019-09-17 2023-11-10 ファスフォードテクノロジ株式会社 Die bonding equipment, peeling unit, collet and semiconductor device manufacturing method
KR102635493B1 (en) * 2020-11-04 2024-02-07 세메스 주식회사 Apparatus for transferring die in bonding equipment and method thereof
KR102840340B1 (en) * 2021-02-17 2025-07-31 가부시키가이샤 신가와 Semiconductor die pickup device and pickup method
KR102570798B1 (en) * 2021-11-10 2023-08-30 세메스 주식회사 Apparatus for picking up semiconductor devices and method of controlling operations of the same
CN115312430B (en) * 2022-08-23 2024-09-03 深圳市易达凯电子有限公司 A special packaging equipment for producing insulated gate bipolar transistor chips

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201001566A (en) * 2008-06-24 2010-01-01 Powertech Technology Inc Jig and method for picking up a die
TW201001614A (en) * 2008-06-30 2010-01-01 Shinkawa Kk Semiconductor die pickup apparatus and semiconductor die pickup method
TW201033100A (en) * 2009-03-05 2010-09-16 Shinkawa Kk Apparatus and method for picking up semiconductor die

Family Cites Families (12)

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Publication number Priority date Publication date Assignee Title
JPS4945339A (en) 1972-09-08 1974-04-30
JPS62210635A (en) * 1986-03-12 1987-09-16 Hitachi Yonezawa Denshi Kk Method and apparatus for isolating article
JP2004226250A (en) * 2003-01-23 2004-08-12 Mitsubishi Electric Corp Optical fiber displacement sensor and displacement control device using the same
JP2004228513A (en) * 2003-01-27 2004-08-12 Matsushita Electric Ind Co Ltd Electronic component transfer device
KR100817068B1 (en) * 2006-10-24 2008-03-27 삼성전자주식회사 Thin semiconductor chip pickup device and method
JP2009064937A (en) * 2007-09-06 2009-03-26 Shinkawa Ltd Semiconductor die pickup apparatus and pickup method
US20090075459A1 (en) * 2007-09-06 2009-03-19 Kabushiki Kaisha Shinkawa Apparatus and method for picking-up semiconductor dies
KR101394390B1 (en) * 2008-07-24 2014-05-14 세메스 주식회사 Apparatus for picking up a semiconductor device
US8141612B2 (en) * 2009-04-02 2012-03-27 Asm Assembly Automation Ltd Device for thin die detachment and pick-up
US8092645B2 (en) * 2010-02-05 2012-01-10 Asm Assembly Automation Ltd Control and monitoring system for thin die detachment and pick-up
JP4927979B2 (en) * 2010-09-28 2012-05-09 株式会社新川 Semiconductor die pick-up device and semiconductor die pick-up method using the device
JP2012156517A (en) * 2012-03-05 2012-08-16 Renesas Electronics Corp Manufacturing method of semiconductor integrated circuit device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201001566A (en) * 2008-06-24 2010-01-01 Powertech Technology Inc Jig and method for picking up a die
TW201001614A (en) * 2008-06-30 2010-01-01 Shinkawa Kk Semiconductor die pickup apparatus and semiconductor die pickup method
TW201033100A (en) * 2009-03-05 2010-09-16 Shinkawa Kk Apparatus and method for picking up semiconductor die

Also Published As

Publication number Publication date
KR102043120B1 (en) 2019-11-12
WO2015125385A1 (en) 2015-08-27
TW201533794A (en) 2015-09-01
CN105900225B (en) 2019-01-22
KR20150145255A (en) 2015-12-29
SG11201607050YA (en) 2016-10-28
JP2015173250A (en) 2015-10-01
JP6349496B2 (en) 2018-07-04
CN105900225A (en) 2016-08-24

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