TWI560255B - Pressure sensitive adhesive, pressure sensitive adhesive sheet, and electronic device - Google Patents
Pressure sensitive adhesive, pressure sensitive adhesive sheet, and electronic deviceInfo
- Publication number
- TWI560255B TWI560255B TW101105237A TW101105237A TWI560255B TW I560255 B TWI560255 B TW I560255B TW 101105237 A TW101105237 A TW 101105237A TW 101105237 A TW101105237 A TW 101105237A TW I560255 B TWI560255 B TW I560255B
- Authority
- TW
- Taiwan
- Prior art keywords
- sensitive adhesive
- pressure sensitive
- electronic device
- adhesive sheet
- sheet
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- H10P90/00—
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Position Input By Displaying (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011056983A JP5712706B2 (ja) | 2011-03-15 | 2011-03-15 | 粘着剤、粘着シートおよびディスプレイ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201237135A TW201237135A (en) | 2012-09-16 |
| TWI560255B true TWI560255B (en) | 2016-12-01 |
Family
ID=46808661
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101105237A TWI560255B (en) | 2011-03-15 | 2012-02-17 | Pressure sensitive adhesive, pressure sensitive adhesive sheet, and electronic device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5712706B2 (zh) |
| KR (1) | KR101890713B1 (zh) |
| CN (1) | CN102676092B (zh) |
| TW (1) | TWI560255B (zh) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5790089B2 (ja) * | 2011-03-31 | 2015-10-07 | Dic株式会社 | 両面粘着テープ |
| JP6057693B2 (ja) * | 2012-12-17 | 2017-01-11 | 藤森工業株式会社 | 粘着剤層、及び粘着フィルム |
| CN103087503B (zh) * | 2013-01-14 | 2015-04-01 | 徐广敏 | 一种电子灌封胶及其制备方法 |
| JP6130246B2 (ja) * | 2013-06-28 | 2017-05-17 | リンテック株式会社 | 粘着性組成物、粘着剤および粘着シート |
| JP6442879B2 (ja) * | 2013-06-28 | 2018-12-26 | 三菱ケミカル株式会社 | 積層防湿フィルム |
| JP6130245B2 (ja) * | 2013-06-28 | 2017-05-17 | リンテック株式会社 | 粘着性組成物、粘着剤および粘着シート |
| JP6325778B2 (ja) * | 2013-06-28 | 2018-05-16 | リンテック株式会社 | 粘着シートおよび積層体 |
| JP2015193706A (ja) * | 2014-03-31 | 2015-11-05 | リンテック株式会社 | 導電性基板用表面保護フィルムの製造方法 |
| CN104175697B (zh) * | 2014-07-04 | 2016-01-27 | 京东方科技集团股份有限公司 | 偏光片的贴附方法、偏光片单元及显示装置 |
| WO2016111526A1 (ko) | 2015-01-06 | 2016-07-14 | 엘지전자 주식회사 | 방송 신호 송신 장치, 방송 신호 수신 장치, 방송 신호 송신 방법, 및 방송 신호 수신 방법 |
| TW201823015A (zh) * | 2015-03-31 | 2018-07-01 | 日商住友化學股份有限公司 | 光學積層體、液晶顯示裝置、黏著劑組成物及光學膜 |
| JP5956044B1 (ja) * | 2015-10-07 | 2016-07-20 | 住友化学株式会社 | 光学積層体及び液晶表示装置 |
| JP7112227B2 (ja) * | 2017-03-31 | 2022-08-03 | 積水化学工業株式会社 | アクリル系粘着剤組成物及び粘着シート |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200600558A (en) * | 2004-04-30 | 2006-01-01 | Sumitomo Chemical Co | Acrylic resin composition |
| TW200842171A (en) * | 2006-12-06 | 2008-11-01 | Nitto Denko Corp | Removable pressure-sensitive adhesive composition and pressure-sensitive adhesive tape or sheet |
| TW201006905A (en) * | 2008-07-31 | 2010-02-16 | Lintec Corp | Adhesive sheet |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4788937B2 (ja) | 2001-05-07 | 2011-10-05 | 綜研化学株式会社 | 粘着剤組成物及び該組成物を用いたディスプレイ用粘着シート |
| JP4534431B2 (ja) * | 2003-04-30 | 2010-09-01 | 東洋インキ製造株式会社 | 粘着剤およびそれを用いた光学部材 |
| JP5299804B2 (ja) | 2004-08-03 | 2013-09-25 | 綜研化学株式会社 | 金属貼着用粘着シート |
| JP2007297452A (ja) * | 2006-04-28 | 2007-11-15 | Daio Paper Corp | 粘着シート |
| JP4931197B2 (ja) * | 2006-08-24 | 2012-05-16 | リケンテクノス株式会社 | 粘着剤組成物およびそれを用いた粘着シート部材 |
| JP4531099B2 (ja) | 2007-09-06 | 2010-08-25 | 日東電工株式会社 | 粘着剤組成物及びそれを用いた粘着製品、ディスプレイ |
| JPWO2011024925A1 (ja) | 2009-08-28 | 2013-01-31 | 日東電工株式会社 | 粘着テープまたはシート用基材、および、粘着テープまたはシート |
| JP5715955B2 (ja) | 2009-09-01 | 2015-05-13 | 綜研化学株式会社 | 光学部材用放射線硬化型粘着剤組成物および粘着型光学部材 |
-
2011
- 2011-03-15 JP JP2011056983A patent/JP5712706B2/ja active Active
-
2012
- 2012-02-17 TW TW101105237A patent/TWI560255B/zh active
- 2012-03-06 CN CN201210058416.XA patent/CN102676092B/zh active Active
- 2012-03-06 KR KR1020120022728A patent/KR101890713B1/ko active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200600558A (en) * | 2004-04-30 | 2006-01-01 | Sumitomo Chemical Co | Acrylic resin composition |
| TW200842171A (en) * | 2006-12-06 | 2008-11-01 | Nitto Denko Corp | Removable pressure-sensitive adhesive composition and pressure-sensitive adhesive tape or sheet |
| TW201006905A (en) * | 2008-07-31 | 2010-02-16 | Lintec Corp | Adhesive sheet |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20120105361A (ko) | 2012-09-25 |
| JP5712706B2 (ja) | 2015-05-07 |
| TW201237135A (en) | 2012-09-16 |
| CN102676092A (zh) | 2012-09-19 |
| CN102676092B (zh) | 2016-03-16 |
| JP2012193248A (ja) | 2012-10-11 |
| KR101890713B1 (ko) | 2018-08-22 |
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