TWI559390B - Equipment for cutting off electronic parts and cutting method - Google Patents

Description

Cutting device and cutting method for manufacturing electronic parts

The present invention relates to a cutting device and a cutting method for manufacturing an electronic component which are used when a plurality of electronic components are manufactured by cutting a workpiece on a predetermined cutting line.

In the production of an electronic component, a technique of using a rotary blade (rotary blade) to cut a workpiece into a plurality of electronic components by singulation is widely practiced (for example, refer to Patent Document 1). As a workpiece (cut object), a semiconductor wafer (a silicon wafer, a compound semiconductor wafer, or the like) containing a circuit as a functional portion for generating an electrical function is exemplified. Secondly, a substrate (ceramic substrate or the like) including a plurality of passive elements (functional portions) such as active elements and resistive elements may be cited. Thirdly, a package substrate having a substrate, a wafer-shaped member (functional portion) respectively mounted on a plurality of regions of the substrate, and a package resin formed in a flat shape so as to cover a plurality of regions collectively may be mentioned. . In the package substrate, a plurality of wafer-shaped members are collectively packaged.

The substrate included in the package substrate includes a lead frame made of copper or an iron-based alloy or the like, and a printed circuit board (printed wiring board) made of a glass epoxy laminate or a copper-clad polyimide film laminate. Further, the substrate includes a ceramic substrate made of alumina, tantalum carbide or sapphire, a metal base substrate made of a metal such as copper or aluminum, and a film base substrate made of a polyimide film or the like. . The wafer-shaped member includes a semiconductor integrated circuit (hereinafter referred to as IC) and optical, respectively. Semiconductor components, transistors, diodes, resistors, capacitors, and thermistors. A wafer-like member may be mounted in one region of the substrate, or a plurality of wafer-shaped members may be mounted. The plurality of wafer-like members mounted on one region may be of the same type or different types. As the encapsulating resin, for example, a cured resin obtained by curing a thermosetting resin such as an epoxy resin or an fluorenone resin is used.

Conventionally, a linear scale has been used in order to determine the cutting position of the substrate. The linear scale is composed of a special crystallized glass having a small coefficient of linear expansion, and is, for example, a length measuring reference member in which a plurality of detected lines having a width of 1 μm are formed at intervals of 1 μm (for example, refer to the fourth aspect of Patent Document 1). Page and Figure 1).

Hereinafter, a technique of cutting the semiconductor wafer W as a workpiece will be described with reference to FIG. 1 of Patent Document 1. In addition, Patent Document 1 will be described below with reference to FIG. 4 of the present specification, which is the same as FIG. 1 of Patent Document 1. According to this prior art, a guide rail 16 is fixed to the upper wall of the main base 2. The horizontal portion 12 of the movable support base 6 is slidably attached along the guide rail 16. A pulse motor 22 and an externally threaded rod 20 extending horizontally connected to the output shaft of the pulse motor 22 are disposed on the main base 2. A block 27 is screwed onto the externally threaded rod 20. The upper surface of the block 27 is fixed to the lower surface of the horizontal portion of the movable support base 6. When the pulse motor 22 is operated to rotate the externally threaded rod 20, the movable supporting base 6 fixed on the block 27 is moved in the horizontal direction (the horizontal direction in Fig. 4) along the guide rail 16.

A linear ruler 30 is disposed on the bottom wall of the main base 2. A hanging piece 34 that protrudes downward is fixed to a horizontal portion of the movable support base 6. A photoelectric detector 36 for detecting a detected line of the linear scale 30 is attached to the hanging piece 34. When the movable supporting base 6 moves by 1 μm along the guide rail 16, the photoelectric detector 36 detects a detected line of the linear scale 30 and generates a detected line. Pulse signal. The generated pulse signal is used to control the movement of the movable support base 6.

A cylindrical support member 10 is attached to the movable support base 6. A bearing member 60 is fixed to the left end of the support member 10 at the free end. A rotating shaft 62 is rotatably attached to the bearing member 60. The left end portion of the rotating shaft 62 protrudes beyond the bearing member 60, and a cutting blade 68 having a thin circular plate shape is fixed at the front end thereof. A drive source 70 composed of a motor or the like rotates the rotary shaft 62. A mounting bracket 90 is fixed to the bearing member 60, and a length measuring reference member 92 is supported by the mounting bracket 90. It is conceivable that the length measuring reference member 92 is a linear ruler. A protruding piece 34 is fixed to a proximal end portion of the support member 10, that is, a right end portion, and a photoelectric detector 96 for detecting a detected line of the length measuring reference member 92 is attached to the protruding piece 34.

The photoelectric detector 96 detects a length change, that is, a linear expansion amount, of the support member 10 caused by linear expansion (ie, thermal expansion or thermal contraction) in the left-right direction in FIG. 4 based on the length measuring reference member 92. The signal generated by the photoelectric detector 96, that is, the signal indicating the length change of the support member 10 caused by the linear expansion in the left-right direction in FIG. 4 is supplied to the control mechanism 86. The control mechanism 86 compensates for the positional movement of the cutting blade 68 based on the signal supplied from the photoelectric detector 96, and compensates for the operational control of the driving source 22 of the driving mechanism 18 in more detail.

Patent Document 1: Japanese Patent Laid-Open No. 62-173147 (pages 3-9, Fig. 1)

In recent years, in order to reduce the price of electronic components, it is desired to increase the number of electronic components (the number of taken-outs) manufactured from a single substrate. In order to cope with such a demand, the substrate is increased in size and the electronic components are miniaturized. The tendency is getting stronger and stronger. In the enlargement of the substrate, first, for a germanium wafer having a substantially circular shape, the wafer diameter is increased from 5 inches (about 150 mm) to 200 mm to 300 mm, and further, it is expected to adopt a diameter of 450 mm in the future. Wafer. Second, for the substrate used in the package substrate, it has a size of about 60×240 mm. The substrate of the size was developed to have a substrate size of 100 x 300 mm. Further, there is a prediction that a substrate having a size of 300 × 300 mm and 380 × 380 mm will be developed in the future. In the case of a package substrate, it is also expected to use a substantially circular substrate having a size of 300 mm to 450 mm in diameter.

As the size of the substrate increases and the size of the electronic component is reduced, the following problems occur. The first problem is as follows: Since the linear scale needs to be lengthened due to the enlargement of the substrate, the price of the linear ruler becomes high. The second problem is as follows: since the time during which the cutting blade 68 continuously cuts the substrate (the semiconductor wafer W in Patent Document 1) becomes long, the driving source 70 heats the support member 10, thereby increasing the support member 10. The amount of thermal expansion. Therefore, it is necessary to have a linear scale for compensating for the positional movement of the cutting blade 68 (the length measuring reference member 92 in Patent Document 1). Therefore, a combination of two sets of linear scales and a photoelectric detector is required. These two problems hinder the low price of the cutting device.

The third problem is that the length of the cutting line of each of the substrates is increased in accordance with the increase in the size of the substrate and the miniaturization of the electronic components. Therefore, the moving distance of the movable supporting base 6 in Patent Document 1 is increased. Thereby, the amount of heat generation of the externally threaded rod 20 in Patent Document 1 is increased. This makes the holding mechanism 72 for holding the semiconductor wafer W in Patent Document 1 easy to thermally expand. The combination of the linear scale and the photoelectric detector is not provided in the holding mechanism 72. Therefore, when the size of the holding mechanism 72 fluctuates due to thermal expansion, it is difficult to correct the fluctuation of the size.

The fourth problem is that the number of times the cutting line of each of the substrates is increased is increased by the increase in the size of the substrate and the increase in the number of taken-out sheets, thereby increasing the number of times the position of the cutting blade 68 is compensated for. This increases the time required for the compensation and thus hinders the efficiency of the cutting step.

In view of the above problems, the object of the present invention is to adopt a simple structure. A cutting device and a cutting method for manufacturing a low-cost and efficient electronic component are provided.

In order to solve the above problems, the cutting device for manufacturing an electronic component according to the present invention has a workpiece including a plurality of positioning marks and a plurality of regions and a functional portion provided in each of the plurality of regions, along the plural A dividing line of a plurality of regions is used for cutting a plurality of electronic components, and includes: a stage for fixing the workpiece; a cutting portion; and a driving portion for opposing the stage and the cutting portion Moving; the driven member is mounted with the cutting portion and driven by the driving portion; the imaging portion is for imaging the workpiece; and the control portion controls at least movement caused by the driving mechanism, and the electronic component manufacturing The cutting device according to the invention is characterized in that: the length measuring reference member is integrally fixed to the stage and is made of a low thermal expansion material; and at least two reference marks are provided on the length measuring reference member. The imaging unit is integrally fixed to the cutting unit, and the second reference in the coordinate system having the first reference mark of the reference mark as an origin The coordinates are known, the imaging unit captures the first reference mark, the imaging unit captures a first one of the plurality of positioning marks, and the control unit is based on the imaging unit at the time of capturing the first reference mark a position and a position of the imaging unit at the time of capturing the first positioning mark, calculating a coordinate of the first positioning mark in the coordinate system, the imaging unit capturing the second reference mark, and the imaging unit capturing the plurality of positioning a second positioning mark in the mark, wherein the control unit calculates the coordinate system based on a position of the imaging unit at a time point when the second reference mark is captured and a position of the imaging unit at a time point when the second positioning mark is captured a coordinate of the second positioning mark in the middle, wherein the control unit performs a cutting line and a rotary knife to be cut in a boundary line between the plurality of regions based on a coordinate of the first positioning mark and a coordinate of the second positioning mark Counterpoint.

Further, the cutting device for manufacturing an electronic component of the present invention is in the above-described cutting device In the meantime, the imaging unit is also an imaging unit that performs imaging to inspect the cutting quality on the cutting line after cutting the workpiece on the cutting line.

Further, in the cutting device for manufacturing an electronic component according to the present invention, the cutting device includes: a spindle; a rotation shaft of the spindle; and a rotation shaft fixed to the rotation shaft Rotating knife on.

Further, in the cutting device for manufacturing an electronic component according to the present invention, in the cutting device described above, the cutting portion has a laser irradiation mechanism.

Further, in the cutting device for manufacturing an electronic component according to the present invention, the low thermal expansion material is any one of a glass-based material, a ceramic-based material, and an alloy.

Further, in the cutting device for manufacturing an electronic component according to the present invention, the at least two reference marks are formed by etching, machining, or printing.

In order to solve the above problem, the cutting method for manufacturing an electronic component according to the present invention uses a cutting portion to form a workpiece including a plurality of positioning marks and a plurality of regions, and a functional portion provided in each of the plurality of regions. a plurality of electronic components are manufactured by cutting along a boundary line of a plurality of regions, and the cutting method for manufacturing the electronic component includes a step of preparing a stage for fixing the workpiece; In the step of the long reference member, the length measuring reference member is made of a low thermal expansion material, is integrally fixed to the stage, and has at least two reference marks; and an imaging unit that is integrally fixed to the cutting portion a step of knowing in advance the coordinates of the second reference mark in the coordinate system with the first reference mark in the reference mark as the origin; and fixing the workpiece to the step on the stage a first step of photographing the first fiducial mark using the image capturing unit; a second step of photographing the first one of the plurality of positioning marks using the image capturing unit; and the image capturing unit based on the first step And a position of the imaging unit in the second step, a step of calculating a coordinate of the first positioning mark in the coordinate system; a third step of capturing a second reference mark using the imaging unit; and using the imaging unit a fourth step of capturing a second one of the plurality of positioning marks; calculating the foregoing in the coordinate system based on a position of the imaging unit in the third step and a position of the imaging unit in the fourth step a step of positioning the coordinates of the second positioning mark; and aligning the cutting line to be cut in the boundary line of the plurality of areas and the cutting portion based on the coordinates of the first positioning mark and the coordinates of the second positioning mark And a step of cutting the workpiece on the cutting line.

Further, in the cutting method for manufacturing an electronic component according to the present invention, the cutting method of the present invention further includes: after the step of cutting the workpiece, the inspection unit is used to inspect the cutting The step of cutting quality on the line.

Further, in the cutting method for manufacturing an electronic component according to the present invention, the cutting unit includes a spindle, a rotation shaft of the spindle, and a rotation fixed to the rotation shaft. In the step of aligning the knives, the knives are aligned with the rotating knives, and in the step of cutting, the rotating knives are brought into contact with the workpiece.

Further, in the cutting method for manufacturing an electronic component according to the present invention, the cutting unit includes a laser irradiation mechanism, and in the step of performing the alignment, the laser irradiation mechanism The irradiated laser is aligned with the cutting line, and in the step of performing the cutting, the workpiece is irradiated with a laser.

Further, in the cutting method for producing an electronic component according to the present invention, the low thermal expansion material is any one of a glass-based material, a ceramic-based material, and an alloy.

Further, in the cutting method for manufacturing an electronic component according to the present invention, the cutting method according to the present invention, further comprising: etching, machining, or printing before the step of preparing the length measuring reference member A step of forming the aforementioned at least two fiducial marks.

According to the invention, at least two reference marks provided on the length measuring reference member and the length measuring reference member which are fixed to the stage and are made of a low thermal expansion material are provided. The coordinates of the second fiducial mark in the coordinate system with the first fiducial mark in the fiducial mark as the origin are known. The coordinates of the first positioning mark in the coordinate system are calculated based on the position of the imaging unit at the time point when the first reference mark is captured and the position of the imaging unit at the time point when the first positioning mark is captured on the substrate. The coordinates of the second positioning mark in the coordinate system are calculated based on the position of the imaging unit at the time point when the second reference mark is captured and the position of the imaging unit at the time point when the second positioning mark is captured on the substrate. The cutting line to be cut in the plurality of dividing lines and the rotary knife are aligned based on the coordinates of the first positioning mark and the coordinates of the second positioning mark. According to this configuration, the coordinates of the second reference mark in the coordinate system whose origin is the first reference mark are hardly affected by thermal expansion. Therefore, the coordinates of the first positioning mark and the coordinates of the second positioning mark in the coordinate system can be accurately determined. The cutting line and the rotary knife are aligned based on the coordinates of the first positioning mark and the coordinates of the second positioning mark respectively provided on the substrate. Thereby, the distance between the first positioning mark and the second positioning mark can be accurately measured without using a linear ruler, and the workpiece can be cut with high precision.

According to the present invention, a length measuring reference member fixed to a stage and composed of a low thermal expansion material and at least two reference marks provided on the length measuring reference member are used. Thereby, even when the stage is heated and thermally expanded, the coordinates of the second reference mark in the coordinate system whose origin is the first reference mark are hardly affected by thermal expansion. Therefore, it is possible to suppress a phenomenon in which the accuracy of cutting the workpiece is lowered by the influence of thermal expansion of the stage.

According to the present invention, each of the reference marks and each of the positioning marks is imaged using an imaging unit that is integrally fixed to the cutting unit, and the coordinates of the first positioning mark and the second positioning mark are calculated based on the positions of the imaging units at the time of imaging, respectively. The coordinates of the coordinates. Thereby, it is not necessary to compensate for the positional movement of the cutting blade for each cutting line. Therefore, the cutting step can be made more efficient.

1‧‧‧cutting device

2. 28‧‧‧stage

3‧‧‧Rotating mechanism

4, 7‧‧‧ Servo motor (driver)

5, 8‧‧‧ ball screw (driven member)

6, 9‧‧‧Sliding parts

10‧‧‧ mandrel (cutting section)

11‧‧‧Rotary shaft (cutting section)

12‧‧‧Rotary knife (cutting section)

13‧‧‧Camera (camera)

14‧‧‧Package substrate (cut object)

15‧‧‧Substrate

16‧‧‧Area

17, 29 ‧ ‧ length measuring reference members

18‧‧‧Low thermal expansion material

19‧‧‧ reference board

20‧‧‧ base

21‧‧‧ recess

22‧‧‧protective glass

23‧‧‧ reference components

24‧‧‧film

25‧‧‧ cut line

26‧‧‧矽 wafer (cut object)

27‧‧‧ Notch

A1‧‧‧Positioning mark (first positioning mark)

A2‧‧‧ positioning mark (second positioning mark)

A3~A6‧‧‧ positioning mark

CTL‧‧‧Control Department

L1‧‧‧Measured distance

L2‧‧‧Measured distance

LS‧‧‧Base distance

LX‧‧‧ calculated distance

M1‧‧ benchmark mark (first benchmark mark)

M2‧‧‧ benchmark mark (second reference mark)

M3~M6‧‧‧ benchmark mark

Fig. 1 is a plan view showing a main part of a cutting device according to the present invention.

2(1) and 2(2) are a front view and a plan view showing a first form in which a reference mark is formed on the length measuring reference member in the first embodiment of the present invention, and Figs. 2(3) to (5) are respectively shown. A front view of the second to fourth forms.

3 is a view showing a modification of the relationship between the positioning mark and the length measuring reference member of the substrate in the first embodiment of the present invention, and FIG. 3 (1) is a plan view of the rectangular substrate, and FIG. 3 (2) It is a top view of a circular germanium wafer.

Fig. 4 is a front elevational view showing a main part of a conventional example.

The cutting device for an electronic component according to the present invention includes: a length measuring reference member fixed to the stage and composed of a low thermal expansion material; and at least two reference marks are set in the measurement Long reference component. The coordinates of the second fiducial mark in the coordinate system with the first fiducial mark in the fiducial mark as the origin are known. The coordinates of the first positioning mark in the coordinate system are calculated based on the position of the imaging unit at the time point when the first reference mark is captured and the position of the imaging unit at the time point when the first positioning mark is captured on the substrate. The coordinates of the second positioning mark in the coordinate system are calculated based on the position of the imaging unit at the time point when the second reference mark is captured and the position of the imaging unit at the time point when the second positioning mark is captured on the substrate. The cutting line to be cut in the plurality of dividing lines and the rotary knife are aligned based on the coordinates of the first positioning mark and the coordinates of the second positioning mark.

[Example 1]

A cutting device for manufacturing an electronic component according to a first embodiment of the present invention will be described with reference to Fig. 1 . Any of the drawings in the present application are easily omitted or exaggerated for the sake of understanding to be schematically drawn. The same reference numerals are used for the same components, and the description is omitted as appropriate.

As shown in FIG. 1, the cutting device 1 for manufacturing an electronic component has a stage 2 and a rotating mechanism 3 that rotates the stage 2 in the θ direction. A servo motor 4 is fixed to a base (not shown) of the cutting device 1. A ball screw 5 is fixed to the rotating shaft of the servo motor 4. The ball screw 5 is a driven member that is driven by the servo motor 4. A slider 6 having a through-threaded hole is screwed into the ball screw 5. The slider 6 is fixed to the main body of the rotating mechanism 3. According to these configurations, the stage 2 is rotated in the θ direction shown in Fig. 1 and moved in the Y direction.

A servo motor 7 is fixed to a base (not shown) of the cutting device 1. A ball screw 8 is fixed to the rotating shaft of the servo motor 7. The ball screw 8 is a driven member that is driven by the servo motor 7. A slider 9 having a through-threaded hole is screwed into the ball screw 8. A mandrel 10 is fixed to the slider 9. The mandrel 10 is fixed to the ball screw 8 through the slider 9.

A thin circular rotating blade 12 is fixed to the rotating shaft 11 of the mandrel 10. The spindle 10, the rotary shaft 11, and the rotary blade 12 are included in the cut portion of the cutting device 1. The cutting device 1 is provided with a drive mechanism (not shown) that moves the cut portion in the Z direction. The control unit CTL is a control mechanism that controls at least the rotational direction and rotational speed of the rotary blade 12 and the relative moving direction and moving speed of the stage 2 and the spindle 10 .

A camera 13 as an imaging unit is fixed to the main body of the mandrel 10. The camera 13 is integrally fixed to the mandrel 10. According to this configuration, the mandrel 10, the rotating shaft 11, the rotary blade 12, and the camera 13 integrally fixed to the mandrel 10 are grouped and moved in the X direction shown in FIG. In other words, the constituent elements formed by the integration of the cutting unit and the camera 13 move in the X direction.

Further, it is preferable that the distance LA in the X direction between the center of the field of view of the camera 13 and the center of the thickness of the rotary blade and the distance LB in the Y direction between the center of the field of view and the center of the rotating shaft 11 are as small as possible. . In addition, the camera 13 can also serve as a camera for capturing an image of the cut portion (cut groove) after cutting the workpiece (the so-called slit detection camera).

In the present document, the written language such as "B that is integrally fixed to A" means that a plurality of structural elements (in this case, A and B) become a group and the group can be moved. The written language such as "fixed integrally" includes a case where a plurality of structural elements that are a group and can be moved can be separated from each other. In addition, the expression "C composed of A and B integrated" does not exclude the case where structural elements other than A and B are included in C.

A jig (not shown) may be fixed to the upper surface of the stage 2. The package substrate 14 as a workpiece is temporarily fixed to the upper surface of the jig or the stage 2. In order to temporarily fix the package substrate 14, for example, using an adsorption jig, a clip jig, or adhering to the upper surface of the stage 2 Tape and so on. The package substrate 14 has a substrate 15. The substrate 15 has a plurality of regions 16. One or a plurality of wafer-like members (not shown) are mounted on one surface of each of the plurality of regions 16. On one surface of the substrate 15 on which the wafer-like member is attached, an encapsulating resin (not shown) made of a cured resin is formed for the purpose of protecting the wafer-shaped member. A plurality of (four in FIG. 1) positioning marks A1, A2, A3, and A4 are formed on at least the other surface (the surface of the drawing) of the substrate 15. The distance (distance in the X direction) between the positioning mark A1 and the positioning mark A2 is the calculated distance, that is, the calculated distance LX.

A length measuring reference member 17 made of a low thermal expansion material is integrally fixed to the stage 2. As shown in FIG. 1, in the case of cutting the package substrate 14 having a laterally extending shape, the stage 2 has a laterally extending shape. Both the package substrate 14 and the stage 2 are generally rectangular in shape extending laterally. At this time, the length measuring reference member 17 is fixed to the laterally extending portion of the stage 2 by a method such as a screw clamp.

In the case where it is necessary to reduce the influence of the thermal expansion of the stage 2 caused by the heat conduction of the ball screw 5 to the stage 2, it is preferable to fix the length measuring reference member 17 to the stage 2 as follows. In the manner of the length measuring reference member 17, the side close to the ball screw 5 (the left side in FIG. 1) is firmly fixed to the stage 2, and is moved in the X direction in the drawing. The side away from the ball screw 5 (the right side in Fig. 1) is fixed. According to this configuration, even if the stage 2 is thermally expanded and elongated, the length measuring reference member 17 is hardly affected by the elongation.

In the length measuring reference member 17, a first reference mark M1 and a second reference mark M2 are formed in the vicinity of the positioning marks A1, A2 of the substrate 15, respectively. The distance (distance in the X direction) between the reference standard M1 and the reference mark M2 that has been formed is measured with high precision in advance. The reference distance LS is known and the reference distance LS is known.

In the present embodiment, first, it is preferable to set the reference mark M1 and the positioning mark A1 as close as possible. Second, it is preferable to set the reference mark M2 and the positioning mark A2 as close as possible. In other words, it is preferable to make the measured distance L1 which is the distance between the reference mark M1 and the positioning mark A1 in the X direction and the measured distance L2 which is the distance between the reference mark M2 and the positioning mark A2 in the X direction. May be small. Thereby, a relationship of L1<<LX and L2<<LX is established between the calculated distance LX and the measured distances L1 and L2 which are the desired distances.

A method of measuring the calculated distance LX (distance in the X direction) in the present embodiment will be described with reference to Fig. 1 . First, the reference mark M1 and the positioning mark A1 are sequentially photographed using the camera 13.

Next, based on the position of the camera 13 at the time point when the reference mark M1 and the positioning mark A1 are respectively captured, the position of the positioning mark A1 based on the position of the reference mark M1 is calculated. According to the present steps, the measured distance L1 which is the distance in the X direction between the reference mark M1 and the positioning mark A1 can be obtained. Since the relationship of L1<<LX is established, the measured distance L1 can be obtained with high precision. In other words, in the coordinate system based on the position of the reference mark M1, the X coordinate of the positioning mark A1 can be accurately calculated.

Next, the position of the positioning mark A2 based on the position of the reference mark M2 is calculated in the same manner as the steps up to now. Thereby, the measured distance L2 which is the distance in the X direction between the reference mark M2 and the positioning mark A2 can be obtained. Since the relationship of L2<<LX is established, the measured distance L2 can be obtained with high precision.

Next, as apparent from Fig. 1, the relationship of LX = LS - L1 - L2 is utilized. With Specifically, the calculated distance L1, the measured distance L2, and the known reference distance LS are obtained, and the calculated distance LX is calculated based on the formula: LX=LS-L1-L2. The reference distance LS is known accurately in advance. Further, based on the relationship of L1<<LX and L2<<LX, the measured distances L1 and L2 are obtained with high precision. Therefore, the calculated distance LX can be accurately calculated. In other words, in the coordinate system based on the position of the reference mark M1, the X coordinate of the positioning mark A2 can be accurately calculated.

Next, the distance between the positioning mark A1 and the leftmost cutting line, which are respectively known as design values and known, and the distance between the positioning mark A2 and the rightmost cutting line and the edge X are called from the control unit CTL. The number N of the direction regions 16 (N=8 in Fig. 1). Using these distances and the number N of the regions 16, the position (X coordinate) of each of the cutting lines of the package substrate 14 temporarily fixed to the stage 2 in the X direction can be obtained.

Next, the rotary blade 12 is accurately aligned with one of the cutting lines 16 in the respective cutting lines 16 in the X direction. Thereafter, the cutting water is supplied to the lower end portion of the rotary blade 12 while the stage 2 is moved in the +Y direction. Thereby, the package substrate 14 is completely cut (completely cut) on the cutting line 16 by using the rotary blade 12.

In the description so far, the distance in the X direction and the position of each cutting line have been described. Similarly, the calculated distance (Y direction) in the Y direction between the positioning mark A1 and the positioning mark A2 can be accurately obtained. According to the conventional steps, in the coordinate system based on the reference mark M1, the coordinates of the first positioning mark A1 and the coordinates of the second positioning mark A2 (both XY coordinates) and the X direction and Y can be accurately obtained. The position of each cutting line in the direction. Therefore, the rotary blade 12 can be accurately aligned with the respective cutting lines.

The control unit CTL can be used to perform various calculations in the steps up to now. The obtained measured distances L1, L2, etc.

According to the present embodiment, each of the reference marks M1, M3 and each of the positioning marks A1, A2 is photographed using the camera 13 integrally fixed to the mandrel 10, and the first positioning mark is calculated based on the positions of the cameras 13 at the time of shooting, respectively. The coordinates of A1 and the coordinates of the second positioning mark A2. Thus, first, when the ball screw 8 to which the mandrel 10 is attached is heated by the servo motor 7 and thermally expands, it is possible to suppress the positioning marks A1, A2 and the rotation due to the influence of the thermal expansion of the ball screw 8. The phenomenon that the distance between the knives 12 changes.

Secondly, when the mandrel 10 is heated by the heat generated by the heat generated by the ball screw 8 and is thermally expanded, the influence of the thermal expansion can be corrected by measuring the position of the cutting groove by using the camera 13.

Thereby, it is possible to suppress a phenomenon in which the accuracy of cutting the package substrate 14 is reduced due to the influence of the thermal expansion of the ball screw 8 and the thermal expansion of the mandrel 10 without using the combination of the linear scale and the photoelectric detector. Therefore, it is possible to suppress a phenomenon in which the accuracy of cutting the package substrate 14 is lowered, and it is possible to reduce the cost of the cutting device.

According to the present embodiment, the length measuring reference member 17 composed of the low thermal expansion material 18 is integrally fixed to the stage 2. Thereby, even when the stage is heated and thermally expanded, the coordinates of the reference mark 2 in the coordinate system having the reference mark M1 as an origin are hardly affected by thermal expansion. Therefore, it is possible to suppress a phenomenon in which the accuracy of cutting the workpiece is lowered due to the influence of thermal expansion of the stage 2 .

According to the present embodiment, when the package substrate 14 having a plurality of cutting lines is cut, a small number of positioning marks, that is, the coordinates of the positioning mark A1 and the coordinates of the positioning mark A2 are calculated. Thereby, it is possible to suppress a phenomenon in which the number of times of the movement of the rotary blade 14 is increased. Therefore, it can be realized The efficiency of the cutting step.

According to the present embodiment, the camera 13 also serves as a camera for detecting the cutting quality of the cutting line 16 in which the cutting groove is formed after the package substrate 14 is cut on the cutting line 16. Therefore, the package substrate 14 can be cut accurately without providing a new camera that aligns the cutting line 16 and the rotary blade 12.

Further, an example in which the length measuring reference member 17 is integrally fixed to one of the two long sides (the lower side in FIG. 1) of the stage 2 is shown in FIG. Instead of this, it is also possible to adopt a structure in which the length measuring reference member 17 is integrally fixed to the upper side of FIG. It is also possible to adopt a configuration in which the length measuring reference members 17 are integrally fixed to both of the two long sides of the stage 2.

The length measuring reference member 17 will be described with reference to Fig. 2 . The body of the length measuring reference member 17 is composed of a low thermal expansion material 18. The low thermal expansion material is any one of a glass-based material, a ceramic-based material, or an alloy. As the glass-based material, for example, CLEARCERAM-Z (for example) -Z, For registered trademarks) and ZERODUR ( , ZERODUR (registered trademark)). Examples of the ceramic material include cordierite and NEXCERA (NEXCERA (registered trademark)). Examples of the alloy include indium (Invar, an alloy based on iron and nickel, an alloy in which Fe-Ni is 36%), super-invar and nobinite ( ,Trademark).

Four forms in which the reference marks M1, M2, ... are formed on the length measuring reference member 17 will be described with reference to Fig. 2 . The first aspect among the four forms is shown in (1) and (2) of Fig. 2 . First, four thin disc-shaped reference plates 19 each having a reference mark (not shown) formed in advance are prepared. By the etching or the like, each of the reference plates 19 is formed in advance by, for example, a "+" shape. A reference mark formed by a shape.

Four base bodies 20 having a rectangular parallelepiped shape (including a cubic shape) are prepared. A concave portion 21 having a flat bottom surface is formed in advance in each of the base bodies 20. The reference plate 19 is attached to the bottom surface of the recess 21. A thin plate-shaped cover glass 22 made of, for example, sapphire glass is attached to the upper surface of each of the bases 20 so as to completely cover the recesses 21. The four reference members 23 are completed by the steps so far.

Next, four reference members 23 are respectively fixed to the upper surface of the low thermal expansion material 18. For example, four reference members 23 are fixed from the lower surface of the low thermal expansion material 18 using screws (not shown), respectively.

Next, the reference distance LS between the formed reference mark M1 and the reference mark M2 is measured with high precision using a highly accurate measurement system (for example, a CNC image measurement system NEXIV manufactured by Nikon Co., Ltd.) (refer to (2) of Fig. 2). Since the length measuring reference member 17 is made of a low thermal expansion material, the variation in the length of the reference distance LS is extremely small even when the ambient temperature or the temperature of the stage 2 fluctuates. The length measuring reference member 17 whose value of the reference distance LS is known is completed by the steps so far.

Next, the length measuring reference member 17 is fixed to the stage 2 by a method such as a screw clamp (see Fig. 1). In the case where it is necessary to reduce the influence of the thermal expansion of the stage 2 due to the heat generation of the ball screw 5, it is preferable to fix the length measuring reference member 17 to the stage 2 by using the following two methods. This mode is as follows. First, on the side (the left side in FIG. 1) of the length measuring reference member 17 close to the ball screw 5, the length measuring reference member 17 is firmly fixed to the stage 2. Second, on the side (the right side in FIG. 1) of the length measuring reference member 17 away from the ball screw 5, the length measuring reference member 17 is fixed so as to be able to move slightly in the X direction in the drawing.

The second aspect among the four forms in which the reference marks M1 and M2 are formed on the length measuring reference member 17 is shown in (3) of FIG. 2 . A concave portion 21 having a flat bottom surface is formed in advance on the upper surface of the low thermal expansion material 18 as the main body of the length measuring reference member 17. The reference plate 19 is attached to the bottom surface of the recess 21. The thin plate-shaped cover glass 22 is attached to the upper surface of the low thermal expansion material 18 so as to completely cover the respective concave portions 21.

A third aspect among the four forms in which the reference marks M1 and M2 are formed on the length measuring reference member 17 is shown in Fig. 2 (4). The reference marks M1, M2, ... are formed directly on the upper surface of the low thermal expansion material 18 by etching or machining. The thin plate-shaped cover glass 22 is attached to the upper surface of the low thermal expansion material 18 in such a manner as to completely cover M1, M2, . As the machining, vibration machining or the like can be used.

A fourth aspect among the four forms in which the reference marks M1 and M2 are formed on the length measuring reference member 17 is shown in Fig. 2 (5). The reference marks M1, M2, ... are directly formed on the light-transmissive film 24 by etching or printing. The film 24 directly formed with the reference marks M1, M2, ... is attached to the upper surface of the low thermal expansion material 18.

Referring to Fig. 3, a modification different from the relationship shown in Fig. 1 among the relationship between the object to be cut 14 and the reference marks M, M2, ... will be described. As shown in (1) of FIG. 3, the substrate 15 included in the package substrate 14 as a workpiece has positioning marks A1 and A3 at the left end and positioning marks A2 and A4 at the right end. Further, the substrate 15 has central positioning marks A5, A6. The substrate 15 has a plurality of regions 16 which are divided by a plurality of cutting lines 25 in the X direction (the horizontal direction in FIG. 3) and the Y direction (the vertical direction in FIG. 3).

In the length measuring reference member 17, reference marks M5 and M6 are formed in the vicinity of the positioning marks A5 and A6 in the center of the substrate 15. Reference mark M1~M5, reference mark M2~M5 The distance between the reference marks M3 to M6 and the reference marks M4 to M6 is the reference distance, and is accurately measured in advance and is known.

This modification is effective in the case where the object to be cut 14 shown in Fig. 1 is laterally extended and the size in the X direction is large. For example, the coordinates of the positioning marks A1, A2, and A5 can be obtained based on the reference distance between the reference marks M1 to M5 and the reference distance between the reference marks M2 to M5. Thereby, the positions of the respective cutting lines between the positioning marks A1 and A5 and the positions of the respective cutting lines between the positioning marks A2 and A5 can be accurately obtained.

(2) of FIG. 3 shows an example in which the tantalum wafer 26 having a substantially circular shape is a cut portion. A notch 27 as a reference for the crystal direction is formed on the crucible wafer 26. Positioning marks A1 to A4 associated with the crystallographic direction are formed on the germanium wafer 26. A length measuring reference member 29 is fixed to the stage 28 for temporarily fixing the silicon wafer 26. Reference marks M1 to M4 are formed in the vicinity of the positioning marks A1 to A4 of the length measuring reference member 29. According to this configuration, the same effects as in the case of the configuration shown in Fig. 1 can be obtained.

In FIG. 3 (2), instead of the tantalum wafer 26, a package substrate in which a bump electrode and a sealing resin are formed on the tantalum wafer 26 can be used as the object to be cut. Further, a package substrate having a printed circuit board or the like having the same shape as the germanium wafer 26 can be used. In the package substrate, a printed circuit board or the like has a plurality of regions, and wafer-shaped members are attached to the respective regions, and the wafer-shaped members are resin-sealed together with a curing resin. At this time, the shape of the printed circuit board or the like may be a square or a rectangle close to a square.

[Embodiment 2]

Hereinafter, an embodiment in which the cutting unit is a laser irradiation mechanism will be described. In this implementation In the example, a laser irradiation mechanism is used as the processing portion. Even when a laser irradiation mechanism is used as the processing portion, dimensional changes due to thermal expansion of the ball screw or the like may occur in the conveyance system of the workpiece. Therefore, the same effect as in the first embodiment can be obtained in the case where the size of the conveyance system of the workpiece is changed.

Based on the effects described so far, the following effects can be obtained according to the present invention. This effect is an effect in the case where the groove for accommodating the circumferential end portion of the rotary blade 12 is provided on the upper surface of the stage 2 . Specifically, the effect of preventing damage of the rotary blade 12 due to variations in the size of the substrate 15 , variations in the size of the substrate 15 , or misalignment when the package substrate 14 is placed on the stage 2 is prevented. The occurrence of scratches on the upper surface of the stage 12.

This effect will be specifically described. As the size of the substrate 15 increases, first, the dimensional deviation of the substrate 15 itself is large. Second, the size variation (increased size) of the package substrate 14 due to the thermal expansion of the substrate 15 during the resin encapsulation step or the like is large. Third, in the cutting step, the substrate 2 cooled by the cutting water is fixed for a long time, and the size (reduction in size) of the package substrate 14 due to heat shrinkage is large. In these cases, when the groove for accommodating the circumferential end portion of the rotary blade 12 is provided on the upper surface of the stage 2, the circumferential end portion of the rotary blade 12 may be grooved with the upper surface of the stage 2. Contact with other parts. This contact causes damage to the peripheral end portion of the rotary blade 12 and scratches on the upper surface of the stage.

According to the present embodiment, since the measured distances L1 and L2 of the substrate 15 included in the package substrate 14 can be accurately measured, the calculated distance LX between the positioning marks A1 and A2 can be accurately calculated. When the control unit CTL measures the lengths of the measured distances L1 and L2, calculates the calculated distance LX, and determines that any of the distances is out of the allowable range, for example, the control unit CTL operates as follows.

After the control unit CTL releases the fixing of the package substrate 14 with respect to the stage 2, the package substrate 14 is placed on the stage 2 and temporarily fixed again. The control unit CTL measures the lengths of the measured distances L1 and L2 again, calculates the calculated distance LX again, and determines again whether or not the distances are within the allowable range. When the control unit CTL determines that these distances are within the allowable range, it is presumed that the reason for the first determination outside the allowable range is the positional deviation when the package substrate 14 is placed on the stage 2. Therefore, the control unit CTL continues the processing on the package substrate 14.

In the second determination, when the control unit CTL still determines that any of the measured distances L1, L2 and the calculated distance LX is out of the allowable range, the package substrate 14 is removed from the cutting device 1. At this time, the package substrate 14 is cut using a cutting device different from the cutting device 1. In the cutting device, the package substrate 14 is temporarily fixed to the stage using an adhesive tape. Thereby, even if any of the measured distances L1, L2 and the calculated distance LX is out of the allowable range, the peripheral end portion of the rotary blade stops at the cutting tape. Therefore, it is possible to prevent damage of the peripheral end portion of the rotary blade and generation of scratches on the surface of the stage.

Further, in each of the embodiments described so far, FIG. 1 shows an example in which the surface (the surface on one side) in which the encapsulating resin is formed in the package substrate 14 is fixed to the upper surface of the stage 2 . Not limited to this, it is also possible to fix the surface (the other side surface) on which the encapsulating resin is not formed on the upper surface of the stage 2 . In other words, the camera 13 can capture the state of the positioning marks A1, A2, A3, and A4 of the substrate 15 from above.

In the respective embodiments, the so-called full cut has been described. Not limited to this, it is also possible to apply the so-called half cut to the present invention.

In each of the embodiments, the servo motors 4, 7 are respectively used as the heart A drive source for the shaft 10 and the stage 2 to move. Instead of the servo motors 4, 7, a stepping motor can also be used.

The present invention is not limited to the above-described embodiments, and may be arbitrarily and appropriately combined, changed, or selectively employed as needed within the scope of the gist of the invention.

1‧‧‧cutting device

2‧‧‧stage

3‧‧‧Rotating mechanism

4, 7‧‧‧ Servo motor (driver)

5, 8‧‧‧ ball screw (driven member)

6, 9‧‧‧Sliding parts

10‧‧‧ mandrel (cutting section)

11‧‧‧Rotary shaft (cutting section)

12‧‧‧Rotary knife (cutting section)

13‧‧‧Camera (camera)

14‧‧‧Package substrate (cut object)

15‧‧‧Substrate

16‧‧‧Area

17‧‧‧Measurement length reference member

A1‧‧‧Positioning mark (first positioning mark)

A2‧‧‧ positioning mark (second positioning mark)

A3~A4‧‧‧ positioning mark

CTL‧‧‧Control Department

L1‧‧‧Measured distance

L2‧‧‧Measured distance

LA‧‧‧Distance in the X direction

LB‧‧‧Distance in the Y direction

LS‧‧‧Base distance

LX‧‧‧ calculated distance

M1‧‧ benchmark mark (first benchmark mark)

M2‧‧‧ benchmark mark (second reference mark)

Claims (12)

A cutting device for manufacturing an electronic component, wherein a workpiece having a plurality of positioning marks and a plurality of regions and a functional portion provided on each of the plurality of regions is cut along a boundary line of the plurality of regions Used to manufacture a plurality of electronic components, comprising: a stage for fixing the workpiece; a cutting unit; a driving unit for relatively moving the stage and the cutting unit; and a driven member; The cutting unit is mounted and driven by the driving unit; the imaging unit is configured to image the workpiece; and the control unit controls at least the movement caused by the driving mechanism, and the cutting device for manufacturing the electronic component The measurement length reference member is integrally fixed to the stage and composed of a low thermal expansion material, and at least two reference marks are provided on the length measurement reference member, and the imaging unit is integrally fixed In the cutting unit, the coordinates of the second reference mark in the coordinate system whose origin is the first reference mark among the reference marks are known, and the above-mentioned photographing is performed. The first reference mark is captured by the imaging unit, and the imaging unit captures a first one of the plurality of positioning marks, and the control unit captures the position of the imaging unit at a time point when the first reference mark is captured and captures the first Calculating a coordinate of the first positioning mark in the coordinate system at a position of the imaging unit at a time point of the positioning mark, the imaging unit capturing the second reference mark, and the imaging unit capturing a second position of the plurality of positioning marks Marking, the control unit is based on the position of the imaging unit at the time point when the second reference mark is captured And calculating a coordinate of the second positioning mark in the coordinate system at a position of the imaging unit at a time point of capturing the second positioning mark, wherein the control unit is based on a coordinate of the first positioning mark and the second positioning mark The coordinates of the cutting line to be cut in the boundary between the plurality of areas and the rotary knife are aligned. The cutting device for manufacturing an electronic component according to the first aspect of the invention, wherein the image pickup unit performs the inspection of the cutting quality on the cutting line after cutting the workpiece on the cutting line. The camera section that was shot. The cutting device for manufacturing an electronic component according to the second aspect of the invention, wherein the cutting portion includes a mandrel, a rotating shaft of the mandrel, and a rotating blade fixed to the rotating shaft. A cutting device for manufacturing an electronic component according to the second aspect of the invention, wherein the cutting portion has a laser irradiation mechanism. The cutting device for manufacturing an electronic component according to the second aspect of the invention, wherein the low thermal expansion material is any one of a glass material, a ceramic material, or an alloy. The cutting device for manufacturing an electronic component according to the second aspect of the invention, wherein the at least two reference marks are formed by any one of etching, machining, or printing. A cutting method for manufacturing an electronic component, comprising: a substrate having a plurality of positioning marks and a plurality of regions and a workpiece having a functional portion provided on each of the plurality of regions, and a plurality of regions along the plurality of regions The cutting line is cut to manufacture a plurality of electronic components, and the cutting method for manufacturing the electronic component is characterized by comprising: The cutting method for manufacturing an electronic component includes a step of preparing a stage for fixing the workpiece, and a step of preparing a length measuring reference member, wherein the length measuring reference member is made of a low thermal expansion material. a step of being integrally fixed to the stage and having at least two reference marks; a step of preparing an image pickup unit integrally fixed to the cut portion; and knowing in advance that the first reference mark of the reference mark is the origin a step of a coordinate of a second reference mark in the coordinate system; a step of fixing the workpiece to the stage; a first step of capturing the first reference mark using the imaging unit; and using the imaging unit a second step of capturing a first one of the plurality of positioning marks; and calculating the number of the coordinates in the coordinate system based on a position of the imaging unit in the first step and a position of the imaging unit in the second step a step of positioning a coordinate of the mark; a third step of photographing the second reference mark using the aforementioned image capturing portion; using the aforementioned image capturing portion to shoot a fourth step of the second positioning mark among the plurality of positioning marks; calculating the second of the coordinate systems based on the position of the imaging unit in the third step and the position of the imaging unit in the fourth step a step of positioning the coordinates of the mark; and step of aligning the cut line to be cut in the boundary line of the plurality of areas and the cut portion based on the coordinates of the first positioning mark and the coordinates of the second positioning mark And a step of cutting the workpiece on the cutting line. For example, the cutting method for manufacturing electronic parts according to item 7 of the patent application scope, wherein The step includes the step of inspecting the cutting quality on the cutting line using the image pickup unit after the step of cutting the workpiece. The cutting method for manufacturing an electronic component according to the eighth aspect of the invention, wherein the cutting portion includes a mandrel, a rotating shaft of the mandrel, and a rotating blade fixed to the rotating shaft. In the step of aligning, the cutting line and the rotating blade are aligned, and in the step of cutting, the rotating blade is brought into contact with the workpiece. The cutting method for manufacturing an electronic component according to the eighth aspect of the invention, wherein the cutting unit has a laser irradiation unit, and in the step of performing the alignment, the laser beam irradiated by the laser irradiation unit The cutting line is aligned, and in the step of performing the cutting, the workpiece is irradiated with the laser. The cutting method for producing an electronic component according to the eighth aspect of the invention, wherein the low thermal expansion material is any one of a glass material, a ceramic material, or an alloy. The cutting method for manufacturing an electronic component according to the eighth aspect of the invention, further comprising: forming at least two of the foregoing by etching, machining or printing before the step of preparing the length measuring reference member The steps of the benchmark mark.