TWI554654B - Printed circuit board fixture for electroplating process - Google Patents
Printed circuit board fixture for electroplating process Download PDFInfo
- Publication number
- TWI554654B TWI554654B TW104114434A TW104114434A TWI554654B TW I554654 B TWI554654 B TW I554654B TW 104114434 A TW104114434 A TW 104114434A TW 104114434 A TW104114434 A TW 104114434A TW I554654 B TWI554654 B TW I554654B
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- TW
- Taiwan
- Prior art keywords
- fixture
- circuit board
- frame
- binding
- bonding
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 44
- 230000008569 process Effects 0.000 title claims description 44
- 238000009713 electroplating Methods 0.000 title claims description 13
- 230000004888 barrier function Effects 0.000 claims description 28
- 230000008878 coupling Effects 0.000 claims description 25
- 238000010168 coupling process Methods 0.000 claims description 25
- 238000005859 coupling reaction Methods 0.000 claims description 25
- 239000007788 liquid Substances 0.000 claims description 19
- 239000000126 substance Substances 0.000 claims description 17
- 230000035515 penetration Effects 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 15
- 230000005611 electricity Effects 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 238000007747 plating Methods 0.000 claims description 9
- 230000000694 effects Effects 0.000 claims description 7
- 239000013043 chemical agent Substances 0.000 claims description 6
- 238000005260 corrosion Methods 0.000 claims description 6
- 230000007797 corrosion Effects 0.000 claims description 6
- 238000001125 extrusion Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 230000000903 blocking effect Effects 0.000 claims description 4
- 238000001311 chemical methods and process Methods 0.000 claims 1
- 230000033001 locomotion Effects 0.000 description 4
- 239000004809 Teflon Substances 0.000 description 3
- 229920006362 Teflon® Polymers 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000026058 directional locomotion Effects 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
本發明係有關一種應用於電鍍製程之電路板治具。 The present invention relates to a circuit board fixture for use in an electroplating process.
隨著電路板(Printed Circuit Board,PCB)製程科技的發展,開發出各式各樣的製程。在電路板的整體製程中,電路板治具是用來夾持電路板,以利電路板的固定與移動。 With the development of Printed Circuit Board (PCB) process technology, a variety of processes have been developed. In the overall process of the circuit board, the circuit board fixture is used to clamp the circuit board to facilitate the fixing and movement of the circuit board.
電路板治具除了必須能固定夾持電路板的功能外,根據不同的電路板製程,還須提供其他附加的功能。以電路板電鍍的步驟為例,尚須要提供防電解液滲透或供電的功能。另一方面,由於電路板的複雜度隨著技術的進展而提升,雙面式或多層式的電路板更是普及應用。因此,如何提供一種有效且具應用彈性治具是提升製程效率的重要議題。 In addition to the function of holding the board, the board fixture must provide additional functions depending on the board process. Taking the step of board plating as an example, it is necessary to provide a function of preventing electrolyte penetration or power supply. On the other hand, as the complexity of the board increases with the advancement of technology, double-sided or multi-layer boards are more popular. Therefore, how to provide an effective and flexible tool is an important issue to improve process efficiency.
有鑑於此,本發明提出一種電路板治具,可應用 於夾持一片或兩片電路板,以利於單片電路板的單面或雙面電鍍,或是兩片電路板的同時單面電鍍。 In view of this, the present invention provides a circuit board fixture that can be applied. One or two boards are clamped to facilitate single-sided or double-sided plating of a single circuit board, or simultaneous single-sided plating of two boards.
本發明之實施例揭露一電路板治具,適用於在製程中夾持一電路板;該電路板治具包含一治具底板、與一治具蓋框;該治具底板為一片狀平板,具有一第一表面與一第二表面,在其第一表面之周圍處設置有複數個結合孔;該治具蓋框為一框型物件,具有一較窄的第一表面與一較寬的第二表面,因此其垂直切面為一梯形;該治具蓋框的第二表面周圍相對應處則設置有複數個結合柱;該治具蓋框的複數個結合柱可分別對應插入該治具底板的複數個結合孔,以夾持固定一電路板;其中,該治具底板更包含一結合柱鎖板,設置於該治具底板之內部,可定向移動橫切過該複數個結合孔,該結合柱鎖板設置有複數個鎖孔,分別對應於該治具底板的複數個結合孔;該複數個鎖孔可容該治具蓋框的複數個結合柱分別通過,再移動該結合柱鎖板後,該鎖孔則將該結合柱鎖住,避免該結合柱自該結合孔拔出而分離;該治具蓋框更包含一導電框與一方型阻隔圈;該導電框設置於該治具蓋框的內部並與該複數個結合柱電性相連,其上設有複數個導電針,該複數個導電針係突出於該第二表面且位於該複數個結合柱的內側,與被夾持的該電路板接觸,以作為電鍍時導電之用;該方型阻隔圈,設置於該第二表面且位於該複數個導電針的內側,以阻隔製程中所用化學液 劑的滲透。 Embodiments of the present invention disclose a circuit board fixture suitable for holding a circuit board in a process; the circuit board fixture includes a fixture bottom plate and a fixture cover frame; the fixture bottom plate is a flat plate Having a first surface and a second surface, a plurality of bonding holes are disposed around the first surface thereof; the fixture cover frame is a frame type object having a narrow first surface and a wider surface a second surface, such that the vertical section is a trapezoid; a plurality of binding columns are disposed at corresponding positions around the second surface of the fixture cover frame; and the plurality of binding columns of the fixture cover frame can be respectively inserted into the treatment a plurality of bonding holes having a bottom plate for clamping and fixing a circuit board; wherein the fixture bottom plate further comprises a combined column lock plate disposed inside the bottom plate of the fixture, and can be directionally moved across the plurality of bonding holes The binding column lock plate is provided with a plurality of locking holes respectively corresponding to the plurality of bonding holes of the fixture bottom plate; the plurality of locking holes can respectively pass through the plurality of binding columns of the jig cover frame, and then move the combination After the column locks the plate, the keyhole combines the Locking, preventing the binding post from being separated from the bonding hole; the fixture cover frame further comprises a conductive frame and a type of barrier ring; the conductive frame is disposed inside the jig cover frame and combined with the plurality of The column is electrically connected, and is provided with a plurality of conductive pins protruding from the second surface and located inside the plurality of bonding columns to be in contact with the clamped circuit board for use as a plating Conductive; the square barrier ring is disposed on the second surface and located inside the plurality of conductive pins to block the chemical liquid used in the process Penetration of the agent.
本發明之另一實施例揭露一電路板治具,適用於 在製程中夾持一電路板;該電路板治具包含一治具底框、與一治具蓋框;該治具底框為一框型物件,具有一較寬的第一表面與一較窄的第二表面,因此其垂直切面為一梯形,在其第一表面之周圍處設置有複數個結合孔;該治具蓋框亦為一框型物件,具有一較窄的第一表面與一較寬的第二表面,因此其垂直切面為一梯形;該治具蓋框的第二表面周圍相對應處則設置有複數個結合柱;該治具蓋框的複數個結合柱可分別對應插入該治具底框的複數個結合孔,以夾持固定一電路板;其中,該治具底框更包含一結合柱鎖框,設置於該治具底框之內部,可定向移動橫切過該複數個結合孔,該結合柱鎖框設置有複數個鎖孔,分別對應於該治具底框的複數個結合孔;該複數個鎖孔可容該治具蓋框的複數個結合柱分別通過,移動該結合柱鎖框後,該鎖孔則將該結合柱鎖住,避免該結合柱自該結合孔拔出而分離;該治具底框更包含複數個導電針與一方型阻隔圈,該複數個導電針係設置於該第一表面且位於該複數個結合孔的內側,與被夾持的該電路板接觸,以作為電鍍時導電之用;該方型阻隔圈係設置於該第一表面且位於該複數個導電針的內側,以阻隔任何化學液劑的滲透;該治具蓋框更包含一導電框與一方型阻隔圈;該導電框係設置於該治具蓋框內部且與該複數個結合柱電性相連,其上更設有複數個導電針,該複數個導 電針係突出於該第二表面且位於該複數個結合柱的內側,與被夾持的該電路板接觸,以作為電鍍時導電之用;該方型阻隔圈係設置於該第二表面且位於該複數個導電針的內側,以阻隔製程中所用化學液劑的滲透。 Another embodiment of the present invention discloses a circuit board fixture suitable for use in Holding a circuit board in the process; the circuit board fixture comprises a bottom frame and a fixture cover frame; the bottom frame of the fixture is a frame type object having a wider first surface and a wider surface a narrow second surface, such that the vertical section is a trapezoidal shape, and a plurality of coupling holes are disposed around the first surface thereof; the fixture cover frame is also a frame type object having a narrow first surface and a wider second surface, so that the vertical section is a trapezoid; a plurality of coupling columns are disposed at corresponding positions around the second surface of the fixture cover frame; the plurality of binding columns of the fixture cover frame respectively correspond to Inserting a plurality of bonding holes of the bottom frame of the fixture to clamp and fix a circuit board; wherein the fixture bottom frame further comprises a binding column lock frame disposed inside the bottom frame of the fixture, and can be moved transversely Passing the plurality of bonding holes, the binding column lock frame is provided with a plurality of locking holes respectively corresponding to the plurality of bonding holes of the bottom frame of the fixture; the plurality of locking holes can accommodate the plurality of bonding columns of the fixture cover frame Passing through the binding column lock frame respectively, the locking hole is the binding column The bottom frame of the fixture further comprises a plurality of conductive pins and a type of barrier ring, and the plurality of conductive needles are disposed on the first surface and located in the plurality of combinations. The inner side of the hole is in contact with the clamped circuit board for conducting electricity during electroplating; the square type resisting ring is disposed on the first surface and located inside the plurality of conductive pins to block any chemical liquid agent The cover frame further comprises a conductive frame and a type of barrier ring; the conductive frame is disposed inside the jig cover frame and electrically connected to the plurality of binding columns, and further comprises a plurality of conductive wires Needle, the plural guide An electric needle system protrudes from the second surface and is located inside the plurality of bonding columns, and is in contact with the clamped circuit board for conducting electricity during electroplating; the square barrier ring is disposed on the second surface and Located inside the plurality of conductive pins to block the penetration of the chemical liquid used in the process.
本發明之又一實施例揭露一電路板治具,適用於 在製程中夾持兩片電路板;該電路板治具包含一治具底板、與兩個治具蓋框;該治具底板為一片狀平板,具有依第一表面與一第二表面,在其第一表面及第二表面之周圍處分別設置有複數個結合孔;該兩治具蓋框可分別結合於該治具底板的第一表面與第二表面,分別夾持一電路板;該治具蓋框為一框型物件,具有一較窄的第一表面與一較寬的第二表面,因此其垂直切面為一梯形;該治具蓋框的第二表面周圍相對應處則設置有複數個結合柱;該治具蓋框的複數個結合柱可分別對應插入該治具底板的複數個結合孔,以夾持固定一電路板;其中,該治具底板更包含兩片結合柱鎖板,分別設置於該治具底板之內部,可定向移動分別橫切過設置於該第一表面與第二表面的複數個結合孔,該結合柱鎖板設置有複數個鎖孔,分別對應於該治具底板的複數個結合孔;該複數個鎖孔可容該治具蓋框的複數個結合柱分別通過,移動該結合柱鎖板後,該鎖孔則將該結合柱鎖住,避免該結合柱自該結合孔拔出而分離;該治具蓋框更包含一導電框與一方型阻隔圈,該導電框係設置於該治具蓋框內部且與該複數個結合柱電性相連,其上設置複數個導電 針,該複數個導電針係突出於該第二表面且位於該複數個結合柱的內側,與被夾持的該電路板接觸,以作為電鍍時導電之用;該方型阻隔圈係設置於該第二表面且位於該複數個導電針的內側,以阻隔製程中所用化學液劑的滲透。 Yet another embodiment of the present invention discloses a circuit board fixture suitable for use in Holding two circuit boards in the process; the circuit board fixture comprises a fixture bottom plate and two jig cover frames; the jig bottom plate is a flat plate having a first surface and a second surface, a plurality of bonding holes are respectively disposed around the first surface and the second surface; the two jig cover frames are respectively coupled to the first surface and the second surface of the jig bottom plate, respectively clamping a circuit board; The jig cover frame is a frame type object having a narrow first surface and a wider second surface, so that the vertical cut surface is a trapezoid; the corresponding area around the second surface of the jig cover frame is a plurality of bonding columns are disposed; the plurality of bonding columns of the fixture cover frame respectively corresponding to the plurality of bonding holes inserted into the bottom plate of the fixture to clamp and fix a circuit board; wherein the fixture bottom plate further comprises two pieces combined The column lock plates are respectively disposed inside the bottom plate of the jig, and are directionalally movable to cross the plurality of joint holes disposed on the first surface and the second surface respectively, wherein the joint column lock plate is provided with a plurality of lock holes, respectively a plurality of bonding holes corresponding to the bottom plate of the fixture The plurality of locking holes can respectively pass through the plurality of binding columns of the jig cover frame. After the binding column lock plate is moved, the locking hole locks the binding post to prevent the binding post from being pulled out from the bonding hole. Separating; the fixture cover frame further comprises a conductive frame and a type of barrier ring, the conductive frame is disposed inside the jig cover frame and electrically connected to the plurality of binding columns, and a plurality of conductive wires are disposed thereon a plurality of conductive needles protruding from the second surface and located inside the plurality of bonding columns, in contact with the clamped circuit board for conducting electricity during electroplating; the square barrier ring is disposed on The second surface is located inside the plurality of conductive pins to block the penetration of the chemical liquid used in the process.
110‧‧‧治具底板 110‧‧‧ fixture bottom plate
111‧‧‧第一表面 111‧‧‧ first surface
112‧‧‧第二表面 112‧‧‧ second surface
113‧‧‧結合孔 113‧‧‧Combination hole
114‧‧‧結合柱鎖板 114‧‧‧ Combined column lock plate
115‧‧‧鎖孔 115‧‧‧Keyhole
120‧‧‧治具蓋框 120‧‧ ‧ fixture cover
121‧‧‧第一表面 121‧‧‧ first surface
122‧‧‧第二表面 122‧‧‧ second surface
123‧‧‧結合柱 123‧‧‧ binding column
124‧‧‧導電針 124‧‧‧Conducting needle
125‧‧‧阻隔圈 125‧‧‧Break ring
126‧‧‧導電框 126‧‧‧ Conductive frame
130‧‧‧電路板 130‧‧‧ boards
131‧‧‧光阻乾膜 131‧‧‧Light-resistance dry film
310‧‧‧治具底框 310‧‧ ‧ fixture bottom frame
311‧‧‧第一表面 311‧‧‧ first surface
312‧‧‧第二表面 312‧‧‧ second surface
313‧‧‧結合孔 313‧‧‧Combination hole
314‧‧‧結合柱鎖框 314‧‧‧ Combined column lock frame
315‧‧‧鎖孔 315‧‧‧Keyhole
316‧‧‧導電針 316‧‧‧conductive needle
317‧‧‧阻隔圈 317‧‧‧Break ring
320‧‧‧治具蓋框 320‧‧ ‧ fixture cover
321‧‧‧第一表面 321‧‧‧ first surface
322‧‧‧第二表面 322‧‧‧ second surface
323‧‧‧結合柱 323‧‧‧ binding column
324‧‧‧導電針 324‧‧‧conductive needle
325‧‧‧阻隔圈 325‧‧‧Break ring
326‧‧‧導電框 326‧‧‧ Conductive frame
330‧‧‧電路板 330‧‧‧Circuit board
331‧‧‧光阻乾膜 331‧‧‧Light-resistance dry film
510‧‧‧治具底板 510‧‧‧ fixture bottom plate
511‧‧‧第一表面 511‧‧‧ first surface
512‧‧‧第二表面 512‧‧‧ second surface
513‧‧‧結合孔 513‧‧‧Contact hole
514‧‧‧結合柱鎖板 514‧‧‧ Combined column lock plate
515‧‧‧鎖孔 515‧‧‧Keyhole
520‧‧‧治具蓋框 520‧‧ ‧ fixture cover
521‧‧‧第一表面 521‧‧‧ first surface
522‧‧‧第二表面 522‧‧‧ second surface
523‧‧‧結合柱 523‧‧‧ binding column
524‧‧‧導電針 524‧‧‧conductive needle
525‧‧‧阻隔圈 525‧‧‧Break ring
526‧‧‧導電框 526‧‧‧ Conductive frame
530‧‧‧電路板 530‧‧‧Circuit board
531‧‧‧光阻乾膜 531‧‧‧Light-resistance dry film
第一圖所示為本發明電路板治具之第一實施例的示意圖。 The first figure shows a schematic view of a first embodiment of a circuit board fixture of the present invention.
第二圖所示為本發明電路板治具之第一實施例的剖面圖。 The second figure shows a cross-sectional view of a first embodiment of the circuit board fixture of the present invention.
第三圖所示為本發明電路板治具之第二實施例的示意圖。 The third figure shows a schematic view of a second embodiment of the circuit board fixture of the present invention.
第四圖所示為本發明電路板治具之第二實施例的剖面圖。 The fourth figure shows a cross-sectional view of a second embodiment of the circuit board fixture of the present invention.
第五圖所示為本發明電路板治具之第三實施例的剖面圖。 Figure 5 is a cross-sectional view showing a third embodiment of the circuit board fixture of the present invention.
以下,參考伴隨的圖式,詳細說明依據本發明的實施例,俾使本領域者易於瞭解。所述之創作可以採用多種變化的實施方式,當不能只限定於這些實施例。本發明省略已熟知部分(well-known part)的描述,並且相同的參考號於本發明中代表相同的元件。 Hereinafter, embodiments according to the present invention will be described in detail with reference to the accompanying drawings, which are readily understood by those skilled in the art. The authoring of the invention may take a variety of variations, and should not be limited to only those embodiments. The description of the well-known part is omitted in the present invention, and the same reference numerals denote the same elements in the present invention.
第一圖與第二圖所示分別為本發明電路板治具 之第一實施例的示意圖以及剖面圖。該電路板治具係應用於在製程中夾持一電路板,可進行該電路板的單面電鍍製程。如第一圖及第二圖所示,該電路板治具包含一治具底板110、與一治具蓋框120;該治具底板110為一片狀平板,具有一第一表面111與一第二表面112,在其第一表面111之周圍處設置有複數個結合孔113;該治具蓋框120為一框型物件,具有一較窄的第一表面121與一較寬的第二表面122,因此其垂直切面為一梯形;該治具蓋框的第二表面周圍相對應處則設置有複數個結合柱123;該治具蓋框120的複數個結合柱123可分別對應插入該治具底板110的複數個結合孔113,以夾持固定一電路板130;其中,該治具底板110更包含一結合柱鎖板114,設置於該治具底板110之內部,可定向移動橫切過該複數個結合孔113,該結合柱鎖板114設置有複數個鎖孔115,分別對應於該治具底板110的複數個結合孔113;該複數個鎖孔115可容該治具蓋框120的複數個結合柱123分別通過,再移動該結合柱鎖板114後,該鎖孔115則將該結合柱123鎖住,避免該結合柱123自該結合孔113拔出而分離;該治具蓋框120更包含一導電框126與一方型阻隔圈125,該導電框126係設置於該治具蓋框120內部且與該複數個結合柱123電性相連,其上設有複數個導電針124,該複數個導電針124係突出於該第二表面122且位於該複數個結合柱123的內側,與被夾持的該電路板130接觸,以作為電鍍時導 電之用;該方型阻隔圈125,設置於該第二表面122且位於該複數個導電針124的內側,以阻隔製程中所用化學液劑的滲透。 其中,該電路板130上覆有一層光阻乾膜(dry film)131。當該治具底板110與該治具蓋框120結合夾持該電路板130時,該方型阻隔圈125係壓制於該光阻乾膜131之上,如此一來,可將製程中所用化學液劑阻隔在外,防止其接觸該電路板的其他裸露區域。另一方面,該複數個導電針124則直接接觸該電路板130,以提供製程中所需的電流到電路板130。 The first figure and the second figure respectively show the circuit board fixture of the present invention. A schematic view and a cross-sectional view of a first embodiment. The circuit board fixture is used to clamp a circuit board in the process, and the single-sided electroplating process of the circuit board can be performed. As shown in the first figure and the second figure, the circuit board fixture includes a fixture bottom plate 110 and a jig cover frame 120; the jig bottom plate 110 is a flat plate having a first surface 111 and a The second surface 112 is provided at a periphery of the first surface 111 with a plurality of coupling holes 113; the fixture cover 120 is a frame-shaped object having a narrow first surface 121 and a wider second The surface 122 is such that the vertical section is a trapezoid; the corresponding area around the second surface of the fixture cover is provided with a plurality of binding columns 123; the plurality of binding columns 123 of the fixture cover 120 can be respectively inserted into the a plurality of bonding holes 113 of the bottom plate 110 of the fixture to clamp and fix a circuit board 130; wherein the fixture bottom plate 110 further includes a coupling column lock plate 114 disposed inside the fixture bottom plate 110 for directional movement The plurality of coupling holes 113 are cut out, and the plurality of locking holes 115 are respectively disposed corresponding to the plurality of coupling holes 113 of the fixture bottom plate 110; the plurality of locking holes 115 can accommodate the fixture cover The plurality of binding columns 123 of the frame 120 respectively pass, and after moving the binding column lock plate 114, The locking hole 115 locks the binding post 123 to prevent the binding post 123 from being separated from the coupling hole 113. The fixture cover 120 further includes a conductive frame 126 and a type of barrier ring 125. The conductive frame The 126 is disposed inside the fixture cover 120 and electrically connected to the plurality of binding posts 123. The plurality of conductive pins 124 are disposed on the second surface 122 and located at the second surface 122. The inner side of the plurality of bonding pillars 123 is in contact with the held circuit board 130 to serve as a plating guide The square barrier 125 is disposed on the second surface 122 and located inside the plurality of conductive pins 124 to block the penetration of the chemical liquid used in the process. The circuit board 130 is covered with a dry film 131. When the fixture bottom plate 110 and the jig cover frame 120 are combined to clamp the circuit board 130, the square barrier ring 125 is pressed onto the photoresist dry film 131, so that the chemistry used in the process can be used. The liquid is blocked from contact with other exposed areas of the board. On the other hand, the plurality of conductive pins 124 directly contact the circuit board 130 to provide the current required in the process to the circuit board 130.
值得注意的是,在較佳的實施例中,該結合柱123 可設計為其頂端較大,且具有一略細頸部的柱狀體。相對應地,該鎖孔115則設計為一端較寬另一端較窄的孔;如此一來,該結合柱123的較大頂端可穿過該鎖孔115較寬的一端,然後再移動該結合柱鎖板114,使得該鎖孔115較窄的一端卡住該結合柱123的頸部,以防止該結合柱123自該結合孔113拔出而分離,進而達到固鎖的效果。 It should be noted that in a preferred embodiment, the binding post 123 It can be designed as a columnar body with a large top end and a slightly narrow neck. Correspondingly, the locking hole 115 is designed as a hole having a wider end and a narrower end; thus, the larger tip of the binding post 123 can pass through the wider end of the locking hole 115, and then the combination is moved. The column locking plate 114 is configured such that the narrow end of the locking hole 115 catches the neck of the coupling post 123 to prevent the coupling post 123 from being separated from the coupling hole 113 to be separated, thereby achieving the effect of locking.
再者,該治具底板110與該治具蓋框120可由抗腐 蝕且不與電路板製成過程中所使用之化學藥劑相作用的材料製成,例如鐵氟龍(teflon)之類的材料。該結合柱鎖板114則可由金屬製程,一方面提供較之強硬度,另一方面亦利於在該治具底板110內部移動以利該結合柱123進出該結合孔113與固鎖該結合柱123。同樣地,該導電框126也係由具導電性的金屬製 程。該方型阻隔圈125則可由橡膠類材質製成,具有擠壓之彈性,可達到防止製程中所用化學液劑的滲透的效果。 Furthermore, the fixture bottom plate 110 and the jig cover frame 120 may be resistant to corrosion It is made of a material that does not interact with the chemical agent used in the manufacturing process of the board, such as a material such as teflon. The binding column lock plate 114 can be made of metal, which provides a relatively strong hardness on the one hand, and facilitates movement inside the fixture bottom plate 110 on the other hand, so that the binding post 123 can enter and exit the coupling hole 113 and lock the binding post 123. . Similarly, the conductive frame 126 is also made of conductive metal. Cheng. The square barrier ring 125 can be made of a rubber material and has the elasticity of extrusion to prevent the penetration of the chemical liquid used in the process.
第三圖與第四圖所示分別為本發明電路板治具 之第二實施例的示意圖以及剖面圖。該電路板治具係應用於在製程中夾持一電路板,可進行該電路板的雙面電鍍製程。如第三圖及第四圖所示,該電路板治具包含一治具底框310、與一治具蓋框320;該治具底框310為一框型物件,具有一較寬的第一表面311與一較窄的第二表面312,因此其垂直切面為一梯形,在其第一表面311之周圍處設置有複數個結合孔313;該治具蓋框320亦為一框型物件,具有一較窄的第一表面321與一較寬的第二表面322,因此其垂直切面為一梯形;該治具蓋框320的第二表面322周圍相對應處則設置有複數個結合柱323;該治具蓋框320的複數個結合柱323可分別對應插入該治具底框310的複數個結合孔313,以夾持固定一電路板330;其中,該治具底框310更包含一結合柱鎖框314,設置於該治具底框310之內部,可定向移動橫切過該複數個結合孔313,該結合柱鎖框314設置有複數個鎖孔315,分別對應於該治具底框310的複數個結合孔313;該複數個鎖孔315可容該治具蓋框320的複數個結合柱323分別通過,移動該結合柱鎖框314後,該鎖孔315則將該結合柱鎖住323,避免該結合柱323自該結合孔313拔出而分離;該治具底框310更包含複數個導電針316與一方型阻隔圈317,該複數個導電針316係設置於該第一表面311並與該結合 柱鎖框314電性相連,且位於該複數個結合孔313的內側,與被夾持的該電路板330接觸,以作為電鍍時導電之用;該方型阻隔圈317係設置於該第一表面311且位於該複數個導電針316的內側,以阻隔任何化學液劑的滲透;該治具蓋框320更包含一導電框326與一方型阻隔圈325,該導電框326係設置於該治具蓋框內部且與結合駐店性相連,其上設置複數個導電針324,該複數個導電針324係設置於該第二表面322且位於該複數個結合柱323的內側,與被夾持的該電路板330接觸,以作為電鍍時導電之用,該複數個導電316則直接接觸該電路板330,以提供製程中所需的電流到電路板330;該方型阻隔圈325係設置於該第二表面322且位於該複數個導電針324的內側,以阻隔製程中所用化學液劑的滲透,防止其接觸該電路板330的其他裸露區域。另一方面,該複數個導電324則直接接觸該電路板330,以提供製程中所需的電流到電路板330。其中,該電路板330的兩表面各覆蓋一層光阻乾膜(dry film)331。 The third and fourth figures are respectively the circuit board fixture of the present invention. A schematic view and a cross-sectional view of a second embodiment. The circuit board fixture is applied to hold a circuit board in the process, and the double-sided plating process of the circuit board can be performed. As shown in the third and fourth figures, the circuit board fixture includes a fixture bottom frame 310 and a fixture cover frame 320; the fixture bottom frame 310 is a frame type object having a wider width. a surface 311 and a narrower second surface 312, such that the vertical section is a trapezoid, and a plurality of coupling holes 313 are disposed around the first surface 311; the fixture cover 320 is also a frame type object Having a narrow first surface 321 and a wider second surface 322, so that the vertical section is a trapezoid; the second surface 322 of the jig cover 320 is provided with a plurality of binding columns corresponding to each other around the second surface 322 The plurality of binding posts 323 of the jig cover frame 320 are respectively corresponding to the plurality of bonding holes 313 of the jig bottom frame 310 for clamping and fixing a circuit board 330; wherein the jig bottom frame 310 further comprises A combination of the column lock frame 314 is disposed inside the fixture bottom frame 310, and can be directionally moved across the plurality of bonding holes 313. The binding column lock frame 314 is provided with a plurality of locking holes 315, which respectively correspond to the treatment a plurality of bonding holes 313 having a bottom frame 310; the plurality of locking holes 315 can accommodate the plurality of jig cover frames 320 The binding post 323 passes through the locking post lock frame 314, and the locking hole 315 locks the binding post 323 to prevent the binding post 323 from being separated from the coupling hole 313 to be separated; the jig bottom frame 310 is further A plurality of conductive pins 316 and one type of barrier ring 317 are disposed, and the plurality of conductive pins 316 are disposed on the first surface 311 and combined with the same The column lock frame 314 is electrically connected to each other and is located inside the plurality of bonding holes 313 to be in contact with the clamped circuit board 330 for conducting electricity during electroplating; the square barrier ring 317 is disposed at the first The surface 311 is located inside the plurality of conductive pins 316 to block the penetration of any chemical liquid. The fixture cover 320 further includes a conductive frame 326 and a type of barrier ring 325. The conductive frame 326 is disposed on the surface. A plurality of conductive pins 324 are disposed on the inner surface of the cover frame, and the plurality of conductive pins 324 are disposed on the second surface 322 and located on the inner side of the plurality of binding posts 323, and are clamped The circuit board 330 is in contact for conducting electricity during electroplating, and the plurality of conductive 316 directly contacts the circuit board 330 to provide current required in the process to the circuit board 330; the square barrier ring 325 is disposed on The second surface 322 is located inside the plurality of conductive pins 324 to block the penetration of the chemical liquid used in the process to prevent it from contacting other exposed regions of the circuit board 330. On the other hand, the plurality of conductive 324 directly contacts the circuit board 330 to provide the current required in the process to the circuit board 330. The two surfaces of the circuit board 330 are each covered with a dry film 331.
值得注意的是,與第一實施例相同,該結合柱323 可設計為其頂端較大,且具有一略細頸部的柱狀體。相對應地,該鎖孔315則設計為一端較寬另一端較窄的孔;如此一來,該結合柱323的較大頂端可穿過該鎖孔315較寬的一端,然後再移動該結合柱鎖框314,使得該鎖孔315較窄的一端卡住該結合柱323的頸部,以防止該結合柱323自該結合孔313拔出而分離,進而達到固鎖的效果。 It is to be noted that the binding column 323 is the same as the first embodiment. It can be designed as a columnar body with a large top end and a slightly narrow neck. Correspondingly, the locking hole 315 is designed as a hole having a wider end and a narrower end; thus, the larger tip of the binding post 323 can pass through the wider end of the locking hole 315, and then the combination is moved. The column locking frame 314 is such that the narrower end of the locking hole 315 catches the neck of the binding post 323 to prevent the binding post 323 from being separated from the coupling hole 313 to be separated, thereby achieving the effect of locking.
再者,該治具底框310與該治具蓋框320可由抗腐 蝕且不與電路板製成過程中所使用之化學藥劑相作用的材料製成,例如鐵氟龍(teflon)之類的材料。該結合柱鎖板314則可由金屬製程,一方面提供較之強硬度,另一方面亦利於在該治具底框310內部移動以利該結合柱323進出該結合孔313與固鎖該結合柱323。同樣地,該導電框326也係由具導電性的金屬製程。該方型阻隔圈317、325則可由橡膠類材質製成,具有擠壓之彈性,可達到防止製程中所用化學液劑的滲透的效果。 Furthermore, the fixture bottom frame 310 and the fixture cover frame 320 may be resistant to corrosion. It is made of a material that does not interact with the chemical agent used in the manufacturing process of the board, such as a material such as teflon. The binding column lock plate 314 can be made of a metal process, which provides a relatively strong hardness on the one hand, and facilitates movement inside the fixture bottom frame 310 on the other hand, so that the binding post 323 can enter and exit the coupling hole 313 and lock the binding column. 323. Similarly, the conductive frame 326 is also made of a conductive metal process. The square-shaped barrier rings 317 and 325 can be made of a rubber-like material and have the elasticity of extrusion to prevent the penetration of the chemical liquid used in the process.
第五圖所示為本發明電路板治具之第三實施例 的剖面圖,係應用於在製程中夾持兩片電路板,可同時進行該兩片電路板的單面電鍍製程。如第五圖所示,該電路板治具包含一治具底板510、與兩個治具蓋框520;該治具底板510為一片狀平板,具有依第一表面511與一第二表面512,在其第一表面511及第二表面512之周圍處分別設置有複數個結合孔513;該兩治具蓋框520可分別結合於該治具底板510的第一表面511與第二表面512,分別夾持一電路板530;該治具蓋框520為一框型物件,具有一較窄的第一表面521與一較寬的第二表面522,因此其垂直切面為一梯形;該治具蓋框520的第二表面522周圍相對應處則設置有複數個結合柱523;該每個治具蓋框520的複數個結合柱523可分別對應插入該治具底板510的複數個結合孔513,以分別夾持固定一電路板530;其中,該治具底板 510更包含兩片結合柱鎖板514,分別設置於該治具底板510之內部,可定向移動分別橫切過設置於該第一表面511與第二表面512的複數個結合孔513,該結合柱鎖板514設置有複數個鎖孔515,分別對應於該治具底板510的複數個結合孔513;該複數個鎖孔513可容該治具蓋框520的複數個結合柱523分別通過,移動該結合柱鎖板514後,該鎖孔515則將該結合柱523鎖住,避免該結合柱523自該結合孔513拔出而分離;該每個治具蓋框520更包含一導電框526與一方型阻隔圈525,該導電框526係設置於該治具蓋框520內部且與該複數個結合柱523電性相連,其上設置複數個導電針524,該複數個導電針524係突出於該第二表面522且位於該複數個結合柱523的內側,與被夾持的該電路板530接觸,以作為電鍍時導電之用;該方型阻隔圈525係設置於該第二表面522且位於該複數個導電針524的內側,以阻隔製程中所用化學液劑的滲透,防止其接觸該電路板530的其他裸露區域。另一方面,該複數個導電524則直接接觸該電路板530,以提供製程中所需的電流到電路板530。其中,該兩電路板530的待電鍍表面各覆蓋一層光阻乾膜(dry film)531。 The fifth figure shows a third embodiment of the circuit board fixture of the present invention. The cross-sectional view is applied to hold two circuit boards in the process, and the single-sided electroplating process of the two circuit boards can be simultaneously performed. As shown in FIG. 5, the circuit board fixture includes a jig bottom plate 510 and two jig cover frames 520. The jig bottom plate 510 is a flat plate having a first surface 511 and a second surface. 512, a plurality of bonding holes 513 are respectively disposed around the first surface 511 and the second surface 512; the two jig cover frames 520 are respectively coupled to the first surface 511 and the second surface of the jig bottom plate 510 512, respectively, holding a circuit board 530; the fixture cover frame 520 is a frame type object having a narrow first surface 521 and a wider second surface 522, so that the vertical section is a trapezoid; A plurality of binding posts 523 are disposed around the second surface 522 of the jig cover frame 520. The plurality of bonding posts 523 of each jig cover frame 520 can respectively be inserted into the plurality of combinations of the jig bottom plate 510. a hole 513 for respectively holding and fixing a circuit board 530; wherein the fixture bottom plate The 510 further includes two binding post lock plates 514 respectively disposed inside the jig bottom plate 510, and can be directionally moved to cross the plurality of coupling holes 513 disposed on the first surface 511 and the second surface 512, respectively. The column lock plate 514 is provided with a plurality of locking holes 515 respectively corresponding to the plurality of coupling holes 513 of the jig bottom plate 510; the plurality of locking holes 513 can respectively pass through the plurality of binding posts 523 of the jig cover frame 520. After the binding column lock plate 514 is moved, the locking hole 515 locks the binding post 523 to prevent the binding post 523 from being separated from the coupling hole 513. The jig cover frame 520 further includes a conductive frame. 526 and one type of barrier ring 525, the conductive frame 526 is disposed inside the jig cover frame 520 and electrically connected to the plurality of binding posts 523, and a plurality of conductive pins 524 are disposed thereon, and the plurality of conductive pins 524 are And protruding on the second surface 522 and located inside the plurality of bonding pillars 523, in contact with the clamped circuit board 530 for conducting electricity during electroplating; the square barrier ring 525 is disposed on the second surface 522 and located inside the plurality of conductive pins 524 for blocking As used in the chemical liquid permeability, to prevent its contact with other exposed areas of the circuit board 530. On the other hand, the plurality of conductive 524 directly contacts the circuit board 530 to provide the current required in the process to the circuit board 530. The surfaces to be plated of the two circuit boards 530 are each covered with a dry film 531.
值得注意的是,與第一與第二實施例相同,該結合柱523可設計為其頂端較大,且具有一略細頸部的柱狀體。相對應地,該鎖孔515則設計為一端較寬另一端較窄的孔;如此一來,該結合柱523的較大頂端可穿過該鎖孔515較寬的一端,然後再移動該結合柱鎖框514,使得該鎖孔515較窄的一端 卡住該結合柱523的頸部,以防止該結合柱523自該結合孔513拔出而分離,進而達到固鎖的效果。 It is to be noted that, as in the first and second embodiments, the binding post 523 can be designed as a columnar body having a large tip and a slightly narrow neck. Correspondingly, the locking hole 515 is designed as a hole having a wider end and a narrower end; thus, the larger tip of the binding post 523 can pass through the wider end of the locking hole 515, and then the combination is moved. The column lock frame 514 is such that the narrow end of the lock hole 515 The neck of the binding post 523 is caught to prevent the binding post 523 from being pulled out from the coupling hole 513 to be separated, thereby achieving the effect of locking.
再者,該治具底板510與該治具蓋框520可由抗腐 蝕且不與電路板製成過程中所使用之化學藥劑相作用的材料製成,例如鐵氟龍(teflon)之類的材料。該結合柱鎖板514則可由金屬製程,一方面提供較之強硬度,另一方面亦利於在該治具底板510內部移動以利該結合柱523進出該結合孔513與固鎖該結合柱523。同樣地,該導電框526也係由具導電性的金屬製程。該方型阻隔圈525則可由橡膠類材質製成,具有擠壓之彈性,可達到防止製程中所用化學液劑的滲透的效果。 Furthermore, the jig bottom plate 510 and the jig cover frame 520 can be resistant to corrosion It is made of a material that does not interact with the chemical agent used in the manufacturing process of the board, such as a material such as teflon. The binding column lock plate 514 can be made of a metal process, which provides a relatively strong hardness on the one hand, and facilitates movement inside the jig bottom plate 510 on the other hand, so that the binding post 523 enters and exits the coupling hole 513 and locks the binding post 523. . Similarly, the conductive frame 526 is also made of a conductive metal process. The square barrier ring 525 can be made of a rubber material and has the elasticity of extrusion to prevent the penetration of the chemical liquid used in the process.
綜而言之,本發明之實施例揭露一種電路板治 具,可分別夾持一片或兩片電路板,以利於單片電路板的單面或雙面電鍍,或是兩片電路板的同時單面電鍍。 In summary, an embodiment of the present invention discloses a circuit board The device can hold one or two circuit boards separately to facilitate single-sided or double-sided plating of a single circuit board, or simultaneous single-sided plating of two circuit boards.
因此,本發明之一種電路板治具,確能藉所揭露 之技藝,達到所預期之目的與功效,符合發明專利之新穎性,進步性與產業利用性之要件。 Therefore, the circuit board fixture of the present invention can be disclosed The craftsmanship achieves the intended purpose and effect, and meets the requirements of novelty, advancement and industrial utilization of invention patents.
惟,以上所揭露之圖示及說明,僅為本發明之較 佳實施例而已,非為用以限定本發明之實施,大凡熟悉該項技藝之人士其所依本發明之精神,所作之變化或修飾,皆應涵蓋 在以下本案之申請專利範圍內。 However, the illustrations and descriptions disclosed above are only the comparison of the present invention. The preferred embodiments are not intended to limit the implementation of the present invention, and those who are familiar with the art should be covered by the spirit of the present invention. In the following patent application scope of this case.
110‧‧‧治具底板 110‧‧‧ fixture bottom plate
113‧‧‧結合孔 113‧‧‧Combination hole
120‧‧‧治具蓋框 120‧‧ ‧ fixture cover
123‧‧‧結合柱 123‧‧‧ binding column
124‧‧‧導電針 124‧‧‧Conducting needle
125‧‧‧阻隔圈 125‧‧‧Break ring
Claims (18)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104114434A TWI554654B (en) | 2015-05-06 | 2015-05-06 | Printed circuit board fixture for electroplating process |
| CN201610031932.1A CN106132088A (en) | 2015-05-06 | 2016-01-19 | Circuit board tool of electroplating process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104114434A TWI554654B (en) | 2015-05-06 | 2015-05-06 | Printed circuit board fixture for electroplating process |
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| Publication Number | Publication Date |
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| TWI554654B true TWI554654B (en) | 2016-10-21 |
| TW201639991A TW201639991A (en) | 2016-11-16 |
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| TW104114434A TWI554654B (en) | 2015-05-06 | 2015-05-06 | Printed circuit board fixture for electroplating process |
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| CN (1) | CN106132088A (en) |
| TW (1) | TWI554654B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108691005A (en) * | 2017-04-07 | 2018-10-23 | 台湾先进系统股份有限公司 | Leakage detection method and device suitable for full-frame conductive electroplating jig |
| TWI670491B (en) * | 2018-12-10 | 2019-09-01 | 財團法人工業技術研究院 | Electrochemical processing device and method for operating electrochemical processing device |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107858740B (en) * | 2017-11-24 | 2024-04-02 | 苏州市康普来新材料有限公司 | Local electroplating jig for radiating fin of new energy automobile inverter |
| TWI722555B (en) * | 2019-09-04 | 2021-03-21 | 日月光半導體製造股份有限公司 | Electroplating holder |
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| TW201425654A (en) * | 2012-11-14 | 2014-07-01 | 傑希優股份有限公司 | Substrate plating fixture |
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| JP2000119899A (en) * | 1998-10-13 | 2000-04-25 | Sumitomo Metal Electronics Devices Inc | Sheet mounting jig for plating and sheet attaching and detaching device |
| JP2000340729A (en) * | 1999-05-28 | 2000-12-08 | Ngk Spark Plug Co Ltd | Plating jig |
| CN102134735A (en) * | 2011-02-28 | 2011-07-27 | 上海美维电子有限公司 | Carrying tool for printed circuit board (PCB) |
| CN202144521U (en) * | 2011-06-10 | 2012-02-15 | 赫克斯科技股份有限公司 | Electroplating jig for electroplating circuit board |
| CN103167734B (en) * | 2011-12-09 | 2016-02-24 | 景硕科技股份有限公司 | sheet supporting jig |
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2015
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- 2016-01-19 CN CN201610031932.1A patent/CN106132088A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201425654A (en) * | 2012-11-14 | 2014-07-01 | 傑希優股份有限公司 | Substrate plating fixture |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108691005A (en) * | 2017-04-07 | 2018-10-23 | 台湾先进系统股份有限公司 | Leakage detection method and device suitable for full-frame conductive electroplating jig |
| TWI670491B (en) * | 2018-12-10 | 2019-09-01 | 財團法人工業技術研究院 | Electrochemical processing device and method for operating electrochemical processing device |
| US11414776B2 (en) | 2018-12-10 | 2022-08-16 | Industrial Technology Research Institute | Electrochemical processing device and method for operating electrochemical processing device |
Also Published As
| Publication number | Publication date |
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| CN106132088A (en) | 2016-11-16 |
| TW201639991A (en) | 2016-11-16 |
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