TWI549025B - Touch panel - Google Patents

Description

Touch panel

The invention relates to a touch panel.

With the development of electronic product design gradually becoming user-oriented, considering the user's convenience of operation, products with touch panel input function have gradually become the mainstream in the market. For example, in products such as smart phones or tablets, touch panels are an important and indispensable part. At present, touch panels can be roughly divided into resistive, capacitive, optical, and electromagnetic touch panels. In the market and the maturity of the technology, capacitive touch technology is used in the above various touch technologies. The application level is the most extensive. In addition, the application of the touch panel is gradually increasing to a larger size. As the area of the touch panel increases, some of the driving technologies used in the small and medium size cannot be effectively applied to the large-sized touch panel. It is necessary to develop a drive architecture suitable for large-size touch panels.

One aspect of the present invention provides a touch panel. The touch panel includes a substrate, a plurality of first sensing series, a plurality of second sensing series, a first chip, and a plurality of control signal lines. The substrate has a sensing region and a peripheral region surrounding the sensing region. The first sensing series is disposed in the sensing area. Each of the second sensing series is interleaved with each of the first sensing series. The first wafer is disposed in a peripheral area of the substrate, The first wafer includes a transmitting unit, a receiving unit, and a control unit. The sending unit is configured to send a signal to the first sensing series. The receiving unit is configured to receive the signal of the second sensing serial. The control unit is used to control the transmitting unit and the receiving unit. The control signal lines are formed on the peripheral area on the substrate, and the control signal lines extend from one side of the substrate to below the first driving wafer for transmitting control signals to the control unit.

Another aspect of the present invention provides a touch panel. The touch panel includes a substrate, a plurality of first sensing series, a plurality of second sensing series, at least one signal transmitting chip, at least one signal receiving chip, a plurality of first control signal lines, a plurality of second control signal lines, and Flexible circuit board and control unit. The substrate has a sensing region and a peripheral region surrounding the sensing region. The first sensing series is disposed in the sensing area, and each of the second sensing series is interlaced with each of the first sensing series. The signal transmitting chip is disposed in a peripheral area of the substrate for transmitting a signal to the first sensing series. The signal receiving chip is disposed in a peripheral area of the substrate for receiving the signal of the second sensing series. The first control signal line is used to transmit the first control signal to the signal transmitting chip. The second control signal line is configured to transmit the second control signal to the signal receiving chip, wherein the first and second control signal lines each have a junction region where the one end portion is collected to the substrate. The flexible circuit board has a joint end coupled to the joint region and connected to the first control signal line and the second control signal line. The control unit respectively transmits the first control signal and the second control signal to the signal transmitting chip and the signal receiving chip via the flexible circuit board.

1, 2, 3‧‧‧ first sensing serial number

4, 5, 6‧‧‧ first sensing serial number

100, 100a, 100b‧‧‧ touch panel

110‧‧‧Substrate

110a‧‧‧Sensing area

110b‧‧‧ surrounding area

110c‧‧‧ Short side

110d‧‧‧Longside

110e‧‧‧ junction area

120‧‧‧First sensing series

120a‧‧‧ first

120b‧‧‧ second

122‧‧‧First sensing pad

124‧‧‧First bridge wiring

130‧‧‧Second sensing series

140‧‧‧First driver chip

140t‧‧‧Send

140r‧‧‧ Receiver

142‧‧‧Control unit

144‧‧‧Send unit

146‧‧‧ receiving unit

150‧‧‧Control signal line

152‧‧‧Second control signal line

153‧‧‧ Third control signal line

154‧‧‧Flexible circuit board

161‧‧‧First signal line

162‧‧‧Second signal line

170‧‧‧Second driver chip

173‧‧‧ Third driver chip

200, 200a‧‧‧ touch panel

200b, 200c‧‧‧ touch panel

210, 210a‧‧‧ signal transmission chip

210b‧‧‧ signal transmission chip

220, 220a‧‧‧ signal receiving chip

220b, 220c‧‧‧ signal receiving chip

230‧‧‧Flexible circuit board

240‧‧‧Control unit

251‧‧‧First control signal line

252‧‧‧Second control signal line

253‧‧‧ third control signal line

254‧‧‧fourth control signal line

255‧‧‧ fifth control signal line

256‧‧‧ sixth control signal line

261‧‧‧First signal line

262‧‧‧Second signal line

263, 263a‧‧‧ third signal line

264, 264a‧‧‧ fourth signal line

270‧‧‧ circuit board

D1‧‧‧ first direction

D2‧‧‧ second direction

A1‧‧‧First Group

A2‧‧‧Second group

B1‧‧‧First Group

B2‧‧‧Second group

G‧‧‧ gap

T1-T10‧‧‧Send

FIG. 1 is a schematic top view of a touch panel according to an embodiment of the present invention.

FIG. 2 is a schematic top view of a touch panel according to another embodiment of the present invention.

FIG. 3 is a schematic top view of a touch panel according to another embodiment of the present invention.

FIG. 4 is a schematic top plan view of a touch panel according to still another embodiment of the present invention.

FIG. 5 is a schematic top view of a touch panel according to still another embodiment of the present invention.

FIG. 6 is a schematic top plan view of a touch panel according to still another embodiment of the present invention.

FIG. 7 is a schematic top view of a touch panel according to still another embodiment of the present invention.

The description of the embodiments of the present invention is intended to be illustrative and not restrictive. The embodiments disclosed herein may be combined or substituted with each other in an advantageous manner, and other embodiments may be added to an embodiment without further description or description.

In the following description, numerous specific details are set forth However, embodiments of the invention may be practiced without these specific details. In other instances, well-known structures and devices are only schematically shown in the drawings in order to simplify the drawings.

FIG. 1 is a schematic plan view of a touch panel 100 according to an embodiment of the present invention. The touch panel 100 includes a substrate 110 , a plurality of first sensing series 120 , a plurality of second sensing series 130 , a first driving chip 140 , and a plurality of control signal lines 150 .

The substrate 110 has a sensing region 110a and a peripheral region 110b. Surrounding The region 110b is located near the edge of the substrate 110, and the peripheral region 110b surrounds the sensing region 110a. The substrate 110 can be, for example, a glass substrate, an ethylene terephthalate (PET) substrate, or other suitable substrate. The substrate 110 is preferably a transparent substrate, but the invention is not limited thereto.

A plurality of first sensing series 120 are disposed in the sensing region 110a of the substrate 110. In detail, each of the first sensing series 120 includes a plurality of first sensing pads 122 and a plurality of first bridge wires 124 , and each of the first bridge wires 124 is connected in series with two adjacent first sensing pads 122 . . In an embodiment, each of the first sensing series 120 extends substantially toward the first direction D1.

Each of the second sensing series 130 and the at least one first sensing series 120 are interleaved. In an embodiment, each of the second sensing series 130 may be interleaved with a plurality of first sensing series 120. Each of the second sensing series 130 includes a plurality of second sensing pads 132 and a plurality of second bridge wires 134 , each of which is connected in series with two adjacent second sensing pads 132 . Each of the first sensing series 120 extends substantially toward the second direction D2, and the second direction D2 is substantially different from the first direction D1, for example, the second direction D2 is substantially perpendicular to the first direction D1. In other embodiments, the second direction D2 may not be perpendicular to the first direction D1. In the embodiment illustrated in FIG. 1 , the second sensing series 130 and the first sensing series 120 are both formed on the sensing region 110 a of the substrate 110 , but the second sensing series 130 and the first sensing Tandem 120 is not in direct contact. For example, a dielectric layer (not shown in FIG. 1) may be disposed between the second sensing series 130 and the first sensing series 120; the dielectric layer may cover the sensing region 110a of the substrate 110, or The electrical layer may also be disposed only at the intersection of the second sensing series 130 and the first sensing series 120. In other In an embodiment, the second sensing series 130 may be formed on another substrate (not shown in FIG. 1 ), and a dielectric layer is disposed between the two substrates to space the second sensing series 130 and the first sense. The series 120 is measured.

The first driving wafer 140 is disposed on the peripheral region 110b of the substrate 110, and the first driving wafer 140 is bonded to the substrate 110 by chip-on-glass (COG). The first driver wafer 140 includes a control unit (MCU) 142, a transmitting unit (RX) 144, and a receiving unit (RX) 146. The sending unit 144 is configured to send the detecting signal to the first sensing series 120, the receiving unit 146 is configured to receive the signal transmitted by the second sensing serial 130, and the control unit 142 is configured to control the sending unit 144 and the receiving unit. 146, and let the transmitting unit 144 and the receiving unit 146 cooperate.

The control signal line 150 is formed in the peripheral region 110b of the substrate 110 for transmitting one or more sets of control signals to the control unit 142 of the first driver wafer 140. Control signal line 150 extends from one side of substrate 110 below first drive wafer 140 to connect first drive wafer 140. In one embodiment, the control signals transmitted by the control signal lines 150 are in the I2C, SPI or USB format, and thus the number of the control signal lines 150 is from about 4 to about 12. Therefore, according to an embodiment of the present invention, the number of control signal lines 150 can be reduced.

In one embodiment, the touch panel 100 further includes a flexible circuit board 154 that is bonded to the edge of the substrate 110 and electrically connected to the control signal lines 150. As the number of control signal lines 150 decreases, the number of wires in the flexible circuit board 154 also decreases.

The first driving chip 140 further includes a plurality of transmitting ends 140t and more Receiver 140r. The transmitting end 140t and the receiving end 140r can be, for example, contact pads, and the transmitting end 140t and the receiving end 140r are electrically connected to the transmitting unit 144 and the receiving unit 146, respectively. Moreover, each of the transmitting ends 140t is electrically connected to at least one first sensing series 120, and each receiving end 140r is electrically connected to at least one second sensing series 130. In an embodiment, the number of receiving ends 140r is greater than the number of transmitting ends 140t.

In one embodiment, the touch panel 100 further includes a plurality of first signal lines 161 for transmitting signals of the transmitting end 140t to the first sensing series 120. Specifically, the first signal line 161 is located in the peripheral area 110b, and each of the first signal lines 161 is electrically connected to a transmitting end 140t and a first sensing series 120.

In another embodiment, the touch panel 100 further includes a plurality of second signal lines 162 disposed in the peripheral region 110b. The first signal lines 161 and the second signal lines 162 are respectively located on opposite sides of the substrate 110. In more detail, the transmitting end 140t can be divided into a first group A1 and a second group A2, and the transmitting ends 140t belonging to the first group A1 are connected to a part of the first sensing series via the first signal line 161. 120. The transmitting ends 140t belonging to the second group A2 are connected to the first sensing series 120 of the other portion via the second signal line 162. For example, the transmitting end 140t of the first group A1 is connected to the odd first sensing series 120 (1, 3, 5 indicated in FIG. 1) via the first signal line 161, and the second group A2 The transmitting end 140t is connected to the even first sensing series 120 (2, 4, 6 indicated in FIG. 1) via the second signal line 162. In other embodiments, the transmitting end 140t of the first group A1 can be connected to the first sensing string located in the upper half of the sensing area 110a via the first signal line 161. The column 120 (not shown in FIG. 1), the transmitting end 140t of the second group A2 can be connected to the first sensing series 120 located in the lower half of the sensing region 110a via the second signal line 162. The number of transmitting ends 140t of the first group A1 may be the same or different from the number of transmitting ends 140t of the second group A2.

The touch panel can include a plurality of drive wafers as shown in FIG. The touch panel 100a may further include a second driving wafer 170, which is also disposed on the peripheral region 110b on the substrate 110. The second drive wafer 170 is substantially controlled by the first drive wafer 140. In other words, the first driving wafer 140 and the second driving wafer 170 have a master-slave relationship, the first driving wafer 140 is a master IC, and the second driving wafer 170 is a slave IC. Please note that in the embodiment, the second driving wafer 170 has the same structure as the first driving wafer 140. As described above, the first driving wafer 140 includes a control unit, a transmitting unit, and a receiving unit. The second driver wafer 170 also includes a control unit, a transmitting unit, and a receiving unit, but the control unit of the second driver wafer 170 is substantially idle, and the second driver wafer 170 is in fact controlled by the first driver wafer 140. Moreover, the touch panel 100a in this embodiment further includes a plurality of second control signal lines 152, and the peripheral area 110b is disposed. The second control signal line 152 is electrically connected to the first driving chip 140 and the second driving wafer 170 for transmitting one or more sets of control signals to the second driving wafer 170. Therefore, according to an embodiment of the present invention, the touch panel 100a only needs to use one driving wafer of the same specification, which represents a reduction in manufacturing cost.

Referring to FIG. 2 again, the touch panel 100a further includes a plurality of first signal lines 161 and a plurality of second signal lines 162, and the first signal lines 161 and The two signal lines 161, 162 are disposed in the peripheral region 110b of the substrate 110. In an example, the first driving chip 140 transmits a signal to a portion of the first sensing series 120 (shown in FIG. 1 ) via the first signal line 161 , and the second driving chip 170 transmits the signal via the second signal line 162 . The first sensing series 120 to another portion. In another example, in order to implement the "bilateral drive", each of the first sensing series 120 corresponds to a first signal line 161 and a second signal line 162, and opposite ends of each of the first sensing series 120 Connected to the corresponding first signal line 161 and second signal line 162 (not shown in FIG. 2).

Of course, the touch panel can contain more than three drive wafers, as shown in FIG. The touch panel 100b further includes a third driving chip 173 and a third control signal line 153. The second control signal line 152 is electrically connected to the first driving chip 140 and the second driving chip 170, and the third control signal line 153 is electrically connected to the second driving chip 170 and the third driving wafer 173. The third driving chip 173 transmits a signal to the first sensing series 120 via the second signal line 162.

When the size of the touch panel is increased, the driving ability and the driving voltage of the transmitting unit 144 must be increased accordingly, and therefore the integrated circuit of the transmitting unit 144 must be manufactured using a high voltage integrated circuit process. In addition, when the resolution of the touch panel is improved, the computing power of the control unit 142 and the memory space are also greatly increased. Therefore, it is necessary to propose another structure of the touch panel, which will be described in more detail below.

FIG. 4 is a schematic top plan view of a touch panel 200 according to another embodiment of the present invention. The touch panel 200 includes at least one signal transmitting chip 210, at least one signal receiving chip 220, a flexible circuit board 230, a control unit 240, a plurality of first control signal lines 251, and a plurality of second control signals. Line 252. In addition, the touch panel 200 further includes a substrate 110 , a plurality of first sensing series 120 , and a plurality of second sensing series 130 . The substrate 110, the first sensing series 120, and the second sensing series 130 may be the same as any of the foregoing embodiments or embodiments, and details are not described herein.

The signal transmitting wafer 210 is disposed in the peripheral region 110b of the substrate 110. The signal transmitting chip 210 is configured to send the detecting signal to the first sensing series 120. The structure of the signal transmitting wafer 210 is different from that of the first driving chip 140 described above. In an example, the signal transmitting wafer 210 does not include a control unit (MCU) and a receiving unit (RX), and the signal transmitting wafer 210 is disposed on the substrate. Control unit 240 outside 110 controls.

The signal receiving wafer 220 is provided with a peripheral region 110b of the substrate 110 for receiving signals transmitted from the second sensing series 130. The structure of the signal receiving wafer 220 is different from that of the first driving chip 140 described above. In an example, the signal receiving wafer 220 does not include a control unit (MCU) and a transmitting unit (TX), and the signal receiving wafer 220 is disposed on the substrate. Control unit 240 outside 110 controls.

The first control signal line 251 is used to transmit one or more sets of control signals to the signal transmitting chip 210. Specifically, the control unit 240 can transmit a signal to the signal transmitting wafer 210 via the first control signal line 251. In one embodiment, the first control signal line 251 is disposed in the peripheral region 110b of the substrate 110, and the first control signal lines 251 are extended from the bonding region 110e of the substrate 110 to the lower side of the signal transmitting wafer 210 to electrically connect the signals. The wafer 210 is sent.

The second control signal line 252 is used to transmit one or more sets of control signals. The signal is received by the signal receiving chip 220. Specifically, the control unit 240 can transmit the signal to the signal receiving wafer 220 via the second control signal line 252. In one embodiment, the first control signal line 251 is disposed in the peripheral region 110b of the substrate 110, and the second control signal lines 252 are extended from the bonding region 110e of the substrate 110 to the lower side of the signal receiving chip 220 to electrically connect the signals. The wafer 220 is received.

The control unit 240 transmits control signals to the signal transmitting wafer 210 and the signal receiving wafer 220 via the flexible circuit board 230. The control unit 240 may be disposed on an external circuit board 270. One end of the flexible circuit board 230 is coupled to the circuit board 270, and the other end of the flexible circuit board 230 is coupled to the land 110e of the substrate 110, and is flexible. The circuit board 230 is electrically connected to the first control signal line 251 and the second control signal line 252. The control unit 240 transmits the first control signal to the signal transmitting wafer 210 via the flexible circuit board 230 and the first control signal line 251, while the control unit 240 transmits the second control via the flexible circuit board 230 and the second control signal line 252. The signal to signal receiving wafer 220. The first control signal and the second control signal are, for example, SPI or I2C format.

In one embodiment, the touch panel 200 includes a plurality of signal transmitting wafers 210 and a plurality of signal transmitting wafers 210, as shown in FIG. Each of the signal transmitting wafers 210 is disposed along the short side 110c of the substrate 110, and each of the signal receiving wafers 220 is disposed along the long side 110d of the substrate 110. In the embodiment, the touch panel 200 further includes a plurality of third control signal lines 253 and a plurality of fourth control signal lines 254. The third control signal lines 253 and the fourth control signal lines 254 are located in the peripheral area of the substrate 110. 110b. Every piece The three control signal lines 253 are connected in series to the adjacent two signal transmitting wafers 210. In addition, each of the fourth control signal lines 254 is connected in series to the adjacent two signal receiving wafers 220.

In another embodiment, the signal transmitting wafers 210 can be divided into a first group B1 and a second group B2, as shown in FIG. The signal transmitting wafer 210 of the first group B1 and the signal transmitting wafer 210 of the second group B2 are respectively disposed on opposite sides of the substrate 110. The control unit 240 controls the signal transmitting wafer 210 of the first group B1 via the first control signal line 251. On the other hand, the control unit 240 controls the signal transmitting wafer 210 of the second group B2 via the second control signal line 252. In more detail, the touch panel 200 can include a plurality of fifth control signal lines 255 disposed in the peripheral area 110b, and a fifth control signal line 255 bridging a signal transmitting chip 210 and a signal receiving chip 220 of the second group B2. Therefore, the control unit 240 can control the signal transmitting wafer 210 of the second group B2 via the second control signal line 252, the signal receiving chip 220, the fourth control signal line 254, and the fifth control signal line 255. In an example, the signal transmitting chip 210 of the first group B1 transmits a signal to a portion of the first sensing series 120, and the signal transmitting chip 210 of the second group B2 transmits a signal to the first sensing series of another portion. 120. For example, the signal transmitting chip 210 of the first group B1 transmits a signal to the first sensing series 120 of the odd strips, and the signal transmitting wafer 210 of the second group B2 transmits the signal to the first sensing series 120 of the even strips. In another example, the signal transmitting wafer 210 of the first group B1 and the signal transmitting wafer 210 of the second group B2 have a corresponding relationship to achieve bilateral driving. In the bilaterally driven architecture, the opposite ends of each of the first sensing series 120 are respectively connected to the first group A signal from group B1 transmits wafer 210 and a signal transmitting wafer 210 of second group B2.

FIG. 5 is a schematic top plan view of a touch panel 200a according to still another embodiment of the present invention. In the present embodiment, the signal transmitting wafer 210 provided only on the single side of the sensing region 110a can also achieve bilateral driving. The touch panel 200a further includes a plurality of third signal lines 263 and a plurality of fourth signal lines 264. Each of the third signal lines 263 corresponds to a fourth signal line 264. More specifically, as shown in FIG. 5, the third signal line 263a corresponds to the fourth signal line 264a, and the third signal line 263a and the fourth signal line 264a are connected to the same transmitting end T2 of the signal transmitting wafer 210. The third signal line 263a bypasses the sensing region 110a from one side of the sensing region 110a and extends to the opposite side of the sensing region 110a. In addition, each of the first sensing series 120 is composed of a first portion 120a and a second portion 120b, and a gap G is spaced between the first portion 120a and the second portion 120b. One end of the third signal line 263a is located below the signal transmitting chip 210 to electrically connect the transmitting end T2 of the signal transmitting chip 210; the other end of the third signal line 263a is connected to the first portion 120a of the first sensing series 120. One end of the fourth signal line 264a is connected to the second portion 120b of the first sensing series 120, and the other end is extended below the signal transmitting chip 210 to electrically connect the transmitting end T2. Therefore, it is only necessary to transmit the wafer 210 on the single side of the substrate 100, and it is also possible to realize bilateral driving without increasing the number of signal transmitting wafers 210.

FIG. 6 is a schematic top plan view of a touch panel 200b according to still another embodiment of the present invention. The main difference between the present embodiment and the touch panel 200 shown in FIG. 4 is that the signal transmitting chip 210 and the signal receiving are received. The wafer 220 is disposed along the long side 110d of the substrate 110. In detail, the first control signal line 251 and the second control signal line 252 extend from the land 110e of the substrate 110 to below the signal transmitting wafer 210a. The control unit 240 transmits the plurality of sets of control signals to the signal transmitting wafer 210a via the first control signal line 251 and the second control signal line 252. The sixth control signal line 256 is connected to the signal transmitting chip 210a and the signal receiving chip 220a for use as a signal transmission path between the control unit 240 and the signal receiving chips 220a, 220b, 220c and the signal transmitting wafer 210b. In addition, a plurality of first signal lines 261 and a plurality of second signal lines 262 are disposed on opposite sides of the substrate 110. Each of the first signal lines 261 electrically bridges the signal transmitting chip 210a and the first sensing series in the sensing area 110a; each of the second signal lines 262 electrically bridges the signal transmitting chip 210b and the first sense in the sensing area 110a Measure the series. Other elements, details, and features of the present embodiment may be the same as those of the fourth embodiment described above.

FIG. 7 is a schematic top plan view of a touch panel 200c according to still another embodiment of the present invention. The touch panel 200c of the present embodiment is different from the touch panel 200b shown in FIG. 5 in that some signal transmitting wafers 210 are disposed on the peripheral region 110b adjacent to the short side of the substrate, and other signal transmitting wafers 210 are disposed. On the peripheral region 110b adjacent to the long side of the substrate. As shown in FIG. 7, the signal transmitting wafers 210a, 210b are located on the peripheral portion 110b of the short side of the substrate 110, and the signal transmitting wafers 210a, 210b are positioned on the peripheral portion 110b of the long side of the substrate 110.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and those skilled in the art may, without departing from the spirit of the invention. And the scope of the invention is defined by the scope of the appended claims.

110‧‧‧Substrate

110a‧‧‧Sensing area

110b‧‧‧ surrounding area

110c‧‧‧ Short side

110d‧‧‧Longside

110e‧‧‧ junction area

120‧‧‧First sensing series

130‧‧‧Second sensing series

200‧‧‧ touch panel

210‧‧‧Signal transmission chip

220‧‧‧Signal receiving chip

230‧‧‧Flexible circuit board

240‧‧‧Control unit

251‧‧‧First control signal line

252‧‧‧Second control signal line

253‧‧‧ third control signal line

254‧‧‧fourth control signal line

255‧‧‧ fifth control signal line

270‧‧‧ circuit board

B1‧‧‧First Group

B2‧‧‧Second group

Claims (12)

A touch panel includes: a substrate having a sensing area and a peripheral area surrounding the sensing area; a plurality of first sensing series disposed in the sensing area; and a plurality of second sensing series, each of the The second sensing series is interleaved with at least one of the first sensing series; at least one signal transmitting chip is disposed in the peripheral area of the substrate for transmitting a signal to the first sensing series The at least one signal receiving chip is disposed in the peripheral area of the substrate for receiving a signal of the second sensing series; the plurality of first control signal lines are configured to transmit a first control signal to the signal sending a plurality of second control signal lines for transmitting a second control signal to the signal receiving chip, wherein each of the first and second control signal lines has a junction region at one end of the substrate; a flexible circuit board having a junction end coupled to the junction region and connecting the first control signal lines and the second control signal lines; and a control unit for transmitting the first via the flexible circuit board a control signal and the Second control signal to the signal transmitting and signal receiving wafer wafer. The touch panel of claim 1, wherein the at least one signal transmitting chip is a plurality of signal transmitting chips, and the substrate has a short side and a long side, and the signal transmitting wafers are disposed along the short side. The touch panel of claim 2, further comprising a plurality of third control signal lines located in the peripheral area of the substrate, wherein the third control signal lines are connected in series with two adjacent signal transmitting chips. The touch panel of claim 1, wherein the at least one signal transmitting chip is a plurality of signal transmitting chips, and the signal transmitting chips are divided into a first group and a second group, respectively arranged in the sensing area. On both sides. The touch panel of claim 4, wherein the control unit controls the signal transmitting chips of the first group via the first control signal lines, and the control unit controls the second via the second control signal lines The signals of the group send the chips. The touch panel of claim 1, wherein the at least one signal receiving chip is a plurality of signal receiving chips, and the substrate has a short side and a long side, and the signal receiving wafers are disposed along the long side. The touch panel of claim 6, further comprising a plurality of fourth control signal lines located in the peripheral area of the substrate, wherein the fourth control signal lines are connected in series with two adjacent signal receiving chips. The touch panel of claim 6, further comprising a plurality of fifth control signal lines disposed in the peripheral area of the substrate, wherein the at least one signal receiving chip is a plurality of signal receiving chips, and the fifth control signal lines Bridge the news One of the transmitting wafers and one of the signal receiving wafers. The touch panel of claim 1, wherein the first control signal lines are extended by the signal transmission wafer to the bonding area of the substrate. The touch panel of claim 1, wherein the second control signal lines are received by the signal to extend the bonding area of the substrate below the wafer. The touch panel of claim 1, wherein the at least one signal transmitting chip is a plurality of signal transmitting chips, the at least one signal receiving chip is a plurality of signal receiving chips, and the substrate has a short side and a long side. The signal transmitting chips and the signal receiving chips are disposed along the long side, and wherein the first control signal lines and the second control signal lines are extended from the signal transmitting wafer to the bonding area of the substrate. The touch panel of claim 1 further includes a plurality of third signal lines and a plurality of fourth signal lines, wherein the third signal lines and the fourth signal lines are located in the peripheral area, and each of the third Corresponding to one of the fourth signal lines, the third signal line and the fourth signal line are connected to the same transmitting end of the signal transmitting chip, and the third signal lines are from the sensing area One side of the first sensing line is connected to the opposite side of the sensing line, and the third signal line and the fourth signal line are respectively connected to opposite sides of the first sensing series.