TWI546006B - Method of manufacturing print circuit board - Google Patents

Description

Printed wiring board manufacturing method

The present invention relates to a method of manufacturing a printed wiring board.

With the demand for high functionality of electronic equipment, high-density integration of electronic components and even high-density mounting have continued to develop. For this reason, in terms of a printed wiring board for high-density mounting of electronic components, etc., the size, thickness, density, and multilayering have been increasing as compared with the prior art.

As a conductor circuit layer having high pattern precision at a high density on a substrate of a printed wiring board, a semi-additive method (SAP method) has been started.

The formation of the circuit according to the SAP method is carried out, for example, according to the following description. First, the surface of the resin of the core substrate or the interlayer insulating layer is roughened. Next, an electroless plating layer of the substrate is formed on the surface of the roughened resin. Next, the non-circuit forming portion is protected by plating a photoresist, and the plating portion is thickened by plating. Thereafter, the photoresist is removed, and the electroless plating layer other than the circuit formation portion is removed by flash etching to form a circuit on the surface of the resin.

According to the SAP method, the metal layer laminated on the surface of the resin can be thinned. Therefore, a finer circuit wiring can be formed.

However, in the case of the SAP method of the resin surface of the prior art for the core substrate or the interlayer insulating layer, sufficient adhesion is not obtained between the conductor circuit layer and the resin surface, and the peeling strength of the conductor circuit layer is lowered. situation shape. At this time, when the printed wiring board is exposed to high-temperature and high-humidity conditions, for example, problems such as peeling of the conductor circuit layer, occurrence of humidification expansion, or deterioration of connection reliability occur.

In addition, in recent years, in order to achieve both a reduction in thickness and a low warpage of the package substrate, there is a case where the filler is highly filled for the purpose of high rigidity of the substrate and low thermal expansion. At this time, the problem of the adhesion between the conductor circuit layer and the resin surface according to the SAP method is conspicuous. This is due to the influence of the filler material when chemical treatment is performed by plating or removing burrs or the like.

In order to improve the adhesion between the resin surface and the conductor circuit layer, for example, the SAP method disclosed in Patent Documents 1 and 2 applies a roughening treatment to the surface of the resin so that the unevenness of the surface of the resin is 1 to 7 μm.

Further, Patent Document 3 discloses a method in which a ruthenium coupling agent is laminated on a copper foil which is not subjected to roughening treatment, and an extremely thin undercoat layer is further laminated thereon to obtain an extremely thin adhesive layer. The copper foil is excellent in adhesion strength to the base resin.

[Previous Technical Literature] [Patent Literature]

Patent Document 1: Japanese Patent Laid-Open Publication No. 2003-69218

Patent Document 2: Japanese Patent Laid-Open Publication No. 2003-60341

Patent Document 3: Japanese Patent Laid-Open Publication No. 2005-053218

The object of the present invention is to pass through a semi-additive method on a core substrate or interlayer The surface of the resin of the insulating layer forms a conductor circuit layer having high adhesion, and a printed wiring board having a high peeling strength of the conductor circuit layer is obtained.

According to the present invention, there is provided a method of producing a printed wiring board comprising: forming an electroless plating layer by electroless plating on the surface of the substrate having a resin composition; a step of forming a photoresist mask having an opening on the electroless plating layer; a step of forming a plating layer by electroplating in the opening; a step of removing the photoresist mask; and the electroless plating described above In the coating, the step of removing the portion which is not overlapped with the plating layer by etching is selectively removed by etching; after the step of forming the electroless plating layer, before the step of forming the plating layer, heating the substrate The first heating step, and/or after forming the plating layer described above, has a second heating step of heating the substrate.

According to the present invention, a conductor circuit layer having high adhesion can be formed on the surface of the resin of the core substrate or the interlayer insulating layer by a semi-additive method, and a printed wiring board having a high peeling strength of the conductor circuit layer can be obtained.

The above and other objects, features, and advantages will be apparent from the description of the preferred embodiments illustrated in the appended claims.

Hereinafter, embodiments of the present invention will be described using a schematic diagram. In addition, in all the drawings, the same component elements are given the same constituent elements. No., and the description is omitted as appropriate.

Fig. 1 is a schematic view showing an example of a method of manufacturing a printed wiring board of the embodiment. Fig. 2 is a flow chart showing an example of a method of manufacturing the printed wiring board of the embodiment.

The method of manufacturing a printed wiring board according to the present embodiment includes the step of forming an electroless plating layer 2 by electroless plating on the surface of the substrate 1 for a printed wiring board having a resin composition. a step of forming a photoresist mask 3 having an opening on the electroless plating layer 2; a step of forming a plating layer 4 by electroplating in the opening of the photoresist mask 3; and a step of removing the photoresist mask 3; In the electroless plating layer 2, the step of treating the portion which is not overlapped with the plating layer 4 by etching is selectively removed by etching. Further, the method of manufacturing a printed wiring board according to the present embodiment has a first heating step of heating the substrate 1 for a printed wiring board, and/or a step of forming the plating layer 4 after the step of forming the electroless plating layer 2, and/or After the plating layer 4 is formed, there is a second heating step of heating the substrate 1 for printed wiring boards.

According to this embodiment, the adhesion between the substrate for a printed wiring board and the conductor circuit layer can be improved. Therefore, the peel strength of the conductor circuit layer constituting the printed wiring board obtained in the present embodiment can be improved.

The second heating step may be between the step of forming the plating layer 4 and the step of removing the photoresist mask 3, the step of removing the photoresist mask 3, and the step of selectively removing the electroless plating layer 2 or the selective This is carried out after the step of removing the electroless plating layer 2. After the step of selectively removing the electroless plating layer 2 In the second heating step, after the electroless plating layer 2 is selectively removed, the heat treatment according to the second heating step is performed, and the circuit layer forming phase ends.

By performing both the first heating step and the second heating step, the adhesion between the printed wiring board substrate and the conductor circuit layer can be further improved.

Hereinafter, an example of a method of manufacturing the printed wiring board of the present invention will be described with reference to Figs. 1 and 2 . The manufacturing method of the printed wiring board shown in FIG. 1 and FIG. 2 includes the step (step (a)) of preparing the printed wiring board substrate 1 in sequence, and the step of forming the electroless plating layer 2 (step (b)). a step of forming a photoresist mask 3 (step (c)), a step of forming a plating layer 4 (step (d)), a step of removing the photoresist mask 3 (step (e)), and selectively removing electroless plating The steps of the step of coating 2 (step (f)) form a circuit layer forming phase of the conductor circuit layer. The first heating step is carried out between step (b) and step (c). The second heating step is carried out after step (f).

Further, the method of manufacturing the printed wiring board of the present embodiment is not limited to the above method. The first heating step can be carried out between step (b) and step (c) or between step (c) and step (d). Further, the second heating step may be carried out between step (d) and step (e), between step (e) and step (f) or after step (f). Further, both the first heating step and the second heating step may be performed, or only one of them may be performed, and preferably both the first heating step and the second heating step are performed.

First, as shown in FIG. 1(a), in the step (a), the printed wiring board substrate 1 is prepared.

The substrate 1 for a printed wiring board is not particularly limited and can be used, for example. A core substrate composed of a laminate or a metal-clad laminate or the like, or a multilayer substrate having an insulating layer covering the inner layer circuit. The method for producing a printed wiring board according to the present embodiment can be applied when the conductor circuit layer is formed on the surface of the insulating resin composition by the SAP method. The method for manufacturing a printed wiring board according to the present embodiment can be applied, for example, to a conductor circuit layer formed on a core substrate or an inner layer circuit or an outer layer circuit of a multilayer printed wiring board.

As the laminated body constituting the core substrate, for example, a plurality of prepregs may be used in a plurality of sheets. The prepreg system is not particularly limited and can be obtained by a known method. The prepreg system can be formed, for example, by heating and drying a substrate such as a glass woven fabric impregnated with a varnish containing a resin composition such as a thermosetting resin, a curing agent, and a filler.

For the metal-clad laminate which constitutes the core substrate, for example, a metal foil may be laminated on at least one surface of the prepreg or the laminate, and may be formed by heat and pressure molding. In addition, when the metal-clad laminate is used as the substrate 1 for a printed wiring board, a metal-clad laminate in which the metal foil provided on the surface is removed by etching or the like can be used. Thereby, the surface of the printed wiring board substrate 1 is composed of a resin composition.

As the multilayered substrate, for example, a layered body in which a conductor circuit which is an inner layer circuit is laminated on a core substrate via an interlayer insulating layer and a multilayer wiring is formed by using a via plating method or a lamination method can be used. It is based on the interlayer insulating layer in the most surface area layer. The above interlayer insulating layer is not particularly limited. For example, it can be comprised by the resin composition which does not contain a prepreg or a base material, etc..

The conductor circuit layer which becomes the inner layer circuit can be formed by, for example, a circuit formation method of the present embodiment which is characterized by the first heating step in the circuit formation stage by the SAP method. Thereby, the peeling strength of the conductor circuit layer which becomes an inner layer circuit can be improved. Further, the conductor circuit layer which becomes the inner layer circuit can be formed by a conventional circuit formation method.

Further, the conductor circuit layer provided on both surfaces of the core substrate formed of the laminate or the metal-clad laminate may be formed on the core substrate by, for example, drilling or laser processing. The through holes are formed and electrically connected to each other.

The printed wiring board substrate 1 which is a support of the conductor circuit layer has a surface made of an insulating resin composition. The resin composition constituting the surface of the substrate 1 for a printed wiring board is not particularly limited, and may be, for example, a resin composition containing at least a thermosetting resin. Examples of the thermosetting resin include urea (urea) resin, melamine resin, maleimide compound polyurethane resin, unsaturated polyester resin, and benzoic acid. Ring resin, bisallyl diimide compound, vinyl benzyl resin, vinyl benzyl ether resin, benzocyclobutene resin, cyanate resin, epoxy resin, and the like. The thermosetting resin is preferably a combination of a glass transition temperature of 200 ° C or higher. Among these, it is preferred that the thermosetting resin has a glass transition temperature of 200 ° C or higher. Therefore, as the thermosetting resin, for example, a ring containing a spiral ring, a heterocyclic formula, a trimethylol type, a biphenyl type, a naphthalene type, a fluorene type, or a novolac type is preferably used. Oxygen resin; cyanate resin (prepolymer containing cyanate resin), maleimide compound, benzocyclobutene resin, with benzoic acid Ring resin.

By using an epoxy resin and/or a cyanate resin as a thermosetting resin, the linear expansion of the resin composition is small, and the heat resistance of the resin composition can be remarkably improved. Moreover, by combining an epoxy resin and/or a cyanate resin with a filler material having a high filling amount, flame retardancy, heat resistance, impact resistance, high rigidity, and electrical properties (low dielectric constant, low) can be obtained. Dielectric tangent) superior resin composition.

Here, the improvement of the heat resistance is considered to be due to the fact that the glass transition temperature of the thermosetting resin after the curing reaction is 200° C. or higher, and the thermal decomposition temperature of the resin composition after curing becomes high at 250° C. The low molecular weight component such as the above reaction residue is reduced.

In addition, in the aromatic thermosetting resin having a high ratio of a benzene ring in the structure, the benzene ring is easily carbonized (graphitized) to form a carbonized portion.

Examples of the epoxy resin include a bisphenol A epoxy resin, a bisphenol F epoxy resin, a phenol novolak epoxy resin, a cresol novolak epoxy resin, and a bisphenol A novolak ring. Oxygen resin, biphenyl novolac type epoxy resin, fluorene type epoxy resin, indoline type epoxy resin, trifunctional phenol type epoxy resin, tetrafunctional phenol type epoxy resin, naphthalene type epoxy resin, joint Benzene type epoxy resin, aralkyl type epoxy resin, alicyclic epoxy resin, a compound obtained by epoxidizing a double bond, such as a polyol epoxy resin, glycidylamine, glycidyl ether, butadiene, or a compound obtained by reacting a hydroxyl group-containing polyoxyl resin with epichlorohydrin Wait. Among these, the epoxy resin is preferably a naphthalene type or an arylalkylene type epoxy resin. By using a naphthalene type or an arylalkylene type epoxy resin, the moisture absorption solder heat resistance (solder heat resistance after moisture absorption) and flame retardancy of the obtained laminated board can be improved. Examples of the naphthalene type epoxy resin include HP-4700, HP-4770, HP-4032D, HP-5000, Nippon Chemical Co., Ltd., NC-7300L, and Nippon Steel Chemical Co., Ltd. ) ESN-375 and so on. Further, examples of the arylalkylene-based epoxy resin include NC-3000, NC-3000L, NC-3000-FH, and Nippon Chemical Co., Ltd., NC-7300L, manufactured by Nippon Kayaku Co., Ltd. ESN-375, etc. manufactured by Nippon Steel Chemical Co., Ltd. The arylalkylene-type epoxy resin is an epoxy resin having a combination of one or more aromatic groups and an alkylene group such as a methylene group in a repeating unit, and is excellent in heat resistance, flame retardancy, and mechanical strength.

The cyanate resin can be obtained, for example, by reacting a halogenated cyanide compound with a phenol. Specific examples of the cyanate resin include a novolak type cyanate resin such as a phenol novolak type cyanate resin, a cresol novolac type cyanate resin, and a naphthol aralkyl type cyanate. Resin, dicyclopentadiene type cyanate resin, biphenyl type cyanate resin, bisphenol A type cyanate resin, bisphenol AD type cyanate resin, tetramethyl bisphenol F type cyanate resin A bisphenol type cyanate resin or the like.

Among these, especially the novolac type cyanate resin, naphthol aryl An alkyl type cyanate resin, a dicyclopentadiene type cyanate resin, or a bisphenol type cyanate resin is preferred. Further, it is preferred that the cyanate resin is contained in an amount of 10% by weight or more based on the total solid content of the resin composition. Thereby, the heat resistance (glass transition temperature, thermal decomposition temperature) of the prepreg can be improved. Further, the coefficient of thermal expansion of the prepreg (especially the coefficient of thermal expansion of the prepreg in the thickness direction) can be lowered. By reducing the coefficient of thermal expansion of the prepreg in the thickness direction, the stress strain of the multilayer printed wiring can be alleviated. Further, in the multilayer printed wiring board having the fine interlayer connection portion, the connection reliability can be greatly improved.

The preferred one of the novolac type cyanate resins is a novolac type cyanate resin represented by the following formula (1). In this case, it is preferred to use a combination of a novolac type cyanate resin having a large weight average molecular weight and a novolak type cyanate resin having a small weight average molecular weight. The weight average molecular weight of the novolac type cyanate resin having a large weight average molecular weight is preferably 2,000 or more, more preferably from 2,000 to 10,000, still more preferably from 2,200 to 3,500. Further, the weight average molecular weight of the novolac type cyanate resin having a small weight average molecular weight is preferably 1,500 or less, more preferably 200 to 1300. Further, the weight average molecular weight of the present embodiment is a value measured by gel chromatography in terms of polystyrene.

In the formula (1), n represents an integer of 0 or more.

Further, as the cyanate resin, a cyanate resin represented by the following general formula (2) can be suitably used. The cyanate resin represented by the following general formula (2) is a naphthol such as α-naphthol or β-naphthol and p-nonanediol, α,α'-dimethoxy-p-xylene, The naphthol aralkyl resin obtained by the reaction of 1,4-bis(2-hydroxy-2-propyl)benzene or the like is obtained by condensation with cyanic acid. The n of the general formula (2) is 1 or more, and more preferably 10 or less. When n is 10 or less, since the resin viscosity does not increase and the impregnation property to the substrate is good, the performance as a laminate is not lowered. Further, it is less likely to cause intramolecular polymerization during the synthesis, and the liquid separation property at the time of washing can be improved, and the yield can be prevented from being lowered.

In the formula (2), R represents a hydrogen atom or a methyl group, and n represents an integer of 1 or more.

Further, as the cyanate resin, a dicyclopentadiene type cyanate resin represented by the following formula (3) can be suitably used.

In the formula (3), n represents an integer of 0 to 8.

Further, in terms of heat resistance, it may also be composed of the above thermosetting resin. The product contains a maleimide compound. The maleimide compound is not particularly limited as long as it has one or more maleimide groups in one molecule. Specific examples thereof include N-phenyl maleimide, N-hydroxyphenyl maleimide, and bis(4-maleoximineiphenyl)methane. , 2,2-bis{4-(4-maleoximineiminophenoxy)-phenyl}propane, bis(3,5-dimethyl-4-northenylenediamine Phenyl)methane, bis(3-ethyl-5-methyl-4-maleimidoiminophenyl)methane, bis(3,5-diethyl-4-s-butenylene) Aminophenyl)methane, polyphenylmethane maleimide, a prepolymer of the maleimide compound or a prepolymer of a maleimide compound and an amine compound, etc. .

Moreover, in view of the adhesion to the metal foil, the thermosetting resin composition may contain a polyimide resin, a polyamide resin, a polyamide resin, or a phenoxy resin.

The amount of the thermosetting resin in the resin composition is preferably from 10 to 90% by weight, more preferably from 20 to 70% by weight, still more preferably from 25 to 50% by weight, based on the total solid content of the resin composition. In addition, the amount of the thermosetting resin in the resin composition can be appropriately adjusted depending on the purpose, and is not particularly limited.

Further, in the case where an epoxy resin and/or a cyanate resin is used as the thermosetting resin, the content of the epoxy resin is in the total solid content of the resin composition, preferably 5 to 50% by weight, 5~25% by weight is better. Further, the content of the cyanate resin is in the total solid content of the resin composition, preferably 5 to 50% by weight, more preferably 10 to 25% by weight.

Therefore, the curable lipid group may contain a flame retardant in a range that does not have the effect, and from the environmental viewpoint, a non-halogen flame retardant is preferred. Examples of the flame retardant include an organic phosphorus-based flame retardant, an organic nitrogen-containing phosphorus compound, a nitrogen compound, a polyoxygenated flame retardant, or a metal hydroxide. Examples of the organophosphorus-based flame retardant include a phosphine compound such as HCA, HCAHQ, and HCA-NQ manufactured by Sanko Co., Ltd., OP930 manufactured by Clariant Co., Ltd., and a phosphate compound such as PX200 manufactured by Daiha Chemical Co., Ltd. A phosphorus-containing epoxy resin such as FX289 manufactured by Dongdu Chemicals Co., Ltd. or a phosphorus-containing phenoxy resin such as ERF001 manufactured by Tosho Kasei Co., Ltd. Examples of the organic nitrogen-containing phosphorus compound include phosphazene compounds such as SPB100 and SPE100 manufactured by Otsuka Chemical Co., Ltd. Examples of the metal hydroxides include CL310 manufactured by Sumitomo Chemical Co., Ltd., and aluminum hydroxide such as HP-350 manufactured by Showa Denko.

Further, a curing agent may be used in combination with the thermosetting resin composition. For example, if the thermosetting resin is an epoxy resin or a cyanate resin, a curing accelerator for a phenol resin or an epoxy resin or a cyanate resin can be used. The phenol resin is not particularly limited, and examples thereof include a phenol novolak resin, a cresol novolak resin, a bisphenol A novolak resin, and an aryl acetal phenol resin such as a novolac type phenol resin, which are not modified. A resol-type phenol resin such as a phenolic phenol resin, a tung oil, a linseed oil or a walnut oil, which is modified by a modified phenolic phenol resin. As the phenol resin, a phenol novolak resin or a cresol novolak resin is preferred. Among them, moisture absorption From the viewpoint of solder heat resistance, a biphenyl aralkyl modified phenol novolak resin is preferred.

One of these may be used singly or in combination of two or more kinds having different weight average molecular weights, or one or two or more kinds of the prepolymers may be used in combination.

The hardening accelerator is not particularly limited, and examples thereof include an organic metal salt such as zinc naphthenate, a tertiary amine such as di-bicyclo[2,2,2]octane, and 2-ethyl-4-. An imidazole such as ethyl imidazole or a phenol compound such as nonylphenol; an organic acid such as p-toluenesulfonic acid, an onium salt compound or the like or a mixture thereof. The derivative may be used alone or in combination of two or more of them.

From the viewpoint of low thermal expansion and mechanical strength, it is preferred to contain an inorganic filler in the resin composition. The inorganic filler is not particularly limited, and examples thereof include talc, calcined clay, uncalcined clay, mica, glass, and the like, titanium oxide, aluminum oxide, cerium oxide, molten cerium oxide, and the like. Carbonate such as calcium, magnesium carbonate, hydrotalcite, aluminum hydroxide, bauxite (AlO(OH), commonly known as bauxite of bauxite) (ie, Al ₂ O ₃ .xH ₂ O, Here, x=1 to 2)), a metal hydroxide such as magnesium hydroxide or calcium hydroxide, a sulfate or sulfite such as barium sulfate, calcium sulfate or calcium sulfite, zinc borate, barium methylborate or boric acid. A borate such as aluminum, calcium borate or sodium borate; a nitride such as aluminum nitride, boron nitride, tantalum nitride or carbon nitride; or a titanate such as barium titanate or barium titanate. One of these may be used alone, or two or more types may be used in combination.

Among these, magnesium hydroxide, aluminum hydroxide, bauxite, cerium oxide, molten cerium oxide, talc, calcined talc, and alumina are preferred. From the viewpoint of low thermal expansion property and insulation reliability, in particular, cerium oxide is preferred, and spherical molten cerium oxide is more preferable. Further, from the viewpoint of flame resistance, aluminum hydroxide is preferred. In the case where the resin composition is filled with the inorganic filler at a high concentration, the drilling wearability is deteriorated, and by using the alumina as the inorganic filler, the drilling wearability is improved.

The particle diameter of the inorganic filler is not particularly limited, and an inorganic filler having an average particle diameter of monodisperse may be used, or an inorganic filler having an average particle diameter of polydisperse may be used. Further, one type or two or more types of inorganic fillers having an average particle diameter of monodisperse and/or polydisperse may be used in combination. Further, in the present specification, the term "average particle diameter" as a monodisperse system means that the standard deviation of the particle diameter is 10% or less. Further, the fact that the average particle diameter is a polydisperse means that the standard deviation of the particle diameter is 10% or more.

The average particle diameter of the inorganic filler is not particularly limited, but is preferably 0.1 μm to 5.0 μm, and particularly preferably 0.1 μm to 3.0 μm. When the particle diameter of the inorganic filler is at least the above lower limit value, the viscosity of the resin composition can be suppressed from increasing, and the workability at the time of preparation of the prepreg can be improved. In addition, when the particle diameter of the inorganic filler is not more than the above upper limit, it is possible to suppress the phenomenon of sedimentation of the inorganic filler in the resin composition. In addition, the average particle size can be a laser diffraction/scatter type particle size distribution measuring device (Shimadzu Corporation) Measurements are performed on general machines such as SALD-7000.

The content of the inorganic filler is not particularly limited, but is preferably from 10 to 90% by weight, more preferably from 30 to 80% by weight, even more preferably from 50 to 75, in the total solid content of the resin composition. weight%. When the cyanate resin and/or its prepolymer is contained in the resin composition, the content of the inorganic filler is preferably from 50 to 75% by weight based on the total solid content of the resin composition. When the content of the inorganic filler is not more than the above upper limit, the fluidity of the resin composition can be improved. In addition, when the content of the inorganic filler is at least the above lower limit value, the strength of the insulating layer composed of the resin composition can be sufficiently increased.

Further, a coupling agent may be further contained in the resin composition. The coupling agent is formulated to improve the wettability of the interface between the thermosetting resin and the inorganic filler. By improving the wettability at the interface between the thermosetting resin and the inorganic filler, the resin and the inorganic filler can be uniformly fixed to the substrate, and the heat resistance, particularly the solder heat resistance after moisture absorption, can be improved.

The coupling agent is not particularly limited, and examples thereof include an epoxy decane coupling agent, a cationic decane coupling agent, an amino decane coupling agent, a titanate coupling agent, and a polyasoxy oil type coupling agent. By using these as a coupling agent, the wettability at the interface with the inorganic filler can be improved. Therefore, the heat resistance of the resin composition can be further improved.

The amount of the coupling agent to be added is not particularly limited, and is preferably 0.05 to 3 parts by weight, particularly 0.1 to 2 parts by weight based on 100 parts by weight of the inorganic filler. It is better. When the content of the coupling agent is at least the above lower limit value, the inorganic filler can be sufficiently covered, and the effect of improving heat resistance can be sufficiently obtained. Moreover, by setting the content of the coupling agent to be equal to or lower than the above upper limit value, it is possible to suppress the influence on the reaction. Thereby, the reduction in bending strength or the like can be suppressed.

In the resin composition, an antifoaming agent, a leveling agent, a UV absorber, a foaming agent, an antioxidant, a flame retardant, a flame retardant auxiliary agent such as a polyfluorene oxide powder, an ion trapping agent, and the like may be added as needed. Additions other than those.

The resin composition preferably contains at least an epoxy resin, a cyanate resin, and an inorganic filler from the viewpoint of easily achieving low-line expansion, high rigidity, and high heat resistance of the prepreg. Among them, in the solid content of the resin composition, it is preferably 5 to 50% by weight of the epoxy resin, 5 to 50% by weight of the cyanate resin, and 10 to 90% by weight of the inorganic filler, more preferably epoxy. The resin is 5 to 25% by weight, the cyanate resin is 10 to 25% by weight, and the inorganic filler is 30 to 80% by weight.

The surface of the substrate 1 for printed wiring boards can be subjected to slag removal treatment. Thereby, the residue generated on the surface of the printed wiring board substrate 1 can be removed. The slag-removing treatment is not particularly limited, and it can be removed by a wet method using an oxidizing agent solution having an organic decomposition action or an active species (plasma, radical, etc.) which is irradiated with a direct oxidation effect to a target object. The organic method is carried out by a known method such as a plasma method such as a plasma method.

The wet slag treatment is carried out, for example, as follows. First, the surface of the resin is subjected to a swelling treatment. Next, etching by alkali treatment is performed. Thereafter, the resin The surface is treated with neutralization.

Next, as shown in FIG. 1(b), in the step (b), electroless plating is performed on the surface of the substrate 1 for a printed wiring board having a resin composition, and electroless plating is formed. Cladding 2. The electroless plating is performed on a surface of a plating target to which a catalyst such as palladium is adhered, by a known method such as an electroless plating method in which an electrolytic solution (plating solution) for plating metal ions is contacted. In the present embodiment, as the electroless plating, for example, electroless copper plating can be performed.

The thickness of the electroless plating layer 2 is not particularly limited, and is preferably 0.1 μm or more and 2 μm or less. By setting the thickness of the electroless plating layer 2 to 0.1 μm or more, the following plating step can be easily performed. Moreover, when the thickness of the electroless plating layer 2 is 2 μm or less, the formation of the electroless plating layer 2 can be performed in a short time. Thereby, the efficiency of the work can be improved.

Next, a first heating step is performed. Further, the first heating step is not limited to the step (b) and the step (c), and may be carried out between the step (c) and the step (d). The first heating step is preferably carried out between step (b) and step (c) from the viewpoint of further improving the peel strength of the conductor circuit layer 5 formed in the following order.

The heating temperature of the heat treatment in the first heating step is preferably 130 to 280 ° C, more preferably 140 to 230 ° C. By the heating temperature being within this range, the peel strength of the conductor circuit layer 5 can be improved.

The heat treatment in the first heating step is not particularly limited, and can be carried out, for example, by a known apparatus capable of introducing nitrogen (N ₂ ), such as a clean oven.

The heat treatment in the first heating step is preferably carried out in an environment having an oxygen (O ₂ ) concentration of 1000 ppm or less, and more preferably in an environment having an oxygen (O ₂ ) concentration of 500 ppm or less. Thereby, oxidation of copper constituting the conductor circuit layer 5 can be prevented, and peeling strength of the conductor circuit layer 5 can be improved.

The heat treatment in the first heating step is preferably carried out in an environment having a nitrogen (N ₂ ) concentration of 78% or more, and more preferably in an environment having a nitrogen (N ₂ ) concentration of 85% or more. Thereby, the peeling strength of the conductor circuit layer 5 can be further improved.

Further, the heat treatment in the first heating step may be carried out under atmospheric pressure or under reduced pressure. For example, in an air atmosphere, by performing heat treatment under a reduced pressure of 3 torr or less, the oxygen concentration can be reduced to 1000 ppm or less. Further, in the case where the air is depressurized by replacing the air with nitrogen, the oxygen concentration can be reduced to 1000 ppm or less even at 3 torr or more. Therefore, the oxidation of the copper constituting the conductor circuit layer 5 can be prevented, and the peel strength of the conductor circuit layer can be improved.

Further, in the first heating step, the time for heat-treating the printed wiring board substrate 1 is preferably 30 minutes or longer and 300 minutes or shorter. When the heat treatment time is 30 minutes or longer, the effect of improving the peel strength of the conductor circuit layer 5 can be sufficiently obtained. Moreover, in the case where the heat treatment time is 300 minutes or less, good work efficiency can be achieved.

Further, as shown in FIG. 1(c), in step (c), a photoresist mask 3 having an opening is formed on the electroless plating layer 2.

The region of the electroless plating layer 2 where the conductor circuit is not formed is masked by the photoresist mask 3. That is, the inside of the opening of the photoresist mask 3 becomes a region where the conductor circuit is formed.

The photoresist mask 3 is not particularly limited. Known materials can be used. The photoresist mask 3 can be formed, for example, by a photosensitive dry film or the like. In the case where a photosensitive dry film is used as the photoresist mask 3, the formation of the photoresist mask 3 is performed, for example, as follows. First, a photosensitive dry film is laminated on the electroless plating layer 2. Next, in the photosensitive dry film, the portion which is located in a region where the conductor circuit is not formed is exposed to light hardening. Next, the unexposed portion of the photosensitive dry film is dissolved/removed by the developer. At this time, the cured photosensitive dry film remaining on the electroless plating layer 2 becomes the photoresist mask 3.

Next, as shown in FIG. 1(d), in step (d), thick plating is applied to the opening of the photoresist mask 3, whereby the plating layer 4 is formed in the circuit forming portion.

The plating can be carried out by immersing the object to be plated in the plating solution and applying a known method such as a current.

Further, as shown in FIG. 1(e), in the step (e), the photoresist mask 3 is removed.

Next, as shown in FIG. 1(f), in the step (f), the plane in the electroless plating layer 2 is regarded as a portion which is not overlapped with the plating layer 4 by flash etching. Selective removal. That is, the electroless plating layer 2 located in a region where the conductor circuit is not formed is removed. Thereby, the conductor circuit layer 5 can be formed on the substrate 1 for printed wiring boards. Further, the flash etching can be carried out by a known method such as partial etching using an etching solution such as sodium persulfate by spraying or the like.

Hereinafter, this step (f) is also referred to as a pattern etching step.

Next, a second heating step is performed. Further, the second heating step is not limited to be performed after the step (f), and may be carried out between the step (d) and the step (e) or between the step (e) and the step (f). From the viewpoint of further increasing the peel strength of the conductor circuit layer 5, the second heating step is preferably performed after the step (f).

The heating temperature of the heat treatment in the second heating step is preferably 130 to 280 ° C, more preferably 140 to 230 ° C. By the heating temperature being within this range, the peel strength of the conductor circuit layer 5 can be improved.

The heat treatment in the second heating step is not particularly limited, and can be carried out in the same manner as the heat treatment in the first heating step.

The heat treatment in the second heating step is preferably carried out in an environment having an oxygen (O ₂ ) concentration of 1000 ppm or less, and more preferably in an environment having an oxygen (O ₂ ) concentration of 500 ppm or less. Thereby, oxidation of copper constituting the conductor circuit layer 5 can be prevented, and peeling strength of the conductor circuit layer 5 can be improved.

The heat treatment in the second heating step is preferably carried out in an environment having a nitrogen (N ₂ ) concentration of 78% or more, and more preferably in an environment having a nitrogen (N ₂ ) concentration of 85% or more. Thereby, the peeling strength of the conductor circuit layer 5 can be further improved.

Further, the heat treatment in the second heating step may be carried out under atmospheric pressure or under reduced pressure. For example, in an air atmosphere, by performing heat treatment under a reduced pressure of 3 torr or less, the oxygen concentration can be reduced to 1000 ppm or less. Further, in the case where the air is depressurized by replacing the air with nitrogen, the oxygen concentration can be reduced to 1000 ppm or less even at 3 torr or more. Therefore, the oxidation of the copper constituting the conductor circuit layer 5 can be prevented, and the peel strength of the conductor circuit layer can be improved.

Further, in the second heating step, the time for heat-treating the substrate 1 for a printed wiring board is preferably 30 minutes or longer and 300 minutes or shorter. When the heat treatment time is 30 minutes or longer, the effect of improving the peel strength of the conductor circuit layer 5 can be sufficiently obtained. Moreover, in the case where the heat treatment time is 300 minutes or less, good work efficiency can be achieved.

As shown in FIG. 1, the method of manufacturing the printed wiring board of the present embodiment can be applied not only to the case where the conductor circuit layer is formed on both surfaces of the printed wiring board substrate 1, but also to the printed wiring board substrate 1 only. The conductor circuit layer is formed on one side. Therefore, according to the method of manufacturing a printed wiring board of the present embodiment, any of a single-sided printed wiring board, a double-sided printed wiring board, and a multilayer printed wiring board can be manufactured.

(Example)

Hereinafter, the present invention will be described in detail based on examples and comparative examples, but the present invention is not limited thereto.

(Manufacturing Example 1 of laminated board)

8.5 parts by weight of a naphthalene-modified cresol novolac epoxy resin (HP-5000, manufactured by DIC Corporation), and a biphenyl aralkyl type phenol resin (Minghe Chemical Co., Ltd.) as a phenol curing agent MEH7851-4H) 8.5 parts by weight, phenol novolac type cyanate resin (Primaset PT-30, manufactured by LONZA Co., Ltd.), 17 parts by weight, spherical molten cerium oxide (SO-25R, Admatechs, average particle diameter 0.5 μm) 65.5 parts by weight of epoxy decane (KBM-403, manufactured by Shin-Etsu Chemical Co., Ltd.) was mixed and dissolved in methyl ethyl ketone. Next, the resin varnish was prepared by stirring using a high-speed stirring device and making the nonvolatile content (solid content) 70% by weight.

Then, the resin varnish was impregnated into a glass woven fabric (thickness: 87 μm, E-glass woven fabric manufactured by Nitto Bose, WEA-2116), and then dried in a heating furnace at 150 ° C for 2 minutes. Thereby, a prepreg having a solid content of the varnish in the prepreg of about 50% by weight was obtained.

Next, 12 μm of copper foil (3EC-VLP foil, manufactured by Mitsui Mining and Mining Co., Ltd.) was superposed on both sides of the laminate in which the prepreg was superposed on two sheets, and heated at a pressure of 3 MPa and a temperature of 220 °C. Press forming for 2 hours. Thereby, a laminate having copper foil on both sides of the insulating layer having a thickness of 0.20 mm was obtained.

(Manufacturing Example 2 of laminated board)

11 parts by weight of a biphenyl aralkyl type epoxy resin (NC-3000, manufactured by Nippon Kayaku Co., Ltd.) as an epoxy resin, and a bis-butylene diimide compound (BMI-70, manufactured by KI Chemical Industry Co., Ltd.) 20 parts by weight of 4,4'-diaminodiphenyl 3.5 parts by weight of alkane, 65 parts by weight of aluminum hydroxide (HP-360 manufactured by Showa Denko), and 0.5 parts by weight of epoxy decane (KBM-403, manufactured by Shin-Etsu Chemical Co., Ltd.) were mixed/dissolved in methyl ethyl ketone. Next, the resin varnish was prepared by stirring using a high-speed stirring device and making the nonvolatile content (solid content) 70% by weight.

Then, the resin varnish was impregnated into a glass woven fabric (thickness: 87 μm, E-glass woven fabric manufactured by Nitto Bose, WEA-2116), and then dried in a heating furnace at 150 ° C for 2 minutes. Thereby, a prepreg having a solid content of the varnish in the prepreg of about 50% by weight was obtained.

Next, 12 μm of copper foil (3EC-VLP foil, manufactured by Mitsui Mining and Mining Co., Ltd.) was superposed on both sides of the laminate in which the prepreg was superposed on two sheets, and heated and pressurized at a pressure of 3 MPa and a temperature of 220 °C. Formed for 2 hours. Thereby, a laminate having copper foil on both sides of the insulating layer having a thickness of 0.20 mm was obtained.

(Example 1)

The copper foil of the laminated board obtained in the manufacturing example 1 was completely etched and removed, and an electroless plating layer (Tough-copper PEA process manufactured by Uemura Kogyo Co., Ltd.) was formed on the surface of the exposed resin in accordance with the target film thickness of 1 μm. Next, the first heating step was carried out by heating in an air atmosphere (oxygen concentration: about 21%, nitrogen concentration: about 78%, atmospheric pressure) at 150 ° C for 30 minutes. After the first heating step, an ultraviolet photosensitive dry film (Sunfort UFG-255, manufactured by Asahi Kasei Co., Ltd.) having a thickness of 25 μm was attached to the surface of the electroless plating layer by a hot roll laminator. Next, draw the minimum line width/line The position of the glass mask (manufactured by TOPIC Corporation) of the pattern of 20/20 μm and 10 mm × 150 mm (peeling strength measurement site) was taken. Further, the ultraviolet photosensitive dry film was exposed by an exposure apparatus (Ono EV-0800) using the peeling mask. Next, the exposed ultraviolet photosensitive dry film was developed with an aqueous solution of soda carbonate. Thereby, a photoresist mask is formed.

Next, an electroless plating layer was used as an electrode layer electrode, and electrolytic copper plating (81-HL manufactured by Okuno Chemical Co., Ltd.) was carried out for 25 minutes under conditions of 3 A/dm ^{2 to} form a pattern of a copper wiring having a thickness of about 20 μm. Further, the photoresist mask was peeled off by a monoethanolamine solution (R-100, manufactured by Mitsubishi Gas Chemical Co., Ltd.) using a peeling machine. Then, the electroless plating layer belonging to the power supply layer is subjected to flash etching (a pure aqueous solution of SAC-702M and SAC-701R35 manufactured by Ebara Electric Co., Ltd.) to be removed, and formed (pattern etching step) L/S=20/20 μm. And a pattern of 10 mm × 150 mm (peeling strength measurement portion) to obtain a printed wiring board.

(Example 2)

The copper foil of the laminated board obtained in the manufacturing example 1 was completely etched and removed, and an electroless plating layer (Tough-copper PEA process manufactured by Uemura Kogyo Co., Ltd.) was formed on the surface of the exposed resin in accordance with the target film thickness of 1 μm. Next, a commercially available sodium hydroxide and ethylene glycol-based solvent-containing liquid (available from Atotech Co., Ltd., Swelling Dip Securiganth P bath) prepared as a resin surface swelling treatment (SW treatment) at a liquid temperature of 60 ° C was used. The mixture (pH 12) was immersed for 2 minutes and washed 3 times with water. Then, as an alkaline treatment (ME treatment) The laminate was immersed in a roughening treatment liquid (Concentrate Compact CP bath solution manufactured by Atotech Co., Ltd.) at a liquid temperature of 60 ° C for 5 minutes and washed with water three times. In addition, as a neutralization treatment (Re treatment), the laminate was immersed in a treatment liquid (Reduction Securiganth P500 bath solution manufactured by Atotech Co., Ltd.) at a liquid temperature of 40 ° C for 3 minutes, and then washed with water three times. Then, heat treatment was carried out for 30 minutes in an air atmosphere (oxygen concentration: about 21%, nitrogen concentration: about 78%) at 150 ° C, whereby the first heating step was performed. After the first heating step, the same treatment as in Example 1 was carried out to obtain a printed wiring board.

(Example 3)

After the pattern etching process according to flashing, heat treatment was performed for 60 minutes in an air atmosphere (oxygen concentration: about 21%, nitrogen concentration: about 78%, atmospheric pressure) at 220 ° C, thereby performing a second heating step. Otherwise, the same treatment as in Example 1 was carried out to obtain a printed wiring board.

(Example 4)

After the pattern etching process according to flashing, heat treatment was performed for 60 minutes in an air atmosphere (oxygen concentration: about 21%, nitrogen concentration: about 78%, atmospheric pressure) at 220 ° C, thereby performing a second heating step. Otherwise, the same treatment as in Example 2 was carried out to obtain a printed wiring board.

(Example 5)

The first heating step was carried out by heat treatment at 220 ° C for 60 minutes in a nitrogen atmosphere (oxygen concentration: 450 ppm, nitrogen concentration: about 99%, atmospheric pressure). except Otherwise, the treatment was carried out in the same manner as in Example 1 to obtain a printed wiring board.

(Example 6)

The copper foil of the laminated board obtained in the manufacturing example 1 was completely etched and removed, and an electroless plating layer (Tough-copper PEA process manufactured by Uemura Kogyo Co., Ltd.) was formed on the surface of the exposed resin in accordance with the target film thickness of 1 μm. Then, as a neutralization treatment (Re treatment), the laminate was immersed in a treatment liquid (Reduction Securiganth P500 bath solution manufactured by Atotech Co., Ltd.) at a liquid temperature of 50 ° C for 5 minutes, and then washed with water three times. Further, the first heating step was carried out by heat treatment at 60 ° C for 60 minutes in a nitrogen atmosphere (oxygen concentration: 450 ppm, nitrogen concentration: about 99%, atmospheric pressure). After the first heating step, the same treatment as in Example 1 was carried out to obtain a printed wiring board.

(Example 7)

The first heating step was carried out by heat treatment at 220 ° C for 60 minutes in a nitrogen atmosphere (oxygen concentration: 450 ppm, nitrogen concentration: about 99%, atmospheric pressure). Otherwise, the same treatment as in Example 2 was carried out to obtain a printed wiring board.

(Example 8)

After the pattern etching process according to flashing, heat treatment was performed for 60 minutes in an air atmosphere (oxygen concentration: about 21%, nitrogen concentration: about 78%, atmospheric pressure) at 220 ° C, thereby performing a second heating step. Otherwise, the same treatment as in Example 5 was carried out to obtain a printed wiring board.

(Example 9)

After the pattern etching process according to flashing, in an air environment (oxygen concentration) About 21%, a nitrogen concentration of about 78%, atmospheric pressure, and heat treatment at 220 ° C for 60 minutes, thereby performing a second heating step. Otherwise, the same treatment as in Example 6 was carried out to obtain a printed wiring board.

(Embodiment 10)

After the pattern etching process according to flashing, heat treatment was performed for 60 minutes in an air atmosphere (oxygen concentration: about 21%, nitrogen concentration: about 78%, atmospheric pressure) at 220 ° C, thereby performing a second heating step. Otherwise, the same treatment as in Example 7 was carried out to obtain a printed wiring board.

(Example 11)

The second heating step was carried out by heat treatment at 220 ° C for 60 minutes in a nitrogen atmosphere (oxygen concentration: 450 ppm, nitrogen concentration: about 99%, atmospheric pressure). Otherwise, the same treatment as in Example 8 was carried out to obtain a printed wiring board.

(Embodiment 12)

The second heating step was carried out by heat treatment at 220 ° C for 60 minutes in a nitrogen atmosphere (oxygen concentration: 450 ppm, nitrogen concentration: about 99%, atmospheric pressure). Otherwise, the same treatment as in Example 9 was carried out to obtain a printed wiring board.

(Example 13)

The second heating step was carried out by heat treatment at 220 ° C for 60 minutes in a nitrogen atmosphere (oxygen concentration: 450 ppm, nitrogen concentration: about 99%, atmospheric pressure). Otherwise, the same treatment as in Example 10 was carried out to obtain a printed wiring board.

(Example 14)

The laminate obtained in Production Example 1 was not used, but was obtained using Production Example 2. Laminated board. Otherwise, the same treatment as in Example 8 was carried out to obtain a printed wiring board.

(Example 15)

The laminate obtained in Production Example 2 was used instead of the laminate obtained in Production Example 1. Otherwise, the same treatment as in Example 9 was carried out to obtain a printed wiring board.

(Embodiment 16)

The laminate obtained in Production Example 2 was used instead of the laminate obtained in Production Example 1. Otherwise, the same treatment as in Example 10 was carried out to obtain a printed wiring board.

(Example 17)

The treatment was carried out in the same manner as in Example 3 except that the first heating step was not performed, and a printed wiring board was obtained.

(Embodiment 18)

The treatment was carried out in the same manner as in Example 4 except that the first heating step was not performed, and a printed wiring board was obtained.

(Embodiment 19)

The first heating step was carried out by heat treatment at 220 ° C for 60 minutes under a reduced pressure atmosphere (oxygen concentration: 280 ppm, 1 torr). Otherwise, the same treatment as in Example 1 was carried out to obtain a printed wiring board.

(Embodiment 20)

The first heating step is performed under a reduced pressure environment (oxygen concentration: 280 ppm, 1 torr) was heat-treated at 220 ° C for 60 minutes. Otherwise, the same treatment as in Example 2 was carried out to obtain a printed wiring board.

(Comparative Example 1)

The treatment was carried out in the same manner as in Example 1 except that the first heating step was not performed, and a printed wiring board was obtained.

(Comparative Example 2)

The treatment was carried out in the same manner as in Example 6 except that the first heating step was not performed, and a printed wiring board was obtained.

(Comparative Example 3)

The treatment was carried out in the same manner as in Example 2 except that the first heating step was not performed, and a printed wiring board was obtained.

(assessment)

The peeling strength measurement of the conductor circuit layer was performed using the printed wiring board obtained by each Example and the comparative example. The peel strength measurement was carried out in accordance with JIS C6481, and the peel strength of the conductor circuit layer having a width of 10 mm at 25 ° C was measured. The measurement results are shown in Table 1.

In Comparative Examples 1 to 3, since the first heating step and the second heating step were not performed, the peeling strength of the conductor circuit layer of the obtained printed wiring board was low.

On the other hand, in Examples 1 to 20, since the first heating step and/or the second heating step were performed, the peeling strength of the conductor circuit layer of the obtained printed wiring board was high. In Examples 1 to 13 using the laminate obtained in Production Example 1, the first heating step was carried out in a nitrogen atmosphere as compared with Examples 1 to 4 in which the first heating step was performed in an air atmosphere. The peel strength of 5~13 is higher. Further, in Examples 14 to 16, the laminate obtained by the production example 2 was different from the composition of the resin varnish of Production Example 1, and the obtained printed wiring board was obtained by performing the first heating step and the second heating step. The conductor circuit layer has a high peel strength.

The embodiments of the present invention have been described above with reference to the drawings, and the present invention is exemplified, and various configurations other than the above may be employed.

The application is based on the priority of Japanese Patent Application No. 2011-014105, filed on Jan. 26, 2011, the entire disclosure of which is incorporated herein.

1‧‧‧Substrate for printed wiring board

2‧‧‧ Electroless plating

3‧‧‧Light-resistance mask

4‧‧‧Electroplating

5‧‧‧ conductor circuit layer

Fig. 1 is a schematic view showing an example of a method of manufacturing a printed wiring board of the embodiment.

Fig. 2 is a flow chart showing an example of a method of manufacturing the printed wiring board of the embodiment.

1‧‧‧Substrate for printed wiring board

2‧‧‧ Electroless plating

3‧‧‧Light-resistance mask

4‧‧‧Electroplating

5‧‧‧ conductor circuit layer

Claims (14)

A method for producing a printed wiring board, comprising: forming an electroless plating layer by electroless plating on the surface of the substrate composed of a resin composition; and performing the electroless plating on the surface a step of forming a photoresist mask having an opening; a step of forming a plating layer by electroplating in the opening; a step of removing the photoresist mask; and selecting by etching in the electroless plating layer The step of removing the portion which is not overlapped with the above-mentioned plating layer according to the plane; after the step of forming the electroless plating layer, before the step of forming the plating layer, having the first heating step of heating the substrate, and/or After forming the plating layer as described above, there is a second heating step of heating the substrate. The method of manufacturing a printed wiring board according to the first aspect of the invention, wherein in the first heating step, the substrate is heated to a temperature of 130 to 280 °C. The method for producing a printed wiring board according to the first aspect of the invention, wherein the first heating step is performed in an environment having an oxygen concentration of 1000 ppm or less. The method for producing a printed wiring board according to the first aspect of the invention, wherein the first heating step is performed in an environment having a nitrogen concentration of 78% or more. A method of manufacturing a printed wiring board according to item 1 of the patent application, The first heating step described above is carried out under reduced pressure. The method of manufacturing a printed wiring board according to claim 1, wherein in the first heating step, the substrate is subjected to heat treatment for 30 minutes or longer and 300 minutes or shorter. The method of manufacturing a printed wiring board according to claim 1, wherein in the second heating step, the substrate is heated to a temperature of 130 to 280 °C. The method of manufacturing a printed wiring board according to the first aspect of the invention, wherein the second heating step is performed in an environment having an oxygen concentration of 1000 ppm or less. The method for producing a printed wiring board according to the first aspect of the invention, wherein the second heating step is performed in an environment having a nitrogen concentration of 78% or more. The method of manufacturing a printed wiring board according to the first aspect of the invention, wherein the second heating step is performed under reduced pressure. The method of manufacturing a printed wiring board according to claim 1, wherein in the second heating step, the substrate is subjected to heat treatment for 30 minutes or longer and 300 minutes or shorter. The method for producing a printed wiring board according to the first aspect of the invention, wherein the electroless plating layer has a layer thickness of 0.1 μm or more and 2 μm or less. A method of manufacturing a printed wiring board according to item 1 of the patent application, The resin composition contains an inorganic filler, and the content of the inorganic filler is 50% by weight or more based on the total solid content of the resin composition. The method for producing a printed wiring board according to the first aspect of the invention, wherein the resin composition contains a thermosetting resin.