TWI542462B - Method and system for cooling resin sealing substrate, system for conveying the substrate, and resin sealing system - Google Patents

Description

Method and system for cooling resin sealing substrate, system for conveying the substrate, and resin sealing system

The present invention relates to a method and system for cooling a resin sealing substrate and a system for delivering the substrate, which is formed by resin sealing an electronic component or the like mounted on a substrate. The invention also relates to a system for sealing a resin or similar component mounted on a substrate.

A resin sealing system having a mold composed of an upper mold and a lower mold is conventionally used for molding or resin sealing an electronic component or the like mounted on a substrate. Both the upper mold and the lower mold have cavities for receiving a large amount of resin. In the resin sealing process, a substrate having an electronic component or the like mounted thereon is sandwiched between an upper mold and a lower mold, and an electronic component or the like is housed in a cavity, which is then already at a high temperature. The molten resin material is filled into the cavity and solidified. (This type of processing is called transfer molding). After the resin material is cured, the resin sealing substrate is transported from the resin sealing mold to a predetermined position designated for post-processing, for example, the substrate is stored in a rack or the substrate is cut.

Such molding and resin sealing processes require a system for delivering substrates before and after resin sealing processing. An example of such a delivery system is disclosed in Patent Document 1. The delivery system includes a level-movable delivery tray that can be inserted between or removed from the upper and lower molds, a substrate carrier that fits into the holes of the delivery tray, and the holes in Can move vertically. When a substrate supporting portion that can support the resin sealing substrate can be provided on the lower side of the substrate carrier, a substrate setting portion in which the substrate is disposed before the resin sealing process can also be provided on the upper side of the substrate carrier. A suction supporting means for supporting the resin sealing substrate by suction in the substrate supporting portion on the lower side of the substrate carrier.

As already explained, the resin sealing of an electronic component or the like is achieved by hardening a resin which has been melted at a high temperature. Therefore, after the resin sealing process is completed, the substrate is still hot. The heat shrinkage coefficient of the resin material is different from the heat shrinkage coefficient of the substrate material. Therefore, if the resin sealing substrate which is removed from the mold is placed in the air, the resin sealing substrate may be bent due to natural cooling. The bending of the resin sealing substrate causes many problems. For example, a curved substrate cannot be stored smoothly in the holder or cannot be accurately cut.

As a solution to this problem, Patent Document 2 discloses a bending preventing device. The device has a heat sink provided in a resin sealing system. The bending of the product is prevented by sandwiching the molded and resin-sealed product between the heat sink and the substrate setting portion and cooling it in this state.

Patent Document 1: JP-A 2010-105326

Patent Document 2: JP-A 3-129864

In the apparatus described in Patent Document 2, it is necessary to apply a considerable pressure for a period of time to maintain the resin sealing substrate in a state of being sandwiched. This may have unintended effects on the product, such as damage to electronic components or similar components in the resin seal or cause the resin to seal outside the substrate. The deformation of the shape of the part.

The present invention provides a method and system for cooling a resin sealing substrate having electronic components or the like which are molded or resin-bonded on the resin sealing substrate. The method or system is capable of reducing the negative effects on electronic components or similar components while cooling the resin sealing substrate, and also prevents bending of the substrate. The present invention also provides a system for delivering a resin sealing substrate comprising the aforementioned cooling system, and a resin sealing system including the same cooling system.

According to a first aspect of the present invention, a system for cooling a resin sealing substrate which solves the above problems is a substrate cooling system for cooling a resin sealing substrate which is mounted by a resin sealing mold. The electronic component on the substrate is molded and resin-tight. The system comprises: a) a holder for holding the resin sealing substrate; b) a suction device disposed in the holder for sealing the resin The substrate is attracted to the holder; and c) a cooling member is disposed at a position, the suction device attracts the resin sealing substrate toward the position, and the cooling member has a contact surface in close contact with the resin sealing substrate.

In the system for cooling a resin sealing substrate according to the first aspect of the present invention In one form of the system, the suction means includes an air suction means for drawing air from a space between the resin sealing substrate and the contact surface of the cooling member.

In another form of the system for cooling a resin-sealed substrate according to the first aspect of the present invention, the suction device includes: an elastic support provided on the cooling member for when the resin sealing substrate is attracted Forming one or more enclosed spaces between the resin sealing substrate and the contact surface by contact with the resin sealing substrate; and one or more through holes each provided in the one or more enclosed spaces The inner cooling member passes through the thickness direction of the cooling member; and the air suction means draws air from the one or more enclosed spaces through the one or more through holes.

According to a first aspect of the present invention, in a further aspect of the system for cooling a resin sealing substrate, the system further comprises: d) a cooling device for cooling the cooling member.

According to a first aspect of the present invention, in another form of the system for cooling a resin sealing substrate, the cooling device is a blower for conveying a gas stream to a cooling member.

According to a first aspect of the present invention, in another form of the system for cooling a resin sealing substrate, the cooling member has one or more grooves formed on the contact surface, and the blower is directed to the one or Airflow is provided in multiple slots.

According to a first aspect of the present invention, in another form of the system for cooling a resin sealing substrate, the cooling device includes a Peltier device connected to the cooling member.

According to a first aspect of the present invention, in a system for cooling a resin sealing substrate, a contact surface of the cooling member is designed such that a resin sealing portion of the resin sealing substrate can be in close contact therewith.

A second aspect of the present invention provides a substrate delivery system for delivering a resin sealing substrate, characterized by comprising any of the foregoing systems for cooling a resin sealing substrate according to the first aspect of the present invention.

A third aspect of the present invention provides a resin sealing system for molding and resin-sealing electronic components mounted on a substrate, the system comprising any of the foregoing for cooling the first aspect according to the present invention A system for sealing a substrate with a resin.

A fourth aspect of the present invention provides a substrate cooling method for cooling a resin sealing substrate which is formed by molding a resin and sealing a substantially electronic component by a resin sealing mold. The method includes the steps of: a) holding the resin sealing substrate; and b) by attracting the supported resin sealing substrate to the cooling member to bring the resin sealing substrate into close contact with the contact surface of the cooling member, thereby The resin sealing substrate is cooled.

According to a fourth aspect of the present invention, in one form of the method for cooling a resin sealing substrate, the step of cooling the resin sealing substrate includes the step of conveying a gas flow to the cooling member.

According to a fourth aspect of the present invention, in another aspect of the method for cooling a resin sealing substrate, the step of cooling the resin sealing substrate includes bringing the resin sealing portion of the resin sealing substrate into close contact with the contact surface of the cooling member. step.

According to a fourth aspect of the present invention, in another form of the method for cooling a resin sealing substrate, the step of cooling the resin sealing substrate is performed at the time of delivering the resin sealing substrate.

In the method and system for cooling a resin sealing substrate of the present invention, the resin sealing substrate is attracted to the contact surface of the cooling member to bring the resin sealing substrate into close contact with the cooling member, thereby drawing heat from the substrate. Therefore, the progress of the cooling process does not cause the resin sealing substrate to be bent, which is caused by the difference in thermal contraction coefficient between the substrate and the resin. Compared to the prior art, the application of a large pressure to the resin sealing substrate during the cooling process minimizes the negative effects on the molded and resin-sealed electronic components.

In the present technology, if the substrate portion of the resin sealing substrate is brought into close contact with the contact surface of the cooling member, the negative influence on the molded and resin-sealed electronic components will be largely reduced. In contrast, if the resin sealing portion of the resin sealing substrate is brought into close contact with the contact surface of the cooling member, since the heat can be directly sucked out from the resin sealing portion in the hot state, the cooling effect is further improved.

Providing an air suction means for drawing air between a contact surface of a resin sealing substrate and a cooling member, a resin sealing substrate and a cooling member The contact between them will be closer, so the anti-bending effect and cooling effect will be improved. When one or more enclosed spaces are formed between the resin sealing substrate and the contact surface, the contact between the resin sealing substrate and the cooling member will be closer, so that the suction device is designed such that it can be drawn from the closed space by air suction means Take in the air.

The provided cooling device will further improve the cooling effect of the resin sealing substrate.

Further, when the structure of the system for cooling a resin sealing substrate according to the present invention is used in a system for delivering a resin sealing substrate or a system for molding and resin-sealing electronic components mounted on a substrate, The obtained system can more effectively deliver the resin sealing substrate when cooling the resin sealing substrate or cooling the resin substrate in a series of processes after the resin sealing process.

The substrate cooling system according to the present invention is a system for cooling a resin sealing substrate formed by molding and resin-sealing an electronic component mounted on a substrate by a resin sealing mold. Before describing the substrate cooling system according to the present invention, the processing of molding and resin sealing of electronic components or the like mounted on the substrate will be described with reference to FIG. Molding and resin sealing processing is performed by using a resin sealing system having a mold composed of an upper mold 11 and a lower mold 12. In the system shown in Fig. 1, the upper mold 11 has a substrate fixing mechanism, and the lower mold 12 has a cavity 13 for receiving a large amount of resin, and the upper mold 11 It has a substrate fixing mechanism. Examples of the substrate fixing mechanism include a mechanism for holding the substrate 21 by suctioning or hooking a structure or the like by suctioning from above.

In the resin sealing system, first, when a liquid (or fluid) resin material 23 at room temperature is injected into the cavity 13 of the lower mold 12, the substrate 21 on which the electronic component 22 is mounted is fixed to the upper portion. The substrate fixing section of the mold 11 (see Fig. 1 (a)). Next, the temperature of the cavity 13 is increased, the lower mold 12 is lifted to a position where its upper surface reaches the lower surface contacting the upper mold 11, and the two molds are pressed together (see Fig. 1(b)). This state is maintained for several minutes to harden the resin inside the cavity 13. Thus, the molding by the compression molding and the resin sealing process are completed, and a product having the resin-sealed electronic component 22 on the substrate 21 can be obtained. After the molding and resin sealing processing is completed, the lower mold 12 is moved downward, and the remaining substrate 21 is fixed to the upper mold 11 as shown in Fig. 1(c). In the following description, the molded and resin-sealed substrate is referred to as a resin sealing substrate 21A, and the portion of the hardened resin-sealed electronic component 22 is referred to as a resin sealing portion 24 (see FIG. 1(d)). It should be noted that a powdery or granular solid material can be used as the resin material 23, in which case the material will melt as the temperature of the lower mold 12 increases.

After the resin sealing of the electronic component or the like mounted on the substrate is completed, the resin sealing substrate is removed from the resin sealing system and delivered to a post-processing, such as cutting the substrate into a frame or cutting the substrate. The following description shows a specific embodiment in which a system for cooling a resin-sealed substrate according to the present invention is applied to a substrate delivery system.

First embodiment

As shown in FIG. 2(a), the system for delivering a resin sealing substrate according to the first embodiment includes a delivery tray 40 for delivering a resin sealing substrate, an inhalation unit 30 is provided on the delivery tray 40, and one is used for A delivery tray drive structure (not shown) that level moves the delivery tray 40, and a suction unit drive mechanism for vertically moving the suction unit 30.

The structure of the suction unit 30 is described with reference to FIG. Fig. 3(a) is a plan view of the suction unit 30, and Fig. 3(b) is a cross-sectional view of the suction unit 30 taken along a section line A-A'. The suction unit 30 includes a cooling member 31 and a frame-shaped elastic abutment member 32 extending along the periphery of the cooling member 31. The cooling member 31 is made of aluminum, which is a highly thermally conductive material having a hardness sufficiently higher than that of the resin sealing portion. The size of the cooling member 31 is approximately equivalent to the lower surface of the resin sealing portion 24 of the resin sealing substrate 21A. The upper surface of the cooling member 31 serves as a contact surface in which the resin sealing portion 24 is in close contact. The cooling member 31 has a through hole 33a passing through the thickness direction thereof. The elastic abutment member 32 slightly protrudes upward from the upper surface (contact surface) of the cooling member 31. An air suction device 33c is connected to the through hole 33a through the air suction passage 33b.

The operation of the system for delivering a resin sealing substrate according to the first embodiment will be described below. After the resin sealing substrate 21A is molded by the resin sealing system, the operation delivery tray driving mechanism moves the delivery tray 40 to a predetermined position between the upper mold 11 and the lower mold 12 (see FIG. 2(a)). This position is a position where the contact surface of the cooling member 31 faces the lower surface of the resin sealing portion 24. Next, the suction unit drive mechanism 50 is operated to bring the suction unit 30 The upper surface of the elastic abutment member 32 is lifted up to the level of the lower surface of the contact resin sealing portion 24 (Fig. 2(b)). As already described, the elastic abutment member 32 protrudes slightly upward from the contact surface of the cooling member 31. Therefore, the upper surface of the elastic holder member 32 reaches the lower surface of the contact resin sealing portion 24. Therefore, an enclosed space surrounded by the contact faces of the cooling member 31, the elastic abutment member 32, and the lower surface of the resin sealing portion 24 is formed (see Fig. 4 (a)).

In this state, the air suction device 33c sucks air from the closed space of the through hole 33a and the air suction passage 33b. At the same time as the air suction operation is started, the operation of supporting the substrate 21 in the upper mold 11 by the substrate fixing mechanism is interrupted. For example, if the substrate 21 is supported by the upper mold 11 during suction, the suction is stopped. Then, the elastic holder member 32 gradually and elastically changes its shape to move the resin sealing substrate 21A from the upper mold 11 to the cooling unit 30 until the lower surface of the resin sealing portion 24 reaches the contact surface contacting the cooling member 31 ( See Figure 4(b)). The elastic characteristics of the elastic holder member 32, the degree of protrusion from the contact surface, and the air suction strength of the air suction device 33c can be adjusted in advance so that the contact surface can be in close contact with the lower surface of the resin sealing portion 24 by the air suction operation. Although it is not necessary to maintain the closed space in a high vacuum state, a more suitable adjustment can be made to maintain a high vacuum state in the enclosed space, thereby producing a very tight relationship between the resin sealing substrate 21A and the contact surface. contact. Then, while maintaining such close contact, the suction unit drive mechanism 50 is operated to lower the suction unit 30 (see FIG. 2(c)), and then the delivery tray drive mechanism is operated to move the resin sealing substrate 21A to a predetermined position for subsequent processing. Or similar work. In this processing, the resin sealing substrate 21A is maintained in a state of being in close contact with the cooling member 31. Thus, the present system can efficiently deliver the resin sealing substrate 21A while cooling the substrate without causing it to be bent.

Second embodiment

A system for delivering a resin sealing substrate according to a second embodiment will be described below. The difference from the first embodiment lies in the structure of the suction unit 30. The structure of the delivery tray 40 and the suction unit drive mechanism 50 is the same as that in the first embodiment, and will not be described here. Fig. 5(a) is a plan view of the suction unit 30, and Fig. 5(b) is a cross-sectional view of the suction unit 30 along the section line B-B'. The suction unit 30 includes a cooling member 31 and six elastic holder members 32. The cooling member 31 has a contact surface in close contact with the lower surface of the resin sealing portion 24, and has six through holes 33a passing through the thickness direction thereof. As shown in Fig. 5(b), six elastic bearing members 32 are respectively provided to the six through holes 33a. Each of the elastic abutment members 32 has a cylindrical portion 32a inserted into the through hole 33a and a bowl portion 32b connected to the upper portion of the cylindrical portion 32a. The bowl portion 32b slightly protrudes upward from the contact surface of the cooling member 31, has an opening at its upper end, and has a hole at its lower end leading to the cylindrical portion 32a. An air suction device 33c is connected to the through hole 33a through the air suction passage 33b.

The operation of the system for delivering a resin sealing substrate according to the second embodiment will be described below. The upper surface of the elastic holder member 32 is caused to come into contact with the lower surface of the resin sealing portion 24 by an operation similar to that of the first embodiment. Since the bowl portion 32b of the elastic holder member 32 slightly protrudes from the contact surface of the cooling member 31, the upper surface of the bowl portion 32b comes into contact The lower surface of the resin sealing portion 24. Thus, an enclosed space surrounded by the lower surface of the bowl portion 32b and the resin sealing portion 24 is formed (see Fig. 6(a)).

In this state, similarly to the first embodiment, the air suction device 33c is energized to draw air from the closed space through the through hole 33a and the air suction passage 33b. At the same time, the operation of the substrate fixing mechanism of the upper mold 11 is interrupted. Then, the elastic holder member 32 gradually and elastically changes its shape to move the resin sealing substrate 21A from the upper mold 11 to the cooling unit 30 until the lower surface of the resin sealing portion 24 reaches the contact surface contacting the cooling member 31 ( See Figure 6(b)). As in the manner of the first embodiment, the elastic characteristics of the elastic holder member 32, the degree of protrusion from the contact surface, and the air suction strength of the air suction device 33c can be adjusted in advance. Subsequently, the resin sealing substrate 21A is delivered to a predetermined position by a similar operation to the first embodiment for subsequent processing. Thus, similarly to the first embodiment, the present system can efficiently deliver the resin sealing substrate 21A while cooling the substrate without causing it to be bent.

As described above, the system in the second embodiment uses six elastic abutment members 32, and sucks air from each of the closed spaces formed by the bowl portions 32b of the elastic abutment members 32 and the lower surface of the resin sealing portion 24. . In this configuration, the total volume of the six enclosed spaces, not to mention the volume of each enclosed space, will be less than the volume of the enclosed space in the first embodiment. Therefore, it is possible to reduce the time required for the resin sealing portion 24 to reach the contact cooling member 31 after the operation of initially sucking air from the closed space is completed.

It should be noted that any of the foregoing embodiments are merely used The examples of the invention are described, and appropriate changes and modifications can be made within the scope of the invention. Although the foregoing embodiments are examples in which the system for cooling a resin sealing substrate according to the present invention is taken as a part of a substrate delivery system, it is natural to construct the system as a separate system for cooling the resin sealing substrate. possible.

In the foregoing embodiment, the cooled resin sealing substrate is a product produced by compression molding. It is also possible to use a system for cooling a resin sealing substrate according to the present invention to cool a resin sealing substrate produced by other casting methods, such as transfer molding.

In addition, the foregoing embodiment assumes a case where the resin sealing substrate is delivered from the resin sealing system in which the substrate is fixed to the upper mold and the resin material is received by the lower mold. In the case of delivering a resin sealing substrate from a functionally sealed resin sealing system of upper and lower molds, the aforementioned system can also be used upside down.

In addition, the foregoing system may be changed to cool the substrate 21 instead of the resin sealing portion 24.

In the foregoing embodiment, the heat generated from the resin sealing substrate to the cooling member is released by natural cooling. In addition to this, it is preferable to provide a cooling device for cooling the cooling member. The use of the cooling device can improve the efficiency of releasing heat generated from the resin sealing substrate to the cooling member, and thus the cooling of the resin sealing substrate is more efficient. Embodiments of the cooling device include a blower (e.g., a fan or vortex tube) for delivering airflow to the cooling component, a Peltier device connected to the cooling component, and the like. When a blower that delivers airflow to the cooling component is used, air can be supplied to the opposite side of the cooling component from the contact surface. A preferred embodiment is shown in Figure 7 (a) (top view) And 7(b) (a cross-sectional view along section line C-C') in which the cooling member 31 has grooves 34 formed on the contact faces, and passes through the grooves 34 between the resin sealing portion 24 and the contact faces. To provide air. This system can seal the substrate with a more efficient cooling resin. It is also possible to perform forced cooling of the surface of the resin sealing substrate that is not in contact with the cooling member, in addition to cooling the resin sealing substrate by the cooling member.

In the foregoing embodiment, a means for sucking air from a space between the resin sealing substrate and the contact faces of the cooling members is used as the attraction means. In the case where the substrate is a metal base substrate using steel as a base material, a device for sealing the substrate with a magnetic attracting resin can be used.

Further, the cooling member made of aluminum in the foregoing embodiment may be made of a material other than aluminum as long as the material is a highly thermally conductive material having a higher hardness than the resin material.

The cooling member shown in Fig. 3 has only one through hole. It is also possible to appropriately increase the number of through holes depending on the size of the resin sealing substrate to be attracted or other factors. Also, the number of through holes shown in Fig. 5 and the number of elastic support members of the cooling member may be appropriately changed.

In the example shown in Figure 3, the resilient abutment member is provided such that it forms a closed space along the periphery of the cooling member. Another possible structure of the suction unit is shown in Figure 8(a) (top view) and Figure 8(b) (cross-sectional view along section line D-D'), wherein the unit is subdivided into smaller enclosed spaces. Air is drawn from each enclosed space.

11‧‧‧Upper mold

12‧‧‧ Lower mold

13‧‧‧ cavity

21‧‧‧Substrate

21A‧‧‧Resin sealed substrate

22‧‧‧Electronic components

23‧‧‧Resin materials

24‧‧‧ resin sealing part

30‧‧‧Inhalation unit

31‧‧‧ Cooling parts

32‧‧‧Flexible bearing parts

32a‧‧‧ cylindrical part

32b‧‧‧ bowl section

33a‧‧‧through hole

33b‧‧‧Air suction channel

33c‧‧‧Air suction device

34‧‧‧ slots

40‧‧‧ delivery tray

50‧‧‧Inhalation unit drive mechanism

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic illustration of the process of assembling a tree-finger sealed electronic component or the like to a substrate.

2 is a schematic view of a process of delivering a resin sealing substrate.

Fig. 3 is a diagrammatic view showing the structure of a suction unit used in the first embodiment of the present invention.

4 is an operation diagram in which the upper surface (contact surface) of the cooling member is in close contact with the lower surface of the resin sealing portion in the first embodiment.

Fig. 5 is a view showing the structure of a suction unit used in the second embodiment of the present invention.

Fig. 6 is a view showing the operation of the upper surface (contact surface) of the cooling member in close contact with the lower surface of the resin sealing portion in the second embodiment.

Figure 7 is a diagram of a variation of the suction unit.

Fig. 8 is a view showing another variation of the suction unit.

11‧‧‧Upper mold

12‧‧‧ Lower mold

13‧‧‧ cavity

21‧‧‧Substrate

21A‧‧‧Resin sealed substrate

22‧‧‧Electronic components

24‧‧‧ resin sealing part

Claims (14)

A substrate cooling system for cooling a resin sealing substrate, which is formed by molding and resin sealing an electronic component mounted on a substrate by a resin sealing mold, comprising: a) a a holder for holding the resin sealing substrate; b) a suction device provided in the holder for attracting the resin sealing substrate to the holder; and c) a cooling member disposed at a position The resin sealing substrate is attracted toward the position by the suction device, the cooling member has a contact surface, and the resin sealing substrate is in close contact with the contact surface. The substrate cooling system of claim 1, wherein the suction device comprises an air suction means for drawing air from a space between the resin sealing substrate and the contact surface of the cooling member. The substrate cooling system of claim 2, wherein the suction device comprises: an elastic support provided on the cooling member for contacting the resin sealing substrate when the resin sealing substrate is attracted Forming one or more enclosed spaces between the resin sealing substrate and the contact surface; and one or more through holes, each of the through holes being disposed in the cooling member, located in the one or more enclosed spaces At one of the positions, and passing through the cooling member in the thickness direction of the cooling member; and the air suction means suctions air from the one or more enclosed spaces through the one or more through holes. The substrate cooling system according to claim 1, wherein Further comprising: d) a cooling device for cooling the cooling component. The substrate cooling system of claim 4, wherein the cooling device is a blower for delivering a gas stream to a cooling component. The substrate cooling system of claim 5, wherein: the cooling member has one or more grooves formed on the contact surface; and the blower supplies airflow into the one or more grooves . The substrate cooling system of claim 4, wherein the cooling device comprises a Peltier device connected to the cooling member. The substrate cooling system of claim 1, wherein the contact surface of the cooling member is designed such that a resin sealing portion of the resin sealing substrate can be in close contact therewith. A substrate delivery system for delivering a resin-sealed substrate, comprising the substrate cooling system of any one of claims 1 to 8. A resin sealing system for molding and resin-sealing an electronic component mounted on a substrate, comprising the substrate cooling system according to any one of claims 1 to 8. A method for cooling a resin sealing substrate, which is formed by molding and resin sealing an electronic component mounted on a substrate by a resin sealing mold, comprising the steps of: a) holding The resin sealing substrate; and b) by attracting the supported resin sealing substrate to the cooling member The resin sealing substrate is in close contact with the contact surface of the cooling member to cool the resin sealing substrate. The method for cooling a resin sealing substrate according to claim 11, wherein the step of cooling the resin sealing substrate comprises the step of conveying a gas flow to the cooling member. The method for cooling a resin sealing substrate according to claim 11, wherein the step of cooling the resin sealing substrate comprises the step of bringing the resin sealing portion of the resin sealing substrate into close contact with the contact surface of the cooling member. The method for cooling a resin sealing substrate according to any one of claims 11 to 13, wherein the step of cooling the resin sealing substrate is performed when the resin sealing substrate is delivered.